Printed circuit board with heat dissipation substrate and manufacturing method thereof
By setting an annular barrier in the printed circuit board material, the traditional protective film etching and controlled depth milling processes are eliminated, solving the problem of damage to the inner layer circuitry during lamination and achieving high-efficiency production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- KINWONG ELECTRONICS TECH LONGCHUAN
- Filing Date
- 2026-02-05
- Publication Date
- 2026-04-21
AI Technical Summary
In existing technologies, the laser engraving of the protective film before lamination and the controlled deep milling after lamination can easily damage the inner layer circuitry, leading to the risk of open circuits, and manual unpacking is inconvenient.
The process uses processed sheet materials, including heat dissipation substrates, with annular barrier components installed in the connection holes. By sequentially setting connection layers and sub-boards on the connection surfaces, the processes of applying protective films, etching protective films, and controlled-depth milling are eliminated, and the bonding is performed directly.
It solves the risk of damage to inner layer circuits during laser engraving of protective film before lamination and controlled deep milling after lamination, improving production efficiency and yield, and is suitable for mass production.
Smart Images
Figure CN121908468A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of printed circuit board technology, and in particular to a printed circuit board with a heat dissipation substrate and a method for manufacturing the same. Background Technology
[0002] With the increasing integration and multifunctionality of the electronics and communications industry and automotive electronics, printed circuit boards (PCBs), as the main components, are required to perform more and more functions. In order to adapt to different assembly needs, the structure of printed circuit boards is becoming more and more diversified. For example, some single-sided multilayer aluminum substrates used in consumer lighting require that some areas be free of aluminum base, exposing the inner layer pads and PTH (Plated Through Hole) to facilitate the installation of connectors or other components.
[0003] To prevent the dielectric layer from sticking to the inner layer pads and metallization during lamination, the traditional approach is to apply a protective film to the entire inner core board after the circuitry, solder mask, and immersion nickel-gold plating are completed. Then, laser etching is used to remove the areas where the dielectric layer needs to be laminated, leaving only the protective film in the exposed areas (i.e., the areas that need to be milled and uncovered later). Then, the board is produced according to the conventional single-sided double-layer aluminum substrate process. During the milling of the finished product, milling is performed on the exposed areas. Finally, the protective film, dielectric layer, and aluminum base in the exposed areas are manually removed to complete the uncovering operation. However, this method is prone to damaging the inner layer circuitry during laser etching of the protective film before lamination and during milling after lamination, which poses a risk of open circuits. Summary of the Invention
[0004] This application provides a printed circuit board with a heat dissipation substrate and a method for manufacturing the same, which solves the problem in the prior art that the inner layer circuits are easily damaged during laser etching of the protective film before lamination and during controlled deep milling after lamination, which may cause open circuits.
[0005] In a first aspect, embodiments of this application provide a method for manufacturing a printed circuit board with a heat dissipation substrate, comprising: A processing board is provided, the processing board including a heat dissipation substrate, the processing board having a connecting surface, the processing board being provided with a connecting hole, the connecting hole penetrating the heat dissipation substrate, an annular barrier being provided inside the connecting hole, the axis of the barrier being parallel to the axis of the connecting hole, and the barrier protruding from the connecting surface; A connecting layer and a sub-plate are sequentially arranged on the connecting surface. The connecting layer is provided with a window, and the barrier protruding from the connecting surface is located in the window. The sub-plate is provided with a conductive part, and the conductive part is arranged corresponding to the internal space of the barrier. The processing sheet, the connecting layer, and the sub-plate are pressed together.
[0006] In some embodiments, the processing board includes a first dielectric layer, which is stacked with the heat dissipation substrate. The connection hole penetrates the first dielectric layer, and the side of the first dielectric layer facing away from the heat dissipation substrate is the connection surface.
[0007] In some embodiments, prior to providing the processing board material, the method for manufacturing the printed circuit board with a heat-dissipating substrate further includes: A laminated sheet material is provided, the laminated sheet material comprising a heat dissipation layer, an insulating layer and a metal layer stacked together; Process holes are machined in the pressed sheet material, the process holes penetrating the heat dissipation layer, the insulating layer and the metal layer, the heat dissipation layer forming the heat dissipation substrate, and the insulating layer forming the first dielectric layer; A filling material is disposed inside the process hole, and a portion of the filling material is located inside the process hole defined by the metal layer; The metal layer is removed, and the remaining process holes form the connection holes; A forming hole is machined inside the filler material to remove part of the filler material, and the remaining filler material forms the barrier to obtain the processed sheet.
[0008] In some embodiments, prior to providing the processing board material, the method for manufacturing the printed circuit board with a heat-dissipating substrate further includes: A laminated sheet material is provided, the laminated sheet material comprising a heat dissipation layer, an insulating layer and a metal layer stacked together; Process holes are machined in the pressed sheet material, the process holes penetrating the heat dissipation layer, the insulating layer and the metal layer, the heat dissipation layer forming the heat dissipation substrate, and the insulating layer forming the first dielectric layer; A filling material is disposed inside the process hole, and a portion of the filling material is located inside the process hole defined by the metal layer; A forming hole is machined inside the filler material to remove part of the filler material, and the remaining filler material forms the barrier. The metal layer is removed, and the remaining process holes form the connection holes to obtain the processed sheet material.
[0009] In some embodiments, the filler material is resin or thermally conductive paste.
[0010] In some embodiments, the sub-board includes at least two circuit layers and a second dielectric layer located between two adjacent circuit layers, the conductive portion is configured as a via, and a conductive portion is provided on the inner wall of the via, the conductive portion being connected to at least two of the circuit layers.
[0011] In some embodiments, when the connecting layer and the sub-plate are sequentially disposed on the connecting surface, the barrier is recessed in the surface of the connecting layer away from the processed sheet material or flush with the surface of the connecting layer away from the processed sheet material.
[0012] In some embodiments, the heat dissipation substrate is an aluminum substrate, a copper substrate, or a ceramic substrate.
[0013] In some embodiments, the connection layer includes a thermally conductive medium layer.
[0014] Secondly, embodiments of this application provide a printed circuit board with a heat dissipation substrate, which is manufactured by the method for manufacturing a printed circuit board with a heat dissipation substrate as described in the first aspect.
[0015] The method for manufacturing a printed circuit board with a heat dissipation substrate provided in this application has the following advantages: Since the processing board includes a heat dissipation substrate, the processing board has a connecting surface, and the processing board is provided with connecting holes that penetrate the heat dissipation substrate, an annular barrier is provided inside the connecting hole, the axis of the barrier is parallel to the axis of the connecting hole, and the barrier protrudes from the connecting surface. Furthermore, by first sequentially setting a connecting layer and a sub-board on the connecting surface, the connecting layer has an opening, the barrier protruding from the connecting surface is located within the opening, and the sub-board has a conductive portion corresponding to the internal space of the barrier, and then pressing the processing board, connecting layer, and sub-board together, the desired printed circuit board can be obtained. This eliminates the need for applying a protective film, etching a protective film, and controlling the depth of milling. Therefore, it solves the problem in the prior art where laser etching of the protective film before pressing and controlling the depth of milling after pressing easily damage the inner layer circuitry, posing a risk of open circuit.
[0016] The advantages of the printed circuit board with heat dissipation substrate provided in this application compared with the prior art can be found in the description of the advantages of the manufacturing method of the printed circuit board with heat dissipation substrate provided in this application compared with the prior art, which will not be repeated here. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a flowchart of a method for manufacturing a printed circuit board with a heat dissipation substrate in one embodiment of this application; Figure 2 This is a schematic diagram of the structure of the pressed sheet material in one embodiment of this application; Figure 3 Is Figure 2 A schematic diagram showing the machining of process holes on the laminated sheet material; Figure 4 Is Figure 3 A schematic diagram showing the filling material inside the process holes of the laminated sheet material; Figure 5 It is to remove Figure 4 A schematic diagram of the metal layers of the laminated sheet material shown; Figure 6 Is Figure 5 A schematic diagram of the processed sheet material is obtained by machining forming holes inside the filler material of the pressed sheet material to remove part of the filler material and make the remaining filler material form a barrier. Figure 7 It connects the layer, sub-board and Figure 6 The diagram shows the substrates being laminated together.
[0019] The markings in the diagram mean: 101. Pressed sheets; 1011, Heat dissipation layer; 1012, Insulation layer; 1013, Metal layer; 10. Processing sheet metal; 11. Heat dissipation substrate; 12. First dielectric layer; 120. Connecting surface; 13. Connecting hole; 130. Process hole; 14. Barrier component; 140. Filler material; 20. Connecting layer; 30. Sub-board; 301, Conductive part; 302, Conductive part; 31, Circuit layer; 32, Second dielectric layer. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0023] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.
[0024] With the increasing integration and multifunctionality of the electronics and communications industry and automotive electronics, printed circuit boards (PCBs), as the main components, are required to perform more and more functions. In order to adapt to different assembly needs, the structure of printed circuit boards is becoming more and more diversified. For example, some single-sided multilayer aluminum substrates used in consumer lighting require that some areas be free of aluminum base, exposing the inner layer pads and PTH (Plated Through Hole) to facilitate the installation of connectors or other components.
[0025] To prevent the dielectric layer from sticking to the inner layer pads and metallization during lamination, the traditional approach is to apply a protective film to the entire inner core board after the circuitry, solder mask, and immersion nickel-gold plating are completed. Then, laser etching is used to remove the area where the dielectric layer needs to be laminated, leaving only the protective film in the exposed area (i.e., the area that needs to be milled and uncovered later). Then, the board is produced according to the conventional single-sided double-layer aluminum substrate process. When milling the finished product, the exposed area is milled with controlled depth. Finally, the protective film, dielectric layer, and aluminum base in the exposed area are manually removed to complete the uncovering operation. However, this method is prone to damaging the inner layer circuitry during laser etching of the protective film before lamination and during controlled depth milling after lamination, which may cause open circuits. Furthermore, when the exposed area is designed in the middle of the PCS (unit board), it is inconvenient to operate manually (there is no point of force).
[0026] In view of this, this application provides a printed circuit board with a heat dissipation substrate and a method for manufacturing the same. The processing board includes a heat dissipation substrate, has a connecting surface, and is provided with connecting holes that penetrate the heat dissipation substrate. An annular barrier is provided inside the connecting hole, with its axis parallel to the axis of the connecting hole and protruding from the connecting surface. A connecting layer and a sub-board are sequentially disposed on the connecting surface. The connecting layer has a window, and the barrier protruding from the connecting surface is located within the window. The sub-board has a conductive portion corresponding to the internal space of the barrier. The processing board, connecting layer, and sub-board are then pressed together to obtain the desired printed circuit board. This eliminates the need for applying a protective film, etching a protective film, and controlling the depth of milling. Therefore, it solves the problem in the prior art where laser etching of the protective film before pressing and controlling the depth of milling after pressing easily damage the inner layer circuitry, posing a risk of open circuits.
[0027] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.
[0028] Please refer to Figures 1 to 7 In a first aspect, embodiments of this application provide a method for manufacturing a printed circuit board with a heat dissipation substrate, comprising: S100: A processing board 10 is provided. The processing board 10 includes a heat dissipation substrate 11. The processing board 10 has a connecting surface 120. The processing board 10 is provided with a connecting hole 13. The connecting hole 13 penetrates the heat dissipation substrate 11. An annular barrier 14 is provided inside the connecting hole 13. The axis of the barrier 14 is parallel to the axis of the connecting hole 13, and the barrier 14 protrudes from the connecting surface 120.
[0029] The heat dissipation substrate 11 can be an aluminum substrate, a copper substrate, or a ceramic substrate, etc. One end of the barrier member 14 can protrude from the connecting surface 120, and the other end of the barrier member 14 can be flush with the surface of the processed plate 10 opposite to the connecting surface 120. The barrier member 14 and the connecting hole 13 can be coaxially arranged.
[0030] S200: A connecting layer 20 and a sub-plate 30 are sequentially arranged on the connecting surface 120. The connecting layer 20 is provided with a window, and the barrier 14 protruding from the connecting surface 120 is located inside the window. The sub-plate 30 is provided with a conductive part 301, and the conductive part 301 is arranged in correspondence with the internal space of the barrier 14.
[0031] The connecting layer 20 may include epoxy resin and reinforcing fibers, for example, a prepreg. The window size is greater than or equal to the size of the barrier 14 to facilitate fitting the connecting layer 20 onto the barrier 14.
[0032] The sub-board 30 can be a single-layer board or a multi-layer board, for example, the sub-board 30 can be a double-layer board formed by double-sided core boards or a multi-layer board composed of multiple core boards, and there is no limitation here. The sub-board 30 and the heat dissipation substrate 11 can both be insulated from the barrier member 14.
[0033] The conductive portion 301 can be a through hole (PTH) or a pad, etc. The conductive portion 301 and the barrier member 14 can be coaxially arranged, and the size of the inner hole of the barrier member 14 can be greater than or equal to the size of the conductive portion 301. For example, when the conductive portion 301 is a through hole, the diameter of the inner hole of the barrier member 14 is 0.6 mm larger on one side than the ring of the through hole.
[0034] The processing sheet 10, connecting layer 20 and sub-plate 30 can be riveted / fused together.
[0035] S300: Press the processing sheet 10, connecting layer 20 and sub-sheet 30 together.
[0036] The processing plate 10, connecting layer 20 and sub-plate 30 can be pressed together by a high-speed press, etc. After the connecting layer 20 melts and solidifies, the processing plate 10 and sub-plate 30 are connected together, and the inner hole of the barrier 14 exposes the conductive part 301, which facilitates the installation of connectors or other components. The powder that may adhere during pressing can be removed by grinding.
[0037] By eliminating the processes of applying protective film, etching protective film, and controlled milling, the problem of easily damaging the inner layer circuitry and causing open circuits during laser etching of the protective film before lamination and controlled milling after lamination in the existing technology can be solved. It also solves the problem of inconvenience in removing the cover in the existing technology.
[0038] It is understandable that the diameter of the inner hole of the barrier 14 can be larger than the diameter of the through portion 301. When the processing sheet 10, the connecting layer 20 and the sub-plate 30 are pressed together, the barrier 14 protruding from the connecting surface 120 forms a dam-like structure, which can prevent the molten connecting layer 20 from flowing into the inner hole of the barrier 14 and the through portion 301. After pressing, there is no need to clean the adhesive from the through portion 301, nor is it necessary to remove the residual adhesive in the area where the through portion 301 is located by peeling off the cover or back drilling.
[0039] The method for manufacturing a printed circuit board with a heat dissipation substrate provided in this application embodiment includes a processing board 10 comprising a heat dissipation substrate 11. The processing board 10 has a connection surface 120 and a connection hole 13 penetrating the heat dissipation substrate 11. An annular barrier 14 is disposed inside the connection hole 13, with the axis of the barrier 14 parallel to the axis of the connection hole 13 and protruding from the connection surface 120. Furthermore, a connection layer 20 and a sub-board 30 are sequentially disposed on the connection surface 120. The board 20 is provided with an opening, and the barrier 14 protruding from the connecting surface 120 is located inside the opening. The sub-board 30 is provided with a conductive part 301, which is correspondingly arranged with the internal space of the barrier 14. Then, the processing board 10, the connecting layer 20 and the sub-board 30 are pressed together to obtain the required printed circuit board. The process of applying protective film, etching protective film and controlled depth milling is eliminated. Therefore, it can solve the problem in the prior art that the inner layer circuit is easily damaged when laser etching the protective film before pressing and when controlled depth milling after pressing, which may cause open circuit.
[0040] The method for manufacturing a printed circuit board with a heat dissipation substrate provided in this application eliminates four processes: applying a protective film, etching a protective film, controlled-depth milling, and peeling off the cover. This greatly improves production efficiency and yield, and is more suitable for mass production than traditional methods.
[0041] It should be noted that after pressing the processing sheet 10, the connecting layer 20, and the sub-sheet 30 together, the following processes can continue: Lines: Transfer the required lines to daughterboard 30.
[0042] Solder shielding: Transfer the required solder shielding to sub-board 30.
[0043] Characters; text silkscreened as required.
[0044] A protective film is applied to the heat dissipation substrate 11 to prevent the heat dissipation substrate 11 from being corroded by the chemical solution during the solder resist immersion gold process.
[0045] Drilling: Drill through the protective film on the conductive part 301.
[0046] Immersion gold: Immersion gold is applied to the surface of the sub-board 30 and the conductive part 301 in the exposed area.
[0047] Remove the protective film: Remove the protective film from the heat dissipation substrate 11.
[0048] Milling the outer shape: Shaped according to the shipping requirements.
[0049] Test: Open / short circuit test.
[0050] Finished product cleaning: Clean the finished product.
[0051] FQC (Final Quality Control): 100% visual inspection.
[0052] FQA (Final Quality Assurance): Visual inspection, dimensional measurement, and reliability testing.
[0053] Packaging: Pack as required.
[0054] Shipment.
[0055] In some embodiments, the processing board 10 includes a first dielectric layer 12, which is stacked with the heat dissipation substrate 11. A connection hole 13 penetrates the first dielectric layer 12, and the side of the first dielectric layer 12 facing away from the heat dissipation substrate 11 is the connection surface 120.
[0056] By adopting the above scheme, when the processing board 10, the connecting layer 20 and the sub-board 30 are pressed together, the first dielectric layer 12 can provide a buffer, and the sub-board 30 and the heat dissipation substrate 11 substrate can have an insulating layer 1012 composed of the first dielectric layer 12 and the connecting layer 20, so that it meets the requirements.
[0057] It is understood that the first dielectric layer 12 may include epoxy resin and reinforcing fibers, etc. For example, the first dielectric layer 12 is a prepreg.
[0058] Please refer to Figures 2 to 6 As one feasible approach, the method for manufacturing a printed circuit board having a heat-dissipating substrate before providing the processing board 10 further includes: First, a press-fit sheet material 101 is provided, which includes a heat dissipation layer 1011, an insulating layer 1012 and a metal layer 1013 stacked together.
[0059] The heat dissipation layer 1011 can be made of aluminum, copper, or ceramic. The insulating layer 1012 can include epoxy resin and reinforcing fibers. The metal layer 1013 can be made of aluminum, copper, or silver. For example, the thickness of the insulating layer 1012 can be 0.1 mm, and the metal layer 1013 can be 40 oz copper foil. The thickness of the bonding layer 20 after lamination should be equal to or less than the thickness of the metal layer 1013, such as less than 4 oz.
[0060] Next, process holes 130 are machined on the pressed board material 101. The process holes 130 penetrate the heat dissipation layer 1011, the insulating layer 1012 and the metal layer 1013. The heat dissipation layer 1011 forms a heat dissipation substrate 11 and the insulating layer 1012 forms a first dielectric layer 12.
[0061] Process holes 130 can be machined on the pressed sheet material 101 by mechanical milling or laser ablation.
[0062] Next, a filling material 140 is provided inside the process hole 130, with a portion of the filling material 140 located inside the process hole 130 defined by the metal layer 1013.
[0063] The filler material 140 can be resin or thermally conductive paste, etc. The filler material 140 can be applied inside the process hole 130 by printing. The filler material 140 can be flush with the surface of the metal layer 1013 opposite to the first dielectric layer 12.
[0064] Then, the metal layer 1013 is removed, and the remaining process holes 130 form the connection holes 13.
[0065] The metal layer 1013 can be removed by chemical etching or mechanical milling. After the metal layer 1013 is removed, part of the filler material 140 protrudes from the connection surface 120.
[0066] Finally, forming holes are machined inside the filler material 140 to remove part of the filler material 140, and the remaining filler material 140 forms a barrier 14 to obtain the processed sheet material 10.
[0067] The forming hole can be machined inside the filler material 140 by mechanical milling or laser ablation. The size of the forming hole can match the size of the conductive part 301 of the subsequent sub-board 30. The diameter of the forming hole is smaller than the diameter of the connecting hole 13, and the forming hole is the inner hole of the barrier 14.
[0068] By adopting the above scheme, the processing sheet 10 can be obtained relatively easily, and the barrier 14 protruding from the connecting surface 120 forms a dam-like structure when the processing sheet 10, the connecting layer 20 and the sub-plate 30 are pressed together, which can prevent the molten connecting layer 20 from entering the inner hole and the conductive part 301 of the barrier 14.
[0069] As another possible implementation method, prior to providing the processing board 10, the method for manufacturing a printed circuit board with a heat dissipation substrate further includes: First, a press-fit sheet material 101 is provided, which includes a heat dissipation layer 1011, an insulating layer 1012 and a metal layer 1013 stacked together.
[0070] Next, process holes 130 are machined on the pressed board material 101. The process holes 130 penetrate the heat dissipation layer 1011, the insulating layer 1012 and the metal layer 1013. The heat dissipation layer 1011 forms a heat dissipation substrate 11 and the insulating layer 1012 forms a first dielectric layer 12.
[0071] Next, a filling material 140 is provided inside the process hole 130, with a portion of the filling material 140 located inside the process hole 130 defined by the metal layer 1013.
[0072] Then, forming holes are machined inside the filler material 140 to remove part of the filler material 140 and make the remaining filler material 140 form the barrier 14.
[0073] Finally, the metal layer 1013 is removed, and the remaining process holes 130 form connection holes 13 to obtain the processed sheet 10.
[0074] By adopting the above solution, the processing sheet 10 can be obtained relatively easily, and the barrier 14 protruding from the connecting surface 120 forms a dam-like structure when the processing sheet 10, the connecting layer 20 and the sub-plate 30 are pressed together, which can prevent the molten connecting layer 20 from entering the inner hole and the conductive part 301 of the barrier 14.
[0075] Optionally, the filler material 140 is resin or thermally conductive paste.
[0076] This configuration allows for easier placement of the filling material 140 inside the process hole 130.
[0077] It should be noted that when the filler material 140 is resin, resin can be plugged into the process hole 130 and cured by resin plugging. Then, the surface of the pressed plate 101 is ground clean. In this case, since the resin has insulating properties, there is no need to consider the insulation between the heat dissipation substrate 11 and the sub-board 30. When the filler material 140 is thermally conductive paste, thermally conductive paste can be plugged into the process hole 130 by printing and cured. Then, the surface of the pressed plate 101 is ground clean. In this case, the insulation between the heat dissipation substrate 11 and the sub-board 30 needs to be considered. If the heat dissipation substrate 11 is a non-conductive heat dissipation substrate 11 such as a ceramic substrate, the thermally conductive paste can be copper paste or aluminum paste, etc. If the heat dissipation substrate 11 is a conductive heat dissipation substrate 11 such as an aluminum substrate or a copper substrate, the thermally conductive paste needs to be non-conductive.
[0078] Please refer to Figure 7 In some embodiments, the sub-board 30 includes at least two circuit layers 31 and a second dielectric layer 32 located between two adjacent circuit layers 31. The conductive portion 301 is configured as a through hole, and a conductive portion 302 is provided on the inner wall of the through hole. The conductive portion 302 is connected to at least two circuit layers 31.
[0079] By adopting the above solution, the conductive part 302 inside the through hole can be exposed through the inner hole of the barrier 14, which facilitates the installation of connectors or other components on the conductive part 302 and realizes the electrical conduction between the circuit layer 31 and the connectors or other components.
[0080] The sub-board 30 can be manufactured through processes such as drilling, electroplating, circuitry, and solder masking.
[0081] Drilling: Drilling holes for electroplating.
[0082] Electroplating: Plating holes inside the holes to form through holes.
[0083] Lines: Transfer the required lines to line layer 31.
[0084] Solder shielding: Transfer the required solder shielding to the circuit layer 31.
[0085] Optionally, when the connecting layer 20 and the sub-plate 30 are sequentially provided on the connecting surface 120, the barrier 14 is recessed in the surface of the connecting layer 20 away from the processing plate 10 or flush with the surface of the connecting layer 20 away from the processing plate 10.
[0086] This configuration prevents the molten connecting layer 20 from entering the inner hole and the conductive part 301 of the barrier 14.
[0087] For example, the barrier 14 is recessed in the connecting layer 20 away from the surface of the processed sheet 10.
[0088] This configuration allows the surface of the connecting layer 20 to be higher than the barrier member 14, away from the surface of the processed sheet 10. When the processed sheet 10, the connecting layer 20 and the sub-plate 30 are pressed together, even if the connecting layer 20 becomes thinner, the sub-plate 30 will not press against the barrier member 14.
[0089] Optionally, the heat dissipation substrate 11 is an aluminum substrate, a copper substrate, or a ceramic substrate.
[0090] This configuration ensures that the heat dissipation substrate 11 meets the usage requirements.
[0091] Optionally, the connecting layer 20 includes a thermally conductive medium layer.
[0092] This configuration allows the heat from the sub-board 30 to be conducted to the heat dissipation substrate 11 through the connecting layer 20, thereby improving the heat dissipation effect of the sub-board 30.
[0093] It should be noted that the thermal conductive layer can be an epoxy-based thermal conductive layer, an organosilicon-based thermal conductive layer, or a polyimide-based thermal conductive layer, etc.
[0094] Secondly, embodiments of this application provide a printed circuit board with a heat dissipation substrate, which is manufactured by the method for manufacturing a printed circuit board with a heat dissipation substrate as described in the first aspect.
[0095] As can be seen from the above, the printed circuit board with a heat dissipation substrate provided in this application embodiment includes a heat dissipation substrate 11 in the processing board 10. The processing board 10 has a connection surface 120 and a connection hole 13 that penetrates the heat dissipation substrate 11. An annular barrier 14 is provided inside the connection hole 13. The axis of the barrier 14 is parallel to the axis of the connection hole 13, and the barrier 14 protrudes from the connection surface 120. Furthermore, by first sequentially setting a connection layer 20 and a sub-board 30 on the connection surface 120, the connection layer... The board 20 is provided with an opening, and the barrier 14 protruding from the connecting surface 120 is located inside the opening. The sub-board 30 is provided with a conductive part 301, which is correspondingly arranged with the internal space of the barrier 14. Then, the processing board 10, the connecting layer 20 and the sub-board 30 are pressed together to obtain the required printed circuit board. The process of applying protective film, etching protective film and controlled depth milling is eliminated. Therefore, it can solve the problem in the prior art that the inner layer circuit is easily damaged when laser etching the protective film before pressing and when controlled depth milling after pressing, which may cause open circuit.
[0096] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.
Claims
1. A method for manufacturing a printed circuit board with a heat dissipation substrate, characterized in that, include: A processing board is provided, the processing board including a heat dissipation substrate, the processing board having a connecting surface, the processing board being provided with a connecting hole, the connecting hole penetrating the heat dissipation substrate, an annular barrier being provided inside the connecting hole, the axis of the barrier being parallel to the axis of the connecting hole, and the barrier protruding from the connecting surface; A connecting layer and a sub-plate are sequentially arranged on the connecting surface. The connecting layer is provided with a window, and the barrier protruding from the connecting surface is located in the window. The sub-plate is provided with a conductive part, and the conductive part is arranged corresponding to the internal space of the barrier. The processing sheet, the connecting layer, and the sub-plate are pressed together.
2. The method for manufacturing a printed circuit board with a heat dissipation substrate according to claim 1, characterized in that, The processing board includes a first dielectric layer, which is stacked with the heat dissipation substrate. The connection hole penetrates the first dielectric layer, and the side of the first dielectric layer facing away from the heat dissipation substrate is the connection surface.
3. The method for manufacturing a printed circuit board with a heat dissipation substrate according to claim 2, characterized in that, Before providing the processing board material, the method for manufacturing the printed circuit board with a heat dissipation substrate further includes: A laminated sheet material is provided, the laminated sheet material comprising a heat dissipation layer, an insulating layer and a metal layer stacked together; Process holes are machined in the pressed sheet material, the process holes penetrating the heat dissipation layer, the insulating layer and the metal layer, the heat dissipation layer forming the heat dissipation substrate, and the insulating layer forming the first dielectric layer; A filling material is disposed inside the process hole, and a portion of the filling material is located inside the process hole defined by the metal layer; The metal layer is removed, and the remaining process holes form the connection holes; A forming hole is machined inside the filler material to remove part of the filler material, and the remaining filler material forms the barrier to obtain the processed sheet.
4. The method for manufacturing a printed circuit board with a heat dissipation substrate according to claim 2, characterized in that, Before providing the processing board material, the method for manufacturing the printed circuit board with a heat dissipation substrate further includes: A laminated sheet material is provided, the laminated sheet material comprising a heat dissipation layer, an insulating layer and a metal layer stacked together; Process holes are machined in the pressed sheet material, the process holes penetrating the heat dissipation layer, the insulating layer and the metal layer, the heat dissipation layer forming the heat dissipation substrate, and the insulating layer forming the first dielectric layer; A filling material is disposed inside the process hole, and a portion of the filling material is located inside the process hole defined by the metal layer; A forming hole is machined inside the filler material to remove part of the filler material, and the remaining filler material forms the barrier. The metal layer is removed, and the remaining process holes form the connection holes to obtain the processed sheet material.
5. The method for manufacturing a printed circuit board with a heat dissipation substrate according to claim 3 or 4, characterized in that, The filler material is resin or thermally conductive paste.
6. The method for manufacturing a printed circuit board with a heat dissipation substrate according to claim 1, characterized in that, The sub-board includes at least two circuit layers and a second dielectric layer located between two adjacent circuit layers. The conductive portion is configured as a via, and a conductive portion is provided on the inner wall of the via. The conductive portion is connected to at least two of the circuit layers.
7. The method for manufacturing a printed circuit board with a heat dissipation substrate according to claim 1, characterized in that, When the connecting layer and the sub-plate are sequentially arranged on the connecting surface, the barrier is recessed in the surface of the connecting layer away from the processed sheet material or flush with the surface of the connecting layer away from the processed sheet material.
8. The method for manufacturing a printed circuit board with a heat dissipation substrate according to any one of claims 1 to 4, characterized in that, The heat dissipation substrate is an aluminum substrate, a copper substrate, or a ceramic substrate.
9. A method for manufacturing a printed circuit board with a heat-dissipating substrate according to any one of claims 1 to 4, characterized in that, The connecting layer includes a thermally conductive medium layer.
10. A printed circuit board with a heat dissipation substrate, characterized in that, The printed circuit board is manufactured by the method for manufacturing a printed circuit board with a heat dissipation substrate as described in any one of claims 1 to 9.