High-precision etching treatment device for fine circuit

Abstract

The invention discloses a high-precision etching treatment device for a fine circuit, and relates to the technical field related to workpiece etching treatment, and the high-precision etching treatment device comprises an etching treatment machine body, a moving sliding table, a dust collection assembly, a negative pressure fixing assembly and a dust cleaning unit, and the right side of the top end of the etching treatment machine body is provided with a single-chip microcomputer; the moving sliding table is installed on the inner wall of the top of the etching treatment machine body, the laser is installed on the bottom side of the moving end of the moving sliding table, and the negative pressure fixing assembly is installed on the top side of the dust collecting shell. The problems that in the etching machining process of circuit board workpieces, the circuit board workpieces are mostly mechanically clamped or rigidly adsorbed, mechanical clamping easily causes workpiece edge damage and circuit deformation, rigid adsorption is difficult to adapt to workpieces with different surface profiles, the subsequent etching precision is affected, meanwhile, a large number of dust particles are generated in the laser etching process, and the production cost is reduced are solved. A traditional dust cleaning mode is low in efficiency and poor in effect, part of dust can be attached to the surface of a workpiece, the etching path of a laser is interfered, and the etching precision is affected.

Description

Technical Field

[0001] This invention relates to the technical field of workpiece etching, specifically to a high-precision etching device for fine lines. Background Technology

[0002] In the electronics manufacturing industry, as electronic devices become smaller and denser, the demand for fine circuit processing on circuit boards and other workpieces is becoming increasingly urgent. High-precision etching technology, as a core process for fine circuit forming, directly determines product quality through its processing accuracy, stability, and environmental friendliness. Laser etching, due to its advantages such as high processing efficiency and excellent circuit forming effect, has been widely used in fine circuit processing scenarios. Currently, existing laser etching equipment has some problems in its use. For example, during the etching process of circuit board workpieces, mechanical clamping or rigid adsorption are often used. Mechanical clamping can easily cause edge damage and circuit deformation of the workpiece, while rigid adsorption is difficult to adapt to workpieces with different surface contours, affecting the subsequent etching accuracy. At the same time, a large number of dust particles are generated during laser etching. Traditional dust removal methods are inefficient and have poor effects. Some dust will adhere to the surface of the workpiece and interfere with the etching path of the laser, affecting the etching accuracy. In order to solve the above-mentioned problems, a high-precision etching device for fine lines is provided. Summary of the Invention

[0003] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0004] In view of the problems existing in the high-precision etching processing device for fine lines mentioned above, the present invention is proposed.

[0005] Therefore, the object of the present invention is to provide a high-precision etching device for fine lines.

[0006] To solve the above technical problems, the present invention provides the following technical solution: it includes: an etching processing machine body, wherein a feeding mechanism for automatic workpiece conveying is provided through the side of the etching processing machine body, and a single-chip microcomputer is installed on the right side of the top of the etching processing machine body; A motion slide is installed on the inner wall of the top of the etching machine body. A laser is installed on the bottom side of the moving end of the motion slide to achieve X / Y / Z three-axis linkage. A dust collection assembly is installed on the worktable at the bottom of the inner cavity of the etching machine, and the dust collection assembly is used to collect dust during fine line etching. A negative pressure fixing component is installed on the top side of the dust collection shell and is used for adsorption and fixing of workpieces; A dust removal unit is disposed on top of the negative pressure fixing component, and the dust removal unit is used to blow away residual dust on the surface.

[0007] As a preferred embodiment of the high-precision etching processing device for fine lines described in this invention, the feeding mechanism includes a fixed frame, a conveying part and a limiting plate. The fixed frame is installed on the side surface of the etching processing machine body. A conveying part for conveying circuit board workpieces is installed on the fixed frame. Limiting plates installed on the top of the fixed frame are symmetrically arranged on both sides of the conveying part. The conveying part and the limiting plate pass through the inlet on the right side of the etching processing machine body and the outlet on the left side of the etching processing machine body. The conveying unit includes a conveying motor, a drive roller, a driven roller, and a conveyor belt. The conveying motor is fixedly installed on the rear surface of the fixed frame. The output end of the conveying motor is connected to the drive roller. The surface of the drive roller is connected to the driven roller through two parallel conveyor belts. The driven roller is rotatably installed on the inner wall of the fixed frame.

[0008] As a preferred embodiment of the high-precision etching processing device for fine lines described in this invention, the dust collection assembly includes a dust collection shell, a collection shell, a partition, a first air pump, a first exhaust pipe, and an intercepting filter. The dust collection shell is installed on the worktable at the bottom of the inner cavity of the etching processing machine. The collection shell is slidably connected to the front side of the dust collection shell. The partition is fixedly connected to the inner wall of the collection shell. The first air pump is installed in the collection shell on one side of the partition. The output end of the first air pump is fixedly connected to the first exhaust pipe.

[0009] As a preferred embodiment of the high-precision etching device for fine lines described in this invention, the dust collection shell has a receiving port in the middle of its top side, and two inclined plates are fixedly connected to the inner wall of the receiving port, with the two inclined plates being symmetrically distributed.

[0010] As a preferred embodiment of the high-precision etching processing device for fine lines described in this invention, the inner cavity of the collection shell is symmetrically equipped with two partitions, the partitions and the top side of the collection shell are on the same horizontal plane, the partitions and the top side of the collection shell are slidably attached to the inner wall of the dust collection shell, and an interception filter is embedded in the side surface of the partition, the interception filter is used to filter dust particles.

[0011] As a preferred embodiment of the high-precision etching processing device for fine lines described in this invention, the negative pressure fixing mechanism includes a hydraulic cylinder, an adjusting plate, a guide part, and an adsorption fixing part. The hydraulic cylinder is installed on the side surface of the dust collection shell. The output end of the hydraulic cylinder is fixedly connected to the adjusting plate. The top side surface of the adjusting plate is fixedly connected to the adsorption fixing part. The bottom outer side of the adjusting plate is installed with the guide part. The bottom end of the guide part is installed on the worktable at the bottom of the inner cavity of the etching processing machine.

[0012] As a preferred embodiment of the high-precision etching processing device for fine lines described in this invention, the adsorption and fixing part includes a negative pressure shell, a rubber negative pressure plate, a filter screen, a second air pump, and a second exhaust pipe. The negative pressure shell is fixedly installed on the side surface of the adjusting plate. A rubber negative pressure plate is fixedly installed on the top side of the negative pressure shell. Adsorption holes are opened on the surface of the rubber negative pressure plate. A filter screen is fixedly installed inside the negative pressure shell. A second air pump is installed on the inner wall of the negative pressure shell at the bottom side of the filter screen. The output end of the second air pump is fixedly connected to the second exhaust pipe. The end of the second exhaust pipe is connected to the outside of the front side of the negative pressure shell.

[0013] As a preferred embodiment of the high-precision etching processing device for fine lines described in this invention, the number of filter screens is two, and the two filter screens are symmetrically arranged inside the negative pressure shell. One end of each filter screen is fixedly connected to the inner wall of the top of the negative pressure shell, and the other end of each filter screen is fixedly connected to the inner wall of the negative pressure shell. A material discharge port is provided between the bottom ends of the two filter screens on the bottom side of the negative pressure shell. A sealing seat is installed in the material discharge port, and the sealing seat is slidably connected to the front side of the negative pressure shell.

[0014] As a preferred embodiment of the high-precision etching processing device for fine lines described in this invention, the guide part includes a guide post, a guide ring, a sleeve, and a limiting seat. The guide post is fixedly installed on the worktable at the bottom of the inner cavity of the etching processing machine. The guide ring is slidably sleeved on the surface of the guide post. The side surface of the guide ring is fixedly connected to the side surface of the adjustment plate. The sleeve is slidably sleeved on the top of the guide post. The limiting seat is fixedly connected to the top of the sleeve.

[0015] As a preferred embodiment of the high-precision etching processing device for fine lines described in this invention, the dust removal unit includes an air pump, an air pipe, an air shell, and dust holes. The air pump is fixedly installed on the outside of the limiting seat. The output end of the air pump is fixedly connected to the air pipe. The end of the air pipe is fixedly connected to the air shell. The air shell is fixedly installed on the inside of the limiting seat. The air shell has dust holes on the side surface facing the rubber negative pressure plate. The dust holes are evenly distributed on the surface of the air shell.

[0016] Compared with the prior art, the beneficial effects of the present invention are: This invention relates to a high-precision etching device for fine lines. Under the action of a negative pressure fixing component, a hydraulic cylinder drives an adjusting plate to move smoothly along a guide section. The rubber negative pressure plate is adjusted to adhere to the bottom of the workpiece, and the rubber negative pressure plate tightly adheres to the bottom of the workpiece through negative pressure suction, preventing the workpiece from shifting during the etching process. By flexibly fitting the contour of the workpiece surface, it prevents damage to the workpiece from hard contact and improves processing accuracy. At the same time, the negative pressure fixing component assists in adsorbing some residual dust on the workpiece surface. The sucked-in dust is intercepted by a filter screen, making it easy to avoid the influence of incoming dust during the adsorption process, further improving the cleanliness of the processing environment.

[0017] With the help of the feeding mechanism, the entire process of workpieces can be automated, eliminating the need for manual handling, reducing labor costs and improving conveying efficiency. The first suction pump generates negative pressure inside the dust collection shell, and works in conjunction with the dust cleaning unit to clean the dust on the surface of the workpiece. This facilitates the orderly discharge of dust into the dust collection shells at the bottom of the front and rear sides of the workpiece. Combined with the material receiving port on the top side of the dust collection shell and the symmetrical inclined plate, the dust generated by etching can be guided to converge into the collection shell. When the airflow passes through the intercepting filter on the partition, the dust particles are filtered and trapped, and the clean airflow is discharged through the first exhaust pipe, preventing dust from spreading to the processing environment, preventing processing dust from affecting the laser etching path, improving the processing accuracy of the circuit board surface, ensuring the health of the operator's working environment, and preventing dust from entering the laser or the suction pump and affecting the service life of the equipment. The dust removal unit, through the air pump and evenly distributed dust blowing holes, can spray high-pressure airflow at high speed in a directional manner after etching, blowing away residual dust on the surface of the workpiece and collecting it with the dust collection component. This avoids dust residue affecting circuit quality, improves workpiece yield, reduces manual intervention, and increases production efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 is a schematic diagram of the overall three-dimensional structure of the high-precision etching device for fine lines of the present invention.

[0019] Figure 2 is a schematic diagram of the overall front laser installation of the high-precision etching device for fine lines of the present invention.

[0020] Figure 3 shows the high-precision etching device for fine lines of the present invention. Figure 2 Front view structural diagram.

[0021] Figure 4 shows the high-precision etching device for fine lines of the present invention. Figure 3 Schematic diagram of the AA section structure.

[0022] Figure 5 is a schematic diagram of the feeding mechanism connection of the high-precision etching device for fine lines of the present invention.

[0023] Figure 6 is a schematic diagram showing the connection of the dust collection component, the negative pressure fixing component, and the dust cleaning unit of the high-precision etching device for fine lines of the present invention.

[0024] Figure 7 shows the high-precision etching device for fine lines of the present invention. Figure 6 Schematic diagram of cross-section on the right side.

[0025] Figure 8 shows the high-precision etching device for fine lines of the present invention. Figure 6 Schematic diagram of the front-middle section.

[0026] Figure 9 is a top cross-sectional view of the negative pressure shell of the high-precision etching device for fine lines of the present invention.

[0027] Figure 10 is a cross-sectional schematic diagram of the dust collection shell of the high-precision etching device for fine lines of the present invention.

[0028] Figure 11 is a schematic diagram of the dust removal unit connection structure of the high-precision etching device for fine lines of the present invention.

[0029] In the picture: 1. Etching treatment of the machine body; 2. Feeding mechanism; 21. Fixed frame; 22. Conveyor motor; 23. Drive roller; 24. Conveyor belt; 25. Driven roller; 26. Limiting plate; 3. Motion slide; 4. Laser; 5. Dust collection assembly; 51. Dust collection shell; 52. Collection shell; 53. Baffle; 54. First air pump; 55. First exhaust pipe; 56. Filter screen; 6. Negative pressure fixing assembly; 61. Hydraulic cylinder; 62. Adjusting plate; 63. Guide part; 631. Guide column; 632. Guide ring; 633. Sleeve; 634. Limiting seat; 64. Adsorption fixing part; 641. Negative pressure shell; 642. Rubber negative pressure plate; 643. Filter screen; 644. Second air pump; 645. Second exhaust pipe; 646. Sealing seat; 7. Dust removal unit; 71. Air pump; 72. Air pipe; 73. Air housing; 74. Dust blowing hole; 8. Microcontroller. Detailed Implementation

[0030] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0031] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0032] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0033] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth. Example

[0034] Please see Figure 1-11 This embodiment provides a high-precision etching device for fine lines, comprising: an etching processing body 1, a motion slide 3, a dust collection component 5, a negative pressure fixing component 6, and a dust removal unit 7. The etching processing body 1 has a feeding mechanism 2 for automatic workpiece conveying through its side. A microcontroller 8 is installed on the top right side of the etching processing body 1. The motion slide 3 is installed on the inner wall of the top of the etching processing body 1. The motion slide 3 is a ball screw type three-axis slide to meet the high-precision requirements of fine line etching. A laser 4 is installed on the bottom side of the moving end of the motion slide 3 to achieve X / Y / Z three-axis linkage. The dust collection component 5 is installed on the worktable at the bottom of the inner cavity of the etching processing body 1 and is used for dust collection during fine line etching. The negative pressure fixing component 6 is installed on the top side of the dust collection shell 51 and is used for workpiece adsorption and fixing.

[0035] After the workpiece negative pressure fixing component 6 is fixed, the microcontroller 8 sends control commands to the motion slide 3. The motion slide 3 is equipped with a laser 4 to achieve X / Y / Z three-axis linkage. According to the preset fine line etching path, the spatial position and movement trajectory of the laser 4 are precisely adjusted. After the laser 4 is started, it emits a high-energy laser to etch the workpiece surface. Through the high-precision control of the three-axis linkage, the fineness and dimensional accuracy of the line etching are ensured to meet the high-precision processing requirements.

[0036] As shown in the figure Figure 5 As shown, the feeding mechanism 2 includes a fixed frame 21, a conveying part and a limiting plate 26. The fixed frame 21 is installed on the side surface of the etching processing machine body 1. The fixed frame 21 is equipped with a conveying part for conveying circuit board workpieces. The limiting plates 26 installed on the top of the fixed frame 21 are symmetrically arranged on both sides of the conveying part. The conveying part and the limiting plate 26 penetrate the inlet on the right side of the etching processing machine body 1 and the outlet on the left side of the etching processing machine body 1. The conveying unit includes a conveyor motor 22, a drive roller 23, a driven roller 25, and a conveyor belt 24. The conveyor motor 22 is fixedly mounted on the rear surface of the fixed frame 21. The output end of the conveyor motor 22 is connected to the drive roller 23. The surface of the drive roller 23 is connected to the driven roller 25 through two parallel conveyor belts 24. The driven roller 25 is rotatably mounted on the inner wall of the fixed frame 21. The conveyor motor 22 is a stepper motor, and the conveyor belt 24 is made of polyurethane with anti-slip rubber pads attached to its surface. Tension is pre-adjusted to ensure no slippage during transmission.

[0037] In this embodiment, after the conveyor motor 22 starts, its output end drives the active roller 23 to rotate. Through two parallel conveyor belts 24 and the driven roller 25, a linkage transmission is formed, placing the circuit board workpiece to be etched on the conveyor belt 24. During the conveying process, the limiting plates 26 symmetrically arranged on the top of the fixed frame 21 limit and guide the workpiece on both sides to prevent the workpiece from deviating and ensure that the workpiece moves smoothly along the preset path. It enters the inner cavity of the machine body through the inlet on the right side of the etching processing machine body 1 until it is conveyed to the processing station on the top side of the dust collection component 5 to complete the loading and conveying. After the processing is completed, the conveyor belt 24 operates here to convey the workpiece to the outside of the machine body through the left outlet to realize the unloading.

[0038] For reference Figure 7 and Figure 8 As shown, the dust collection assembly 5 includes a dust collection shell 51, a collection shell 52, a partition 53, a first air pump 54, a first exhaust pipe 55, and an intercepting filter 56. The dust collection shell 51 is installed on the worktable at the bottom of the inner cavity of the etching processing machine body 1. The collection shell 52 is slidably connected to the front side of the dust collection shell 51. The partition 53 is fixedly connected to the inner wall of the collection shell 52. The first air pump 54 is installed in the collection shell 52 on one side of the partition 53. The output end of the first air pump 54 is fixedly connected to the first exhaust pipe 55.

[0039] The dust collection shell 51 has a material receiving port in the middle of its top side, and two inclined plates are fixedly connected to the inner wall of the material receiving port. The two inclined plates are symmetrically distributed.

[0040] Two partitions 53 are symmetrically installed inside the collection shell 52. The partitions 53 and the top side of the collection shell 52 are on the same horizontal plane. The partitions 53 and the top side of the collection shell 52 are slidably attached to the inner wall of the dust collection shell 51. An interception filter 56 is embedded in the side surface of the partitions 53. The interception filter 56 is used to filter dust particles.

[0041] The negative pressure fixing mechanism includes a hydraulic cylinder 61, an adjusting plate 62, a guide part 63, and an adsorption fixing part 64. The hydraulic cylinder 61 is installed on the side surface of the dust collection shell 51. The output end of the hydraulic cylinder 61 is fixedly connected to the adjusting plate 62. The top side surface of the adjusting plate 62 is fixedly connected to the adsorption fixing part 64. The guide part 63 is installed on the outer side of the bottom end of the adjusting plate 62. The bottom end of the guide part 63 is installed on the worktable at the bottom of the inner cavity of the etching processing machine body 1.

[0042] The adsorption fixing part 64 includes a negative pressure shell 641, a rubber negative pressure plate 642, a filter screen 643, a second air pump 644, and a second exhaust pipe 645. The negative pressure shell 641 is fixedly installed on the side surface of the adjusting plate 62. The rubber negative pressure plate 642 is fixedly installed on the top side of the negative pressure shell 641. Adsorption holes are opened on the surface of the rubber negative pressure plate 642. The filter screen 643 is fixedly installed inside the negative pressure shell 641. The second air pump 644 is installed on the bottom side of the filter screen 643 and installed on the inner wall of the negative pressure shell 641. The output end of the second air pump 644 is fixedly connected to the second exhaust pipe 645. The end of the second exhaust pipe 645 is connected to the front outside of the negative pressure shell 641.

[0043] There are two filter screens 643, which are symmetrically arranged inside the negative pressure shell 641. One end of each filter screen 643 is fixedly connected to the inner wall of the top of the negative pressure shell 641, and the other end of each filter screen 643 is fixedly connected to the inner wall of the negative pressure shell 641. A material discharge port is provided between the bottom ends of the two filter screens 643 on the bottom side of the negative pressure shell 641. A sealing seat 646 is installed in the material discharge port and is slidably connected to the front side of the negative pressure shell 641.

[0044] The guide part 63 includes a guide post 631, a guide ring 632, a sleeve 633, and a limiting seat 634. The guide post 631 is fixedly installed on the worktable at the bottom of the inner cavity of the etching processing machine body 1. The guide ring 632 is slidably sleeved on the surface of the guide post 631. The side surface of the guide ring 632 is fixedly connected to the side surface of the adjusting plate 62. The top end of the guide post 631 is slidably sleeved on the sleeve 633. The top end of the sleeve 633 is fixedly connected to the limiting seat 634.

[0045] Operation process: After the workpiece is transported to the processing station, the hydraulic cylinder 61 is activated, and the extension and retraction of the output end is adjusted according to the workpiece size, driving the adjusting plate 62 to move along the guide part 63. The adjusting plate 62 slides along the guide post 631 through the guide ring 632 on the side surface. The sleeve 633 and the limiting seat 634 play a limiting and protective role, ensuring that the adjusting plate 62 drives the adsorption fixing part 64 to move smoothly to directly below the workpiece. Subsequently, the second suction pump 644 is activated, drawing air through the air passage in the negative pressure shell 641, so that the adsorption holes on the surface of the rubber negative pressure plate 642 form a negative pressure suction force, tightly adsorbing the bottom of the workpiece, and achieving non-damaging fixation of the workpiece. At the same time, the flexible material of the rubber negative pressure plate 642 can adapt to the surface contour of the workpiece, avoiding workpiece damage caused by hard contact, and further improving the workpiece fixing effect. During this process, the two symmetrical filter screens 643 in the negative pressure shell 641 can intercept a small amount of dust entrained in the adsorption airflow, preventing dust from entering the second suction pump 644. Dust that affects equipment lifespan can be discharged by opening the sealing seat 646 of the discharge port. Dust generated during etching is efficiently collected by the dust collection component 5 and the negative pressure fixing component 6. The receiving port on the top side of the dust collection shell 51 and the symmetrical inclined plate guide the dust to converge into the collection shell 52. After the first suction pump 54 is started, it generates negative pressure, which draws the dust airflow in the dust collection shell 51 into the collection shell 52. When the airflow passes through the interception filter 56 on the partition 53, the dust particles are filtered and intercepted. The clean airflow is discharged through the first exhaust pipe 55. Under the negative pressure of the adsorption fixing part 64, some dust remaining on the surface of the workpiece enters the negative pressure shell 641 through the adsorption hole of the rubber negative pressure plate 642 and is intercepted by the filter 643. This makes it easy to avoid the influence of the entering dust during the adsorption process, and at the same time, it facilitates auxiliary dust collection, further improves the cleanliness of the processing environment, avoids the influence of processing dust on the etching path of the laser 4, and improves the processing accuracy of the circuit board surface. Example

[0046] Reference Figures 6-8 and Figure 11 The difference between this embodiment and the first embodiment is that the dust removal unit 7 is disposed on the top of the negative pressure fixing component 6, and the dust removal unit 7 is used to blow away residual dust on the surface.

[0047] The dust removal unit 7 includes an air pump 71, an air pipe 72, an air shell 73, and dust blowing holes 74. The air pump 71 is fixedly installed on the outside of the limiting seat 634. The output end of the air pump 71 is fixedly connected to the air pipe 72. The end of the air pipe 72 is fixedly connected to the air shell 73. The air shell 73 is fixedly installed on the inside of the limiting seat 634. The air shell 73 has dust blowing holes 74 on the side surface facing the rubber negative pressure plate 642. The dust blowing holes 74 are evenly distributed on the surface of the air shell 73.

[0048] The rest of the structure is the same as in Example 1.

[0049] During operation, after etching is completed, the air pump 71 is started, generating a high-pressure airflow that is delivered to the air shell 73 on one side through the air pipe 72. The airflow is ejected at high speed through the dust blowing holes 74 evenly distributed on the surface of the air shell 73, precisely aimed at the workpiece surface on the rubber negative pressure plate 642. At the same time, the air shells 73 are symmetrically arranged on both sides of the workpiece, which facilitates blowing dust into the front and rear sides of the workpiece. The blown-off dust falls into the dust collection shell 51 and is collected by the dust collection component 5, avoiding the problem of dust residue affecting the etching path of the laser 4 and reducing the workpiece processing quality. After the dust is cleaned, the second suction pump 644 stops working, the negative pressure disappears, and the workpiece is removed from the adsorption and fixation. The hydraulic cylinder 61 drives the adjusting plate 62 to reset, and the conveyor belt 24 starts to transport the processed workpiece out of the machine body, completing the entire processing cycle.

[0050] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0051] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the currently considered best mode for carrying out the invention, or those features that are not relevant to implementing the invention) may be omitted.

[0052] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine task in design, manufacturing, and production without requiring extensive experimentation.

[0053] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A high-precision etching device for fine lines, characterized in that, It includes: An etching processing machine body (1) is provided with a feeding mechanism (2) for automatic conveying of workpieces through the side of the etching processing machine body (1), and a single-chip microcomputer (8) is installed on the right side of the top of the etching processing machine body (1). The motion slide (3) is installed on the top inner wall of the etching processing machine body (1). A laser (4) is installed on the bottom side of the moving end of the motion slide (3) to carry the laser (4) to realize X / Y / Z three-axis linkage. Dust collection assembly (5), the dust collection assembly (5) is installed on the worktable at the bottom of the inner cavity of the etching processing machine body (1), the dust collection assembly (5) is used for dust collection in fine line etching; Negative pressure fixing component (6), the negative pressure fixing component (6) is installed on the top side of the dust collection shell (51), the negative pressure fixing component (6) is used for workpiece adsorption and fixing; Dust removal unit (7) is located on top of negative pressure fixing component (6) and is used to blow away residual dust on the surface.

2. The high-precision etching apparatus for fine lines as described in claim 1, characterized in that: The feeding mechanism (2) includes a fixed frame (21), a conveying part and a limiting plate (26). The fixed frame (21) is installed on the side surface of the etching processing machine body (1). The fixed frame (21) is equipped with a conveying part for conveying circuit board workpieces. The limiting plate (26) installed on the top of the fixed frame (21) is symmetrically arranged on both sides of the conveying part. The conveying part and the limiting plate (26) penetrate the inlet on the right side of the etching processing machine body (1) and the outlet on the left side of the etching processing machine body (1). The conveying unit includes a conveying motor (22), a drive roller (23), a driven roller (25), and a conveyor belt (24). The conveying motor (22) is fixedly installed on the rear surface of the fixed frame (21). The output end of the conveying motor (22) is connected to the drive roller (23). The surface of the drive roller (23) is connected to the driven roller (25) through two parallel conveyor belts (24). The driven roller (25) is rotatably installed on the inner wall of the fixed frame (21).

3. The high-precision etching apparatus for fine lines as described in claim 1, characterized in that: The dust collection assembly (5) includes a dust collection shell (51), a collection shell (52), a partition (53), a first air pump (54), a first exhaust pipe (55), and an interception filter (56). The dust collection shell (51) is installed on the worktable at the bottom of the inner cavity of the etching processing machine body (1). The collection shell (52) is slidably connected to the front side of the dust collection shell (51). The partition (53) is fixedly connected to the inner wall of the collection shell (52). The first air pump (54) is installed in the collection shell (52) on one side of the partition (53). The first air pump (54) is fixedly connected to the first exhaust pipe (55) at its output end.

4. The high-precision etching apparatus for fine lines as described in claim 3, characterized in that: The dust collection shell (51) has a material receiving port in the middle of the top side, and two inclined plates are fixedly connected to the inner wall of the material receiving port. The two inclined plates are symmetrically distributed.

5. The high-precision etching apparatus for fine lines as described in claim 3, characterized in that: Two partitions (53) are symmetrically installed in the inner cavity of the collection shell (52). The partitions (53) and the top side of the collection shell (52) are on the same horizontal plane. The partitions (53) and the top side of the collection shell (52) slide against the inner wall of the dust collection shell (51). An interception filter (56) is embedded in the side surface of the partitions (53). The interception filter (56) is used to filter dust particles.

6. The high-precision etching apparatus for fine lines as described in claim 1, characterized in that: The negative pressure fixing mechanism includes a hydraulic cylinder (61), an adjusting plate (62), a guide part (63), and an adsorption fixing part (64). The hydraulic cylinder (61) is installed on the side surface of the dust collection shell (51). The output end of the hydraulic cylinder (61) is fixedly connected to the adjusting plate (62). The top side surface of the adjusting plate (62) is fixedly connected to the adsorption fixing part (64). The bottom outer side of the adjusting plate (62) is installed with the guide part (63). The bottom end of the guide part (63) is installed on the worktable at the bottom of the inner cavity of the etching processing machine body (1).

7. The high-precision etching apparatus for fine lines as described in claim 6, characterized in that: The adsorption fixing part (64) includes a negative pressure shell (641), a rubber negative pressure plate (642), a filter screen (643), a second air pump (644), and a second exhaust pipe (645). The negative pressure shell (641) is fixedly installed on the side surface of the adjusting plate (62). The rubber negative pressure plate (642) is fixedly installed on the top side of the negative pressure shell (641). Adsorption holes are opened on the surface of the rubber negative pressure plate (642). The filter screen (643) is fixedly installed inside the negative pressure shell (641). The second air pump (644) is installed on the inner wall of the negative pressure shell (641) on the bottom side of the filter screen (643). The output end of the second air pump (644) is fixedly connected to the second exhaust pipe (645). The end of the second exhaust pipe (645) is connected to the front outside of the negative pressure shell (641).

8. The high-precision etching apparatus for fine lines as described in claim 7, characterized in that: There are two filter screens (643), which are symmetrically arranged inside the negative pressure shell (641). One end of the filter screen (643) is fixedly connected to the inner wall of the top of the negative pressure shell (641), and the other end of the filter screen (643) is fixedly connected to the inner wall of the negative pressure shell (641). A material discharge port is provided between the bottom ends of the two filter screens (643) on the bottom side of the negative pressure shell (641). A sealing seat (646) is installed in the material discharge port and is slidably connected to the front side of the negative pressure shell (641).

9. The high-precision etching apparatus for fine lines as described in claim 6, characterized in that: The guide part (63) includes a guide post (631), a guide ring (632), a sleeve (633), and a limiting seat (634). The guide post (631) is fixedly installed on the worktable at the bottom of the inner cavity of the etching processing machine body (1). The guide ring (632) is slidably sleeved on the surface of the guide post (631). The side surface of the guide ring (632) is fixedly connected to the side surface of the adjustment plate (62). The sleeve (633) is slidably sleeved on the top of the guide post (631). The limiting seat (634) is fixedly connected to the top of the sleeve (633).

10. The high-precision etching apparatus for fine lines as described in claim 1, characterized in that: The dust removal unit (7) includes an air pump (71), an air pipe (72), an air shell (73), and dust holes (74). The air pump (71) is fixedly installed on the outside of the limiting seat (634). The output end of the air pump (71) is fixedly connected to the air pipe (72). The end of the air pipe (72) is fixedly connected to the air shell (73). The air shell (73) is fixedly installed on the inside of the limiting seat (634). The air shell (73) has dust holes (74) on the side of the air shell (73) facing the rubber negative pressure plate (642). The dust holes (74) are evenly distributed on the surface of the air shell (73).

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