Heat dissipation device

Abstract

The invention discloses a heat dissipation device which comprises a bearing part, a first heat conduction part and a second heat conduction part. The bearing part is provided with first and second liquid flow channels which are connected, and a liquid inlet and a liquid outlet which are respectively communicated with the two flow channels, the first heat conduction part is arranged in the two flow channels, and the second heat conduction part is connected to one side, far away from the first liquid flow channel, of the first heat conduction part. The end, close to the liquid inlet, of the first liquid runner is provided with a first flaring slope, and the end, close to the second liquid runner, is provided with a necking slope; the flowing section width L of the first liquid flow channel is larger than the flowing section width S of the connecting position of the first liquid flow channel and the second liquid flow channel. The first flaring inclined plane can enlarge the contact area of the cooling liquid and the first heat conduction piece, the necking inclined plane can concentrate the cooling liquid at the connecting position of the two flow channels, the flowing speed of the cooling liquid can be increased through the arrangement that L is larger than S, and the heat dissipation effect of the heat dissipation device is effectively improved through cooperation of L, S and the cooling liquid.

Description

Technical Field

[0001] This invention relates to the field of radiator technology, and more specifically, to a heat dissipation device. Background Technology

[0002] With the development of the electronics and new energy fields, the integration and power of high-power devices are increasing, making heat dissipation requirements more urgent. Liquid cooling is widely used in high-power (e.g., 2500KW) scenarios due to its high efficiency and uniform temperature control, and existing solutions mostly adopt direct current flow.

[0003] This method uses multiple direct-flow channels on the surface of the heat source, allowing coolant to enter from one end of the channel, flow through it, and exit from the other end, thus removing heat through heat exchange. However, this method has limited heat dissipation and is difficult to adapt to products with higher power (e.g., 4500KW). Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a heat dissipation device.

[0005] The present invention discloses a heat dissipation device, comprising: a support member, a first heat-conducting member and a second heat-conducting member. The support member has a first liquid flow channel, a second liquid flow channel, a liquid inlet and a liquid outlet. The first liquid flow channel is connected to the second liquid flow channel, the liquid inlet is connected to the first liquid flow channel, and the liquid outlet is connected to the second liquid flow channel. The first heat-conducting member is disposed in the first liquid flow channel and the second liquid flow channel, and the second heat-conducting member is connected to the side of the first heat-conducting member away from the first liquid flow channel. The first liquid flow channel has a first flared slope at one end near the inlet; the first liquid flow channel has a constricted slope at one end near the second liquid flow channel. The width of the flow section of the first liquid flow channel is L, and the width of the flow section at the connection between the first liquid flow channel and the second liquid flow channel is S, where L > S.

[0006] According to one embodiment of the present invention, there is a first angle between the first flared inclined surface and the vertical wall surface in the first liquid flow channel, wherein the first angle is 123°-127°.

[0007] According to one embodiment of the present invention, a second angle exists between the constricted inclined surface and the horizontal wall surface inside the first liquid flow channel, wherein the second angle is 166°-170°.

[0008] According to one embodiment of the present invention, a second flared inclined surface is further provided at one end of the first liquid flow channel near the liquid inlet, and the second flared inclined surface is disposed opposite to the first flared inclined surface.

[0009] According to one embodiment of the present invention, there is a third angle between the second flared inclined surface and the vertical wall surface in the first liquid flow channel, wherein the third angle is 143°-147°.

[0010] According to one embodiment of the present invention, a guide slope is further provided at one end of the first liquid flow channel near the second liquid flow channel.

[0011] According to one embodiment of the present invention, a fourth angle exists between the guide slope and the vertical wall surface in the first liquid flow channel, wherein the fourth angle is 193°-197°.

[0012] According to one embodiment of the present invention, the first heat-conducting element has a plurality of spaced heat dissipation channels, which are connected to a first liquid channel or a second liquid channel.

[0013] According to one embodiment of the present invention, the first liquid flow channel and the second liquid flow channel have a symmetrical structure.

[0014] According to one embodiment of the present invention, the carrier further has a third liquid flow channel and a fourth liquid flow channel that are connected to each other. The first liquid flow channel and the second liquid flow channel are located on one side of the carrier, and the third liquid flow channel and the fourth liquid flow channel are located on the other side of the carrier. The third liquid flow channel is connected to the liquid inlet, and the fourth liquid flow channel is connected to the liquid outlet. It also includes a third heat-conducting component and a fourth heat-conducting component. The third heat-conducting component is disposed in the third liquid flow channel and the fourth liquid flow channel, and the fourth heat-conducting component is disposed on the side of the third heat-conducting component away from the third liquid flow channel.

[0015] The beneficial effects of this invention are as follows: By setting the first flared inclined surface, the coolant entering through the inlet can flow to a larger area within the first liquid flow channel, thereby increasing the contact area between the coolant and the first heat-conducting component, which is beneficial for improving heat dissipation. Furthermore, due to the L>S configuration, the flow velocity of the coolant increases when flowing from the first liquid flow channel to the second liquid flow channel, thereby improving the efficiency of the coolant flowing out from the outlet and further enhancing the heat dissipation effect. The constricted inclined surface concentrates the coolant within the first liquid flow channel at the junction of the first and second liquid flow channels. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a three-dimensional structural diagram of the heat dissipation device; Figure 2 This is a breakdown diagram of the heat dissipation device; Figure 3 This is a three-dimensional structural diagram of the load-bearing component; Figure 4 This is a schematic diagram of another three-dimensional structure of the load-bearing component; Figure 5This is a front view of the load-bearing component; Figure 6 for Figure 2 Enlarged view of section A in the middle; Figure 7 This is a cross-sectional schematic diagram of the load-bearing component.

[0017] Explanation of reference numerals in the attached figures 1. Supporting component; 11. First liquid flow channel; 101. First angle; 102. Second angle; 103. Third angle; 104. Fourth angle; 111. First flaring slope; 112. Narrowing slope; 113. Vertical wall; 114. Horizontal wall; 115. Second flaring slope; 116. Guide slope; 12. Second liquid flow channel; 13. Liquid inlet; 14. Liquid outlet; 15. Third liquid flow channel; 16. Fourth liquid flow channel; 2. First heat-conducting component; 21. Heat dissipation channel; 3. Second heat-conducting component; 4. Third heat-conducting component; 5. Fourth heat-conducting component. Detailed Implementation

[0018] The following drawings disclose several embodiments of the present invention. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not essential. Furthermore, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0019] Furthermore, in this invention, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the invention. They are merely used to distinguish components or operations described using the same technical terms, and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, such a combination should be considered nonexistent and not within the scope of protection claimed by this invention.

[0020] like Figures 1-5 As shown, Figure 1 This is a three-dimensional structural diagram of the heat dissipation device; Figure 2 This is a breakdown diagram of the heat dissipation device; Figure 3 This is a three-dimensional structural schematic diagram of the support component 1; Figure 4This is another three-dimensional structural diagram of the support component 1; Figure 5 This is a front view of the support component 1. The heat dissipation device includes the support component 1, a first heat-conducting component 2, and a second heat-conducting component 3. The first heat-conducting component 2 is disposed within the support component 1, and the second heat-conducting component 3 is connected to the first heat-conducting component 2. Coolant flows within the support component 1. The product is placed on the second heat-conducting component 3. The heat generated by the product during operation is transferred to the second heat-conducting component 3, which then transfers the heat to the first heat-conducting component 2. As the coolant flows through the first heat-conducting component 2, it carries away the heat, thereby achieving a cooling effect on the product.

[0021] The carrier 1 has a first liquid flow channel 11, a second liquid flow channel 12, an inlet 13, and an outlet 14. The first liquid flow channel 11 and the second liquid flow channel 12 are connected. The inlet 13 is connected to the first liquid flow channel 11, and the outlet 14 is connected to the second liquid flow channel 12. A first heat-conducting element 2 is located inside the first liquid flow channel 11 and the second liquid flow channel 12. A second heat-conducting element 3 is connected to the side of the carrier 1 and covers the outer surface of the first liquid flow channel 11 and the second liquid flow channel 12. In this way, the first liquid flow channel 11 and the second liquid flow channel 12 form a cavity structure, and the coolant flows only within the first liquid flow channel 11 and the second liquid flow channel 12, without easily overflowing to the outside. In specific applications, the inlet 13 and the outlet 14 are arranged side by side on one side of the carrier 1. The coolant is input through the inlet 13, flows through the first liquid flow channel 11 and the second liquid flow channel 12, and finally flows out through the outlet 14. In this embodiment, the cross-sections of the first liquid flow channel 11 and the second liquid flow channel 12 are U-shaped, thereby improving the heat dissipation effect by extending the flow path of the coolant.

[0022] Specifically, the first liquid flow channel 11 is provided with a first flared inclined surface 111, which is located at the end of the first liquid flow channel 11 near the inlet 13. In use, when the coolant flows into the first liquid flow channel 11 from the inlet 13, the coolant flows along the first flared inclined surface 111, increasing the flow area of ​​the coolant in the first liquid flow channel 11. This facilitates full contact between the coolant and the first heat-conducting element 2, allowing more heat to be carried away from the first heat-conducting element 2. In this embodiment, the first liquid flow channel 11 is also provided with a vertical wall 113 opened in the vertical direction. There is a first angle 101 between the first flared inclined surface 111 and the vertical wall 113, wherein the first angle 101 is 123°-127°.

[0023] Furthermore, the first liquid flow channel 11 also has a second flared slope 115, which is located at the end of the first liquid flow channel 11 near the liquid inlet 13, and the first flared slope 111 and the second flared slope 115 are distributed on opposite sides. In use, the second flared slope 115 helps to increase the area through which the coolant flows, thereby increasing the contact area between the coolant and the first heat-conducting element 2, and thus improving the efficiency of heat removal. The combined arrangement of the first flared slope 111 and the second flared slope 115 maximizes the contact between the coolant and the first heat-conducting element 2, further improving the overall heat dissipation effect.

[0024] Specifically, the first liquid flow channel 11 may have multiple vertical walls 113, and there is a third angle 103 between the second flared inclined surface 115 and the corresponding vertical wall 113, wherein the third angle 103 is 143°-147°.

[0025] In practical applications, the flow cross-sectional width of the first liquid flow channel 11 is L, and the flow cross-sectional width at the connection between the first liquid flow channel 11 and the second liquid flow channel 12 is S, where L > S. It should be noted that the flow cross-sectional width refers to the width of the area through which the coolant flows. During use, the coolant flows into the first liquid flow channel 11 from the inlet 13. While flowing within the first liquid flow channel 11, the flow area of ​​the coolant is relatively large. When the coolant reaches the connection between the first liquid flow channel 11 and the second liquid flow channel 12, the flow area decreases. With the continuous input of coolant, the coolant is propelled to flow faster from the first liquid flow channel 11 to the second liquid flow channel 12, thereby increasing the flow velocity of the coolant within both the first and second liquid flow channels 11 and 12. This allows for more efficient removal of heat from the first heat-conducting element 2, achieving a more efficient heat dissipation effect. To further explain, when coolant flows from a wider flow cross-section to a narrower flow cross-section, the flow velocity increases significantly. This increased velocity lowers the pressure in that area, creating a pressure difference. This pressure difference drives the coolant to flow more efficiently, improving overall heat dissipation efficiency. In this embodiment, L = 72-76 mm, and S = 9-13 mm.

[0026] Furthermore, the first liquid flow channel 11 also has a constricted inclined surface 112, which is located at one end of the first liquid flow channel 11 near the second liquid flow channel 12, and is formed towards the connection between the first liquid flow channel 11 and the second liquid flow channel 12. The constricted inclined surface 112 allows for a smooth transition of the coolant, avoiding eddies and dead zones caused by right angles or stepped structures, thereby reducing overall pressure loss and achieving the effect of reducing flow resistance. In specific applications, a second angle 102 exists between the constricted inclined surface 112 and the horizontal wall 114 within the first liquid flow channel 11, wherein the second angle 102 is 166°-170°.

[0027] Furthermore, the first liquid flow channel 11 also has a guide ramp 116, which is located at one end of the first liquid flow channel 11 near the second liquid flow channel 12, and is formed towards the connection between the first liquid flow channel 11 and the second liquid flow channel 12. The guide ramp 116 allows for a smooth transition of the coolant, avoiding eddies and dead zones caused by right angles or stepped structures, thereby reducing overall pressure loss and achieving the effect of reducing flow resistance. In specific applications, a fourth angle 104 exists between the guide ramp 116 and the vertical wall 113 within the first liquid flow channel 11, wherein the fourth angle 104 is 193°-197°.

[0028] To further clarify, the vertical wall 113 and horizontal wall 114 in this embodiment are only used as reference surfaces. In other words, when the first liquid flow channel 11 does not have vertical walls 113 and horizontal walls 114 designed within it, imaginary vertical and horizontal surfaces can be used as substitutes. That is to say, the vertical wall 113 and horizontal wall 114 indicated in the attached drawings can be curved surfaces or bent structures, etc., in actual use. No structural limitations are imposed on the vertical wall 113 or horizontal wall 114 indicated in the attached drawings.

[0029] In this embodiment, the first liquid flow channel 11 and the second liquid flow channel 12 are symmetrical structures. The first flaring slope 111, the second flaring slope 115, the narrowing slope 112 and the guide slope 116 designed in the first liquid flow channel 11 are all present in the second liquid flow channel 12, so they will not be described in detail here.

[0030] Please refer to the following: Figure 2 and Figure 6 As shown, Figure 6 for Figure 2 Enlarged view of section A. The first heat-conducting component 2 has multiple heat dissipation channels 21, which are spaced apart and located within either the first liquid channel 11 or the second liquid channel 12. In use, the coolant in the first liquid channel 11 flows through the multiple heat dissipation channels 21, carrying away heat from the walls of the channels 21. In specific applications, the first heat-conducting component 2 can be divided into two groups: one group is placed within the first liquid channel 11, where the heat dissipation channels 21 are connected to the first liquid channel 11; the other group is placed within the second liquid channel 12, where the heat dissipation channels 21 are connected to the second liquid channel 12. In this embodiment, the width of the heat dissipation channels 21 is 0.5 mm.

[0031] Please refer to the following: Figure 7 As shown, Figure 7This is a cross-sectional schematic diagram of the support member 1. Preferably, the support member 1 further includes a third liquid flow channel 15 and a fourth liquid flow channel 16. The third liquid flow channel 15 and the first liquid flow channel 11 are respectively disposed on opposite sides of the support member 1, and the fourth liquid flow channel 16 and the second liquid flow channel 12 are respectively disposed on opposite sides of the support member 1. The third liquid flow channel 15 and the fourth liquid flow channel 16 are connected. The third liquid flow channel 15 is also connected to the liquid inlet 13, and the fourth liquid flow channel 16 is connected to the liquid outlet 14. The heat dissipation device further includes a third heat-conducting element 4 and a fourth heat-conducting element 5. The third heat-conducting element 4 is disposed within the third liquid flow channel 15 and the fourth liquid flow channel 16, and the fourth heat-conducting element 5 is connected to the side of the third heat-conducting element 4 away from the third liquid flow channel 15. In use, the coolant input through the inlet 13 flows to the first liquid flow channel 11 and the third liquid flow channel 15. After passing through the second liquid flow channel 12 and the fourth liquid flow channel 16, the coolant will flow out through the outlet 14. In this way, the products on the second heat-conducting component 3 and the fourth heat-conducting component 5 can be cooled simultaneously, which not only saves space but also reduces costs.

[0032] Specifically, the third liquid flow channel 15 has a similar structure to the first liquid flow channel 11, the fourth liquid flow channel 16 has a similar structure to the second liquid flow channel 12, the third heat-conducting element 4 has a similar structure to the first heat-conducting element 2, and the fourth heat-conducting element 5 has a similar structure to the second heat-conducting element 3.

[0033] In this embodiment, the support component 1 is made of aluminum, and the first heat-conducting component 2, the second heat-conducting component 3, the third heat-conducting component 4, and the fourth heat-conducting component 5 are all made of copper.

[0034] As shown in Table 1, Table 1 is a table of experimental parameters for the heat dissipation device. The experimental conditions are as follows: Under normal temperature conditions, the 4500KW product is in normal operation, the heat dissipation device is in contact with the product, and coolant that meets the temperature requirements (e.g., coolant at room temperature) is introduced into the heat dissipation device. Then, three detection areas are randomly selected for temperature collection. Based on the collected temperature information, it is determined whether the product temperature has been reduced to the required 70℃. #1-#7 are multiple heat dissipation devices with the same structure.

[0035] Table 1: Experimental Parameters of the Heat Dissipation Device

[0036] The data above shows that: ① The overall pressure difference is controlled between 0.1011 and 0.1240 bar, with minimal fluctuations, indicating a smooth flow channel design in the heat dissipation device, resulting in low resistance and low energy loss for the coolant during internal circulation. ② Under the combined effects of a constant flow rate (0.25 L / s) and low pressure difference, the actual flow velocity of the coolant inside the heat dissipation device is faster, enabling more efficient removal of heat generated by the 4500 kW high load. Furthermore, the rapidly flowing coolant enhances convective heat transfer, providing a crucial guarantee for rapid cooling.

[0037] In summary, the design of the first flared slope 111 allows the coolant entering through the inlet 13 to flow into a larger area within the first liquid flow channel 11, thereby increasing the contact area between the coolant and the first heat-conducting element 2 and improving heat dissipation. Furthermore, due to the L>S configuration, the flow velocity of the coolant increases as it flows from the first liquid flow channel 11 to the second liquid flow channel 12, thus improving the efficiency of the coolant exiting through the outlet 14 and further enhancing heat dissipation. The constricted slope 112 concentrates the coolant within the first liquid flow channel 11 at the junction of the first and second liquid flow channels 11 and 12.

[0038] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: The carrier (1), the first heat-conducting component (2) and the second heat-conducting component (3) are provided. The carrier (1) has a first liquid flow channel (11), a second liquid flow channel (12), an inlet (13) and an outlet (14). The first liquid flow channel (11) is connected to the second liquid flow channel (12), the inlet (13) is connected to the first liquid flow channel (11), and the outlet (14) is connected to the second liquid flow channel (12). The first heat-conducting component (2) is disposed in the first liquid flow channel (11) and the second liquid flow channel (12). The second heat-conducting component (3) is connected to the side of the first heat-conducting component (2) away from the first liquid flow channel (11). The first liquid flow channel (11) has a first flared slope (111) at one end near the liquid inlet (13); the first liquid flow channel (11) has a constricted slope (112) at one end near the second liquid flow channel (12). The width of the flow section of the first liquid flow channel (11) is L, and the width of the flow section at the connection between the first liquid flow channel (11) and the second liquid flow channel (12) is S, where L > S.

2. The heat dissipation device according to claim 1, characterized in that, There is a first angle (101) between the first flared inclined surface (111) and the vertical wall surface (113) inside the first liquid flow channel (11), wherein the first angle (101) is 123°-127°.

3. The heat dissipation device according to claim 1, characterized in that, There is a second angle (102) between the constricted inclined surface (112) and the horizontal wall (114) inside the first liquid flow channel (11), wherein the second angle (102) is 166°-170°.

4. The heat dissipation device according to claim 1, characterized in that, The first liquid flow channel (11) is also provided with a second flared inclined surface (115) at one end near the liquid inlet (13), and the second flared inclined surface (115) is arranged opposite to the first flared inclined surface (111).

5. The heat dissipation device according to claim 4, characterized in that, There is a third angle (103) between the second flared inclined surface (115) and the vertical wall (113) inside the first liquid flow channel (11), wherein the third angle (103) is 143°-147°.

6. The heat dissipation device according to any one of claims 1-5, characterized in that, The first liquid flow channel (11) is also provided with a guide slope (116) at one end near the second liquid flow channel (12).

7. The heat dissipation device according to claim 6, characterized in that, There is a fourth angle (104) between the guide slope (116) and the vertical wall (113) in the first liquid flow channel (11), wherein the fourth angle (104) is 193°-197°.

8. The heat dissipation device according to any one of claims 1-5, characterized in that, The first heat-conducting component (2) has multiple spaced heat dissipation channels (21), which are connected to the first liquid channel (11) or the second liquid channel (12).

9. The heat dissipation device according to any one of claims 1-5, characterized in that, The first liquid flow channel (11) and the second liquid flow channel (12) are symmetrical structures.

10. The heat dissipation device according to any one of claims 1-5, characterized in that, The carrier (1) also has a third liquid flow channel (15) and a fourth liquid flow channel (16) that are connected. The first liquid flow channel (11) and the second liquid flow channel (12) are located on one side of the carrier (1), and the third liquid flow channel (15) and the fourth liquid flow channel (16) are located on the other side of the carrier (1). The third liquid flow channel (15) is connected to the liquid inlet (13), and the fourth liquid flow channel (16) is connected to the liquid outlet (14). It also includes a third heat-conducting element (4) and a fourth heat-conducting element (5). The third heat-conducting element (4) is disposed in the third liquid flow channel (15) and the fourth liquid flow channel (16), and the fourth heat-conducting element (5) is disposed on the side of the third heat-conducting element (4) away from the third liquid flow channel (15).

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