Apparatus for manufacturing display device and method of manufacturing display device

Abstract

The invention relates to an apparatus for manufacturing a display device and a method of manufacturing the display device. The apparatus includes: a stage; a first film processing member that conveys the first film positioned above the stage in one direction; a second film processing member that conveys a second film positioned above the first film in one direction; a head portion above the second film, in which the head portion moves in a direction approaching the stage to provide a pressing force to the first film and the second film; and a clamping member that clamps a portion of the second film.

Description

Technical Field

[0001] This disclosure relates to apparatus and methods for manufacturing display devices. More specifically, this disclosure relates to apparatus for manufacturing display devices in a bonding process and methods for manufacturing display devices using such apparatus. Background Technology

[0002] With the development of information technology, display devices, as the connection medium between users and information, have become increasingly important. As a result, display devices such as liquid crystal displays (“LCDs”), organic light-emitting diode displays (“OLEDs”), and plasma display panels (“PDPs”) are widely used in various fields.

[0003] The display device may include a display area for displaying an image and a peripheral area extending from the display area to at least one side and where components (e.g., circuit boards, etc.) are positioned. For example, the circuit board may be formed of a printed circuit board or a film and positioned on the pads of the display panel.

[0004] Bonding equipment can refer to a thermoforming device that attaches components to a substrate using anisotropic conductive films. Through the bonding process using this equipment, conductive patterns on the substrate and conductive patterns on the component can be electrically connected to each other. Summary of the Invention

[0005] The embodiments provide an apparatus for manufacturing display devices with improved reliability.

[0006] Other embodiments provide a method for manufacturing a display device using equipment for manufacturing a display device.

[0007] An apparatus for manufacturing a display device according to an embodiment includes: a stage; a first film processing member that conveys a first film located above the stage in one direction; a second film processing member that conveys a second film located above the first film in one direction; a head located above the second film, wherein the head moves in a direction approaching the stage to provide pressing pressure to the first and second films; and a clamping member that clamps a portion of the second film.

[0008] In one embodiment, the clamping component may include a vacuum clamping component.

[0009] In an embodiment, the clamping component may include a first clamping member and a second clamping member, wherein the first clamping member clamps a first end of the second membrane and the second clamping member clamps a second end of the second membrane opposite to the first end.

[0010] In an embodiment, the clamping component may include only one clamping member that clamps one of the first end of the second membrane and the second end of the second membrane opposite to the first end.

[0011] In an embodiment, in a standby state where the head does not apply pressure to the first and second membranes, the head and the second membrane may not contact each other, while the clamping member and the second membrane may contact each other.

[0012] In one embodiment, the object to be processed may be positioned on a stage, and the object to be processed may include a display panel contained in a display device.

[0013] In the embodiments, the first film may be an anisotropic conductive film, and the second film may be a protective film.

[0014] An apparatus for manufacturing a display device according to an embodiment includes: a stage; a first film processing member that conveys a first film located above the stage in one direction; a second film processing member that conveys a second film located above the first film in one direction; and a head located above the second film, wherein the head moves in a direction approaching the stage to provide pressing pressure to the first and second films, and the head includes a body member and a clamping member disposed in a hole defined in the body member, wherein the clamping member clamps a portion of the second film.

[0015] In one embodiment, the clamping element may include a vacuum clamping element that provides vacuum suction to the second membrane.

[0016] In an embodiment, the main component may include a first region and a second region, the first region being defined as a region overlapping with the first membrane, and the second region being defined as a region not overlapping with the first membrane, and the clamping member may be positioned in the second region.

[0017] In an embodiment, in a standby state where the head does not apply pressure to the first and second membranes, the head and the second membrane may not contact each other, and the clamping member and the second membrane may not contact each other.

[0018] In one embodiment, the object to be processed may be positioned on a stage, and the object to be processed may include a display panel contained in a display device.

[0019] In the embodiments, the first film may be an anisotropic conductive film, and the second film may be a protective film.

[0020] A method of manufacturing a display device according to an embodiment includes: placing an object to be processed on a stage; placing a first film above the object to be processed; placing a portion of a clamped second film above the first film; pressing the first and second films to contact the object to be processed; and separating the second film from the object to be processed.

[0021] In one embodiment, a portion of the second membrane can be held by vacuum suction.

[0022] In one embodiment, a portion of the second membrane may be two opposite ends of the second membrane.

[0023] In an embodiment, a portion of the second membrane may be one end of the second membrane.

[0024] In one embodiment, the object to be processed may include a display panel contained in a display device.

[0025] In the embodiments, the first film may be an anisotropic conductive film, and the second film may be a protective film.

[0026] In an embodiment, multiple first membranes may be provided, and multiple first membranes may be attached to the object to be processed.

[0027] The apparatus for manufacturing a display device according to embodiments of the present disclosure and the method for manufacturing a display device using the apparatus for manufacturing a display device can effectively prevent defects caused by slippage of the protective film when compression is performed by the head by clamping a portion of the protective film. Attached Figure Description

[0028] The above and other features of the embodiments of this disclosure will become more apparent from the further detailed description of the embodiments with reference to the accompanying drawings.

[0029] Figure 1 and Figure 2 This is a view illustrating an apparatus for manufacturing a display device according to an embodiment of the present disclosure.

[0030] Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 It shows the use Figure 1 and Figure 2 A view of the apparatus used to manufacture a display device and the method of manufacturing a display device.

[0031] Figure 8 , Figure 9 , Figure 10 and Figure 11 It shows the use Figure 1 and Figure 2 A view of a display device manufactured using equipment for manufacturing display devices.

[0032] Figure 12 Is included Figure 10 and Figure 11 A top view of the display panel in a display device.

[0033] Figure 13 It is along Figure 12 A cross-sectional view of line X-X'.

[0034] Figure 14 and Figure 15 This is a view illustrating an apparatus for manufacturing a display device according to another embodiment of the present disclosure, and a method for manufacturing a display device using the apparatus.

[0035] Figure 16 , Figure 17 and Figure 18 This is a view illustrating an apparatus for manufacturing a display device according to another embodiment of the present disclosure, and a method for manufacturing a display device using the apparatus. Detailed Implementation

[0036] The invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be exhaustive and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals throughout refer to the same elements.

[0037] It will be understood that when an element is referred to as being "on" another element, the element may be directly on the other element, or there may be an intermediary element between the element and the other element. Conversely, when an element is referred to as being "directly on" another element, there is no intermediary element.

[0038] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Therefore, without departing from the teachings herein, “first element,” “first component,” “first region,” “first layer,” or “first section” discussed below may be referred to as “second element,” “second component,” “second region,” “second layer,” or “second section.”

[0039] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, “a,” “an,” “the,” and “at least one” are not intended to be a limitation on quantity and are intended to include both the singular and the plural. Thus, a reference to “the element” following a reference to “an element” in a claim includes one element and multiple elements. For example, unless the context clearly indicates otherwise, “an element” has the same meaning as “at least one element.” “At least one” is not to be construed as limited to “a” or “an”. “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that, when used in this specification, the terms “comprising” and / or “including” or “having” and / or “possessing” indicate the presence of the stated features, areas, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components and / or groups thereof.

[0040] Furthermore, relative terms such as “below” or “bottom” and “above” or “top” may be used herein to describe the relationship between one element and another as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the relative terms are intended to cover different orientations of the device. For example, if the device is flipped in one of the drawings, an element described as being “below” the other element will subsequently be oriented to be “above” the other element. Thus, depending on the specific orientation of the drawing, the term “below” can cover both “below” and “above” orientations. Similarly, if the device is flipped in one of the drawings, an element described as being “below” or “under” the other element will subsequently be oriented to be “above” the other element. Thus, the terms “below” or “under” can cover both “above” and “below” orientations.

[0041] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), as used herein, “about” or “approximately” includes the stated value and means within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of said value.

[0042] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that, unless expressly defined herein, terms (such as those defined in a general dictionary) should be interpreted as having a meaning consistent with their context in the relevant field and their meaning in this disclosure, and will not be interpreted in an idealized or overly formalized sense.

[0043] Embodiments are described herein with reference to cross-sectional views as idealized examples. Thus, variations in the illustrated shapes are anticipated due to factors such as manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but will include deviations in shape due to factors such as manufacturing. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0044] In the following, embodiments of the invention will be described in detail with reference to the accompanying drawings. The same reference numerals will be used for the same components in the drawings, and any repeated detailed descriptions of the same components will be omitted or simplified.

[0045] Figure 1 and Figure 2 This is a view illustrating an apparatus for manufacturing a display device according to an embodiment of the present disclosure.

[0046] Specifically, Figure 1 This is a top view of an apparatus for manufacturing a display device according to embodiments of the present disclosure, and Figure 2 This is a side view of an apparatus for manufacturing a display device according to an embodiment of the present disclosure.

[0047] An apparatus for manufacturing a display device according to embodiments of the present disclosure may include a stage ST and a bonding device TL disposed on the stage ST.

[0048] In an embodiment, the object OB to be processed can be positioned on the stage ST. In an embodiment, for example, the object OB to be processed can be an object manufactured using a bonding process (thermo-bonding). In an embodiment, the object OB to be processed can include objects contained in a display device (e.g., Figure 10 The first display device DD1 or Figure 11 The display panel in the Nth display device (DDN) (e.g., Figure 17 Display panel (PA).

[0049] In an embodiment, for example, the bonding device TL may be a device for hot-pressing and bonding the first film F1 to the display panel. In an embodiment, the bonding device TL may include a first film processing component TF1, a second film processing component TF2, a head HE, and a clamping component FX.

[0050] In this embodiment, the first membrane processing component TF1 can be positioned above the stage ST. The first membrane processing component TF1 can be disposed on opposite sides of the first membrane F1. The first membrane processing component TF1 can transport (or convey) the first membrane F1 located above the object OB to be processed in one direction.

[0051] In an embodiment, for example, the first membrane treatment component TF1 may include a first supply component SU1 and a first recycling component RE1. In an embodiment, for example, the first supply component SU1 may provide a first membrane F1 that contacts the object to be treated OB. Contaminated or used first membrane F1 may be recycled in the first recycling component RE1. In an embodiment, for example, the first membrane F1 may be movable in a first direction DR1 in the area overlapping with the object to be treated OB. In an embodiment, for example, the first membrane F1 may be provided for each bonding process.

[0052] In an embodiment, the first film F1 may be an anisotropic conductive film (“ACF”). In an embodiment, for example, the anisotropic conductive film may include an adhesive layer and a release liner. The release liner may be a film protecting the adhesive layer. The release liner can be removed during the bonding process, and only the adhesive layer can be attached to the object OB to be treated.

[0053] In an embodiment, a second membrane processing component TF2 may be positioned above a first membrane processing component TF1. The second membrane processing component TF2 may be disposed on opposite sides of the second membrane F2. The second membrane processing component TF2 may transport the second membrane F2 located above the first membrane F1 in one direction. In an embodiment, for example, the second membrane processing component TF2 may include a second supply component SU2 and a second recycling component RE2. In an embodiment, for example, the second membrane F2 in contact with the first membrane F1 may be provided while the second membrane F2, which is wound in a rolled-up form in the second supply component SU2, is being unwound. After a thermosetting bonding process, the second membrane F2 may be separated from the object OB to be treated. Additionally, contaminated or used second membrane F2 may be recycled to the second recycling component RE2 (“reelto reelmethod”).

[0054] In an embodiment, for example, a new second membrane F2 may be provided approximately every few tens of times (or dozens of times) of the process. In an embodiment, for example, a second supply member SU2 may provide the second membrane F2 to the object OB to be processed, and used second membrane F2 may be recycled to and discharged from a second recycling member RE2. Therefore, the amount of second membrane F2 wound around the second supply member SU2 may be gradually reduced. If the amount of second membrane F2 wound around the second supply member SU2 is insufficient, a new second membrane F2 may be supplied to the second supply member SU2.

[0055] In an embodiment, the second membrane F2 may be a protective membrane. The protective membrane can serve as a buffer during the bonding process. In an embodiment, for example, the protective membrane can effectively prevent damage to the bonding device TL, effectively prevent damage to the object OB to be processed, and improve flatness.

[0056] In an embodiment, the head HE can be positioned above the second membrane F2. For example, the head HE can move in a direction close to the stage ST (e.g., the second direction DR2) or in a direction away from the stage ST (e.g., the direction opposite to the second direction DR2). The second direction DR2 can intersect the first direction DR1. For example, the first direction DR1 and the second direction DR2 can be perpendicular to each other.

[0057] In an embodiment, the head HE can be moved in a direction close to the stage ST (e.g., the second direction DR2) to provide pressing pressure to the first membrane F1 and the second membrane F2.

[0058] In an embodiment, for example, the head HE may include metal. When the head HE provides pressing pressure, foreign objects or the like may be present on the pressing surface of the head HE and / or the attachment surface of the object OB to be processed (the surface opposite the pressing surface). Without positioning the second membrane F2, the head HE and / or the first membrane F1 may be damaged when pressing pressure is applied. To prevent such damage to the head HE and / or the first membrane F1, the second membrane F2 may be disposed between the head HE and the first membrane F1.

[0059] In an embodiment, the clamping component FX may include a first clamping member CK1, a second clamping member CK2, and a bracket BR. In an embodiment, for example, the bracket BR may support the first clamping member CK1 and the second clamping member CK2. In an embodiment, for example, the first clamping member CK1 and the second clamping member CK2 may be spaced apart from each other in a third direction DR3. Here, the third direction DR3 may intersect both the first direction DR1 and the second direction DR2. For example, the third direction DR3 may be perpendicular to both the first direction DR1 and the second direction DR2.

[0060] In an embodiment, the clamping member FX can clamp (or apply clamping force to) a portion of the second membrane F2 to effectively prevent the tension of the second membrane F2 from weakening and slipping. The second membrane F2 may be made of a different material than the first membrane F1. In an embodiment, for example, the second membrane F2 may include an elastomer. In an embodiment, for example, the elastomer may include silicone or Teflon. Furthermore, the second membrane F2 can have a longer travel distance than the first membrane F1. Therefore, as the size of the second membrane F2 increases, sagging in the direction of gravity may occur within the second membrane F2. Additionally, the second membrane F2 may slip while moving. The clamping member FX can effectively prevent sagging and slippage of the second membrane F2 by clamping a portion (e.g., the end) of the second membrane F2.

[0061] In embodiments, the first clamping member CK1 and / or the second clamping member CK2 included in the clamping component FX may be vacuum clamping members. However, this disclosure is not limited thereto. In embodiments, for example, clamping members that can effectively prevent the second membrane F2 from slipping may be used in various ways. In embodiments, for example, the first clamping member CK1 and / or the second clamping member CK2 may include electrostatic clamping members. Additionally, the first clamping member CK1 and the second clamping member CK2 may each include the same type of clamping member or may each include different types of clamping members.

[0062] In an embodiment, the clamping component FX may include a first clamping member CK1 clamping a first end ED1 of the second membrane F2 and a second clamping member CK2 clamping a second end ED2 opposite to the first end ED1. In an embodiment, for example, in a plan view, the first clamping member CK1 and the second clamping member CK2 may be positioned at locations where they do not overlap with the first membrane F1 but only with the second membrane F2. Therefore, the first membrane F1 can be attached to the object OB to be processed by a bonding process, and the second membrane F2 can maintain its tension.

[0063] In an embodiment, in a standby state where the head HE does not apply pressure to the first membrane F1 and the second membrane F2, the head HE does not contact the second membrane F2, and the clamping member FX can contact the second membrane F2. In an embodiment, for example, the head HE can have a high temperature. In an embodiment, for example, the temperature of the head HE can be approximately 60 degrees Celsius or higher. In an embodiment, the head HE and the second membrane F2 can be spaced apart to effectively prevent the second membrane F2 from deforming due to heat. In an embodiment, the clamping member FX can be in a state of clamping (or applying clamping force to) the second membrane F2. In an embodiment, defects caused by slippage of the second membrane F2 can be effectively prevented by including the clamping member FX in the engagement device TL.

[0064] Figure 1The embodiments shown are illustrative and this disclosure is not limited thereto. In the embodiments, for example, the apparatus for manufacturing a display device may include more components, or some components may be replaced / omitted.

[0065] In embodiments, for example, a drive device DV may also be included to drive the head HE. The drive device DV can move the head HE in the second direction DR2 and / or in a direction opposite to the second direction DR2. In embodiments, for example, the drive device DV may include a servo motor. However, this disclosure is not limited thereto.

[0066] In one embodiment, for example, the head HE may include a cylinder. The cylinder may be positioned in front of the drive unit DV (opposite to the first direction DR1). The cylinder may apply pressing pressure to the object OB to be processed.

[0067] Additionally, it may include guide rollers (e.g., to guide the movement of the first membrane F1 and the second membrane F2) Figure 1 (Guide rollers GR1, GR2, GR3, and GR4). The guide rollers may have tolerances (e.g., manufacturing tolerances of the guide rollers). The second film F2 may slip due to these tolerances.

[0068] Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 It shows the use Figure 1 and Figure 2 A view of the apparatus used to manufacture a display device and the method of manufacturing a display device.

[0069] In the following text, for ease of description, references to the above will be omitted or simplified. Figure 1 and Figure 2 The description includes any repeated detailed descriptions of the same or similar elements of the apparatus for manufacturing a display device according to embodiments of this disclosure.

[0070] Reference Figure 3 In a method for manufacturing a display device according to an embodiment of the present disclosure, an object to be processed OB may be positioned (or provided) on a stage ST (S100). In an embodiment, the object to be processed OB may include a display panel contained in the display device.

[0071] Reference Figure 4 The first membrane F1 can be positioned (or provided) above the object OB to be processed (S200). In an embodiment, the first membrane F1 can be an anisotropic conductive membrane.

[0072] In one embodiment, for example, the top may be in the second direction DR2 (e.g., the direction opposite to the direction of gravity). The object to be processed OB and the first membrane F1 may be parallel to the plane defined by the first direction DR1 and the third direction DR3.

[0073] Reference Figure 5 The second membrane F2, which is partially clamped (i.e., the second membrane F2 whose portion is clamped), can be positioned (or provided) above the first membrane F1 (S300). In an embodiment, the second membrane F2 may be a protective membrane.

[0074] In an embodiment, this portion of the second membrane F2 may be the opposite ends of the second membrane F2 (e.g., Figure 2 The first end ED1 and the second end ED2). In an embodiment, this portion of the second membrane F2 can be held by using a vacuum-adhesive clamping member FX. In an embodiment, for example, the clamping member FX may include a first clamping member CK1 and a second clamping member CK2 supported by a bracket BR. The first clamping member CK1 and the second clamping member CK2 can use vacuum pressure to lift and secure the opposite ends of the second membrane F2 (e.g., Figure 2 The first end ED1 and the second end ED2). Therefore, it is possible to effectively prevent the second membrane F2 from sagging in the direction opposite to the second direction DR2 and from sagging along the guide roller (e.g., Figure 1 The slippage that occurs when the guide rollers GR1, GR2, GR3 and GR4 move.

[0075] As described above, in the embodiment, when the second membrane F2, which is partially clamped, is positioned (or provided) above the first membrane F1, the second membrane F2 can contact the clamping member FX but not the head HE to effectively prevent thermal deformation of the second membrane F2.

[0076] Reference Figure 6 The first film F1 and the second film F2 can be pressed and brought into contact with the object OB to be treated (S400). In this process, only the adhesive layer of the first film F1 can be attached to the object OB to be treated, and the release paper can be removed.

[0077] Reference Figure 7 The second membrane F2 can be separated from the object to be processed OB (S500). To continue with the new bonding process, a new first membrane F1 can be provided to the first membrane processing component (e.g., Figure 1 The first membrane processing component TF1). In an embodiment, for example, after the second membrane F2 has undergone (or been used for) bonding processes dozens of times, a new second membrane F2 can be provided to the second membrane processing component (e.g., Figure 1 The second membrane treatment component TF2).

[0078] Figure 8 , Figure 9 , Figure 10 and Figure 11 It shows the use Figure 1 and Figure 2 A view of a display device manufactured using equipment for manufacturing display devices.

[0079] In the following text, for ease of description, references to the above will be omitted or simplified. Figure 1 and Figure 2 The components of an apparatus for manufacturing a display device according to embodiments of the present disclosure and the above references are described. Figure 3 , Figure 4 , Figure 5 and Figure 6 The description of any repeated elements that are the same as or similar to the elements in the method of manufacturing the display device according to the embodiments is described in detail.

[0080] Reference Figure 8 , Figure 9 and Figure 10 The first display device DD1 may include an object to be processed OB, a first film F1, and a component PT. In an embodiment, for example, the object to be processed OB may include a display panel, the first film F1 may include an anisotropic conductive film, and the component PT may include a circuit board. However, this disclosure is not limited thereto.

[0081] In an embodiment, for example, Figure 1 The bonding device TL can be a device that applies heat and pressure to a first membrane F1 to electrically connect the first electrode E1 of the object to be processed OB to the second electrode E2 of the component PT.

[0082] In some embodiments, for example, the first film F1 may include an adhesive AD and conductive balls CB. The conductive balls CB may be dispersed in the adhesive AD (distributed and disposed within the adhesive AD). In some embodiments, for example, the adhesive AD may include a thermoplastic material (e.g., styrene-butadiene or polyethylene-butene, etc.) or a thermosetting material (e.g., epoxy resin, polyurethane or acrylic resin, etc.). In some embodiments, for example, the conductive balls CB may include a metallic material (e.g., gold (Au), nickel (Ni), or palladium (Pd, etc.).

[0083] In embodiments, for example, the conductive ball CB may have a multilayer structure comprising a core containing a polymer, a metal layer surrounding the core and containing a conductive material, and a surface layer surrounding the metal layer and containing an insulating material. However, this disclosure is not limited thereto.

[0084] In an embodiment, for example, when the first membrane F1 is hot-pressed between the object to be processed OB and the component PT, electricity can flow in the pressing direction (e.g., the second direction DR2), and the adhesive AD can have insulating properties such that electricity does not flow in a direction perpendicular to the pressing direction (i.e., anisotropy).

[0085] Reference Figure 8 , Figure 9 and Figure 11 The Nth display device DDN may include multiple components PT (e.g., such as...). Figure 11 As shown, the multiple components PT may include a first component PT1 and a second component PT2. In an embodiment, for example, the first component PT1 and the second component PT2 may be disposed on the object OB to be processed. For this purpose, in an embodiment, a multiple first membranes F1 may be attached to the object OB to be processed. In an embodiment, for example, the multiple first membranes F1 may include a first-first membrane F11 corresponding to the first component PT1 and a first-second membrane F12 corresponding to the second component PT2.

[0086] As the length LE of the first membrane F1 in the first direction DR1 increases, the number of bonding processes, the cycle time, and the number of components used in the bonding process (i.e., Figure 2 The number of bonding devices TL can be reduced. Therefore, the number of display devices manufactured per unit time (i.e., production output) can be improved. However, as the length LE of the first film F1 in the first direction DR1 increases, the tension at the center may weaken. Therefore, sagging in the first film F1 in the direction of gravity (e.g., the direction opposite to the second direction DR2) may occur before the bonding process (i.e., in the standby state).

[0087] While the second film F2 moves along the second film processing component TF2, slippage may occur within the second film F2. In this case, due to slippage, the surface of the second film F2 may not be flat in the side view (i.e., the flatness of the surface of the second film F2 may be small). In this case, the position where the second film F2 is attached may deviate from the designed position. Therefore, the yield of the display device may decrease.

[0088] An apparatus for manufacturing a display device according to embodiments of the present disclosure may include clamping components (e.g., Figure 2 The clamping component FX). By clamping the end of the second membrane F2 (e.g., Figure 2 The first end ED1 and / or the second end ED2 can effectively prevent the tension of the second film F2 from weakening. Therefore, slippage can be effectively prevented, thereby improving the output of the display device.

[0089] In an embodiment, such as Figure 8 , Figure 9and Figure 10 As shown, the first membrane F1 can be attached to the object OB to be processed, and then the component PT can be attached. However, this disclosure is not limited thereto. In another embodiment, for example, the object OB to be processed can be attached after the first membrane F1 has been attached to the component PT.

[0090] Figure 12 Is included Figure 10 and Figure 11 A top view of the display panel in a display device. Figure 13 It is along Figure 12 A cross-sectional view of line X-X'.

[0091] Reference Figure 12 and Figure 13 An embodiment of the display panel PA of the display device DD may include multiple layers on a substrate SUB. In an embodiment, for example, the display panel PA may include a substrate SUB, a buffer layer BUF, a display layer DL, and an encapsulation layer TFE.

[0092] The display layer DL may include a transistor TFT, a gate insulating layer GI, an interlayer insulating layer II, a passivation layer PAS, a light-emitting element LED, and a pixel defining layer PDL.

[0093] The display area DA may include a light-emitting area and a non-light-emitting area. In an embodiment, for example, a transistor TFT and a light-emitting element LED may be positioned in the light-emitting area.

[0094] In an embodiment, for example, a transistor TFT may include an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE. A light-emitting element LED may include a first electrode E1, an intermediate layer ML, and a second electrode E2.

[0095] In a plan view, non-luminous areas may surround luminous areas. Here, the plan view may represent a view along a third direction DR3.

[0096] In embodiments, for example, the substrate SUB may include glass, quartz, plastic, stainless steel (SUS), or titanium (Ti), etc. In embodiments, for example, the substrate SUB may have flexible (e.g., bendable or rollable) properties.

[0097] A buffer layer (BUF) can be disposed on a substrate (SUB). The buffer layer (BUF) may include an inorganic insulating material. In embodiments, for example, the buffer layer (BUF) may include silicon oxide, silicon nitride, or silicon oxynitride. The buffer layer (BUF) can prevent impurities from diffusing into the active layer (ACT) of the transistor TFT or damaging the active layer (ACT) of the transistor TFT. However, this disclosure is not limited thereto. In embodiments, for example, the buffer layer (BUF) may include an organic insulating material.

[0098] The active layer ACT can be disposed on the buffer layer BUF. According to an embodiment, the active layer ACT may include a silicon semiconductor material. In an embodiment, for example, the active layer ACT may include amorphous silicon or polycrystalline silicon. According to an embodiment, the active layer ACT may include an oxide semiconductor material. In an embodiment, for example, the active layer ACT may include zinc oxide, zinc tin oxide, zinc indium oxide, indium oxide, titanium oxide, indium gallium zinc oxide, or indium zinc tin oxide. According to an embodiment, the active layer ACT may include an organic semiconductor material.

[0099] The active layer ACT can include the source region SEA, the drain region DEA, and the channel region CHA located between the source region SEA and the drain region DEA.

[0100] In one embodiment, for example, the active layer ACT can be formed by forming an amorphous silicon layer on the buffer layer BUF, crystallizing the amorphous silicon layer, and patterning the crystalline silicon layer. In another embodiment, for example, depending on the type of transistor TFT (e.g., a driving transistor or a switching transistor), the active layer ACT can be doped with impurities in the source region SEA and the drain region DEA.

[0101] A gate insulating layer GI can be disposed on the active layer ACT. The gate insulating layer GI can include an inorganic insulating material. In embodiments, for example, the gate insulating layer GI can include silicon oxide, silicon nitride, silicon oxynitride, titanium oxide, or tantalum oxide. The gate insulating layer GI can electrically insulate the active layer ACT from the gate electrode GE.

[0102] The gate electrode GE can be disposed on the gate insulating layer GI. The gate electrode GE can include a conductive material. In embodiments, for example, the gate electrode GE can include a metal, alloy, conductive metal oxide, or transparent conductive material. A gate signal can be applied to the gate electrode GE. The gate signal can turn the transistor TFT on / off to adjust the conductivity of the active layer ACT.

[0103] Interlayer insulating layer II may be disposed on the gate electrode GE. Interlayer insulating layer II may include organic insulating materials and / or inorganic insulating materials. Interlayer insulating layer II can electrically insulate the source electrode SE and drain electrode DE from the gate electrode GE.

[0104] The source electrode SE and drain electrode DE can be disposed on the interlayer insulating layer II. The source electrode SE and drain electrode DE can include conductive materials. In embodiments, for example, the source electrode SE and drain electrode DE can include metals, alloys, conductive metal oxides, or transparent conductive materials, etc.

[0105] The source electrode SE and drain electrode DE can be electrically contacted with the active layer ACT through contact holes H1 defined or formed through the interlayer insulating layer II and the gate insulating layer GI. In an embodiment, for example, the source electrode SE can be connected to the source region SEA and the drain electrode DE can be connected to the drain region DEA through contact holes H1 in the interlayer insulating layer II and the gate insulating layer GI.

[0106] A passivation layer PAS can be disposed on the source electrode SE and the drain electrode DE. The passivation layer PAS can include an organic insulating material. In embodiments, for example, the passivation layer PAS can include a polyimide resin or an acrylic resin (e.g., polyacrylic acid resin). The top surface of the passivation layer PAS can be substantially flat. In embodiments, for example, the passivation layer PAS can be formed of a transparent insulator to achieve a resonant effect. In embodiments, for example, the passivation layer PAS can include two or more layers comprising organic and / or inorganic materials. However, this disclosure is not limited thereto.

[0107] In another embodiment, for example, the top surface of the passivation layer PAS can be formed to be curved according to the curvature of the underlying layer. In this case, the passivation layer may also comprise an inorganic insulating material.

[0108] The first electrode E1 can be disposed on the passivation layer PAS. The first electrode E1 may include a conductive material. In embodiments, for example, the first electrode E1 may include a metal, alloy, conductive metal oxide, or transparent conductive material, etc.

[0109] The first electrode E1 can be electrically connected to the source electrode SE or the drain electrode DE through a contact hole H2 defined or formed through the passivation layer PAS. According to an embodiment, the first electrode E1 can be referred to as the anode electrode.

[0110] A pixel defining layer (PDL) may be disposed on the passivation layer (PAS) and cover a portion of the first electrode (E1). The pixel defining layer (PDL) may include an organic insulating material. In embodiments, for example, the pixel defining layer (PDL) may include a polyacrylic acid compound or a polyimide compound. The pixel defining layer (PDL) may define or be provided with pixel openings to separate the light-emitting regions of the pixels. The pixel openings defined in the pixel defining layer (PDL) may extend to the first electrode (E1).

[0111] The intermediate layer ML can be disposed on the first electrode E1 in the pixel aperture. The intermediate layer ML can include an organic light-emitting material. According to an embodiment, the intermediate layer ML can have a multilayer structure including various functional layers. In an embodiment, for example, the intermediate layer ML can include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

[0112] The second electrode E2 can be disposed on the intermediate layer ML and cover the pixel definition layer PDL. According to an embodiment, the second electrode E2 can be referred to as the cathode electrode.

[0113] In addition, the intermediate layer ML and the second electrode E2 can be formed on the first electrode E1.

[0114] The first electrode E1 and the second electrode E2 can be separated from each other by an intermediate layer ML, and light can be emitted from the organic light-emitting layer by applying voltages of different polarities to the intermediate layer ML. In an embodiment, a unit pixel may include multiple sub-pixels, and the multiple sub-pixels may emit light of various colors. In an embodiment, for example, each of the multiple sub-pixels may emit any one of red, green, and blue light. However, this disclosure is not limited thereto. In another embodiment, for example, the multiple sub-pixels may emit white light.

[0115] The encapsulation layer TFE can have a multilayer structure. In one embodiment, for example, the encapsulation layer TFE may include at least one organic layer between at least two inorganic layers. In another embodiment, for example, the encapsulation layer TFE may include at least one inorganic layer between at least two organic layers. In yet another embodiment, for example, the encapsulation layer TFE may include at least one organic layer between at least two inorganic layers and at least one inorganic layer between at least two organic layers.

[0116] In embodiments, for example, the encapsulation layer TFE may include an organic layer. In embodiments, for example, the organic layer may include a polymer. In embodiments, for example, the polymer may include polyethylene terephthalate, polyimide, polycarbonate, epoxy resin, polyethylene, or polyacrylate, etc. They may be used alone or in combination with each other. However, this disclosure is not limited thereto. The organic layer may include a material polymerized with a monomer composition. In embodiments, for example, the monomer composition may include monoacrylate monomers, deacrylate monomers, triacrylate monomers, or photoinitiators such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide (TPO), etc. They may be used alone or in combination with each other. However, this disclosure is not limited thereto.

[0117] In some embodiments, the encapsulation layer TFE may include an inorganic layer. In some embodiments, the inorganic layer may include a metal oxide or a metal nitride. In some embodiments, the inorganic layer may include SiN. x Materials such as Al2O3, SiO2, or TiO2. The materials listed above can be used alone or in combination with each other. However, this disclosure is not limited thereto.

[0118] In one embodiment, for example, the encapsulation layer TFE may include a first inorganic layer, a first organic layer, and a second inorganic layer sequentially stacked from the top of the light-emitting element LED. In another embodiment, for example, the encapsulation layer TFE may include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer sequentially stacked from the top of the light-emitting element LED. In yet another embodiment, for example, the encapsulation layer TFE may include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, a third inorganic layer, a third organic layer, and a fourth inorganic layer sequentially stacked from the top of the light-emitting element LED.

[0119] The top layer of the TFE encapsulation layer, which is the outermost layer of the display panel PA, can be formed with an inorganic layer to prevent moisture from penetrating into the light-emitting element LED. However, this disclosure is not limited thereto.

[0120] A halide metal layer may also be included between the light-emitting element (LED) and the first inorganic layer. In embodiments, for example, the halide metal layer may include lithium fluoride (LiF). When the first inorganic layer is formed by sputtering, the halide metal layer can effectively prevent damage to the LED. However, this disclosure is not limited thereto.

[0121] The pad PAD can be the location of the display panel PA and the circuit board (e.g., Figure 2 The components (PT) can be connected to the device. In an embodiment, for example, the first film of the described apparatus (method) for manufacturing a display device (e.g., Figure 2 The first film F1 is disposed in the area where the pad PAD is located, and the display panel PA and the circuit board can be connected via conductive balls (e.g., included in the first film F1). Figure 8 The conductive ball (CB) is electrically connected.

[0122] Figure 14 and Figure 15 This is a view illustrating an apparatus for manufacturing a display device according to another embodiment of the present disclosure, and a method for manufacturing a display device using the apparatus.

[0123] In the following text, for ease of description, references to the above will be omitted or simplified. Figure 1 and Figure 2 The components of an apparatus for manufacturing a display device according to embodiments of the present disclosure and the above references are described. Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 The description of any repeated elements that are the same as or similar to the elements in the method of manufacturing the display device according to the embodiments is described in detail.

[0124] Reference Figure 14 , Figure 15 and Figure 16 Apart from the configuration of the bonding device TL', the apparatus for manufacturing a display device according to another embodiment can be substantially the same as the apparatus for manufacturing a display device according to the above embodiment. In the embodiment, the clamping member FX' included in the bonding device TL' may consist of only one clamping member (e.g., a first clamping member CK1) and a bracket BR supporting the first clamping member CK1.

[0125] In an embodiment, the first clamping member CK1 can clamp a portion (e.g., one end) of the second membrane F2. While this portion of the second membrane F2 is clamped by the clamping member FX', the engagement device TL' can move up / down to effectively prevent the second membrane F2 from sagging and sliding.

[0126] In this embodiment that includes only one clamping element, manufacturing costs can be reduced compared to the case that includes two clamping elements, and interference with other components can be more easily avoided.

[0127] Figure 14 , Figure 15 and Figure 16 The method of manufacturing a display device using the apparatus for manufacturing a display device according to the embodiments shown in the examples can be substantially the same as / similar to the method of manufacturing a display device according to the embodiments described above.

[0128] In such an embodiment, for example, with Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 Similar to the embodiment shown, the object to be processed OB can be positioned on the stage ST (S100). The first membrane F1 can be positioned above the object to be processed OB (S200). The second membrane F2, which is partially clamped, can be positioned above the first membrane F1 (modification of S300). Here, only one end of the second membrane F2 can be clamped (see reference). Figure 14 The first membrane F1 and the second membrane F2 can be brought into contact with the object OB to be treated by pressing (S400). The second membrane F2 can be separated from the object OB to be treated (S500).

[0129] In such an embodiment where only one end of the second membrane F2 is clamped, the manufacturing cost (e.g., vacuum forming cost, etc.) can be reduced compared to the case where both ends of the second membrane F2 are clamped.

[0130] Figure 16 , Figure 17 and Figure 18 This is a view illustrating an apparatus for manufacturing a display device according to another embodiment of the present disclosure, and a method for manufacturing a display device using the apparatus.

[0131] In the following text, for ease of description, references to the above will be omitted or simplified. Figure 1 and Figure 2 The components of an apparatus for manufacturing a display device according to embodiments of the present disclosure, and the above references Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 The elements of the method for manufacturing a display device according to the embodiments described above, and the references above Figure 14 , Figure 15 ,and Figure 16 The description of any repeated elements of the same or similar elements of the apparatus and method for manufacturing the display device according to the embodiments is not included.

[0132] Reference Figure 16 , Figure 17 and Figure 18 Apart from the configuration of the "joining device TL", the apparatus for manufacturing a display device according to another embodiment can be substantially the same as the apparatus for manufacturing a display device according to the above embodiment. In the embodiment, the head HE' included in the "joining device TL" may include a clamping member FX.

[0133] In an embodiment, the head HE' may include a main body component BO and a clamping member FX". The clamping member FX" may be a vacuum clamping member disposed inside the main body component BO and providing vacuum suction force to the second membrane F2. However, this disclosure is not limited thereto. In an embodiment, for example, the clamping member FX" may be various clamping members capable of maintaining the tension of the second membrane F2. In an embodiment, for example, the clamping member may include an electrostatic clamping member.

[0134] In an embodiment, the main component BO may include a first region A1 and a second region A2. The first region A1 may be defined as the region overlapping with the first membrane F1. The second region A2 may be defined as the region not overlapping with the first membrane F1. In an embodiment, a clamping element FX (e.g., a vacuum clamping element) may be disposed in the second region A2.

[0135] In an embodiment, the head HE' and the second membrane F2 may not be in contact with each other, and the clamping member FX" and the second membrane F2 may also not be in contact with each other.

[0136] In one embodiment, the object to be processed (OB) may include a display panel contained in a display device.

[0137] In the embodiments, the first film F1 may be an anisotropic conductive film, and the second film F2 may be a protective film.

[0138] In other words, according to Figure 16 , Figure 17 and Figure 18 The apparatus for manufacturing a display device according to the embodiment shown includes a head HE' and a clamping member FX', and except that the head HE and the clamping members FX and FX' are configured independently, the apparatus for manufacturing a display device according to the embodiment described above can be combined with... Figure 16 , Figure 17 and Figure 18 The embodiments shown are essentially the same.

[0139] In an embodiment, the clamping member FX” can clamp a portion of the second membrane F2 (e.g., one end or opposite ends). With a portion of the second membrane F2 clamped, the engagement device TL” can move up / down to effectively prevent the second membrane F2 from sagging and slipping.

[0140] In embodiments where the clamping element "FX" is incorporated into the head "HE", the bracket may not be included (e.g., Figure 2 (The bracket BR). Therefore, compared to the case where the head HE and clamping parts FX and FX' are configured independently, installation can be easier.

[0141] In the method of manufacturing a display device according to an embodiment using the apparatus for manufacturing a display device according to an embodiment, such as Figure 16 As shown, the object to be processed OB can be positioned on the stage ST. The first membrane F1 can be positioned above the object to be processed OB. The second membrane F2 can be positioned above the first membrane F1. Here, when the first membrane F1 is positioned above the object to be processed OB, the second membrane F2 does not need to contact the head HE' and the clamping member FX". Therefore, deformation of the second membrane F2 due to heat from the head HE can be effectively prevented. Figure 17 As shown, the coupling device TL” can move in the second direction DR2. Therefore, the clamping member FX″ can clamp a portion of the second membrane F2. Figure 18 As shown, the engagement device TL” can move twice. Therefore, the first membrane F1 and the second membrane F2 can be pressed and brought into contact with the object OB to be processed. Next, the second membrane F2 can be separated from the object OB. During this process, the clamping member FX” can be closed. In an embodiment, for example, the vacuum clamping member can release the vacuum.

[0142] However, this disclosure is not limited thereto. In another embodiment, for example, a cooling device is included to prevent thermal deformation of the second membrane F2, and a bonding process can be performed while the second membrane F2 is in contact with the head HE' and the clamping member FX".

[0143] In the case of the apparatus for manufacturing a display device according to the comparative example, clamping components FX and FX' or clamping component FX' may not be included. In this case, the positional deviation of the second film F2 attached to the object OB to be processed may be large. The greater the positional deviation, the more likely the attachment position of components (e.g., circuit boards, etc.) is to deviate from the design position, and the display device may be determined to be defective.

[0144] The apparatus for manufacturing a display device according to the embodiments can be applied to the manufacturing process of display devices including computers (e.g., laptops), mobile phones, smartphones, smart panels, portable media players (“PMPs”), personal digital assistants (“PDAs”), or Motion Picture Experts Compression Standard Audio Layer 3 (MP3) players, etc.

[0145] This invention should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

[0146] Although the invention has been specifically shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit or scope of the invention as defined by the appended claims.

Claims

1. An apparatus for manufacturing a display device, wherein, The device includes: Stage; A first membrane processing component conveys a first membrane located above the stage in one direction; A second membrane processing component conveys a second membrane located above the first membrane in the one direction; A head, above the second membrane, wherein the head moves in a direction approaching the stage to provide pressing pressure to the first and second membranes; and A clamping component that clamps a portion of the second membrane.

2. The device according to claim 1, wherein, The clamping component includes a vacuum clamping component.

3. The device according to claim 1, wherein, The clamping component includes a first clamping member and a second clamping member, wherein the first clamping member clamps a first end of the second membrane, and the second clamping member clamps a second end of the second membrane opposite to the first end.

4. The device according to claim 1, wherein, The clamping component includes only one clamping member that clamps one of the first end of the second membrane and the second end of the second membrane opposite to the first end.

5. The device according to claim 1, wherein, In the standby state where the head does not apply pressure to the first and second membranes, The head and the second membrane do not contact each other, and The clamping component and the second membrane are in contact with each other.

6. The device according to claim 1, wherein, The object to be processed is positioned on the stage, and The object to be processed includes a display panel contained in the display device.

7. The device according to claim 1, wherein, The first film is an anisotropic conductive film, and The second membrane is a protective membrane.

8. An apparatus for manufacturing a display device, wherein, The device includes: Stage; A first membrane processing component conveys a first membrane located above the stage in one direction; A second membrane processing component, wherein the second membrane processing component conveys a second membrane located above the first membrane in the one direction; and A head, located above the second membrane, wherein the head moves in a direction approaching the stage to provide pressing pressure to the first membrane and the second membrane, and the head includes a body component and a clamping member disposed in a hole defined in the body component, wherein the clamping member clamps a portion of the second membrane.

9. The device according to claim 8, wherein, The clamping element includes a vacuum clamping element that provides vacuum suction force to the second membrane.

10. The device according to claim 8, wherein, The main component includes a first region and a second region. The first region is defined as the region overlapping with the first membrane, and the second region is defined as the region not overlapping with the first membrane. The clamping element is positioned in the second region.

11. The device according to claim 8, wherein, In the standby state where the head does not apply pressure to the first and second membranes, The head and the second membrane do not contact each other, and The clamping element and the second membrane do not contact each other.

12. The device according to claim 8, wherein, The object to be processed is positioned on the stage, and The object to be processed includes a display panel contained in the display device.

13. The device according to claim 12, wherein, The first film is an anisotropic conductive film, and The second membrane is a protective membrane.

14. A method for manufacturing a display device, wherein, The method includes: Place the object to be processed on the platform; The first membrane is placed above the object to be processed; A second membrane, in which a portion of its portion is clamped, is positioned above the first membrane; Press the first and second membranes to contact the object to be processed; and The second membrane is separated from the object to be processed.

15. The method according to claim 14, wherein, The portion of the second membrane is held by vacuum suction.

16. The method of claim 14, wherein, The portion of the second membrane is the opposite ends of the second membrane.

17. The method of claim 14, wherein, The portion of the second membrane is one end of the second membrane.

18. The method according to claim 14, wherein, The object to be processed includes a display panel contained in a display device.

19. The method according to claim 18, wherein, The first film is an anisotropic conductive film, and The second membrane is a protective membrane.

20. The method of claim 14, wherein, The first membrane is provided in multiple forms, and the multiple first membranes are attached to the object to be processed.

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