Automatic pressing device for a waxless mat process

Abstract

The application provides an automatic pressing device for a waxless pad process, and relates to the technical field of semiconductor wafer processing. The automatic pressing device comprises a rotating platform, a photoelectric sensor, a pressing assembly and a controller. The rotating platform is used to carry and drive the rotation of a waxless pad ceramic disc on which a wafer to be attached is installed. The photoelectric sensor is configured to output a positioning detection signal based on the positioning mark of the waxless pad ceramic disc. The pressing assembly comprises a support frame and a pressing air bag. One end of the support frame extends towards the rotating platform and is connected with the pressing air bag. The controller is configured to control the rotation of the rotating platform based on the positioning detection signal to rotate the wafer to be attached to the lower side of the pressing air bag. The controller is also configured to control the pressing air bag to perform a pressing operation on the wafer to be attached along a direction perpendicular to the waxless pad ceramic disc based on a plurality of groups of preset control parameters executed in sequence. The application can realize automatic positioning of the wafer and multi-stage program-controlled pressing, has high pressing precision and good consistency, and effectively improves the processing efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor wafer processing technology, and in particular to an automated lamination apparatus for a wax pad-free process. Background Technology

[0002] In the semiconductor wafer processing field, the wax-free process is widely used in wafer lamination and bonding processes due to its advantages of no residue, no pollution, and stable bonding. Since wafer processing has high requirements for lamination force, holding time, and positional accuracy, a stable and controllable lamination device is needed to ensure that the actual state of the wafer after lamination with the wax-free process is completely consistent with the process requirements.

[0003] In the existing technology, wafer lamination without a wax pad needs to be completed manually or with simple lamination equipment. The lamination action relies on manual adjustment of position and pressure parameters, and the wafer and the wax-free pad are laminated and bonded by applying pressure in a single step.

[0004] However, this method relies on manual operation and single pressure parameter control, making it impossible to adjust multiple sets of sequential pressure and bonding time, and difficult to automate cyclic bonding of multi-station wafers. With a large number of wafers being processed and varying bonding process parameters, manual operation and simple equipment cannot meet the precise, continuous, and stable bonding requirements, resulting in low processing efficiency and poor bonding quality consistency. Summary of the Invention

[0005] This application provides an automatic lamination device for a wax pad-free process to solve the technical problems of existing wafer lamination relying on manual operation or simple equipment, which have low wafer positioning accuracy, inability to achieve multi-segment programmable lamination, poor lamination quality consistency and low processing efficiency.

[0006] To achieve the above objectives, this application provides an automated pressing device for a wax-free pad process, comprising:

[0007] A rotary platform is used to support and drive a wax-free ceramic disk on which a wafer to be bonded is rotated.

[0008] The photoelectric sensor is mounted on one side of the rotating platform.

[0009] The photoelectric sensor is configured to output a positioning detection signal based on a positioning marker on a wax-free ceramic disc.

[0010] The tableting assembly includes a support frame, one end of which extends toward the rotating platform and is connected to a tableting airbag.

[0011] The controller is electrically connected to the rotating platform, photoelectric sensor, and tablet pressing assembly.

[0012] The controller is configured as follows:

[0013] Based on the positioning detection signal, the rotating platform is controlled to rotate so that the wafer to be bonded in the wax-free ceramic disk is rotated below the tableting airbag.

[0014] Based on multiple sets of sequentially executed preset control parameters, the pressure airbag is controlled to perform a pressing operation on the wafer to be bonded along a direction perpendicular to the wax-free ceramic disk.

[0015] Preferably, the support frame includes columns.

[0016] A cylinder is installed on the side wall of the column; the piston rod of the cylinder is oriented towards the rotating platform and is connected to the tablet compression airbag.

[0017] The controller executes multiple sets of sequentially executed preset control parameters to control the pressing airbag to perform a pressing operation on the wafer to be bonded along a direction perpendicular to the wax-free ceramic disk. Specifically, it is configured as follows:

[0018] Based on multiple sets of preset control parameters executed sequentially, the control cylinder drives the pressing airbag to perform a pressing operation on the wafer to be bonded in a direction perpendicular to the wax-free ceramic disk.

[0019] Preferably, each set of preset control parameters includes a first preset pressure, a second preset pressure, and a pressing time;

[0020] The controller executes multiple sets of preset control parameters executed sequentially, controlling the cylinder to drive the pressing airbag to perform a pressing operation on the wafer to be bonded along a direction perpendicular to the wax-free ceramic disk. Specifically, it is configured as follows:

[0021] Based on the first preset pressure in the current group's preset control parameters, the control cylinder drives the tableting airbag to move in the direction close to the wax-free ceramic disc.

[0022] The inflation pressure of the tablet compression bladder is controlled based on the second preset pressure in the same set of preset control parameters.

[0023] When the driving pressure of the cylinder reaches the first preset pressure and the filling pressure of the tableting airbag reaches the second preset pressure, the cylinder is controlled to maintain the first preset pressure and the tableting airbag is controlled to maintain the second preset pressure, and the pressing time is continued.

[0024] Preferably, the controller executes multiple sets of preset control parameters executed sequentially, controlling the cylinder to drive the pressing airbag to perform a pressing operation on the wafer to be bonded along a direction perpendicular to the wax-free ceramic disk, and is further configured as follows:

[0025] After executing a set of preset control parameters, based on the next set of preset control parameters, the steps of controlling the cylinder to drive the tableting airbag, controlling the filling pressure of the tableting airbag, controlling the cylinder to maintain the first preset pressure, the tableting airbag to maintain the second preset pressure, and continuing the pressing time are executed again.

[0026] Preferably, the controller executes multiple sets of preset control parameters executed sequentially, controlling the cylinder to drive the pressing airbag to perform a pressing operation on the wafer to be bonded along a direction perpendicular to the wax-free ceramic disk, and is further configured as follows:

[0027] After executing the last set of preset control parameters, the release pressure of the tablet compression bladder is controlled based on the second preset pressure in the last set of preset control parameters.

[0028] Based on the first preset pressure in the same set of preset control parameters, the control cylinder drives the tableting airbag to move away from the wax-free ceramic disc.

[0029] Preferably, it further includes a pressure sensor, which is disposed on an air passageway connected to the tablet compression bladder.

[0030] The pressure sensor is configured to output a pressure detection signal based on the pressure of the tablet compression bladder.

[0031] Preferably, the pressure sensor is electrically connected to the controller.

[0032] The controller is also configured as follows:

[0033] Acquire pressure detection signals.

[0034] The pressure detection signal is compared with the second preset pressure to obtain the pressure comparison result.

[0035] Based on the pressure comparison results, the inflation pressure of the tableting bladder is dynamically adjusted to stabilize the pressure inside the tableting bladder at the second preset pressure.

[0036] Preferably, the wax-free ceramic disk has multiple receiving positions for accommodating the wafer to be mounted, and the multiple receiving positions are evenly distributed along the circumference of the wax-free ceramic disk on the bearing surface of the wax-free ceramic disk.

[0037] Preferably, the rotating platform is an indexing rotating platform, and the single rotation angle of the rotating platform is the same as the circumferential angle between adjacent receiving positions on the wax-free ceramic disc.

[0038] Preferably, the controller is further configured to:

[0039] Based on the single rotation angle of the rotating platform, the platform is controlled to rotate so that the wafer to be mounted in the next receiving position is rotated below the tableting air bag.

[0040] As can be seen from the above technical solution, this application provides an automatic pressing device for a wax-free pad process. The device includes: a rotating platform for carrying and driving a wax-free pad ceramic disk containing a wafer to be bonded to rotate; a photoelectric sensor installed on one side of the rotating platform, configured to output a positioning detection signal based on the positioning marker of the wax-free pad ceramic disk; a pressing assembly including a support frame, one end of which extends towards the rotating platform and is connected to a pressing airbag; and a controller electrically connected to the rotating platform, the photoelectric sensor, and the pressing assembly. The controller is configured to: control the rotating platform to rotate based on the positioning detection signal, thereby rotating the wafer to be bonded within the wax-free pad ceramic disk to below the pressing airbag; and control the pressing airbag to perform a pressing operation on the wafer to be bonded in a direction perpendicular to the wax-free pad ceramic disk based on multiple sets of sequentially executed preset control parameters. This application achieves automatic wafer positioning through a photoelectric sensor and multi-segment programmable pressing based on multiple sets of sequentially executed preset control parameters, effectively improving pressing accuracy and consistency, and increasing processing efficiency. Attached Figure Description

[0041] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 One of the schematic diagrams of an automatic pressing device for a wax-free pad process provided in an embodiment of this application;

[0043] Figure 2 This is the second schematic diagram of the automatic pressing device for the wax-free pad process provided in the embodiments of this application.

[0044] Illustration:

[0045] The components include: 1. Rotating platform; 2. Wax-free ceramic disc; 21. Receiving position; 3. Photoelectric sensor; 4. Tableting assembly; 41. Support frame; 411. Column; 412. Cylinder; 42. Tableting airbag; and 5. Controller. Detailed Implementation

[0046] The embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described below do not represent all embodiments consistent with this application. They are merely examples of systems and methods consistent with some aspects of this application.

[0047] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.

[0048] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0049] The terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclude inclusion, for example, a product or device that includes a range of components is not necessarily limited to all of the components that are clearly listed, but may include other components that are not clearly listed or that are inherent to such product or device.

[0050] In the semiconductor wafer fabrication field, current technologies for wafer lamination without wax pads require manual operation or simple lamination equipment. The lamination process relies on manual adjustment of position and pressure parameters, achieving bonding between the wafer and the wax-free pad through a single application of pressure. This type of lamination method depends on manual operation and single pressure parameter control, making it impossible to achieve multiple sets of sequential pressure and lamination time adjustments, and it is difficult to automate the cyclic lamination of multi-station wafers. When processing a large number of wafers with varying lamination process parameters, manual operation and simple equipment cannot meet the requirements for precise, continuous, and stable lamination. This not only increases the labor intensity but also leads to low processing efficiency, poor consistency in lamination quality, and affects the stability of subsequent processing steps.

[0051] To solve the above problems, see [link to relevant documentation]. Figure 1 and Figure 2 This application provides an automatic pressing device for a wax-free pad process, comprising:

[0052] Rotary platform 1 is used to support and drive the wax-free ceramic disk 2, on which the wafer to be bonded is mounted, to rotate. The driving method of rotary platform 1 can be servo motor drive, stepper motor drive, or hydraulic motor drive. This embodiment does not limit the specific driving method of rotary platform 1.

[0053] Photoelectric sensor 3 is mounted on one side of the rotating platform 1. The detection head of photoelectric sensor 3 faces the wax-free ceramic disk 2 on the rotating platform 1.

[0054] The photoelectric sensor 3 is configured to output a positioning detection signal based on the positioning mark of the wax-free ceramic disk 2.

[0055] Specifically, when the wax-free ceramic disc 2 rotates with the rotating platform 1, the positioning marker passes through the detection area of ​​the photoelectric sensor 3 each time, and the photoelectric sensor 3 outputs a positioning detection signal. The photoelectric sensor 3 then sends the positioning detection signal to the controller 5.

[0056] The tablet pressing assembly 4 includes a support frame 41, which is positioned corresponding to the rotating platform 1. One end of the support frame 41 extends towards the rotating platform 1 and is connected to a tablet pressing airbag 42. The tablet pressing airbag 42 is made of flexible silicone material (such as a silicone airbag). The hardness of the tablet pressing airbag 42 can be set, for example, in the range of Shore A30 to Shore A50, so that the tablet pressing airbag 42 can apply the required pressure during the pressing process without damaging the wafer. The tablet pressing airbag 42 has a hollow structure, and its interior is connected to the air source pipeline. By inflating, the tablet pressing airbag 42 expands and undergoes elastic deformation. The flexible structure and elastic deformation characteristics of the tablet pressing airbag 42 allow it to adaptively conform to the micro-undulations of the surface of the wafer to be bonded and the bearing surface of the wax-free ceramic disk 2, thereby ensuring a uniform pressure distribution applied to the wafer by the tablet pressing airbag 42. The hardness, structure, and elastic deformation characteristics of the compression airbag 42 are matched with the requirements of the wax-free process for uniform wafer stress and no local stress concentration, ensuring uniform bonding between the wafer to be bonded and the wax-free ceramic disk 2 during the pressing process. The support frame 41 can drive the compression airbag 42 to move towards or away from the wax-free ceramic disk 2, realizing the lifting and lowering action of the compression airbag 42.

[0057] The movement of the support frame 41 can be achieved by driving elements such as cylinders, hydraulic cylinders or electric push rods. In this embodiment, the specific driving method for the movement of the support frame 41 is not limited.

[0058] The controller 5 is electrically connected to the rotating platform 1, the photoelectric sensor 3, and the pressing assembly 4.

[0059] Controller 5 is configured as follows:

[0060] Based on the positioning detection signal, the rotating platform 1 is controlled to rotate so that the wafer to be bonded in the wax-free ceramic disk 2 is rotated below the tableting airbag 42.

[0061] Based on multiple sets of sequentially executed preset control parameters, the pressure bladder 42 is controlled to perform a pressing operation on the wafer to be bonded along a direction perpendicular to the wax-free ceramic disk 2.

[0062] Specifically, controller 5 controls the rotation of rotating platform 1. When the positioning mark on the wax-free ceramic disk 2 passes through the detection area of ​​photoelectric sensor 3, photoelectric sensor 3 outputs a positioning detection signal. After receiving the positioning detection signal, controller 5 controls rotating platform 1 to rotate by a corresponding angle so that the wafer to be bonded is directly below the pressure airbag 42.

[0063] After the wafer to be bonded is positioned, the controller 5, based on multiple sets of sequentially executed preset control parameters, controls the pressure airbag 42 to perform a pressing operation on the wafer to be bonded in a direction perpendicular to the wax-free ceramic disk 2. The preset control parameters are stored inside the controller 5, and the controller 5 executes each set of parameters in the order of their groups, controlling the movement of the pressure airbag 42 and pressing the wafer to be bonded in the wax-free ceramic disk 2.

[0064] As can be seen from the above technical solution, this embodiment achieves automatic positioning and automatic pressing of the wafers to be bonded through the cooperation of the rotating platform 1, photoelectric sensor 3, pressing assembly 4, and controller 5. The photoelectric sensor 3 detects the positioning mark on the wax-free ceramic disk 2 and outputs a positioning detection signal. The controller 5 controls the rotating platform 1 to rotate according to this signal, precisely moving the wafers to be bonded under the pressing airbag 42, solving the problems of low accuracy and poor efficiency of manual alignment. The controller 5 controls the movement of the pressing airbag 42 based on multiple sets of sequentially executed preset control parameters, enabling the pressing process to be automatically executed according to a preset multi-stage program, solving the problem that the traditional single pressure control mode cannot adapt to complex process requirements. The entire device can continuously and automatically process multiple wafers to be bonded on the wax-free ceramic disk 2. The pressing parameters of each wafer are uniformly controlled by the controller 5, ensuring the consistency of pressing conditions, improving the stability and repeatability of pressing quality, and significantly reducing manual operation time, thus improving processing efficiency. The automatic pressing device provided in this embodiment has a compact structure, clear control logic, and can flexibly adapt to the multi-stage requirements of different wafer processing technologies for pressing parameters.

[0065] In some embodiments, see Figure 1 The support frame 41 includes a column 411, and a cylinder 412 is provided on the side wall of the column 411. The piston rod of the cylinder 412 is positioned towards the rotating platform 1, and the piston rod of the cylinder 412 is connected to the tablet compression airbag 42.

[0066] Controller 5 executes multiple sets of sequentially executed preset control parameters to control the pressing airbag 42 to perform a pressing operation on the wafer to be bonded along a direction perpendicular to the wax-free ceramic disk 2. Specifically, it is configured as follows:

[0067] Based on multiple sets of sequentially executed preset control parameters, the control cylinder 412 drives the pressing airbag 42 to perform a pressing operation on the wafer to be bonded in a direction perpendicular to the wax-free ceramic disk 2.

[0068] Specifically, the column 411 forms the main structure of the support frame 41, providing a stable support foundation for the entire tableting assembly 4. The cylinder 412, serving as the power source for moving the tableting airbag 42, is located on the side wall of the column 411. The piston rod of the cylinder 412 extends towards the rotating platform 1, and its end is fixedly connected to the tableting airbag 42. When the piston rod of the cylinder 412 extends, it pushes the tableting airbag 42 towards the wax-free ceramic disc 2; when the piston rod of the cylinder 412 retracts, it moves the tableting airbag 42 away from the wax-free ceramic disc 2. Through this connection method, the linear motion of the cylinder 412 is directly converted into the lifting and lowering motion of the tableting airbag 42, thus controlling the position of the tableting airbag 42.

[0069] In this embodiment, the cylinder 412 drives the tablet compression airbag 42 to move in the direction of approaching or moving away from the wax-free ceramic disc 2, which solves the problems of unstable movement of the pressing head and inaccurate position control in the existing simple equipment. It realizes the automated control of the lifting and lowering action of the tablet compression airbag 42, and provides a stable and controllable execution basis for pressing operation based on multiple sets of sequentially executed preset control parameters.

[0070] In some embodiments, each set of preset control parameters includes a first preset pressure, a second preset pressure, and a pressing time.

[0071] The controller 5 executes multiple sets of preset control parameters executed sequentially, controlling the cylinder 412 to drive the pressing airbag 42 to perform a pressing operation on the wafer to be bonded along a direction perpendicular to the wax-free ceramic disk 2. Specifically, it is configured as follows:

[0072] Based on the first preset pressure in the current group's preset control parameters, the control cylinder 412 drives the tablet compression airbag 42 to move in the direction close to the wax-free ceramic disc 2.

[0073] The inflation pressure of the tablet compression bladder 42 is controlled based on the second preset pressure in the same set of preset control parameters.

[0074] When the driving pressure of cylinder 412 reaches the first preset pressure and the filling pressure of tableting airbag 42 reaches the second preset pressure, control cylinder 412 to maintain the first preset pressure and tableting airbag 42 to maintain the second preset pressure, and continue pressing for a period of time.

[0075] The first preset pressure is a target pressure value used to control the movement of the compression airbag 42 driven by the cylinder 412. The second preset pressure is a target pressure value used to control the filling pressure of the compression airbag 42. The pressing time is a target value for the duration during which the compression airbag 42 presses the wafer to be bonded.

[0076] Cylinder 412 and tablet compressor 42 are connected to different air supply lines. The filling pressure of tablet compressor 42 can be achieved by a solenoid valve, a proportional valve, or other pneumatic adjustment components; this embodiment does not specifically limit this. Taking a solenoid valve as an example, a solenoid valve is installed on the air supply line connected to tablet compressor 42. The solenoid valve is electrically connected to controller 5, and controller 5 adjusts the filling pressure of tablet compressor 42 by controlling the opening degree of the solenoid valve.

[0077] Specifically, during the pressing process, the controller 5 sends a control command to the cylinder 412 based on the first preset pressure in the current set of preset control parameters. In response to this command, the cylinder 412 drives the tableting airbag 42 to move towards the wax-free ceramic disc 2. Simultaneously, the controller 5 controls the inflation pressure of the tableting airbag 42 based on the second preset pressure in the same set of preset control parameters. The internal pressure of the tableting airbag 42 gradually increases.

[0078] When the driving pressure of cylinder 412 reaches the first preset pressure and the filling pressure of tableting bladder 42 reaches the second preset pressure, controller 5 controls cylinder 412 to maintain the first preset pressure and tableting bladder 42 to maintain the second preset pressure, and continues the pressing process. During the continuous pressing process, controller 5 keeps the driving pressure of cylinder 412 stable at the first preset pressure, and at the same time keeps the internal pressure of tableting bladder 42 stable at the second preset pressure, until the pressing time set by the preset control parameters is reached.

[0079] In some embodiments, the controller 5 executes multiple sets of sequentially executed preset control parameters to control the cylinder 412 to drive the pressing airbag 42 to perform a pressing operation on the wafer to be bonded along a direction perpendicular to the wax-free ceramic disk 2. Specifically, it is further configured to:

[0080] After executing a set of preset control parameters, based on the next set of preset control parameters, the steps of controlling the cylinder 412 to drive the tableting airbag 42, controlling the tableting airbag 42 to fill pressure, controlling the cylinder 412 to maintain the first preset pressure, the tableting airbag 42 to maintain the second preset pressure, and continuing to compress for a certain period of time are executed again.

[0081] Specifically, for example, the preset control parameters can be set to five sets of parameters as shown in Table 1, with each set of parameters being a set of preset control parameters:

[0082] Table 1 Examples of Preset Control Parameters

[0083]

[0084] The controller 5 executes each set of preset control parameters sequentially according to a preset order. For the current set of parameters, the controller 5 controls the cylinder 412 to drive the tableting airbag 42 to move towards the wax-free ceramic disc 2 based on the first preset pressure of the set, and simultaneously controls the inflation pressure of the tableting airbag 42 based on the second preset pressure of the set. When the driving pressure of the cylinder 412 reaches the first preset pressure of the set and the inflation pressure of the tableting airbag 42 reaches the second preset pressure of the set, the controller 5 controls the cylinder 412 to maintain the first preset pressure of the set and the tableting airbag 42 to maintain the second preset pressure of the set, and continues the pressing time of the set. After completing the current set of parameters, the controller 5 automatically switches to the next set of parameters and repeats the above process until all sets from the first to the fifth set are completed.

[0085] The initial preset pressure (200kg→230kg→260kg→280kg→300kg) gradually increases. Specifically, as the cylinder lowers the airbag, the airbag gradually presses against the wafer from the inside out, starting from the center of the wafer, until it completely covers it. This aims to make the local flatness changes of the wafer more gradual and controllable, thereby effectively reducing overall flatness deviation. Simultaneously, the gradually increasing initial pressure avoids damage to the wafer from instantaneous impacts.

[0086] The second preset pressure (110kg→110kg→108kg→106kg→105kg) is initially constant and then gradually decreases. The purpose of this is that as the cylinder descends step by step, the force on the wafer surface continues to increase. Appropriately reducing the second preset pressure in the later stage can prevent the wafer from being subjected to excessive instantaneous force and avoid stress concentration or warping deformation at the wafer edge due to excessive pressure.

[0087] The purpose of gradually increasing the lamination time (3s→4s→6s→9s→10s) is as follows: as the lamination process progresses, the microstructure on the material surface is gradually compacted. Extending the lamination time can ensure that there are no bubbles or misalignments at the interface, thus achieving full adhesion. At the same time, there may be slight differences in micro-roughness and flatness between different batches of wafers. Gradually extending the lamination time helps to compensate for such deviations, thereby improving the consistency between batches.

[0088] In this embodiment, after the controller 5 executes a set of preset control parameters, it re-executes the control steps based on the next set of preset control parameters. This enables the sequential automatic switching and continuous execution of multiple sets of pressing parameters, solving the problem that existing pressing devices require manual intervention to change pressing parameters. This allows the pressing process to be completed automatically according to the preset multi-stage process requirements, improving the automation level and process adaptability of the pressing process.

[0089] In some embodiments, the controller 5 executes multiple sets of sequentially executed preset control parameters to control the cylinder 412 to drive the pressing airbag 42 to perform a pressing operation on the wafer to be bonded along a direction perpendicular to the wax-free ceramic disk 2. Specifically, it is further configured to:

[0090] After executing the last set of preset control parameters, the pressure of the tablet compression bladder 42 is controlled to be released based on the second preset pressure in the last set of preset control parameters.

[0091] Based on the first preset pressure in the same set of preset control parameters, the control cylinder 412 drives the tablet compression airbag 42 to move away from the wax-free ceramic disc 2.

[0092] Specifically, after the controller 5 completes the execution of all preset control parameters for each group, it enters the pressing stage completion state corresponding to the last set of preset control parameters. At this time, the controller 5 first controls the tableting airbag 42 to release its internal pressure based on the second preset pressure in the last set of preset control parameters. The tableting airbag 42 releases air through the air source pipeline, and the internal pressure of the airbag gradually decreases until it is balanced with atmospheric pressure. After the pressure of the tableting airbag 42 is released, the controller 5 sends a control command to the cylinder 412 based on the first preset pressure in the same set of preset control parameters. In response to the command, the cylinder 412 drives the tableting airbag 42 to move away from the wax-free ceramic disk 2, so that the tableting airbag 42 is completely detached from the surface of the wafer to be bonded and returns to its initial position.

[0093] In this embodiment, after the controller 5 executes the last set of preset control parameters, it controls the tableting airbag 42 to release pressure based on the second preset pressure in the same set of parameters, and controls the cylinder 412 to drive the tableting airbag 42 away from the wax-free ceramic disc 2 based on the first preset pressure, thereby realizing the automatic reset operation after the pressing is completed. This solves the problem that existing pressing devices require manual intervention to reset after pressing, and improves the complete automation level of the pressing process.

[0094] In some embodiments, the automatic pressing device for the wax-free pad process further includes a pressure sensor (not shown in the figure), which is disposed on an air passage that communicates with the tableting airbag 42.

[0095] The pressure sensor is configured as follows:

[0096] The pressure output pressure detection signal is based on the pressure of the tablet compression airbag 42.

[0097] Specifically, a pressure sensor is installed in the gas pipeline connecting the tablet compression bladder 42 and the gas source. The detection end of the pressure sensor is connected to the inside of the pipeline, enabling it to sense changes in the internal pressure of the tablet compression bladder 42 in real time. When the tablet compression bladder 42 inflates or deflates, the pressure sensor detects the internal pressure value of the bladder in real time and converts this pressure value into a corresponding electrical signal, i.e., a pressure detection signal. The pressure sensor sends the pressure detection signal to the controller 5 in real time, providing the controller 5 with real-time feedback on the internal pressure of the tablet compression bladder 42.

[0098] This embodiment uses a pressure sensor to detect the internal pressure of the tablet compression airbag 42 in real time and outputs a pressure detection signal, providing the controller 5 with real-time monitoring data of the airbag pressure during the compression process. This solves the problem that existing compression devices cannot obtain the internal pressure information of the tablet compression airbag in real time, and provides a data foundation for subsequent precise control based on pressure feedback.

[0099] In some embodiments, the pressure sensor is electrically connected to the controller 5.

[0100] Controller 5 is also configured as follows:

[0101] Acquire pressure detection signals.

[0102] The pressure detection signal is compared with the second preset pressure to obtain the pressure comparison result.

[0103] Based on the pressure comparison results, the filling pressure of the tablet compression bladder 42 is dynamically adjusted so that the pressure inside the tablet compression bladder 42 is stabilized at the second preset pressure.

[0104] Specifically, the pressure sensor continuously sends pressure detection signals to the controller 5, which collects these signals in real time and obtains the current pressure value of the tablet compression bladder 42. The controller 5 compares the current pressure value with the second preset pressure in the current group of preset control parameters to obtain a pressure comparison result. If the pressure comparison result shows that the current pressure value is lower than the second preset pressure, the controller 5 controls the air source to supplement the inflation of the tablet compression bladder 42, increasing the internal pressure of the bladder. If the pressure comparison result shows that the current pressure value is higher than the second preset pressure, the controller 5 controls the tablet compression bladder 42 to release some pressure, reducing the internal pressure of the bladder. If the pressure comparison result shows that the current pressure value is consistent with the second preset pressure, the controller 5 maintains the current inflation state. Through this dynamic adjustment method, the controller 5 keeps the pressure inside the tablet compression bladder 42 stable near the second preset pressure.

[0105] In this embodiment, the controller 5 collects the pressure detection signal and compares it with the second preset pressure. Based on the comparison result, the filling pressure of the tableting air bladder 42 is dynamically adjusted, realizing closed-loop control of the internal pressure of the tableting air bladder. This solves the problem that the pressure cannot be accurately maintained during the pressing process in existing pressing devices, ensuring that the pressure inside the tableting air bladder 42 remains stable at the preset target value throughout the pressing time, and improving the pressure stability and consistency of pressing quality during the pressing process.

[0106] In some embodiments, see Figure 1 The wax-free ceramic disk 2 is provided with multiple receiving positions 21 for accommodating wafers to be mounted. The multiple receiving positions 21 are evenly distributed along the circumference of the wax-free ceramic disk 2 on the bearing surface of the wax-free ceramic disk 2.

[0107] The bearing surface of the wax-free ceramic disk 2 refers to the side of the wax-free ceramic disk 2 facing the pressure airbag 42, used to place the wafer to be bonded. The receiving position 21 is a groove or positioning structure formed on the bearing surface of the wax-free ceramic disk 2. The shape of the receiving position 21 matches the shape of the wafer to be bonded, used to prevent the wafer from shifting during the rotation of the wax-free ceramic disk 2. Multiple receiving positions 21 are evenly distributed along the circumference of the wax-free ceramic disk 2, meaning the central angle between adjacent receiving positions 21 is equal, so that every time the wax-free ceramic disk 2 rotates by a fixed angle, the wafer to be bonded in the next receiving position 21 can be delivered to the same working position.

[0108] This embodiment achieves the function of a single wax-free ceramic disk 2 simultaneously supporting multiple wafers by setting multiple circumferentially evenly distributed receiving positions 21 on the bearing surface of the wax-free ceramic disk 2. This solves the problem that existing pressing devices can only process a single wafer at a time and require frequent loading and unloading, and provides a structural basis for continuous cyclic pressing of multiple wafers.

[0109] In some embodiments, the rotating platform 1 is an indexing rotating platform, and the single rotation angle of the rotating platform 1 is the same as the circumferential angle of the adjacent receiving position 21 on the wax-free ceramic disk 2.

[0110] Specifically, the rotating platform 1 adopts an indexing rotating platform structure, which can rotate precisely at a set angle and stop at that position. The single rotation angle of the rotating platform 1 is set to be equal to the circumferential angle between adjacent receiving positions 21 on the wax-free ceramic disk 2. When the controller 5 controls the rotating platform 1 to rotate once, the rotating platform 1 drives the wax-free ceramic disk 2 to rotate exactly one interval angle of receiving position 21, so that the wafer to be placed in the next receiving position 21 is accurately moved to the position below the tableting airbag 42.

[0111] This embodiment sets the rotating platform 1 as an indexing rotating platform and makes the single rotation angle of the rotating platform 1 the same as the circumferential angle of the adjacent receiving position 21. This achieves precise positioning and automatic switching of multiple wafers to be bonded on the wax-free ceramic disk 2, solves the problem of repeated alignment when multiple wafers are continuously pressed, and ensures that each wafer to be bonded can be accurately delivered to the same pressing position under the pressing airbag 42, providing positioning guarantee for the automated cyclic pressing of multiple wafers.

[0112] In some embodiments, controller 5 is further configured to:

[0113] Based on the single rotation angle of the rotating platform 1, the rotating platform 1 is controlled to rotate so as to rotate the wafer to be attached in the next receiving position 21 to below the tableting air bag 42.

[0114] Specifically, the rotating platform 1 is an indexing rotating platform, and the single rotation angle of the rotating platform 1 is the same as the circumferential angle of the adjacent receiving positions 21 on the wax-free ceramic disk 2. The controller 5 stores the value of this single rotation angle internally. After the wafer to be bonded in the current receiving position 21 is pressed, the controller 5 sends a rotation command to the rotating platform 1 based on the single rotation angle. The rotating platform 1 responds to the command by rotating one single rotation angle step, causing the wax-free ceramic disk 2 to rotate synchronously. After the wax-free ceramic disk 2 rotates, the next receiving position 21 originally located on the oblique side of the pressing air bladder 42 and the wafer to be bonded therein are exactly moved to the position directly below the pressing air bladder 42. At this time, the photoelectric sensor 3 detects the positioning mark of the wax-free ceramic disk 2 and outputs a positioning detection signal. The controller 5 confirms that the next wafer to be bonded has been positioned and then starts the pressing procedure for the wafer to be bonded.

[0115] In this embodiment, the controller 5 controls the rotation of the rotating platform 1 based on the single rotation angle of the rotating platform 1, realizing the automatic cyclic feeding of multiple wafers to be bonded on the wax-free ceramic disk 2. This solves the problem of needing manual intervention or repeated alignment when multiple wafers are continuously pressed together, and ensures that each wafer to be bonded can be automatically moved to the same pressing position under the pressing airbag 42 in sequence, providing complete control logic for the continuous automated pressing of multiple wafers.

[0116] Similar parts between the embodiments provided in this application can be referred to mutually. The specific implementation methods provided above are only a few examples under the overall concept of this application and do not constitute a limitation on the scope of protection of this application. For those skilled in the art, any other implementation methods extended from the solution of this application without creative effort shall fall within the scope of protection of this application.

Claims

1. An automatic pressing device for a wax-free pad process, characterized in that, include: Rotating platform (1), the rotating platform (1) is used to carry and drive the wax-free ceramic disk (2) on which the wafer to be bonded is mounted to rotate; A photoelectric sensor (3) is mounted on one side of the rotating platform (1); The photoelectric sensor (3) is configured to output a positioning detection signal based on the positioning mark of the wax-free ceramic disk (2); The tablet compression assembly (4) includes a support frame (41), one end of which extends toward the rotating platform (1) and is connected to a tablet compression airbag (42). The controller (5) is electrically connected to the rotating platform (1), the photoelectric sensor (3), and the pressing assembly (4), respectively. The controller (5) is configured as follows: Based on the positioning detection signal, the rotating platform (1) is controlled to rotate so as to rotate the wafer to be bonded in the wax-free ceramic disk (2) to the underside of the tableting airbag (42); Based on multiple sets of sequentially executed preset control parameters, the compression airbag (42) is controlled to perform a pressing operation on the wafer to be bonded in a direction perpendicular to the wax-free ceramic disk (2).

2. The automatic pressing device for the wax-free pad process according to claim 1, characterized in that, The support frame (41) includes a column (411); A cylinder (412) is provided on the side wall of the column (411); the piston rod of the cylinder (412) is positioned toward the rotating platform (1), and the piston rod of the cylinder (412) is connected to the tablet compression airbag (42); The controller (5) executes multiple sets of sequentially executed preset control parameters to control the pressing airbag (42) to perform a pressing operation on the wafer to be bonded along a direction perpendicular to the wax-free ceramic disk (2), specifically configured as follows: Based on multiple sets of sequentially executed preset control parameters, the cylinder (412) is controlled to drive the pressing airbag (42) to perform a pressing operation on the wafer to be bonded in a direction perpendicular to the wax-free ceramic disk (2).

3. The automatic pressing device for the wax-free pad process according to claim 2, characterized in that, Each set of preset control parameters includes a first preset pressure, a second preset pressure, and a pressing time; The controller (5) executes preset control parameters based on multiple sets of sequentially executed parameters, controlling the cylinder (412) to drive the pressing airbag (42) to perform a pressing operation on the wafer to be bonded in a direction perpendicular to the wax-free ceramic disk (2), specifically configured as follows: Based on the first preset pressure in the current group preset control parameters, the cylinder (412) is controlled to drive the tablet compression airbag (42) to move in the direction close to the wax-free ceramic disc (2); The inflation pressure of the tablet compression bladder (42) is controlled based on the second preset pressure in the same set of preset control parameters; When the driving pressure of the cylinder (412) reaches the first preset pressure and the filling pressure of the tableting airbag (42) reaches the second preset pressure, the cylinder (412) is controlled to maintain the first preset pressure and the tableting airbag (42) is controlled to maintain the second preset pressure, and the pressing time is continued.

4. The automatic pressing device for the wax-free pad process according to claim 3, characterized in that, The controller (5) executes preset control parameters based on multiple sets of sequentially executed parameters, controlling the cylinder (412) to drive the pressing airbag (42) to perform a pressing operation on the wafer to be bonded in a direction perpendicular to the wax-free ceramic disk (2), and is specifically configured as follows: After executing a set of preset control parameters, based on the next set of preset control parameters, the steps of controlling the cylinder (412) to drive the tableting airbag (42), controlling the filling pressure of the tableting airbag (42), controlling the cylinder (412) to maintain the first preset pressure, the tableting airbag (42) to maintain the second preset pressure, and continuing the pressing time are executed again.

5. The automatic pressing device for the wax-free pad process according to claim 4, characterized in that, The controller (5) executes preset control parameters based on multiple sets of sequentially executed parameters, controlling the cylinder (412) to drive the pressing airbag (42) to perform a pressing operation on the wafer to be bonded in a direction perpendicular to the wax-free ceramic disk (2), and is specifically configured as follows: After executing the last set of preset control parameters, the pressure of the tablet compression bladder (42) is controlled to be released based on the second preset pressure in the last set of preset control parameters; Based on the first preset pressure in the same set of preset control parameters, the cylinder (412) is controlled to drive the tablet compression airbag (42) to move away from the wax-free ceramic disc (2).

6. The automatic pressing device for the wax-free pad process according to claim 3, characterized in that, Also includes: A pressure sensor is disposed on an air passage that is connected to the tablet airbag (42); The pressure sensor is configured to output a pressure detection signal based on the pressure of the tablet airbag (42).

7. The automatic pressing device for the wax-free pad process according to claim 6, characterized in that, The pressure sensor is electrically connected to the controller (5); The controller (5) is also configured to: Acquire the pressure detection signal; The pressure detection signal is compared with the second preset pressure to obtain the pressure comparison result; Based on the pressure comparison results, the inflation pressure of the tablet compression bladder (42) is dynamically adjusted so that the pressure inside the tablet compression bladder (42) is stabilized at the second preset pressure.

8. The automatic pressing device for the wax-free pad process according to claim 1, characterized in that, The wax-free ceramic disk (2) is provided with a plurality of receiving positions (21) for accommodating the wafer to be mounted. The plurality of receiving positions (21) are evenly distributed along the circumference of the wax-free ceramic disk (2) on the bearing surface of the wax-free ceramic disk (2).

9. The automatic pressing device for the wax-free pad process according to claim 8, characterized in that, The rotating platform (1) is an indexing rotating platform, and the single rotation angle of the rotating platform (1) is the same as the circumferential angle of the adjacent receiving position (21) on the wax-free ceramic disk (2).

10. The automatic pressing device for the wax-free pad process according to claim 9, characterized in that, The controller (5) is also configured to: Based on the single rotation angle of the rotating platform (1), the rotating platform (1) is controlled to rotate so as to rotate the wafer to be attached in the next receiving position (21) to below the tableting airbag (42).

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