Heating body, heating assembly and aerosol generating device

Abstract

The invention provides a heating body, a heating assembly and an aerosol generating device, the heating body is a semiconductor conductive ceramic piece, and the thermal conductivity of the semiconductor conductive ceramic piece is 5 W / (m.K)-45 W / (m.K). The heat conductivity of the semiconductor conductive ceramic provided by the invention is 5W / (m.K)-45W / (m.K), the semiconductor ceramic has a certain supporting effect, and the heat conductivity can be adjusted as required, so that an aerosol generating product to be heated can be heated to a preset temperature within a short time, and a user can obtain a good taste.

Description

Technical Field

[0001] This application relates to the field of aerosol generation technology, and in particular to a heating element in the heating component of an aerosol generation device. Background Technology

[0002] Heating components in non-combustible aerosol generating devices can heat a heat source through methods such as resistance heating, thermal radiation, and thermal convection. Resistance heating typically transfers heat from the heat source to the aerosol-generated product. However, current resistance heating elements often fail to meet users' requirements for temperature field distribution and temperature rise rate.

[0003] Application content

[0004] To address the problem that existing technologies cannot meet users' needs for temperature field distribution and temperature rise rate.

[0005] This application provides a heating element, which is a semiconductor conductive ceramic component, and the thermal conductivity of the semiconductor conductive ceramic is 5W / (m·K)-45W / (m·K).

[0006] This application provides a heating element in which the thermal conductivity of the semiconductor conductive ceramic is 6W / (m·K)-30W / (m·K).

[0007] This application provides a heating element in which the resistivity of the semiconductor conductive ceramic is 0.01Ω·cm-1Ω·cm; and / or the resistivity of the semiconductor conductive ceramic is 0.01Ω·cm-0.5Ω·cm.

[0008] This application provides a heating element in which the temperature coefficient of resistance of the semiconductor conductive ceramic is -3000ppm / ℃ to 1000ppm / ℃; and / or the temperature coefficient of resistance of the semiconductor conductive ceramic is -2800ppm / ℃ to 0ppm / ℃.

[0009] This application provides a heating element in which the normal total emissivity of the semiconductor conductive ceramic is 0.8-0.96.

[0010] This application provides a heating element in which the three-point bending strength of the semiconductor conductive ceramic is greater than or equal to 25N; and / or the three-point bending strength of the semiconductor conductive ceramic is greater than or equal to 40N.

[0011] This application provides a heating component, including a first electrode, a second electrode, and a heating element made of semiconductor conductive ceramic as described in claims 1-5; the heating element has an opening for inserting an aerosol generating article, the heating element defining a heating cavity for receiving the aerosol generating article, the opening and the heating cavity communicating; the heating element includes a first end near the opening and a second end away from the first end; the first electrode and the second electrode are disposed at a distance along the longitudinal direction of the heating element, the first electrode and the second electrode being used to guide current in the longitudinal direction of the heating element when the heating component is in use, the first electrode being located between the first end and the second electrode.

[0012] This application provides a heating element, wherein the wall thickness of the heating element is 0.5mm-0.7mm.

[0013] This application provides a heating component, wherein the first electrode and the second electrode extend circumferentially along the heating body;

[0014] The distance between the second electrode and the first end is less than the distance between the second electrode and the first end.

[0015] This application provides a heating component, wherein the first electrode and / or the second electrode are closed rings.

[0016] This application provides a heating component, wherein the first electrode and / or the second electrode are configured to be non-closed in the circumferential direction, and the corresponding electrodes are provided with notches.

[0017] This application provides a heating component, wherein both the first electrode and the second electrode have notches, the notch on the first electrode is a first notch, and the notch on the second electrode is a second notch, and the first notch and the second notch are staggered in the longitudinal direction of the heating element.

[0018] This application provides a heating component, wherein the notch extends along the circumference of the heating body with an arc between 0.1π and 0.7π.

[0019] This application provides a heating component, wherein the first electrode and / or the second electrode extend along the circumferential direction of the heating body in an arc between π and 2π.

[0020] This application provides a heating component in which the first electrode and the second electrode extend with the same arc along the circumferential direction of the heating body;

[0021] Alternatively, the first electrode and the second electrode may extend at different circumferential arcs along the heating element.

[0022] This application provides a heating component, which also includes:

[0023] A conductive transition adhesive layer is formed or disposed between the first electrode and / or the second electrode and the heating element to provide adhesion between the first electrode and / or the second electrode and the heating element.

[0024] This application provides a heating component, wherein a first distance is provided between the first electrode and the first end, a second distance is provided between the first electrode and the second electrode, and a third distance is provided between the second electrode and the second end; the second distance is greater than or equal to the first distance, and the second distance is less than or equal to the third distance.

[0025] This application provides a heating component, wherein the heating element includes:

[0026] The first part defines the first end;

[0027] The second part defines the second end, wherein the first electrode and / or the second electrode are arranged on the first part and avoid the second part;

[0028] When current is guided through the first electrode and the second electrode on the heating element, the first part can generate heat through resistive Joule heating, and the second part generates heat by receiving the heat transferred from the first part.

[0029] This application provides a heating component, wherein a first electrode and a second electrode are arranged at intervals on the heating body to conduct current on at least a portion of the heating body;

[0030] At least one conductive trace is formed or incorporated on the heating element; the at least one conductive trace is arranged to extend from the first electrode to the second electrode and is capable of being subjected to a voltage by the first electrode and the second electrode to generate resistive Joule heating.

[0031] This application provides an aerosol generating device, including a battery assembly and the aforementioned heating assembly, wherein the battery assembly provides electrical energy to the heating assembly.

[0032] The semiconductor conductive ceramic provided in this application has a thermal conductivity of 5W / (m·K)-45W / (m·K). The semiconductor ceramic itself has a certain supporting function, and the thermal conductivity can be adjusted according to the requirements. This allows the aerosol product to be heated to the preset temperature in a short time, and users can obtain a good taste. Attached Figure Description

[0033] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0034] Figure 1 This is the temperature field distribution when the heating component reaches its maximum temperature under operating condition ① of this application.

[0035] Figure 2 This is the temperature field distribution when the heating component in operating condition ② of this application reaches its maximum temperature.

[0036] Figure 3 This is the temperature field distribution when the heating component reaches its highest temperature under operating condition ③ of this application.

[0037] Figure 4 This is the temperature field distribution when the heating component reaches its highest temperature under operating condition ④ of this application.

[0038] Figure 5 This is the temperature field distribution when the heating component reaches its highest temperature under operating condition ⑤ of this application.

[0039] Figure 6 This is the temperature field distribution when the heating element in operating condition ⑥ of this application reaches its maximum temperature.

[0040] Figure 7 This is the temperature field distribution when the heating element in operating condition ⑦ of this application reaches its highest temperature.

[0041] Figure 8 This is the temperature field distribution when the heating element in operating condition ⑧ of this application reaches its maximum temperature.

[0042] Figure 9 This is the temperature field distribution when the heating element reaches its highest temperature under operating condition ⑨ of this application.

[0043] Figure 10 This is the temperature field distribution when the heating element reaches its highest temperature under operating condition ⑩ of this application.

[0044] Figure 11 The difference in heating rate of the highest temperature point of the heating component in operating conditions ①-⑩ of this application;

[0045] Figure 12 The location of the longitudinal temperature field distribution monitoring point when the heating element of this application reaches the maximum temperature of 300℃;

[0046] Figure 13 For this application Figure 5 The longitudinal temperature difference between monitoring point 5 and monitoring point 1;

[0047] Figure 14The temperature change of monitoring point 5 over time under different thermal conductivity conditions in this application;

[0048] Figure 15 This is a schematic diagram of a heating component according to an embodiment of this application;

[0049] Figure 16 This is a schematic diagram of a heating component according to an embodiment of this application;

[0050] Figure 17 This is a schematic diagram of a heating component according to an embodiment of this application;

[0051] Figure 18 This is a schematic diagram of a heating component according to an embodiment of this application;

[0052] Figure 19 This is a schematic diagram of an aerosol generating apparatus according to an embodiment of this application.

[0053] In the picture:

[0054] 10. Heating components;

[0055] 1. First electrode; 11. First notch;

[0056] 2. Second electrode; 21. Second notch;

[0057] 3. Heating element; 31. Opening; 32. Heating cavity; 33. First end; 34. Second end; 35. First part; 36. Second part;

[0058] 4. Conductive trajectory;

[0059] 20. Battery components;

[0060] 100. Aerosol generating device. Detailed Implementation

[0061] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0062] The terms "first," "second," and "third" used in this application are for descriptive purposes only and should not be construed as indicating or implying the quantity or order of the indicated technical features relative to their importance. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship or movement of the components in a specific orientation (as shown in the accompanying drawings). If the specific orientation changes, the directional indication will also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0063] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0064] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be intervening elements. When an element is referred to as being "connected to" another element, it can be directly connected to the other element, or there may be one or more intervening elements. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0065] This application provides a heating element that can be made of semiconductor conductive ceramic. That is, the heating element can be a semiconductor conductive ceramic component. The thermal conductivity of the semiconductor conductive ceramic can be 5 W / (m·K)-45 W / (m·K).

[0066] The semiconductor conductive ceramic provided in this application has a thermal conductivity of 5W / (m·K)-45W / (m·K). The semiconductor ceramic itself has a certain supporting function, and the thermal conductivity can be adjusted according to the needs. This allows the aerosol product to be heated to the preset temperature in a short time, and users can obtain a good taste.

[0067] In some examples, the thermal conductivity of the semiconductor conductive ceramic can be 6 W / (m·K) to 30 W / (m·K). In one embodiment of this application, the thermal conductivity of the semiconductor conductive ceramic is 10 W / (m·K) to 27 W / (m·K). For example, the thermal conductivity of the semiconductor conductive ceramic can be 10 W / (m·K), 12 W / (m·K), 15 W / (m·K), 18 W / (m·K), 20 W / (m·K), 22 W / (m·K), 25 W / (m·K), 27 W / (m·K), 30 W / (m·K), 33 W / (m·K), 35 W / (m·K), 37 W / (m·K), or 40 W / (m·K).

[0068] In one embodiment of this application, the aerosol-generating article has an overall elongated cylindrical structure, for example, constructed to resemble the cylindrical shape of a cigarette. Alternatively, in other variations, the aerosol-generating article may be an elongated elliptical cylinder, a square prism, a polygonal prism, etc. In some embodiments, the appearance of the aerosol-generating article may mimic the appearance of a conventional lit and smokeable cigarette.

[0069] In one embodiment of this application, the aerosol-generating article includes an aerosol-generating matrix; the aerosol-generating matrix describes a matrix capable of releasing volatile compounds upon heating, which can form aerosols. The aerosols described herein can be visible or invisible and can include vapors (e.g., fine particles of matter in a gaseous state, which are typically liquid or solid at room temperature) as well as droplets of gas and condensed vapors. The aerosol-generating matrix can include one or more of the following: powder, granules, pellets, fragments, strands, strips, or sheets, comprising one or more of the following: dried flowers or leaves, grass leaves, tobacco leaves, tobacco midribs, expanded tobacco, and homogenized tobacco.

[0070] In one embodiment of this application, the aerosol generating article includes a filter section and a smoke-generating section. The filter section is used to filter the aerosol before outputting it, and the filter section typically includes a porous material such as cellulose acetate. The smoke-generating section is inserted into the heating chamber 32 of the heating assembly 10 to heat the smoke-generating section to generate aerosol.

[0071] The heating rate and longitudinal temperature field distribution of the heating component 10 under the following 10 working conditions were tested using multiphysics simulation software.

[0072] Operating condition ①: Constant power 23W, thermal conductivity 37W / (m·K), electrical conductivity 1.5×10 3 S / m.

[0073] Operating condition ②: Constant power 23W, thermal conductivity 27W / (m·K), electrical conductivity 1.5×10 3 S / m.

[0074] Operating condition ③: Constant power 23W, thermal conductivity 27W / (m·K), electrical conductivity 7.5×10 2 S / m.

[0075] Operating condition 4: Constant power 23W, thermal conductivity 5W / (m·K), electrical conductivity 7.5×10 2 S / m;

[0076] Operating condition ⑤: Constant power 23W, thermal conductivity 6W / (m·K), electrical conductivity 7.5×10 2 S / m;

[0077] Operating condition ⑥: Constant power 23W, thermal conductivity 10W / (m·K), electrical conductivity 7.5×10 2 S / m;

[0078] Operating condition ⑦: Constant power 23W, thermal conductivity 20W / (m·K), electrical conductivity 7.5×10 2 S / m;

[0079] Operating condition ⑧: Constant power 23W, thermal conductivity 27W / (m·K), electrical conductivity 7.5×10 2 S / m;

[0080] Operating condition ⑨: Constant power 23W, thermal conductivity 30W / (m·K), electrical conductivity 7.5×10 2 S / m;

[0081] Operating condition ⑩: Constant power 23W, thermal conductivity 45W / (m·K), electrical conductivity 7.5×10 2 S / m.

[0082] In operating conditions ①-⑩, the temperature field distribution when the heating element 10 reaches its maximum temperature is as follows: Figures 1-10 As shown. Combined with Figures 1-10 It can be seen that the highest temperature of the heating component 10 is located between the first electrode 1 and the second electrode 2.

[0083] Figure 11 The diagram illustrates the differences in the heating rate of the highest temperature point of the heating element 10 in operating conditions ①-⑩. Combined with... Figure 11 It can be seen that the heating rate of the highest temperature point of the heating component 10 varies under different operating conditions.

[0084] Figure 12 The location of the longitudinal temperature field distribution monitoring point when the heating component 10 reaches the maximum temperature of 300℃. Figure 12 Five monitoring points were set up, namely measuring point 1, measuring point 2, measuring point 3, measuring point 4 and measuring point 5. Figure 12 The distribution locations and spacing of measuring points 1 to 5 are marked as an example.

[0085] Figure 13 for Figure 12 The longitudinal temperature difference between monitoring point 5 and monitoring point 1,

[0086] Figure 13 The diagram illustrates the longitudinal temperature difference between monitoring point 5 and monitoring point 1 at the instantaneous point when the highest temperature is reached in operating conditions ①-⑩. When the thermal conductivity is 5W / (m·K), 6W / (m·K), 10W / (m·K), 20W / (m·K), 27W / (m·K), 30W / (m·K), 37W / (m·K), and 45W / (m·K), the longitudinal temperature differences between monitoring point 5 and monitoring point 1 at the instantaneous point when the highest temperature is reached are 271.3℃, 271.0℃, 268.4℃, 254.3℃, 237.8℃, 229.7℃, 205.6℃, and 177.3℃, respectively.

[0087] Figure 14The temperature change of monitoring point 5 over time is shown under different thermal conductivity conditions. Combining operating conditions ①-⑩, it can be seen that when the thermal conductivity is 5 W / (m·K), the time for the highest temperature to reach 300℃ from room temperature (25℃) is 1.8 s, and the temperature difference between monitoring point 5 and monitoring point 1 at this moment is 271.3℃; when the thermal conductivity is 6 W / (m·K), the time for the highest temperature to reach 300℃ from room temperature (25℃) is 1.9 s, and the temperature difference between monitoring point 5 and monitoring point 1 at this moment is 271.0℃; when the thermal conductivity is 10 W / (m·K), the time for the highest temperature to reach 300℃ from room temperature (25℃) is 2.25 s, and the temperature difference between monitoring point 5 and monitoring point 1 at this moment is 268.4℃; when the thermal conductivity is 20 W / (m·K), the time for the highest temperature to reach 300℃ from room temperature (25℃) is 3.42 s, and the temperature difference between monitoring point 5 and monitoring point 1 at this moment is 2... 54.3℃; When the thermal conductivity is 27W / (m·K), the time for the highest temperature to reach 300℃ from room temperature of 25℃ is 4.4s, and the temperature difference between measuring point 5 and measuring point 1 at this moment is 237.8℃; When the thermal conductivity is 30W / (m·K), the time for the highest temperature to reach 300℃ from room temperature of 25℃ is 4.86s, and the temperature difference between measuring point 5 and measuring point 1 at this moment is 229.7℃; When the thermal conductivity is 37W / (m·K), the time for the highest temperature to reach 300℃ from room temperature of 25℃ is 5.7s, and the temperature difference between measuring point 5 and measuring point 1 at this moment is 205.6℃; When the thermal conductivity is 45W / (m·K), the time for the highest temperature to reach 300℃ from room temperature of 25℃ is 6.6s, and the temperature difference between measuring point 5 and measuring point 1 at this moment is 177.3℃. Analysis shows that under the same constant power input of 23W, the thermal conductivity of the semiconductor ceramic decreases from 45W / (m·K) to 5W / (m·K), and the time to reach the highest temperature of 300℃ is shortened from 6.6s to 1.8s. This means that reducing the thermal conductivity increases the heating rate. In other words, the higher the thermal conductivity, the longer it takes to reach the same highest temperature with the same power input, and the more uniform the temperature field distribution along the longitudinal direction.

[0088] Based on the analysis of operating conditions ② and ③, it can be seen that maintaining a thermal conductivity of 27 W / (m·K) and reducing the electrical conductivity from 1.5 × 10⁻⁶ W / (m·K) will... 3 S / m decreased to 7.5×10 2 S / m, the heating rate remains constant.

[0089] Analysis of the test data from comprehensive operating conditions ①-⑩ unexpectedly revealed that the value of thermal conductivity has a substantial impact on the temperature rise rate. By selecting a specific range of thermal conductivity values, the temperature rise rate requirements of the aerosol generation matrix can be met. Furthermore, combined with... Figures 12-14 It can be seen that as thermal conductivity decreases, the heat transfer effect from the highest temperature to the lowest temperature region weakens. In other words, to reach the same temperature, semiconductor heating elements with lower thermal conductivity require less energy to reach the highest temperature region.

[0090] This application provides a heating component 10, such as Figures 15-17 As shown, the device includes a first electrode 1, a second electrode 2, and a heating element 3 made of the aforementioned semiconductor conductive ceramic. The heating element 3 has an opening 31 for inserting an aerosol generating article 20, and defines a heating cavity 32 for accommodating the aerosol generating article 20. The opening 31 and the heating cavity 32 are connected. The heating element 3 includes a first end 33 near the opening 31 and a second end 34 away from the first end 33. The first electrode 1 and the second electrode 2 are disposed on the heating element 3 at intervals along the longitudinal direction of the heating element 3. The first electrode 1 and the second electrode 2 are used to guide current in the longitudinal direction of the heating element 3 when the heating component 10 is used. The first electrode 1 is located between the first end 33 and the second electrode 2.

[0091] In one embodiment of this application, the heating element 3 made of semiconductor conductive ceramic is formed by injection molding the semiconductor ceramic raw material into a mold and then sintering and solidifying it. In another embodiment of this application, the preparation process may include: mixing the raw material of conductive ceramic material with a liquid solvent to form an injectable slurry; then injecting the slurry into the cavity of the mold to form a tubular green body; after demolding to obtain the green body, sintering and solidifying it to obtain the heating element 3.

[0092] In one embodiment of this application, the resistivity of the semiconductor conductive ceramic is 0.01 Ω·cm to 1 Ω·cm; and / or the resistivity of the semiconductor conductive ceramic is 0.01 Ω·cm to 0.5 Ω·cm. In another embodiment of this application, the resistivity of the semiconductor conductive ceramic is 0.01 Ω·cm, 0.1 Ω·cm, 0.15 Ω·cm, 0.18 Ω·cm, 0.2 Ω·cm, 0.3 Ω·cm, 0.4 Ω·cm, or 0.5 Ω·cm.

[0093] In one embodiment of this application, when current is guided to the heating element 3 through the first electrode 1 and the second electrode 2, the resistance value of the heating element 3 measured by the first electrode 1 and the second electrode 2 is between 0.45Ω and 5Ω. In other words, when current is guided to the heating element 3 through the first electrode 1 and the second electrode 2, the resistance value of the heating element 3 measured by the first electrode 1 and the second electrode 2 is in the range of 0.45Ω to 5Ω. In some embodiments, the resistance value of the heating element 3 measured by the first electrode 1 and the second electrode 2 is between 0.8Ω and 1.5Ω. In other words, the resistance value of the heating element 3 measured by the first electrode 1 and the second electrode 2 is in the range of 0.8Ω to 1.5Ω. In a specific embodiment, the resistance value of the heating element 3 measured by the first electrode 1 and the second electrode 2 is approximately 1.4Ω.

[0094] In one embodiment of this application, the temperature coefficient of resistance of the semiconductor conductive ceramic is -3000ppm / ℃ to 1000ppm / ℃; and / or the temperature coefficient of resistance of the semiconductor conductive ceramic is -2800ppm / ℃ to 0ppm / ℃. In one embodiment of this application, the resistance of the heating element 3 decreases as the temperature of the heating element 3 increases. In one embodiment of this application, when current is guided through the first electrode 1 and the second electrode 2 on the heating element 3 at room temperature, the initial resistance of the heating element 3 is 1.4Ω; when the temperature of the heating element 3 rises to approximately 350℃, the resistance of the heating element 3 decreases to approximately 0.5Ω.

[0095] In one embodiment of this application, the three-point bending strength of the semiconductor conductive ceramic is greater than or equal to 25 N. In another embodiment, the three-point bending strength of the semiconductor conductive ceramic is greater than or equal to 40 N. In yet another embodiment, the three-point bending strength of the semiconductor conductive ceramic is 25 N, 30 N, 32 N, 35 N, 40 N, 45 N, or 60 N. The three-point bending strength test is a commonly used method for testing the mechanical properties of materials. Its basic principle is to place the sample at two support points and one bending point, and then apply a downward load at the bending point. When the moments formed by the sample at the two support points are equal, the sample will fracture at the midpoint. This method is often used to measure the bending strength (flexural strength) of materials and is suitable for testing the mechanical properties of various materials.

[0096] In one embodiment of this application, the normal total emissivity of the semiconductor conductive ceramic is 0.8-0.96. In another embodiment, the semiconductor conductive ceramic itself has infrared emission characteristics and can emit infrared light to heat the aerosol generation product. In another embodiment, the heating element 3 made of the semiconductor conductive ceramic can be in direct contact with the aerosol generation product.

[0097] In one embodiment of this application, the wall thickness of the heating element 3 is 0.5mm-0.7mm. In another embodiment of this application, the wall thickness of the heating element 3 can be 0.5mm, 0.55mm, 0.6mm, 0.65mm, or 0.7mm.

[0098] In one embodiment of this application, the inner diameter of the heating element 3 is determined based on the diameter of the aerosol-generating article. In one embodiment of this application, the diameter of the aerosol-generating article can be between approximately 5 mm and 12 mm. In another embodiment of this application, the diameter of the aerosol-generating article can be between approximately 6 mm and 10 mm.

[0099] In one embodiment of this application, a first electrode 1 and a second electrode 2 are disposed at a distance from each other on the heating body 3 along its longitudinal direction. The first electrode 1 and the second electrode 2 extend circumferentially along the heating body 3. The first electrode 1 and the second electrode 2 are used to guide current in the longitudinal direction of the heating body 3 when the heating component 10 is in use. The first electrode 1 is located between the first end 33 and the second electrode 2, and the distance between the second electrode 2 and the first end 33 is less than the distance between the second electrode 2 and the second end 34. In another embodiment of this application, the first electrode 1 and the second electrode 2 may be arranged close to the first end 33 but far from the second end 34.

[0100] In one embodiment of this application, a first distance d1 is provided between the first electrode 1 and the first end 33. A second distance d2 is provided between the first electrode 1 and the second electrode 2. A third distance d3 is provided between the second electrode 2 and the second end 34. In one embodiment of this application, the first distance d1 is smaller than the third distance 33 between the second electrode 2 and the second end 34. In another embodiment of this application, the first distance d1 is less than or equal to the second distance d2. The second distance d2 is less than or equal to the third distance d3.

[0101] In one embodiment of this application, the first spacing d1 is between 0.5 and 2.0 mm. The second spacing d2 is between 1 mm and 4 mm. In some alternative embodiments, the first spacing d1 is approximately 1 mm. The second spacing d2 is approximately 2 mm. Or in some embodiments, the ratio of the second spacing d2 to the longitudinal length of the heating element 3 is between 5% and 50%. In one embodiment of this application, the ratio of the second spacing d2 to the longitudinal length of the heating element 3 is between 5% and 40%.

[0102] In one embodiment of this application, the ratio of the third distance d3 between the second electrode 2 and the second end 34 to the longitudinal length of the heating element 3 is between 0% and 85%. In another embodiment of this application, the ratio of the third distance d33 to the longitudinal length of the heating element 31 is between 40% and 80%.

[0103] In one embodiment of this application, the dimensions of the first electrode 1 and / or the second electrode 2 along the longitudinal direction of the heating body 3 are between 1 mm and 4 mm. In another embodiment, the dimensions of the first electrode 1 and / or the second electrode 2 along the longitudinal direction of the heating body 3 are approximately 2 mm. In some optional embodiments, the ratio of the dimensions of the first electrode 1 and / or the second electrode 2 along the longitudinal direction of the heating body 3 to the longitudinal length of the heating body 3 is between 1% and 40%. In one embodiment, the ratio of the dimensions of the first electrode 1 and / or the second electrode 2 along the longitudinal direction of the heating body 3 to the longitudinal length of the heating body 3 is between 5% and 40%. In another embodiment, the ratio of the dimensions of the first electrode 1 and / or the second electrode 2 along the longitudinal direction of the heating body 3 to the longitudinal length of the heating body 3 is between 10% and 30%.

[0104] In one embodiment of this application, the first electrode 1 and the second electrode 2 are attached to the outer surface of the heating element 3 and are arranged at intervals along the longitudinal direction of the heating element 3.

[0105] In one embodiment of this application, the first electrode 1 and / or the second electrode 2 are arranged extending circumferentially along the heating body 3. The first electrode 1 and / or the second electrode 2 are annular around the heating body 3. In one embodiment of this application, the first electrode 1 and / or the second electrode 2 are closed circumferentially. In one embodiment of this application, the first electrode 1 and / or the second electrode 2 are closed annular rings.

[0106] In one embodiment of this application, the first electrode 1 and / or the second electrode 2 includes at least one of an electrode ring, an electrode cap, an electrode sheet, a track electrode, or an electrode coating. In some embodiments, the first electrode 1 and / or the second electrode 2 are made of a low-resistivity metal or alloy. For example, the first electrode 1 and / or the second electrode 2 includes gold, silver, copper, or an alloy containing at least one of these. In some embodiments, the first electrode 1 and / or the second electrode 2 are obtained by forming a conductive paste containing the aforementioned low-resistivity metal or alloy on the outer surface of the heating element 3 by printing, spraying, or depositing, and then curing it. For example, the first electrode 1 and / or the second electrode 2 are obtained by printing conductive silver paste on the outer surface of the heating element 3 and then curing it.

[0107] In one embodiment of this application, the heating element includes a first portion 35 and a second portion 36, the first portion 35 being close to or defining a first end 33, and the second portion 36 being close to or defining a second end 34; a first electrode 1 and / or a second electrode 2 are disposed on the first portion 35 and away from the second portion 36.

[0108] In one embodiment of this application, when the heating element 3 is powered through the first electrode 1 and the second electrode 2, the first part 35 of the heating element 3 generates heat through resistive Joule heating, while the second part 36 does not generate heat itself, but generates heat by receiving heat transferred from the first part 35.

[0109] In one embodiment of this application, the first electrode 1 and / or the second electrode 2 are arranged to extend circumferentially along the heating body 3. In this embodiment, the first electrode 1 and / or the second electrode 2 are not closed circumferentially along the heating body 3, and the corresponding electrodes have notches. In other words, at least one of the first electrode 1 and the second electrode 2 is not closed circumferentially, and the corresponding electrode has a notch.

[0110] In one embodiment of this application, the first electrode 1 and / or the second electrode 2 are arcuate shapes extending circumferentially along the heating body 3. At least a portion of the first electrode 1 and at least a portion of the second electrode 2 are opposite each other in the longitudinal direction of the heating body 3; or, in the longitudinal direction of the heating body 3, the first electrode 1 and the second electrode 2 are not completely staggered. In one embodiment of this application, the first electrode 1 and the second electrode 2 have the same arcuate extension along the circumferential direction of the heating body 3; or in some alternative embodiments, the first electrode 1 and the second electrode 2 have different arcuate extensions along the circumferential direction of the heating body 3. For example, the arcuate extension of the first electrode 1 along the circumferential direction of the heating body 3 is less than the arcuate extension of the second electrode 2 along the circumferential direction of the heating body 3. In one embodiment of this application, the arcuate extension of the first electrode 1 and / or the second electrode 2 along the circumferential direction of the heating body 3 is between π and 2π. In one embodiment of this application, the arcuate extension of the first electrode 1 and / or the second electrode 2 along the circumferential direction of the heating body 3 is between 1.5π and 2π.

[0111] In one embodiment of this application, the first electrode 1 defines a first notch 11; the second electrode 2 defines a second notch 21. In this embodiment, the first notch 11 and the second notch 21 are completely offset in the longitudinal direction of the heating element 3. Alternatively, in some other embodiments, the first notch 11 and the second notch 21 are partially offset in the longitudinal direction of the heating element 3. Or, in some other optional embodiments, the first notch 11 and the second notch 21 are arranged opposite to each other in the radial direction of the heating element 3.

[0112] In one embodiment of this application, the circumferential extension arc of the first notch 11 and the circumferential extension arc of the second notch 21 in the heating body 3 are the same. Alternatively, in some embodiments, the circumferential extension arcs of the first notch 11 and the second notch 21 in the heating body 3 are different; for example, in some embodiments, the extension arc of the first notch 11 is greater than the extension arc of the second notch 21. In some embodiments, the extension arcs of the first notch 11 and / or the second notch 21 are approximately between 0.1π and 0.8π. In one embodiment of this application, the extension arcs of the first notch 11 and / or the second notch 21 are approximately between 0.3π and 0.5π.

[0113] In one embodiment of this application, a transition bonding layer is provided between the first electrode 1 and / or the second electrode 2 and the heating element 3; in the embodiment, the transition bonding layer forms a tight bond between the first electrode 1 and / or the second electrode 2 made of metal and the heating element 3 made of ceramic.

[0114] In one embodiment of this application, the thickness of the transition adhesive layer is approximately 0.01 mm to 1.0 mm. In another embodiment of this application, the thickness of the transition adhesive layer is approximately 0.05 mm to 0.8 mm.

[0115] In one embodiment of this application, the coefficient of thermal expansion of the transition adhesive layer is less than that of the first electrode 1 and / or the second electrode 2. This is advantageous for suppressing deformation of the first electrode 1 and / or the second electrode 2 during use.

[0116] In one embodiment of this application, the transition adhesive layer is conductive. In another embodiment of this application, the material of the transition adhesive layer may be a metal or alloy, such as silver, aluminum, titanium, or alloys thereof.

[0117] In one embodiment of this application, the transition bonding layer may be a composite material of ceramics and metals. This allows the transition bonding layer to simultaneously possess material compatibility with both the metallic first electrode 1 and / or the second electrode 2, and the ceramic heating element 3. For example, in some optional embodiments, the material of the transition bonding layer may include 10%-80% metal and 20%-90% ceramics. The metal in the transition bonding layer may include at least one of gold, silver, copper, aluminum, nickel, titanium, zirconium, platinum, etc. The ceramic in the transition bonding layer may include oxides or nitrides such as alumina, zirconium oxide, titanium oxide, iron oxide, and silicon oxide.

[0118] In one embodiment of this application, the transition adhesive layer is obtained by printing or coating the above materials onto the outer surface of the heating body 3 and then sintering it.

[0119] One embodiment of this application also provides a heating component, such as... Figure 18 As shown. A first electrode 1 and a second electrode 2 are arranged at intervals on a heating body 3 for guiding current on at least a portion of the heating body 3; at least one conductive trace 4 is formed or incorporated on the heating body 3; at least one conductive trace 4 is arranged to extend from the first electrode 1 to the second electrode 2 and is capable of applying a voltage from the first electrode 1 and the second electrode 2 to generate resistive Joule heating.

[0120] One embodiment of this application also provides an aerosol generating apparatus 100, such as... Figure 19 As shown, it includes a battery assembly 20 and the aforementioned heating assembly 10, with the battery assembly 20 providing electrical energy to the heating assembly 30.

[0121] It should be noted that the preferred embodiments of this application are given in the specification and accompanying drawings, but are not limited to the embodiments described in this specification. Furthermore, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A heating element, characterized in that, The heating element is a semiconductor conductive ceramic component, and the thermal conductivity of the semiconductor conductive ceramic is 5W / (m·K)-45W / (m·K).

2. The heating element according to claim 1, characterized in that, The thermal conductivity of the semiconductor conductive ceramic is 6 W / (m·K)-30 W / (m·K).

3. The heating element according to claim 1, characterized in that, The resistivity of the semiconductor conductive ceramic is 0.01Ω·cm to 1Ω·cm; and / or the resistivity of the semiconductor conductive ceramic is 0.01Ω·cm to 0.5Ω·cm.

4. The heating element according to claim 1, characterized in that, The temperature coefficient of resistance of the semiconductor conductive ceramic is -3000ppm / ℃ to 1000ppm / ℃; and / or the temperature coefficient of resistance of the semiconductor conductive ceramic is -2800ppm / ℃ to 0ppm / ℃.

5. The heating element according to claim 1, characterized in that, The normal total emissivity of the semiconductor conductive ceramic is 0.8-0.

96.

6. The heating element according to claim 1, characterized in that, The semiconductor conductive ceramic has a three-point bending strength greater than or equal to 25N; and / or the semiconductor conductive ceramic has a three-point bending strength greater than or equal to 40N.

7. A heating element, characterized in that, It includes a first electrode, a second electrode, and a heating element made of the semiconductor conductive ceramic as described in claims 1-6; The heating element has an opening for inserting an aerosol-generating article, and the heating element defines a heating cavity for receiving the aerosol-generating article, the opening and the heating cavity being in communication; the heating element includes a first end near the opening and a second end away from the first end; The first electrode and the second electrode are disposed at intervals along the longitudinal direction of the heating element on the heating element. The first electrode and the second electrode are used to guide current in the longitudinal direction of the heating element when the heating element is in use. The first electrode is located between the first end and the second electrode.

8. The heating element according to claim 7, characterized in that, The wall thickness of the heating element is 0.5mm-0.7mm.

9. The heating component according to claim 7, characterized in that, The first electrode and the second electrode extend circumferentially along the heating element; The distance between the second electrode and the first end is less than the distance between the second electrode and the first end.

10. The heating component according to claim 9, characterized in that, The first electrode and / or the second electrode are closed rings.

11. The heating component according to claim 9, characterized in that, The first electrode and / or the second electrode are configured to be non-closed in the circumferential direction, and the corresponding electrodes have notches.

12. The heating component according to claim 11, characterized in that, Both the first electrode and the second electrode have notches. The notch on the first electrode is a first notch, and the notch on the second electrode is a second notch. The first notch and the second notch are staggered in the longitudinal direction of the heating element.

13. The heating component according to claim 11, characterized in that, The arc of the notch extending circumferentially along the heating element is between 0.1π and 0.7π.

14. The heating component according to claim 9, characterized in that, The first electrode and / or the second electrode extend in an arc between π and 2π along the circumference of the heating body.

15. The heating component according to claim 9, characterized in that, The first electrode and the second electrode extend in the same arc along the circumferential direction of the heating body; Alternatively, the first electrode and the second electrode may extend at different circumferential arcs along the heating element.

16. The heating component according to claim 9, characterized in that, Also includes: A conductive transition adhesive layer is formed or disposed between the first electrode and / or the second electrode and the heating element to provide adhesion between the first electrode and / or the second electrode and the heating element.

17. The heating component according to claim 9, characterized in that, The first electrode and the first end have a first distance, the first electrode and the second electrode have a second distance, and the second electrode and the second end have a third distance; the second distance is greater than or equal to the first distance, and the second distance is less than or equal to the third distance.

18. The heating component according to claim 9, characterized in that, The heating element includes: The first part defines the first end; The second part defines the second end, wherein the first electrode and / or the second electrode are arranged on the first part and avoid the second part; When current is guided through the first electrode and the second electrode on the heating element, the first part can generate heat through resistive Joule heating, and the second part generates heat by receiving the heat transferred from the first part.

19. The heating component according to claim 7, characterized in that, The first electrode and the second electrode are arranged at intervals on the heating element to conduct current on at least a portion of the heating element; At least one conductive trace is formed or incorporated into the heating element; The at least one conductive trace is arranged to extend from the first electrode to the second electrode and is capable of being energized by voltage applied by the first and second electrodes to generate resistive Joule heating.

20. An aerosol generating device, characterized in that, It includes a battery assembly and a heating element as described in claims 7-19, wherein the battery assembly provides electrical energy to the heating element.

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