Circuit board assembly and manufacturing method thereof
By introducing a combination structure of heat sink and insulating thermally conductive material into the circuit board assembly, the problem of poor heat dissipation in electronic products is solved, achieving rapid heat dissipation and signal shielding.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD
- Filing Date
- 2024-10-22
- Publication Date
- 2026-04-24
AI Technical Summary
In the process of developing high circuit density and miniaturization, existing electronic products suffer from poor heat dissipation, which affects the stable operation and service life of electronic components.
The structure employs a combination of heat sinks and insulating thermally conductive materials, including side heat sinks and surface heat sinks, which surround electronic components and are filled with insulating thermally conductive materials to enhance heat dissipation.
By using insulating and thermally conductive materials and designing heat dissipation components, the heat energy of electronic components can be rapidly dissipated, improving the heat dissipation effect and shielding against external signal interference.
Smart Images
Figure CN121924670A_ABST
Abstract
Description
Technical Field
[0001] This application relates to a circuit board assembly and a method for manufacturing the same. Background Technology
[0002] In recent years, electronic products have been trending towards multifunctionality, high circuit density, and miniaturization. The speed and effectiveness of heat dissipation in electronic products also affect their quality. Heat dissipation mechanisms in electronic products help electronic components dissipate the heat generated during operation, thereby improving the stable operation and lifespan of the components. Summary of the Invention
[0003] At least one embodiment of this application provides a circuit board assembly and a method for manufacturing the same, wherein the circuit board assembly utilizes heat sinks and insulating thermally conductive materials to improve heat dissipation.
[0004] The circuit board assembly provided in at least one embodiment of this application includes a first outer circuit layer, a second outer circuit layer, an inner circuit layer, electronic components, a heat sink, and an insulating thermally conductive material. The inner circuit layer is located between the first and second outer circuit layers. The electronic components are disposed within the inner circuit layer and between the first and second outer circuit layers. The heat sink is disposed within the inner circuit layer and between the first and second outer circuit layers. The heat sink covers the electronic components and includes multiple corrugated surfaces surrounding the electronic components. Each corrugated surface has multiple troughs. The insulating thermally conductive material is disposed within the inner circuit layer and between the first and second outer circuit layers. The insulating thermally conductive material covers the electronic components and the heat sink. The insulating thermally conductive material contacts the electronic components and the heat sink and fills the multiple troughs.
[0005] In at least one embodiment of this application, the circuit board assembly further includes a plurality of pads. The plurality of pads are disposed between the first outer circuit layer and the electronic component, and electrically connect the electronic component. The heat sink includes a surface heat sink. The surface heat sink is located between the second outer circuit layer and the electronic component, and has one of its corrugated surfaces.
[0006] In at least one embodiment of this application, the heat sink includes a plurality of side heat sinks. The plurality of side heat sinks extend between a first outer circuit layer and a second outer circuit layer, and have a plurality of additional corrugated surfaces. Electronic components are located between the plurality of side heat sinks.
[0007] In at least one embodiment of this application, the circuit board assembly further includes multiple shielding structures. The multiple shielding structures are electrically connected to a first outer circuit layer and a second outer circuit layer. Multiple side heat sinks and electronic components are located between the multiple shielding structures, with each side heat sink located between one of the shielding structures and the electronic component.
[0008] In at least one embodiment of this application, the insulating and thermally conductive material is located between multiple shielding structures and multiple side heat dissipation plates, and contacts multiple shielding structures.
[0009] In at least one embodiment of this application, the circuit board assembly further includes multiple heat dissipation layers. The multiple heat dissipation layers are respectively disposed on a first outer circuit layer and a second outer circuit layer. The first outer circuit layer and the second outer circuit layer are located between the multiple heat dissipation layers.
[0010] The method for manufacturing a circuit board assembly provided in at least one embodiment of this application includes: providing a first substrate; disposing electronic components on the first substrate; forming a side heat sink on the first substrate, wherein the side heat sink and the electronic components are located on the same side of the first substrate; providing a second substrate; forming a surface heat sink on the second substrate; after forming the side heat sink and the surface heat sink, combining the first substrate and the second substrate, wherein the side heat sink and the surface heat sink form a heat sink to cover the electronic components, and a plurality of corrugated surfaces of the heat sink surround the electronic components; and filling an insulating and thermally conductive material between the first substrate and the second substrate, wherein the insulating and thermally conductive material covers the electronic components and the heat sink.
[0011] In at least one embodiment of this application, the manufacturing method further includes: forming a plurality of pads on a first substrate before placing electronic components on a first substrate; patterning a first metal layer of the first substrate to form a first outer circuit layer after filling with an insulating and thermally conductive material, wherein the plurality of pads and the first outer circuit layer are respectively located on two opposite sides of the first substrate; and patterning a second metal layer of a second substrate to form a second outer circuit layer after filling with an insulating and thermally conductive material, wherein a surface heat sink and the second outer circuit layer are respectively located on two opposite sides of the second substrate.
[0012] In at least one embodiment of this application, forming a side heat sink on a first substrate includes: providing two first composite substrates, each of the two first composite substrates including a first malleable insulating layer, a first peelable metal layer and a third metal layer, wherein the first peelable metal layer is located between the first malleable insulating layer and the third metal layer; thermoforming the two first composite substrates such that the third metal layer of each first composite substrate forms a first wave structure; after forming the two first wave structures, sandwiching a heat sink between the two first composite substrates, wherein the first wave structure of each first composite substrate is connected to the heat sink; after the heat sink is sandwiched between the two first composite substrates, removing the first malleable insulating layer and the first peelable metal layer of each first composite substrate to expose the first wave structure to form a side heat sink; and disposing the side heat sink on the first substrate.
[0013] In at least one embodiment of this application, forming a surface heat sink on a second substrate includes: providing a second composite substrate, wherein the second composite substrate includes a second malleable insulating layer, a second peelable metal layer and a fourth metal layer, and the second peelable metal layer is located between the second malleable insulating layer and the fourth metal layer; thermoforming the second composite substrate such that the fourth metal layer forms a second wave structure; forming a metal block on a first substrate; after forming the second wave structure, disposing the second composite substrate on the metal block, wherein the second wave structure is located between the second peelable metal layer and the metal block; and after disposing the second composite substrate on the metal block, removing the second malleable insulating layer and the second peelable metal layer to expose the second wave structure.
[0014] Based on the above, in the circuit board assembly disclosed in the above embodiments, the heat generated by the electronic components can be conducted from the insulating thermally conductive material to the heat sink for easy heat dissipation, thereby achieving a good heat dissipation effect. Attached Figure Description
[0015] To gain a more complete understanding of the embodiments and their advantages, reference is now made to the following description taken in conjunction with the accompanying drawings, wherein:
[0016] Figure 1 This is a partial cross-sectional schematic diagram of a circuit board assembly according to at least one embodiment of this application;
[0017] Figure 2A , Figure 2B , Figure 2C , Figure 2D and Figure 2E They are Figure 1 A partial cross-sectional view of the steps in the manufacturing method of the circuit board assembly, including providing a substrate, forming multiple pads and multiple grooves, forming multiple heat-conducting blocks and multiple components, setting electronic components and circuit boards, and forming multiple side heat sinks.
[0018] Figure 3A , Figure 3B , Figure 3C , Figure 3D and Figure 3E They are Figure 1 A partial cross-sectional view of the steps in the manufacturing method of the circuit board assembly, including providing a substrate, forming multiple grooves, forming a metal block and multiple components, setting a composite substrate, and exposing a wave structure.
[0019] Figure 4 yes Figure 1 A partial cross-sectional view of the step of combining the substrate and the circuit board in the manufacturing method of the circuit board assembly.
[0020] Figure 5 yes Figure 1A partial cross-sectional view of the step of filling insulating and thermally conductive material in the manufacturing method of a circuit board assembly;
[0021] Figure 6 yes Figure 1 A partial cross-sectional schematic diagram of the steps in the manufacturing method of the circuit board assembly, namely forming multiple conductive structures, multiple heat dissipation layers and multiple protective layers.
[0022] Figure 7A , Figure 7B , Figure 7C and Figure 7D They are Figure 1 A cross-sectional schematic diagram of the steps in the manufacturing method of the circuit board assembly, including providing two composite substrates, forming a wave structure, combining the two composite substrates and a heat sink, exposing the wave structure, and separating multiple wave structures; and
[0023] Figure 8A , Figure 8B and Figure 8C They are Figure 1 A cross-sectional schematic diagram of the steps in the manufacturing method of the circuit board assembly, including providing a composite substrate, forming a wave structure, and separating multiple wave structures. Detailed Implementation
[0024] In the following text, to clearly present the technical features of this application, the dimensions (e.g., length, width, thickness, and depth) of elements (e.g., layers, films, substrates, and regions) in the accompanying drawings will be enlarged proportionally, and the number of some elements may be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the accompanying drawings and the size and shape of the elements, but should cover the dimensions, shapes, and deviations thereof caused by actual manufacturing processes and / or tolerances. Furthermore, for clarity in illustrating the following embodiments, elements with the same or similar functions are designated by the same number.
[0025] Figure 1 This is a partial cross-sectional schematic diagram of a circuit board assembly 100 according to at least one embodiment of this application. (See also...) Figure 1 The circuit board assembly 100 includes two outer circuit layers 111 and 112, multiple inner circuit layers 113-116, multiple pads 117, multiple insulating layers 121-125, multiple adhesive layers 130, multiple conductive structures 141 and 142, multiple heat dissipation layers 151 and 152, multiple protective layers 161 and 162, electronic components 200, multiple heat-conducting blocks 300, heat sinks 400, multiple shielding structures 500, and insulating and thermally conductive material 600. The internal heat dissipation mechanism of the circuit board assembly 100 helps the embedded electronic components 200 to easily dissipate the heat generated during operation. Therefore, the circuit board assembly 100 can be applied to electronic products requiring large amounts of computation, electronic products with lighting functions, power supplies, portable electronic products, or battery management systems.
[0026] exist Figure 1 In the example, the circuit board assembly 100 includes four inner circuit layers 113-116. Outer circuit layers 111, 112, inner circuit layers 113-116, insulating layers 121-125, and adhesive layer 130 are stacked. The outer circuit layers 111, 112, and inner circuit layers 113-116 may be made of copper.
[0027] Insulating layer 121 and one of the adhesive layers 130 are sandwiched between outer circuit layer 111 and inner circuit layer 113. Insulating layer 122 and another adhesive layer 130 are sandwiched between inner circuit layers 113 and 114. Insulating layer 123 is sandwiched between inner circuit layers 114 and 115. Insulating layer 124 and another adhesive layer 130 are sandwiched between inner circuit layers 115 and 116. Insulating layer 125 and one of the adhesive layers 130 are sandwiched between inner circuit layer 116 and outer circuit layer 112. The material of insulating layers 121 to 125 can be polyimide (PI). The material of adhesive layer 130 can be epoxy resin or polyimide.
[0028] A receiving space exists between outer circuit layers 111 and 112. Multiple pads 117 are located within this receiving space and disposed on an insulating layer 121, which is located between the outer circuit layer 111 and the multiple pads 117. Multiple conductive structures 141 extend from the outer circuit layer 111 through the insulating layer 121 and the adhesive layer 130 to the inner circuit layer 113, electrically connecting the outer circuit layer 111 and the inner circuit layer 113. Multiple conductive structures 142 extend from the outer circuit layer 112 through the insulating layer 125 and the adhesive layer 130 to the inner circuit layer 116, electrically connecting the outer circuit layer 112 and the inner circuit layer 116. The pads 117 and the conductive structures 141 and 142 may be made of copper.
[0029] Heat dissipation layers 151 and 152 are respectively disposed on outer circuit layers 111 and 112. Outer circuit layers 111 and 112 are located between heat dissipation layers 151 and 152. Heat dissipation layers 151 and 152 are disposed only within the grounding areas 111a and 112a of outer circuit layers 111 and 112, and are electrically connected to grounding areas 111a and 112a, respectively. Heat dissipation layers 151 and 152 are aligned with the accommodating space between outer circuit layers 111 and 112. Multilayer protective layers 161 and 162 respectively cover heat dissipation layers 151 and 152, outer circuit layers 111 and 112, and insulating layers 121 and 125. Protective layer 161 can contact the surface of outer circuit layer 111, the exposed surface of insulating layer 121 of outer circuit layer 111, and the surface of heat dissipation layer 151, and exposes a portion of the surface of outer circuit layer 111 and a portion of the surface of heat dissipation layer 151.
[0030] The protective layer 162 can contact the surface of the outer circuit layer 112, the surface of the exposed insulating layer 125 of the outer circuit layer 112, and the surface of the heat dissipation layer 152, and exposes a portion of the surface of the outer circuit layer 112 and a portion of the surface of the heat dissipation layer 152. It is worth noting that the heat dissipation layers 151 and 152 can be made of copper, and the exposed surfaces of the heat dissipation layers 151 and 152 from the protective layers 161 and 162 can be surface-finished to form plating layers 151a and 152a. Plating layers 151a and 152a can be nickel plating or gold plating.
[0031] Electronic component 200 is disposed within an accommodating space between outer circuit layers 111 and 112 and electrically connected to pad 117. More specifically, electronic component 200 is disposed within inner circuit layers 113-115, insulating layers 122 and 123, and adhesive layer 130 between inner circuit layers 113 and insulating layers 124. Electronic component 200 may be a chip. Electronic component 200 may be electrically connected via pad 117 to outer circuit layers 111 and 112 or multiple inner circuit layers 113-116, without limitation.
[0032] exist Figure 1 In the example, the circuit board assembly 100 includes two heat-conducting blocks 300. These heat-conducting blocks 300 are disposed at a distance within the insulating layer 121 and contact the outer circuit layer 111 exposed by the insulating layer 121. These heat-conducting blocks 300 may be electrically connected to the grounding area 111a. These heat-conducting blocks 300 are located on opposite sides of the electronic component 200. The material of these heat-conducting blocks 300 may be copper.
[0033] The heat sink 400 is also disposed within the accommodating space between the outer circuit layers 111 and 112. Specifically, the heat sink 400 is disposed within the inner circuit layers 113-116, the insulating layers 122-125, and the adhesive layer 130 between the inner circuit layers 113 and the insulating layer 125. The heat sink 400 covers the electronic component 200 and includes a plurality of side heat sinks 410 and a surface heat sink 420. The electronic component 200 is located between the plurality of side heat sinks 410, and the electronic component 200 faces the surface heat sink 420 relative to the surface of the pad 117; that is, the surface of the pad 117 does not face the surface heat sink 420.
[0034] Each side heat sink 410 extends between outer circuit layers 111 and 112 and includes a heat sink 411, two corrugated structures 412 and 413, two adhesive layers 414, and multiple thermally conductive adhesives 415. The heat sink 411 can be made of a high-strength heat-dissipating material, so it can be a steel sheet. The heat sink 411 is sandwiched between the two corrugated structures 412 and 413, and the two corrugated structures 412 and 413 are bonded to the heat sink 411 via the adhesive layers 414. The corrugated structures 412 and 413 can be made of copper.
[0035] The two wave structures 412 and 413 each have two wave surfaces 412a and 413a. Each wave surface 412a and 413a has multiple troughs. Multiple side heat sinks 410 are respectively disposed on multiple heat conduction blocks 300 and are connected to the multiple heat conduction blocks 300 via thermally conductive adhesive 415. The wave surface 412a of each side heat sink 410 faces the side of the electronic component 200.
[0036] A surface heat sink 420 is located between the outer circuit layer 112 and the electronic component 200, and includes a metal block 421, a corrugated structure 422, an adhesive layer 423, and multiple thermally conductive adhesives 424. The metal block 421 is disposed within the insulating layer 125 and contacts the outer circuit layer 112 exposed by the insulating layer 125. The metal block 421 may be made of copper. The corrugated structure 422 is disposed on the metal block 421 and bonded to the metal block 421 via the adhesive layer 423. The corrugated structure 422 may also be made of copper and has a corrugated surface 422a with multiple troughs. The corrugated surface 422a of each surface heat sink 420 faces the surface of the electronic component 200. In addition, the surface heat sink 420 is connected to the side heat sinks 410 via multiple thermally conductive adhesives 424, so that the multiple side heat sinks 410 and the surface heat sink 420 are roughly U-shaped shields and cover the electronic components 200, and the wave surfaces 412a, 413a, and 422a surround the electronic components 200.
[0037] Multiple shielding structures 500 extend between outer circuit layers 111 and 112, and each shielding structure 500 is electrically connected to grounding areas 111a and 112a. The shape of the shielding structure 500 can be wall-shaped or columnar, without limitation. Multiple side heat sinks 410 and electronic components 200 are located between the multiple shielding structures 500. Each side heat sink 410 is located between one of the shielding structures 500 and the electronic component 200, and the corrugated surface 413a of each side heat sink 410 faces the side of the shielding structure 500. Each shielding structure 500 can be made of copper and includes components 510 and 520 and solder 530. Components 510, 520 and solder 530 are electrically connected. Solder 530 can be solder paste or conductive adhesive.
[0038] The insulating thermally conductive material 600 is located within the accommodating space between the outer circuit layers 111 and 112, and is disposed within the adhesive layer 130 between the inner circuit layers 113-116, the insulating layers 122-124, and the insulating layers 121-125. The insulating thermally conductive material 600 covers the electronic component 200 and the heat sink 400, and contacts the sides of the multiple shielding structures 500 facing the corrugated surface 413a. Specifically, the insulating thermally conductive material 600 directly contacts the electronic component 200 and the heat sink 400, and fills the multiple troughs of the corrugated surfaces 412a, 413a, and 422a, as well as the gaps between the pads 117. The insulating thermally conductive material 600 can be an insulating thermally conductive ink, a thermally conductive adhesive, or other thermally conductive material.
[0039] As can be seen from the above structure, the heat generated by the electronic component 200 can be conducted from the insulating thermally conductive material 600 to the side heat sink 410 and the surface heat sink 420. The heat can then be conducted through the side heat sink 410 and the insulating thermally conductive material 600 to the shielding structure 500, and through the shielding structure 500 to the outer circuit layers 111 and 112, and then dissipated to the outside of the circuit board assembly 100 through the heat dissipation layers 151 and 152. In addition, the heat can be transferred to the outer circuit layer 112 through the surface heat sink 420, and also dissipated to the outside of the circuit board assembly 100 through the heat dissipation layer 152.
[0040] It is worth mentioning that the corrugated surfaces 412a, 413a, and 422a can increase the contact area with the insulating and thermally conductive material 600, thereby increasing the heat conduction efficiency. Therefore, the heat generated by the electronic component 200 can be quickly and extensively conducted to the outside of the circuit board assembly 100 to achieve rapid heat dissipation. In addition, since the shielding structure 500 is electrically connected to the grounding areas 111a and 112a, it can shield the electronic component 200 from interference from external signals.
[0041] the following Figures 2A to 8C Exposure Figure 1 A method for manufacturing a circuit board assembly 100, wherein Figure 2A yes Figure 1 A partial cross-sectional view of the step of providing substrate 710 in the manufacturing method of circuit board assembly 100. (See attached diagram.) Figure 2A A substrate 710 is provided, wherein the substrate 710 includes multiple metal layers 711, 712 and an insulating layer 121. The metal layers 711, 712 and the insulating layer 121 are stacked, and the insulating layer 121 is sandwiched between the metal layers 711, 712. The metal layers 711 and 712 may be copper layers.
[0042] Figure 2B yes Figure 1 A partial cross-sectional view of the step of forming multiple pads 117 and multiple recesses 713, 714 in the manufacturing method of circuit board assembly 100. (See attached diagram.) Figure 2A and Figure 2B A patterned metal layer 711 is formed to create a plurality of pads 117. Next, a plurality of recesses 713, 714 are formed in the insulating layer 121. These recesses 713, 714 are spaced apart and expose the metal layer 712, with pads 117 located between two recesses 713 and pads 117 and recesses 713 located between two recesses 714. For example, the patterned metal layer 711 can be formed by photolithography and etching processes. The formation of the plurality of recesses 713, 714 can be formed by photolithography and etching processes, or by laser drilling.
[0043] Figure 2C yes Figure 1 A partial cross-sectional view of the steps in the manufacturing method of the circuit board assembly 100, namely forming a plurality of heat-conducting blocks 300 and a plurality of components 510. (See attached diagram.) Figure 2B and Figure 2C First, multiple heat-conducting blocks 300 are formed in multiple grooves 713, and metal blocks 715 are formed in multiple grooves 714. These heat-conducting blocks 300 and metal blocks 715 can be formed by electroplating. Next, metal blocks 716 are formed on these metal blocks 715 by selective electroplating. The metal blocks 715 and 716 constitute component 510. These components 510 protrude from the heat-conducting blocks 300. During the selective electroplating formation of the metal blocks 716, a masking layer (not shown) can be formed on the metal blocks 715, such that the metal blocks 716 are formed in the area of the masking layer that exposes the metal blocks 715. This masking layer can be a dry film.
[0044] Figure 2D yes Figure 1 A partial cross-sectional view of the steps involved in setting up the electronic components 200 and the circuit board 720 in the manufacturing method of the circuit board assembly 100. (See attached diagram.) Figure 2C and Figure 2D Electronic component 200 is disposed on substrate 710. Specifically, electronic component 200 is disposed on pad 117. It should be noted that before disposing of electronic component 200, pad 117 may undergo surface treatment, such as electroless nickel immersion gold (ENIG) process, tin plating process, or tin plating process, to prevent pad 117 from oxidizing with air, thus ensuring effective soldering to electronic component 200 later.
[0045] Next, the circuit board 720 is attached to the insulating layer 121 of the substrate 710. The circuit board 720 includes multiple inner circuit layers 113-116, multiple insulating layers 122-124, and multiple adhesive layers 130. One adhesive layer 130 bonds the insulating layer 121 and the inner circuit layer 113, another adhesive layer 130 bonds the insulating layer 122 and the inner circuit layer 114, and yet another adhesive layer 130 bonds the insulating layer 124 and the inner circuit layer 115. Before attaching the circuit board 720, through-holes can be formed in the circuit board 720. When attaching the circuit board 720, the through-holes are aligned with the electronic components 200, the multiple heat-conducting blocks 300, and the multiple components 510, so that the electronic components 200, the heat-conducting blocks 300, and the components 510 can be exposed from the circuit board 720.
[0046] Figure 2E yes Figure 1 A partial cross-sectional view of the step of forming multiple side heat sinks 410 in the manufacturing method of the circuit board assembly 100. (See attached diagram.) Figure 2D and Figure 2E Multiple side heat sinks 410 are formed on a substrate 710, wherein the side heat sinks 410 and electronic components 200 are located on the same side of the substrate 710, and the electronic components 200 are located between the side heat sinks 410. For example, the wave structures 412, 413 of the multiple side heat sinks 410 can be formed outside the substrate 710 first, and then the side heat sinks 410 are disposed on the substrate 710. The multiple side heat sinks 410 can be respectively connected to multiple heat-conducting blocks 300 via multiple thermally conductive adhesives 415. Then, solder 530 is applied to the multiple components 510 respectively. It should be noted that a detailed description of the wave structures 412, 413 forming the multiple side heat sinks 410 can be found later. Figures 7A to 7D .
[0047] Figure 3A and Figure 3B They are Figure 1 A partial cross-sectional view of the steps of providing a substrate 730 and forming a plurality of recesses 732 and 733 in the manufacturing method of the circuit board assembly 100. (See attached diagram.) Figure 3A A substrate 730 is provided, wherein the substrate 730 includes a metal layer 731 and an insulating layer 125. The metal layer 731 and the insulating layer 125 are stacked. The metal layer 731 may be a copper layer. See also Figure 3A and Figure 3B Multiple grooves 732 and 733 are formed in the insulating layer 125. These grooves 732 and 733 are spaced apart and expose the metal layer 731, with groove 732 located between two grooves 733. These grooves 732 and 733 can be formed by photolithography and etching processes, or by laser drilling.
[0048] Figure 3C yes Figure 1A partial cross-sectional view of the steps in the manufacturing method of the circuit board assembly 100, namely forming a metal block 421 and multiple components 520. (See attached diagram.) Figure 3B and Figure 3C A metal block 421 is formed within a groove 732, and metal blocks 734 are formed within multiple grooves 733, wherein these metal blocks 421 and 734 can be formed by electroplating. Next, metal blocks 735 are formed on these metal blocks 734 by selective electroplating. Metal blocks 734 and 735 constitute component 520. These components 520 protrude from the metal block 421. The method of forming the metal block 735 can be similar to the method of forming the metal block 716, and will not be described further here.
[0049] Figure 3D yes Figure 1 A partial cross-sectional view of the step of setting the composite substrate 900 in the manufacturing method of the circuit board assembly 100. (See attached diagram.) Figure 3C and Figure 3D A composite substrate 900 is disposed on a metal block 421, wherein the composite substrate 900 includes a malleable insulating layer 910, a peelable metal layer 920, and a wave structure 422, with the peelable metal layer 920 located between the malleable insulating layer 910 and the wave structure 422. The wave structure 422 is located between the peelable metal layer 920 and the metal block 421. For example, the composite substrate 900 can be attached to the metal block 421 via an adhesive layer 423. Therefore, the wave structure 422 is located between the peelable metal layer 920 and the adhesive layer 423. It should be noted that a detailed description of forming the wave structure 422 can be found later. Figures 8A to 8C .
[0050] Figure 3E yes Figure 1 A partial cross-sectional view of the step of exposing the wave structure 422 in the manufacturing method of the circuit board assembly 100. (See attached diagram.) Figure 3D and Figure 3E Remove the malleable insulating layer 910 and the peelable metal layer 920 to expose the corrugated structure 422. The malleable insulating layer 910 and the peelable metal layer 920 can be removed manually or mechanically, without limitation.
[0051] Figure 4 and Figure 5 They are Figure 1 A partial cross-sectional view of the steps in the manufacturing method of the circuit board assembly 100, including the bonding of substrates 710, 730, and circuit board 720, and the filling of insulating and thermally conductive material 600. (See attached diagram.) Figure 4The substrates 710 and 730 and the circuit board 720 are combined. For example, multiple thermally conductive adhesives 424 are provided on the corrugated structure 422, with these thermally conductive adhesives 424 aligned with the tops of the side heat sink 410. Multiple components 520 are aligned with solder 530 on multiple components 510. The circuit board 720 can be stacked on the inner circuit layer 116 and the substrate 730 is pressed together using a build-up method. For example, the inner circuit layer 116 and the insulating layer 125 can be connected via an adhesive layer 130. Components 510 and 520 are soldered together via solder 530. The side heat sink 410 and the surface heat sink 420 can be connected via thermally conductive adhesives 424. Then, the adhesive layer 130, thermally conductive adhesives 415 and 424 can be cured, for example, by photocuring or thermocuring.
[0052] See Figure 4 and Figure 5 Next, an insulating and thermally conductive material 600 is filled between substrates 710 and 730. For example, substrates 710 or 730 may have through-holes (not shown) communicating with the outside world. The insulating and thermally conductive material 600 is then filled through the through-holes, so that the insulating and thermally conductive material 600 covers the electronic component 200 and the heat sink 400, and covers the sides of the shielding structure 500. Afterward, the through-holes are sealed.
[0053] Figure 6 yes Figure 1 A partial cross-sectional schematic diagram of the steps in the manufacturing method of the circuit board assembly 100, namely forming multiple conductive structures 141, 142, multiple heat dissipation layers 151, 152, and multiple protective layers 161, 162. (See attached diagram.) Figure 5 and Figure 6 First, multiple vias (not shown) are formed. Then, conductive structures 141 and 142 are formed within the vias, which can be formed by laser drilling. Heat dissipation layers 151 and 152 are formed on metal layers 712 and 731, respectively. Metal layers 712 and 731 are located between heat dissipation layers 151 and 152. The conductive structures 141 and 142 and the heat dissipation layers 151 and 152 can be formed by electroplating. Next, metal layers 712 and 731 are patterned to form outer circuit layers 111 and 112, respectively. The outer circuit layers 111 and 112 can be formed by photolithography and etching processes.
[0054] Therefore, as Figures 4 to 6 As shown, multiple pads 117 and outer circuit layers 111 are located on opposite sides of substrate 710. Surface heat sink 420 and outer circuit layers 112 are located on opposite sides of substrate 730. Next, protective layers 161 and 162 are attached to outer circuit layers 111 and 112 and heat sink layers 151 and 152, respectively, i.e., outer circuit layers 111 and 112 and heat sink layers 151 and 152 are located between protective layers 161 and 162.
[0055] Next, the exposed surfaces of the heat dissipation layers 151 and 152 from the protective layers 161 and 162 can be coated with plating layers 151a and 152a through surface treatment. Figure 1 The plating layers 151a and 152a can be formed using the aforementioned chemical nickel-gold process, chemical tin plating process, or electroplating tin process. The plating layers 151a and 152a can accelerate heat dissipation. Thus, the manufacturing of the circuit board assembly 100 is essentially completed.
[0056] In addition, the following Figures 7A to 7D Exposure Figure 1 In the manufacturing method of the circuit board assembly 100, a wave structure 412, 413 is formed in the side heat sink 410, and Figures 8A to 8C Exposure Figure 1 In the manufacturing method of the circuit board assembly 100, a wave structure 422 is formed on the surface heat sink 420.
[0057] Figure 7A yes Figure 1 A cross-sectional schematic diagram of the step of providing two composite substrates 800A and 800B in the manufacturing method of the circuit board assembly 100. (See attached diagram.) Figure 7A Two composite substrates 800A and 800B are provided. These composite substrates 800A and 800B may have the same or similar structures, and each composite substrate 800A and 800B includes a malleable insulating layer 810, two peelable metal layers 820, and two metal layers 830. The malleable insulating layer 810 is located between the two peelable metal layers 820. The malleable insulating layer 810 and the two peelable metal layers 820 are located between the two metal layers 830. The material of the malleable insulating layer 810 may be a liquid crystal polymer (LCP) material. The materials of the peelable metal layers 820 and metal layers 830 may be copper.
[0058] Figure 7B yes Figure 1 A cross-sectional schematic diagram of the steps in the manufacturing method of the circuit board assembly 100, including forming wave structures 412 and 413 and combining two composite substrates 800A and 800B with a heat sink 411. (See attached diagram.) Figure 7A and Figure 7BThermoplastic composite substrates 800A and 800B are formed such that the metal layer 830 of composite substrate 800A forms multiple wave structures 412, and the metal layer 830 of composite substrate 800B forms multiple wave structures 413. There is no limit to the number of wave structures 412 or 413 formed on each composite substrate 800A or 800B. Next, a heat sink 411 is sandwiched between the two composite substrates 800A and 800B, and the heat sink 411 and the two composite substrates 800A and 800B are pressed together. The wave structures 412 and 413 connect the heat sink 411 via multiple layers of adhesive 414 to bond the composite substrates 800A and 800B and the heat sink 411. The heat sink 411 and the adhesive layers 414 are located between the wave structures 412 and 413.
[0059] Figure 7C yes Figure 1 A cross-sectional schematic diagram of the steps exposing the wave structures 412 and 413 in the manufacturing method of the circuit board assembly 100. (See attached diagram.) Figure 7B and Figure 7C Remove the malleable insulating layer 810 and the peelable metal layer 820 from the composite substrates 800A and 800B to expose the wave structures 412 and 413. The malleable insulating layer 810 and the peelable metal layer 820 can be removed manually or mechanically, without limitation.
[0060] Figure 7D yes Figure 1 A cross-sectional schematic diagram of the step of separating multiple wave structures 412 and 413 in the manufacturing method of the circuit board assembly 100. Multiple wave structures 412 and 413 are separated from the bonded composite substrates 800A and 800B to form multiple localized side heat sinks 410. The multiple wave structures 412 and 413 can be separated by mechanical processing. Thus, in Figure 2E In the process, the formed side heat sink 410 can be disposed on the substrate 710.
[0061] Figure 8A yes Figure 1 A cross-sectional schematic diagram of the step of providing the composite substrate 900 in the manufacturing method of the circuit board assembly 100. (See also...) Figure 8A A composite substrate 900 is provided, wherein the composite substrate 900 includes a malleable insulating layer 910, two peelable metal layers 920, and two metal layers 930. The malleable insulating layer 910 is located between the two peelable metal layers 920. The malleable insulating layer 910 and the two peelable metal layers 920 are located between the two metal layers 930. The material of the malleable insulating layer 910 can be similar to the material of the malleable insulating layer 910, such as a liquid crystal polymer material. The materials of the peelable metal layers 920 and the metal layers 930 can be copper.
[0062] Figure 8Band Figure 8C They are Figure 1 A cross-sectional schematic diagram of the steps of forming the wave structure 422 and separating the multiple wave structures 422 in the manufacturing method of the circuit board assembly 100. (See attached diagram) Figure 8A and Figure 8B On one side of the thermoplastic composite substrate 900, the metal layer 930 on that side of the composite substrate 900 forms multiple wave structures 422. There is no limit to the number of wave structures 422 formed on the composite substrate 900. (See also...) Figure 8C The multiple wave structures 422 in the composite substrate 900 are separated. The multiple wave structures 422 can be separated by mechanical processing. Thus, in Figure 3D In the process, the composite substrate 900 forming the wave structure 422 can be disposed on the metal block 421.
[0063] In summary, in the circuit board assembly 100 disclosed in the above embodiments, the heat generated by the electronic component 200 can be conducted from the insulating thermally conductive material 600 to the side heat sink 410 and the surface heat sink 420, and then to the shielding structure 500 and the outer circuit layers 111 and 112, and then dissipated to the outside of the circuit board assembly 100 via the heat dissipation layers 151 and 152, thereby achieving a good heat dissipation effect. Furthermore, the plating layers 151a and 152a of the heat dissipation layers 151 and 152 can accelerate the heat dissipation speed. The corrugated surfaces 412a, 413a, and 422a can increase the contact area with the insulating thermally conductive material 600, thereby increasing the heat conduction efficiency. The shielding structure 500 can shield the electronic component 200 from interference from external signals.
[0064] Although this application has been disclosed above with reference to embodiments, it is not intended to limit this application. Those skilled in the art can make some modifications and refinements without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be determined by the appended claims.
[0065] [Symbol Explanation]
[0066] 100: Circuit board assembly
[0067] 111, 112: Outer circuit layer
[0068] 111a, 112a: Connecting regions
[0069] 113~116: Inner circuit layer
[0070] 117: Connecting pad
[0071] 121-125: Insulation layer
[0072] 130,414,423: Adhesive layer
[0073] 141, 142: Conductive Structure
[0074] 151, 152: Heat dissipation layer
[0075] 151a, 152a: Coating
[0076] 161, 162: Protective layer
[0077] 200: Electronic Components
[0078] 300: Thermal block
[0079] 400: Heat sink
[0080] 410: Side heat sink
[0081] 411: Heatsink
[0082] 412, 413, 422: Wave structure
[0083] 412a, 413a, 422a: Wavy surface
[0084] 415, 424: Thermal conductive adhesive
[0085] 420: Surface heat dissipation plate
[0086] 421,715,716,734,735: Metal blocks
[0087] 500: Shielding structure
[0088] 510, 520: Components
[0089] 530: Solder
[0090] 600: Insulating and thermally conductive material
[0091] 710,730:Substrate
[0092] 711, 712, 731, 830, 930: Metallic layer
[0093] 713, 714, 732, 733: Groove
[0094] 720: Circuit Board
[0095] 800A, 800B, 900: Composite substrate
[0096] 810, 910: Shaped insulating layer
[0097] 820, 920: Peelable metal layer.
Claims
1. A circuit board assembly, characterized in that, Include: First outer circuit layer; Second outer circuit layer; The inner circuit layer is located between the first outer circuit layer and the second outer circuit layer; An electronic component is disposed within the inner circuit layer and located between the first outer circuit layer and the second outer circuit layer; A heat sink is disposed within the inner circuit layer and located between the first outer circuit layer and the second outer circuit layer, wherein the heat sink covers the electronic component and includes multiple corrugated surfaces surrounding the electronic component, wherein each of the multiple corrugated surfaces has multiple troughs. as well as An insulating and thermally conductive material is disposed within the inner circuit layer and located between the first outer circuit layer and the second outer circuit layer. The insulating and thermally conductive material covers the electronic component and the heat sink, and contacts the electronic component and the heat sink, filling the plurality of grooves.
2. The circuit board assembly according to claim 1, characterized in that, Also includes: Multiple pads are disposed between the first outer circuit layer and the electronic component, and are electrically connected to the electronic component; The heat sink includes a surface heat sink located between the second outer circuit layer and the electronic component, and has one of the plurality of corrugated surfaces.
3. The circuit board assembly according to claim 1, characterized in that, The heat sink includes multiple side heat sinks extending between the first outer circuit layer and the second outer circuit layer, and having multiple wavy surfaces, wherein the electronic components are located between the multiple side heat sinks.
4. The circuit board assembly according to claim 3, characterized in that, Also includes: Multiple shielding structures are electrically connected to the first outer circuit layer and the second outer circuit layer; The plurality of side heat sinks and the electronic components are located between the plurality of shielding structures, and each of the plurality of side heat sinks is located between one of the plurality of shielding structures and the electronic components.
5. The circuit board assembly according to claim 4, characterized in that, The insulating and thermally conductive material is located between the plurality of shielding structures and the plurality of side heat dissipation plates, and is in contact with the plurality of shielding structures.
6. The circuit board assembly according to claim 1, characterized in that, Also includes: Multiple heat dissipation layers are respectively disposed on the first outer circuit layer and the second outer circuit layer, wherein the first outer circuit layer and the second outer circuit layer are located between the multiple heat dissipation layers.
7. A method for manufacturing a circuit board assembly, characterized in that, Include: Provide a first substrate; Electronic components are disposed on the first substrate; A side heat sink is formed on the first substrate, wherein the side heat sink and the electronic component are located on the same side of the first substrate; Provide a second substrate; A surface heat dissipation plate is formed on the second substrate; After the side heat sink and the surface heat sink are formed, the first substrate and the second substrate are combined, wherein the side heat sink and the surface heat sink form a heat sink to cover the electronic component, and a plurality of wavy surfaces of the heat sink surround the electronic component. as well as An insulating and thermally conductive material is filled between the first substrate and the second substrate, wherein the insulating and thermally conductive material covers the electronic components and the heat sink.
8. The manufacturing method according to claim 7, characterized in that, Also includes: Before the electronic components are placed on the first substrate, a plurality of pads are formed on the first substrate; After filling the insulating and thermally conductive material, the first metal layer of the first substrate is patterned to form a first outer circuit layer, wherein the plurality of pads and the first outer circuit layer are respectively located on two opposite sides of the first substrate; and After filling the insulating and thermally conductive material, the second metal layer of the second substrate is patterned to form a second outer circuit layer, wherein the surface heat sink and the second outer circuit layer are located on opposite sides of the second substrate.
9. The manufacturing method according to claim 7, characterized in that, Forming the side heat sink on the first substrate includes: Two first composite substrates are provided, each of the two first composite substrates comprising a first shaped insulating layer, a first peelable metal layer and a third metal layer, wherein the first peelable metal layer is located between the first shaped insulating layer and the third metal layer; The two first composite substrates are thermoformed such that the third metal layer of each of the two first composite substrates forms a first wave structure; After the two first wave structures are formed, the heat sink is sandwiched between the two first composite substrates, wherein the first wave structure of each of the two first composite substrates is connected to the heat sink. After the heat sink is sandwiched between the two first composite substrates, the first shaped insulating layer and the first peelable metal layer of each of the two first composite substrates are removed to expose the first wave structure to form the side heat sink. as well as The side heat sink is disposed on the first substrate.
10. The manufacturing method according to claim 7, characterized in that, Forming the surface heat sink on the second substrate includes: A second composite substrate is provided, wherein the second composite substrate includes a second shaped insulating layer, a second peelable metal layer and a fourth metal layer, and the second peelable metal layer is located between the second shaped insulating layer and the fourth metal layer; The second composite substrate is thermoformed so that the fourth metal layer forms a second wave structure; A metal block is formed on the first substrate; After the second wave structure is formed, the second composite substrate is disposed on the metal block, wherein the second wave structure is located between the second peelable metal layer and the metal block; as well as After the second composite substrate is placed on the metal block, the second shaped insulating layer and the second peelable metal layer are removed to expose the second wave structure.