Electronic device

Abstract

The invention provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a first circuit board and a second circuit board which are arranged in a stacked mode, the first circuit board and the second circuit board are electrically connected through a connector terminal, the first circuit board comprises a radio frequency module, and the first circuit board is configured to receive signals through the radio frequency module; the second circuit board comprises a processor and a communication port. The second circuit board is configured to process the signal received by the radio frequency module through the processor and send the signal to an external device through the communication port. Through the layered design of the circuit boards, the radio frequency module and the processor are respectively arranged on the upper and lower layers of circuit boards, so that the electromagnetic interference between the radio frequency module and the processor is effectively reduced, the installation is convenient, the size of the electronic equipment can be reduced, the working stability and the positioning accuracy of the electronic equipment are improved, and the electronic equipment is convenient to use. And the application requirements of high precision and high reliability are further met. Moreover, the electronic equipment provided by the invention is convenient to install.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] With the development of the electronic equipment field, electronic devices are carrying more and more functions, resulting in larger sizes. Furthermore, different functional modules are prone to mutual interference. Taking a BeiDou intelligent terminal as an example, there may be significant electromagnetic interference between its radio frequency module and processor, leading to poor operational stability, reduced positioning accuracy, and an inability to meet the requirements of high-precision and high-reliability applications.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] This disclosure provides an electronic device that overcomes, to at least a certain extent, the problems of large size and easy interference between different functional modules in related technologies.

[0005] Other features and advantages of this disclosure will become apparent from the following detailed description, or may be learned in part from practice of this disclosure.

[0006] According to one aspect of this disclosure, an electronic device is provided, including a first circuit board and a second circuit board stacked together, the first circuit board and the second circuit board being electrically connected via connector terminals: The first circuit board includes a radio frequency module, and the first circuit board is configured to receive signals through the radio frequency module; The second circuit board includes a processor and a communication port. The second circuit board is configured to process the signals received by the radio frequency module through the processor and send them to an external device through the communication port.

[0007] In some exemplary embodiments, the radio frequency module includes at least one of an RNSS (Radio Navigation Satellite System) module and an RDSS (Radio Determination Satellite Service) module, wherein the RNSS module and the RDSS module are electrically connected to the processor, respectively. The RDSS module is configured to send and receive short message signals, and the RNSS module is configured to receive positioning signals. The processor is configured to process the raw data corresponding to the short message signal and / or process the raw data corresponding to the positioning signal.

[0008] In some exemplary embodiments, the second circuit board further includes a power management module configured to generate corresponding power supplies to power the radio frequency module and the processor, respectively.

[0009] In some exemplary embodiments, the second circuit board further includes a 5G module configured to transmit 5G data and locate the electronic device; The power management module is configured to generate a corresponding power supply to power the 5G module.

[0010] In some exemplary embodiments, the communication port includes a first communication port, a second communication port, a third communication port, and a fourth communication port. The first communication port is used for system debugging and / or software upgrades, the second and third communication ports are used for electrical connection with the external device, and the fourth communication port is used for electrical connection with the display.

[0011] In some exemplary embodiments, the electronic device further includes a housing, wherein the first circuit board and the second circuit board are respectively disposed in upper and lower layers inside the housing.

[0012] In some exemplary embodiments, the first circuit board and the second circuit board are fixed inside the housing through circuit fixing holes.

[0013] In some exemplary embodiments, at least one of an RNSS indicator light and an RDSS indicator light is provided on the exterior of the housing. The RNSS indicator light is used to indicate the working status of the RNSS module, and the RDSS indicator light is used to indicate the working status of the RDSS module.

[0014] In some exemplary embodiments, at least one of a power indicator light and a 5G indicator light is provided on the outside of the housing. The power indicator light is used to indicate the working status of the power management module, and the 5G indicator light is used to indicate the working status of the 5G module.

[0015] In some exemplary embodiments, the exterior of the housing is provided with at least one of a communication port, an antenna port, and an integrated port.

[0016] The technical solutions provided in the embodiments of this disclosure, by designing the circuit board in layers, place the radio frequency module and the processor on the upper and lower circuit boards respectively, thereby effectively reducing the electromagnetic interference between the two and reducing the size of the electronic device. Furthermore, the solutions are easy to install, reduce the size of the electronic device, improve the working stability and positioning accuracy of the electronic device, and further meet the application requirements of high precision and high reliability.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0019] Figure 1 This diagram illustrates the structure of an electronic device according to an embodiment of the present disclosure. Figure 2 This diagram illustrates the structure of an electronic device according to an embodiment of the present disclosure. Figure 3 This diagram illustrates the structure of an electronic device according to an embodiment of the present disclosure. Figure 4 This diagram illustrates the structure of an electronic device according to an embodiment of the present disclosure. Figure 5 A structural block diagram of an electronic device according to an embodiment of the present disclosure is shown. Detailed Implementation

[0020] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0021] Furthermore, the accompanying drawings are merely illustrative of this disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted. Some block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0022] The specific implementation methods of the embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0023] Figure 1 This is a schematic diagram illustrating the structure of an electronic device according to an exemplary embodiment of the present disclosure. Figure 1 As shown, the electronic device provided in this embodiment includes a first circuit board 1 and a second circuit board 2 stacked together, and the first circuit board 1 and the second circuit board 2 are electrically connected through connector terminals.

[0024] The first circuit board 1 includes a radio frequency module 11, which is configured to receive signals. The second circuit board 2 includes a processor 21 and a communication port 22, which is configured to process the signals received by the radio frequency module 11 through the processor 21 and transmit them to an external device through the communication port 22.

[0025] This disclosure does not limit the size, thickness, or other dimensions of the first circuit board 1 and the second circuit board 2. For example, the thickness of both the first circuit board 1 and the second circuit board 2 can be 1.6 mm. Furthermore, this disclosure does not limit the basic materials used for the first circuit board 1 and the second circuit board 2. In an exemplary embodiment, the first circuit board 1 and the second circuit board 2 can, for example, use substrates such as FR-1, FR-2, FR-3, or FR-4.

[0026] In an exemplary embodiment, the first circuit board 1 can be used to deploy the radio frequency module 11, and the second circuit board 2 can be used to deploy the processor 21. The radio frequency module 11 and the processor 21 can be electrically connected to achieve interaction, wherein the electrical connection between the radio frequency module 11 and the processor 21 can be based on connector terminals. For example, the connector terminals can be board-to-board (B2B) connector terminals, simple board-to-board connection terminals, etc.

[0027] For example, the first circuit board 1 and the second circuit board 2 can be stacked, wherein the first circuit board 1 can be located above the second circuit board 2 and at least partially stacked with the second circuit board 2. Alternatively, the second circuit board 2 can be located above the first circuit board 1 and at least partially stacked with the first circuit board 1. This embodiment of the disclosure does not limit the vertical position of the first circuit board 1 and the second circuit board 2.

[0028] Figure 2 This is a schematic diagram illustrating the structure of an electronic device according to an exemplary embodiment of the present disclosure. Figure 2 As shown, the radio frequency module 11 may include at least one of the RNSS module 111 and the RDSS module 112, and the RNSS module 111 and the RDSS module 112 are electrically connected to the processor 21 respectively.

[0029] For example, the RDSS module 112 is configured to send and receive short message signals, and the RNSS module 111 is configured to receive location signals; the processor 21 is configured to process the raw data corresponding to the short message signals and / or process the raw data corresponding to the location signals.

[0030] It should be noted that, in addition to the RNSS module 111 and / or RDSS module 112, other types of radio frequency module devices may also be deployed on the first circuit board 1, and this disclosure does not limit this.

[0031] In an exemplary embodiment, the RNSS module 111 can receive positioning signals from multiple navigation satellites and determine latitude, longitude, altitude, etc., through calculation to achieve positioning. Furthermore, the RNSS module 111 can implement navigation functions, such as planning travel routes and providing real-time guidance. Additionally, the RNSS module 111 can implement time synchronization functions, such as providing high-precision time synchronization.

[0032] It should be noted that the RNSS module 111 can operate in a one-way receiving mode, that is, it can receive satellite positioning signals without transmitting signals to the satellite.

[0033] In an exemplary embodiment, the RDSS module 112 can be used for bidirectional short message communication, such as information exchange between the terminal and a satellite, the terminal and a ground station, or other terminals. Additionally, the RDSS module 112 can be used to report its own location by sending a short message to other devices. The RNSS module 111 and the RDSS module 112 can be combined to achieve integrated navigation and communication functions.

[0034] It should be noted that the RDSS module 112 can operate in a bidirectional transceiver mode, meaning it can both receive satellite signals and transmit radio frequency signals to satellites.

[0035] In some exemplary embodiments, the RDSS module 112 communicates with the processor 21 via a serial port. For example, the RDSS module 112 can acquire BeiDou terminal location information and is connected to the processor 21 via a serial port, transmitting real-time location information to the processor 21 through the serial port.

[0036] The processor 21 can receive the raw data corresponding to the short message signal and the positioning signal, process the raw data accordingly, and finally send it to the external device through the communication port 22.

[0037] In some exemplary embodiments, the second circuit board 2 further includes a power management module 23, which is configured to generate corresponding power supplies to power the radio frequency module 11 and the processor 21 respectively.

[0038] For example, such as Figure 2 As shown, the second circuit board 2 may be provided with a power input to supply power to the power management module 23.

[0039] In an exemplary embodiment, the power management module 23 can generate different power supply voltages to power the RDSS module 112, RNSS module 111, and processor 21. For example, the power management module 23 can receive an externally input DC voltage and process it based on its internal DC-DC (Direct Current to Direct Current) converter step-down and LDO (Low Dropout Regulator) voltage regulation circuit, thereby outputting multiple power supply voltages of different specifications.

[0040] In some embodiments, the power management module 23 can provide adapted voltages to the RDSS module 112 and the RNSS module 111, and can also provide the processor 21 with the adapted voltages required for its core and peripheral circuits. These voltage values ​​can be, for example, 3.3V, 2.8V, 1.8V, etc. The voltage output circuits from the power management module 23 to each module are independent of each other.

[0041] In some exemplary embodiments, the second circuit board 2 further includes a 5G module 24, which is configured to transmit 5G data and locate electronic devices; the power management module 23 is configured to generate a corresponding power supply to power the 5G module 24.

[0042] In an exemplary embodiment, a 5G module 24 is integrated on the second circuit board 2. The 5G module 24 is electrically connected to the power management module 23 and the processor 21 on the second circuit board 2, and the 5G module 24 can be connected to a corresponding antenna in the electronic device.

[0043] For example, the 5G module 24 can be used for data transmission and device positioning, and when the 5G signal is weak, the electronic device can switch to BeiDou short message transmission, thereby achieving complementarity between the 5G and BeiDou frequency bands.

[0044] For example, the 5G module 24 can achieve high-speed bidirectional data transmission under the 5G standard, uploading location data and status monitoring data of electronic devices to the backend server via the 5G network, while simultaneously receiving control commands and parameter configuration information from the backend server. Furthermore, the 5G module 24 can utilize the base station positioning capabilities of the 5G network to achieve assisted positioning of electronic devices. In complex scenarios where BeiDou satellite signals are obstructed, it can supplement positioning data through 5G base station positioning, improving the continuity and coverage of the overall positioning of electronic devices.

[0045] In some exemplary embodiments, the power management module 23 can provide 5V or 3.3V voltage to the 5G module 24.

[0046] In some exemplary embodiments, the communication port 22 includes a first communication port 221, a second communication port 222, a third communication port 223, and a fourth communication port 224. The first communication port 221 is used for system debugging and / or software upgrades, the second communication port 222 and the third communication port 223 are used for electrical connection with external devices, and the fourth communication port 224 is used for electrical connection with a display.

[0047] In an exemplary embodiment, the second circuit board 2 has a first communication port 221, a second communication port 222, a third communication port 223, and a fourth communication port 224. Each communication port can be connected to the processor 21.

[0048] For example, the first communication port 221 is configured as a debugging and upgrade interface for the electronic device, used to realize system debugging, fault diagnosis, and software version burning and upgrade, ensuring the debugging, maintenance, and functional iteration of the electronic device. The second communication port 222 and the third communication port 223 can be external communication interfaces of the electronic device, configured to establish bidirectional communication connections with external devices, realize functions such as instruction transmission and data interaction between the electronic device and external devices, and adapt to the external communication needs of the electronic device in various application scenarios.

[0049] In an exemplary embodiment, such as Figure 2As shown, the second circuit board may include an Ethernet module 2221, and the second communication port 222 can be connected to the processor 21 through the Ethernet module 2221.

[0050] In addition, the fourth communication port 224 can be configured as a display interface to connect to an external display and realize the visualization and display of information such as the positioning data, working status data, and communication data of the electronic device.

[0051] It should be noted that the embodiments disclosed herein do not limit the type of each communication port 22. For example, the communication port 22 can be an M8 aviation plug, an M12 aviation plug, a DB (D-subminiature) series connector, etc.

[0052] For example, the electronic device may also include an antenna assembly 5, and the power management module 23 may also provide power to the antenna assembly 5.

[0053] Figure 3 This is a schematic diagram illustrating the structure of an electronic device according to an exemplary embodiment of the present disclosure. Figure 3 As shown, the antenna assembly can be mounted on the first circuit board 1. The power management module 23 can be connected to the antenna assembly via the voltage switching circuit 12 to provide a feed voltage to the antenna assembly. Additionally, the voltage switching circuit 12 can also receive signals from the RDSS module 112 to provide the required feed voltage to the RDSS module 112.

[0054] In an exemplary embodiment, the first circuit board 1 may further include a SIM (Subscriber Identity Module) card module 13. The SIM card module 13 can interact with the RDSS module 112 to realize the electronic device's identity recognition, authentication, and other services.

[0055] Figure 4 A schematic diagram of the structure of an electronic device provided in an embodiment of this disclosure is shown. Figure 4 As shown, the electronic device also includes a housing 3, with the first circuit board 1 and the second circuit board 2 respectively disposed in the upper and lower layers inside the housing 3.

[0056] In some exemplary embodiments, with Figure 4 For example, the first circuit board 1 is located above the second circuit board 2, so the first circuit board 1 can be called the upper circuit board and the second circuit board 2 can be called the lower circuit board, thereby realizing the stacking of the first circuit board 1 and the second circuit board 2.

[0057] In some exemplary embodiments, the first circuit board 1 and the second circuit board 2 are fixed inside the housing 3 through circuit fixing holes 4.

[0058] In an exemplary embodiment, the first circuit board 1 and the second circuit board 2 are arranged in a layered parallel manner, and are precisely positioned and rigidly fixed to the interior of the outer casing 3 through circuit fixing holes 4 pre-set at their respective corners and edges. The circuit fixing holes 4 can be through-holes located at the corners and edges of the circuit boards where stress is balanced.

[0059] For example, the first circuit board 1 and the second circuit board 2 can be connected based on a board-to-board connector to achieve electrical conduction between the first circuit board 1 and the second circuit board 2, and further assist in the mechanical positioning and fixation of the first circuit board 1 and the second circuit board 2.

[0060] In some exemplary embodiments, at least one of RNSS indicator light 31 and RDSS indicator light 32 is provided on the outside of the housing 3. RNSS indicator light 31 is used to indicate the working status of RNSS module 111, and RDSS indicator light 32 is used to indicate the working status of RDSS module 112.

[0061] In some exemplary embodiments, the RNSS indicator 31 may include one or more operating states. For example, a constantly lit RNSS indicator 31 may indicate that positioning is normal, while an off RNSS indicator 31 may indicate that the positioning module is not working. Additionally, a flashing RNSS indicator 31 may indicate that satellites are being searched.

[0062] In some possible implementations, the RDSS indicator 32 may include one or more operating states. For example, a constantly lit RDSS indicator 32 may indicate normal operation or network standby mode; continuous flashing of the RDSS indicator 32 may indicate that it is searching for a signal; a single flash of the RDSS indicator 32 may indicate that a short message has been sent; and the RDSS indicator 32 being off may indicate that the short message module is not working.

[0063] For example, RNSS indicator light 31 and RDSS indicator light 32 can be electrically connected to processor 21, and processor 21 is used to control the operating status of RNSS indicator light 31 and RDSS indicator light 32. Alternatively, an indicator light module can be provided on the second circuit board 2, and RNSS indicator light 31 and RDSS indicator light 32 can be electrically connected to the indicator light module, and the indicator light module is used to control the operating status of RNSS indicator light 31 and RDSS indicator light 32. This disclosure does not limit the scope of the embodiments.

[0064] In some exemplary embodiments, at least one of a power indicator light 33 and a 5G indicator light 34 is provided on the outside of the housing 3. The power indicator light 33 is used to indicate the working status of the power management module 23, and the 5G indicator light is used to indicate the working status of the 5G module 24.

[0065] In some possible implementations, the power indicator 33 may include one or more operating states. For example, a constantly lit power indicator 33 may indicate that the power is on, and a constantly lit power indicator 33 may indicate that the power is off.

[0066] In addition, the 5G indicator light 34 can include one or more working states. For example, a constantly lit 5G indicator light 34 can indicate that the 5G module 24 is working normally, while an off 5G indicator light 34 can indicate that the 5G module 24 is not working.

[0067] In an exemplary embodiment, the power indicator 33 and the 5G indicator 34 can be electrically connected to the processor 21, which controls the operating state of the power indicator 33 and the 5G indicator 34. Alternatively, an indicator module can be provided on the second circuit board 3, with the power indicator 33 and the 5G indicator 34 electrically connected to it, which controls the operating state of the power indicator 33 and the 5G indicator 34. This disclosure does not limit the scope of the embodiments.

[0068] It should be noted that the embodiments disclosed herein do not limit the indicator colors of RNSS indicator 33, RDSS indicator 34, power indicator 33 and 5G indicator 34, and RNSS indicator 31, RDSS indicator 32, power indicator 33 and 5G indicator 34 may use the same or different indicator colors.

[0069] For example, RNSS indicator 31 and RDSS indicator 32 can be yellow, and power indicator 33 and 5G indicator 34 can be red. Alternatively, RNSS indicator 31 can be yellow, RDSS indicator 32 can be red, power indicator 33 can be green, and 5G indicator 34 can be white.

[0070] In some exemplary embodiments, the exterior of the housing 3 is provided with at least one of a communication port 35, an antenna port 36, and an integrated port 37.

[0071] In an exemplary embodiment, the housing 3 of the electronic device may include at least one communication port 35. Figure 4 For example, the communication port 35 may include communication port 35A, communication port 35B and communication port 35C.

[0072] It should be noted that the positions of each communication port 31 can correspond to the positions of each communication port 22 on the second circuit board 2.

[0073] For example, the housing 3 of the electronic device may include at least one antenna port 36. Figure 4 For example, the casing 3 of the electronic device can be provided with three antenna ports 36, namely antenna port 36A, antenna port 36B and antenna port 36C.

[0074] In an exemplary embodiment, the antenna port 36 can be an SMA (Sub-Miniature version A) interface. Exemplarily, the antenna port 36 can be used for connection between an electronic device and an external BeiDou navigation antenna or radio frequency antenna. Its core function is to achieve bidirectional transmission of BeiDou navigation high-frequency signals and radio frequency signals, while ensuring signal transmission quality and anti-interference capability.

[0075] For example, the housing 3 of the electronic device may include at least one integrated port 37. The integrated port 37 integrates power supply and Ethernet communication interfaces.

[0076] The electronic device provided in this disclosure uses a layered design for the circuit board, with the radio frequency module and the processor respectively placed on the upper and lower circuit boards. This effectively reduces electromagnetic interference between the two and reduces the size of the electronic device. It is also easy to install, reduces the size of the electronic device, improves the working stability and positioning accuracy of the electronic device, and further meets the application requirements of high precision and high reliability.

[0077] This disclosure does not limit the type of electronic device. For example, the electronic device can be various terminals, such as a Beidou smart terminal, which integrates Beidou satellite navigation and communication capabilities. The types of terminals include, but are not limited to, smartphones, tablets, laptops, desktop computers, smart speakers, smartwatches, wearable devices, augmented reality devices, virtual reality devices, etc.

[0078] Figure 5 A structural block diagram of an electronic device 500 provided in an embodiment of the present disclosure is disclosed.

[0079] It should be noted that, Figure 5 The electronic device 500 shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments disclosed herein.

[0080] like Figure 5As shown, the electronic device 500 is presented in the form of a general-purpose computing device. The components of the electronic device 500 may include, but are not limited to: at least one processing unit 510, at least one storage unit 520, and a bus 530 connecting different system components (including the storage unit 520 and the processing unit 510). The storage unit stores program code, which can be executed by the processing unit 510.

[0081] Storage unit 520 may include readable media in the form of volatile storage units, such as random access memory (RAM) 5201 and / or cache memory 5202, and may further include read-only memory (ROM) 5203.

[0082] Storage unit 520 may also include a program / utility 5204 having a set (at least one) program module 5205, such program module 5205 including but not limited to: operating system, one or more application programs, other program modules and program data, each or some combination of these examples may include an implementation of a network environment.

[0083] Bus 530 can represent one or more of several types of bus structures, including a memory cell bus or memory cell controller, a peripheral bus, a graphics acceleration port, a processing unit, or a local bus using any of the various bus structures.

[0084] Electronic device 500 can also communicate with one or more external devices 540 (e.g., keyboard, pointing device, Bluetooth device, etc.), and with one or more devices that enable a user to interact with electronic device 500, and / or with any device that enables electronic device 500 to communicate with one or more other computing devices (e.g., router, modem, etc.). This communication can be performed via input / output (I / O) interface 550. Furthermore, electronic device 500 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via network adapter 560. As shown, network adapter 560 communicates with other modules of electronic device 500 via bus 530. It should be understood that, although not shown in the figures, other hardware and / or software modules can be used in conjunction with electronic device 500, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0085] It should be noted that although several modules or units for the device used to perform actions have been mentioned in the detailed description above, this division is not mandatory. In fact, according to embodiments of this disclosure, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0086] Although terms such as “first,” “second,” and “third” may be used in this document to describe various components, parts, or regions, these components, parts, or regions are not limited to these terms. Rather, these terms are used only to distinguish one component, part, or region from another. Therefore, without departing from the teachings of the examples described herein, the first component, part, or region mentioned in the examples may also be referred to as the second component, part, or region.

[0087] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In this description, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0088] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the solutions disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope of this disclosure is indicated by the following claims.

[0089] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An electronic device, characterized in that, The circuit includes a first circuit board and a second circuit board stacked together, and the first circuit board and the second circuit board are electrically connected via connector terminals. The first circuit board includes a radio frequency module, and the first circuit board is configured to receive signals through the radio frequency module; The second circuit board includes a processor and a communication port. The second circuit board is configured to process the signals received by the radio frequency module through the processor and send them to an external device through the communication port.

2. The electronic device according to claim 1, characterized in that, The radio frequency module includes at least one of a satellite navigation system RNSS module and a satellite short message communication system RDSS module, wherein the RNSS module and the RDSS module are electrically connected to the processor respectively. The RDSS module is configured to send and receive short message signals, and the RNSS module is configured to receive positioning signals. The processor is configured to process the raw data corresponding to the short message signal and / or process the raw data corresponding to the positioning signal.

3. The electronic device according to claim 1, characterized in that, The second circuit board also includes a power management module, which is configured to generate corresponding power supplies to power the radio frequency module and the processor respectively.

4. The electronic device according to claim 3, characterized in that, The second circuit board also includes a 5G module, which is configured to transmit 5G data and locate the electronic device; The power management module is configured to generate a corresponding power supply to power the 5G module.

5. The electronic device according to claim 1, characterized in that, The communication ports include a first communication port, a second communication port, a third communication port, and a fourth communication port. The first communication port is used for system debugging and / or software upgrades. The second and third communication ports are used for electrical connection with the external device. The fourth communication port is used for electrical connection with the display.

6. The electronic device according to claim 1, characterized in that, The electronic device also includes a housing, with the first circuit board and the second circuit board respectively disposed in the upper and lower layers inside the housing.

7. The electronic device according to claim 6, characterized in that, The first circuit board and the second circuit board are fixed inside the housing through circuit fixing holes.

8. The electronic device according to claim 6 or 7, characterized in that, The exterior of the housing is provided with at least one of an RNSS indicator light and an RDSS indicator light. The RNSS indicator light is used to indicate the working status of the RNSS module, and the RDSS indicator light is used to indicate the working status of the RDSS module.

9. The electronic device according to claim 6 or 7, characterized in that, The outer surface of the housing is provided with at least one of a power indicator light and a 5G indicator light. The power indicator light is used to indicate the working status of the power management module, and the 5G indicator light is used to indicate the working status of the 5G module.

10. The electronic device according to claim 6 or 7, characterized in that, The exterior of the housing is provided with at least one of a communication port, an antenna port, and an integrated port.

Images