Manufacturing method of circuit board assembly and circuit board assembly

Abstract

A manufacturing method of a circuit board assembly comprises the steps that a first circuit board is provided, and a first electronic element is electrically connected to the first circuit board; providing a second circuit board, and electrically connecting a second electronic element and a third electronic element on the second circuit board; the surface of the first electronic element is covered with a first protective film, the surface of the first protective film is covered with a shielding film, the shielding film is electrically connected with the first circuit board, and a first assembly is obtained; covering the surfaces of the second electronic element and the third electronic element with a second protective film to obtain a second assembly; and pressing and baking the first component and the second component in a manner that the first circuit board and the second circuit board face outwards and the shielding film is positioned between the first protective film and the second protective film. The invention further provides a circuit board assembly, the overall height of the circuit board assembly manufactured by the invention is small, a structure for shielding does not need to be additionally arranged, and the overall height of the circuit board can be further reduced.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to a method for manufacturing a circuit board assembly and the circuit board assembly itself. Background Technology

[0002] With the development of portable and wearable electronic products, the packaging size of electronic components and circuit boards in electronic products is getting smaller and smaller. Traditional planar packaging methods are difficult to meet the miniaturization requirements. Stacked packaging can accommodate more electronic components in a limited space, but current stacked packaging is still difficult to meet the miniaturization requirements of electronic products. Summary of the Invention

[0003] In view of this, it is necessary to provide a method for manufacturing a small-sized circuit board assembly and a circuit board assembly to solve the above problems.

[0004] A method for manufacturing a circuit board assembly includes: providing a first circuit board and electrically connecting a first electronic component to the first circuit board; providing a second circuit board and electrically connecting a second electronic component and a third electronic component to the second circuit board; covering the surface of the first electronic component with a first protective film, covering the surface of the first protective film with a shielding film, the shielding film being electrically connected to the first circuit board to obtain a first assembly; covering the surfaces of the second electronic component and the third electronic component with a second protective film to obtain a second assembly; pressing and baking the first assembly and the second assembly with the first circuit board and the second circuit board facing outwards and the shielding film located between the first protective film and the second protective film.

[0005] In some possible embodiments of this application, a first groove is formed on the surface of the first circuit board, and the first groove is located on the surface of the first circuit board on which the first electronic component is disposed; after the step of “covering the surface of the first electronic component with a first protective film”, the first protective film is also filled in the first groove.

[0006] In some possible embodiments of this application, a second groove is formed on the surface of the second circuit board, and the second groove is located on the surface of the second circuit board on which the second electronic component and the third electronic component are disposed; after the step of “covering the surface of the second electronic component and the third electronic component with a second protective film”, the second protective film is also filled in the second groove.

[0007] In some possible embodiments of this application, in the step of "electrically connecting the first electronic component on the first circuit board", the manufacturing method further includes: electrically connecting conductive pillars on the first circuit board, wherein the conductive pillars and the first electronic component are located on the same surface of the first circuit board; after the step of "pressing and baking the first and second components", the conductive pillars are electrically connected to the second circuit board; or in the step of "electrically connecting the second and third electronic components on the second circuit board", the manufacturing method further includes: electrically connecting conductive pillars on the second circuit board, wherein the conductive pillars, the second electronic component, and the third electronic component are located on the same surface of the second circuit board; after the step of "pressing and baking the first and second components", the conductive pillars are electrically connected to the first circuit board.

[0008] In some possible embodiments of this application, after the step of "pressing and baking the first component and the second component", the manufacturing method further includes: forming a connecting pad on the surface of the first circuit board or the second circuit board.

[0009] A circuit board assembly includes a first assembly and a second assembly. The first assembly includes a first circuit board, a first electronic component, a first protective film, and a shielding film; the first electronic component and the first circuit board are electrically connected; the first protective film covers the first electronic component; the shielding film covers the first protective film and is electrically connected to the first circuit board.

[0010] The second component includes a second circuit board, a second electronic component, a third electronic component, and a second protective film. The second electronic component and the second circuit board are electrically connected. The third electronic component and the second electronic component are located on the same surface of the second circuit board and are electrically connected to the second circuit board. The second protective film covers the second electronic component and the third electronic component. A shielding film is located between the first protective film and the second protective film.

[0011] In some possible embodiments of this application, the first component includes a protrusion extending from a first electronic component, a first protective film, and a shielding film toward a direction away from the first circuit board; the second component is provided with a receiving groove, which is recessed from a second protective film toward the second circuit board; the protrusion is received in the receiving groove.

[0012] In some possible embodiments of this application, the circuit board assembly further includes conductive posts located between the first circuit board and the second circuit board, and electrically connected to the first circuit board and the second circuit board.

[0013] In some possible embodiments of this application, the first circuit board has a first groove, the first groove is located on the surface of the first circuit board on which the first electronic component is disposed, and the first protective film is also filled in the first groove.

[0014] In some possible embodiments of this application, the second circuit board has a second groove located on the surface of the second circuit board where the second electronic component and the third electronic component are disposed, and the second protective film is also filled in the second groove.

[0015] In the circuit board assembly provided in this application embodiment, the first electronic component, the second electronic component, and the third electronic component are all located inside the first circuit board and the second circuit board. Compared with related technologies, this is equivalent to omitting the mounting height of the first electronic component, which is beneficial to reducing the overall height of the circuit board assembly. In addition, the shielding film is located between the first electronic component, the second electronic component, and the third electronic component, eliminating the need for additional shielding structures, which is beneficial to further reduce the overall height of the circuit board. Attached Figure Description

[0016] Figure 1 A cross-sectional schematic diagram of a circuit board assembly provided for the prior art.

[0017] Figure 2 This is a cross-sectional flow diagram illustrating the electrical connection of a first electronic component on a first circuit board, as provided in an embodiment of this application.

[0018] Figure 3 This is a cross-sectional flow diagram showing the electrical connection of a second electronic component, a third electronic component, and a conductive pillar on a second circuit board, as provided in an embodiment of this application.

[0019] Figure 4 In order to be in Figure 2 The diagram shows a cross-sectional flow chart of the first component obtained by sequentially covering the surface of the first electronic component with a first protective film and a shielding film.

[0020] Figure 5 In order to be in Figure 3 The diagram shows a cross-sectional flow diagram of the second component obtained by sequentially covering the surfaces of the second and third electronic components with the second protective film.

[0021] Figure 6 For pressing and baking Figure 4 The first component shown and Figure 5 The diagram shows a cross-sectional flow chart of the second component.

[0022] Figure 7 In order to be in Figure 6 The diagram shows a cross-sectional view of the circuit board assembly obtained after forming a connecting pad on the surface of the second circuit board.

[0023] Explanation of main component symbols

[0024]

[0025] Detailed Implementation

[0026] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0028] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0029] Please see Figure 1 , Figure 1 A cross-sectional schematic diagram of a circuit board assembly 100' provided in the prior art is shown. The circuit board assembly 100' is arranged in a stacked manner. The specific manufacturing steps include: connecting a first electronic component 13' to a first circuit board 11', connecting a second electronic component 23' and a third electronic component 24' to a second circuit board 21', arranging them in the manner of the first electronic component 13', the first circuit board 11', the second electronic component 23', and the second circuit board 21', and forming an encapsulation layer 19' between each component and on the surface of the components.

[0030] The overall height H' of the circuit board assembly 100' is relatively high, which is not conducive to miniaturized structural design; furthermore, air bubbles are prone to occur during the formation of the encapsulation layer 19', affecting the performance and reliability of the circuit board assembly 100'; if the first electronic component 13', the second electronic component 23', or the third electronic component 24' requires electromagnetic shielding, a cage-like shielding structure must be formed using a metal shielding shell or wire bonding. Using a metal shielding shell for shielding will increase the overall size of the circuit board assembly 100'; using wire bonding for shielding (such as...) Figure 1 If (as shown), then multiple grounding pads 111' need to be set, which can easily cause interference between line layers.

[0031] Please see Figures 2 to 7 This application provides a method for manufacturing a circuit board assembly 100, which can produce a circuit board assembly 100 with electromagnetic shielding performance and a small product size. The method for manufacturing the circuit board assembly 100 may include the following steps:

[0032] Step S1: Please refer to Figure 2 A first circuit board 11 is provided, on which a first electronic component 13 is electrically connected.

[0033] The first circuit board 11 includes a first dielectric layer (not shown) and a first circuit layer (not shown), with the first circuit layer located on the surface of the first dielectric layer. The number of layers in the first dielectric layer and the first circuit layer is not limited; each can be one or more layers. In this embodiment, we take an example where both the first dielectric layer and the first circuit layer are one layer.

[0034] The first circuit layer includes a plurality of first solder pads 112, which serve as electrical connections. A first electronic component 13 is electrically connected to the first solder pads 112. The number of first electronic components 13 can be one or more; in this embodiment, the number of first electronic components 13 is one.

[0035] Here, the direction in which the first circuit board 11 extends is defined as the first direction L1, and the direction in which the first electronic component 13 is disposed on the first circuit board 11 is defined as the second direction L2. The first direction L1 and the second direction L2 can be perpendicular to each other.

[0036] A first groove 114 may be formed on the first circuit board 11, and the number of first grooves 114 may be one or more. The first groove 114 is formed on the surface of the first dielectric layer, and the first groove 114 is located on the same side of the first circuit board 11 where the first electronic component 13 is disposed.

[0037] Step S2: Please refer to Figure 3 A second circuit board 21 is provided, on which a second electronic component 23, a third electronic component 24 and a conductive post 27 are electrically connected, and the second electronic component 23, the third electronic component 24 and the conductive post 27 are located on the same surface of the second circuit board 21.

[0038] The second circuit board 21 includes a second dielectric layer (not shown) and a second circuit layer (not shown), with the second circuit layer located on the surface of the second dielectric layer. The number of layers in the second dielectric layer and the second circuit layer is not limited; each can be a single layer or multiple layers. In this embodiment, we take an example where both the second dielectric layer and the second circuit layer are single layers.

[0039] The second circuit layer includes multiple second solder pads 212, which serve as electrical connections. The second electronic component 23 and the conductive pillar 27 are both electrically connected to the second solder pads 212. The second electronic component 23 and the third electronic component 24 are disposed on the surface of the second circuit board 21 along a second direction L2, and are spaced apart along a first direction L1.

[0040] The conductive post 27 can be made of ultra-low resistance nanomaterials, which helps to improve current transmission efficiency and reduce energy loss. There are at least two conductive posts 27, with a second electronic component 23 and a third electronic component 24 located between them. The conductive posts 27 can subsequently serve as electrical connections and also provide support.

[0041] The second circuit board 21 may have a second groove 214 formed thereon, and the number of second grooves 214 may be one or more. The second groove 214 is formed on the surface of the second dielectric layer, and the second groove 214 is located on the same side of the second circuit board 21 on which the second electronic component 23 and the third electronic component 24 are disposed.

[0042] Step S3: Please refer to Figure 4 A first protective film 15 is covered on the surface of the first electronic component 13, and a shielding film 17 is covered on the surface of the first protective film 15. The shielding film 17 is electrically connected to the first circuit board 11 to obtain the first component 10.

[0043] A first protective film 15 is first applied to the surface of the first electronic component 13 facing away from the first circuit board 11, and then the first protective film 15 is pressed together. The first protective film 15 covers the surface of the first electronic component 13 and is connected to the first circuit board 11. The first protective film 15 also fills the gap between the first electronic component 13 and the first circuit board 11. Part of the first solder pad 112 is exposed to the first protective film 15.

[0044] The first protective film 15 is made of thermoplastic film, with polyurethane as its main component. Compared with EMC, the first protective film 15 has good elongation and Young's modulus. During vacuum pressing, the first protective film 15 is in a flowing state during pre-pressing, while the entire pressing space is under vacuum. After preheating, the hydraulic cylinder rises again, and the airbag is inflated and pressurized. Under high pressure, the flowing first protective film 15 fills the gaps between components, ensuring that there are no air bubbles between the first protective film 15 and the first circuit board 11.

[0045] The first protective film 15 is also filled in the first groove 114. The setting of the first groove 114 is equivalent to forming multiple breakpoints on the first circuit board 11, which is used to break the internal stress distribution of the first circuit board 11 caused by thermal stress or mechanical stress, thereby effectively reducing the warping of the first circuit board 11. At the same time, the first protective film 15 has excellent stress coupling characteristics, which can effectively reduce the accumulation of thermal stress and reduce the warping of the first circuit board 11. Furthermore, the first groove 114 can increase the contact area between the first circuit board 11 and the first protective film 15, thereby increasing the bonding force.

[0046] The shielding film 17 can be made of an elastomer composed of liquid metal and polydimethylsiloxane. The shielding film 17 has good fluidity and electromagnetic shielding performance. The shielding film 17 is located on the surface of the first protective film 15 and is electrically connected to the first solder pad 112 exposed on the first protective film 15. The shielding film 17 is used to perform electromagnetic shielding.

[0047] After the shielding film 17 is pressed onto the first protective film 15, the first component 10 includes a protrusion 18, which is the area of ​​the first component 10 where the first electronic component 13 is located. The protrusion 18 protrudes along the second direction L2 toward the direction away from the first circuit board 11.

[0048] Step S4: Please refer to Figure 5 A second protective film 25 is applied to the surfaces of the second electronic component 23 and the third electronic component 24 to obtain the second component 20.

[0049] A second protective film 25 is pre-applied to the surfaces of the second electronic component 23 and the third electronic component 24 facing away from the second circuit board 21. The second protective film 25 is then pressed together, covering the surfaces of the second electronic component 23 and the third electronic component 24 and connecting to the second circuit board 21. The second protective film 25 also fills the gap between the second electronic component 23, the third electronic component 24, and the second circuit board 21. After pressing the second protective film 25, a receiving groove 28 is formed between the second electronic component 23 and the third electronic component 24, and the receiving groove 28 is recessed towards the second circuit board 21 along the second direction L2.

[0050] The second protective film 25 is made of thermoplastic film, with polyurethane as its main component. Compared to EMC, the second protective film 25 has better elongation and Young's modulus. During vacuum pressing, the second protective film 25 is in a flowing state during pre-pressing, while the entire pressing space is under vacuum. After preheating, the hydraulic cylinder rises again, and the airbag is inflated and pressurized. Under high pressure, the flowing second protective film 25 fills the gaps between components, ensuring that there are no air bubbles between the second protective film 25 and the second circuit board 21.

[0051] The second protective film 25 is also filled in the second groove 214. The setting of the second groove 214 is equivalent to forming multiple breakpoints on the second circuit board 21, which is used to break the internal stress distribution of the second circuit board 21 caused by thermal stress or mechanical stress, thereby effectively reducing the warping of the second circuit board 21. At the same time, the second protective film 25 has excellent stress coupling characteristics, which can effectively reduce the accumulation of thermal stress and reduce the warping of the second circuit board 21. Furthermore, the second groove 214 can increase the contact area between the second circuit board 21 and the second protective film 25, thereby increasing the bonding force.

[0052] Step S5: Please refer to Figure 6 The first component 10 and the second component 20 are pressed and baked with the first circuit board 11 and the second circuit board 21 facing outwards and the shielding film 17 located between the first protective film 15 and the second protective film 25. The conductive post 27 is electrically connected to the first circuit board 11.

[0053] The protrusion 18 is located in the receiving groove 28, with the first circuit board 11 and the second circuit board 21 facing outwards, and the first electronic component 13, the first protective film 15, the shielding film 17, the second electronic component 23, the third electronic component 24 and the second protective film 25 facing inwards. The shielding film 17 is located between the first protective film 15 and the second protective film 25. The first component 10 and the second component 20 are pressed and baked.

[0054] The height of the first electronic component 13 along the second direction L2 is d1, the distance from the first electronic component 13 along the second direction L2 to the shielding film 17 is n1, the thickness of the shielding film 17 along the second direction L2 is k, and the width of the protrusion 18 along the first direction L1 is c.

[0055] The thickness of the third electronic component 24 along the second direction L2 is d2. The thickness of the second protective film 25 located on the surface of the second electronic component 23 or the third electronic component 24 along the second direction L2 is n2. The distance between the second electronic component 23 and the third electronic component 24 is a. The width of the receiving groove 28 along the first direction L1 is b. The distance from the second electronic component 23 to the receiving groove 28 is a1. The distance from the third electronic component 24 to the receiving groove 28 is a2. The distances a1 and a2 are related to the dimensions of the second electronic component 23 and the third electronic component 24. The thickness of the first protective film 15 or the second protective film 25 before pressing is m. The thickness n1 or n2 is approximately one-quarter of m.

[0056] In some embodiments, c ≤ b is satisfied so that the protrusion 18 can be received in the receiving groove 28. In some embodiments, d1 + n1 + k = d2 + n2 is satisfied, which means that along the second direction L2, the protrusion height of the protrusion 18 and the recess depth of the receiving groove 28 are the same, so that after the protrusion 18 is received in the receiving groove 28, the shielding film 17 can contact the second protective film 25.

[0057] The overall height after pressing is H. Compared with the height H' in the prior art, the overall height H after pressing is equivalent to omitting at least the installation height of the first electronic component 13. Therefore, H < H', which is beneficial to reduce the overall height H of the circuit board assembly 100.

[0058] Vacuum baking is employed, which increases the bonding force between components during the baking process. Simultaneously, high-temperature baking intensifies the intermolecular movement within the first protective film 15, shielding film 17, and second protective film 25, creating tension within these films. The surface area between these films increases the overall energy. To reduce the overall energy, the first protective film 15, shielding film 17, and second protective film 25 flow and tend to fuse, forming a tightly connected whole. The presence of shielding film 17 reduces signal interference between the first electronic component 13, the second electronic component 23, and the third electronic component 24.

[0059] It is understood that in other embodiments, the conductive post 27 may also be pre-set on the surface of the first circuit board 11. In step S1, the first electronic component 13 is electrically connected to the first circuit board 11, and the conductive post 27 is also electrically connected to the first circuit board 11 at the same time. The conductive post 27 and the first electronic component 13 are located on the same surface of the first circuit board 11. After the step of "pressing and baking the first component 10 and the second component 20", the conductive post 27 is electrically connected to the second circuit board 21. The conductive post 27 can also serve as an electrical connection and support.

[0060] Step S6: Please refer to Figure 7 Connecting pads 30 are formed on the surface of the first circuit board 11 or the second circuit board 21 to obtain the circuit board assembly 100.

[0061] Solder can be applied to the surface of the second circuit board 21 away from the first circuit board 11 by means of printing or balling to form a connecting pad 30, which is used to perform electrical connection.

[0062] In some embodiments, when the second circuit board 21 has a connecting pad 30 on the surface opposite to the first circuit board 11, or when the first circuit board 11 has a connecting pad 30 on the surface opposite to the second circuit board 21, the step of forming the connecting pad 30 may be omitted.

[0063] Please refer to it again. Figure 7 This application also provides a circuit board assembly 100, which may include a first component 10 and a second component 20, the first component 10 and the second component 20 being connected as a whole.

[0064] The first component 10 may include a first circuit board 11, a first electronic component 13, a first protective film 15, and a shielding film 17. The first electronic component 13 is electrically connected to the first circuit board 11. The first protective film 15 covers the first electronic component 13 and is connected to the surface of the first circuit board 11, and the first protective film 15 also fills the gap between the first electronic component 13 and the first circuit board 11. The shielding film 17 covers the first protective film 15 and is electrically connected to the first circuit board 11.

[0065] If the area of ​​the first component 10 where the first electronic element 13 is disposed protrudes relative to the area where the first electronic element 13 is not disposed, then the first component 10 includes a protruding portion 18, which is composed of the first electronic element 13, a first protective film 15 covering the first electronic element 13, and a shielding film 17 covering the first protective film 15.

[0066] The second component 20 may include a second circuit board 21, a second electronic component 23, a third electronic component 24, and a second protective film 25. The second electronic component 23 and the third electronic component 24 are spaced apart and electrically connected to the second circuit board 21. The second protective film 25 covers the second electronic component 23 and the third electronic component 24 and is connected to the surface of the second circuit board 21. The second protective film 25 also fills the gap between the second electronic component 23, the third electronic component 24, and the second circuit board 21.

[0067] The second protective film 25 located between the second electronic component 23 and the third electronic component 24 forms a receiving groove 28, the protrusion 18 of the first component 10 is received in the receiving groove 28, and the shielding film 17 is connected to the second protective layer.

[0068] In some embodiments, the circuit board assembly 100 may further include conductive posts 27 located between the first circuit board 11 and the second circuit board 21, and electrically connected to the first circuit board 11 and the second circuit board 21. A gap exists between the conductive posts 27 and the second protective layer.

[0069] In some embodiments, a first circuit board 11 has a first groove 114 located on the surface of the first circuit board 11 where a first electronic component 13 is disposed, and a first protective film 15 is also filled in the first groove 114. The first groove 114 helps reduce thermal stress accumulation and warping of the first circuit board 11; furthermore, the first groove 114 increases the contact area between the first circuit board 11 and the first protective film 15, thereby increasing the bonding strength. In some embodiments, a second circuit board 21 has a second groove 214 located on the surface of the second circuit board 21 where a second electronic component 23 and a third electronic component 24 are disposed, and a second protective film 25 is also filled in the second groove 214. The second groove 214 also helps reduce thermal stress accumulation and warping of the second circuit board 21; furthermore, the second groove 214 increases the contact area between the second circuit board 21 and the second protective film 25, thereby increasing the bonding strength.

[0070] In some embodiments, the circuit board assembly 100 may further include a connection pad 30 located on the surface of the first circuit board 11 or the second circuit board 21, and the connection pad 30 serves to provide an electrical connection.

[0071] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A method for manufacturing a circuit board assembly, characterized in that, include: A first circuit board is provided, on which a first electronic component is electrically connected; A second circuit board is provided, on which a second electronic component and a third electronic component are electrically connected; A first protective film is covered on the surface of the first electronic component, and a shielding film is covered on the surface of the first protective film. The shielding film is electrically connected to the first circuit board to obtain a first assembly. A second protective film is applied to the surfaces of the second electronic component and the third electronic component to obtain a second assembly; as well as The first and second components are pressed and baked with the first and second circuit boards facing outwards and the shielding film located between the first and second protective films.

2. The method for manufacturing a circuit board assembly according to claim 1, characterized in that, The first circuit board has a first groove on its surface, and the first groove is located on the surface of the first circuit board on which the first electronic component is disposed; after the step of "covering the surface of the first electronic component with a first protective film", the first protective film is also filled in the first groove.

3. The method for manufacturing a circuit board assembly according to claim 1 or 2, characterized in that, The second circuit board has a second groove on its surface, and the second groove is located on the surface of the second circuit board on which the second electronic component and the third electronic component are disposed; after the step of "covering the surface of the second electronic component and the third electronic component with a second protective film", the second protective film is also filled in the second groove.

4. The method for manufacturing a circuit board assembly according to claim 1, characterized in that, In the step of "electrically connecting the first electronic component on the first circuit board", the manufacturing method further includes: electrically connecting conductive pillars on the first circuit board, wherein the conductive pillars and the first electronic component are located on the same surface of the first circuit board; after the step of "pressing and baking the first component and the second component", the conductive pillars are electrically connected to the second circuit board; or In the step of "electrically connecting the second electronic component and the third electronic component on the second circuit board", the manufacturing method further includes: electrically connecting conductive pillars on the second circuit board, wherein the conductive pillars, the second electronic component and the third electronic component are located on the same surface of the second circuit board; after the step of "pressing and baking the first component and the second component", the conductive pillars are electrically connected to the first circuit board.

5. The method for manufacturing a circuit board assembly according to claim 1, characterized in that, After the step of "pressing and baking the first component and the second component", the manufacturing method further includes: A bonding pad is formed on the surface of the first circuit board or the second circuit board.

6. A circuit board assembly, characterized in that, include: The first component includes: First circuit board; The first electronic component is electrically connected to the first circuit board; A first protective film covers the first electronic component; and A shielding film, covering the first protective film and electrically connected to the first circuit board; and a second component, comprising: Second circuit board; The second electronic component is electrically connected to the second circuit board; The third electronic component and the second electronic component are located on the same surface of the second circuit board and are electrically connected to the second circuit board; and A second protective film covers the second electronic component and the third electronic component; The shielding film is located between the first protective film and the second protective film.

7. The circuit board assembly according to claim 6, characterized in that, The first component includes a protrusion extending from the first electronic component, the first protective film, and the shielding film in a direction away from the first circuit board; the second component is provided with a receiving groove, which is recessed from the second protective film towards the second circuit board; the protrusion is received in the receiving groove.

8. The circuit board assembly according to claim 6, characterized in that, The circuit board assembly further includes conductive pillars located between the first circuit board and the second circuit board, and electrically connecting the first circuit board and the second circuit board.

9. The circuit board assembly according to any one of claims 6-8, characterized in that, The first circuit board has a first groove located on the surface of the first circuit board where the first electronic component is disposed, and the first protective film also fills the first groove.

10. The circuit board assembly according to any one of claims 6-8, characterized in that, The second circuit board has a second groove located on the surface of the second circuit board where the second electronic component and the third electronic component are disposed, and the second protective film is also filled in the second groove.

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