Stacked heat dissipation packaging structure and preparation method thereof

Abstract

The invention relates to the technical field of stacked heat dissipation packaging structures, and discloses a stacked heat dissipation packaging structure and a preparation method thereof.The stacked heat dissipation packaging structure comprises a mounting plate, a mounting groove is formed in the mounting plate, grooves are formed in the ends of the two sides of the mounting groove, and heat dissipation grooves are evenly formed between the grooves; a chip assembly is arranged on the mounting plate, the chip assembly is clamped and mounted on a firm assembly, the firm assembly is fixedly arranged on a firm seat, the firm seat is fixedly mounted at the end parts of the two sides in the mounting groove, the side part and the upper side part of the chip assembly are provided with rotary assemblies, the top part of each rotary assembly is provided with a heat dissipation assembly, and the bottom part of each heat dissipation assembly is provided with a buffer assembly; according to the invention, the chip assemblies are stacked in a staggered manner and are clamped with the firm assemblies, so that the installation stability and the space utilization rate are improved; a concentric-square-shaped groove, a heat conduction pipe and a spiral channel of the rotary assembly are matched with fins of the heat dissipation assembly, so that heat is quickly conducted out; the honeycomb units and the air holes of the buffer assembly absorb shock and do not resist heat dissipation, packaging miniaturization is guaranteed, and heat dissipation and buffer reliability is synchronously improved.

Description

Technical Field

[0001] This invention relates to the field of stacked heat dissipation packaging structure technology, specifically to a stacked heat dissipation packaging structure and its preparation method. Background Technology

[0002] With the rapid development of electronic devices towards miniaturization and high integration, chip stacking packaging technology has become an important development direction in the packaging field because it can effectively improve the chip integration per unit area.

[0003] Chinese patent document CN 120432452 B discloses a stacked heat dissipation packaging structure and its fabrication method, relating to the field of chip packaging technology. This stacked heat dissipation packaging structure includes a substrate, a first chip, a thermal adhesive layer, a first heat dissipation dummy sheet, a second heat dissipation dummy sheet, a molding compound, and solder balls. The first chip is mounted on the substrate, and a chip recess is formed on the non-functional surface of the first chip. The thermal adhesive layer is disposed in the chip recess. Both the first and second heat dissipation dummy sheets are disposed in the chip recess, with the second heat dissipation dummy sheet bent and extending onto the first heat dissipation dummy sheet, forming a heat dissipation gap between them. Compared to existing technologies, this invention places both the first and second heat dissipation dummy sheets on the thermal adhesive layer, significantly increasing the heat dissipation area and thus improving the heat dissipation effect and performance. Furthermore, it effectively reduces the stacking height, contributing to the miniaturization of the packaging structure.

[0004] Existing technologies lack interconnected internal and external heat dissipation buffer components. The heat dissipation design of most stacked package structures often focuses on single internal or external heat dissipation, making it difficult to form an efficient heat conduction path from the chip core to the external environment. Heat tends to accumulate inside the package and cannot be quickly dissipated. At the same time, the design of the buffer structure and heat dissipation components are independent of each other. The buffer unit mostly only plays a shock absorption role and fails to cooperate with the heat dissipation channel, resulting in low overall space utilization and functional integration of the package.

[0005] To address these issues, this invention proposes a stacked heat dissipation packaging structure and its fabrication method. Summary of the Invention

[0006] The purpose of this invention is to provide a stacked heat dissipation packaging structure to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a stacked heat dissipation packaging structure, including a mounting plate, wherein a mounting groove is provided in the mounting plate, and grooves are provided at both ends of the mounting groove, and heat dissipation grooves are uniformly provided between the grooves; The mounting plate is provided with a chip assembly, which is adapted and snapped onto a mounting component. The mounting component is fixedly mounted on a mounting base, which is fixedly mounted on both sides of the mounting groove. A rotary assembly is installed on the side and top of the chip assembly. A heat dissipation assembly is installed on the top of the rotary assembly, and a buffer assembly is provided at the bottom of the heat dissipation assembly.

[0008] Preferably, the bottom end of the chip body in the chip assembly is fixedly provided with a snap-fit ​​protrusion, and the snap-fit ​​protrusion on the bottom chip body is adapted to snap-fit ​​in the groove. The chip bodies are stacked in a staggered manner inside the mounting groove, and the two ends of the chip bodies are adapted to slide and snap-fit ​​in the mounting groove.

[0009] Preferably, the mounting groove in the chip assembly is located inside the mounting base, the upper layer of the chip body is fitted onto the mounting groove on the right mounting base, and the middle layer of the chip body is fitted onto the mounting groove on the left mounting base.

[0010] Preferably, the securing blocks in the securing assembly are evenly installed on the securing base, and pins are evenly arranged in the gaps between the securing blocks. The pins are connected to the chip body, the top of the securing block is in close contact with the bottom end of the rotary plate, the pins are separated from the bottom end of the rotary plate, and the chip body is in close contact with the bottom end of the rotary plate.

[0011] Preferably, the stabilizing seat in the stabilizing assembly is provided with a stabilizing locking groove, and an elastic rod is adapted to be locked in the stabilizing locking groove. The elastic rod is fixedly installed at the bottom ends of both sides of the rotary plate, and the rotary plate is locked onto the stabilizing seat by the elastic rod. The rotary plate has an installation end extending from its end side.

[0012] Preferably, the rotary plate in the rotary assembly is uniformly provided with rotary grooves, the rotary grooves are provided with channels inside, the rotary grooves are configured in a U-shape, the rotary grooves are connected by channel bridges, a fixed cover plate is fixedly installed on the inner side of the rotary groove, the fixed cover plate is uniformly provided with ventilation grooves, and connection holes are uniformly provided on the inner side of both ends of the rotary plate, and heat conduction pipes are fixedly connected to the bottom of the connection holes.

[0013] Preferably, the heat pipe in the rotary assembly is fixedly installed on the heat-conducting pad, and the heat-conducting pad is evenly installed at three locations: the top, middle, and bottom of the heat pipe. A spiral channel is fixedly installed inside the heat pipe. The top of the spiral channel is connected to the connecting hole, and the side of the spiral channel is connected to the inside of the heat-conducting pad. The heat-conducting pad is snap-fitted to both ends of the chip body.

[0014] Preferably, the heat dissipation fins in the heat dissipation assembly are evenly installed on the cover plate. The heat dissipation fins are configured in a U-shape, and there are evenly spaced gaps between them. The installation positions of the heat dissipation fins correspond one-to-one with the positions of the rotary grooves. Folded mounting ends are fixedly provided on both sides of the cover plate. The bottom end of the lower fold of the folded mounting end is in close contact with the top two sides of the mounting plate. The inner fold of the folded mounting end is in close contact with the outer side of the fixed seat. The bottom end of the upper fold of the folded mounting end is in close contact with the top of the rotary plate. The cover plate is fixedly installed on the mounting plate by fixing pins.

[0015] Preferably, the buffer plate in the buffer assembly is fixedly installed at the bottom end of the rotary plate, the buffer plate has a cavity, honeycomb buffer units are uniformly fixedly installed in the buffer plate, buffer layers are uniformly provided at the upper and lower ends of the honeycomb buffer units, and ventilation holes are fixedly installed on the sides and top of the honeycomb buffer units.

[0016] Stacked heat dissipation packaging structure and its fabrication method, wherein the fabrication method is as follows: Install the mounting bracket and chip assembly. Fix the mounting bracket to both sides of the mounting slot on the mounting plate, and then stack the chip bodies in a staggered manner. The bottom layer is inserted into the groove by the snap-fit ​​protrusion.

[0017] Install the mounting and swivel components, attach the mounting blocks to the mounting base, arrange the pins in the gap and connect them to the chip body; insert the swivel plate into the mounting base's mounting slot via the elastic rod, and finally connect the heat pipe and the connection hole, and install it on both sides of the chip body.

[0018] Install the buffer assembly and heat dissipation assembly, install the buffer plate at the bottom of the rotating plate, then position the cover plate through the folded mounting end, and finally fix the cover plate to the mounting plate with the fixing pin.

[0019] Compared with existing technologies, the beneficial effects of this invention are as follows: By stacking chip components in staggered layers and securing them with strong component snap-fit, the stability of chip installation and space utilization are improved; the spiral component's U-shaped spiral groove, heat pipe, and spiral channel form an internal and external linkage heat conduction path, which, together with the U-shaped heat dissipation fins of the heat dissipation component, enables rapid heat dissipation from the chip, solving the problem of heat accumulation; the honeycomb buffer unit and vent design of the buffer component not only provide shock absorption and protection but also do not obstruct the heat dissipation channel, and the close fit with the spiral component improves the space integration. The synergistic effect of each component not only ensures the miniaturization requirements of stacked packaging but also simultaneously improves heat dissipation performance and structural buffer reliability, enhancing the overall packaging structure's operational stability and service life. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the chip assembly structure of the present invention; Figure 3 This is a schematic diagram of the robust component structure of the present invention; Figure 4 This is a schematic diagram of the gyro assembly structure of the present invention; Figure 5 This is a schematic diagram of the heat dissipation component structure of the present invention; Figure 6 This is a schematic diagram of the buffer component structure of the present invention.

[0021] In the diagram: Mounting plate 1, Mounting slot 2, Groove 3, Heat dissipation slot 4, Secure base 5, Chip body 501, Snap-fit ​​protrusion 502, Mounting groove 503, Secure block 601, Pin 602, Secure snap-fit ​​groove 603, Elastic rod 604, Rotary plate 701, Rotary groove 702, Fixed cover plate 703, Ventilation groove 704, Connecting hole 705, Heat pipe 706, Heat-conducting pad 707, Spiral channel 708, Heat dissipation fins 801, Cover plate 802, Folded mounting end 803, Buffer plate 901, Honeycomb buffer unit 902, Buffer layer 903, Ventilation hole 904. Detailed Implementation

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Example 1: Please refer to Figures 1-3 The system includes a mounting plate 1, a mounting groove 2 inside the mounting plate 1, grooves 3 on both sides of the mounting groove 2, and heat dissipation grooves 4 evenly distributed between the grooves 3; a chip assembly is mounted on the mounting plate 1, the chip assembly is fitted and snapped onto a fixing component, the fixing component is fixedly mounted on a fixing seat 5, the fixing seat 5 is fixedly mounted on both sides of the mounting groove 2, a rotating component is mounted on the side and top of the chip assembly, a heat dissipation component is mounted on the top of the rotating component, and a buffer component is provided at the bottom of the heat dissipation component.

[0024] The bottom end of the chip body 501 in the chip assembly is fixedly provided with a snap-fit ​​protrusion 502. The snap-fit ​​protrusion 502 on the bottom chip body 501 is adapted to snap-fit ​​in the groove 3. The chip bodies 501 are stacked in staggered layers and installed inside the mounting groove 2. The two ends of the chip bodies 501 are adapted to slide and snap-fit ​​in the mounting groove 503.

[0025] The mounting groove 503 in the chip assembly is located inside the mounting base 5. The upper layer of the chip body 501 is attached to the mounting groove 503 on the right mounting base 5, and the middle layer of the chip body 501 is attached to the mounting groove 503 on the left mounting base 5.

[0026] The securing blocks 601 in the securing assembly are evenly installed on the securing base 5. Pins 602 are evenly arranged in the gaps between the securing blocks 601. The pins 602 are connected to the chip body 501. The top of the securing block 601 is in close contact with the bottom end of the rotating plate 701. There is a gap between the pins 602 and the bottom end of the rotating plate 701. The chip body 501 is in close contact with the bottom end of the rotating plate 701.

[0027] The mounting base 5 in the mounting assembly is provided with a mounting groove 603. An elastic rod 604 is fitted into the mounting groove 603. The elastic rod 604 is fixedly installed on the bottom ends of both sides of the rotary plate 701. The rotary plate 701 is mounted on the mounting base 5 by the elastic rod 604. The end of the rotary plate 701 has an installation end protruding from its end.

[0028] In use, first, the mounting base 5 is positioned and fixed using the mounting slot 2 of the mounting plate 1, ensuring that the mounting base 5 is securely installed on both sides of the mounting slot 2. Then, the chip bodies 501 are stacked in a staggered manner. The bottom chip body 501 is precisely engaged with the grooves 3 on both sides of the mounting slot 2 using the bottom locking protrusion 502. The middle chip body 501 slides into the mounting groove 503 of the left mounting base 5, and the top chip body 501 slides into the mounting groove 503 of the right mounting base 5, achieving stable assembly of the chip assembly. Then, the chip body is mounted on the mounting base... 5. Evenly install the mounting blocks 601, arrange the pins 602 in the gaps between the mounting blocks 601 and connect them to the chip body 501. Then, insert the rotary plate 701 into the mounting slots 603 of the mounting base 5 through the elastic rods 604 at the bottom of both sides, so that the top of the mounting blocks 601 and the chip body 501 are in close contact with the bottom of the rotary plate 701. The pins 602 are kept in a gap with the bottom of the rotary plate 701 to avoid contact interference, laying a solid foundation for the subsequent component installation. The chip body 501 and the mounting blocks 601 are welded and installed securely.

[0029] Example 2: Based on Example 1, please refer to... Figures 2-5 The rotary plate 701 in the rotary assembly is evenly provided with rotary grooves 702. The rotary grooves 702 are provided with channels inside. The rotary grooves 702 are configured in the shape of a U.S. shape. The rotary grooves 702 are connected by channel bridges. A fixed cover plate 703 is fixedly installed on the inner side of the rotary groove 702. The fixed cover plate 703 is evenly provided with ventilation grooves 704. Connection holes 705 are evenly provided on the inner side of both ends of the rotary plate 701. A heat conduction pipe 706 is fixedly connected to the bottom of the connection hole 705.

[0030] The heat pipe 706 in the rotary assembly is fixedly installed on the heat-conducting pad 707. The heat-conducting pad 707 is evenly installed at the top, middle and bottom of the heat pipe 706. A spiral channel 708 is fixedly installed inside the heat pipe 706. The top of the spiral channel 708 is connected to the connection hole 705, and the side of the spiral channel 708 is connected to the inside of the heat-conducting pad 707. The heat-conducting pad 707 is snapped onto both ends of the chip body 501.

[0031] In use, based on the assembly in Embodiment 1, the heat pipe 706 is fixedly welded to both ends of the chip body 501 via heat-conducting pads 707 at three locations (top, middle, and bottom). This ensures that the heat-conducting pads 707 are in close contact with the chip body 501 for efficient heat conduction. The top of the heat pipe 706 is fixedly connected to the connection holes 705 on the inner sides of both ends of the rotary plate 701, allowing the spiral channel 708 inside the heat pipe 706 to communicate with the connection holes 705. Simultaneously, the side of the spiral channel 708 connects to the interior of the heat-conducting pads 707, forming a heat conduction channel. The chip body 501 generates heat during operation. The heat is transferred to the spiral channel 708 through the heat-conducting pad 707. As the heat propagates upward, it is transported upward through the spiral channel 708 to the connecting hole 705, and then introduced into the U-shaped swivel groove 702 on the swivel plate 701. The swivel grooves 702 are connected by channel bridges, which can make the heat evenly distributed in the swivel grooves 702. The fixed cover plate 703 on the inner side of the swivel groove 702 plays a protective role, while the vent groove 704 on its surface facilitates air circulation and assists in heat dissipation, realizing the efficient transfer of heat from the chip to the swivel assembly. The heat continues to dissipate upward through the vent groove 704.

[0032] Example 3: Based on Example 2, please refer to... Figures 4-6 The heat dissipation fins 801 in the heat dissipation assembly are evenly installed on the cover plate 802. The heat dissipation fins 801 are set in a U-shape and there are evenly spaced gaps between them. The installation positions of the heat dissipation fins 801 correspond one-to-one with the positions of the rotary grooves 702. Folded mounting ends 803 are fixedly installed on both sides of the cover plate 802. The bottom end of the lower fold of the folded mounting end 803 is in close contact with the top two sides of the mounting plate 1. The inner fold of the folded mounting end 803 is in close contact with the outer side of the fixed seat 5. The bottom end of the upper fold of the folded mounting end 803 is in close contact with the top of the rotary plate 701. The cover plate 802 is fixedly installed on the mounting plate 1 by fixing pins.

[0033] The buffer plate 901 in the buffer assembly is fixedly installed at the bottom end of the rotary plate 701. A cavity is provided inside the buffer plate 901. Honeycomb buffer units 902 are uniformly fixedly installed inside the buffer plate 901. Buffer layers 903 are uniformly provided at the upper and lower ends of the honeycomb buffer units 902. Ventilation holes 904 are fixedly installed on the sides and top of the honeycomb buffer units 902.

[0034] In use, a buffer plate 901 is fixedly installed at the bottom end of the rotary plate 701. The honeycomb buffer unit 902 and the buffer layers 903 on the upper and lower sides of the buffer plate 901 can effectively buffer the vibration and external impact generated during the operation of the chip assembly, preventing damage to the chip body 501. The vent holes 904 on the side and top of the honeycomb buffer unit 902 ensure unobstructed heat dissipation channels and do not affect heat conduction. Then, the cover plate 802 is positioned by the folded mounting ends 803 on both sides, so that the bottom end of the folded corner of the folded mounting end 803 is tightly attached to the bottom of the chip body 501. The top two sides and the inner corner of the mounting plate 1 are tightly attached to the outer side of the fixed seat 5, and the bottom end of the upper corner is tightly attached to the top of the rotary plate 701. This ensures that the cover plate 802 is installed firmly and that the heat dissipation fins 801 correspond one-to-one with the rotary grooves 702. The cover plate 802 is fixed to the mounting plate 1 by fixing pins. The heat in the rotary grooves 702 can be quickly transferred to the corresponding U-shaped heat dissipation fins 801. The gap between the heat dissipation fins 801 increases the contact area with air, accelerates heat dissipation, and realizes a complete heat dissipation path from the chip to the outside, ensuring the stable operation of the packaging structure. Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A stacked heat dissipation packaging structure, including a mounting plate (1), wherein a mounting groove (2) is provided on the mounting plate (1), and grooves (3) are provided on both sides of the mounting groove (2), and heat dissipation grooves (4) are uniformly provided between the grooves (3). Its features are: The chip assembly is adapted and snapped onto a mounting component. The mounting component is fixedly mounted on a mounting base (5). The mounting base (5) is fixedly mounted on both sides of the mounting groove (2). A rotary assembly is installed on the side and top of the chip assembly. A heat dissipation assembly is installed on the top of the rotary assembly. A buffer assembly is provided at the bottom of the heat dissipation assembly.

2. The stacked heat dissipation packaging structure according to claim 1, characterized in that: The bottom end of the chip body (501) in the chip assembly is fixedly provided with a snap-fit ​​protrusion (502). The snap-fit ​​protrusion (502) on the bottom chip body (501) is adapted to snap-fit ​​in the groove (3). The chip bodies (501) are stacked in staggered layers inside the mounting groove (2). The two ends of the chip bodies (501) are adapted to slide and snap-fit ​​in the mounting groove (503).

3. The stacked heat dissipation packaging structure according to claim 2, characterized in that: The mounting groove (503) in the chip assembly is located inside the mounting base (5). The upper layer of the chip body (501) is fitted onto the mounting groove (503) on the right mounting base (5), and the middle layer of the chip body (501) is fitted onto the mounting groove (503) on the left mounting base (5).

4. The stacked heat dissipation packaging structure according to claim 1, characterized in that: The securing blocks (601) in the securing assembly are evenly installed on the securing base (5). Pins (602) are evenly arranged in the gaps between the securing blocks (601). The pins (602) are connected to the chip body (501). The top of the securing block (601) is in close contact with the bottom end of the rotating plate (701). The pins (602) and the bottom end of the rotating plate (701) are separated. The chip body (501) is in close contact with the bottom end of the rotating plate (701).

5. The stacked heat dissipation packaging structure according to claim 4, characterized in that: The sturdy seat (5) in the sturdy assembly is provided with a sturdy locking groove (603), and an elastic rod (604) is fitted into the sturdy locking groove (603). The elastic rod (604) is fixedly installed on the bottom ends of both sides of the rotary plate (701). The rotary plate (701) is installed on the sturdy seat (5) by the elastic rod (604). The rotary plate (701) has an installation end extending from its end side.

6. The stacked heat dissipation packaging structure according to claim 1, characterized in that: The rotary plate (701) in the rotary assembly is uniformly provided with rotary grooves (702), and a channel is provided inside the rotary groove (702). The rotary groove (702) is configured as a U-shape. The rotary grooves (702) are connected by a channel bridge. A fixed cover plate (703) is fixedly installed on the inner side of the rotary groove (702). A ventilation groove (704) is uniformly provided on the fixed cover plate (703). Connection holes (705) are uniformly provided on the inner side of both ends of the rotary plate (701). A heat conduction pipe (706) is fixedly connected to the bottom of the connection hole (705).

7. The stacked heat dissipation packaging structure according to claim 6, characterized in that: The heat pipe (706) in the cyclone assembly is fixedly installed on the heat-conducting pad (707). The heat-conducting pad (707) is evenly installed at three locations: the top, middle, and bottom of the heat pipe (706). A spiral channel (708) is fixedly installed inside the heat pipe (706). The top of the spiral channel (708) is connected to the connecting hole (705), and the side of the spiral channel (708) is connected to the inside of the heat-conducting pad (707). The heat-conducting pad (707) is snapped onto both ends of the chip body (501).

8. The stacked heat dissipation packaging structure according to claim 1, characterized in that: The heat dissipation fins (801) in the heat dissipation assembly are evenly installed on the cover plate (802). The heat dissipation fins (801) are set in a U-shape. There are even gaps between the heat dissipation fins (801). The installation position of the heat dissipation fins (801) corresponds one-to-one with the position of the rotary groove (702). The two ends of the cover plate (802) are fixedly provided with folded installation ends (803). The bottom end of the lower fold of the folded installation end (803) is closely attached to the top two sides of the mounting plate (1). The inner fold of the folded installation end (803) is closely attached to the outer side of the fixed seat (5). The bottom end of the upper fold of the folded installation end (803) is closely attached to the top of the rotary plate (701). The cover plate (802) is fixedly installed on the mounting plate (1) by fixing pins.

9. The stacked heat dissipation packaging structure according to claim 1, characterized in that: The buffer plate (901) in the buffer assembly is fixedly installed at the bottom end of the rotary plate (701). The buffer plate (901) has a cavity. Honeycomb buffer units (902) are uniformly fixedly installed in the buffer plate (901). Buffer layers (903) are uniformly provided at the upper and lower ends of the honeycomb buffer units (902). Ventilation holes (904) are fixedly installed on the sides and top of the honeycomb buffer units (902).

10. A method for preparing a stacked heat dissipation packaging structure as described in any one of claims 1-9, characterized in that, The preparation method is as follows: S1: Install the mounting base and chip assembly. Fix the mounting base (5) to both sides of the mounting slot (2) of the mounting plate (1). Then stack the chip body (501) in a staggered manner. The bottom layer is inserted into the groove (3) by the snap-fit ​​protrusion (502). S2: Install the mounting components and the rotating components. Install the mounting block (601) on the mounting base (5), arrange the pins (602) in the gap and connect them to the chip body (501); insert the rotating plate (701) into the mounting slot (603) of the mounting base (5) through the elastic rod (604), and finally connect the heat pipe (706) and the connection hole (705) and install it on both sides of the chip body (501). S3: Install the buffer assembly and heat dissipation assembly. Install the buffer plate (901) at the bottom of the rotary plate (701), then position the cover plate (802) through the folded mounting end (803), and finally fix the cover plate (802) to the mounting plate (1) with the fixing pin.

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