Mounting apparatus, mounting method, electronic device manufacturing system, electronic device manufacturing method, laser irradiation apparatus, and laser irradiation method

Abstract

The mounting device is provided with: a stage (20) for supporting the three-dimensional substrate; a mounting head (24) for mounting a component (2) on the three-dimensional substrate; and a management device (16) that controls the table (20) so that the surface of the three-dimensional substrate at the mounting position of the component (2) becomes horizontal, and that controls the mounting head (24) so that the component (2) is mounted at the mounting position. The mounting device sets, on the basis of component data, the rotational speed of the table (20) when the surface of the three-dimensional substrate at the mounting position of the component (2) becomes horizontal. The component data includes at least one of a size, a height, and a weight of the component (2), and a ratio of a region to which the paste solder is applied to a ground contact surface of the component and a surface of the three-dimensional substrate.

Description

Technical Field

[0001] This invention relates to an installation device, an installation method, a manufacturing system for electronic devices, a manufacturing method for electronic devices, a laser irradiation device, and a laser irradiation method. Background Technology

[0002] In the technical field of mounting devices, a 3D mounting device for mounting components on a three-dimensional substrate, as disclosed in Patent Document 1, is known.

[0003] Patent Document 1: International Publication No. 2018 / 207313 Summary of the Invention

[0004] In the mounting apparatus, electronic components are mounted on areas coated with solder paste. They are then conveyed to a laser irradiation device, where the solder paste is melted by laser irradiation. The molten solder paste is cooled, thereby soldering the electronic components to the substrate. When mounting electronic components onto a three-dimensional substrate, the worktable supporting the substrate needs to be controlled to rotate the substrate on the worktable so that the mounting position of the electronic components on the three-dimensional surface is horizontal. At this time, since the electronic components are held to the substrate solely by the adhesive force of the solder, mounted electronic components may shift or detach due to the high-speed rotation of the substrate. Similarly, even when soldering electronic components mounted on the substrate, unsoldered electronic components may shift or detach due to the high-speed rotation of the substrate.

[0005] The purpose of this invention is to perform mounting processes in a three-dimensional substrate stably and at high speed.

[0006] In addition, the present invention aims to perform welding processes in three-dimensional substrates stably and at high speed.

[0007] An installation apparatus according to one aspect of the present invention includes: a worktable supporting a stereolithography substrate; a mounting head mounting a component onto the stereolithography substrate; and a management device controlling the worktable to make the surface of the stereolithography substrate at the mounting position of the component horizontal, and controlling the mounting head to mount the component at the mounting position. The installation apparatus sets the rotational speed of the worktable to make the surface of the stereolithography substrate at the mounting position of the component horizontal based on component data, the component data including at least one of the size, height, weight of the component, and the ratio of the area of ​​the component to which solder paste is applied to the ground plane between the component and the surface of the stereolithography substrate.

[0008] Additionally, as another aspect of the present invention, a laser irradiation apparatus includes: a worktable supporting a three-dimensional substrate; a laser head irradiating a paste solder held on a component mounted on the three-dimensional substrate; and a management device controlling the worktable to make the surface of the three-dimensional substrate at the mounting position of the component horizontal, and controlling the laser head to irradiate the paste solder at the mounting position with laser. The laser irradiation apparatus sets the rotational speed of the worktable to make the surface of the three-dimensional substrate at the mounting position of the component horizontal based on component data, the component data including at least one of the size, height, weight of the component, and the ratio of the area where the paste solder is applied to the surface of the component relative to the ground plane of the component and the surface of the three-dimensional substrate.

[0009] The effects of the invention

[0010] According to the present invention, mounting processes in a three-dimensional substrate can be performed stably and at high speed.

[0011] Furthermore, according to the present invention, welding processes in three-dimensional substrates can be performed stably and at high speed. Attached Figure Description

[0012] Figure 1 This is a perspective view showing the substrate and components involved in the embodiment.

[0013] Figure 2 This is a perspective view showing the tray that supports the substrate according to the embodiment.

[0014] Figure 3 This is an exploded perspective view showing the substrate and tray involved in the embodiment.

[0015] Figure 4 This is a diagram schematically illustrating a production system for an electronic device involved in an embodiment.

[0016] Figure 5 This is a top view schematically illustrating the mounting device involved in the embodiment.

[0017] Figure 6 This is a perspective view showing the tray and workbench involved in the implementation method.

[0018] Figure 7 This is a schematic diagram illustrating the mounting head involved in the implementation method.

[0019] Figure 8 This is a diagram used to explain the substrate data and NC data involved in the implementation method.

[0020] Figure 9 This diagram is used to illustrate the control method of the workbench.

[0021] Figure 10 This is a diagram that schematically illustrates the structure of the management device involved in the implementation method.

[0022] Figure 11 This is a flowchart illustrating the installation process involved in the implementation method.

[0023] Figure 12 This is a flowchart illustrating the laser welding process involved in the implementation method.

[0024] Figure 13 This is a flowchart illustrating another example of the laser welding process involved in the implementation method. Detailed Implementation

[0025] Below, refer to the appendix. Figure 1 This embodiment will be described below. In this embodiment, an XYZ orthogonal coordinate system is defined, and the positional relationships of each part will be explained with reference to this XYZ orthogonal coordinate system. This XYZ orthogonal coordinate system is a relative orientation set with respect to the manufacturing system of the mounting device, laser irradiation device, and electronic device exemplified in this invention. The direction of the X-axis, which is parallel to the defined plane, is defined as the X-axis direction. The direction of the Y-axis, which is parallel to the defined plane and orthogonal to the X-axis, is defined as the Y-axis direction. The direction of the Z-axis, which is parallel to the defined plane and orthogonal to the defined plane, is defined as the Z-axis direction. The direction of rotation or tilting centered on the X-axis direction is defined as the θX direction. The direction of rotation or tilting centered on the Y-axis direction is defined as the θY direction. The direction of rotation or tilting centered on the Z-axis direction is defined as the θZ direction. In this embodiment, the defined plane is parallel to the horizontal plane. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. Furthermore, the above-mentioned "the defined plane is parallel to the horizontal plane" does not mean that the defined plane is only parallel to the horizontal plane. In this embodiment, the specified surface may also be inclined relative to the horizontal plane. Furthermore, in this embodiment, the specified surface, including the X-axis and Y-axis, is appropriately referred to as the XY plane.

[0026] [Substrate]

[0027] Figure 1 This is a perspective view showing the substrate 1 and component 2 according to the embodiment. In this embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may also include corners. Protrusions may also be provided on the surface of the substrate 1.

[0028] A circuit is disposed on the surface of substrate 1. In this embodiment, substrate 1 is formed by in-mold forming technology. Substrate 1 includes: a substrate 1A having a curved surface; and a thin film 1B bonded to the surface of substrate 1A. Thin film 1B is flexible. Thin film 1B contains a circuit. The circuit includes electrodes such as pads and spacers. The positions (planar coordinates) of each electrode in thin film 1B are known. The surface of substrate 1 includes the surface of thin film 1B.

[0029] Component 2 contains electronic components. Figure 1 Only one component 2 is shown in the illustration, but in this embodiment, it is envisioned that multiple components 2 be mounted on a substrate 1. Furthermore, the multiple components 2 include various types of components 2 with different sizes, heights, weights, and materials. Component 2 can be a leaded electronic component with leads protruding from its body. Component 2 can also be a chip-type electronic component without leads. Electronic devices are manufactured by mounting components 2 on the surface of the substrate 1.

[0030] [tray]

[0031] Figure 2 This is a perspective view showing the tray 3 that supports the substrate 1 according to the embodiment. Figure 3 This is an exploded perspective view showing the substrate 1 and tray 3 according to the embodiment. The tray 3 supports the substrate 1. In this embodiment, the substrate 1 is processed with the substrate 1 supported on the tray 3. The tray 3 has: a support member 4 that supports the substrate 1; and a clamping mechanism 5 that fixes the substrate 1.

[0032] The support member 4 includes: a base portion 4A that supports the substrate 1 from the -Z side; a protective portion 4B that is respectively disposed on the +Y side and the -Y side of the base portion 4A; and a plurality of pin portions 4C that support the substrate 1 from the +Y side and the -Y side.

[0033] The base portion 4A is a plate-shaped part with multiple openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper and lower surfaces of the base portion 4A.

[0034] The protective part 4B is longer in the X-axis direction. A pair of protective parts 4B are provided. The pair of protective parts 4B are separated from each other in the Y-axis direction. One protective part 4B protrudes from the end on the +Y side of the upper surface of the base part 4A toward the +Z side. The other protective part 4B protrudes from the end on the -Y side of the upper surface of the base part 4A toward the +Z side.

[0035] Multiple pins 4C each protrude from the upper surface of the base portion 4A toward the +Z side. A portion of the pins 4C are disposed on the +Y side relative to the center of the base portion 4A. A portion of the pins 4C are disposed on the -Y side relative to the center of the base portion 4A. The multiple pins 4C disposed on the +Y side relative to the center of the base portion 4A support the +Y side end of the substrate 1. The multiple pins 4C disposed on the -Y side relative to the center of the base portion 4A support the -Y side end of the substrate 1.

[0036] A clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes: a pair of support portions 5A that support the -X side end of the substrate 1; and a movable portion 5B that supports the +X side end of the substrate 1. The movable portion 5B is located on the upper surface of the base portion 4A and is movable in the X-axis direction. With the substrate 1 positioned between the support portions 5A and the movable portion 5B, the movable portion 5B moves in the -X direction, thereby clamping the substrate 1 between the support portions 5A and the movable portion 5B. The substrate 1 is clamped by the support portions 5A and the movable portion 5B, thereby being fixed to the tray 3.

[0037] In this embodiment, the tray 3 may also have an information medium 80. The information medium 80 stores substrate data related to the substrate 1. In this embodiment, the information medium 80 is a 2D barcode. Alternatively, the information medium 80 may be a 1D barcode. The information medium 80 may also be an RF tag. In this embodiment, the information medium 80 is mounted on a portion of the upper surface of the base portion 4A. The information medium 80 is configured not to overlap with the substrate 1.

[0038] [Production System]

[0039] Figure 4 This is a schematic diagram illustrating a production system 10 for an electronic device according to an embodiment. (See diagram below.) Figure 4 As shown, the production system 10 includes an installation device 12, a preheating device 13, a laser irradiation device 14, and a management device 16. An electronic equipment production line is constructed using the installation device 12, the preheating device 13, and the laser irradiation device 14.

[0040] Mounting device 12 mounts component 2 onto substrate 1. At least one mounting device 12 is provided in the production line. Alternatively, multiple mounting devices 12 may be provided.

[0041] Figure 5 This is a schematic top view of the mounting device 12 according to the embodiment. The mounting device 12 includes a base component 18, a conveying device 19, a worktable 20, a worktable moving device 21, a component supply device 22, a mounting head 24 including a suction nozzle 23, a substrate camera 25, a height sensor 26, a mounting head moving device 27, and a suction nozzle moving device 28 (see reference). Figure 7) and chamber 29.

[0042] The base component 18 supports the conveying device 19, the worktable 20, the worktable moving device 21, the component supply device 22, the mounting head 24, and the mounting head moving device 27.

[0043] The conveying device 19 transports the tray 3 supporting the substrate 1 in the X-axis direction. The conveying device 19 transports the tray 3 supplied to the mounting device 12 to the processing position of the mounting device 12. The processing position is defined in the conveying path of the conveying device 19.

[0044] The conveying device 19 includes: a conveyor belt 19A that conveys the pallet 3 in the X-axis direction; and a guide member 19B that guides the pallet 3.

[0045] Guide member 19B is longer in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are separated from each other in the Y-axis direction. One guide member 19B is positioned on the +Y side relative to tray 3. The other guide member 19B is positioned on the -Y side relative to tray 3.

[0046] The conveyor belt 19A is looped. A pair of conveyor belts 19A are provided. The conveyor belt 19A is supported on the guide member 19B via a drive pulley and a driven pulley. The conveyor belt 19A is suspended on the drive pulley and the driven pulley. One conveyor belt 19A is supported on one guide member 19B. The other conveyor belt 19A is supported on the other guide member 19B.

[0047] In a pair of conveyor belts 19A, the conveyor belt 19A located on the +Y side supports the +Y side end of the lower surface of the pallet 3. The conveyor belt 19A located on the -Y side supports the -Y side end of the lower surface of the pallet 3. The pallet 3 is conveyed in the X-axis direction by rotating the drive pulley via a drive motor (not shown).

[0048] By means of an actuator (not shown), one guide member 19B can move relative to another guide member 19B in the Y-axis direction. By separating one guide member 19B and the other guide member 19B in the Y-axis direction, the support of the pallet 3 by the conveyor belt 19A is thereby released.

[0049] Figure 6This is a perspective view showing the tray 3 and worktable 20 according to the embodiment. The worktable 20 supports the substrate 1 via the tray 3. The worktable 20 supports the tray 3, which is being transported to the processing position, from the -Z side. Two positioning members 20A are provided on the upper surface of the worktable 20. The positioning members 20A are inserted into holes 4D in the tray 3. The positioning members 20A are inserted into the holes 4D from the -Z side of the tray 3, thereby positioning the worktable 20 and the tray 3. A hook is provided at the upper end of the positioning member 20A. The hook is hooked onto the tray 3. The hook includes a ball that moves by air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the tray 3, the ball is hooked onto the tray 3, thereby fixing the worktable 20 and the tray 3.

[0050] The table moving device 21 moves the table 20. In this embodiment, the table moving device 21 moves the table 20 in the Y-axis direction, Z-axis direction, θX direction, and θY direction, respectively. The table moving device 21 includes: a Y-axis motor that generates power to move the table 20 in the Y-axis direction; a Z-axis motor that generates power to move the table 20 in the Z-axis direction; an θX motor that generates power to rotate the table 20 in the θX direction; and an θY motor that generates power to rotate the table 20 in the θY direction.

[0051] After the pallet 3 is conveyed to the processing position by the conveyor 19, the worktable 20 is moved in the +Z direction by the worktable moving device 21, thereby supporting the pallet 3 from below and transferring the pallet 3 from the conveyor 19 to the worktable 20. Next, the guide member 19B on the +Y side moves in the Y-axis direction to separate from the other guide member 19B, thereby releasing the support of the pallet 3 by the conveyor belt 19A. Furthermore, the worktable 20 supports the pallet 3 in the +Z direction, and the support of the pallet 3 by the conveyor belt 19A is released. With the pallet 3 supported on the worktable 20, the worktable moving device 21 can move the worktable 20 in the Z-axis direction, the θX direction, and the θY direction by moving the worktable 20 in the +Y direction to the center of the two guide members 19B.

[0052] When pallet 3 is transferred from worktable 20 to conveyor 19, worktable 20 moves in the -Y direction until one side of pallet 3 is on conveyor belt 19A. Meanwhile, guide member 19B on the +Y side moves in the -Y direction until the opposite side of pallet 3 is on conveyor belt 19A. After the hook at the upper end of positioning member 20A is released, worktable 20 is moved in the -Z direction by worktable moving device 21. As a result, the support of worktable 20 on pallet 3 is released, and pallet 3 is supported on conveyor belt 19A.

[0053] The component supply device 22 supplies components 2. The component supply device 22 includes multiple belt feeders. The belt feeders hold multiple components 2. The component supply device 22 supplies at least one of the multiple components 2 to the supply position. In this embodiment, the component supply device 22 is disposed on the -Y side of the conveying device 19. However, the configuration of the component supply device 22 is not limited to the above. The component supply device 22 may also be disposed on both the +Y side and the -Y side of the conveying device 19.

[0054] Mounting head 24 mounts component 2 onto substrate 1. Mounting head 24 supports multiple suction nozzles 23. Mounting head 24 mounts component 2 supplied from component supply device 22 onto substrate 1 by supporting component 2 via suction nozzles 23. Mounting head 24 is movable between a supply position and a processing position, supplying component 2 from component supply device 22 to the supply position and positioning substrate 1 at the processing position. Mounting head 24 holds component 2 supplied to the supply position via suction nozzles 23, and after moving to the processing position, mounts it onto the surface of substrate 1 positioned at the processing position.

[0055] The mounting head moving device 27 moves the mounting head 24. In this embodiment, the mounting head moving device 27 moves the mounting head 24 in both the X-axis and Y-axis directions. The mounting head moving device 27 includes an X-axis moving device 27X, which moves the mounting head 24 in the X-axis direction; and a Y-axis moving device 27Y, which moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. The mounting head 24 moves in the X-axis direction by the operation of the X-axis moving device 27X. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. The X-axis moving device 27X moves in the Y-axis direction by the operation of the Y-axis moving device 27Y, thereby moving the mounting head 24 in the Y-axis direction.

[0056] Figure 7 This is a schematic diagram illustrating the mounting head 24 according to the embodiment. (See diagram below.) Figure 7 As shown, the mounting head 24 has multiple suction nozzles 23. The suction nozzles 23 hold the component 2 in a manner that allows for the attachment and detachment of the component 2. The suction nozzle 23 is a suction nozzle for adsorbing and holding the component 2. An opening is provided at the lower end of the suction nozzle 23. The opening of the suction nozzle 23 is connected to a vacuum system. When the lower end of the suction nozzle 23 is in contact with the component 2, a suction action is performed from the opening at the lower end of the suction nozzle 23, thereby adsorbing and holding the component 2 at the lower end of the suction nozzle 23. Releasing the suction action from the opening releases the component 2 from the suction nozzle 23. Alternatively, the suction nozzle 23 may also be a clamping suction nozzle that holds the component 2 in place.

[0057] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in the Z-axis direction and the θZ direction, respectively. The nozzle moving device 28 is supported on the mounting head 24. The nozzle 23 is connected to the lower end of a shaft 23A. Multiple shafts 23A are provided. Multiple nozzles 23 are connected to multiple shafts 23A respectively. Multiple nozzle moving devices 28 are provided. Multiple nozzle moving devices 28 are connected to multiple shafts 23A respectively. The nozzle 23 is supported on the mounting head 24 via the shafts 23A and the nozzle moving device 28. The nozzle moving device 28 moves the shafts 23A in the Z-axis direction and the θZ direction, thereby moving the nozzle 23.

[0058] The suction nozzle 23 can move in the X-axis, Y-axis, Z-axis and θZ-axis directions respectively via the mounting head moving device 27 and the suction nozzle moving device 28. By moving the suction nozzle 23, the component 2 held by the suction nozzle 23 can also move in the X-axis, Y-axis, Z-axis and θZ-axis directions respectively.

[0059] The substrate camera 25 captures images of the substrate 1. In this embodiment, the substrate camera 25 captures images of the surface of the substrate 1 from the +Z side. The substrate camera 25 is mounted on the mounting head 24. The substrate camera 25 moves together with the mounting head 24 in the X-axis and Y-axis directions. For example, the substrate camera 25 can capture images of positioning marks provided on the surface of the substrate 1.

[0060] The height sensor 26 detects the height of the surface of the substrate 1 in the Z-axis direction. The height sensor 26 is disposed on the mounting head 24. The height sensor 26 moves together with the mounting head 24 in the X-axis and Y-axis directions. In this embodiment, the height sensor 26 is a laser positioning sensor. The height sensor 26 illuminates the surface of the substrate 1 with laser light from the +Z side of the substrate 1, and receives the laser light reflected from the surface of the substrate 1, thereby enabling the detection of the distance from the mounting head 24 to the substrate 1. By detecting the distance from the mounting head 24 to the substrate 1, the height of the surface of the substrate 1 is detected.

[0061] The chamber 29 has an internal space that accommodates the base component 18, the conveying device 19, the worktable 20, the worktable moving device 21, the component supply device 22, the mounting head 24, the mounting head moving device 27, and the suction nozzle moving device 28.

[0062] like Figure 4As shown, in this embodiment, the mounting device 12 includes a dispensing applicator 34 for applying solder paste to the substrate 1. The dispensing applicator 34 moves along the X-axis, Y-axis, and Z-axis directions respectively on the +Z side compared to the conveying device 19. The dispensing applicator 34 and the mounting head 24 can move independently. After the solder paste is applied to the surface of the substrate 1 by the dispensing applicator 34, the mounting head 2 is used to mount the component 2 onto the substrate 1. The mounting head 24 mounts the component 2 onto the substrate 1 with the solder paste applied. The substrate 1 with the component 2 mounted by the mounting device 12 is conveyed to the preheating device 13 in a fixed state on the tray 3.

[0063] The preheating device 13 reduces the liquid component of the paste solder applied to the substrate 1. The paste solder includes flux and metal solder balls dispersed in the flux. The preheating device 13 reduces the liquid component of the paste solder by vaporizing at least a portion of the liquid component as the flux is activated. The preheating device 13 includes: a base component 35; a conveying device 36 with a conveying tray 3; a heater 37 for heating the substrate 1; and a chamber 38.

[0064] The base component 35 supports the conveying device 36. The conveying device 36 conveys the tray 3, on which the base plate 1 is supported, in the X-axis direction. The conveying device 36 includes: a conveyor belt 36A that conveys the tray 3; and a guide component 36B that guides the tray 3.

[0065] Heater 37 heats substrate 1 so that at least a portion of the liquid component of flux in the solder paste vaporizes.

[0066] The chamber 38 has internal spaces that respectively house the base component 35, the conveying device 36 and the heater 37.

[0067] The preheating device 13 heats the substrate 1 supported by the tray 3 to reduce the liquid content of the solder paste. The preheating device 13 heats the substrate 1 at a temperature lower than the melting point of the solder paste. For example, the preheating device 13 heats the substrate 1 at a temperature of 80°C or higher and 100°C or lower for 10 minutes. The substrate 1, preheated by the preheating device 13, is then conveyed to the laser irradiation device 14 while fixed to the tray 3.

[0068] The laser irradiation device 14 irradiates a paste solder with a laser to melt the paste solder. The laser irradiation device 14 includes: a base component 39; a conveying device 40 with a conveying tray 3; a worktable 41 with a supporting tray 3; a worktable moving device 42 for moving the worktable 41; a laser head 43 for emitting a laser; and a cavity 44.

[0069] The base component 39 supports the conveying device 40, the worktable 41, the worktable moving device 42, and the laser head 43. The conveying device 40 transports the tray 3, which supports the substrate 1, in the X-axis direction. The conveying device 40 includes: a conveyor belt 40A that transports the tray 3; and a guide component 40B that guides the tray 3. The construction and function of the conveying device 40 are substantially the same as those of the conveying device 19.

[0070] The worktable 41 supports the tray 3 from the -Z side. The worktable moving device 42 moves the worktable 41 in the Y-axis direction, Z-axis direction, θX direction, and θY direction, respectively. The structure and function of the worktable 41 are substantially the same as those of the worktable 20.

[0071] The laser head 43 irradiates the paste solder with a laser, causing the paste solder to melt. The laser head 43 moves in the X-axis, Y-axis and Z-axis directions respectively on the +Z side compared with the conveying device 40.

[0072] The chamber 44 has an internal space that accommodates the base component 39, the conveying device 40, the worktable 41, the worktable moving device 42, and the laser head 43.

[0073] In the laser irradiation apparatus 14, a laser beam emitted from the laser head 43 irradiates the paste solder. The laser heats the paste solder, causing it to melt. The molten paste solder is then cooled, thereby soldering the component 2 to the substrate 1. In this embodiment, the paste solder is irradiated with a laser after the liquid content of the paste solder has decreased in the preheating apparatus 13. Since the paste solder 90 is irradiated with a laser while the liquid content of the paste solder has decreased, solder balls generated by sudden boiling of the paste solder are suppressed.

[0074] When the tray 3 has an information medium 80, a reading device 101 can be installed on the mounting device 12, a reading device 102 on the preheating device 13, and a reading device 103 on the laser irradiation device 14. The reading device 101 reads the substrate data stored in the information medium 80. If the information medium 80 is a QR code, the reading device 101 is a QR code reader / writer. If the information medium 80 is an RF tag, the reading device 101 is an RFID reader / writer. Similarly, the reading devices 102 and 103 each read the substrate data stored in the information medium 80.

[0075] [Substrate data and NC data]

[0076] Figure 8This diagram illustrates the substrate data and NC data involved in the embodiment. The substrate data may be stored, for example, in the information medium 80, or in storage devices provided in each of the mounting device 12, the preheating device 13, and the laser irradiation device 14, or via a network in the storage device 49 of the management device 16 (described later) or in external storage devices such as storage devices on a server that manages the production system 10. In this embodiment, the case where the substrate data is stored in the information medium 80 will be described.

[0077] The substrate data includes the mounting position Pp (xp, yp, zp) of component 2 on the surface of substrate 1. Additionally, the substrate data includes, for example, the normal vector (u, v, w) of the surface of substrate 1 at mounting position Pp, surface data of the surface of substrate 1, and texture data of the circuit pattern on the surface data. The substrate data is represented by a substrate coordinate system (Xp, Yp, Zp) with the substrate coordinate reference point Pr fixed to substrate 1 or tray 3 as the origin. In addition to the above, the substrate data also includes the component number to be mounted, the position of the solder pads for applying solder paste, preheating temperature, preheating time, laser power, and laser irradiation time, and is used in various devices of the production line.

[0078] The worktable 20 is used in the mounting device 12. The mounting device 12 is a 3D mounting device. The worktable 20 is capable of rotating while supporting the substrate 1. The worktable 20 is capable of rotating in the θX direction with the rotation axis Xt as its center. The worktable 20 is capable of rotating in the θY direction with the rotation axis Yt as its center. The worktable 20 supports the substrate 1 via the tray 3. If the worktable 20 rotates in the θX and θY directions with the rotation axes Xt and Yt as its centers and the substrate 1 tilts, then the mounting position Pp rotates with the rotation axes Xt and Yt as its centers. The rotation axes Xt and Yt are orthogonal.

[0079] A mechanical coordinate system (Xm, Ym, Zm) is defined in the mounting device 12. This system is fixed to the mounting device 12 and serves as the reference for the movement of the mounting head 24. The origin of the mechanical coordinate system can be located at any position on the mounting device 12. If the worktable 20 rotates about the rotation axes Xt and Yt in the θX and θY directions respectively, and the substrate 1 tilts, then the mounting position Pp rotates about the rotation axes Xt and Yt. The mounting position Pm (xm, ym, zm) in the mechanical coordinate system of the rotated mounting position Pp is calculated, and using this mounting position Pm (xm, ym, zm), the substrate camera 25, height sensor 26, and nozzle 23 of the mounting head 24 move. The mounting position Pm (xm, ym, zm) in the mechanical coordinate system and the rotation angle of the worktable 20 are stored as NC data and used as the command position for the drive system motor when the mounting device 12 operates. Similarly, NC data is created and used in each device on the production line other than the mounting device 12. Since the NC data is calculated based on mechanism parameters such as the positions of the rotation axes Xt and Yt of the worktable 20, the NC data in each device is different.

[0080] Figure 9 This diagram illustrates the control method for the worktable 20. If the worktable 20 rotates around the rotation axis Rm, the substrate 1 and the substrate coordinate system also rotate. If the worktable 20 moves vertically in the Z-axis direction, the substrate 1 and the substrate coordinate system also move vertically. Therefore, using data on the rotation angle and vertical movement of the worktable 20, the position of the rotation axis of the worktable 20, and the position of the rotation axis of the worktable 20 and the origin of the substrate coordinate system, the mounting position Pp (xp, yp, zp) is transformed into the mounting position Pm (xm, ym, zm) in the mechanical coordinate system. Furthermore, the position in the mechanical coordinate system can also be transformed into the position in the substrate coordinate system based on the control values ​​of the worktable 20.

[0081] As described above, by rotating and moving the stage 20 in the mounting device 12, the surface of the substrate 1 at the mounting position Pm can be made horizontal. The structure and function of the stage 20 of the mounting device 12 are substantially the same as those of the stage 41 of the laser irradiation device 14. Therefore, in the laser irradiation device 14, the stage 41 can also be rotated and moved through the same process as described above, thereby making the surface of the substrate 1 at the laser irradiation position horizontal.

[0082] [Management Device]

[0083] Figure 10This is a schematic diagram illustrating the structure of the management device 16 according to the embodiment. The management device 16 controls the production line. The management device 16 may be present in the mounting device 12, the preheating device 13, and the laser irradiation device 14, or it may be present separately via a network. The management device 16 includes a computer system.

[0084] The management device 16 has at least one processor 47, main memory 48, storage 49, and interface 50. The processor 47 is a CPU (Central Processing Unit). The main memory 48 includes non-volatile memory such as ROM (Read Only Memory) and volatile memory such as RAM (Random Access Memory). Examples of storage devices 49 include hard disk drives (HDDs), solid-state drives (SSDs), magnetic disks, optical disks, CD-ROMs, and DVD-ROMs. The interface 50 includes input / output circuitry. The functions of the processor 47 are stored as programs in the storage device 49. The processor 47 reads the program from the storage device 49, expands it to the main memory 48, and executes the program. Furthermore, the program can also be transmitted to the management device 16 via a network.

[0085] [Installation Process]

[0086] Figure 11 This is a flowchart illustrating the installation process involved in the embodiment. The substrate 1 is fixed to the tray 3. In this embodiment, the substrate data of the substrate 1 fixed to the tray 3 is stored in the information medium 80. If the information medium 80 is a QR code, a QR code representing the substrate data may be installed on the tray 3, and only the identification number is stored in the information medium 80 held on the tray 3, referring to the substrate data stored in the storage 49 of the management device 16 or on the server that manages the production system 10.

[0087] In this embodiment, a tray 3, on which the information medium 80 is mounted, is conveyed to the mounting device 12 while supporting the substrate 1. The reading device 102 reads the information medium 80 mounted on the tray 3, thereby the management device 16 obtains the substrate data of the substrate 1 (step SA1). The substrate data of the substrate 1 conveyed to the mounting device 12 includes coordinate data of the mounting position on the surface of the substrate 1, data of the component 2 being mounted, and the position of the solder pads, etc. The data of the component 2 includes the component number, type, size, height, weight, etc., of the component 2. Depending on the type of component 2, conditions such as the ratio of the area to the ground plane where solder paste is applied may vary.

[0088] The management device 16 sets the rotation speed of the worktable 20 based on data about the component 2, such as its size, height, weight, and the ratio of the area to which solder paste is applied to the ground plane. The rotation speed of the worktable 20 can also be set based on the sum of the size, height, weight, and ratio of the area to which solder paste is applied to the ground plane, each with a predetermined weighting coefficient. The rotation speed of the worktable 20 can be set to three speeds: high, medium, and low; two or more speeds; or no speed at all.

[0089] The management device 16 sets the rotation speed of the worktable 20 for each component 2 (step SA2). In this embodiment, it is set to any of the high, medium, and low speeds shown in Table 1 below. Furthermore, the management device 16 sets the order of the mounting components 2 based on the set rotation speed of the worktable 20 (step SA3). At this time, the settings are performed in order from high speed to low speed of the worktable 20. In this embodiment, the rotation speed is set using three levels: high, medium, and low. Therefore, the order of multiple components 2 set to the same rotation speed level is arbitrary. For example, it can be set from the center of the surface of the substrate 1 towards the outer periphery to minimize the rotation of the worktable 20 or the movement of the mounting head 24.

[0090] [Table 1]

[0091] Next, the applicator 34 of the mounting device 12 creates NC data using substrate data and mechanism parameters read from the information medium 80 by the reading device 102, and applies solder paste to the substrate 1 based on the created NC data. The applicator 34 applies solder paste to the pad positions of the components to be mounted at the mounting position Pp (step SA4). The application of solder paste is repeated for all components 2 to be mounted on the substrate 1.

[0092] After applying solder paste to the substrate 1, the management device 16 sets the execution number i to i = 1 and begins the loop process (step SA5). During the loop process, while i ≤ n, the process from step SA6 to step SA7 is repeated n times. Furthermore, n is the number of components 2 to be mounted on the substrate 1, and i is the order in which the components 2 are mounted, as set in step SA3.

[0093] The management device 16 controls the worktable 20 so that the surface of the substrate 1 at the mounting position Pp of the i-th component 2 becomes horizontal. At this time, the management device 16 controls the worktable 20 to rotate and move at the rotational speed set for the i-th component 2 in step SA2 (step SA6). The worktable 20 is controlled based on NC data created by reading substrate data and mechanism parameters from the information medium 80 by the reading device 104. The management device 16 controls the mounting head 24 to mount the component 2 onto the substrate 1 supported by the worktable 20. The mounting head 24 is controlled based on the NC data. The mounting head 24 mounts the component 2 at the mounting position Pp (step SA7).

[0094] In the loop process, the management device 16 resets the execution number i to i = i + 1 and returns to step SA6. The process from step SA6 to step SA7 is executed n times. If all components 2 are installed at their respective designated positions on the substrate 1, the loop process ends (step SA8). Furthermore, the application of solder paste and the installation of components can be performed by applying solder paste to all areas and then installing all n components 2 in a concentrated manner, or the application of solder paste and the installation of component 2 can be repeated for each component 2.

[0095] [Preheating treatment]

[0096] After component 2 is mounted on substrate 1, tray 3 is conveyed to preheating device 13 while supporting substrate 1. Reading device 103 reads information medium 80 mounted on tray 3. Preheating device 13 preheats the paste solder applied to substrate 1 based on the preheating temperature and preheating time of substrate data read from information medium 80 by reading device 103.

[0097] [Laser welding process]

[0098] Figure 12 This is a flowchart illustrating the laser welding process involved in the embodiment. After the solder paste is preheated, the tray 3 is conveyed to the laser irradiation device 14 in a state supporting the substrate 1. The reading device 104 reads the information medium 80 mounted on the tray 3, thereby the management device 16 obtains the substrate data of the substrate 1 (step SB1). The substrate data of the substrate 1 conveyed to the laser irradiation device 14 includes coordinate data of the mounting position on the surface of the substrate 1, data of the component 2 being mounted, and the position of the soldering pads, etc. The data of the component 2 includes the component number, type, size, height, weight, etc. Depending on the type of component 2, conditions such as the ratio of the area where the solder paste is applied to the ground plane may vary. In addition, the substrate data includes laser irradiation conditions such as laser power and laser irradiation time.

[0099] The management device 16 sets the rotation speed of the worktable 41 based on data about the component 2, such as its size, height, weight, and the ratio of the area to which solder paste is applied to the ground plane. The rotation speed of the worktable 41 can be set, for example, based on the sum of the size, height, weight, and ratio of the area to which solder paste is applied to the ground plane, each with a predetermined weighting coefficient. The rotation speed of the worktable 41 can be set to three levels: low, medium, and high; two or more levels; or no levels.

[0100] The management device 16 sets the rotation speed of the worktable 41 for each component 2 (step SB2). In this embodiment, it is set to any of the low, medium, and high speeds shown in Table 2 below. Furthermore, the management device 16 sets the order in which the laser irradiates the solder paste corresponding to the component 2 based on the set rotation speed of the worktable 41 (step SB3). At this time, the setting is performed in order from low to high rotation speed of the worktable 41. In this embodiment, the rotation speed is set using three levels: low, medium, and high. Therefore, the order among multiple components 2 set to the same rotation speed level is arbitrary. For example, it can be set from the center of the surface of the substrate 1 towards the outer periphery to minimize the rotation of the worktable 41 or the movement of the laser head 43.

[0101] [Table 2]

[0102] Next, the management device 16 sets the execution number j to j=1 and begins the loop process (step SB4). During the loop process, while j≤n is true, the process from step SB5 to step SB6 is repeated n times. Furthermore, n is the number of components 2 mounted on the substrate 1, and j is the order of laser irradiation set in step SB3.

[0103] The management device 16 controls the worktable 41 to make the surface of the substrate 1 at the location where the j-th component 2 is mounted horizontal. At this time, the management device 16 controls the worktable 41 to rotate and move at the rotational speed set for the j-th component 2 in step SB2 (step SB5). The worktable 41 is controlled based on NC data created by reading substrate data and mechanism parameters from the information medium 80 by the reading device 104. The management device 16 controls the laser head 43 to irradiate the paste solder applied to the area where the j-th component 2 is mounted on the substrate 1 with a laser. The laser head 43 is controlled based on the NC data. By irradiating the laser head 43 with a laser, the paste solder melts, and by cooling, the component 2 is soldered to the substrate 1 (step SB6).

[0104] NC data is created for component mounting so that the surface of substrate 1 at component 2's mounting position Pp is horizontal. However, the surface of substrate 1 can also be tilted during laser irradiation, within a range where the component's position will not shift due to gravity. By intentionally tilting the surface of substrate 1 during laser irradiation, the direction of laser reflection from the solder surface can be restricted, preventing substrate 1 from burning. The tilt angle is determined by the weight of component 2 and the adhesive force of the solder paste, and is pre-stored in the substrate data.

[0105] In the loop process, the management device 16 resets the execution number j to j = j + 1 and returns to step SB5. The process from step SB5 to step SB6 is executed n times. If all components 2 on the substrate 1 have been soldered, the loop process ends (step SB7).

[0106] [Another example of laser welding]

[0107] Figure 13 This is a flowchart illustrating another example of the laser welding process involved in the implementation method. Furthermore, in Figure 13 In the processing shown, regarding the relationship with Figure 12 The common processes shown are appropriately omitted from the description. Figure 13 In the example shown, it is used in the mounting device 12 Figure 11 The flowchart shown illustrates the data used in the processing. Specifically, during the installation process in the mounting device 12, the rotation speed of the worktable 20 corresponding to each component 2 and the order of the mounting components 2 are pre-stored in the information medium 80. After the solder paste is preheated, the tray 3 is conveyed to the laser irradiation device 14 in a state supporting the substrate 1. The reading device 104 reads the information medium 80 mounted on the tray 3, thereby the management device 16 obtains substrate data and the rotation speed of the worktable 20 and the order of the mounting components 2 set in the mounting device 12 (step SC1) regarding the substrate 1.

[0108] Next, the management device 16 sets the execution number i to i = n and begins the loop process (step SC2). During the loop process, while i ≥ 1, the processes from step SC3 to step SC4 are repeated n times. Furthermore, n is the number of components 2 mounted on the substrate 1, and i is determined by... Figure 11 The sequence of mounting components 2 is set in step SA3 shown below. That is, as shown in Table 3 below, in... Figure 13 In the process shown, the worktable 41 is rotated at the same speed as the worktable 20 when the component 2 is installed, and the paste solder is irradiated with laser in the reverse order of the order of the component 2 installation.

[0109] [Table 3]

[0110] The management device 16 controls the worktable 41 so that the surface of the substrate 1 in the i-th component 2 of the reverse sequence becomes horizontal. At this time, the management device 16 controls the worktable 41 to pass through the i-th component 2 of the reverse sequence. Figure 11 The rotation and movement are performed at the rotation speed set in step SA3 (step SC3). The worktable 41 is controlled based on NC data created by reading substrate data and mechanism parameters from the information medium 80 by the reading device 104. The management device 16 controls the laser head 43 to irradiate the paste solder applied to the area on which the i-th component 2 is mounted in reverse order on the substrate 1. The laser head 43 is controlled based on the NC data. By irradiating the laser head 43 with laser, the paste solder melts and, through cooling, solders the component 2 to the substrate 1 (step SC4).

[0111] In the loop process, the management device 16 resets the execution number i to i = i - 1 and returns to step SC3. The process from step SC3 to step SC4 is executed n times. If all components 2 on the substrate 1 have been soldered, the loop process ends (step SC5).

[0112] [Effect]

[0113] As described above, according to this embodiment, the rotation speed of the worktable 20 when rotating to set the mounting position of the component 2 to a horizontal orientation can be set based on component data. This component data includes at least one of the following: the size, height, weight of the component 2 mounted on the surface of the substrate 1 supported by the worktable 20, and the ratio of the area covered by solder paste to the contact area between the component 2 and the surface of the substrate 1. Therefore, in a substrate 1 where multiple components 2 are mounted, when several components 2 are already mounted and held in place by the adhesive force of the solder, the displacement or detachment of the components 2 can be suppressed when the worktable 20 rotates, enabling stable and high-speed mounting.

[0114] Furthermore, according to this embodiment, the rotation speed of the worktable 41 when rotating to set the mounting position of the component 2 to a horizontal orientation can be set based on component data. This component data includes at least one of the following: the size, height, weight of the component 2 mounted on the surface of the substrate 1 supported by the worktable 41, and the ratio of the area where solder paste is applied to the contact area between the component 2 and the surface of the substrate 1. Therefore, in a substrate 1 with multiple components 2 mounted, where soldering is not yet complete and several components 2 are still held together solely by the adhesive force of the solder, the rotation of the worktable 41 can suppress the offset or detachment of the components 2, enabling stable and high-speed soldering.

[0115] [Other Implementation Methods]

[0116] The embodiments of this application have been described above, but the present invention is not limited to these embodiments. The above-described embodiments and variations can be appropriately combined without contradicting the processing content. Furthermore, the aforementioned structural elements include elements of substantially the same, so-called equal scope, which can be easily conceived by those skilled in the art. Moreover, the aforementioned structural elements can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of structural elements can be made without departing from the spirit of the aforementioned embodiments.

[0117] For example, in this embodiment, the rotation speed of the worktable 20 corresponding to each component 2 is set for all components 2 to be mounted on the substrate 1, and the installation order of all components 2 is predetermined. However, the rotation speed of the worktable 20 when installing the next component 2 can also be set based on the component data of the already installed components 2. That is, the rotation speed of the worktable 20 is set to match the component 2 among the multiple already installed components 2 that should result in the slowest rotation speed of the worktable 20.

[0118] Furthermore, for example, in this embodiment, the rotation speed of the worktable 41 corresponding to each component 2 to be welded to the substrate 1 is set for all components 2, and the laser irradiation sequence corresponding to all components 2 is preset. However, the rotation speed of the worktable 41 when welding the next component 2 can also be set based on the component data of the components 2 that have not yet been welded among the installed components 2. That is, the rotation speed of the worktable 41 is set to match the component 2 among the multiple components 2 that have not yet been welded, so that the rotation speed of the worktable 41 should be the slowest.

[0119] Alternatively, tray 3 may not have information medium 80, but instead reference substrate data stored in storage device 49 of management device 16 or storage device on a server that manages production system 10. In this case, reading devices 101, 102, and 103 are not required in mounting device 12, preheating device 13, and laser irradiation device 14, nor is a reading operation for obtaining substrate data from information medium 80 necessary. That is, when substrate data is stored in storage devices or storage devices 49 of mounting device 12, preheating device 13, and laser irradiation device 14, or in external storage devices, the mounting process, preheating process, and laser welding process shown in the embodiment do not involve reading from information medium 80, but rather obtaining substrate data by referring to the substrate data from that storage device.

[0120] Furthermore, all or part of the processes described in the above embodiments that are set to be performed automatically can be performed manually, or all or part of the processes described in the manual processes can be performed automatically using known methods. In addition, the processing order, specific names, and information including various data and parameters shown in the above documents and figures can be arbitrarily changed, unless specifically described otherwise. For example, the various information shown in the figures is not limited to the information illustrated.

[0121] Furthermore, the structural elements of each device illustrated are functional conceptual structural elements and do not necessarily need to be constructed as shown in the physical diagram. That is, the specific method of distributing and merging the devices is not limited to the illustrated method; all or part of them can be distributed and merged in any unit, functionally or physically, according to various loads, usage conditions, etc. For example, the aforementioned management device 16 can be composed of multiple computers divided into several functions, and the functions of the computers can also be the functions of a cloud server that performs various functions through cloud computing.

[0122] The present invention includes the following methods.

[0123] (1) An installation device comprising: The worktable supports the three-dimensional substrate; A mounting head that mounts components on the stereolithography substrate; and A management device controls the worktable to make the surface of the three-dimensional substrate at the mounting position of the component level, and controls the mounting head to mount the component at the mounting position. The mounting device sets the rotational speed of the worktable to make the surface of the stereolithography substrate at the mounting position of the component horizontal, based on component data, which includes at least one of the component's size, height, weight, and the ratio of the area to which solder paste is applied to the component to the ground plane of the surface of the stereolithography substrate.

[0124] (2) According to the installation device described in (1), wherein, Based on the component data of the components already installed in the stereo substrate, the rotational speed of the worktable is set to make the surface of the stereo substrate horizontal at the installation position of the component to be installed next.

[0125] (3) According to the installation device described in (1), wherein, For multiple components mounted on the stereo substrate, the rotation speed of the worktable is set based on the respective component data, and the order in which the components are mounted is set based on the set rotation speed of the worktable.

[0126] (4) The installation device described in any one of (1) to (3), wherein, The components are configured to be installed in descending order of the rotation speed of the worktable.

[0127] (5) A manufacturing system for an electronic device, comprising: A tray that supports the three-dimensional substrate and has an information medium for storing substrate data, including the mounting positions of components on the surface of the three-dimensional substrate, the horizontal direction at the mounting positions, and component data; and The mounting apparatus described in any one of (1) to (4) applies solder paste to the three-dimensional substrate being transported in a state fixed to the tray, and mounts the component at the mounting position.

[0128] (6) An installation method comprising the following steps: Obtain substrate data, which includes the mounting position of a component on the surface of a three-dimensional substrate supported by a worktable, the horizontal direction at the mounting position, and component data, which includes at least one of the component's size, height, weight, and the ratio of the area of ​​the component coated with solder paste to the ground plane of the component and the surface of the three-dimensional substrate. Based on the component data, the rotation speed of the worktable is set when the surface of the three-dimensional substrate at the mounting position of the component is horizontal. The worktable is controlled based on the substrate data and the rotation speed to ensure that the surface of the three-dimensional substrate at the mounting position is horizontal; and With the surface of the three-dimensional substrate at the mounting position horizontal, the component is mounted at the mounting position using a mounting head.

[0129] (7) A method for manufacturing an electronic device, comprising the following steps: A paste solder is applied to the three-dimensional substrate; and The component is mounted on the three-dimensional substrate using the mounting method described in (6).

[0130] (8) A laser irradiation device, comprising: The worktable supports the three-dimensional substrate; A laser head that irradiates a paste-like solder that holds components mounted on the three-dimensional substrate with a laser; and A management device controls the worktable to make the surface of the three-dimensional substrate at the mounting position of the component level, and controls the laser head to irradiate the solder paste at the mounting position with a laser. The laser irradiation device sets the rotation speed of the worktable to make the surface of the stereolithography substrate at the mounting position of the component horizontal, based on component data, which includes at least one of the component's size, height, weight, and the ratio of the area to which solder paste is applied to the component to the ground plane of the surface of the stereolithography substrate.

[0131] (9) The laser irradiation apparatus described in (8), wherein, Based on component data of the unsoldered components among the components mounted on the stereolithography substrate, the rotational speed of the worktable is set to make the surface of the stereolithography substrate horizontal at the mounting position of the component held by the paste solder to be irradiated by the laser.

[0132] (10) The laser irradiation apparatus described in (8), wherein, For multiple components mounted on the three-dimensional substrate, the rotation speed of the worktable is set based on the respective component data, and the order in which the laser irradiates the solder paste of the component is set based on the set rotation speed of the worktable.

[0133] (11) The laser irradiation apparatus described in any one of (8) to (10), wherein, The components are configured to be installed in order of increasing rotation speed of the worktable.

[0134] (12) A manufacturing system for an electronic device, comprising: The tray supports the three-dimensional substrate and has an information medium for storing substrate data, which includes the mounting positions of components on the surface of the three-dimensional substrate, the horizontal direction at the mounting positions, and the component data. An installation device applies solder paste to the three-dimensional substrate, which is conveyed in a fixed state to the tray, and installs the component at the installation position; and The laser irradiation apparatus described in any one of (8) to (11) performs welding by irradiating a paste solder that holds the component mounted in the mounting apparatus with a laser.

[0135] (13) A laser irradiation method comprising the following steps: Obtain substrate data, which includes the mounting position of the component on the surface of the three-dimensional substrate supported by the worktable, the horizontal direction at the mounting position, and component data, which includes at least one of the component's size, height, weight, and the ratio of the area of ​​the component coated with solder paste to the ground plane of the component and the surface of the three-dimensional substrate. Based on the component data, the rotation speed of the worktable is set when the surface of the three-dimensional substrate at the mounting position of the component is horizontal. The worktable is controlled based on the substrate data and the rotation speed to ensure that the surface of the three-dimensional substrate at the mounting position is horizontal; and With the surface of the three-dimensional substrate at the mounting position horizontal, the component is soldered by irradiating a paste-like solder that holds the component at the mounting position with a laser.

[0136] (14) The laser irradiation method described in (13) includes the following steps: Obtain the rotational speed of the stage supporting the three-dimensional substrate when the component is mounted on the three-dimensional substrate; and The worktable is controlled based on the substrate data and the obtained rotation speed so that the surface of the three-dimensional substrate at the mounting position where the laser is irradiated becomes horizontal.

[0137] (15) A method for manufacturing an electronic device, comprising the following steps: A paste-like solder is applied to the three-dimensional substrate; The component is mounted on the stereo substrate; and The component is welded by the laser irradiation method described in (13) or (14).

[0138] This application is based on Japanese Patent Application No. 2023-168558, filed on September 28, 2023, and Japanese Patent Application No. 2023-168559, filed on September 28, 2023, the contents of which are incorporated herein by reference.

Claims

1. An installation device comprising: The worktable supports the three-dimensional substrate; A mounting head that mounts components on the stereolithography substrate; and A management device controls the worktable to make the surface of the three-dimensional substrate at the mounting position of the component level, and controls the mounting head to mount the component at the mounting position. The mounting device sets the rotational speed of the worktable to make the surface of the stereo substrate at the mounting position of the component horizontal, based on component data, which includes at least one of the component's size, height, weight, and the ratio of the area to which solder paste is applied to the component relative to the ground plane between the component and the surface of the stereo substrate.

2. The installation device according to claim 1, wherein, Based on the component data of the components already installed in the stereo substrate, the rotational speed of the worktable is set to make the surface of the stereo substrate horizontal at the installation position of the component to be installed next.

3. The installation device according to claim 1, wherein, For multiple components mounted on the stereo substrate, the rotation speed of the worktable is set based on the respective component data, and the order in which the components are mounted is set based on the set rotation speed of the worktable.

4. The installation device according to claim 3, wherein, The components are configured to be installed in descending order of the rotation speed of the worktable.

5. A manufacturing system for an electronic device, comprising: A tray that supports the three-dimensional substrate and has an information medium for storing substrate data, including the mounting positions of components on the surface of the three-dimensional substrate, the horizontal direction at the mounting positions, and component data; and The mounting apparatus according to any one of claims 1 to 4 applies a paste solder to the three-dimensional substrate being transported in a state fixed to the tray, and mounts the component at the mounting position.

6. An installation method comprising the following steps: Obtain substrate data, which includes the mounting position of a component on the surface of a three-dimensional substrate supported by a worktable, the horizontal direction at the mounting position, and component data, which includes at least one of the component's size, height, weight, and the ratio of the area of ​​the component coated with solder paste to the ground plane of the component and the surface of the three-dimensional substrate. Based on the component data, the rotation speed of the worktable is set when the surface of the three-dimensional substrate at the mounting position of the component is horizontal. The worktable is controlled based on the substrate data and the rotation speed so that the surface of the three-dimensional substrate at the mounting position becomes horizontal. as well as With the surface of the three-dimensional substrate at the mounting position horizontal, the component is mounted at the mounting position using a mounting head.

7. A method for manufacturing an electronic device, comprising the following steps: A paste solder is applied to the three-dimensional substrate; and The component is mounted on the three-dimensional substrate using the mounting method described in claim 6.

8. A laser irradiation device, comprising: The worktable supports the three-dimensional substrate; A laser head that irradiates a paste-like solder that holds components mounted on the three-dimensional substrate with a laser; and A management device controls the worktable to make the surface of the three-dimensional substrate at the mounting position of the component horizontal, and controls the laser head to irradiate the solder paste at the mounting position with a laser. The laser irradiation device sets the rotation speed of the worktable to make the surface of the stereolithography substrate at the mounting position of the component horizontal, based on component data, which includes at least one of the component's size, height, weight, and the ratio of the area to which solder paste is applied to the component relative to the ground plane between the component and the surface of the stereolithography substrate.

9. The laser irradiation device according to claim 8, wherein, Based on component data of the unsoldered components among the components mounted on the stereolithography substrate, the rotational speed of the worktable is set to make the surface of the stereolithography substrate horizontal at the mounting position of the component held by the paste solder to be irradiated by the laser.

10. The laser irradiation apparatus according to claim 8, wherein, For multiple components mounted on the three-dimensional substrate, the rotation speed of the worktable is set based on the respective component data, and the order in which the laser irradiates the solder paste of the component is set based on the set rotation speed of the worktable.

11. The laser irradiation apparatus according to claim 10, wherein, The components are configured to be installed in order of increasing rotation speed of the worktable.

12. A manufacturing system for an electronic device, comprising: The tray supports the three-dimensional substrate and has an information medium for storing substrate data, which includes the mounting positions of components on the surface of the three-dimensional substrate, the horizontal direction at the mounting positions, and the component data. An installation device applies solder paste to the three-dimensional substrate being conveyed in a fixed state on the tray, and installs the component at the installation position; as well as The laser irradiation apparatus according to any one of claims 8 to 11 performs welding by irradiating a paste solder that holds the component mounted in the mounting device with a laser.

13. A laser irradiation method comprising the following steps: Obtain substrate data, which includes the mounting position of the component on the surface of the three-dimensional substrate supported by the worktable, the horizontal direction at the mounting position, and component data, which includes at least one of the component's size, height, weight, and the ratio of the area of ​​the component coated with solder paste to the ground plane of the component and the surface of the three-dimensional substrate. Based on the component data, the rotation speed of the worktable is set when the surface of the three-dimensional substrate at the mounting position of the component is horizontal. The worktable is controlled based on the substrate data and the rotation speed so that the surface of the three-dimensional substrate at the mounting position becomes horizontal. as well as With the surface of the three-dimensional substrate at the mounting position horizontal, the component is soldered by irradiating a paste-like solder that holds the component at the mounting position with a laser.

14. The laser irradiation method according to claim 13, wherein, Includes the following steps: Obtain the rotational speed of the stage supporting the three-dimensional substrate when the component is mounted on the three-dimensional substrate; and The worktable is controlled based on the substrate data and the obtained rotation speed so that the surface of the three-dimensional substrate at the mounting position where the laser is irradiated becomes horizontal.

15. A method for manufacturing an electronic device, comprising the following steps: A paste-like solder is applied to the three-dimensional substrate; The component is mounted on the stereo substrate; and The component is welded using the laser irradiation method described in claim 13 or 14.

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