Windowing protruding type PCB press-fit finger structure and manufacturing and designing method thereof

Abstract

The invention provides a windowing protruding type PCB press-fit finger structure and a manufacturing and designing method of the windowing protruding type PCB press-fit finger structure. The method belongs to the technical field of flexible circuit board pressing processes. The method comprises the following steps: carrying out micro-bulge morphology etching treatment on a PCB substrate to generate a golden finger array, and carrying out solder mask layer windowing positioning according to the morphology parameters of the golden finger array to form a solder mask window matched with a bulge structure; performing lamination stress field simulation based on the morphology characteristics of the convex structure, and optimizing the distribution density and the embedding depth of the ACF anisotropic conductive film; gradient pressurizing and heating are carried out through pressing equipment, so that the conductive particles form controllable flattening deformation on a micro-bulge interface, and a pressing structure is generated; through micro-bulge morphology etching and accurate windowing of the solder mask layer, the problem that green oil permeates into golden finger gaps is effectively avoided, and the reliability of press-fit electrical connection is remarkably improved.

Description

Technical Field

[0001] This invention proposes a windowed protruding PCB pressing finger structure and its manufacturing design method, belonging to the field of flexible circuit board pressing technology. Background Technology

[0002] With the widespread application of display electronics in automotive, laptops, medical, and smart home fields, large-size display devices place higher demands on PCB and FPC connection technologies. Traditional PCB bonding finger structures, due to their planar design, are prone to solder mask seeping into the gaps between gold fingers, causing poor contact. Furthermore, they rely on high-pressure bonding, accelerating device aging, and the uncontrollable particle bursting leads to yield fluctuations. While existing technologies have proposed improvements such as windowed designs or the addition of ACF film, none have achieved a breakthrough in surface optimization for "cleaner windowing." They lack deep integration of precise control over micro-protrusion morphology, ACF particle embedding optimization, and stress field co-design, making it difficult to meet the requirements of high-density pin connections and intelligent bonding paradigms.

[0003] Against this backdrop, this invention proposes a manufacturing design method for a windowed protrusion type PCB lamination finger structure. It avoids solder mask penetration by using micro-protrusion morphology etching and solder mask window positioning technology; optimizes ACF distribution through stress field simulation to reduce mechanical pressure requirements; employs online particle burst state detection and adaptive alignment technology to improve lamination yield and positioning accuracy; and finally constructs a cognitive-level manufacturing model to achieve closed-loop synergy of "materials-process-performance," providing an innovative solution for PCB lamination technology. Summary of the Invention

[0004] This invention provides a windowed, raised PCB bonding finger structure and its manufacturing design method to solve the problems mentioned in the background art above: The present invention proposes a manufacturing and design method for a windowed, raised PCB bonding finger structure, the method comprising: S1. Perform micro-protrusion morphology etching on the PCB substrate to generate a gold finger array. Based on the morphology parameters of the gold finger array, perform solder mask window positioning to form a solder mask window that matches the protrusion structure. S2. Based on the morphological characteristics of the protruding structure, the stress field of the pressing is simulated to optimize the distribution density and embedding depth of the ACF anisotropic conductive adhesive film; gradient pressure heating is implemented through the pressing equipment to make the conductive particles form controllable flattening deformation at the micro-protrusion interface to generate the pressing structure. S3. Perform online detection of the bursting state of the conductive particles after compression to identify abnormal particles that are not broken or excessively broken; adjust the compression parameters based on the abnormal particle distribution data to generate an optimized particle embedding control strategy. S4. The three-dimensional morphology of the gold finger protrusion structure is reconstructed by laser interferometry to generate micron-level positioning feature data; adaptive alignment is performed with FPC pins based on the positioning feature data to control the FPC alignment deviation within ±15μm to meet the requirements of high-density pin connection. S5. Based on the morphological parameters of the pressed structure, the particle embedding state, and the positioning accuracy data, a cognitive-level manufacturing model is constructed. The etching process, ACF distribution, and pressing parameters are adjusted in real time through the model feedback to form a closed-loop manufacturing architecture that precisely controls the micro-protrusion morphology, optimizes ACF particle embedding, and coordinates stress field design.

[0005] The present invention proposes a windowed protruding PCB pressing finger structure, which is designed and formed by the design method described in any one of the above.

[0006] The beneficial effects of this invention are as follows: By etching the micro-protrusion morphology and precisely opening windows in the solder mask layer, the problem of solder mask seeping into the gaps between the gold fingers is effectively avoided, significantly improving the reliability of the lamination electrical connection. Simultaneously, by combining stress field simulation to optimize the ACF particle distribution, the dependence of the lamination process on high mechanical pressure is reduced, equipment wear and energy consumption are decreased, and equipment lifespan is extended. This solution also enables online detection and adaptive adjustment of the conductive particle bursting state, enhancing the stability of the lamination yield and reducing the risk of connection failure due to unbroken or excessively broken particles. Furthermore, laser interferometry technology ensures high-precision alignment between the gold finger protrusion structure and the FPC pins, meeting the requirements of high-density pin connections while avoiding contact problems caused by positioning deviations, thus improving overall product performance and market competitiveness. Attached Figure Description

[0007] Figure 1 This is a diagram illustrating the steps of the method described in this invention. Detailed Implementation

[0008] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0009] One embodiment of the present invention, such as Figure 1 As shown, a manufacturing and design method for a windowed, raised PCB bonding finger structure is provided, the method comprising: S1. The PCB substrate is subjected to micro-protrusion morphology etching to generate a gold finger array, which has a uniform protrusion structure; the solder mask layer is positioned according to the morphology parameters of the gold finger array to form a solder mask window that matches the protrusion structure, so as to prevent the green solder mask from penetrating into the effective contact area. S2. Based on the morphological characteristics of the protruding structure, the stress field of the pressing is simulated to optimize the distribution density and embedding depth of the ACF anisotropic conductive adhesive film; gradient pressure heating is implemented through the pressing equipment to make the conductive particles form controllable flattening deformation at the micro-protrusion interface to generate the pressing structure. The pressing structure has a stable electrical connection channel and reduces the mechanical pressure requirement. S3. Perform online detection of the bursting state of the conductive particles after compression to identify abnormal particles that are not broken or excessively broken; adjust the compression parameters according to the abnormal particle distribution data to generate an optimized particle embedding control strategy and improve the stability of compression yield. S4. The three-dimensional morphology of the gold finger protrusion structure is reconstructed by laser interferometry to generate micron-level positioning feature data; adaptive alignment is performed with FPC pins based on the positioning feature data to control the FPC alignment deviation within ±15μm to meet the requirements of high-density pin connection. S5. Based on the morphological parameters of the pressed structure, the particle embedding state, and the positioning accuracy data, a cognitive-level manufacturing model is constructed. The etching process, ACF distribution, and pressing parameters are adjusted in real time through the model feedback, forming a closed-loop manufacturing architecture for precise control of micro-protrusion morphology, optimization of ACF particle embedding, and collaborative design of stress field, thereby realizing a leap in intelligent pressing paradigm.

[0010] The working principle and effects of the above technical solution are as follows: This manufacturing design method significantly improves the stability of lamination yield and the positioning accuracy of gold fingers, controlling FPC alignment deviation to the micrometer level, meeting the requirements of high-density pin connections. It reduces equipment mechanical pressure requirements and manufacturing costs, decreases the amount of solder mask and cover film used, and lightens the PCB weight, facilitating mass production handling. It enhances the stability and reliability of product electrical connections, improves the controllability of the manufacturing process, and reduces abnormal situations such as conductive particles not breaking or breaking excessively. It avoids poor connections caused by solder mask seeping into the effective contact area, avoids yield fluctuations caused by improper lamination parameters, and avoids excessive wear and tear on equipment due to high-pressure requirements. It ensures a smooth and uniform appearance of the gold fingers, shortens production steps, improves efficiency, and achieves a dual improvement in lamination quality and production efficiency, promoting the intelligent upgrade of PCB and FPC connections.

[0011] In one embodiment of the present invention, S1 includes: S11. Select a high-flatness copper-clad laminate as the base material, perform surface cleaning and impurity removal treatment to remove the oxide layer and oil stains, and generate a clean base material surface. S12. High-precision photolithography is used to transfer the preset circuit pattern to the surface of a clean substrate to form a uniformly distributed resist layer pattern. S13. Implement a precise etching process to remove excess copper layers not covered by the resist layer, generating a gold finger array with micro-protrusion morphology. S14. Perform professional film removal treatment to completely remove any residual resist layer and fully expose the gold finger protrusion structure and copper circuit. S15. Based on the protrusion height and spacing parameters of the gold finger array, perform solder mask window positioning to form a solder mask window that perfectly matches the protrusion structure, thus isolating the path of green oil penetration into the effective contact area.

[0012] The working principle and effects of the above technical solution are as follows: This technical step significantly improves the uniformity and structural precision of the gold finger array, ensuring a precise fit between the solder mask window and the raised structure. It enhances the cleanliness of the PCB substrate surface, reducing interference from residual resist and excess copper layers, ensuring the integrity of the effective contact area of ​​the gold fingers. It prevents solder mask from seeping into the effective contact area, avoiding poor subsequent lamination connections due to uneven protrusions or surface impurities. It reduces the alignment difficulty of subsequent lamination processes and eliminates the need for additional solder mask cleaning. This not only lays a solid foundation for stable electrical connections but also improves the smoothness of the overall manufacturing process, ensuring consistent product connection performance from the source and reducing rework caused by initial process defects.

[0013] In one embodiment of the present invention, S2 includes: S21. Collect morphological feature data of the gold finger protrusion structure, perform pressure stress field simulation analysis, and optimize the distribution density and embedding depth parameters of the ACF anisotropic conductive adhesive film. S22. The optimized ACF anisotropic conductive adhesive film is evenly laid on the surface of the gold finger protrusion structure to ensure that the adhesive film is completely adhered to the top of the protrusion. S23. Start the pressing equipment to implement gradient pressurization and heating operation, and the temperature and pressure gradually increase to the preset threshold over time; S24. The conductive particles at the interface between the gold finger protrusion structure and the FPC undergo controllable flattening deformation under gradient stress. S25. The deformed conductive particles form a continuous and stable electrical connection channel at the contact interface, generating a press-fit structure with low pressure requirements.

[0014] The working principle and effects of the above technical solution are as follows: This technical step improves the controllability of the flattening and deformation of conductive particles, making the electrical connection channel formed at the contact interface more continuous and stable. It reduces the mechanical pressure requirements of the laminating equipment, minimizing wear and tear caused by long-term high-load operation. It enhances the adhesion between the ACF film and the gold finger protrusions, improving the accuracy of film distribution density and embedding depth, and reducing uneven distribution of conductive particles. It avoids insufficient deformation or excessive breakage of particles due to improper pressure or temperature parameters, preventing electrical connection interruptions or poor contact. It ensures stable and reliable electrical performance of the laminating structure, extends the service life of production equipment, makes the laminating process more efficient and controllable, and reduces subsequent rework caused by connection problems.

[0015] In one embodiment of the present invention, step S21 includes: S211. The gold finger protrusion structure is scanned in its entirety using three-dimensional laser scanning technology to collect morphological feature data, including protrusion height, spacing, and contour curvature; the collected morphological feature data is denoised and normalized to generate three-dimensional structural model data that conforms to simulation standards. S212. Import the three-dimensional structural model data into the simulation system, carry out compression stress field simulation analysis, and capture the stress transmission law under different distribution densities and embedding depths. S213. Compare the stress uniformity and the force state of conductive particles corresponding to different parameter combinations, and select the parameter range with balanced stress distribution and reasonable particle force. S214. Based on the selected parameter range, refine and adjust the distribution density gradient and embedding depth values ​​to form the optimized ACF anisotropic conductive film parameter configuration.

[0016] The working principle and effects of the above technical solution are as follows: This step significantly improves the accuracy of data acquisition for the morphological features of the gold finger, and noise reduction and normalization make the 3D structural model data more closely resemble actual working conditions. It enhances the reliability of the pressure stress field simulation analysis, and the captured stress transmission patterns are more consistent with real pressure scenarios. It reduces the blindness of ACF parameter configuration, minimizing time and material losses caused by repeated trial and error. It avoids stress concentration or uneven force distribution on conductive particles due to improper parameter matching, preventing connection breaks or poor contact in subsequent pressure bonding. It allows the distribution density and embedding depth of the ACF film to precisely match the gold finger protrusion structure, and ensures more balanced force distribution on conductive particles during subsequent pressure bonding, laying a solid foundation for stable electrical connection channels and further improving the controllability and consistency of the pressure bonding process.

[0017] In one embodiment of the present invention, S212 includes: Import the 3D structural model data into the simulation system, input the physical property parameters of the PCB substrate, gold fingers and ACF film, and generate the basic data of the lamination scene; Multiple combinations of ACF distribution density gradients and embedding depths are defined to form a variable matrix covering the range of key parameters; Start the simulation system to run the pressure stress field simulation and record the stress propagation time sequence data at the contact interface under each set of variables in real time; Spatial interpolation is performed on the collected time-series data to generate a continuous and complete stress field distribution map. The stress transmission paths and intensity changes corresponding to different variables are extracted from the stress field distribution map to summarize the stress transmission laws.

[0018] The working principle and effects of the above technical solution are as follows: This step improves the realism of the compression scenario simulation, and the input of multiple physical property parameters makes the basic data more consistent with actual working conditions. It enhances the comprehensiveness of stress field data acquisition, with multiple variable combinations covering the range of key parameters and reducing parameter blind spots. It improves the completeness of the stress field distribution map, with spatial interpolation filling data gaps and making the stress propagation sequence more coherent. It reduces the one-sidedness of the summary of stress transfer laws, avoiding deviations caused by insufficient variable settings or data breaks. It prevents the simulation results from deviating from the actual compression scenario, and avoids a lack of effective data support for subsequent parameter adjustments. It allows the simulation process to fully reproduce the real compression stress state and accurately captures the differences in stress changes under different parameters, providing a reliable basis for subsequent ACF parameter optimization and reducing the risk of parameter matching errors.

[0019] In one embodiment of the present invention, S3 includes: S31. Online visual inspection technology is used to perform a comprehensive scan of the conductive particles after compression to capture image data of the particle explosion state. S32. Analyze and filter the image data to identify abnormal particles that are not broken or are excessively broken, and count the number and distribution of abnormal particles. S33. Based on the abnormal particle distribution data, analyze the correlation between compression temperature and pressure and particle explosion state. S34. Adjust the pressing parameters in a targeted manner to generate an optimized particle embedding control strategy; S35. Re-implement the pressing operation according to the optimization strategy to improve the stability and consistency of the pressing yield.

[0020] The working principle and effects of the above technical solution are as follows: This step improves the timeliness and comprehensiveness of conductive particle burst state detection, and online visual scanning can quickly capture the true state of each particle. It enhances the accuracy of abnormal particle identification, and through data analysis and screening, clearly understands the quantity and distribution patterns of abnormal particles. It reduces the blindness of pressing parameter adjustments, and adjustments based on correlation patterns are more targeted. It reduces the fluctuation range of pressing yield, and the optimized control strategy makes the particle embedding state more stable. It avoids connection failures caused by undetected particle anomalies, avoids material and time losses due to repeated trial and error, and avoids large-scale quality problems in mass production. It can quickly locate the core correlation between pressing temperature and pressure and particle bursting, and continuously improve the pressing effect through dynamic parameter optimization, steadily improving product connection reliability and ensuring consistent quality in mass production.

[0021] In one embodiment of the present invention, S33 includes: Organize the abnormal particle distribution data and the corresponding temperature and pressure records of the pressing process to generate a one-to-one corresponding dataset. The datasets are classified and associated according to the particle explosion state, and divided into three data groups: normal fracture, no fracture, and excessive fracture. Calculate the mean and fluctuation range of temperature and pressure in each set of data, and generate parameter interval data corresponding to each state; By comparing the numerical differences of different state parameter ranges, we can observe the changing trend of particle explosion state when the temperature and pressure deviate from the normal range. Linear fitting was performed on each set of data to generate correlation curves between temperature, pressure, and particle explosion state, and the correlation patterns were extracted.

[0022] The working principle and effects of the above technical solution are as follows: This step improves the accuracy of extracting the correlation between temperature, pressure, and particle bursting state, making the core correlation hidden in the data clearer. It enhances the systematic nature of data analysis; classification and grouping make the parameter characteristics corresponding to different bursting states readily apparent. It reduces the one-sidedness of rule summarization by covering key influencing dimensions through mean fluctuation calculation and interval comparison. It lowers the trial-and-error cost of parameter adjustment, avoiding misjudgments of rules due to mixed data and preventing deterioration of the compression state caused by unfounded adjustments. It can accurately capture the change trajectory of particle bursting state when temperature and pressure deviate from the normal range, and can intuitively present the intrinsic relationship between the two through correlation curves, providing solid data support for targeted optimization of subsequent compression parameters, making particle embedding control more scientific, and further ensuring the stability of compression yield.

[0023] In one embodiment of the present invention, step S4 includes: S41. Use laser interferometry to perform a full-range scan of the gold finger protrusion structure and collect three-dimensional morphological data. S42. Process and analyze the three-dimensional topography data, extract the positioning feature information of the gold finger protrusion, and generate micron-level positioning data; S43. Compare and analyze the positioning feature data with the FPC pin data, and start the adaptive alignment adjustment mechanism. S44. Adjust the relative position of the FPC and the gold fingers in real time to control the alignment deviation within ±15μm; S45. Complete the precise docking of the FPC and the gold fingers to meet the precision requirements of high-density pin connections.

[0024] The working principle and effects of the above technical solution are as follows: This step significantly improves the comprehensiveness and accuracy of the three-dimensional topography data acquisition of the gold finger, and the micron-level positioning data makes the positioning features clearer and more identifiable. It enhances the adaptive adjustment capability of the FPC and gold finger alignment, stably controlling the alignment deviation within a very small range. It reduces the alignment difficulty of high-density pin connections, reduces operational errors caused by manual intervention, and reduces rework losses due to misalignment. It avoids signal transmission instability caused by pin contact misalignment, avoids connection failures in high-density connection scenarios, and avoids product scrapping due to excessive deviation. It can accurately match the connection requirements of the gold finger and FPC, and adapt to the fine connection scenarios of high-density pins, making the docking process more efficient and controllable, further ensuring the stability and reliability of the product's electrical connection, and meeting the stringent requirements of high-end display devices for precision connections.

[0025] In one embodiment of the present invention, S44 includes: Collect real-time alignment deviation data between the current FPC and the gold finger to determine the deviation value and direction; Decompose the deviation data according to the X-axis and Y-axis to generate bidirectional independent fine adjustment amounts; The precision adjustment mechanism is driven to perform micro-displacement compensation, gradually reducing the alignment deviation; Continuously collect deviation feedback data during the adjustment process and track the trend of deviation changes; Fine-tuning the compensation amount stabilizes the alignment deviation within the set range, achieving precise alignment.

[0026] The working principle and effects of the above technical solution are as follows: This step improves the accuracy of FPC and gold finger alignment adjustment, and the bidirectional independent fine adjustment allows for more targeted deviation correction. It enhances the real-time performance and stability of deviation control; continuous tracking of feedback data enables timely capture of deviation changes, avoiding adjustment lag. It reduces overshoot or insufficient correction during the adjustment process; the combination of gradual compensation and fine adjustment makes deviation convergence more stable. It reduces the probability of alignment deviation exceeding the set range, ensuring that connection accuracy always meets requirements. It avoids residual deviation caused by unidirectional adjustment, prevents pin contact misalignment due to improper adjustment, and avoids signal transmission failures in high-density connection scenarios. It can quickly respond to real-time alignment deviations and steadily reduce the deviation amplitude, ensuring a stable and accurate alignment state, laying a solid foundation for subsequent reliable connections, and adapting to the fine-tuning requirements of high-density pins.

[0027] In one embodiment of the present invention, step S5 includes: S51. Collect the morphological parameters, conductive particle embedding state, and positioning accuracy data of the press-fit structure, and integrate them to form a complete manufacturing dataset. S52. Construct a cognitive-level manufacturing model based on the manufacturing dataset, and establish a correlation mapping between various process parameters and product quality; the model provides real-time feedback data to adjust the parameter settings of the etching process and optimize the accuracy of the gold finger protrusion morphology. S53. Adjust the distribution of the anisotropic conductive adhesive film of ACF according to the feedback results to adapt to the optimized protrusion structure; simultaneously adjust the temperature and pressure parameters of the pressing equipment to achieve coordinated matching between the stress field and structural features. S54. A closed-loop manufacturing architecture is formed for precise control of micro-protrusion morphology ACF, particle embedding optimization and stress field collaborative design. S55, relying on a closed-loop architecture, realizes the intelligent upgrade of the pressing manufacturing mode, achieving efficient and stable intelligent pressing operations.

[0028] The working principle and effects of the above technical solution are as follows: This step improves the intelligence level of the manufacturing process and the precision of process adjustment, making the parameter matching of each link more consistent with product quality requirements. It enhances the synergistic linkage between etching process, ACF distribution, and lamination parameters, allowing for a benign fit between the gold finger protrusion morphology, particle embedding state, and stress field. It reduces reliance on manual intervention and trial-and-error costs, minimizes quality risks caused by parameter mismatches, and reduces defective losses in mass production. It avoids performance deviations caused by each process link operating independently, prevents excessive product quality fluctuations, and avoids production efficiency bottlenecks caused by insufficient intelligent upgrades. It can continuously optimize manufacturing details through real-time feedback and achieve iterative upgrades of the production mode through a closed-loop architecture, making lamination operations more efficient and stable, further improving product reliability and consistency in mass production, and driving the leap from traditional lamination manufacturing to an intelligent paradigm.

[0029] In one embodiment of the present invention, S52 includes: The complete manufacturing dataset is classified and organized into four major data modules: morphological parameters, particle embedding state, positioning accuracy, and process parameters. Key feature variables were extracted from each data module to screen the core process factors that affect the morphology of the gold finger protrusions. Establish the basic framework for a cognitive-level manufacturing model, integrating the correlation dimensions between feature variables and quality indicators; The model learns through multiple rounds of data iteration to uncover the intrinsic relationship between process parameters and the accuracy of protrusion morphology; it generates real-time feedback data to focus on key control nodes of the etching process. Based on feedback data, the etching process parameters were fine-tuned to optimize the uniformity and dimensional accuracy of the protrusion structure.

[0030] The working principle and effects of the above technical solution are as follows: This step improves the classification and regularity of the manufacturing dataset. The four data modules make various types of information clear and organized, and the screening of core process factors makes the key elements affecting the protrusion morphology more prominent. It enhances the pertinence of the cognitive-level manufacturing model, and multi-round data iteration learning allows for a deeper exploration of the intrinsic correlation between process parameters and protrusion morphology accuracy. It improves the accuracy of etching process parameter adjustment, and real-time feedback data focuses on key control nodes, making fine-tuning more directional. It reduces misjudgments caused by data clutter and reduces time and material losses caused by blindly adjusting etching parameters. It avoids model deviations caused by fuzzy core factors, avoids problems such as insufficient uniformity of protrusion structure or substandard dimensional accuracy, and avoids the disconnect between process adjustments and quality requirements. It allows the manufacturing model to closely fit actual production data and continuously optimizes the uniformity and dimensional accuracy of the gold finger protrusions, laying a solid foundation for the coordinated matching of subsequent stages and further improving the stability of overall manufacturing quality.

[0031] In one embodiment of the present invention, a windowed protruding PCB pressing finger structure is designed and formed by the design method described in any one of the above descriptions.

[0032] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A manufacturing and design method for a windowed, raised PCB bonding finger structure, characterized in that, The method includes: S1. Perform micro-protrusion morphology etching on the PCB substrate to generate a gold finger array. Based on the morphology parameters of the gold finger array, perform solder mask window positioning to form a solder mask window that matches the protrusion structure. S2. Based on the morphological characteristics of the protruding structure, the stress field of the pressing is simulated to optimize the distribution density and embedding depth of the ACF anisotropic conductive adhesive film; gradient pressure heating is implemented through the pressing equipment to make the conductive particles form controllable flattening deformation at the micro-protrusion interface to generate the pressing structure. S3. Perform online detection of the bursting state of the conductive particles after compression to identify abnormal particles that are not broken or excessively broken; adjust the compression parameters based on the abnormal particle distribution data to generate an optimized particle embedding control strategy. S4. The three-dimensional morphology of the gold finger protrusion structure is reconstructed by laser interferometry to generate micron-level positioning feature data; adaptive alignment is performed with FPC pins based on the positioning feature data to control the FPC alignment deviation within ±15μm to meet the requirements of high-density pin connection. S5. Based on the morphological parameters of the pressed structure, the particle embedding state, and the positioning accuracy data, a cognitive-level manufacturing model is constructed. The etching process, ACF distribution, and pressing parameters are adjusted in real time through the model feedback to form a closed-loop manufacturing architecture that precisely controls the micro-protrusion morphology, optimizes ACF particle embedding, and coordinates stress field design.

2. The manufacturing and design method of the windowed protruding PCB pressing finger structure according to claim 1, characterized in that, S1 includes: S11. Select a high-flatness copper-clad laminate as the base material, perform surface cleaning and impurity removal treatment to remove the oxide layer and oil stains, and generate a clean base material surface. S12. High-precision photolithography is used to transfer the preset circuit pattern to the surface of a clean substrate to form a uniformly distributed resist layer pattern. S13. Implement a precise etching process to remove excess copper layers not covered by the resist layer, generating a gold finger array with micro-protrusion morphology. S14. Perform a film removal process to remove any residual resist layer and fully expose the gold finger protrusion structure and copper circuitry. S15. Based on the protrusion height and spacing parameters of the gold finger array, perform solder mask window positioning to form a solder mask window that perfectly matches the protrusion structure, thus isolating the path of green oil penetration into the effective contact area.

3. The manufacturing and design method of the windowed protruding PCB pressing finger structure according to claim 1, characterized in that, The S2 includes: S21. Collect morphological feature data of the gold finger protrusion structure, perform pressure stress field simulation analysis, and optimize the distribution density and embedding depth parameters of the ACF anisotropic conductive adhesive film. S22. The optimized ACF anisotropic conductive adhesive film is evenly laid on the surface of the gold finger protrusion structure to ensure that the adhesive film is completely adhered to the top of the protrusion. S23. Start the pressing equipment to implement gradient pressurization and heating operation, and the temperature and pressure gradually increase to the preset threshold over time; S24. The conductive particles at the interface between the gold finger protrusion structure and the FPC undergo controllable flattening deformation under gradient stress. S25. The deformed conductive particles form a continuous and stable electrical connection channel at the contact interface, generating a press-fit structure with low pressure requirements.

4. The manufacturing and design method of the windowed protruding PCB pressing finger structure according to claim 3, characterized in that, S21 includes: S211. The three-dimensional laser scanning technology is used to perform a full-domain scan of the gold finger protrusion structure, collect morphological feature data, and perform noise reduction and normalization on the collected morphological feature data to generate three-dimensional structural model data that conforms to the simulation standard. S212. Import the three-dimensional structural model data into the simulation system, carry out compression stress field simulation analysis, and capture the stress transmission law under different distribution densities and embedding depths. S213. Compare the stress uniformity and the force state of conductive particles corresponding to different parameter combinations, and select the parameter range with balanced stress distribution and reasonable particle force. S214. Based on the selected parameter range, refine and adjust the distribution density gradient and embedding depth values ​​to form the optimized ACF anisotropic conductive film parameter configuration.

5. The manufacturing and design method of the windowed protruding PCB pressing finger structure according to claim 4, characterized in that, S212 includes: Import the 3D structural model data into the simulation system, input the physical property parameters of the PCB substrate, gold fingers and ACF film, and generate the basic data of the lamination scene; Multiple combinations of ACF distribution density gradients and embedding depths are defined to form a variable matrix covering the range of key parameters; Start the simulation system to run the pressure stress field simulation and record the stress propagation time sequence data at the contact interface under each set of variables in real time; Spatial interpolation is performed on the collected time-series data to generate a continuous and complete stress field distribution map. The stress transmission paths and intensity changes corresponding to different variables are extracted from the stress field distribution map to summarize the stress transmission laws.

6. The manufacturing and design method of the windowed protruding PCB pressing finger structure according to claim 1, characterized in that, The S3 includes: S31. Online visual inspection technology is used to perform a comprehensive scan of the conductive particles after compression to capture image data of the particle explosion state. S32. Analyze and filter the image data to identify abnormal particles that are not broken or are excessively broken, and count the number and distribution of abnormal particles. S33. Based on the abnormal particle distribution data, analyze the correlation between compression temperature and pressure and particle explosion state. S34. Adjust the pressing parameters in a targeted manner to generate an optimized particle embedding control strategy; S35. Re-implement the pressing operation according to the optimization strategy to improve the stability and consistency of the pressing yield.

7. The manufacturing and design method of the windowed protruding PCB pressing finger structure according to claim 6, characterized in that, S33 includes: Organize the abnormal particle distribution data and the corresponding temperature and pressure records of the pressing process to generate a one-to-one corresponding dataset. The datasets are classified and associated according to the particle explosion state, and divided into three data groups: normal fracture, no fracture, and excessive fracture. Calculate the mean and fluctuation range of temperature and pressure in each set of data, and generate parameter interval data corresponding to each state; By comparing the numerical differences of different state parameter ranges, we can observe the changing trend of particle explosion state when the temperature and pressure deviate from the normal range. Linear fitting was performed on each set of data to generate correlation curves between temperature, pressure, and particle explosion state, and the correlation patterns were extracted.

8. The manufacturing and design method of the windowed protruding PCB pressing finger structure according to claim 1, characterized in that, The S4 includes: S41. Use laser interferometry to perform a full-range scan of the gold finger protrusion structure and collect three-dimensional morphological data. S42. Process and analyze the three-dimensional topography data, extract the positioning feature information of the gold finger protrusion, and generate micron-level positioning data; S43. Compare and analyze the positioning feature data with the FPC pin data, and start the adaptive alignment adjustment mechanism. S44. Adjust the relative position of the FPC and the gold fingers in real time to control the alignment deviation within ±15μm; S45. Complete the precise docking of the FPC and the gold fingers to meet the precision requirements of high-density pin connections.

9. The manufacturing and design method of the windowed protruding PCB pressing finger structure according to claim 1, characterized in that, The S5 includes: S51. Collect the morphological parameters, conductive particle embedding state, and positioning accuracy data of the press-fit structure, and integrate them to form a complete manufacturing dataset. S52. Construct a cognitive-level manufacturing model based on the manufacturing dataset, and establish a correlation mapping between various process parameters and product quality; the model provides real-time feedback data to adjust the parameter settings of the etching process and optimize the accuracy of the gold finger protrusion morphology. S53. Adjust the distribution of the anisotropic conductive adhesive film of ACF according to the feedback results to adapt to the optimized protrusion structure; simultaneously adjust the temperature and pressure parameters of the pressing equipment to achieve coordinated matching between the stress field and structural features. S54. A closed-loop manufacturing architecture is formed for precise control of micro-protrusion morphology ACF, particle embedding optimization and stress field collaborative design. S55, relying on a closed-loop architecture to achieve intelligent upgrade of the pressing manufacturing mode, and achieve efficient and stable intelligent pressing operation.

10. A windowed, raised PCB bonding finger structure, characterized in that, The design is formed using the design method described in any one of claims 1 to 9.

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