Wafer cleaning and drying system and wafer cleaning and drying method

Abstract

The application discloses a wafer cleaning and drying system and a wafer cleaning and drying method. The wafer cleaning and drying system comprises: a plurality of cleaning cavities used for cleaning wafers; a transmission track arranged beside the cleaning cavities; a plurality of moving members arranged in the transmission track and capable of reciprocating; and a plurality of transfer members arranged in the moving members and capable of lifting and lowering along the moving members to take and place the wafers in the cleaning cavities. The wafer cleaning and drying system further comprises: a drying box internally provided with liquid and a lifting mechanism, wherein the lifting mechanism is used for lifting the wafers below the liquid level in the drying box upward to separate the wafers from the liquid level, and the drying box is internally provided with at least two working positions; and at least one transfer track. The at least one transfer member is used for transferring the wafers in the cleaning cavities to the same working position or different working positions close to the lifting mechanism in the drying box, so that the lifting mechanism can receive the wafers and lift the wafers upward to complete drying. The wafer cleaning and drying system can realize the drying function of double or multiple wafers, improve the wafer drying efficiency, and match the cleaning speed of the double-wafer cleaning cavity.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor integrated circuit chip manufacturing technology, and in particular relates to a wafer cleaning and drying system and a wafer cleaning and drying method. Background Technology

[0002] The cleaning process unit functions to remove polishing fluid residue and other contaminant particles from the wafer. It comprises three units: mega-sound cleaning, brushing, and drying. The drying unit primarily utilizes three methods: mechanical spin-rotation dryer (SRD, which uses centrifugal force to remove water from the wafer surface), IPA (Integrated Pulse Atomizer) which uses the Marangoni effect (utilizing the surface tension gradient of liquids to remove water adhering to the wafer surface) to dry the wafer.

[0003] The following problems exist: The known vertical layout of the same single-inlet, single-outlet IPA drying unit is the one disclosed in Chinese patent CN111092036A, "A Wafer Cleaning and Drying Device". It cannot achieve the drying capacity of more than one wafer. When it is built together with the cleaning device disclosed in CN115990594A or the brushing device disclosed in CN115995405A to form a dual-wafer Cleaner system, the single-wafer drying IPA drying unit layout can no longer meet the corresponding wafer output rate, becoming a bottleneck restricting the wafer output rate of the entire Cleaner per unit time.

[0004] Currently, the requirements for the film output rate per unit time of chemical mechanical planarization equipment are becoming increasingly stringent, and conventional single-station IPA drying units cannot meet the cleaning needs. In order to improve the film output rate, multiple single-wafer megasonic cleaning tanks are used, but megasonic cleaning occupies too much space, increases the transmission distance, and reduces transmission efficiency, which cannot meet production requirements. Summary of the Invention

[0005] To overcome the shortcomings of the prior art, the present invention provides a wafer cleaning and drying system and a wafer cleaning and drying method, which significantly increases the wafer output rate per unit time without significantly increasing the space required.

[0006] The technical solution adopted by this invention to solve its technical problem is: a wafer cleaning and drying system, comprising:

[0007] The cleaning chambers, numbered at least two, are used for cleaning wafers;

[0008] A transfer track is located beside the cleaning chamber;

[0009] At least one movable component is provided on the transmission track for reciprocating movement;

[0010] A transfer unit, disposed on the movable member, and capable of moving up and down along the movable member to pick up and place wafers in the cleaning chamber; also includes;

[0011] The drying oven is equipped with a liquid and a lifting mechanism inside. The lifting mechanism is used to lift the wafers below the liquid surface in the drying oven upwards and remove them from the liquid surface. The drying oven is provided with at least two working positions.

[0012] Transfer orbits, at least one in number;

[0013] At least one transfer unit transfers the wafer in the cleaning chamber to the same or different working positions in the drying chamber near the lifting mechanism, so that the lifting mechanism can receive the wafer and lift it upward to complete the drying.

[0014] Furthermore, the working position is a drying position, and there are at least two drying positions. The lifting mechanism is set corresponding to the drying position, and the wafer enters and exits the drying chamber from the drying position.

[0015] or,

[0016] The working position includes a drying position and a receiving position. The number of drying positions is at least two. The lifting mechanism is set corresponding to the drying position. The wafer enters the drying chamber from the receiving position and exits the drying chamber from the drying position.

[0017] or,

[0018] The working position includes a drying position and a receiving position. The lifting mechanism is set corresponding to the drying position. The wafer enters the drying chamber from the receiving position and exits the drying chamber from the drying position.

[0019] or,

[0020] The working position includes a drying position and a receiving position. The lifting mechanism is set corresponding to the drying position, and the wafer enters and exits the drying chamber from the drying position.

[0021] Furthermore, it also includes an extension section that extends in the direction of the drying chamber, and at least one transfer member, in cooperation with the extension section and the transfer track, transfers the wafers in the cleaning chamber to the same or different working positions in the drying chamber near the lifting mechanism.

[0022] Furthermore, the working position is a drying position, and the lifting mechanism is set corresponding to the drying position; the extension section is located on the moving part and can move up and down along the moving part; the transfer track is connected to the extension section; at least one transfer part can move horizontally along the transfer track to remove the wafer in the cleaning chamber and transfer it to different drying positions.

[0023] Furthermore, the working position includes a drying position and a receiving position, and the lifting mechanism is set corresponding to the drying position; the extension section is set on the moving part or the transfer track, the transfer track is set inside the drying chamber, and the transfer track is movably provided with a support for supporting the wafer, which can move along the transfer track to switch between the drying position and the receiving position.

[0024] Furthermore, the transfer track extends in a direction perpendicular to the transmission track, and the receiving position is located in the X-axis extension direction of the cleaning chamber.

[0025] Furthermore, the transfer track is provided with at least one receiving position and at least two drying positions, with the drying positions located on both sides of the receiving position.

[0026] Furthermore, the number of transfer tracks is at least two, each transfer track has a drying position and a receiving position, adjacent transfer tracks are arranged in parallel and spaced apart, and the receiving positions of adjacent transfer tracks are set close to each other, while the drying positions of adjacent transfer tracks are far apart from each other.

[0027] Furthermore, each moving element is provided with at least two transfer elements to simultaneously place at least two wafers in the receiving position of the transfer track.

[0028] Furthermore, the transfer track extends in a direction parallel to the transport track.

[0029] Furthermore, the working position includes a drying position, a receiving position, and a waiting position, and the lifting mechanism is set corresponding to the drying position; the extension section is set on the moving part or the transfer track, the transfer track is set inside the drying chamber, and the transfer track is provided with a first support and a second support for supporting the wafer. The transfer track is movably set to switch the first support and the second support to the drying position.

[0030] Furthermore, the support base includes a first leg and a second leg, with a notch formed between the first leg and the second leg. The lifting mechanism includes a middle lifting member and a side lifting member. The middle lifting member can support the wafer in the notch, and the side lifting member supports the wafer in a direction away from the first leg and the second leg.

[0031] This invention also discloses a wafer cleaning and drying method, comprising the following steps:

[0032] The transfer unit picks up the wafer from the cleaning chamber, and after translation and lifting, places the wafer on the support of the transfer track. At this time, the support is in the working position.

[0033] The support base moves along the transfer track to another working position, which corresponds to the lifting mechanism.

[0034] The lifting mechanism lifts the wafer off the liquid surface to achieve wafer drying.

[0035] Furthermore, the cleaning chamber is arranged along the X-axis direction, and the transfer track extends along the direction perpendicular to the X-axis, or the transfer track extends along the direction parallel to the X-axis.

[0036] Furthermore, there are two transfer tracks, each equipped with a support base, and each support base can move and switch between two working positions;

[0037] or,

[0038] The number of transfer tracks is one, and the number of support seats is one, which moves and switches between two working positions;

[0039] or,

[0040] The transfer track is movable, and there are two support bases that can move and switch between three working positions.

[0041] The beneficial effects of this invention are: 1) It can realize the drying function of dual or multiple wafers, improve the wafer drying efficiency, and match the cleaning speed of dual-wafer cleaning chambers; 2) It achieves a significant increase in the drying capacity of the drying chamber without significantly increasing the system length and width; 3) More transmission positions and time windows reduce the waiting exposure time after wafer cleaning, improve system redundancy and process compatibility, and reduce the risk of exposure contamination while improving transmission efficiency; 4) It proposes a dual-wafer drying chamber layout that can be adapted to other dual-wafer cleaning chambers, thereby improving the cleaning and drying efficiency. Attached Figure Description

[0042] Figure 1 This is a perspective view of the wafer cleaning and drying system provided in Embodiment 1 of the present invention.

[0043] Figure 2 This is a perspective view of the drying oven provided in Embodiment 1 of the present invention.

[0044] Figure 3 This is a perspective view of the transmission track, moving parts, and transfer parts provided in Embodiment 1 of the present invention.

[0045] Figure 4 This is a simplified layout diagram of the drying oven provided in Embodiment 1 of the present invention.

[0046] Figure 5 This is a perspective view of the wafer cleaning and drying system provided in Embodiment 2 of the present invention.

[0047] Figure 6 This is a schematic diagram of the internal structure of the drying oven provided in Embodiment 2 of the present invention. Figure 1 .

[0048] Figure 7This is a schematic diagram of the internal side view of the drying oven provided in Embodiment 2 of the present invention.

[0049] Figure 8 This is a schematic diagram of the internal three-dimensional structure of the drying oven provided in Embodiment 2 of the present invention. Figure 1 .

[0050] Figure 9 This is a schematic diagram of the internal three-dimensional structure of the drying oven provided in Embodiment 2 of the present invention. Figure 2 .

[0051] Figure 10 This is a schematic diagram of the internal structure of the drying oven provided in Embodiment 2 of the present invention. Figure 2 .

[0052] Figure 11 This is a three-dimensional structural diagram of the transfer track and lifting mechanism provided in Embodiment 2 of the present invention.

[0053] Figure 12 This is a three-dimensional structural diagram of the transfer track and support base provided in Embodiment 2 of the present invention.

[0054] Figure 13 This is a simplified layout diagram of the drying oven provided in Embodiment 2 of the present invention.

[0055] Figure 14 This is a perspective view of the wafer cleaning and drying system provided in Embodiment 3 of the present invention.

[0056] Figure 15 This is a schematic diagram of the internal structure of the drying oven provided in Embodiment 3 of the present invention.

[0057] Figure 16 This is a schematic diagram of the internal three-dimensional structure of the drying oven provided in Embodiment 3 of the present invention.

[0058] Figure 17 This is an internal side view of the drying oven provided in Embodiment 3 of the present invention.

[0059] Figure 18 This is a simplified layout diagram of the drying oven provided in Embodiment 3 of the present invention.

[0060] Figure 19 This is a schematic diagram of the internal three-dimensional structure of the drying oven provided in Embodiment 4 of the present invention. Figure 1 .

[0061] Figure 20 This is a schematic diagram of the internal three-dimensional structure of the drying oven provided in Embodiment 4 of the present invention. Figure 2 .

[0062] Figure 21 This is a schematic diagram of the internal side view of the drying oven provided in Embodiment 4 of the present invention. Figure 1 .

[0063] Figure 22 This is a schematic diagram of the internal side view of the drying oven provided in Embodiment 4 of the present invention. Figure 2 .

[0064] Figure 23 This is a three-dimensional structural diagram of the transfer track and the first support base and the second support base provided in Embodiment 4 of the present invention.

[0065] Figure 24 This is a schematic diagram of the internal side view of the drying oven provided in Embodiment 4 of the present invention. Figure 3 At this point, the number of forwarded items is two.

[0066] Figure 25 Side view of the inside of the drying oven provided in Embodiment 4 of the present invention Figure 1 At this time, the second support is in the dry position.

[0067] Figure 26 This is a simplified layout diagram of the drying oven provided in Embodiment 4 of the present invention, which corresponds to... Figure 25 The state.

[0068] Figure 27 Side view of the inside of the drying oven provided in Embodiment 4 of the present invention Figure 2 At this time, the second support is in the waiting position.

[0069] Figure 28 This is a simplified layout diagram of the drying oven provided in Embodiment 4 of the present invention, which corresponds to... Figure 27 The state.

[0070] Among them, 1-cleaning chamber, 2-transfer track, 3-moving component, 31-extension section, 4-transfer component, 5-drying chamber, 51-lifting mechanism, 511-intermediate lifting component, 512-side lifting component, 52-first drying chamber, 53-second drying chamber, 6-transfer track, 71-drying position, 72-receiving position, 73-waiting position, 8-wafer, 9-support base, 91-first support base, 92-second support base, 93-first leg, 94-second leg, 95-notch. Detailed Implementation

[0071] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0072] Example 1

[0073] like Figure 1 , Figure 2 As shown, a wafer cleaning and drying system includes at least two cleaning chambers 1 for cleaning wafers 8, a transfer track 2 disposed beside the cleaning chambers 1, a movable component 3 disposed on the transfer track 2, a transfer component 4 disposed on the movable component 3, a drying chamber 5, and at least one transfer track 6.

[0074] The moving part 3 moves horizontally along the transfer track 2 in the X-axis direction, and the transfer part 4 can move up and down along the moving part 3 in the Y-axis direction, thereby achieving the purpose of picking up and placing the wafer 8 in the cleaning chamber 1. The number of moving parts 3 is not limited; in this embodiment, there are at least two moving parts 3. The number of transfer parts 4 on each moving part 3 is not limited; in this embodiment, each moving part 3 is provided with one or two transfer parts 4. In this embodiment, the transfer parts 4 can be clamping parts or lifting parts in the prior art.

[0075] The drying oven 5 has a dual-station structure, comprising a vertically placed first drying chamber 52 with an open top, and a second drying chamber 53. The second drying chamber 53 is horizontally placed with its side opening facing the first drying chamber 52. The first drying chamber 52 contains a liquid and lifting mechanism 51. This lifting mechanism 51 is used to lift the wafer 8 below the liquid surface in the first drying chamber 52 upwards, removing it from the liquid surface, thus achieving the drying of the wafer 8 using the Marangoni effect. The first drying chamber 52 also includes water spraying and immersion systems, which are existing technologies and will not be described further.

[0076] The first drying chamber 52 is provided with at least two working positions. The working positions include a drying position for lifting the wafer 8 upwards away from the liquid surface to achieve drying, a receiving position for receiving the wafer 8 transferred from the cleaning chamber 1 and placed on the lifting mechanism 51 to be dried, and a waiting position for waiting to receive the wafer 8 transferred from the cleaning chamber 1.

[0077] At least one transfer member 4 transfers the wafer 8 in the cleaning chamber 1 to the first drying chamber 52, to the same or different working positions near the lifting mechanism 51, so that one or two lifting mechanisms 51 can receive the wafer 8 and lift it upward to complete the drying.

[0078] like Figure 4 As shown, in this embodiment, there are two working positions, both of which are drying positions. The number of drying positions can be increased, and there is no specific limitation. Lifting mechanisms 51 are provided corresponding to the drying positions, meaning there are two lifting mechanisms 51 arranged side-by-side. Specifically, the line connecting the two lifting mechanisms 51 is perpendicular to the transmission track 2.

[0079] like Figures 1-3As shown, the transfer track 6 is mounted on the movable part 3 located at the end of the transfer track 2. The transfer track 6 extends in a direction perpendicular to the transfer track 2, or more precisely, in the direction in which the two drying positions are located, i.e., the transfer track 6 extends in the Z-axis direction.

[0080] To avoid interference during the interaction, the end of the transfer track 2 is located in the area corresponding to the cleaning chamber 1, and does not extend towards the drying chamber 5. Therefore, an extension section 31 is provided on the moving part 3 at the end of the transfer track 2. This extension section 31 extends towards the drying chamber 5, and the transfer track 6 is disposed on this extension section 31. This extension section 31 can move up and down along the moving part 3, thereby realizing the up and down movement of the transfer track 6, and further realizing the up and down movement of the transfer part 4 on the transfer track 6.

[0081] The transfer member 4 on the end moving part 3 of the transfer track 2 clamps the cleaned wafer 8 from the cleaning chamber 1. After the transfer member 4 on the extension section 31 rises along the moving part 3, it moves to the end of the transfer track 2 with the moving part 3. At this time, the transfer track 6 on the extension section 31 is located above the first drying chamber 52. Then the transfer member 4 moves along the transfer track 6 to move the wafer 8 above any lifting mechanism 51 corresponding to the first drying chamber 52. The extension section 31 descends along the moving part 3, and the transfer member 4 places the wafer 8 on the lifting mechanism 51 inside the first drying chamber 52.

[0082] The transfer member 4 rises, and the moving member 3 moves along the transfer track 2 to the cleaning chamber 1 to obtain another cleaned wafer 8. The above steps are repeated, placing the wafer 8 onto another lifting mechanism 51 within the first drying chamber 52. Alternatively, the other cleaned wafer 8 can also be placed onto the first lifting mechanism 51 within the first drying chamber 52; no specific limitation is imposed. The implementation structure for the transfer member 4 moving along the transfer track 6 can be any structure in the prior art, without specific limitation. In other words, at least one transfer member 4, in cooperation with the extension section 31 and the transfer track 6, transfers the wafer 8 from the cleaning chamber 1 to the same or different working positions within the first drying chamber 52 near the lifting mechanism 51.

[0083] like Figure 2 As shown, the lifting mechanism 51 includes at least a middle lifting member 511 and a side lifting member 512. Its specific structure and lifting implementation are existing technologies and will not be described further. The top of the first drying chamber 52 has two openings, each corresponding to the lifting mechanism 51. The transfer member 4 moves along the transfer track 6 to the opening and then moves downwards to place the wafer 8 onto the lifting mechanism 51. The specific stopping position of the wafer 8 on the transfer track 6 can be determined by a position sensor installed on the transfer track 6; its specific implementation is existing technology and will not be described further.

[0084] To reduce the difficulty of the transfer process, one of the drying positions can be set at a position corresponding to the cleaning chamber 1 in the X-axis direction. That is, after the transfer member 4 obtains the wafer 8 from the cleaning chamber 1, there is no need to adjust the position of the transfer member 4 in the Z-axis direction. It will directly lower the obtained wafer 8 onto the lifting mechanism 51.

[0085] The wafer 8 dried in the first drying chamber 52 can be transferred to the second drying chamber 53 by a flipping mechanism (not shown in the figure), which can be achieved by existing technology and will not be described in detail here.

[0086] Subsequent wafers 8 can complete the cleaning and drying tasks according to the above process until all wafer 8 cleaning and drying processes are completed.

[0087] A wafer cleaning and drying method includes the following steps:

[0088] The transfer component 4 on the transfer track 6 obtains the wafer 8 from the cleaning chamber 1, which is arranged along the X-axis direction. The transfer track 6 extends along the vertical X-axis direction. The transfer component 4 places the wafer 8 on the lifting mechanism 51 after translation and lifting.

[0089] The lifting mechanism 51 lifts the wafer 8 away from the liquid surface to achieve wafer 8 drying;

[0090] While one of the lifting mechanisms 51 is performing the lifting operation, the transfer member 4 can place another wafer 8 onto another lifting mechanism 51 at a different working position. This allows both lifting mechanisms 51 to operate simultaneously to dry the wafer 8, eliminating any time difference between their operation. Example 2

[0091] like Figures 5-8 As shown, the working position includes a drying position 71 and a receiving position 72. There are two drying positions 71, and the lifting mechanism 51 is set corresponding to the drying position 71, that is, there are also two lifting mechanisms 51. Of course, the number of drying positions 71 and lifting mechanisms 51 can be increased, and there is no specific limitation.

[0092] like Figure 7 , Figure 11 As shown, the two lifting mechanisms 51 are offset in the X-axis and Z-axis directions, but there is no restriction on whether they are offset in the Y-axis direction.

[0093] Two transfer tracks 6 are also provided inside the first drying chamber 52. These transfer tracks 6 extend along the Z-axis, that is, along a direction perpendicular to the transfer track 2, and adjacent transfer tracks 6 are arranged parallel and spaced apart. Each transfer track 6 has a drying position 71 and a receiving position 72. The receiving positions 72 of adjacent transfer tracks 6 are arranged close together, while the drying positions 71 of adjacent transfer tracks 6 are arranged far apart. Specifically, as shown... Figure 8As shown, both wafers 8 are currently located at receiving position 72, as... Figure 9 As shown, at this time, the two wafers 8 are located at the drying positions 71 on both sides. In other words, the drying position 71 of one transfer track 6 is to the left of its receiving position 72, and the drying position 71 of the other transfer track 6 is to the right of its receiving position 72.

[0094] Each transfer track 6 is provided with a support 9 for supporting the wafer 8. The support 9 can be translated along the transfer track 6 to switch between the drying position 71 and the receiving position 72.

[0095] Of course, in other embodiments, the number of transfer tracks 6 can also be one, and the number of support seats 9 is also at least one. At least one receiving position 72 and at least two drying positions 71 can be provided on the transfer track 6, with the drying positions 71 located on both sides of the receiving position 72.

[0096] To avoid interference between the lifting mechanism 51 and the support base 9, the support base 9 includes a first leg 93 and a second leg 94, with a notch 95 formed between the first leg 93 and the second leg 94. The intermediate lifting member 511 can support the wafer 8 in this notch 95, thereby realizing the transfer of the wafer 8 between the lifting mechanism 51 and the support base 9. The side lifting member 512 supports the wafer 8 in a direction away from the first leg 93 and the second leg 94, that is, the left side lifting member 512 supports the wafer 8 to the left of the first leg 93, and the right side lifting member 512 supports the wafer 8 to the right of the second leg 94.

[0097] At this time, the extension section 31 can be disposed on the movable member 3 or on the transfer track 2. In the illustration of this embodiment, the extension section 31 is disposed on the movable member 3, so that the transfer member 4 can move to the top of the drying chamber 5.

[0098] To reduce the difficulty of the transfer process, the receiving position 72 can be set in the X-axis extension direction of the cleaning chamber 1. That is, after the transfer member 4 obtains the wafer 8 from the cleaning chamber 1, there is no need to adjust the position of the transfer member 4 in the Z-axis direction. It will directly lower the obtained wafer 8 and place it on the receiving position 72.

[0099] like Figure 5 , Figure 8 As shown, a single moving part 3 is equipped with two transfer parts 4, which allows two wafers 8 to be simultaneously retrieved from the cleaning chamber 1 and placed in the receiving positions 72 of the two transfer tracks 6. Of course, in other embodiments, multiple transfer parts 4 can be provided, their number corresponding to the number of transfer tracks 6. In this case, the cleaning chamber 1 can be a dual-station cleaning chamber, meaning that two wafers 8 undergo the cleaning process simultaneously.

[0100] A wafer cleaning and drying method includes the following steps:

[0101] The transfer unit 4 obtains the wafer 8 from the cleaning chamber 1, which is arranged along the X-axis. After translation and lifting, the wafer 8 is placed on the support seat 9 of the transfer track 6. At this time, the support seat 9 is in the working position, specifically the receiving position 72. The support seat 9 is translated along the transfer track 6 to another working position, specifically the drying position 71. The drying position 71 is set to the lifting mechanism 51.

[0102] The lifting mechanism 51 lifts the wafer 8 away from the liquid surface to achieve wafer 8 drying.

[0103] Transfer track 6 can extend along the vertical X-axis.

[0104] There are two transfer tracks 6, each with a support base 9. Each support base 9 moves and switches between two working positions, that is, between the receiving position 72 and the drying position 71.

[0105] In this embodiment, the two transfer members 4 on the moving part 3 at the end of the transfer track 2 move up and down along the moving part 3 to obtain two wafers 8 from the cleaning chamber 1, then move along the extension section 31 to above the drying chamber 5, and then descend to place the two wafers 8 simultaneously at the receiving positions 72 of the two transfer tracks 6. Figure 9 , Figure 11 As shown, the support 9 on one of the transfer tracks 6 moves from the receiving position 72 to the left to the drying position 71, and the lifting mechanism 51 lifts the wafer 8 upward to achieve drying; the support 9 on the other transfer track 6 moves from the receiving position 72 to the right to the drying position 71, and the lifting mechanism 51 lifts the wafer 8 upward to achieve drying; that is, the two wafers 8 enter the first drying chamber 52 from the two receiving positions 72 respectively, and then exit the first drying chamber 52 from the two drying positions 71 respectively.

[0106] Example 3

[0107] like Figures 13-16 As shown, the working position includes a drying position 71 and a receiving position 72. There is one drying position 71 and one receiving position 72. The lifting mechanism 51 is set corresponding to the drying position 71, that is, there is also one lifting mechanism 51. Of course, the number of drying positions 71 and lifting mechanisms 51 can be increased, and there is no specific limitation.

[0108] A transfer track 6 is provided inside the first drying chamber 52. The transfer track 6 extends along the X-axis, that is, along a direction parallel to the transfer track 2. The transfer track 6 has a drying position 71 and a receiving position 72. The support 9 translates on the transfer track 6, thereby switching between the drying position 71 and the receiving position 72.

[0109] In this embodiment, the extension section 31 is disposed on the transfer track 2, that is, the end of the transfer track 2 extends upward toward the drying chamber 5. Of course, the extension section 31 can also be disposed on the moving part 3.

[0110] A wafer cleaning and drying method includes the following steps:

[0111] The transfer unit 4 obtains the wafer 8 from the cleaning chamber 1, which is arranged along the X-axis. After translation and lifting, the wafer 8 is placed on the support seat 9 of the transfer track 6. At this time, the support seat 9 is in the working position, specifically the receiving position 72. The support seat 9 is translated along the transfer track 6 to another working position, specifically the drying position 71. The drying position 71 is set to the lifting mechanism 51.

[0112] The lifting mechanism 51 lifts the wafer 8 away from the liquid surface to achieve wafer 8 drying.

[0113] Transfer track 6 extends along the direction parallel to the X-axis.

[0114] There is one transfer track 6 and one support base 9. The support base 9 moves and switches between two working positions, that is, between the receiving position 72 and the drying position 71.

[0115] In this embodiment, the support base 9 waits at the receiving position 72. The transfer member 4 on the moving part 3 at the end of the transfer track 2 moves up and down along the moving part 3 to obtain a wafer 8 from the cleaning chamber 1. Then, it moves along the extension section 31 to above the drying chamber 5, and then descends to place the wafer 8 on the support base 9 at the receiving position 72. The support base 9 translates along the transfer track 6 in the X-axis direction, moving from the receiving position 72 to the drying position 71. The drying position 71 is located below the lifting mechanism 51. The lifting mechanism 51 lifts the wafer 8 upward to achieve drying. At the same time, the support base 9 can move in the opposite direction to the receiving position 72 to continue receiving wafers 8. This solves the problem that when the lifting mechanism 51 is lifting and drying one wafer 8, it is impossible to place another wafer 8 in the drying chamber 5. This saves transfer time, improves the drying efficiency of the drying chamber 5, and thus improves the wafer output rate per unit time of the entire system.

[0116] At this time, wafer 8 enters the first drying chamber 52 from receiving position 72 and exits the first drying chamber 52 from drying position 71. Of course, wafer 8 can also directly enter the first drying chamber 52 from drying position 71, and the lifting mechanism 51 lifts it upward to achieve drying, so that wafer 8 still exits the first drying chamber 52 from drying position 71.

[0117] Example 4

[0118] like Figures 17-22As shown, the working position includes a drying position 71, a receiving position 72, and a waiting position 73, each with a quantity of one. The lifting mechanism 51 is set corresponding to the drying position 71, that is, the quantity of the lifting mechanism 51 is also one. Of course, the quantity of the drying position 71 and the lifting mechanism 51 can be increased, and there is no specific limitation.

[0119] A transfer track 6 is provided inside the first drying chamber 52. The transfer track 6 extends along the X-axis, that is, along a direction parallel to the transfer track 2, and is movably configured relative to the first drying chamber 52. The transfer track 6 is provided with a first support 91 and a second support 92 for supporting the wafer 8. The first support 91 and the second support 92 can be fixed relative to the transfer track 6 or movably configured; in this embodiment, they are fixed. The transfer track 6 translates relative to the first drying chamber 52 along the X-axis, thereby switching the first support 91 and the second support 92 to the drying position 71.

[0120] like Figure 19 As shown, at this time, the first support 91 is located at the receiving position 72, the second support 92 is located at the drying position 71, and the waiting position 73 is to the left of the drying position 71. Figure 20 As shown, at this time, the first support 91 is located in the drying position 71, the second support 92 is located in the waiting position 73, and the receiving position 72 is on the right side of the drying position 71.

[0121] In this embodiment, the extension section 31 is disposed on the transfer track 2, that is, the end of the transfer track 2 extends upward toward the drying chamber 5. Of course, the extension section 31 can also be disposed on the moving part 3.

[0122] A wafer cleaning and drying method includes the following steps:

[0123] The transfer unit 4 obtains the wafer 8 from the cleaning chamber 1, which is arranged along the X-axis. After translation and lifting, the wafer 8 is placed on the support seat 9 of the transfer track 6. At this time, the support seat 9 is in the working position, specifically the receiving position 72. The support seat 9 is translated along the transfer track 6 to another working position, specifically the drying position 71. The drying position 71 is set to the lifting mechanism 51.

[0124] The lifting mechanism 51 lifts the wafer 8 away from the liquid surface to achieve wafer 8 drying.

[0125] Transfer track 6 extends along the direction parallel to the X-axis.

[0126] The transfer track 6 is set to move, and there are two support bases 9. It can move and switch between three working positions, that is, between the receiving position 72, the drying position 71, and the waiting position 73.

[0127] The working process of this embodiment is as follows: Figure 19 As shown, the transfer track 6 stops moving, so that the first support 91 is located at the receiving position 72 and the second support 92 is located at the drying position 71; the transfer member 4 on the moving part 3 at the end of the transfer track 2 moves up and down along the moving part 3 to obtain a wafer 8 in the cleaning chamber 1, and then moves along the extension section 31 to above the drying chamber 5, and then descends to place the wafer 8 on the first support 91 on the receiving position 72. The transfer track 6 moves to the left, so that the first support 91 moves into the drying position 71, as shown. Figure 20 As shown, at this time, the second support 92 moves into the waiting position 73, and the lifting mechanism 51 lifts the wafer 8 upward to achieve drying; the transfer track 6 moves to the right to reset. The specific position can be determined by existing technologies such as sensors, and will not be elaborated further.

[0128] Alternatively, the transfer unit 4 can simultaneously place the two wafers 8 on the first support 91 and the second support 92. The lifting mechanism 51 first lifts the wafer 8 on the second support 92 located in the drying position 71 upward to achieve drying. The transfer track 6 moves to the left, causing the second support 92 to move into the drying position 71. At this time, the first support 91 moves into the waiting position 73, and the lifting mechanism 51 lifts the wafer 8 upward to achieve drying. At this time, the drying of the two wafers 8 is achieved, and the transfer track 6 moves to the right to reset.

[0129] The structures of the first support base 91 and the second support base 92 are similar to those of the support base 9, and will not be described in detail here.

[0130] The above specific embodiments are used to explain and illustrate the present invention, but not to limit the present invention. Any modifications and changes made to the present invention within the spirit and scope of the claims shall fall within the protection scope of the present invention.

Claims

1. A wafer cleaning and drying system, comprising: Cleaning chambers (1), numbered at least two, are used for cleaning wafers (8); The transfer track (2) is located beside the cleaning chamber (1); At least one movable component (3) is provided on the transmission track (2) in a reciprocating manner. A transfer member (4), disposed on the movable member (3), and capable of moving up and down along the movable member (3) to pick up and place the wafer (8) in the cleaning chamber (1); characterized in that: it further includes, The drying oven (5) is equipped with a liquid and lifting mechanism (51) inside. The lifting mechanism (51) is used to lift the wafer (8) below the liquid surface in the drying oven (5) upwards and remove it from the liquid surface. The drying oven (5) is equipped with at least two working positions. Transfer orbits (6), at least one in number; At least one transfer member (4) transfers the wafer (8) in the cleaning chamber (1) to the same or different working positions in the drying chamber (5) near the lifting mechanism (51), so that the lifting mechanism (51) can receive the wafer (8) and lift it upward to complete the drying. It also includes an extension section (31) that extends toward the direction of the drying chamber (5), and at least one transfer member (4) in cooperation with the extension section (31) and the transfer track (6) transfers the wafer (8) in the cleaning chamber (1) to the same or different working positions in the drying chamber (5) near the lifting mechanism (51). The working position is the drying position (71), and the lifting mechanism (51) is set in the drying position (71); the extension section (31) is set on the moving part (3) and can be raised and lowered along the moving part (3); the transfer track (6) is connected to the extension section (31); at least one transfer part (4) can be moved along the transfer track (6) to take out the wafer (8) in the cleaning chamber (1) and transfer it to different drying positions (71).

2. The wafer cleaning and drying system according to claim 1, characterized in that: The working position is a drying position (71), and there are at least two drying positions (71). The lifting mechanism (51) is set in relation to the drying position (71), and the wafer (8) enters and exits the drying chamber (5) from the drying position (71).

3. The wafer cleaning and drying system according to claim 1, characterized in that: The transfer track (6) extends along the direction of the vertical transfer track (2).

4. A wafer cleaning and drying system, comprising: Cleaning chambers (1), numbered at least two, are used for cleaning wafers (8); The transfer track (2) is located beside the cleaning chamber (1); At least one movable component (3) is provided on the transmission track (2) in a reciprocating manner. A transfer member (4), disposed on the movable member (3), and capable of moving up and down along the movable member (3) to pick up and place the wafer (8) in the cleaning chamber (1); characterized in that: it further includes, The drying oven (5) is equipped with a liquid and lifting mechanism (51) inside. The lifting mechanism (51) is used to lift the wafer (8) below the liquid surface in the drying oven (5) upwards and remove it from the liquid surface. The drying oven (5) is equipped with at least two working positions. Transfer orbits (6), at least one in number; At least one transfer member (4) transfers the wafer (8) in the cleaning chamber (1) to the same or different working positions in the drying chamber (5) near the lifting mechanism (51), so that the lifting mechanism (51) can receive the wafer (8) and lift it upward to complete the drying. It also includes an extension section (31) that extends toward the direction of the drying chamber (5), and at least one transfer member (4) in cooperation with the extension section (31) and the transfer track (6) transfers the wafer (8) in the cleaning chamber (1) to the same or different working positions in the drying chamber (5) near the lifting mechanism (51). The working position includes a drying position (71), a receiving position (72), and a waiting position (73). The lifting mechanism (51) is set corresponding to the drying position (71). The extension section (31) is set on the moving part (3) or the transfer track (2). The transfer track (6) is set inside the drying chamber (5). The transfer track (6) is provided with a first support (91) and a second support (92) for supporting the wafer (8). The transfer track (6) is movably set to switch the first support (91) and the second support (92) to the drying position (71).

5. The wafer cleaning and drying system according to claim 4, characterized in that: The transfer track (6) extends in a direction parallel to the transmission track (2).

6. The wafer cleaning and drying system according to claim 4, characterized in that: The support base includes a first leg (93) and a second leg (94), with a notch (95) formed between the first leg (93) and the second leg (94). The lifting mechanism (51) includes a middle lifting member (511) and a side lifting member (512). The middle lifting member (511) can support the wafer (8) in the notch (95), and the side lifting member (512) supports the wafer (8) in a direction away from each other from the first leg (93) and the second leg (94).

7. A wafer cleaning and drying method, based on the wafer cleaning and drying system according to any one of claims 4-6, characterized in that, Includes the following steps: The transfer unit picks up the wafer from the cleaning chamber, and after translation and lifting, places the wafer on the support of the transfer track. At this time, the support is in the working position. The support base moves along the transfer track to another working position, which corresponds to the lifting mechanism. The lifting mechanism lifts the wafer off the liquid surface to achieve wafer drying.

8. The wafer cleaning and drying method according to claim 7, characterized in that: The transfer track extends along a direction parallel to the X-axis, which is the direction in which the cleaning chamber (1) is extended.

9. The wafer cleaning and drying method according to claim 7, characterized in that: The transfer track is movably arranged relative to the drying oven, and there are two support bases that can move and switch between three working positions.

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