Optical module

Abstract

The invention discloses an optical module. The optical module comprises a light emitting chip, a photoelectric detector and a control chip, and the control chip converts the electric signal of the photoelectric detector into the current optical power. And when the current optical power is 0, the degradation count is reset. And when the current optical power is not 0, the current optical power is greater than a second limit threshold, and the output bias current is not the second bias current, the degradation count is reset. When the current optical power is not 0 and the current optical power is smaller than or equal to a second limit threshold value, 1 is added to the degradation count; when the degradation count is larger than or equal to the preset value, the bias current is set to be second bias current, and the second bias current is larger than the working current of the light emitting chip. And when the current optical power is not 0 and the current optical power is less than or equal to a second limit threshold, outputting an optical power alarm signal. According to the optical module provided by the invention, the magnitude of the bias current of the degraded light emitting chip can be improved.

Description

optical modules

[0001] This application claims the priority of application number 202410298601.9 filed with the China Patent Office on March 15, 2024; and the priority of application number 202410479694.5 filed with the China Patent Office on April 19, 2024, all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rates of optical modules are constantly increasing as optical communication technology evolves.

[0004] Summary of the Invention

[0005] The optical module provided in the embodiment of the present disclosure includes:

[0006] an optical transmitter chip configured to transmit an optical signal;

[0007] a photodetector configured to convert the optical power of the emitted optical signal into an electrical signal;

[0008] A control chip connected to the photodetector and the light emitting chip;

[0009] The control chip is configured as follows:

[0010] Converting the electrical signal into current optical power;

[0011] The current optical power is 0, and the degradation count is reset to zero;

[0012] If the current optical power is not 0, the current optical power is greater than the second limit threshold, and the output bias current is not the second bias current, the degradation count is cleared.

[0013] If the current optical power is not 0 and is less than or equal to the second limit threshold, the degradation count is incremented by 1.

[0014] When the degradation count is greater than or equal to a preset value, the bias current is set to a second bias current, and the second bias current is greater than the operating current of the light emitting chip;

[0015] If the current optical power is not 0 and is less than or equal to the second limit threshold, an optical power alarm signal is output;

[0016] The optical module further includes:

[0017] TEC chip;

[0018] CDR chip;

[0019] APD circuit;

[0020] Optical receiver chip;

[0021] MCU, the MCU includes: a power consumption register and an optical instruction register;

[0022] Wherein: the MCU is configured as:

[0023] When the power consumption instruction value in the power consumption register is a first preset value, the TEC chip is controlled to be turned off, the CDR chip is controlled to be turned off, the voltage of the APD circuit is controlled to be reduced, and the light receiving chip is controlled to be turned off;

[0024] When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the CDR chip is controlled to be turned on, the light receiving chip is controlled to be turned on, the voltage of the APD circuit is increased, the light emitting chip is controlled to be turned on, and the TEC chip is controlled to be turned on;

[0025] When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a fourth preset value, the light emitting chip is controlled to be turned off. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0028] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0029] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0030] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0031] FIG5 is a schematic diagram of a first partial structure of an optical module provided according to some embodiments of the present disclosure;

[0032] FIG6 is a schematic diagram of a second partial structure of an optical module provided according to some embodiments of the present disclosure;

[0033] FIG7 is a schematic diagram of a method for controlling transmitted optical power according to some embodiments of the present disclosure;

[0034] FIG8 is a first schematic diagram of a method for controlling transmitted optical power according to some embodiments of the present disclosure;

[0035] FIG9 is a second schematic diagram of a method for controlling transmitted optical power according to some embodiments of the present disclosure;

[0036] FIG10 is a third schematic diagram of a method for controlling transmitted optical power according to some embodiments of the present disclosure;

[0037] FIG11 is a schematic diagram of a third partial structure of an optical module provided according to some embodiments of the present disclosure;

[0038] FIG12 is a schematic diagram of an MCU structure provided according to some embodiments of the present disclosure;

[0039] FIG13 is a schematic diagram of a fourth partial structure of an optical module provided according to some embodiments of the present disclosure;

[0040] FIG14 is a first schematic diagram of a method for controlling power consumption of an optical module according to some embodiments of the present disclosure;

[0041] FIG15 is a second schematic diagram of a method for controlling power consumption of an optical module according to some embodiments of the present disclosure;

[0042] FIG16 is a flow chart 1 of a method for controlling power consumption of an optical module according to some embodiments of the present disclosure;

[0043] FIG17 is a second flowchart of a method for controlling power consumption of an optical module according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0044] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0045] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0046] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0047] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0048] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0049] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0050] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0051] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0052] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0053] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer 100. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0054] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0055] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0056] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0057] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0058] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted to the remote server 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0059] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0060] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0061] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects to the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0062] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0063] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0064] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0065] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0066] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and the opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located on the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the electrical port 204 and is inserted into the electrical connector of the host computer 100. The opening 205 is an optical port, which is configured to connect to the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0067] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, and the like within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0068] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0069] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer 100, or to release the fixed connection between the optical module 200 and the host computer 100.

[0070] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer 100, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0071] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0072] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0073] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer 100 to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0074] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0075] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0076] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0077] Figure 5 is a schematic diagram of a first partial structure of an optical module according to some embodiments of the present disclosure. As shown in Figure 5, in some embodiments, the optical emitting component 400 may include: an optical emitting chip 410, which can be used to emit optical signals.

[0078] The light emitting component 400 may include a photodetector 420 for detecting the magnitude of the optical power of the light emitting chip 410 .

[0079] The light emitting component 400 may include a control chip 440, which is connected to the photodetector 420 and the light emitting chip 410. The control chip 440 receives the electrical signal from the photodetector 420 and calculates the current optical power of the light emitting chip 410 based on the electrical signal.

[0080] The control chip 440 can control the magnitude of the output bias current according to the current optical power.

[0081] In some embodiments, a lookup table is stored in the control chip 440 , and the control chip 440 can control the magnitude of the output bias current according to the lookup table.

[0082] In some embodiments, the lookup table may be a mapping relationship between temperature and bias current magnitude.

[0083] The photodetector 420 can convert the received emission light into an emission electrical signal and send the emission electrical signal to the control chip 440. The control chip 440 can convert the emission electrical signal into a data value and control the magnitude of the bias current according to the data value and the lookup table.

[0084] The control chip 440 can control the magnitude of the bias current according to the current optical power value and the lookup table. The bias current obtained by the control chip 440 according to the lookup table is called a normal compensation current.

[0085] In some embodiments, the lookup table includes a correspondence between optical power values ​​and compensation currents, wherein the optical power values ​​include a first limit threshold. When the current optical power value is greater than or equal to the first limit threshold, the control chip 440 controls the magnitude of the compensation current according to the lookup table to compensate for the current optical power.

[0086] In some embodiments, the control chip 440 can preset a target optical power. When the current optical power is greater than the target optical power, the bias current is increased; when the current optical power is less than the target optical power, the bias current is decreased; and when the current optical power is equal to the target optical power, the bias current remains unchanged.

[0087] The control chip 440 may adjust the bias current according to the target optical power so that the current optical power is equal to the target optical power.

[0088] The control chip 440 may store a second limit threshold. When the current optical power is less than or equal to the second limit threshold, the control chip 440 outputs an optical power alarm signal to the gold finger 301 . The alarm signal may be transmitted to the host computer 100 via the gold finger 301 .

[0089] Typically, when the current optical power of the optical module is less than or equal to the second limit threshold, the optical power of the optical module exceeds the normal range, the optical transmitting chip 410 degrades, and the control chip 440 outputs an optical power alarm signal to the gold finger 301. The alarm signal can be transmitted to the host computer 100 via the gold finger 301, and the degradation information is reported to the host computer 100.

[0090] FIG6 is a schematic diagram of a second partial structure of an optical module according to some embodiments of the present disclosure. As shown in FIG6 , the gold finger 301 includes a warning gold finger 3011 . The warning gold finger 3011 is connected to the control chip 440 .

[0091] For the convenience of description, when the optical power value is the first limit threshold, the bias current output by the control chip 440 is the first bias current.

[0092] In some embodiments, a second bias current is preset in the control chip 440 of the optical module. When the current optical power is less than or equal to the second limit threshold, the control chip 440 outputs the second bias current to the driving circuit to increase the magnitude of the bias current of the driving circuit. When the current optical power is less than or equal to the second limit threshold, the performance of the optical emission chip 410 degrades.

[0093] For the convenience of description, when the optical power value is less than or equal to the second limit threshold, the current output by the control chip 440 is the second bias current.

[0094] The control chip 440 may be configured to output a second bias current to the driving circuit when the current optical power is less than or equal to a second limit threshold, so as to increase the bias current of the driving circuit.

[0095] In some embodiments, due to an interruption or light-off during signal transmission, the optical power value of the optical emitting chip 410 is 0 at a certain moment. However, at this time, the performance of the optical emitting chip 410 in the optical module has not degraded, and degradation compensation is not required at this time. The control chip 440 can be configured as follows: when the current optical power is less than or equal to the second limit threshold, the degradation count is increased by one. When the degradation count is greater than or equal to the preset value, the control chip 440 outputs a second bias current to the driving circuit. When the current optical power is 0, the degradation count is cleared. After the optical power value is 0, indicating that the signal is interrupted or the light is turned off, the optical module restarts normally, and the degradation count is cleared to avoid degradation compensation for the normal optical module.

[0096] In some embodiments, if the current optical power is less than or equal to the second limit threshold and is not zero, the degradation count is incremented by one. If the degradation count is greater than or equal to a preset value, the control chip 440 outputs the second bias current. If the current optical power remains less than or equal to the second limit threshold, indicating that the optical module's optical transmitter chip 410 is continuously degraded, the control chip 440 continues to output the second bias current.

[0097] In some embodiments, the second bias current may be greater than the first bias current. The first bias current is the bias current applied to the light emitting chip 410 when the light emitting chip 410 is operating normally. The second bias current is the bias current applied to the light emitting chip 410 after the light emitting chip 410 has degraded.

[0098] In some embodiments, the second bias current may be 10 to 20 times greater than the first bias current.

[0099] In some embodiments, the second bias current may be 10 times the first bias current, 13.5 times the first bias current, or 20 times the first bias current.

[0100] The second bias current is greater than the normal operating current of the light emitting chip 410 , and can drive the degraded light emitting chip 410 so that the degraded light emitting chip 410 can continue to work.

[0101] In some embodiments, when the optical module is not degraded, the bias current is approximately 10-40 mA; when the optical module is degraded, the bias current is approximately 100-800 mA. For example, the first bias current may be 10 mA, the second bias current may be 100 mA, the second bias current may be 135 mA, and the second bias current may be 200 mA. For another example, the first bias current may be 20.5 mA, the second bias current may be 205 mA, the second bias current may be 276.75 mA, and the second bias current may be 410 mA. For another example, the first bias current may be 40 mA, the second bias current may be 400 mA, the second bias current may be 540 mA, and the second bias current may be 800 mA.

[0102] In some embodiments, the control chip 440 may determine whether degradation compensation has been currently performed.

[0103] The control chip 440 can obtain the output bias current. If the output bias current is the second bias current, it indicates that degradation compensation is currently in progress. If degradation compensation is currently in progress, the degradation counter is incremented by one. If degradation compensation is not currently in progress, the degradation counter is reset to zero. Even if the current optical power exceeds the second limit threshold while in degradation compensation mode, degradation has occurred on the optical transmitter chip 410 and degradation compensation should continue.

[0104] In some embodiments, the control chip 440 can be configured to: reset the degradation count when the current optical power is 0; reset the degradation count when the current optical power is not 0, the current optical power is greater than the second limit threshold, and the output bias current is not the second bias current; and increment the degradation count by 1 when the current optical power is not 0, the current optical power is less than or equal to the second limit threshold. When the degradation count is greater than or equal to a preset value, the output bias current is set to the second bias current.

[0105] In some examples, the current optical power of 0 may be an optical power value detected by the photodetector 420. In some examples, the current optical power of 0 may be a light-off signal received from the host computer 100. In some examples, the current optical power of 0 may be an output signal interruption of the host computer 100.

[0106] The current optical power is 0, indicating that an interruption or light shutoff occurs during signal transmission. However, the performance of the optical transmitter chip 410 in the optical module has not degraded, and degradation compensation is not required. The output bias current is not the second bias current, indicating that the optical transmitter chip 410 has not been compensated for degradation. The current optical power is not 0, and the current optical power is greater than the second limit threshold, indicating that the optical power of the optical transmitter chip 410 can still meet the demand. The current optical power is not 0, and the current optical power is greater than the second limit threshold, the output bias current is not the second bias current, and the degradation count is cleared. Records that are not in a continuous degradation state are cleared so that degradation compensation is performed after the degradation state continues for the preset value, thereby extending the life cycle of the optical module.

[0107] The control chip 440 can be configured to output a control voltage according to the lookup table when the current optical power is greater than or equal to the first limit threshold, and output a first bias current when the current optical power is less than the first limit threshold or greater than the second limit threshold.

[0108] The control chip 440 may be configured to modulate the bias current according to the magnitude of the control voltage output from the lookup table when the current optical power is greater than the second limit threshold.

[0109] The control chip 440 may be configured to: when the current optical power is greater than the second limit threshold, output a control voltage according to the target optical power value and modulate the bias current.

[0110] For the convenience of description, the compensation current when the current optical power is greater than the second limit threshold, that is, when the optical emission chip is not degraded, is defined as the normal bias current.

[0111] In some embodiments, the optical transmitter chip can use a lookup table to output a bias current to compensate for the optical power of the optical transmitter chip. When the optical power continuously falls below a second limit threshold, an optical power alarm signal is output, and the voltage output to the control chip 440 is set to the second bias current. This allows the degraded optical transmitter chip to transmit again, extending the lifecycle of the optical module.

[0112] Degradation is detected by recording degradation counts. If the count exceeds a threshold, the degradation state is determined to be stable. The bias current is adjusted upward within a certain range to return the transmitted optical power to normal.

[0113] In some embodiments, the control chip 440 can be configured to obtain a calibration value, compare the calibration value with a preset calibration coefficient, and if the calibration value differs from the preset calibration coefficient, it indicates that the optical module has been calibrated for transmit optical power, and the next step is performed. If the calibration value is the same as the preset calibration coefficient, it indicates that the optical module has not been calibrated for transmit optical power, and the degradation counter is reset to zero. After the optical module is calibrated, the calibration value is stored in a preset location.

[0114] In some embodiments, the transmitted optical power usually needs to be calibrated. Before the optical power is calibrated, the optical power of the module is inaccurate. Therefore, before the optical power is calibrated, the degradation count is reset to zero and no degradation judgment is performed.

[0115] In some embodiments, the control chip 440 may be configured to:

[0116] Get the calibration value. If the calibration value is the same as the preset calibration coefficient, the degradation count is reset to zero.

[0117] If the calibration value is different from the preset calibration coefficient and the current optical power is 0, the degradation count is reset;

[0118] If the calibration value is different from the preset calibration coefficient, the current optical power is greater than the second limit threshold, and the output bias current is not the second bias current, the degradation count is reset;

[0119] If the calibration value is different from the preset calibration coefficient, the current optical power is not 0, or the current optical power is less than or equal to the second limit threshold, the degradation count is incremented by 1.

[0120] When the degradation count is greater than or equal to a preset value, the output is a second bias current.

[0121] After the emission optical power is calibrated and the number of times the continuous optical power is less than or equal to the second limit threshold reaches a preset value, the control chip 440 compensates for the degradation of the optical emission chip to extend the life cycle of the optical module.

[0122] In some embodiments, degradation determination of a transmitting chip is generally related to module characteristics, and a low power warning threshold may be used as a degradation determination threshold.

[0123] In some embodiments, the calibration value is different from the preset calibration coefficient, the current optical power is greater than the second limit threshold, and the output bias current is not the second bias current, indicating that the optical module has been calibrated. The current optical power is greater than the second limit threshold, and the output bias current is not the second bias current, indicating that degradation compensation has not been performed and the optical emission chip has not degraded.

[0124] Figure 7 is a schematic diagram of a method for controlling transmitted optical power according to some embodiments of the present disclosure. In some embodiments, a method for controlling the transmitted optical power of an optical module is also provided. As shown in Figure 7, the method for controlling transmitted optical power may include: S100: Obtaining a calibration value. Transmitted optical power typically requires calibration, and the calibration value is stored in a preset location.

[0125] The method for controlling transmitted optical power may include: S200: Obtaining current optical power and current bias current. The current optical power is the optical power of the optical emitting component detected by the photodetector 420. The control chip 440 may convert the electrical signal from the photodetector 420 into an analog value. The control chip 440 may also obtain the bias current of the control chip 440.

[0126] The method for controlling the transmitted optical power may include: S300: the calibration value is the same as the preset calibration coefficient, and the degradation count is cleared. If the calibration value is the same as the preset calibration coefficient, it means that the optical module has not been calibrated for the transmitted optical power, and the degradation count is cleared.

[0127] The method for controlling transmitted optical power may include: S400: when the calibration value differs from a preset calibration coefficient and the current optical power is 0, a degradation counter is reset. The current optical power being 0 indicates an interruption or light shutoff during signal transmission, but the performance of the optical transmitter chip in the optical module is not necessarily degraded, and degradation compensation is not required.

[0128] The method for controlling transmitted optical power may include: S500: if the calibration value differs from a preset calibration coefficient, the current optical power is greater than a second limit threshold, and the output bias current is not the second bias current, the degradation count is cleared. If the current optical power is not zero, the current optical power is greater than the second limit threshold, and the output bias current is not the second bias current, the degradation count is cleared, and records of non-continuous degradation states are cleared.

[0129] The method for controlling the transmitted optical power may include: S600: if the calibration value is different from a preset calibration coefficient, the current optical power is not 0, or the current optical power is less than or equal to a second limit threshold, the degradation count is increased by 1.

[0130] In some embodiments, if the calibration value is different from the preset calibration coefficient, the current optical power is not 0, the current optical power is greater than the second limit threshold, and the bias current is the second bias current, the degradation count is incremented by 1. The degradation count is continuously incremented during the degradation compensation period.

[0131] The method for controlling transmitted optical power may include: S700: When the degradation count is greater than or equal to a preset value, setting the bias current to a second bias current. After the transmitted optical power is calibrated and the number of times the optical power is continuously less than or equal to the second limit threshold reaches a preset value, the control chip 440 performs degradation compensation on the optical transmitter chip to extend the lifecycle of the optical module.

[0132] In some embodiments, when the degradation count is greater than or equal to a preset value, the magnitude of the bias current may be controlled according to a degradation compensation table.

[0133] For example, the bias current in the degradation compensation table includes: a second bias current and a normal compensation current value. When the degradation count is greater than or equal to a preset value, the output bias current is the sum of the second bias current and the normal compensation current value.

[0134] In some embodiments, when the degradation count is greater than or equal to a preset value, the current temperature value is obtained, and the conventional compensation current value corresponding to the current temperature value is searched according to the lookup table, and the output bias current is the sum of the second bias current and the conventional compensation current value.

[0135] The method for controlling transmitted optical power may include: S800: if the calibration value is different from the preset calibration coefficient and the current optical power is greater than the second limit threshold, compensating the optical power according to the lookup table. Compensating the optical power according to the lookup table may include adjusting the bias current according to the lookup table.

[0136] In some embodiments, the bias current corresponding to the second bias current is greater than the operating current of the light emitting chip.

[0137] In some embodiments, the method for controlling the transmitted optical power may include: S900: outputting an optical power alarm signal if the calibration value is different from a preset calibration coefficient, the current optical power is not 0, or the current optical power is less than or equal to a second limit threshold.

[0138] Some embodiments of the present disclosure can maintain the transmitted optical power of the optical module within a certain range during normal use. When degradation occurs, the optical power will drop, and an alarm or warning will be reported. By increasing the bias current, degradation compensation is performed after the degradation state continues for a preset value, thereby extending the life cycle of the optical module.

[0139] In some embodiments, the preset value may be 100. The preset value may be 200. The preset value may be 300. The preset value may be any natural number greater than 2, and may be set according to actual needs.

[0140] Figure 8 is a schematic diagram of a method for controlling transmitted optical power according to some embodiments of the present disclosure. As shown in Figure 8 , the method for controlling transmitted optical power may include: S200: Obtaining current optical power and obtaining a bias current. The current optical power is the optical power of the light emitting component detected by the photodetector. The control chip 440 may convert the electrical signal from the photodetector into an analog value. The control chip 440 may also obtain a bias current for the control chip 440.

[0141] The control method for transmitting optical power may include: T400: Current optical power is 0, and degradation counter is cleared. The current optical power of 0 indicates that there is an interruption or light shutoff during signal transmission, but the performance of the optical transmitter chip in the optical module is not necessarily degraded at this time, and degradation compensation is not required in this case.

[0142] The method for controlling the transmitted optical power may include: T500: if the current optical power is not zero, the current optical power is greater than the second limit threshold, and the bias current is not the second bias current, the degradation count is cleared. If the current optical power is not zero, the current optical power is greater than the second limit threshold, and the bias current is not the second bias current, the degradation count is cleared, and records of non-continuous degradation states are cleared.

[0143] The method for controlling the transmitted optical power may include: T600: the current optical power is not 0, the current optical power is less than or equal to the second limit threshold, the bias current is the second bias current, and the degradation count is increased by 1.

[0144] The method for controlling transmitted optical power may include: S700: When the degradation count is greater than or equal to a preset value, setting the bias current to a second bias current. After the transmitted optical power is calibrated and the number of times the optical power is continuously less than or equal to the second limit threshold reaches a preset value, the control chip 440 performs degradation compensation on the optical transmitter chip to extend the lifecycle of the optical module.

[0145] The method for controlling the transmitted optical power may include: T800: if the current optical power is greater than or equal to a first limit threshold, the optical power is compensated according to a lookup table.

[0146] In some embodiments, the first limit threshold is greater than the second limit threshold. The bias current corresponding to the second bias current is greater than the operating current of the light emitting chip.

[0147] In some embodiments, the method for controlling the transmitted optical power may include: T900: if the current optical power is not 0 and the current optical power is less than or equal to a second limit threshold, an optical power alarm signal is output.

[0148] Some embodiments of the present disclosure can maintain the transmitted optical power of the optical module within a certain range during normal use. When degradation occurs, the optical power will drop, and the module will report an alarm or warning. By increasing the bias current, degradation compensation is performed after the degradation state continues for a preset value, thereby extending the life cycle of the optical module.

[0149] FIG9 is a second schematic diagram of a method for controlling transmitted optical power according to some embodiments of the present disclosure. As shown in FIG9 , in some embodiments, the method for controlling transmitted optical power may include: T100: if the current optical power is greater than or equal to a first limit threshold and the current optical power is not equal to a target optical power, adjusting the bias current so that the current optical power is equal to the target optical power.

[0150] In the embodiment of the present disclosure, the current optical power is compared with the target optical power. When the current optical power is greater than the target optical power, the bias current is increased; when the current optical power is less than the target optical power, the bias current is reduced; when the current optical power is equal to the target optical power, the bias current remains unchanged.

[0151] The control chip 440 may adjust the bias current according to the target optical power so that the current optical power is equal to the target optical power.

[0152] FIG10 is a third schematic diagram of a method for controlling transmitted optical power according to some embodiments of the present disclosure. As shown in FIG10 , in some embodiments, the method for controlling transmitted optical power may include: S100: Obtaining a calibration value. Transmitted optical power typically requires calibration, and the calibration value is stored in a preset location.

[0153] The method for controlling transmitted optical power may include: S200: obtaining current optical power and bias current. The current optical power is the optical power of the optical emitting component detected by the photodetector. The control chip 440 may convert the electrical signal from the photodetector into an analog value. The control chip 440 may also obtain the bias current of the control chip 440.

[0154] The method for controlling the transmitted optical power may include: S300: the calibration value is the same as the preset calibration coefficient, and the degradation count is cleared. If the calibration value is the same as the preset calibration coefficient, it means that the optical module has not been calibrated for the transmitted optical power, and the degradation count is cleared.

[0155] The method for controlling transmitted optical power may include: S400: when the calibration value differs from a preset calibration coefficient and the current optical power is 0, a degradation counter is reset. The current optical power being 0 indicates an interruption or light shutoff during signal transmission, but the performance of the optical transmitter chip in the optical module is not necessarily degraded, and degradation compensation is not required.

[0156] The method for controlling transmitted optical power may include: S500: if the calibration value differs from a preset calibration coefficient, the current optical power is greater than a second limit threshold, and the bias current is not the second bias current, the degradation count is reset. If the current optical power is greater than the second limit threshold, the bias current is not the second bias current, the degradation count is reset, and records of non-continuous degradation states are cleared.

[0157] The method for controlling the transmitted optical power may include: S600: if the calibration value is different from the preset calibration coefficient and the current optical power is less than or equal to the second limit threshold, the degradation count is increased by 1.

[0158] In some embodiments, the bias current being the second bias current indicates that degradation compensation has been performed, and degradation counting is no longer required, and the system remains in a degradation compensation state.

[0159] In some embodiments, when the degradation count is equal to a preset value, the bias current is modified to a second bias current. After the degradation count is equal to the preset value, the control chip controls the bias current to be the second bias current.

[0160] In some embodiments, when the degradation count is equal to a preset value, the bias current is modified to a second bias current. After the degradation count is equal to the preset value, the control chip controls the bias current to be the sum of the second bias current and a normal compensation current value.

[0161] The method for controlling transmitted optical power may include: S700: When the degradation count is greater than or equal to a preset value, setting the bias current to a second bias current. After the transmitted optical power is calibrated and the number of times the optical power is continuously less than or equal to the second limit threshold reaches a preset value, the control chip 440 performs degradation compensation on the optical transmitter chip to extend the lifecycle of the optical module.

[0162] The control method of the transmitted optical power may include: A800: if the calibration value is different from the preset calibration coefficient, the current optical power is greater than or equal to the first limit threshold, and the current optical power is not equal to the target optical power, the bias current is adjusted to make the current optical power equal to the target optical power.

[0163] In some embodiments, the first limit threshold is greater than the second limit threshold. The bias current corresponding to the second bias current is greater than the operating current of the light emitting chip.

[0164] In some embodiments, the method for controlling the transmitted optical power may include: S900: outputting an optical power alarm signal if the calibration value is different from a preset calibration coefficient, the current optical power is not 0, or the current optical power is less than or equal to a second limit threshold.

[0165] Some embodiments of the present disclosure can maintain the transmitted optical power of the optical module within a certain range during normal use. When degradation occurs, the optical power will drop, and an alarm or warning will be reported. By increasing the bias current, degradation compensation is performed after the degradation state continues for a preset value, thereby extending the life cycle of the optical module.

[0166] In some embodiments, the optical module 200 is connected to the host computer 100, which can power and provide control signals to the functional chips of the optical module 200. When the optical module 200 receives the light-off signal, it turns off the light emitting chip 410 and does not control other optoelectronic chips, resulting in high power consumption.

[0167] Therefore, some embodiments of the present disclosure further provide an optical module to reduce power consumption. Figure 11 is a third partial structural diagram of an optical module provided according to some embodiments of the present disclosure. As shown in Figure 11, in some embodiments, the optical module may include an MCU 311. MCU 311 can be connected to the gold finger 301 to receive communication signals from the host computer 100.

[0168] In some embodiments, the MCU 311 may receive a light-off instruction from the host computer 100. The MCU 311 may receive a low-power instruction from the host computer 100.

[0169] The host computer 100 can issue a light-off instruction via the IIC. The host computer 100 can issue a low-power instruction via the IIC.

[0170] The optical module may include: an emission driver chip 313. The emission driver chip 313 may be connected to the MCU 311. The MCU 311 controls the light emission chip 410 by controlling the emission driver chip.

[0171] The optical module may include a TEC chip, and the MCU 311 may control the temperature of the TEC chip.

[0172] The optical module may include a TEC control chip 312 . The TEC control chip 312 may be connected to an MCU 311 . The MCU 311 may control the voltage of the TEC control chip 312 .

[0173] The optical module may include a CDR chip 315. The CDR chip 315 may be connected to the MCU 311. The MCU may control the switching of the CDR chip.

[0174] The optical module may include an APD circuit 314. The APD circuit 314 may be connected to the MCU 311. The MCU may control the voltage of the APD control circuit. The APD circuit is a photodetector boost circuit.

[0175] The optical module may include a light receiving chip 316. The light receiving chip 316 may be connected to the MCU 311. The light receiving chip 316 may convert an optical signal into an electrical signal. The MCU 311 may control the switching of the light receiving chip.

[0176] Figure 12 is a schematic diagram of an MCU structure according to some embodiments of the present disclosure. Figure 13 is a schematic diagram of a fourth partial structure of an optical module according to some embodiments of the present disclosure.

[0177] In some embodiments, the MCU 311 may include an emission control pin 3111. The emission control pin 3111 is connected to the emission driver chip 313. The MCU 311 may write an emission shutdown signal into a register in the emission driver chip 313 via the emission control pin 3111 to enable the light emitting chip 410 to be turned on and off.

[0178] For example, when the value of the register in the emission driver chip 313 is 0, the emission driver chip 313 does not output a driving voltage to the light emitting chip 410, so that the light emitting chip 410 is turned off. When the value of the register in the emission driver chip 313 is 1, the emission driver chip 313 outputs a driving voltage to the light emitting chip 410, so that the light emitting chip 410 is turned on.

[0179] The optical module may include a TEC control chip 312 . The TEC control chip 312 may be connected to an MCU 311 . The MCU 311 may control the voltage of the TEC control chip 312 .

[0180] In some embodiments, the TEC control chip 312 can be a temperature control chip, such as the GNA4007 or SGM41296. The MCU outputs a temperature control voltage to the TEC control chip 312, which implements temperature feedback control. The TEC control chip 312 controls the temperature of the TEC. The light emitting chip 410 is thermally connected to the TEC, and the TEC controls the temperature of the light emitting chip 410.

[0181] The MCU 311 may include a temperature control pin 3112. The temperature control pin 3112 is connected to the TEC control chip 312. The MCU may control the switching of the TEC chip by controlling the magnitude of the output temperature control voltage.

[0182] The optical module may include a CDR chip 315 . The CDR chip 315 may be connected to the MCU 311 .

[0183] In some embodiments, the MCU 311 may include a CDR control pin 3113. The CDR control pin 3113 is connected to the CDR chip 315. The MCU may write a CDR control signal into a register within the CDR control pin 3113 via the CDR control pin 3113 to enable the light emitting chip 410 to be turned on or off.

[0184] For example, when the register value in the CDR control pin 3113 is 0, the CDR control pin 3113 does not output a driving voltage to the light emitting chip 410, so that the light emitting chip 410 is turned off. When the register value in the CDR control pin 3113 is 1, the emission driver chip 313 outputs a driving voltage to the light emitting chip 410, so that the light emitting chip 410 is turned on.

[0185] The optical module may include an APD circuit 314 . The APD circuit 314 may be connected to the MCU 311 .

[0186] In some embodiments, the MCU 311 may include an APD control pin 3114. The APD control pin 3114 is connected to the APD control circuit 314. The MCU may control the voltage of the APD control circuit through the APD control pin 3114.

[0187] The APD circuit 314 may be connected to the light emitting chip 410 to adjust the output optical power of the light emitting chip 410 .

[0188] The optical module may include a light receiving chip 316. The light receiving chip 316 may be connected to the MCU 311. The light receiving chip 316 may convert an optical signal into an electrical signal.

[0189] In some embodiments, the MCU 311 may include a receiving control pin 3115. The receiving control pin 3115 is connected to the optical receiving chip 316. The MCU can write a signal to turn off the optical receiving chip into a register in the optical receiving chip 316 via the receiving control pin 3115 to turn the optical receiving chip 316 on and off.

[0190] In some embodiments, a power consumption register is provided within the MCU. When the power consumption instruction value within the power consumption register is a first preset value, it may indicate that a low power consumption instruction has been received. When the power consumption instruction value within the power consumption register is a second preset value, it may indicate that a high power consumption instruction has been received.

[0191] In some embodiments, the first preset value may be 1, and the second preset value may be 0. Alternatively, the first preset value may be 0 and the second preset value may be 1. The host computer 100 may write the power consumption instruction into the power consumption register. In some embodiments, the MCU includes a light instruction register. When the light instruction value in the light instruction register is a third preset value, it may indicate that a light-on instruction has been received. When the light instruction value in the light instruction register is a fourth preset value, it may indicate that a light-off instruction has been received.

[0192] In some embodiments, the third preset value may be 1, and the fourth preset value may be 0. Alternatively, the third preset value is 0, and the fourth preset value is 1. The host computer 100 may write the light instruction into the light instruction register.

[0193] The MCU can be configured to control the shutdown of the emission driver chip according to the light-on instruction and low-power instruction.

[0194] The MCU can be configured to: upon receiving a low-power instruction and a light-on instruction, control the emission driver chip to shut down, thereby shutting down the light emitting chip 410. When the power instruction value in the power consumption register is a first preset value and the light instruction value in the light instruction register is a third preset value, control the emission driver chip to shut down, thereby shutting down the light emitting chip 410.

[0195] The MCU can be configured to: control the light emitting chip 410 to turn off when receiving a low power instruction and a light on instruction. When the power instruction value in the power register is a first preset value and the light instruction value in the light instruction register is a third preset value, the light emitting chip 410 is controlled to turn off.

[0196] In some embodiments, turning off the emission driver chip may include writing an emission control signal into a register within the emission driver chip 313 to implement switching of the light emitting chip 410 .

[0197] In some embodiments, turning off the light emitting chip 410 may be achieved by turning off the emission driving chip 313 .

[0198] The MCU can be configured to control the TEC control chip to shut down when receiving a low-power instruction or a light-on instruction.

[0199] When the power consumption instruction value in the power consumption register is a first preset value and the light instruction value in the light instruction register is a third preset value, the TEC control chip is controlled to be turned off.

[0200] In some embodiments, shutting down the TEC control chip may include outputting a temperature control voltage to shut down the TEC control chip. The MCU sends the temperature control voltage to shut down the TEC control chip.

[0201] The MCU can be configured to control the CDR chip to shut down when receiving a low-power command or a light-on command.

[0202] When the power consumption instruction value in the power consumption register is a first preset value and the light instruction value in the light instruction register is a third preset value, the CDR chip is controlled to be turned off.

[0203] In some embodiments, shutting down the CDR chip may be writing a CDR control signal into a register in the CDR chip to turn the CDR chip on and off. The MCU sends a CDR chip shut-down instruction to the CDR chip.

[0204] The MCU can be configured to reduce the voltage of the APD circuit when receiving a low-power instruction or a light-on instruction.

[0205] In some embodiments, the MCU can be configured to: upon receiving a low-power command or a light-on command, send a CDR chip shutdown command to the CDR chip, send a temperature control voltage to shut down the TEC control chip, send a light-receiving chip shutdown signal to the light-receiving chip, reduce the voltage of the APD circuit, and send a light-emission shutdown signal to the emission driver chip to shut down the light-emitting chip 410. In some embodiments, the light-emitting chip 410 is shut down after the TEC control chip is shut down to ensure that the temperature of the light-emitting chip 410 is appropriate during the light-emitting process.

[0206] The MCU can be configured as follows: when the power consumption instruction value in the power consumption register is a first preset value and the light instruction value in the light instruction register is a third preset value, a CDR chip shutdown instruction is sent to the CDR chip, a temperature control voltage is sent to shut down the TEC control chip, a light receiving chip shutdown signal is sent to the light receiving chip, the voltage of the APD circuit is reduced, and a light emission drive shutdown signal is sent to the emission driver chip to shut down the light emission chip 410.

[0207] The MCU can be configured to shut down the CDR chip and the light receiving chip when receiving a low-power command or a light-on command, reduce the voltage of the APD circuit, shut down the light emitting driver chip, and shut down the TEC control chip. This enables the CDR chip, TEC control chip, light receiving chip, and light emitting driver chip to be shut down, and the voltage of the APD circuit to be reduced, thereby reducing power consumption.

[0208] In some embodiments, when the MCU receives a low-power instruction and a light-on instruction, the control process is the same as when the MCU receives a low-power instruction and a light-off instruction.

[0209] The MCU can be configured to, upon receiving a low-power command or a light-off command, shut down the CDR chip, shut down the light receiving chip, reduce the voltage of the APD circuit, shut down the light emitting chip 410, and shut down the TEC control chip. This enables the CDR chip, TEC control chip, light receiving chip, and light emitting chip 410 to be shut down, and the voltage of the APD circuit to be reduced, thereby reducing power consumption.

[0210] In some embodiments, a power consumption ranking table of optoelectronic devices may be preset in the MCU. Upon receiving a low-power instruction, optoelectronic devices with power consumption rankings less than or equal to a preset value are turned off. The power consumption ranking table lists the devices in descending order of power consumption.

[0211] In some examples, the preset value may be 3; the preset value may be 4; the preset value may be 5; the preset value may be 6 or other values.

[0212] For example, a power consumption ranking table of optoelectronic devices may be preset in the MCU. After receiving a low power consumption instruction, optoelectronic devices with a power consumption ranking less than or equal to 5 are turned off.

[0213] For example, a power consumption ranking table of optoelectronic devices may be preset in the MCU. After receiving a low power consumption instruction, optoelectronic devices with a power consumption ranking less than or equal to 6 are turned off.

[0214] The MCU may be configured to receive a low-power consumption instruction and, according to a preset power consumption ranking table, control the first power consumption device to be turned off, control the second power consumption device to be turned off, and control the third power consumption device to be turned off.

[0215] The MCU may be configured to control the emission driver chip to turn off, so as to turn off the light emitting chip 410 , upon receiving a low power consumption instruction and a light-on instruction.

[0216] When the power consumption instruction value in the power consumption register is the first preset value and the light instruction value in the light instruction register is the third preset value, it represents that the low power consumption instruction and the light-on instruction are received.

[0217] When the power consumption instruction value in the power consumption register is the first preset value and the light instruction value in the light instruction register is the third preset value, the emission driving chip is controlled to be turned off to turn off the light emitting chip 410 .

[0218] In some embodiments, turning off the emission driver chip 410 may include writing an emission control signal into a register within the emission driver chip 313 to implement switching of the light emitting chip 410 .

[0219] The MCU can be configured to control the TEC chip to shut down when receiving a low-power command and a light-off command.

[0220] The MCU can be configured to control the TEC control chip to shut down when receiving a low-power command and a light-off command.

[0221] In some embodiments, controlling the TEC control chip to shut down may include outputting a temperature control voltage to shut down the TEC control chip. The MCU sends the temperature control voltage to shut down the TEC control chip.

[0222] The MCU can be configured to control the CDR chip to shut down when receiving a low-power command and a light-off command.

[0223] In some embodiments, controlling the CDR chip to shut down may include writing a CDR control signal into a register in the CDR chip to turn the CDR chip on and off. The MCU sends a CDR chip shut down instruction to the CDR chip.

[0224] The MCU can be configured to reduce the voltage of the APD circuit when receiving a low-power instruction and a light-off instruction.

[0225] In some embodiments, the MCU can be configured to, upon receiving a low-power command and a light-off command, send a CDR chip shutdown command to the CDR chip, send a temperature control voltage to shut down the TEC control chip, send a light-receiving chip shutdown signal to the light-receiving chip, reduce the voltage of the APD circuit, and send a light-emission shutdown drive signal to the emission driver chip to shut down the light-emitting chip 410. In some embodiments, the light-emitting chip 410 is shut down after the TEC control chip is shut down to ensure that the temperature of the light-emitting chip 410 is appropriate during the light-emitting process.

[0226] The MCU can be configured to shut down the CDR chip and the light receiving chip when receiving low-power and light-off commands, reduce the voltage of the APD circuit, shut down the light emitting driver chip, and shut down the TEC control chip. This reduces power consumption by shutting down the CDR chip, TEC control chip, light receiving chip, and light emitting driver chip, and reducing the voltage of the APD circuit.

[0227] In some embodiments, when the MCU receives a low-power instruction or a light-off instruction, the control process is the same as when the MCU receives a low-power instruction or a light-on instruction.

[0228] The MCU can be configured to shut down the CDR chip and the light receiving chip when receiving low-power and light-off commands, reduce the voltage of the APD circuit, shut down the light emitting driver chip, and shut down the TEC control chip. This enables the CDR chip, TEC control chip, light receiving chip, and light emitting driver chip to be shut down, and the voltage of the APD circuit to be reduced, thereby reducing power consumption.

[0229] In some embodiments, when receiving a low power consumption instruction and a light-off instruction, the light emitting chip 410 may be first controlled to be turned off, and then the TEC chip may be turned off. Receiving the light-off instruction indicates that the optical module currently has no signal transmission requirements and therefore does not need to perform temperature control.

[0230] The MCU can be configured to, upon receiving a low-power command and a light-off command, shut down the CDR chip, shut down the light-receiving chip, reduce the voltage of the APD circuit, shut down the TEC control chip, and shut down the light-emitting chip 410. This enables the CDR chip, TEC chip, light-receiving chip, and light-emitting chip 410 to be shut down, and the voltage of the APD circuit to be reduced, thereby reducing power consumption.

[0231] The control sequence of the CDR chip, the APD circuit, and the optical receiving chip can be arranged according to the power consumption or in any order.

[0232] In some embodiments, a power consumption ranking table of optoelectronic devices may be preset in the MCU. Upon receiving a low-power instruction, optoelectronic devices with power consumption rankings less than or equal to a preset value are turned off. The power consumption ranking table lists the devices in descending order of power consumption.

[0233] In some examples, the preset value may be 3; the preset value may be 4; the preset value may be 5; the preset value may be 6 or other values.

[0234] For example, a power consumption ranking table of optoelectronic devices may be preset in the MCU. After receiving a low power consumption instruction, optoelectronic devices with a power consumption ranking less than or equal to 5 are turned off.

[0235] For example, a power consumption ranking table of optoelectronic devices may be preset in the MCU. After receiving a low power consumption instruction, optoelectronic devices with a power consumption ranking less than or equal to 6 are turned off.

[0236] In some embodiments, the MCU may be configured to: activate the low power consumption mode when the power consumption instruction value in the power consumption register is a first preset value.

[0237] When the power consumption instruction value in the power consumption register is a first preset value, a CDR chip shutdown instruction is sent to the CDR chip, a temperature control voltage is sent to shut down the TEC control chip, a light receiving chip shutdown signal is sent to the light receiving chip, the voltage of the APD circuit is reduced, and a light emission drive shutdown signal is sent to the emission driver chip to shut down the light emission chip 410.

[0238] When the power consumption instruction value in the power consumption register reaches a first preset value, the CDR chip is turned off, the light receiving chip is turned off, the voltage of the APD circuit is reduced, the light emitting driver chip is turned off, and the TEC control chip is turned off. This achieves the goal of turning off the CDR chip, the TEC control chip, the light receiving chip, the light emitting driver chip, and reducing the voltage of the APD circuit, thereby reducing power consumption.

[0239] When the power consumption instruction value in the power consumption register is the first preset value, it means that a low power consumption instruction has been received. In this case, it is not necessary to determine whether to turn off the light and enter the low power consumption mode.

[0240] In some embodiments, when the power consumption instruction value in the power consumption register is set to change from the second preset value to the first preset value, it represents that the MCU has received a low power consumption instruction.

[0241] The MCU can be configured to: when the power consumption instruction value in the power consumption register changes from the second preset value to the first preset value, control the CDR chip to shut down, control the light receiving chip to shut down, reduce the voltage of the APD circuit, control the light emitting driver chip to shut down, and control the TEC control chip to shut down. This achieves the goal of shutting down the CDR chip, TEC control chip, light receiving chip, light emitting driver chip, and reducing the voltage of the APD circuit, thereby reducing power consumption.

[0242] FIG14 is a schematic diagram of a method for controlling power consumption of an optical module according to some embodiments of the present disclosure. As shown in FIG14 , the present disclosure provides a method for controlling power consumption of an optical module, which may include:

[0243] S100: Receive a low power consumption instruction. The low power consumption instruction may be received by setting a power consumption instruction value in a power consumption register to a first preset value.

[0244] S200 : Turn off the light emitting chip 410 .

[0245] S300: Turn off the TEC chip.

[0246] S400: Turn off the CDR chip.

[0247] S500: Lowering the voltage of the APD circuit.

[0248] S600: Turn off the optical receiving chip.

[0249] When the optical module receives the low power consumption instruction, it turns off the optical transmitting chip 410, the TEC chip, the CDR chip and the optical receiving chip, and reduces the voltage of the APD circuit, so that the power consumption of the optical module is reduced to meet the low power consumption requirement.

[0250] In some embodiments, the MCU may be configured to: receive a high power consumption instruction, receive a light-on instruction, and control the TEC control chip to turn on, so that the TEC operates normally.

[0251] When the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is the third preset value, it means that the MCU receives a high power consumption instruction and a light-on instruction, and enters a high power consumption light-on mode.

[0252] The MCU can be configured to receive a high power consumption instruction and a light-on instruction, and control the CDR chip to turn on. When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the CDR chip is controlled to turn on.

[0253] In some embodiments, controlling the CDR chip to be turned on may include writing a CDR control signal into a register within the CDR chip to turn the CDR chip on and off. The MCU sends a CDR chip turn-on command to the CDR chip. After receiving the CDR chip turn-on command, the CDR chip starts operating.

[0254] The MCU can be configured to: receive a high power consumption instruction and a light-on instruction, control the light emitting chip 410 to turn on. When the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is the third preset value, control the light emitting chip 410 to turn on.

[0255] The MCU can be configured to: upon receiving a high power consumption instruction and a light-on instruction, control the emission driver chip to turn on, thereby turning on the light emitting chip 410. When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, control the emission driver chip to turn on, thereby turning on the light emitting chip 410.

[0256] In some embodiments, turning on the emission driver chip may include writing an emission control signal into a register within the emission driver chip 313 to implement switching of the light emitting chip 410 .

[0257] In some embodiments, turning on the light emitting chip 410 may be achieved by turning on the emission driver chip.

[0258] The MCU can be configured to control the TEC chip to turn on when receiving a high power consumption instruction or a light-on instruction. The TEC chip can also be controlled to turn on when the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value.

[0259] Controlling the TEC chip to turn on can be achieved by controlling the TEC driver chip.

[0260] In some embodiments, turning on the TEC control chip may include outputting a temperature control voltage to turn on the TEC control chip, and the MCU may send the temperature control voltage to turn off the TEC control chip.

[0261] The MCU can be configured to control the CDR chip to turn on when receiving a high power consumption instruction or a light-on instruction. The MCU can also control the CDR chip to turn on when the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value.

[0262] In some embodiments, controlling the CDR chip to be turned on may include writing a CDR control turn-on signal into a register in the CDR chip to turn the CDR chip on and off. The MCU sends a CDR chip turn-on instruction to the CDR chip.

[0263] The MCU can be configured to increase the voltage of the APD circuit when receiving a high power consumption instruction or a light-on instruction. The voltage of the APD circuit can also be increased when the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value.

[0264] In some embodiments, the MCU can be configured to: upon receiving a high-power consumption instruction or a light-on instruction, send a CDR chip-on instruction to the CDR chip, send a temperature control voltage to turn on the TEC control chip, send a light-receiving chip-on signal to the light-receiving chip, increase the voltage of the APD circuit, and send a light-emission-on drive signal to the emission driver chip to turn on the light-emitting chip 410. In some embodiments, the light-emitting chip 410 is turned on after the TEC control chip is turned on to ensure that the temperature of the light-emitting chip 410 is appropriate during the light-emitting process.

[0265] The MCU can be configured to, upon receiving a high-power command or a light-on command, control the CDR chip to turn on, control the light receiving chip to turn on, increase the voltage of the APD circuit, control the transmitter driver chip to turn on, and control the TEC control chip to turn on. This enables the CDR chip, TEC control chip, light receiving chip, light transmitting chip 410 to turn on, and increase the voltage of the APD circuit, allowing the optical module to emit light or receive optical signals.

[0266] FIG15 is a second schematic diagram of a method for controlling power consumption of an optical module according to some embodiments of the present disclosure. As shown in FIG15 , the present disclosure provides a method for controlling power consumption of an optical module, which may include:

[0267] T100: Receives high power consumption instructions, receives light-on instructions, and turns on the TEC chip.

[0268] That is, no low power consumption instruction is received, no light-off instruction is received, and the TEC chip is turned on.

[0269] T200: Receives a high power consumption instruction and a light-on instruction, and turns on the light emitting chip 410.

[0270] That is, no low power consumption instruction is received, no light-off instruction is received, and the light emitting chip 410 is turned on.

[0271] T300: Receives high power consumption instructions, receives light-on instructions, and turns on the CDR chip.

[0272] That is, no low power consumption instruction is received, no light-off instruction is received, and the CDR chip is turned on.

[0273] T400: Receives high power consumption instructions and light-on instructions to increase the voltage of the APD circuit.

[0274] That is, no low power consumption instruction is received, no light-off instruction is received, and the voltage of the APD circuit is increased.

[0275] S500: Receive high power consumption instructions, receive light-on instructions, and turn on the light receiving chip.

[0276] That is, no low power consumption instruction is received, no light-off instruction is received, and the light receiving chip is turned on.

[0277] When the optical module does not receive the low power consumption instruction and the light off instruction, the optical transmitting chip 410, the TEC chip, the CDR chip and the optical receiving chip are turned on to increase the voltage of the APD circuit so that the transmitting and receiving functions of the optical module operate normally.

[0278] In some embodiments, receiving a light-on instruction may be receiving a light-off instruction.

[0279] In some embodiments, the MCU can be configured to receive a high power consumption instruction, receive a light-off instruction, and control the light emitting chip 410 to shut down. When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a fourth preset value, the light emitting chip 410 is controlled to shut down.

[0280] The MCU may be provided with a first state memory, and the first state memory may be used to store the previous power consumption instruction value.

[0281] In some embodiments, the MCU may be provided with a second state memory, which may be used to store the previous light instruction value. The MCU may be configured such that when the previous power instruction value is a first preset value, the current power instruction value remains unchanged when the previous power instruction value is the first preset value.

[0282] The MCU can be configured to shut down the CDR chip, the light receiving chip, and the APD circuit voltage, and shut down the light emitting driver chip and the TEC control chip, respectively, when the previous power consumption instruction value is the second preset value and the current power consumption instruction value is the first preset value. This enables the CDR chip, TEC control chip, light receiving chip, and light emitting driver chip to be shut down, and the APD circuit voltage to be lowered, thereby reducing power consumption.

[0283] When the previous power consumption instruction value is the second preset value and the current power consumption instruction value is the first preset value, the low power consumption mode is entered, and no comparison is required between the previous light instruction value and the current light instruction value.

[0284] The MCU can be configured to: when the previous power consumption instruction value is a first preset value and the current power consumption instruction value is a second preset value; when the previous light instruction value is a third preset value and the current light instruction value is a third preset value, control the CDR chip to turn on, control the light receiving chip to turn on, increase the voltage of the APD circuit, control the emission driver chip to turn on, and control the TEC control chip to turn on. This enables the CDR chip, the TEC control chip, the light receiving chip, the light emitting chip 410 to turn on, and increase the voltage of the APD circuit, so that the optical module emits light or receives light signals.

[0285] The MCU can be configured to: when the previous power consumption instruction value is the first preset value and the current power consumption instruction value is the second preset value; when the previous light instruction value is the fourth preset value and the current light instruction value is the third preset value, control the CDR chip to turn on, control the light receiving chip to turn on, increase the voltage of the APD circuit, and control the TEC control chip to turn on. This enables the CDR chip, TEC control chip, light receiving chip to turn on, and increase the voltage of the APD circuit, so that the optical module can emit light or receive light signals.

[0286] The MCU can be configured to: when the previous power consumption instruction value is a first preset value and the current power consumption instruction value is a second preset value; when the previous light instruction value is a third preset value and the current light instruction value is a third preset value, control the CDR chip to turn on, control the light receiving chip to turn on, increase the voltage of the APD circuit, control the emission driver chip to turn on, and control the TEC control chip to turn on. This enables the CDR chip, the TEC control chip, the light receiving chip, the light emitting chip 410 to turn on, and increase the voltage of the APD circuit, so that the optical module emits light or receives light signals.

[0287] The MCU can be configured to: when the previous power consumption instruction value is the first preset value and the current power consumption instruction value is the second preset value; when the previous light instruction value is the fourth preset value and the current light instruction value is the third preset value, control the CDR chip to turn on, control the light receiving chip to turn on, increase the voltage of the APD circuit, control the emission driver chip to turn on, and control the TEC control chip to turn on. This enables the CDR chip, the TEC control chip, the light receiving chip, the light emitting chip 410 to turn on, and increase the voltage of the APD circuit, so that the optical module can emit light or receive light signals.

[0288] The MCU can be configured as follows: when the previous power consumption instruction value is the first preset value and the current power consumption instruction value is the first preset value; when the previous light instruction value is the fourth preset value and the current light instruction value is the third preset value, the emission driver chip is controlled to turn on, the light emission chip 410 is turned on, and the optical module emits light or receives light signals.

[0289] The MCU can be configured as follows: when the previous power consumption instruction value is the first preset value and the current power consumption instruction value is the first preset value; when the previous light instruction value is the third preset value and the current light instruction value is the fourth preset value, the emission driver chip is controlled to be turned off, thereby turning off the light emission chip 410.

[0290] Figure 16 is a flowchart of a method for controlling power consumption of an optical module according to some embodiments of the present disclosure. Figure 17 is a flowchart of a method for controlling power consumption of an optical module according to some embodiments. As shown in Figures 16 and 17, the present disclosure provides a method for controlling power consumption of an optical module, which may include:

[0291] A01: Determine whether to receive a low power consumption instruction.

[0292] A02: Determine whether the light-off command is received.

[0293] S200 : Turn off the light emitting chip 410 .

[0294] S300: Turn off the TEC chip.

[0295] S400: Turn off the CDR chip.

[0296] S500: Lowering the voltage of the APD circuit.

[0297] S600: Turn off the optical receiving chip.

[0298] T01: Turn on the TEC chip.

[0299] T02: Turn on the light emitting chip 410 .

[0300] T03: Turn on the CDR chip.

[0301] T04: Increase the voltage of the APD circuit.

[0302] T05: Turn on the optical receiving chip.

[0303] When receiving a high power consumption instruction or a light-on instruction, T01: turns on the TEC chip; T02: turns on the light emitting chip 410;

[0304] T03: Turn on the CDR chip; T04: Increase the voltage of the APD circuit; T05: Turn on the optical receiver chip to ensure the normal operation of the optical module's light emitting and receiving functions.

[0305] When receiving a low-power instruction or a light-on instruction, the optical module 410 is turned off at step S200; the TEC chip is turned off at step S300; the CDR chip is turned off at step S400; the voltage of the APD circuit is reduced at step S500; and the optical receiver chip is turned off at step S600. This disables the light emitting and receiving functions of the optical module, thereby reducing power consumption.

[0306] When receiving a low power consumption instruction or a light-off instruction, the optical module 410 is turned off at step S200; the TEC chip is turned off at step S300; the CDR chip is turned off at step S400; the voltage of the APD circuit is reduced at step S500; and the optical receiver chip is turned off at step S600. This disables the light emitting and receiving functions of the optical module, thereby reducing power consumption.

[0307] When a high power consumption instruction or a light-off instruction is received, S200 : the light emitting chip 410 is turned off.

[0308] In some embodiments of the present disclosure, when a low power consumption instruction is received, optoelectronic devices with higher power consumption in the optical module are turned off to reduce power consumption.

[0309] Figure 16 illustrates the MCU's control method when receiving a power consumption instruction. When the MCU receives a power consumption-related instruction, it first determines whether the power consumption instruction is a low-power instruction. If it is a low-power instruction, it does not need to determine whether it has received a light-off instruction and can directly enter low-power mode. If the power consumption instruction is a high-power instruction, it needs to determine whether it has received a light-off instruction. If the current instruction is a light-off instruction, it enters high-power light-off mode. If the power consumption instruction is a high-power instruction and the current instruction is a light-on instruction, it enters high-power light-on mode.

[0310] Figure 17 shows the MCU's control method when receiving a light command. When the MCU receives a light command, it first determines whether the light command is an off command. If it is an off command, it then determines whether a power consumption command is received. If the light command is an on command and the power consumption command is a low power command, the MCU enters low-power mode. If the light command is an on command and the power consumption command is a high power command, the MCU enters high-power off mode. If the light command is an off command and the power consumption command is a low power command, the MCU enters low-power mode. If the light command is an off command and the power consumption command is a high power command, the MCU enters high-power on mode.

[0311] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, wherein: include: an optical transmitter chip configured to transmit an optical signal; a photodetector configured to convert the optical power of the emitted optical signal into an electrical signal; A control chip connected to the photodetector and the light emitting chip; The control chip is configured as follows: Converting the electrical signal into current optical power; The current optical power is 0, and the degradation count is reset to zero; If the current optical power is not 0, the current optical power is greater than the second limit threshold, and the output bias current is not the second bias current, the degradation count is cleared. If the current optical power is not 0 and is less than or equal to the second limit threshold, the degradation count is incremented by 1. When the degradation count is greater than or equal to a preset value, the bias current is set to a second bias current, and the second bias current is greater than the operating current of the light emitting chip; If the current optical power is not 0 and is less than or equal to the second limit threshold, an optical power alarm signal is output; The optical module further includes: TEC chip; CDR chip; APD circuit; Optical receiver chip; MCU, the MCU includes: a power consumption register and an optical instruction register; Wherein: the MCU is configured as: When the power consumption instruction value in the power consumption register is a first preset value, the TEC chip is controlled to be turned off, the CDR chip is controlled to be turned off, the voltage of the APD circuit is controlled to be reduced, and the light receiving chip is controlled to be turned off; When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the CDR chip is controlled to be turned on, the light receiving chip is controlled to be turned on, the voltage of the APD circuit is increased, the light emitting chip is controlled to be turned on, and the TEC chip is controlled to be turned on; When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a fourth preset value, the light emitting chip is controlled to be turned off.

2. The optical module according to claim 1, wherein: The control chip is further configured to: If the current optical power is greater than or equal to a first limit threshold, the bias current is adjusted according to the lookup table; The first limit threshold is greater than the second limit threshold.

3. The optical module according to claim 1, wherein: The control chip is further configured to: when the current optical power is a first limit threshold, the bias current is a first bias current; When the current optical power is less than or equal to the second limit threshold, the bias current is the second bias current; The second bias current is 10 to 20 times the first bias current.

4. The optical module according to claim 1, wherein: The control chip is further configured to: The calibration value is the same as the preset calibration coefficient, and the degradation count is reset to zero; If the calibration value is different from the preset calibration coefficient and the current optical power is 0, the degradation count is reset; If the calibration value is different from the preset calibration coefficient, the current optical power is not 0, the current optical power is greater than the second limit threshold, or the output bias current is not the second bias current, the degradation count is reset. If the calibration value is different from the preset calibration coefficient, the current optical power is not 0, or the current optical power is less than or equal to the second limit threshold, the degradation count is incremented by 1. When the degradation count is greater than or equal to a preset value, the bias current is set to a second bias current, and the second bias current is greater than the operating current of the light emitting chip; If the calibration value is different from the preset calibration coefficient and the current optical power is greater than or equal to the first limit threshold, the bias current is adjusted according to the lookup table; The first limit threshold is greater than the second limit threshold.

5. The optical module according to claim 4, wherein: The control chip is configured to output an optical power alarm signal when the calibration value is different from a preset calibration coefficient, the current optical power is not 0, and the current optical power is less than or equal to a second limit threshold.

6. The optical module according to claim 1, wherein: The control chip is further configured to: The current optical power is greater than or equal to the first limit threshold, and the bias current is adjusted to make the optical power of the light emitting chip reach the target optical power.

7. The optical module according to claim 6, wherein: The control chip is configured as follows: If the calibration value is different from the preset calibration coefficient and the current optical power is greater than or equal to the first limit threshold, the bias current is adjusted according to the lookup table; The first limit threshold is greater than the second limit threshold.

8. The optical module according to claim 6, wherein: The control chip is configured to: when the current optical power is a first limit threshold, the bias current is a first bias current; When the current optical power is less than or equal to the second limit threshold, the bias current is the second bias current; The second bias current is 10 to 20 times the first bias current.

9. The optical module according to claim 4, wherein: The control chip is further configured to: The current optical power is greater than or equal to the first limit threshold, and the bias current is adjusted to make the optical power of the light emitting chip reach the target optical power.

10. The optical module according to claim 1, comprising: The TEC control chip is connected to the MCU and the TEC chip, and the MCU controls the TEC control chip to turn off the TEC chip.

11. The optical module according to claim 1 or 10, further comprising: The emission driver chip is connected to the MCU and the light emitting chip, and the MCU controls the emission driver chip to turn off so as to turn off the light emitting chip.

12. The optical module according to claim 11, wherein: The MCU is also configured to: A low power consumption instruction is received, and an emission shutdown signal is written into a register of the emission driver chip to shut down the emission driver chip.

13. The optical module according to claim 1, wherein: The MCU is also configured to: A power consumption sequence table of the light emitting chip, the TEC chip, the CDR chip, the APD circuit, and the light receiving chip is preset. A low power consumption instruction is received, and the light emitting chip, the TEC chip, the CDR chip, the APD circuit, and the light receiving chip are controlled according to the power consumption sequence table.

14. The optical module according to claim 13, wherein: The MCU is also configured to: When the power consumption instruction value in the power consumption register is a first preset value, the light emitting chip, the TEC chip, the CDR chip, the APD circuit, and the light receiving chip are controlled to be turned off according to the power consumption sequence table; When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the CDR chip is controlled to be turned on, the light receiving chip is controlled to be turned on, the voltage of the APD circuit is increased, the light emitting chip is controlled to be turned on, and the TEC chip is controlled to be turned on; When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a fourth preset value, the light emitting chip is controlled to be turned off.

15. The optical module according to claim 1, wherein The MCU further includes: Power consumption register, used to store the current power consumption instruction value; Light command register, used to store the previous power consumption command value; A first state memory, used to store the previous power consumption instruction value; The second state memory is used to store the previous light instruction value; Wherein: the MCU is configured as: When the previous power consumption instruction value is the second preset value and the current power consumption instruction value is the first preset value, the CDR chip, the TEC chip, the light receiving chip, and the light emitting chip are controlled to be turned off, and the voltage of the APD circuit is reduced; The previous power consumption instruction value is the first preset value, the current power consumption instruction value is the first preset value, the previous light instruction value is the fourth preset value, and the current light instruction value is the third preset value, and the emission driver chip is controlled to be turned on; The previous power consumption instruction value is the first preset value, the current power consumption instruction value is the first preset value, the previous light instruction value is the third preset value, and the current light instruction value is the fourth preset value, and the emission driver chip is controlled to be turned off.

16. An optical module, wherein: include: an optical transmitter chip configured to transmit an optical signal; a photodetector configured to convert the optical power of the emitted optical signal into an electrical signal; A control chip connected to the photodetector and the light emitting chip; The control chip is configured as follows: Converting the electrical signal into current optical power; The current optical power is 0, and the degradation count is reset to zero; If the current optical power is not 0, the current optical power is greater than the second limit threshold, and the output bias current is not the second bias current, the degradation count is cleared. If the current optical power is not 0 and is less than or equal to the second limit threshold, the degradation count is incremented by 1. When the degradation count is greater than or equal to a preset value, the bias current is set to a second bias current, and the second bias current is greater than the operating current of the light emitting chip; If the current optical power is not 0 and is less than or equal to the second limit threshold, an optical power alarm signal is output.

17. The optical module according to claim 16, wherein: The control chip is further configured to: If the current optical power is greater than or equal to a first limit threshold, the bias current is adjusted according to the lookup table; The first limit threshold is greater than the second limit threshold.

18. The optical module according to claim 16, wherein: The control chip is further configured to: when the current optical power is a first limit threshold, the bias current is a first bias current; When the current optical power is less than or equal to the second limit threshold, the bias current is the second bias current; The second bias current is 10 to 20 times the first bias current.

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