Temperature regulation and control method, device, equipment and medium
By regulating heat transfer in a vacuum environment using a semiconductor cooler and a liquid temperature control chamber, the problem of high cost and long temperature control time in existing temperature control equipment is solved, achieving rapid and effective temperature control and improving calibration efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- WUXI INFISENSE PERCEPTION TECH CO LTD
- Filing Date
- 2024-10-29
- Publication Date
- 2026-05-01
AI Technical Summary
Existing industrial infrared imaging temperature measurement products suffer from high cost of temperature control equipment and slow temperature control time during multi-temperature point calibration, resulting in low calibration efficiency.
By combining a semiconductor cooler and a liquid temperature control chamber, the direction and amount of heat transfer are regulated by controlling the polarity and magnitude of the current, and combined with a vacuum environment, rapid and effective temperature control is achieved.
It improves the efficiency of multi-temperature point calibration of the module to be controlled, ensures the accuracy of temperature control and the rapid transition of the module between different temperatures, and reduces the temperature control time.
Smart Images
Figure CN121953530A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of temperature control technology, and in particular to a temperature regulation method, device, equipment, and medium. Background Technology
[0002] Currently, in the calibration and production process of industrial infrared imaging temperature measurement products, it is necessary to calibrate the modules at different temperatures (including temperature ranges above and below room temperature). Temperature control is a crucial step in this process. A common solution is to use air-cooled and air-heated modules in specific equipment to change the air temperature inside a specific space to achieve product temperature control. However, such temperature control equipment is generally expensive and has a slow temperature control time, resulting in low efficiency in calibrating multiple temperature points of the modules to be controlled.
[0003] In summary, how to achieve rapid and effective temperature control to improve the multi-temperature point calibration efficiency of the module to be controlled is an urgent problem to be solved. Summary of the Invention
[0004] In view of this, the purpose of this invention is to provide a temperature control method, device, equipment, and medium that can achieve rapid and effective temperature control to improve the multi-temperature point calibration efficiency of the module to be controlled. The specific solution is as follows:
[0005] In a first aspect, this application discloses a temperature control method applied to a temperature control system, the temperature control system comprising a module to be controlled, a semiconductor cooler, and an auxiliary temperature control device in contact with a non-temperature-controlled surface of the semiconductor cooler, the method comprising:
[0006] The semiconductor cooler controls the direction and amount of heat transfer between the temperature-controlled surface and the non-temperature-controlled surface based on the acquired current polarity and magnitude. The temperature of the temperature-controlled surface is then regulated based on the heat transfer direction and amount between the two surfaces. The temperature-controlled surface is the surface in the semiconductor cooler that is in close, soft contact with the module to be temperature-controlled. The non-temperature-controlled surface is the surface corresponding to the temperature-controlled surface that is far from the module to be temperature-controlled.
[0007] The temperature of the module to be controlled is adjusted based on the temperature control surface;
[0008] The auxiliary temperature control device receives heat from the non-temperature-controlled surface, or transfers heat from the auxiliary temperature control device to the non-temperature-controlled surface.
[0009] The auxiliary temperature control device is a liquid temperature control box;
[0010] Specifically, when the predetermined temperature corresponding to the temperature control system is higher than the target room temperature, the liquid stored in the liquid temperature control box is at a preset high temperature; when the predetermined temperature is lower than the target room temperature, the liquid stored in the liquid temperature control box is at a preset low temperature.
[0011] The step of regulating the temperature of the temperature-controlled surface based on the heat transfer direction and the heat transfer amount through heat transfer between the temperature-controlled surface and the non-temperature-controlled surface includes:
[0012] The heat from the first heat transfer amount in the temperature-controlled surface is transferred to the non-temperature-controlled surface, or the heat from the second heat transfer amount in the non-temperature-controlled surface is transferred to the temperature-controlled surface, so as to regulate the temperature of the temperature-controlled surface.
[0013] Prior to controlling the direction and amount of heat transfer between the temperature-controlled surface and the non-temperature-controlled surface based on the acquired current polarity and magnitude using the semiconductor cooler, the method further includes:
[0014] The polarity and magnitude of the current sent by the temperature control board are obtained through the semiconductor cooler based on the semiconductor cooler power line connecting the semiconductor cooler and the temperature control board.
[0015] The temperature control system further includes a temperature sensor between the temperature control surface and the module to be temperature controlled;
[0016] Accordingly, the temperature control method further includes:
[0017] The temperature sensor reads the temperature of the temperature control surface and the temperature of the module to be controlled in real time, so that the user can adjust the polarity and magnitude of the current in real time based on the temperature of the temperature control surface and the temperature of the module to be controlled.
[0018] The temperature control system operates in a vacuum environment.
[0019] Secondly, this application discloses a temperature control device applied to a temperature control system, the temperature control system including a module to be controlled, a semiconductor cooler, and an auxiliary temperature control device in contact with the non-temperature-controlled surface of the semiconductor cooler, the device comprising:
[0020] The first temperature control module is used to control the direction and amount of heat transfer between the temperature control surface and the non-temperature control surface based on the acquired current polarity and current magnitude through the semiconductor cooler, and to regulate the temperature of the temperature control surface based on the heat transfer direction and the amount of heat transfer through the heat transfer between the temperature control surface and the non-temperature control surface; the temperature control surface is the surface of the semiconductor cooler that is in close soft contact with the module to be temperature controlled; the non-temperature control surface is the surface corresponding to the temperature control surface that is far away from the module to be temperature controlled;
[0021] The second temperature control module is used to control the temperature of the module to be controlled based on the temperature control surface;
[0022] The auxiliary temperature control device receives heat from the non-temperature-controlled surface, or transfers heat from the auxiliary temperature control device to the non-temperature-controlled surface.
[0023] The auxiliary temperature control device is a liquid temperature control box;
[0024] Specifically, when the predetermined temperature corresponding to the temperature control system is higher than the target room temperature, the liquid stored in the liquid temperature control box is at a preset high temperature; when the predetermined temperature is lower than the target room temperature, the liquid stored in the liquid temperature control box is at a preset low temperature.
[0025] Thirdly, this application discloses an electronic device, including:
[0026] Memory, used to store computer programs;
[0027] A processor is used to execute the computer program to implement the aforementioned temperature control method.
[0028] Fourthly, this application discloses a computer-readable storage medium for storing a computer program; wherein, when the computer program is executed by a processor, it implements the aforementioned temperature control method.
[0029] As can be seen, this application controls the direction and amount of heat transfer between the temperature-controlled surface and the non-temperature-controlled surface based on the acquired current polarity and current magnitude using the semiconductor cooler, and regulates the temperature of the temperature-controlled surface based on the heat transfer direction and the amount of heat transfer between the temperature-controlled surface and the non-temperature-controlled surface; the temperature-controlled surface is the surface in the semiconductor cooler that is in close soft contact with the module to be temperature-controlled; the non-temperature-controlled surface is the surface corresponding to the temperature-controlled surface that is far away from the module to be temperature-controlled; the temperature of the module to be temperature-controlled is regulated based on the temperature-controlled surface; wherein, the auxiliary temperature control device receives heat from the non-temperature-controlled surface, or transfers heat from the auxiliary temperature control device to the non-temperature-controlled surface. Therefore, this application achieves temperature control of the temperature-controlled surface through heat transfer between the temperature-controlled surface and the non-temperature-controlled surface in the semiconductor cooler, and further achieves temperature control of the module to be controlled, enabling the module to be controlled to quickly switch between different temperatures, which is beneficial to improving the multi-temperature point calibration efficiency of the module to be controlled; this application utilizes auxiliary temperature control equipment to provide the required heat to the non-temperature-controlled surface in a timely manner or to remove excess heat from the temperature-controlled surface, thereby improving the temperature control accuracy of the semiconductor cooler and enabling the module to be controlled to reach a thermally stable state for a certain period of time. Attached Figure Description
[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0031] Figure 1 This is a flowchart of a temperature control method disclosed in this application;
[0032] Figure 2 This is a schematic diagram of a temperature control system receiver disclosed in this application;
[0033] Figure 3 This is a schematic diagram of the structure of a temperature control device disclosed in this application;
[0034] Figure 4 This is a structural diagram of an electronic device disclosed in this application. Detailed Implementation
[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0036] Currently, in the calibration and production process of industrial infrared imaging temperature measurement products, it is necessary to calibrate the modules at different temperatures (including temperature ranges above and below room temperature). Temperature control is a crucial step in this process. A common solution is to use air-cooled and air-heated modules in specific equipment to change the air temperature inside a specific space to achieve product temperature control. However, such temperature control equipment is generally expensive and has a slow temperature control time, resulting in low efficiency in calibrating multiple temperature points of the modules to be controlled.
[0037] Therefore, this application proposes a temperature control scheme that can achieve rapid and effective temperature control to improve the multi-temperature point calibration efficiency of the module to be controlled.
[0038] This application discloses a temperature control method applied to a temperature control system. The temperature control system includes a module to be controlled, a thermoelectric cooler, and an auxiliary temperature control device in contact with the non-temperature-controlled surface of the thermoelectric cooler. See [link to relevant documentation]. Figure 1 As shown, the method includes:
[0039] Step S11: The thermoelectric cooler controls the heat transfer direction and amount between the temperature-controlled surface and the non-temperature-controlled surface based on the acquired current polarity and current magnitude. The temperature of the temperature-controlled surface is adjusted based on the heat transfer direction and amount between the temperature-controlled surface and the non-temperature-controlled surface. The temperature-controlled surface is the surface of the thermoelectric cooler that is in close, soft contact with the module to be temperature-controlled. The non-temperature-controlled surface is the surface corresponding to the temperature-controlled surface that is far from the module to be temperature-controlled. The auxiliary temperature control device receives heat from the non-temperature-controlled surface, or transfers heat from the auxiliary temperature control device to the non-temperature-controlled surface.
[0040] In this embodiment, see Figure 2 The diagram shows a receiving schematic of a temperature control system. In the diagram, TEC (ThermoElectric Cooler) represents a thermoelectric cooler, and the module is the module to be controlled. The temperature control system also includes a temperature sensor, a liquid-assisted temperature control device, a TEC power cord (thermoelectric cooler power cord), and a temperature control board. In the diagram, one module is paired with one TEC, one TEC power cord, and one temperature sensor. In other temperature control systems, one TEC and one TEC power cord may correspond to multiple modules.
[0041] In this embodiment, the TEC and the product requiring temperature control (infrared product, i.e. the module to be controlled) are brought into close soft contact (to avoid scratches) through tooling fixtures and heat-conducting medium. The surface of the TEC that is close to the infrared product is the temperature-controlled surface, and the surface that is far away from the infrared product is the non-temperature-controlled surface.
[0042] In this embodiment, before controlling the direction and amount of heat transfer between the temperature-controlled surface and the non-temperature-controlled surface based on the acquired current polarity and magnitude by the thermoelectric cooler, the method further includes: acquiring the current polarity and magnitude sent by the temperature-controlled plate via the thermoelectric cooler power line connecting the thermoelectric cooler and the temperature-controlled plate. It should be noted that the temperature-controlled plate is used to send a current with appropriate current polarity and magnitude to the thermoelectric cooler so that heat transfer is achieved based on the current polarity and magnitude.
[0043] In this embodiment, the temperature control system further includes a temperature sensor between the temperature control surface and the module to be temperature-controlled; correspondingly, the temperature control method further includes: real-time reading of the temperature of the temperature control surface and the temperature of the module to be temperature-controlled using the temperature sensor, so that the user can adjust the polarity and magnitude of the current in real time based on the temperature of the temperature control surface and the temperature of the module to be temperature-controlled. It should be noted that the temperature control board further determines the appropriate current polarity and magnitude based on the real-time reading of the temperature of the temperature control surface and the temperature of the module to be temperature-controlled by the temperature sensor. Specifically, a temperature sensor is placed between the temperature control surface and the infrared product to read their temperatures in real time, and the power supply current of the TEC is adjusted accordingly to achieve precise temperature control of the product.
[0044] In this embodiment, regulating the temperature of the temperature-controlled surface based on the heat transfer direction and the heat transfer amount through heat transfer between the temperature-controlled surface and the non-temperature-controlled surface includes: transferring heat of a first heat transfer amount in the temperature-controlled surface to the non-temperature-controlled surface, or transferring heat of a second heat transfer amount in the non-temperature-controlled surface to the temperature-controlled surface, so as to regulate the temperature of the temperature-controlled surface.
[0045] In this embodiment, the auxiliary temperature control device is a liquid temperature control box. When the predetermined temperature corresponding to the temperature control system is higher than the target room temperature, the liquid temperature control box stores liquid at a preset high temperature; when the predetermined temperature is lower than the target room temperature, the liquid temperature control box stores liquid at a preset low temperature. It should be noted that during temperature control, the TEC needs to continuously conduct heat between its temperature-controlled and non-temperature-controlled surfaces to ensure the infrared product reaches a thermally stable state for a certain period. If the required heat cannot be provided or excess heat cannot be dissipated in time, it will lead to inaccurate temperature control of the TEC or even damage to its physical structure. Therefore, an auxiliary temperature control device, such as a liquid temperature control box, is needed for the TEC. When the TEC controls the infrared product at a low temperature, a low-temperature liquid can be connected to the non-temperature-controlled surface of the TEC, thereby conducting away the heat from the temperature-controlled surface and lowering its temperature. When the TEC controls the infrared product at a high temperature, a high-temperature liquid can be connected to the non-temperature-controlled surface of the TEC, thereby providing the required heat to the temperature-controlled surface. It should be noted that the preset low temperature and preset high temperature can be set according to specific circumstances and are not specifically limited here.
[0046] Step S12: Adjust the temperature of the module to be controlled based on the temperature control surface.
[0047] In this embodiment, the temperature control system operates in a vacuum environment. Specifically, when the temperature of the TEC and infrared products approaches zero, water vapor in the air will condense into water or frost on their surfaces, which can lead to circuit breakage or short circuit of the TEC hardware temperature control module in severe cases. To reduce heat loss from the TEC, improve temperature control accuracy, and solve the problem of water vapor frost formation at low temperatures, this application chooses to conduct the calibration process in a vacuum environment. Specifically, a vacuum chamber is manufactured, and the product to be calibrated, along with the temperature control module and communication module required for the calibration process, are placed inside the vacuum chamber. Based on the desired low temperature value and referring to the relationship between the water vapor condensation point and the vacuum level, the vacuum level inside the chamber is adjusted to prevent condensation during the calibration process.
[0048] In summary, this application presents a method for rapid temperature control of a product in a vacuum environment using a thermoelectric cooler (TEC). A thermoelectric cooler (TEC), also known as a thermoelectric cooler, can both cool and heat. Its working principle involves controlling the transfer of heat between the upper and lower surfaces of the cooler by changing the polarity and magnitude of the energized current, thereby achieving temperature control. It should be noted that the temperature control module of this application uses a thermoelectric cooler that offers fast temperature control, high temperature control accuracy, and low cost, which can significantly reduce the temperature control time for multi-point temperature calibration and greatly improve calibration efficiency. Furthermore, this application creates a vacuum environment for temperature calibration, solving the problem of water vapor condensation in the air during low-temperature calibration.
[0049] As can be seen, this application controls the direction and amount of heat transfer between the temperature-controlled surface and the non-temperature-controlled surface based on the acquired current polarity and current magnitude using the semiconductor cooler, and regulates the temperature of the temperature-controlled surface based on the heat transfer direction and the amount of heat transfer between the temperature-controlled surface and the non-temperature-controlled surface; the temperature-controlled surface is the surface in the semiconductor cooler that is in close soft contact with the module to be temperature-controlled; the non-temperature-controlled surface is the surface corresponding to the temperature-controlled surface that is far away from the module to be temperature-controlled; the temperature of the module to be temperature-controlled is regulated based on the temperature-controlled surface; wherein, the auxiliary temperature control device receives heat from the non-temperature-controlled surface, or transfers heat from the auxiliary temperature control device to the non-temperature-controlled surface. Therefore, this application achieves temperature control of the temperature-controlled surface through heat transfer between the temperature-controlled surface and the non-temperature-controlled surface in the semiconductor cooler, and further achieves temperature control of the module to be controlled, enabling the module to be controlled to quickly switch between different temperatures, which is beneficial to improving the multi-temperature point calibration efficiency of the module to be controlled; this application utilizes auxiliary temperature control equipment to provide the required heat to the non-temperature-controlled surface in a timely manner or to remove excess heat from the temperature-controlled surface, thereby improving the temperature control accuracy of the semiconductor cooler and enabling the module to be controlled to reach a thermally stable state for a certain period of time.
[0050] Accordingly, this application also discloses a temperature control device applied to a temperature control system. The temperature control system includes a module to be controlled, a thermoelectric cooler, and an auxiliary temperature control device in contact with the non-temperature-controlled surface of the thermoelectric cooler. See [link to relevant documentation]. Figure 3 As shown, the device includes:
[0051] The first temperature control module 11 is used to control the heat transfer direction and amount between the temperature control surface and the non-temperature control surface based on the acquired current polarity and current magnitude through the semiconductor cooler, and to regulate the temperature of the temperature control surface based on the heat transfer direction and the amount of heat transfer through the heat transfer between the temperature control surface and the non-temperature control surface; the temperature control surface is the surface of the semiconductor cooler that is in close soft contact with the module to be temperature controlled; the non-temperature control surface is the surface corresponding to the temperature control surface that is far away from the module to be temperature controlled;
[0052] The second temperature control module 12 is used to control the temperature of the module to be controlled based on the temperature control surface;
[0053] The auxiliary temperature control device receives heat from the non-temperature-controlled surface, or transfers heat from the auxiliary temperature control device to the non-temperature-controlled surface.
[0054] As can be seen, this application controls the direction and amount of heat transfer between the temperature-controlled surface and the non-temperature-controlled surface based on the acquired current polarity and current magnitude using the semiconductor cooler, and regulates the temperature of the temperature-controlled surface based on the heat transfer direction and the amount of heat transfer between the temperature-controlled surface and the non-temperature-controlled surface; the temperature-controlled surface is the surface in the semiconductor cooler that is in close soft contact with the module to be temperature-controlled; the non-temperature-controlled surface is the surface corresponding to the temperature-controlled surface that is far away from the module to be temperature-controlled; the temperature of the module to be temperature-controlled is regulated based on the temperature-controlled surface; wherein, the auxiliary temperature control device receives heat from the non-temperature-controlled surface, or transfers heat from the auxiliary temperature control device to the non-temperature-controlled surface. Therefore, this application achieves temperature control of the temperature-controlled surface through heat transfer between the temperature-controlled surface and the non-temperature-controlled surface in the semiconductor cooler, and further achieves temperature control of the module to be controlled, enabling the module to be controlled to quickly switch between different temperatures, which is beneficial to improving the multi-temperature point calibration efficiency of the module to be controlled; this application utilizes auxiliary temperature control equipment to provide the required heat to the non-temperature-controlled surface in a timely manner or to remove excess heat from the temperature-controlled surface, thereby improving the temperature control accuracy of the semiconductor cooler and enabling the module to be controlled to reach a thermally stable state for a certain period of time.
[0055] In one embodiment, the auxiliary temperature control device is a liquid temperature control box;
[0056] Specifically, when the predetermined temperature corresponding to the temperature control system is higher than the target room temperature, the liquid stored in the liquid temperature control box is at a preset high temperature; when the predetermined temperature is lower than the target room temperature, the liquid stored in the liquid temperature control box is at a preset low temperature.
[0057] In one embodiment, the first temperature control module 11 is specifically used to transfer heat from the first heat transfer amount in the temperature control surface to the non-temperature control surface, or to transfer heat from the second heat transfer amount in the non-temperature control surface to the temperature control surface, so as to control the temperature of the temperature control surface.
[0058] In one embodiment, the temperature control device is further configured to obtain the polarity and magnitude of the current sent by the temperature control board via the semiconductor cooler based on the semiconductor cooler power line connecting the semiconductor cooler and the temperature control board.
[0059] In one embodiment, the temperature control system further includes a temperature sensor between the temperature control surface and the module to be temperature controlled;
[0060] Accordingly, the temperature control device is also used to read the temperature of the temperature control surface and the temperature of the module to be controlled in real time through the temperature sensor, so that the user can adjust the polarity and magnitude of the current in real time based on the temperature of the temperature control surface and the temperature of the module to be controlled.
[0061] In one embodiment, the temperature control system operates in a vacuum environment.
[0062] Furthermore, embodiments of this application also provide an electronic device. Figure 4 This is a structural diagram of an electronic device 20 according to an exemplary embodiment. The content of the diagram should not be construed as limiting the scope of this application.
[0063] Figure 4 This is a schematic diagram of the structure of an electronic device 20 provided in an embodiment of this application. Specifically, the electronic device 20 may include: at least one processor 21, at least one memory 22, a display screen 23, an input / output interface 24, a communication interface 25, a power supply 26, and a communication bus 27. The memory 22 stores a computer program, which is loaded and executed by the processor 21 to implement the relevant steps in the temperature control method disclosed in any of the foregoing embodiments. Furthermore, the electronic device 20 in this embodiment may specifically be an electronic computer.
[0064] In this embodiment, the power supply 26 is used to provide operating voltage for each hardware device on the electronic device 20; the communication interface 25 can create a data transmission channel between the electronic device 20 and external devices, and the communication protocol it follows can be any communication protocol applicable to the technical solution of this application, and is not specifically limited here; the input / output interface 24 is used to acquire external input data or output data to the outside world, and its specific interface type can be selected according to specific application needs, and is not specifically limited here.
[0065] Furthermore, the memory 22, as a carrier for resource storage, can be a read-only memory, random access memory, disk, or optical disk, etc. The resources stored thereon may include computer programs 221, and the storage method may be temporary storage or permanent storage. In addition to including computer programs capable of performing the temperature control method executed by the electronic device 20 as disclosed in any of the foregoing embodiments, the computer program 221 may further include computer programs capable of performing other specific tasks.
[0066] Furthermore, embodiments of this application also disclose a computer-readable storage medium for storing a computer program; wherein, when the computer program is executed by a processor, it implements the aforementioned temperature control method.
[0067] The specific steps of this method can be found in the corresponding content disclosed in the foregoing embodiments, and will not be repeated here.
[0068] The various embodiments in this application are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. For the same or similar parts between the various embodiments, refer to each other. As for the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple, and relevant parts can be referred to in the method section.
[0069] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0070] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented directly by hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.
[0071] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0072] The above provides a detailed description of a temperature control method, apparatus, device, and storage medium provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. A temperature control method, characterized in that, The method is applied to a temperature control system, the temperature control system including a module to be controlled, a thermoelectric cooler, and an auxiliary temperature control device in contact with the non-temperature-controlled surface of the thermoelectric cooler, the method comprising: The semiconductor cooler controls the direction and amount of heat transfer between the temperature-controlled surface and the non-temperature-controlled surface based on the acquired current polarity and magnitude. The temperature of the temperature-controlled surface is then regulated based on the heat transfer direction and amount between the two surfaces. The temperature-controlled surface is the surface in the semiconductor cooler that is in close, soft contact with the module to be temperature-controlled. The non-temperature-controlled surface is the surface corresponding to the temperature-controlled surface that is far from the module to be temperature-controlled. The temperature of the module to be controlled is adjusted based on the temperature control surface; The auxiliary temperature control device receives heat from the non-temperature-controlled surface, or transfers heat from the auxiliary temperature control device to the non-temperature-controlled surface.
2. The temperature control method according to claim 1, characterized in that, The auxiliary temperature control device is a liquid temperature control box; Specifically, when the predetermined temperature corresponding to the temperature control system is higher than the target room temperature, the liquid stored in the liquid temperature control box is at a preset high temperature; when the predetermined temperature is lower than the target room temperature, the liquid stored in the liquid temperature control box is at a preset low temperature.
3. The temperature control method according to claim 1, characterized in that, The method of regulating the temperature of the temperature-controlled surface based on the heat transfer direction and the heat transfer amount through heat transfer between the temperature-controlled surface and the non-temperature-controlled surface includes: The heat from the first heat transfer amount in the temperature-controlled surface is transferred to the non-temperature-controlled surface, or the heat from the second heat transfer amount in the non-temperature-controlled surface is transferred to the temperature-controlled surface, so as to regulate the temperature of the temperature-controlled surface.
4. The temperature control method according to claim 1, characterized in that, Before controlling the direction and amount of heat transfer between the temperature-controlled surface and the non-temperature-controlled surface based on the acquired current polarity and magnitude using the semiconductor cooler, the method further includes: The polarity and magnitude of the current sent by the temperature control board are obtained through the semiconductor cooler based on the semiconductor cooler power line connecting the semiconductor cooler and the temperature control board.
5. The temperature control method according to claim 1, characterized in that, The temperature control system also includes a temperature sensor between the temperature control surface and the module to be temperature controlled; Accordingly, the temperature control method further includes: The temperature sensor reads the temperature of the temperature control surface and the temperature of the module to be controlled in real time, so that the user can adjust the polarity and magnitude of the current in real time based on the temperature of the temperature control surface and the temperature of the module to be controlled.
6. The temperature control method according to claim 1, characterized in that, The temperature control system operates in a vacuum environment.
7. A temperature control device, characterized in that, An auxiliary temperature control device is used in a temperature control system, which includes a module to be controlled, a thermoelectric cooler, and an auxiliary temperature control device in contact with the non-temperature-controlled surface of the thermoelectric cooler. The device includes: The first temperature control module is used to control the direction and amount of heat transfer between the temperature control surface and the non-temperature control surface based on the acquired current polarity and current magnitude through the semiconductor cooler, and to regulate the temperature of the temperature control surface based on the heat transfer direction and the amount of heat transfer through the heat transfer between the temperature control surface and the non-temperature control surface; the temperature control surface is the surface of the semiconductor cooler that is in close soft contact with the module to be temperature controlled; the non-temperature control surface is the surface corresponding to the temperature control surface that is far away from the module to be temperature controlled; The second temperature control module is used to control the temperature of the module to be controlled based on the temperature control surface; The auxiliary temperature control device receives heat from the non-temperature-controlled surface, or transfers heat from the auxiliary temperature control device to the non-temperature-controlled surface.
8. The temperature control device according to claim 7, characterized in that, The auxiliary temperature control device is a liquid temperature control box; Specifically, when the predetermined temperature corresponding to the temperature control system is higher than the target room temperature, the liquid stored in the liquid temperature control box is at a preset high temperature; when the predetermined temperature is lower than the target room temperature, the liquid stored in the liquid temperature control box is at a preset low temperature.
9. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor for executing the computer program to implement the temperature control method as described in any one of claims 1 to 6.
10. A computer-readable storage medium, characterized in that, Used to store a computer program; wherein, when the computer program is executed by a processor, it implements the temperature control method as described in any one of claims 1 to 6.