Semiconductor device switching time double-pulse testing device and system capable of improving precision

Abstract

The invention relates to the technical field of semiconductor device testing, in particular to a semiconductor device switching time double-pulse testing device and system capable of improving the precision, and the device comprises an air chamber lower shell and an air chamber upper shell which can move up and down relative to the air chamber lower shell. When the air chamber upper shell descends and is closed and matched with the air chamber lower shell, a closed cavity can be formed, the semiconductor device is arranged in the closed cavity, and a pin of the semiconductor device is in conduction contact with the test conductor under the pressure of the air chamber upper shell; the closed cavity is formed by the air chamber lower shell and the air chamber upper shell, and the air supply pipe and the constant-temperature fan are matched, so that the temperature can be kept more stable when a semiconductor device is subjected to a switching time double-pulse test, and the test precision is improved.

Description

A dual-pulse testing device and system for improving the accuracy of semiconductor device switching time. Technical Field

[0001] This invention relates to the field of semiconductor device testing technology, specifically to a semiconductor device switching time double-pulse testing device and system that can improve accuracy. Background Technology

[0002] The semiconductor device switching time double-pulse test is a test item for semiconductor devices such as IGBTs and MOSFETs. It is mainly used to measure parameters during the switching process of semiconductor devices to evaluate the performance of the devices and drivers. Specifically, the test circuit module applies a double-pulse signal to the device and collects data during the switching process, such as the switching delay time, rise / fall time, and switching power consumption of the IGBT. Existing technology, which uses test fixtures to directly connect the test circuit module, has the following problems in practical use: During the test, the application of a double-pulse signal current to the semiconductor device causes temperature changes. As the temperature rises, the intrinsic carrier concentration of the semiconductor increases, for example, affecting the gate threshold voltage of the IGBT. This will decrease, which will cause the gate trigger voltage to be met earlier when the device is actually turned on. If the switching time of an IGBT is incorrectly measured too short, and the scattering of charge carriers in the semiconductor is enhanced while their mobility decreases, the switching speed of the IGBT will slow down; that is, temperature changes will have a negative impact on the switching time of semiconductor devices during double-pulse testing. Summary of the Invention

[0003] The purpose of this invention is to provide a semiconductor device switching time double pulse test device and system that can improve accuracy, so as to solve the problem that the test devices in the prior art mentioned in the background art cause significant temperature changes in semiconductor devices during the test process, which in turn leads to low test accuracy.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor device switching time double-pulse testing device with improved accuracy, comprising a lower chamber shell and an upper chamber shell that can move up and down relative to the lower chamber shell. A test conductor is installed on the lower chamber shell. When the upper chamber shell descends and closes with the lower chamber shell, a closed cavity is formed. The semiconductor device is disposed in the closed cavity. Under the pressure of the upper chamber shell, the pins of the semiconductor device make conductive contact with the test conductor. An air supply pipe is connected to one end of the lower chamber shell, and a constant temperature fan is provided at the other end of the air supply pipe. The constant temperature fan generates constant temperature gas and inputs it into the closed cavity through the air supply pipe, thereby reducing temperature fluctuations of the semiconductor device during the switching time double-pulse testing process.

[0005] It also includes a positioning shaft located inside the lower shell of the air chamber, a synchronous sliding plate located outside the lower shell of the air chamber, and a vibration tolerance assessment structure; when performing a switching time double pulse test, the positioning shaft positions the semiconductor device so that the test conductor makes conductive contact with the root of the semiconductor device pin; when performing a vibration tolerance assessment, the synchronous sliding plate drives the positioning shaft through the vibration tolerance assessment structure so that the semiconductor device moves to the state where the pin end makes conductive contact with the test conductor.

[0006] The lower shell of the air chamber is fixedly provided with a track frame, and the synchronous slide plate slides within the track frame. A first lead screw is provided in the synchronous slide plate, and the synchronous slide plate is driven by rotating the first lead screw.

[0007] The vibration tolerance assessment structure includes a secondary slot on the positioning shaft and a tray fixedly installed at the lower end of the positioning shaft. A vertical shaft is fixedly installed at the lower part of the tray, and a synchronous vibration plate is fixedly installed at the lower part of the vertical shaft. A cantilever plate is positioned and sleeved on the outside of the vertical shaft. The cantilever plate passes through the inner wall of the lower shell of the air chamber and is fixedly installed with the synchronous slide plate. A first spring is provided between the cantilever plate and the synchronous vibration plate.

[0008] A vibration shaft is inserted into the bottom of the lower shell of the air chamber, and an electromagnetic vibrator for controlling the up-and-down vibration of the vibration shaft is provided at the lower end of the vibration shaft. When performing vibration tolerance assessment, the synchronous slide moves the synchronous vibrating plate to directly above the vibration shaft, so that the vibration shaft can drive the synchronous vibrating plate to vibrate up and down. At this time, the secondary slot axially limits the semiconductor device, and the pin end of the semiconductor device is in conductive contact with the test conductor.

[0009] A pressure plate is fixedly installed above the lower shell of the air chamber, and a lifting cylinder is installed on the pressure plate. The lifting cylinder drives the upper shell of the air chamber, so that the upper shell of the air chamber can move up and down relative to the lower shell of the air chamber.

[0010] A pressing column is fixedly installed on the upper surface of the upper shell of the air chamber, and a mating tooth groove is opened on the pressing column; a positioning slide frame is fixedly installed on the pressure plate, and a slide body is limited and lifted in the positioning slide frame. A cylindrical inner cavity is opened inside the slide body, and a piston body is installed in the cylindrical inner cavity. A toothed insert plate and a second spring are provided on one side of the piston body. When the toothed insert plate extends, it can be limited and engaged with the mating tooth groove.

[0011] The slide body is provided with a second lead screw in a helical engagement. The slide body is driven to move up and down by rotating the second lead screw. A gear part is fixedly provided at the end of the second lead screw. The gear part is externally engaged with a toothed condition. A rack cylinder is provided on one side of the toothed condition for driving the toothed condition to move along its length direction. A first air pipe is connected to the rack cylinder. A parallel valve group is provided on the first air pipe. The other end of the first air pipe is connected to the second air pipe.

[0012] One end of the second air pipe is connected to the inner cavity of the cylinder, and the other end is connected to a pressure-sensing cylinder. The pressure-sensing cylinder is fixedly mounted on the outer frame of the track. When the synchronous slide moves away from the lower shell of the air chamber, the synchronous slide will squeeze and contact the pressure-sensing cylinder, causing the pressure-sensing cylinder to generate positive pressure gas. The positive pressure gas first enters the inner cavity of the cylinder through the second air pipe, driving the toothed insert plate to extend, and then enters the rack cylinder through the parallel valve group, causing the rack cylinder to drive the toothed plate to move.

[0013] A semiconductor device switching time double pulse test system with improved accuracy includes a semiconductor device switching time double pulse test device with improved accuracy and a test circuit module. The test circuit module is electrically connected to the test conductor in the semiconductor device switching time double pulse test device with improved accuracy.

[0014] Compared with the prior art, the beneficial effects of the present invention are: the semiconductor device switching time double pulse test device of the present invention forms a closed cavity through the set lower shell and upper shell of the air chamber, and by cooperating with the air supply pipe and constant temperature fan, it can make the semiconductor device maintain a more stable temperature during switching time double pulse test, thereby improving the test accuracy.

[0015] This invention, through the coordination of a positioning drag shaft and a vibration tolerance assessment structure, can simultaneously perform vibration tolerance assessment of semiconductor devices. Furthermore, by changing the position of the semiconductor device through the positioning drag shaft, during the switching time double pulse test, the test conductor contacts the root of the semiconductor device's pin, reducing the loop length, lowering stray inductance, and improving the accuracy of the switching time double pulse test. During vibration tolerance assessment, the test conductor contacts the tip of the semiconductor device's pin, making the pin less prone to excessive bending fatigue and reducing damage to the pin when the semiconductor device vibrates.

[0016] This invention, through the combination of a clamping column, a sliding body, and a pressure-sensing cylinder, can automatically increase the downward pressure on the upper shell of the air chamber by adapting to the positional changes of the synchronous sliding plate during vibration tolerance assessment. This makes the pins more stable when the semiconductor device vibrates, clamped between the lower and upper shells of the air chamber, further reducing the probability of shaking affecting the contact resistance. Attached Figure Description

[0017] Figure 1 is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 is a schematic diagram of the overall structure of the present invention from another angle.

[0019] Figure 3 is a schematic diagram of the removal of the upper shell and pressure plate structure of the air chamber.

[0020] Figure 4 is a top view showing the removal of the upper shell and pressure plate structure of the air chamber.

[0021] Figure 5 is a three-dimensional half-section schematic diagram of the cantilever plate of the present invention.

[0022] Figure 6 is a partial three-dimensional half-section schematic diagram of the positioning drag shaft of the present invention.

[0023] Figure 7 is a three-dimensional half-section schematic diagram of the electromagnetic vibrator of the present invention.

[0024] Figure 8 is a three-dimensional half-section schematic diagram of the slide body of the present invention.

[0025] Figure 9 is a partial three-dimensional cross-sectional view of the slide body of the present invention.

[0026] In the diagram: 1. Lower shell of the air chamber; 2. Upper shell of the air chamber; 3. Test conductor; 4. Air supply pipe; 5. Constant temperature fan; 6. Positioning support shaft; 7. Synchronous sliding plate; 8. Track outer frame; 9. First lead screw; 601. Secondary slot; 602. Tray section; 603. Vertical shaft section; 604. Synchronous vibrating plate; 605. Cantilever plate; 606. First spring; 607. Vibration shaft; 608. Electromagnetic vibrator; 101. Cover plate; 102. Lifting cylinder; 103. Pressing column; 104. 105. Gear groove; 106. Positioning slide frame; 107. Slide body; 108. Cylindrical inner cavity; 109. Piston body; 100. Gear groove insert plate; 110. Second spring; 111. Second lead screw; 112. Gear section; 113. Gear condition; 114. Rack cylinder; 115. First air pipe; 116. Parallel valve group; 117. Second air pipe; 118. Pressure sensing cylinder; 301. Horizontal contact part; 302. Insertion part; 501. U-shaped support plate; 119. Slide rail side plate. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Please refer to Figures 1 to 9. This invention provides a technical solution: a double-pulse testing device for semiconductor device switching time with improved accuracy, including a lower chamber shell 1 and an upper chamber shell 2 that can move up and down relative to the lower chamber shell 1. A test conductor 3 is installed on the lower chamber shell 1. When the upper chamber shell 2 descends and closes with the lower chamber shell 1, a closed cavity is formed. The semiconductor device is disposed in the closed cavity. Under the pressure of the upper chamber shell 2, the pins of the semiconductor device make contact with the test conductor 3. As shown in Figure 6, a horizontal contact portion 301 is provided on the upper part of the test conductor 3. The horizontal contact portion 301 is in a horizontal state. The pins of the semiconductor device contact the horizontal contact portion 301, thereby realizing the contact and conduction between the pins and the test conductor 3. A pin portion 302 is also fixedly provided on the test conductor 3.

[0029] An air supply pipe 4 is connected to one end of the lower shell 1 of the air chamber, and a constant temperature fan 5 is installed at the other end of the air supply pipe 4. The constant temperature fan 5 consists of a fan module, airflow heating fins, airflow cooling fins, and a temperature sensor. The sensor monitors the airflow temperature in real time. In conjunction with the airflow heating fins and airflow cooling fins, it can control the temperature of the output gas, so that the constant temperature fan 5 can output constant temperature gas at the set temperature, as shown in Figure 2. A U-shaped support plate 501 is fixedly installed on the upper part of the constant temperature fan 5 with screws. The upper part of the U-shaped support plate 501 is then fixedly installed to the lower shell 1 of the air chamber with screws, thereby achieving the support and fixation of the lower shell 1 of the air chamber. The constant temperature fan 5 generates constant temperature gas and inputs it into the above-mentioned closed cavity through the air supply pipe 4, thereby reducing the temperature fluctuation of the semiconductor device during the switching time double pulse test.

[0030] It also includes a positioning shaft 6 disposed inside the lower shell 1 of the air chamber, a synchronous sliding plate 7 disposed outside the lower shell 1 of the air chamber, and a vibration tolerance assessment structure; when performing a switching time double pulse test, the positioning shaft 6 positions the semiconductor device so that the test conductor 3 makes conductive contact with the root of the semiconductor device pin, as shown in Figure 6, where the root of the semiconductor device pin is the end of the pin that is close to the semiconductor device package; when performing a vibration tolerance assessment, the synchronous sliding plate 7 drives the positioning shaft 6 through the vibration tolerance assessment structure so that the semiconductor device moves to the state where the pin end makes conductive contact with the test conductor 3, where the pin end is the end of the semiconductor device that is away from the semiconductor device package.

[0031] The lower shell 1 of the air chamber is fixedly provided with a track frame 8. The synchronous slide plate 7 slides within the track frame 8. A first lead screw 9 is provided in the synchronous slide plate 7 in a spiral engagement. The synchronous slide plate 7 is driven by the rotation of the first lead screw 9. The first lead screw 9 is driven by a motor.

[0032] The vibration tolerance assessment structure includes a secondary slot 601 formed on the positioning shaft 6, and a tray 602 fixedly installed at the lower end of the positioning shaft 6. A vertical shaft 603 is fixedly installed at the lower part of the tray 602, and a synchronous vibration plate 604 is fixedly installed at the lower part of the vertical shaft 603. A cantilever plate 605 is positioned and sleeved on the outside of the vertical shaft 603. The cantilever plate 605 passes through the inner wall of the lower shell 1 of the air chamber and is fixedly installed with the synchronous slide plate 7. A first spring 606 is provided between the cantilever plate 605 and the synchronous vibration plate 604.

[0033] A vibration shaft 607 is inserted into the bottom of the lower shell 1 of the air chamber. An electromagnetic vibrator 608 for controlling the up-and-down vibration of the vibration shaft 607 is provided at the lower end of the vibration shaft 607. When conducting vibration tolerance assessment, the synchronous plate 604 is moved to directly above the vibration shaft 607 by the synchronous slide plate 7, so that the vibration shaft 607 can push the synchronous plate 604 to vibrate up and down. At this time, the secondary slot 601 axially limits the semiconductor device, and the pin end of the semiconductor device is in conductive contact with the test conductor 3.

[0034] A pressure plate 101 is fixedly installed on the upper part of the lower shell 1 of the air chamber, as shown in Figures 1 and 3. Slide rail side plates 119 are fixedly installed on both sides of the lower shell 1 of the air chamber. The pressure plate 101 is fixedly installed on the upper end of the slide rail side plates 119. The surface of the slide rail side plates 119 is vertically provided with a track protrusion structure. The two ends of the upper shell 2 of the air chamber are limited and matched with the track protrusion structure vertically provided on the surface of the slide rail side plates 119, so that the upper shell 2 of the air chamber can be stably raised and lowered relative to the lower shell 1 of the air chamber. A lifting cylinder 102 is installed on the pressure plate 101. The lifting cylinder 102 drives the upper shell 2 of the air chamber, so that the upper shell 2 of the air chamber can be raised and lowered relative to the lower shell 1 of the air chamber.

[0035] A pressing column 103 is fixedly installed on the upper surface of the upper shell 2 of the air chamber, and a mating groove 104 is provided on the pressing column 103; a positioning slide frame 105 is fixedly installed on the cover plate 101, and a sliding body 106 is provided in the positioning slide frame 105 for limiting lifting. A cylindrical inner cavity 107 is provided inside the sliding body 106, and a piston body 108 is provided in the cylindrical inner cavity 107. A toothed insert plate 109 and a second spring 110 are provided on one side of the piston body 108. When the toothed insert plate 109 is extended, it can be limited and engaged with the mating groove 104.

[0036] A second lead screw 111 is helically fitted into the slide body 106. Rotation of the second lead screw 111 drives the slide body 106 to move up and down. A gear portion 112 is fixedly mounted at the end of the second lead screw 111. A toothed condition 113 is meshed externally on the gear portion 112. A rack cylinder 114 is mounted on one side of the toothed condition 113 to drive it to move along its length. A first air pipe 115 is connected to the rack cylinder 114. A parallel valve assembly 116 is mounted on the first air pipe 115. The other side of the first air pipe 115... The end is connected to the second air pipe 117; the parallel valve group 116 is composed of a pressure relief valve and a one-way valve in parallel as in the prior art. The one-way valve allows the gas in the first air pipe 115 to flow unidirectionally into the second air pipe 117 without much flow resistance, which can be achieved by a one-way valve. The pressure relief valve allows the positive pressure gas in the second air pipe 117 to enter the first air pipe 115 only when the pressure is higher than the set value, thereby prioritizing the extension of the toothed insert plate 109, and ensuring that the rack cylinder 114 can be reset and return air through the one-way valve.

[0037] One end of the second air pipe 117 is connected to the cylindrical inner cavity 107, and the other end is connected to a pressure-sensing cylinder 118. The pressure-sensing cylinder 118 is fixedly mounted on the outer frame 8 of the track. When the synchronous slide plate 7 moves away from the lower shell 1 of the air chamber, the synchronous slide plate 7 will press against the pressure-sensing cylinder 118, causing the pressure-sensing cylinder 118 to generate positive pressure gas. The positive pressure gas first enters the cylindrical inner cavity 107 through the second air pipe 117, driving the toothed insert plate 109 to extend, and then enters the rack cylinder 114 through the parallel valve group 116, causing the rack cylinder 114 to drive the gear condition 113 to move. The pressure-sensing cylinder 118 and the rack and pinion cylinder 114 have the same structure, both being traditional cylinder structures. The difference lies in the following: the rodless chamber of the pressure-sensing cylinder 118 is equipped with a spring, so that the cylinder shaft of the pressure-sensing cylinder 118 is in the extended state in its natural state, and the second air pipe 117 is connected to the rodless chamber of the pressure-sensing cylinder 118, so that when the cylinder shaft of the pressure-sensing cylinder 118 is squeezed and retracted, positive pressure gas can be input into the second air pipe 117; while the rack and pinion cylinder 114 is equipped with a spring in the rod chamber, so that the cylinder shaft of the rack and pinion cylinder 114 is in the retracted state in its natural state, and the first air pipe 115 is also connected to the rodless chamber of the rack and pinion cylinder 114.

[0038] A semiconductor device switching time double pulse test system with improved accuracy includes a semiconductor device switching time double pulse test device with improved accuracy and a test circuit module. The test circuit module is electrically connected to the test conductor 3 in the semiconductor device switching time double pulse test device with improved accuracy. Specifically, the test conductor 3 is electrically connected to the test circuit module through a pin portion 302.

[0039] In use, the invention first controls the upper shell 2 of the air chamber to rise by the lifting cylinder 102. At this time, the semiconductor device can be placed inside the lower shell 1 of the air chamber. The heat dissipation substrate of the standard packaged semiconductor device is provided with mounting holes. The mounting holes are aligned with the positioning shaft 6 so that the semiconductor device is positioned. At this time, the root of the lead of the semiconductor device is in conductive contact with the horizontal contact part 301, as shown in Figures 3 and 6.

[0040] The upper shell 2 of the control chamber moves downward, pressing the pins of the semiconductor device onto the horizontal contact portion 301, thus establishing a stable contact between the pins and the horizontal contact portion 301. At this time, the lower shell 1 and the upper shell 2 of the control chamber cooperate to form a closed cavity. The constant temperature fan 5 runs, and constant temperature air is introduced into the closed cavity through the air supply pipe 4. For example, when testing under different standards, the temperature of the constant temperature air can be selected as 25°C, 30°C, or 40°C. By continuously introducing constant temperature air, the semiconductor device and the constant temperature air complete heat exchange, and the two temperatures become consistent.

[0041] The test circuit module sends out a double pulse signal and performs corresponding acquisition to start the switching time double pulse test. During the test, when the temperature of the semiconductor device is higher than that of the constant temperature air, the constant temperature air will carry away the temperature of the semiconductor device. Conversely, when the temperature of the semiconductor device drops, the constant temperature air will also heat the semiconductor device, making the temperature of the semiconductor device more stable throughout the test and improving the test accuracy.

[0042] Since semiconductor devices used in automotive, industrial equipment and other applications are subjected to vibration stress for a long time, if there are problems with the internal bonding wires or chip solder layers, poor contact will occur during vibration. For example, IGBTs will show instantaneous fluctuations in the collector-emitter saturation voltage drop. In the quality inspection and testing of semiconductors, mechanical vibration is performed and the stability of the semiconductor device parameters is monitored to screen for the above-mentioned problems.

[0043] The present invention can perform superimposed tests for vibration tolerance assessment. As shown in Figure 4, by controlling the rotation of the first lead screw 9, the synchronous slide plate 7 moves relative to the outer frame of the track 8. The synchronous slide plate 7 drives the cantilever plate 605 to move, as shown in Figure 6, so that the cantilever plate 605 moves away from the semiconductor device.

[0044] During the movement of the cantilever plate 605, the positioning drag shaft 6, the synchronous vibration plate 604, and other structures move synchronously, as shown in Figure 6. The secondary slot 601 engages with the mounting holes on the heat dissipation substrate, thereby positioning the semiconductor device axially relative to the positioning drag shaft 6. The positioning drag shaft 6 drags the semiconductor device toward the synchronous slide plate 7 until the synchronous vibration plate 604 is directly above the vibration shaft 607, as shown in Figure 7.

[0045] At this point, the semiconductor device's pins, initially in conductive contact with the horizontal contact portion 301 at their base, slide to a state where their ends are also in conductive contact with the horizontal contact portion 301. The electromagnetic vibrator 608 drives the vibration shaft 607 to oscillate upwards at high frequency. The vibration shaft 607 impacts the synchronous vibration plate 604, causing the positioning drag shaft 6 to push the semiconductor device up and down through the secondary slot 601. Because the pin ends are in conductive contact with the horizontal contact portion 301, the pins retain a longer bending range, reducing the degree of bending and minimizing fatigue damage during the semiconductor device's up-and-down oscillation. During this process, the stability of the semiconductor device's parameters is screened using the test conductor 3 and the test circuit module. After screening, the synchronous slide plate 7 is reset.

[0046] During the above process, as shown in Figures 4 and 5, when the synchronous slide plate 7 moves into place away from the lower shell 1 of the air chamber, the synchronous slide plate 7 will squeeze the cylinder shaft of the pressure-sensing cylinder 118, causing the pressure-sensing cylinder 118 to generate positive pressure gas, which is then input into the second air pipe 117.

[0047] As shown in Figure 9, the parallel valve group 116 can only be opened after the gas pressure reaches the set threshold. Therefore, the gas in the second gas pipe 117 first enters the cylindrical inner cavity 107, pushes the piston body 108 to drive the toothed insert plate 109 to extend, so that the toothed insert plate 109 is inserted into the mating toothed groove 104, locking the position of the slide body 106 and the clamping column 103.

[0048] As the cylinder shaft of the pressure-sensing cylinder 118 continues to be compressed by the synchronous slide plate 7, the gas pressure in the second air pipe 117 continues to rise until it reaches the opening threshold of the parallel valve group 116. This causes the gas in the second air pipe 117 to enter the first air pipe 115 through the parallel valve group 116, driving the rack cylinder 114 to extend and move the gear conditioner 113 to drive the gear part 112 to rotate. This causes the second lead screw 111 to drive the slide body 106 to move downward through the screw engagement. Then, through the transmission of the clamping column 103, the pressure on the upper shell 2 of the air chamber is further increased downward. This makes the pins more stable when the semiconductor device vibrates, clamped between the lower shell 1 and the upper shell 2 of the air chamber, further reducing the probability of shaking affecting the contact resistance. When the synchronous slide plate 7 resets, the cylinder structures such as the pressure-sensing cylinder 118 and the rack cylinder 114 automatically reset through the reverse push of the internal spring.

[0049] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor device switching time double-pulse testing device with improved accuracy, comprising a lower chamber housing and an upper chamber housing capable of vertical movement relative to the lower chamber housing, characterized in that: A test conductor is installed on the lower shell of the air chamber. When the upper shell of the air chamber descends and closes with the lower shell, a closed cavity is formed. The semiconductor device is placed in the closed cavity. Under the pressure of the upper shell of the air chamber, the pins of the semiconductor device make contact with the test conductor. An air supply pipe is connected to one end of the lower shell of the air chamber. A constant temperature fan is installed at the other end of the air supply pipe. The constant temperature fan generates constant temperature gas and inputs it into the closed cavity through the air supply pipe, thereby reducing the temperature fluctuation of the semiconductor device during the switching time double pulse test.

2. The semiconductor device switching time double-pulse testing device with improved accuracy according to claim 1, characterized in that: It also includes a positioning shaft located inside the lower shell of the air chamber, a synchronous sliding plate located outside the lower shell of the air chamber, and a vibration tolerance assessment structure; when performing a switching time double pulse test, the positioning shaft positions the semiconductor device so that the test conductor makes conductive contact with the root of the semiconductor device pin; when performing a vibration tolerance assessment, the synchronous sliding plate drives the positioning shaft through the vibration tolerance assessment structure so that the semiconductor device moves to the state where the pin end makes conductive contact with the test conductor.

3. The semiconductor device switching time double-pulse testing device with improved accuracy according to claim 2, characterized in that: The lower shell of the air chamber is fixedly provided with a track frame, and the synchronous slide plate slides within the track frame. A first lead screw is provided in the synchronous slide plate, and the synchronous slide plate is driven by rotating the first lead screw.

4. The semiconductor device switching time double-pulse testing device with improved accuracy according to claim 2, characterized in that: The vibration tolerance assessment structure includes a secondary slot on the positioning shaft and a tray fixedly installed at the lower end of the positioning shaft. A vertical shaft is fixedly installed at the lower part of the tray, and a synchronous vibration plate is fixedly installed at the lower part of the vertical shaft. A cantilever plate is positioned and sleeved on the outside of the vertical shaft. The cantilever plate passes through the inner wall of the lower shell of the air chamber and is fixedly installed with the synchronous slide plate. A first spring is provided between the cantilever plate and the synchronous vibration plate.

5. The semiconductor device switching time double-pulse testing device with improved accuracy according to claim 4, characterized in that: A vibration shaft is inserted into the bottom of the lower shell of the air chamber, and an electromagnetic vibrator for controlling the up-and-down vibration of the vibration shaft is provided at the lower end of the vibration shaft. When performing vibration tolerance assessment, the synchronous slide moves the synchronous vibrating plate to directly above the vibration shaft, so that the vibration shaft can drive the synchronous vibrating plate to vibrate up and down. At this time, the secondary slot axially limits the semiconductor device, and the pin end of the semiconductor device is in conductive contact with the test conductor.

6. The semiconductor device switching time double-pulse testing device with improved accuracy according to claim 3, characterized in that: A pressure plate is fixedly installed above the lower shell of the air chamber, and a lifting cylinder is installed on the pressure plate. The lifting cylinder drives the upper shell of the air chamber, so that the upper shell of the air chamber can move up and down relative to the lower shell of the air chamber.

7. The semiconductor device switching time double-pulse testing device with improved accuracy according to claim 6, characterized in that: A pressing column is fixedly installed on the upper surface of the upper shell of the air chamber, and a mating tooth groove is opened on the pressing column; a positioning slide frame is fixedly installed on the pressure plate, and a slide body is limited and lifted in the positioning slide frame. A cylindrical inner cavity is opened inside the slide body, and a piston body is installed in the cylindrical inner cavity. A toothed insert plate and a second spring are provided on one side of the piston body. When the toothed insert plate extends, it can be limited and engaged with the mating tooth groove.

8. The semiconductor device switching time double-pulse testing device with improved accuracy according to claim 7, characterized in that: The slide body is provided with a second lead screw in a helical engagement. The slide body is driven to move up and down by rotating the second lead screw. A gear part is fixedly provided at the end of the second lead screw. The gear part is externally engaged with a toothed condition. A rack cylinder is provided on one side of the toothed condition for driving the toothed condition to move along its length direction. A first air pipe is connected to the rack cylinder. A parallel valve group is provided on the first air pipe. The other end of the first air pipe is connected to the second air pipe.

9. The semiconductor device switching time double-pulse testing device with improved accuracy according to claim 8, characterized in that: One end of the second air pipe is connected to the inner cavity of the cylinder, and the other end is connected to a pressure-sensing cylinder. The pressure-sensing cylinder is fixedly mounted on the outer frame of the track. When the synchronous slide moves away from the lower shell of the air chamber, the synchronous slide will squeeze and contact the pressure-sensing cylinder, causing the pressure-sensing cylinder to generate positive pressure gas. The positive pressure gas first enters the inner cavity of the cylinder through the second air pipe, driving the toothed insert plate to extend, and then enters the rack cylinder through the parallel valve group, causing the rack cylinder to drive the toothed plate to move.

10. A semiconductor device switching time double-pulse test system with improved accuracy, comprising the semiconductor device switching time double-pulse test apparatus and test circuit module with improved accuracy as described in any one of claims 1-9, characterized in that: The test circuit module is electrically connected to the test conductor in the semiconductor device switching time double pulse test device, which can improve accuracy.

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