Spaceborne high-function-density comprehensive electronic computer based on SM750 processor

Abstract

The invention provides a satellite-borne high-function-density comprehensive electronic computer based on an SM750 processor. Comprising a casing, and a first general processing and small solid memory module, a second general processing and small solid memory module, a first secondary power supply module, a second secondary power supply module, a channel gateway module, an I-type comprehensive interface module, an II-type comprehensive interface module, a serial port communication module, an initiating explosive device and power distribution module and a power driving module which are arranged on the casing, the system comprises a relay responder module, a measurement and transmission integrated responder module, a navigation module and an internal bus mother board. According to the invention, a satellite platform measurement and control function, a measurement and transmission integrated function, a satellite service management function, a time base function, an attitude and orbit control management function, a power supply and distribution management function, an initiating explosive device and hot knife driving function, a thermal control management function, a mechanism pointing trajectory planning function and a navigation function are integrated in one single machine, so that the integration level of core functions of the satellite platform can be improved; and the quality and power consumption overhead of basic functions of the platform are effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of small low-Earth orbit spacecraft technology, and more specifically, to a spaceborne high-functional-density integrated electronic computer based on the SM750 processor. Background Technology

[0002] In recent years, the application scenarios for small satellite platforms have been increasing, placing higher demands on the functional density and performance indicators of onboard integrated electronic computers. Traditional onboard integrated electronic systems generally employ a configuration of one management unit plus several expansion units. For example, the management unit mainly implements functions such as analog telemetry acquisition, remote control command execution and forwarding, organizing bus communication, platform telemetry information, platform safety management program control, thermal control management program control, and service program control; the expansion units mainly implement functions such as heater driving, command forwarding, analog telemetry acquisition, and high-current driving. In general, traditional integrated electronic systems have many individual units, are heavy, and have relatively few and dispersed functions, making them difficult to meet the weight and functional density requirements of small satellite platforms.

[0003] Given the characteristics of traditional spaceborne drive controllers and considering the requirements of spacecraft such as small satellites for size, weight, heat dissipation, and reliability, it is of greater significance to develop a new type of high-function-density, high-reliability spaceborne integrated electronic computer that integrates small satellite telemetry and control, telemetry and data transmission, platform power distribution, pyrotechnic drive, thermal blade drive, navigation, magnetic torque drive, propulsion valve drive, and solar array charging and discharging control.

[0004] Patent application CN118779282A discloses a spaceborne security device and system, relating to the field of information security technology. The device includes an integrated control module and an algorithm engine module. The integrated control module is used to perform trust measurement on the satellite payload subsystem and the modules included in the spaceborne security device; and to receive information to be processed from the satellite payload subsystem and invoke the algorithm engine module to perform secure calculations on the information to be processed. The algorithm engine module includes multiple algorithm engines for performing secure calculations on the information to be processed. However, this patent cannot completely solve the existing technical problems, nor can it meet the needs of this invention. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide a spaceborne high-functionality integrated electronic computer based on the SM750 processor.

[0006] The spaceborne high-function-density integrated electronic computer based on the SM750 processor provided by the present invention includes: a chassis and a first general-purpose processing and small storage module, a second general-purpose processing and small storage module, a first secondary power supply module, a second secondary power supply module, a channel gateway module, a type I integrated interface module, a type II integrated interface module, a serial communication module, a pyrotechnics and power distribution module, a power drive module, a relay transponder module, a measurement and transmission integrated transponder module, a navigation module, and an internal bus motherboard; The first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module are both connected to the first secondary power supply module, the second general-purpose processing and small solid-state storage module, the channel gateway module, the serial communication module, the Type I integrated interface module, the Type II integrated interface module, the power drive module, and the navigation module through the internal bus motherboard; the first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module are interconnected and both are connected to the on-board payload unit. The first secondary power supply module is connected to the first general-purpose processing and small solid-state storage module, the second general-purpose processing and small solid-state storage module, the channel gateway module, the serial communication module, the type I integrated interface module, the type II integrated interface module, the power drive module, and the navigation module through the internal bus motherboard; The second secondary power supply module is connected to the Type I integrated interface module, Type II integrated interface module, power drive module, relay transponder module and measurement and transmission integrated transponder module through the internal bus motherboard; The Type I integrated interface module is connected to the pyrotechnics and power distribution modules via an internal bus motherboard.

[0007] Preferably, the first general processing and small solid-state storage module realizes satellite telemetry and remote control management functions, integrated telemetry and transmission solid-state storage and baseband functions, high-frequency mechanism pointing calculation functions, attitude and orbit control management functions, satellite safety management functions, and satellite service program control. The second general-purpose processing and small solid-state storage module realizes the backup satellite telemetry and remote control management function, the integrated telemetry and transmission solid-state storage and baseband function, the high-frequency mechanism pointing calculation function, the attitude and orbit control management function, the satellite safety management function, and the satellite service program control.

[0008] Preferably, the first secondary power supply module and the second secondary power supply module provide power to each component.

[0009] Preferably, the Type I integrated interface module collects voltage and temperature measurements from various parts of the satellite, outputs OC commands, and provides heater drive, valve drive, magnetic torque drive, and secondary power distribution to the satellite; The Type II integrated interface module collects voltage and temperature measurements from various parts of the satellite and provides heater drive and secondary power distribution for the satellite.

[0010] Preferably, the pyrotechnic device and power distribution module provide the satellite with pyrotechnic device drive, hot knife drive and primary power distribution; The power drive module provides heater drive for the satellite; The serial communication module is connected to the satellite's star sensor, fiber optic gyroscope, mechanism controller, camera, and payload unit. The channel gateway module scrambles the satellite telemetry data and then sends it to the integrated telemetry and transceiver module for further modulation and processing. The navigation module provides navigation time synchronization second signals and positioning and orbit determination information to the satellite; The relay transponder module is connected to the satellite's relay antenna and relay power amplifier; The integrated telemetry and transponder module is connected to the satellite's telemetry and transponder antenna.

[0011] Preferably, the housing includes a frame and screws, and the frame is a thin-walled frame structure; The first general-purpose processing and small solid-state storage module, the second general-purpose processing and small solid-state storage module, the first secondary power supply module, the second secondary power supply module, the channel gateway module, the type I integrated interface module, the type II integrated interface module, the serial communication module, the pyrotechnics and power distribution module, the power drive module, the relay transponder module, the measurement and transmission integrated transponder module, and the navigation module are all single-board structures. The internal bus motherboard is fixed to the frame base with screws. After each module is inserted into the housing frame, it is connected to the internal bus motherboard, thereby realizing the electrical interface interaction between the modules.

[0012] Preferably, the first general processing and small fixed storage module and the second general processing and small fixed storage module acquire payload service data through the RS422 interface and directly store it into their small fixed storage according to the data transmission data format. The small fixed storage implements partitioned storage of class data.

[0013] Preferably, the first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module have a variable rate function for satellite downlink data channels. When the satellite is in telemetry and control mode, the first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module send satellite telemetry data to the channel gateway module at a rate of 16.384 kbps. The channel gateway module scrambles these data and sends them to the telemetry and transmission integrated transponder module for further modulation and processing. When the satellite is in telemetry and transmission integrated mode, the first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module control the telemetry and transmission integrated transponder module to enter the telemetry and transmission integrated mode. At the same time, the satellite telemetry data and various data transmission data are sent to the channel gateway together at a rate of 950.272 kbps according to a preset ratio. The channel gateway adaptively changes the rate and scrambles the data before sending it to the telemetry and transmission integrated transponder module for further modulation and processing.

[0014] Preferably, the first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module control the Type I integrated interface module to send OC commands to the pyrotechnics and power distribution module through the RS422 interface to control the operation of the drive circuits on them.

[0015] Preferably, the Type I integrated interface module and the Type II integrated interface module use highly integrated chips and devices such as AD976 and LT47322. The Type I integrated interface module realizes 64-channel OC command drive, 68-channel voltage acquisition, 56-channel temperature acquisition, 24-channel heater drive, 3-channel magnetic torque drive, 1-channel self-locking valve drive and 4-channel solenoid valve drive. The Type II integrated interface module realizes 4-channel voltage acquisition, 12-channel analog current acquisition, 44-channel temperature acquisition, 12-channel heater drive and 4-channel secondary power distribution.

[0016] Compared with the prior art, the present invention has the following beneficial effects: (1) The general processing and small solid-state storage module, channel gateway module and telemetry and transmission integrated transponder module of the present invention cooperate with each other to realize the integrated digital and radio frequency baseband functions of satellite data downlink telemetry and control and data transmission. Under the premise that the bandwidth requirements of low-orbit satellite service data communication are low, the satellite data transmission function can be integrated into the on-board integrated electronic computer, saving the weight and power consumption expenses required by the satellite to realize the data transmission function. (2) This invention does not require an FPGA for power distribution and pyrotechnic hot knife drive control. It directly controls the power distribution relay and the pyrotechnic hot knife optocoupler through internal OC instructions, thereby improving reliability while reducing the weight and power consumption of the pyrotechnics and power distribution module. (3) This invention greatly reduces the types and number of devices in various interfaces or drive circuits, and integrates the analog telemetry acquisition function, OC command drive function, valve drive function, heater drive function, secondary power distribution function, and magnetic torque drive function into the integrated interface module (Type I, Type II), which enables the integrated electronic subsystem to achieve the above functions while avoiding the use of a single expansion unit with relatively large weight and power consumption. (4) The general processing and small solid memory module of the present invention, together with the data management software, attitude and orbit control software and navigation module, realize high real-time and high frequency mechanism pointing control. While simplifying the mechanism control information flow, it saves the weight and power consumption expenses required by the satellite mechanism subsystem to achieve this function. Attached Figure Description

[0017] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the spaceborne integrated electronic computer based on the SM750 processor of this invention. Detailed Implementation

[0018] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0019] Example like Figure 1 This invention proposes a spaceborne high-function-density integrated electronic computer based on the SM750 processor, comprising: a chassis and general-purpose processing and small solid-state storage modules 1 and 2, a secondary power supply module, a channel gateway module, an integrated interface module (Type I), an integrated interface module (Type II), a pyrotechnics and power distribution module, a power drive module, a relay transponder module, a measurement and transmission integrated transponder module, a navigation module, and an internal bus motherboard mounted on the chassis; the chassis includes a frame and screws, the frame being a thin-walled frame structure; the general-purpose processing and small solid-state storage modules 1 and 2, the secondary power supply module, the channel gateway module, the integrated interface module (Type I), the integrated interface module (Type II), the pyrotechnics and power distribution module, the power drive module, the relay transponder module, the measurement and transmission integrated transponder module, and the navigation module are all single-board structures; the internal bus motherboard is fixed to the base of the frame by screws, and after each module is inserted into the chassis frame, it is connected to the internal bus motherboard, thereby realizing electrical interface interaction between the modules. A high-function-density integrated electronic computer based on the SM750 processor can realize satellite platform telemetry and control functions, telemetry and transmission integration functions, satellite management functions, time base functions, attitude and orbit control management functions, power supply and distribution management functions, pyrotechnics and hot knife drive functions, thermal control management functions, mechanism pointing trajectory planning functions, and navigation functions. The integrated electronic computer weighs only 12.7 kg and has a size of only 300 mm × 248 mm × 197.5 mm. Its long-term on-orbit power consumption is less than 70 W, and it is securely installed inside the satellite platform cabin with eight M6 screws.

[0020] The general processing and small fixed-store module can acquire payload service data through the RS422 interface and directly store it in its small fixed-store according to the data transmission format. The small fixed-store can realize partitioned storage of three types of data. The general processing and small fixed-store module has a variable rate function for satellite downlink data channels. When the satellite is in telemetry and control mode, the general processing and small fixed-store module sends satellite telemetry data to the channel gateway module at a rate of 16.384kbps. The channel gateway module scrambles these data and sends them to the telemetry and transmission integrated transponder module for further modulation and processing. When the satellite is in telemetry and transmission integrated mode, the general processing and small fixed-store module controls the telemetry and transmission integrated transponder module to enter the telemetry and transmission integrated mode. At the same time, it sends satellite telemetry data and various types of data transmission data to the channel gateway at a rate of 950.272kbps in a specified proportion. The channel gateway adapts to the rate change and scrambles the data before sending it to the telemetry and transmission integrated transponder module for further modulation and processing.

[0021] The general processing and small solid-state storage module can control the integrated interface module (Type I) through the RS422 interface to send OC commands to the pyrotechnics and power distribution module to control the operation of the drive circuits on them. Therefore, there is no need to use related control FPGA on the pyrotechnics and power distribution module, saving device installation space and increasing the number of related drive channels. A total of 8 main and backup control power distribution channels, 4 main and backup pyrotechnics drive channels, and 4 main and backup hot knife drive channels are realized.

[0022] The integrated interface modules (Type I and Type II) use highly integrated chips and devices such as AD976 and LT47322. The integrated interface module (Type I) implements 64-channel OC command drive, 68-channel voltage acquisition, 56-channel temperature acquisition, 24-channel heater drive, 3-channel magnetic torque drive, 1-channel self-locking valve drive, and 4-channel solenoid valve drive. The integrated interface module (Type II) implements 4-channel voltage acquisition, 12-channel analog current acquisition, 44-channel temperature acquisition, 12-channel heater drive, and 4-channel secondary power distribution.

[0023] The general processing and small solid-state storage module runs the Fengyun Yihui operating system. The satellite data management application software and attitude and orbit control application software run on the same operating system. The operating system provides task scheduling services, reliable data interaction mechanisms and a unified time reference. Combined with the positioning and orbit determination data provided by the navigation module, they work together to complete the high-frequency control of the satellite platform structure. It can simultaneously output the real-time pointing angle control sequence of the two mechanisms, with a single-step period of 2 milliseconds in the control sequence.

[0024] This invention has the following advantages: 1) The general-purpose processing and small solid-state storage module, channel gateway module, and integrated telemetry and transmission transponder module work together to realize the integrated digital and radio frequency baseband functions of satellite data downlink telemetry and control and data transmission. Under the premise that the bandwidth requirements of low-orbit satellite service data communication are relatively low, the satellite data transmission function can be integrated into the onboard integrated electronic computer, saving the weight and power consumption expenses required by the satellite to realize the data transmission function; 2) There is no need for the FPGA for power distribution and pyrotechnic hot knife drive control. The drive control of the power distribution relay and the pyrotechnic hot knife optocoupler is directly realized through internal OC instructions, which improves reliability while reducing the weight and power consumption of the pyrotechnics and power distribution module; 3) Large The number and types of components in various interfaces or drive circuits have been reduced. The analog telemetry acquisition function, OC command drive function, valve drive function, heater drive function, secondary power distribution function, and magnetic torque drive function have been integrated into the integrated interface module (Type I and II). This allows the integrated electronic subsystem to achieve the above functions without having to use a single expansion unit with relatively large weight and power consumption. 4) The data management software, attitude and orbit control software of the general processing and small solid-state storage module work together with the navigation module to achieve high real-time and high-frequency mechanism pointing control. This simplifies the mechanism control information flow and saves the weight and power consumption expenses required by the satellite mechanism subsystem to achieve this function.

[0025] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0026] Those skilled in the art will understand that, in addition to implementing the system, apparatus, and their modules provided by this invention in purely computer-readable program code, the same program can be implemented in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers by logically programming the method steps. Therefore, the system, apparatus, and their modules provided by this invention can be considered a hardware component, and the modules included therein for implementing various programs can also be considered structures within the hardware component; alternatively, modules for implementing various functions can be considered both software programs implementing the method and structures within the hardware component.

[0027] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A spaceborne high-functional-density integrated electronic computer based on the SM750 processor, characterized in that, include: The casing and the first general-purpose processing and small storage module, the second general-purpose processing and small storage module, the first secondary power supply module, the second secondary power supply module, the channel gateway module, the type I integrated interface module, the type II integrated interface module, the serial communication module, the pyrotechnics and power distribution module, the power drive module, the relay transponder module, the measurement and transmission integrated transponder module, the navigation module, and the internal bus motherboard are mounted on the casing. The first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module are both connected to the first secondary power supply module, the second general-purpose processing and small solid-state storage module, the channel gateway module, the serial communication module, the Type I integrated interface module, the Type II integrated interface module, the power drive module, and the navigation module through the internal bus motherboard; the first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module are interconnected and both are connected to the on-board payload unit. The first secondary power supply module is connected to the first general-purpose processing and small solid-state storage module, the second general-purpose processing and small solid-state storage module, the channel gateway module, the serial communication module, the type I integrated interface module, the type II integrated interface module, the power drive module, and the navigation module through the internal bus motherboard; The second secondary power supply module is connected to the Type I integrated interface module, Type II integrated interface module, power drive module, relay transponder module and measurement and transmission integrated transponder module through the internal bus motherboard; The Type I integrated interface module is connected to the pyrotechnics and power distribution modules via an internal bus motherboard.

2. The spaceborne high-functional-density integrated electronic computer based on the SM750 processor according to claim 1, characterized in that, The first general processing and small solid-state storage module realizes satellite telemetry and remote control management functions, integrated telemetry and transmission solid-state storage and baseband functions, high-frequency mechanism pointing calculation functions, attitude and orbit control management functions, satellite safety management functions, and satellite service program control. The second general-purpose processing and small solid-state storage module realizes the backup satellite telemetry and remote control management function, the integrated telemetry and transmission solid-state storage and baseband function, the high-frequency mechanism pointing calculation function, the attitude and orbit control management function, the satellite safety management function, and the satellite service program control.

3. The spaceborne high-functional-density integrated electronic computer based on the SM750 processor according to claim 1, characterized in that, The first and second secondary power modules provide power to each component.

4. The spaceborne high-functional-density integrated electronic computer based on the SM750 processor according to claim 1, characterized in that, The Type I integrated interface module collects voltage and temperature measurements from various parts of the satellite, outputs OC commands, and provides the satellite with heater drive, valve drive, magnetic torque drive and secondary power distribution. The Type II integrated interface module collects voltage and temperature measurements from various parts of the satellite and provides heater drive and secondary power distribution for the satellite.

5. The spaceborne high-functional-density integrated electronic computer based on the SM750 processor according to claim 1, characterized in that, The pyrotechnics and power distribution module provide the satellite with pyrotechnic drive, hot knife drive and primary power distribution; The power drive module provides heater drive for the satellite; The serial communication module is connected to the satellite's star sensor, fiber optic gyroscope, mechanism controller, camera, and payload unit. The channel gateway module scrambles the satellite telemetry data and then sends it to the integrated telemetry and transceiver module for further modulation and processing. The navigation module provides navigation time synchronization second signals and positioning and orbit determination information to the satellite; The relay transponder module is connected to the satellite's relay antenna and relay power amplifier; The integrated telemetry and transponder module is connected to the satellite's telemetry and transponder antenna.

6. The spaceborne high-functional-density integrated electronic computer based on the SM750 processor according to claim 1, characterized in that, The housing includes a frame and screws, and the frame is a thin-walled frame structure; The first general-purpose processing and small solid-state storage module, the second general-purpose processing and small solid-state storage module, the first secondary power supply module, the second secondary power supply module, the channel gateway module, the type I integrated interface module, the type II integrated interface module, the serial communication module, the pyrotechnics and power distribution module, the power drive module, the relay transponder module, the measurement and transmission integrated transponder module, and the navigation module are all single-board structures. The internal bus motherboard is fixed to the frame base with screws. After each module is inserted into the housing frame, it is connected to the internal bus motherboard, thereby realizing the electrical interface interaction between the modules.

7. The spaceborne high-functional-density integrated electronic computer based on the SM750 processor according to claim 1, characterized in that, The first general processing and small fixed storage module and the second general processing and small fixed storage module acquire payload service data through the RS422 interface and directly store it into their small fixed storage according to the data transmission data format. The small fixed storage implements partitioned storage of class data.

8. The spaceborne high-functional-density integrated electronic computer based on the SM750 processor according to claim 1, characterized in that, The first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module have variable rate function for satellite downlink data channels. When the satellite is in telemetry and control mode, the first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module send satellite telemetry data to the channel gateway module at a rate of 16.384 kbps. The channel gateway module scrambles these data and sends them to the telemetry and transmission integrated transponder module for further modulation and processing. When the satellite is in telemetry and transmission integrated mode, the first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module control the telemetry and transmission integrated transponder module to enter the telemetry and transmission integrated mode. At the same time, the satellite telemetry data and various data transmission data are sent to the channel gateway together at a rate of 950.272 kbps according to a preset ratio. The channel gateway adapts to the rate change and scrambles the data before sending it to the telemetry and transmission integrated transponder module for further modulation and processing.

9. The spaceborne high-functional-density integrated electronic computer based on the SM750 processor according to claim 1, characterized in that, The first general-purpose processing and small solid-state storage module and the second general-purpose processing and small solid-state storage module control the Type I integrated interface module to send OC commands to the pyrotechnics and power distribution module through the RS422 interface to control the operation of the drive circuits on them.

10. The spaceborne high-functional-density integrated electronic computer based on the SM750 processor according to claim 1, characterized in that, The Type I and Type II integrated interface modules use highly integrated chips and devices such as AD976 and LT47322. The Type I integrated interface module implements 64 OC command drive, 68 voltage acquisition, 56 temperature acquisition, 24 heater drive, 3 magnetic torque drive, 1 self-locking valve drive and 4 solenoid valve drive. The Type II integrated interface module implements 4 voltage acquisition, 12 analog current acquisition, 44 temperature acquisition, 12 heater drive and 4 secondary power distribution.

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