High-efficiency heat dissipation module for high-power inverter frequency converter and design method of high-efficiency heat dissipation module

Abstract

The invention provides an efficient heat dissipation module for a high-power inverter frequency converter and a design method of the efficient heat dissipation module, and belongs to the technical field of heat dissipation, the heat dissipation module is used for being attached to a power element to export heat, the heat dissipation module comprises a radiator substrate, a substrate heat pipe, a fin heat pipe and a fin set, the substrate heat pipe is pre-buried on the face, attached to the power element, of the radiator substrate, and the fin set is embedded in the substrate heat pipe; and the other surface of the radiator substrate is welded with a fin heat pipe vertical to the substrate, and the fin heat pipe is fixedly connected with a fin group. Innovation is conducted from the principle level, and the heat pipes are pre-buried in the base plate, so that X / Y-axis two-dimensional plane soaking is achieved; the vertical fin heat pipes and the high-density laminations strengthen Z-axis heat dissipation, a three-dimensional heat dissipation network is formed, and the vertical fin heat pipes and the high-density laminations are more efficient, faster in heat conduction and more in heat transfer direction.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation technology, specifically relating to a high-efficiency heat dissipation module for high-power inverter frequency converters and its design method. Background Technology

[0002] Thermal design of electronic devices is widely used in both civilian and military products. With the development of microelectronics technology, chip integration is increasing and packaging is becoming smaller, resulting in highly integrated systems formed by high-density assembly and micro-assembly. As electronic product functions improve, heat dissipation power increases while volume shrinks, leading to a continuous increase in heat flux density. Traditional heat dissipation methods can no longer meet the ever-evolving heat dissipation requirements. Designers must consider thermal design during the structural and electrical performance design phases of products, simultaneously meeting structural interface requirements, electrical performance requirements, and heat dissipation requirements. Related data shows that thermal failure accounts for 55% of electronic product failures. The traditional method of experience-based design plus prototype thermal testing is no longer suitable for the rapid development and optimized design needs of modern electronic devices. Therefore, improving the heat dissipation capacity of equipment is of significant practical value for improving the thermal reliability of electronic devices.

[0003] In the field of electrical installations, high-power devices often generate a lot of heat. This heat cannot be dissipated inside the device, which has a significant impact on the performance of the electrical components inside the device. Excessively high ambient temperatures can also affect the normal operation of the device system.

[0004] Through competitor research, searching relevant papers and patents, collecting online information, and in-depth communication with multiple radiator suppliers, we have developed a relatively systematic understanding of air-cooled radiators. Based on practical application needs, traditional radiator technology has undergone a continuous evolution, from early extruded profile radiators to tinted radiators and press-fit radiators, and further advancing towards more advanced technologies such as spade-tinted radiators. Advances in different processing techniques have improved the application performance of traditional radiators. However, limited by the thermal conductivity of the materials themselves and long-established design concepts, the heat dissipation capabilities of existing technologies are unlikely to achieve a significant breakthrough. Summary of the Invention

[0005] This application provides a high-efficiency heat dissipation module and its design method for high-power inverter frequency converters, forming a three-dimensional heat dissipation network, which is more efficient, has faster heat conduction, and more heat transfer directions.

[0006] A high-efficiency heat dissipation module for a high-power inverter frequency converter is provided. The heat dissipation module is used to connect power components to dissipate heat. It includes a heat sink substrate, a substrate heat pipe, a finned heat pipe and a fin assembly. The substrate heat pipe is pre-embedded on one side of the heat sink substrate where the power components are connected, and the finned heat pipe perpendicular to the substrate is welded to the other side of the heat sink substrate. The fin assembly is fixedly connected to the finned heat pipe.

[0007] Moreover, the substrate heat pipes are multiple and are evenly distributed on the surface of the heat sink according to the layout of the power components. The position of the substrate heat pipes must pass directly below the heat-generating chip of the power components.

[0008] Moreover, the positions of the finned heat pipe and the substrate heat pipe are in a one-to-one correspondence.

[0009] Furthermore, the finned heat pipe is prefabricated in a U-shape, with the bottom of the U-shape embedded in a blind groove on the back of the heat sink substrate and welded and fixed. The two ends of the U-shape of the finned heat pipe are welded and fixed with fin assemblies.

[0010] Moreover, the fin assembly consists of multiple layers of heat dissipation fins stacked together, all of which are parallel to the substrate surface and arranged along the length of the heat pipe.

[0011] Moreover, the multi-layer heat dissipation fins consist of 34 pieces with a spacing of 2mm.

[0012] Furthermore, the multi-layer heat dissipation fins consist of 29 pieces with a spacing of 2.5mm.

[0013] Furthermore, a thermally conductive layer is provided between the contact surface of the power component and the heat dissipation module, and the thermally conductive layer is made of graphite sheet material.

[0014] A design method for a high-efficiency heat dissipation module for a high-power inverter includes the following steps: Step 1: Analyze the heat dissipation module and its working environment based on the existing research object. The heat dissipation module includes a substrate, fins and heat pipes. Set initial parameters and alternative parameters for the substrate, fins and heat pipes of the heat dissipation module respectively, and establish the heat dissipation module parameters to be optimized. The parameters include: material, connection process, architecture and heat dissipation. Step 2: Establish a simulation model, set the parameters of the simulation model, including initial parameters and alternative parameters, set the calculation conditions, simulate the working state, and use alternative parameters to replace the initial parameters one by one to carry out simulation experiments and record the test values. Adjust the parameter combinations to establish a simulation model after the combination replacement, conduct simulation experiments, summarize and compare the test values, and select the optimized simulation model. Step 3: Prototype fabrication and experimental verification. Based on the selected optimized simulation model, a prototype is fabricated and tested under the same test conditions as the simulated working state to verify the accuracy of the simulation results. Step 4: Based on the experimental verification results of the prototype, modify the simulation model, set the fan curve and the heat conduction layer deterioration rate until the simulation data and experimental data match, and complete the design of the heat dissipation module.

[0015] Moreover, in step 2, (1) The materials include substrate material and fin material. The substrate and fin are selected with initial parameters and replacement parameters respectively in various permutation and combination forms; Substrate material: Initial parameter is aluminum, replacement parameter is copper; Fin material: The initial parameter is aluminum, and the replacement parameter is copper or a mixture of copper and aluminum; (2) Connection process: The initial parameter is cold pressing and filling, and the alternative parameter is soldering or vacuum brazing; (3) Architecture: The initial parameter is that only the heat dissipation fins are fixed on the back of the substrate. The alternative parameters are: heat pipes connected to the back of the substrate, a composite heat dissipation module consisting of fin heat pipes and fin groups connected in series on the back of the substrate, and heat pipes pre-embedded on the front of the substrate. The number of heat pipes on the substrate, the number of fin heat pipes, and the number of fins in the fin group are set to multiple options.

[0016] In summary, the technical solutions provided in the embodiments of this application have the following technical effects or advantages: 1. This invention innovates from the principle level by pre-embedding heat pipes in the substrate to achieve uniform heat distribution in two-dimensional planes along the X and Y axes; vertical fin heat pipes + high-density stacked fins to enhance heat dissipation along the Z axis and form a three-dimensional heat dissipation network.

[0017] 2. This invention is the first to use a composite structure of “substrate-heat pipe-laminated plate-heat pipe”, which improves the thermal conductivity to 80W / m•K, a 300% improvement compared with the existing technology.

[0018] 3. The heat dissipation module material of this invention breaks through by replacing thermal grease with graphite sheets (1500W / m•K), which improves the heat transfer performance by 250 times.

[0019] 4. This technology can successfully support the production of high-power inverters / frequency converters, ensuring stable product performance and achieving performance breakthroughs. By applying the design method of this application to high-power complete sets of equipment in the field, we can occupy the commanding heights of industry technology and seize market opportunities.

[0020] 5. This design methodology shifts from experience-driven to technology-driven, providing a reusable heat dissipation design template for similar products and achieving an upgrade in the R&D paradigm. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of the heat dissipation module in the embodiment.

[0022] Figure 2 This is the front view of the heat dissipation module in the embodiment.

[0023] Figure 3 yes Figure 2 The left view.

[0024] Figure 4 yes Figure 3A sectional view along line AA.

[0025] Figure 5 yes Figure 2 Rear view.

[0026] Figure 6 This is a schematic diagram of the composite heat dissipation module in the embodiment.

[0027] Figure 7 This is a thermal simulation model of C3 with the outer shell hidden.

[0028] Figure 8 This is the location of the thermal test patch for the stacked heat sink module.

[0029] Reference numerals: 1. Heat sink base plate; 2. Base plate heat pipe; 3. Heat sink fins; 4. Fin heat pipe; 5. Press block. Detailed Implementation

[0030] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Example

[0031] A high-efficiency heat dissipation module for a high-power inverter / frequency converter, see attached. Figure 1 As shown, the heatsink includes a heatsink substrate 1, substrate heat pipes 2, finned heat pipes 4, and heat dissipation fins 3. The heat dissipation module is attached to the power components to dissipate heat from the power components. This structure utilizes the principle of heat pipe heat equalization, pre-embedding substrate heat pipes on the side (front) where the power components are attached to the heatsink substrate to achieve two-dimensional planar heat dissipation. In this embodiment, multiple substrate heat pipes are arranged in parallel at intervals, see attached diagram. Figure 2 As shown.

[0032] A finned heat pipe, perpendicular to the base plate, is welded to the back of the heat sink base plate. The positions of the finned heat pipes and the base plate heat pipes are aligned one-to-one, ensuring that the finned heat pipes can quickly dissipate heat transferred from the base plate heat pipes. Multiple layers of cooling fins are fixedly connected to the finned heat pipes. These fins are parallel to the base plate surface and arranged in a high-density configuration along the length of the heat pipes. The finned heat pipes and cooling fins achieve heat dissipation perpendicular to the base plate. (See attached diagram.) Figure 3 As shown.

[0033] By combining the structures on both sides of the heat sink base plate, three-dimensional heat dissipation along the XYZ axes is formed in space.

[0034] Embedding heat pipes on the substrate refers to machining blind slots into the heat sink substrate to match the dimensions of the heat pipes. Solder paste is filled into these blind slots, and the heat pipes are then embedded and soldered into them. The placement of the heat pipes is determined by the location of the power components, and the heat pipes are evenly distributed across the heat sink surface according to the component layout. The heat pipes must be positioned directly beneath the heat-generating chip of the power component. Since power components are often smaller than the heat sink, and the heat sink substrate material not covered by heat pipes has limited thermal conductivity, heat cannot be conducted quickly. This solution, by embedding heat pipes, allows for more even and rapid heat transfer to the heat sink surface, enabling the heat sink substrate to dissipate heat over a larger area, thereby improving the heat dissipation efficiency of the heat sink substrate.

[0035] The finned heat pipes are soldered by creating grooves on the back of the heatsink base plate, filling the grooves with solder paste to secure the finned heat pipes, and then filling the spaces between the heatsink fins and the heat pipes with solder paste. The heatsink is then placed in an oven for soldering, followed by surface machining. The heatsink base plate is 20mm thick and made of aluminum. The finned heat pipes are 12mm in diameter and made of copper. The heatsink fins are made of aluminum. The aluminum base plate and heatsink fins represent an optimal choice that balances heat dissipation with cost-effectiveness.

[0036] In this embodiment, the heat pipes pre-embedded on the front side of the heat sink substrate use welding technology, which can reduce the thermal resistance between the heat pipes and the heat sink. The thermal conductivity between the heat pipes and the heat sink without welding is 10 W / m•K, while the thermal conductivity after welding is 80 W / m•K.

[0037] See appendix Figure 5 As shown, the back structure of the heat sink substrate in this embodiment is a heat pipe welded with heat sink fins, and the heat sink fins are arranged parallel to the substrate.

[0038] See appendix Figure 6 As shown, the prefabricated U-shaped finned heat pipe structure is interlocked and welded onto the fin assembly, forming an integrated structure of fin assembly + base plate heat pipe. The bottom of the U-shaped finned heat pipe has a blind groove for embedding and welding to the back of the heat sink base plate. The two ends of the U-shaped finned heat pipe are welded to fix the fin assembly. The welding process reduces the thermal resistance of heat transfer, and the finned heat pipe design allows heat to be transferred to each fin of the fin assembly more quickly, increasing the heat dissipation area and greatly improving the heat dissipation effect. The finned heat pipe can also be directly welded onto the heat sink base plate, which simplifies the manufacturing process.

[0039] The finned heat pipe has a diameter of 10mm and is made of copper. Since the finned heat pipe and the base plate heat pipe are positioned one-to-one, both the finned heat pipe and the base plate heat pipe are fixed by blind groove welding. The thickness of the base plate between the finned heat pipe and the base plate heat pipe is about 2mm. The heat conducted by the base plate heat pipe can be quickly transferred to the corresponding finned heat pipe through the base plate.

[0040] See appendix Figure 4 As shown, in order to ensure the firmness of the finned heat pipe welding, a pressure block is provided at the welding position between the finned heat pipe and the heat sink base plate. The pressure block covers the bent part of the finned heat pipe and is fixedly connected to the heat sink base plate.

[0041] This embodiment is the first to use a substrate-heat pipe-laminated-heat pipe composite structure, which increases the thermal conductivity to 80W / m•K, a 300% improvement over traditional solutions.

[0042] To dissipate heat from the power components more quickly and increase the contact area between the power components and the heat dissipation module, a thermally conductive layer is provided between the contact interface. In this embodiment, the thermally conductive layer is made of graphite sheet material, achieving a minimum thermal conductivity of 1500 W / m•K. Existing thermally conductive layers typically use thermal grease; replacing it with graphite sheet material results in 250 times the heat transfer performance of high-performance thermal grease, transferring heat from the power components to the heat sink much faster and effectively doubling the heat dissipation efficiency.

[0043] In this embodiment, there are 34 heat dissipation fins with a spacing of 2mm, which is the optimal heat dissipation solution obtained from experimental analysis. Example

[0044] The difference from Example 1 is that there are 29 heat dissipation fins with a spacing of 2.5mm. This is a preferred solution that simulates long-term use in a real-world environment, is more resistant to sludge blockage, and maintains heat dissipation performance.

[0045] This embodiment presents a design method for a high-efficiency heat dissipation module for a high-power inverter. It adopts a closed-loop technical route of "theoretical analysis - simulation verification - prototype testing - model iteration," and develops the heat dissipation module through a four-stage progressive approach, thus building technical reserves for subsequent product development. The specific steps are as follows: 1. Theoretical Analysis: Heat pipe technology, with its significantly optimized thermal conductivity, has emerged. Its equivalent thermal conductivity can be tens to hundreds of times that of aluminum or copper, enabling rapid directional heat transfer, thus earning it the reputation of a highly efficient "heat transporter" in the industry. Heat pipe technology has undergone significant phased evolution, with its landmark achievement being the development from gravity heat pipes to anti-gravity heat pipes. This advancement has completely freed it from dependence on the direction of gravity, fundamentally improving installation direction and system layout, and significantly expanding its application boundaries.

[0046] Although heat pipes are highly efficient heat transfer media, they cannot directly dissipate heat. In practical applications, heat pipes need to be organically combined with traditional heat dissipation fins to form a composite heat dissipation module in order to achieve efficient transfer and dissipation of heat from the heat source.

[0047] Regarding the connection processes between heat pipes and substrates, and between heat pipes and fins, cold pressing, soldering, and vacuum brazing have become mature technologies widely used in the industry. From a theoretical thermal conductivity perspective, vacuum brazing outperforms soldering, and soldering outperforms cold pressing.

[0048] Based on the aforementioned fundamental research on heat dissipation technology, the project team took our company's products as the specific research object and explored optimizations of the original press-fit profile cold-pressed heat pipe radiators. The following three technical solutions were identified as the key directions for this research: (1) Material replacement scheme: Based on the traditional heat sink structure, the main material is replaced with copper instead of aluminum to improve the overall heat conduction efficiency.

[0049] (2) Process upgrade plan: The original heat pipe heat sink architecture is retained, and its core process is upgraded from cold pressing and filling to soldering, which aims to enhance the interface thermal conductivity between the heat pipe and the substrate.

[0050] (3) Architecture Restructuring Scheme: The original press-fit heat sink design is abandoned, and an integrated architecture is adopted in which the substrate and fins are connected by heat pipe soldering. In order to further improve the heat dissipation and diffusion efficiency of the IGBT heat source, the scheme also considers embedding heat pipes in the substrate.

[0051] 2. Numerical simulation modeling and optimization See appendix Figure 7 As shown, based on the product's 3D model and physical structure, this study uses Flotherm thermal simulation software to construct its system-level thermal model. The model mainly includes the following key components: external casing, cooling fan, system air duct, heat sink, IGBT power devices, and capacitor bank module.

[0052] The calculation conditions and results for the heat loss of power components in the model parameter settings are detailed in Table 1. The thermal interface material used is high-temperature, low-permeability thermal grease TC-5860, with a thermal conductivity of 6 W / (m·K) and a designed thickness of 0.12 mm. To optimize mesh generation and improve computational efficiency, this scheme, based on the actual application characteristics of this thermal grease (applied to the contact interface between the IGBT and the heat sink), treats it as an equivalent fixed thermal resistance value and directly assigns it to the contact interface between the IGBT and the heat sink.

[0053] Table 1. Calculation conditions and results for heat loss of power components

[0054] Based on the established fundamental research direction, the project team conducted systematic simulation analysis on solutions such as copper-based solder fins, press-fit solder heat pipe radiators, and stacked heat dissipation modules. This study focuses on a comparative analysis of copper-based solder fins (including solder-bonded aluminum teeth and copper-aluminum hybrid tooth structures) and stacked heat dissipation modules.

[0055] The materials selected for the substrate and fins can be arranged and combined in various ways. The substrate is made of aluminum or copper, and the fins are made of aluminum, copper, or a mixture of copper and aluminum. The combination of substrate and fins can be as follows:

[0056] Among them, the combination of copper substrate and all-copper fins in the sixth combination was not tested because the cost was too high and it did not meet the product expectations.

[0057] In the simulation of the stacked heat dissipation module, the impact of variables such as heat pipe size, fin thickness, fin spacing, and number of fins on heat dissipation performance was investigated. For ease of differentiation, the module naming follows the rule of "φ substrate heat pipe × φ fin heat pipe × n number of fins", where the fins are equally spaced, and different numbers of fins n represent different fin spacings. Detailed simulation comparison results for each scheme are summarized in Table 2. (Due to confidentiality requirements for some research data, the simulation results only show the table format and do not include actual test data.) Table 2. Simulation of IGBT-related temperatures under different heatsink installations

[0058] 3. Prototype manufacturing and experimental verification See appendix Figure 8 As shown, to verify the accuracy of the simulation results, the project team conducted experimental verification of the heat dissipation module.

[0059] After setting the test conditions, steady-state and related shock temperature tests were conducted in an aging chamber at an ambient temperature of 45°C. The final test results are shown in Table 3 (the table shows the highest temperature rise of the thyristor and diode during the test process).

[0060] Table 3. Actual measured junction temperatures of Fuji IGBT cases with different heat sinks (highest measured value).

[0061] Following review, the heat dissipation capacity improvement project was approved to adopt a stacked heat dissipation module solution. Regarding the specific model selection, considering factors such as cost structure and actual operating environment, the 12×10×29 specification was ultimately chosen. This decision was primarily based on the following considerations: While the 12×10×34 module offers slightly better heat dissipation performance, its denser fin spacing poses risks such as easy clogging and poor maintainability in industrial applications with high dust and oil content, resulting in relatively insufficient long-term operational stability and user-friendliness.

[0062] To analyze the heat transfer characteristics of the stacked heat sink module in depth, this study placed thermocouple temperature measurement points at key locations (see details below). Figure 8The system underwent several comparative tests, including temperature comparison of inner and outer fins at the same location, substrate temperature monitoring, and temperature difference analysis between the near and far ends of the same fin near the heat pipe. The experimental results are summarized in Table 5. The data shows that the temperature values ​​at measurement points 1, 2, and 3 are relatively close, indicating good temperature difference control. This result fully demonstrates that the stacked fin heat dissipation module significantly outperforms traditional heat sinks in terms of heat transfer efficiency and temperature uniformity at the far end of the fins. It also indicates that, given sufficient installation space, appropriately increasing the number of fins at equal intervals can effectively improve the overall heat dissipation capacity of the module.

[0063] Table 5 Temperature table of heat sink mounting points (°C) for stacked heat sink modules

[0064] 4. Model Iteration Based on experimental data, the thermal simulation model was modified to make the simulation data closer to the experimental data: considering that the working curve of the fan will be damaged in reality, the fan curve damage rate was set, and the fan curve was substituted into the simulation according to the damaged data; at the same time, the thermal grease on the back of the power components will also have a damage rate. After calculating the thermal grease data according to the damage rate and substituted into the data, the simulation data basically matches the experimental data.

[0065] This completes the entire process of innovative design for the heat dissipation module.

[0066] In this embodiment, the heat dissipation module processing technology is as follows: substrate cutting, machining heat pipe grooves on the substrate, filling with solder paste, pre-embedding heat pipes, pressing heat pipes, assembling heat dissipation fins, inserting heat pipes into the fins, fixing the fins and heat pipes to the back of the heat sink (filling with solder paste), filling the fins and heat pipes with solder paste, entering the oven for soldering, taking them out of the oven, letting them cool to room temperature, machining the surface, and finally cleaning them.

[0067] The foregoing description is merely an exemplary embodiment of this disclosure and should not be construed as limiting the scope of this disclosure. Any equivalent changes and modifications made in accordance with the teachings of this disclosure shall still fall within the scope of this disclosure. Those skilled in the art will readily conceive of other embodiments of this disclosure upon considering the specification and the disclosure of practical truth. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not described in this disclosure. The specification and embodiments are considered exemplary only, and the scope and spirit of this disclosure are defined by the claims.

Claims

1. A high-efficiency heat dissipation module for a high-power inverter, the heat dissipation module being used to adhere to power components to dissipate heat, characterized in that... It includes a heat sink substrate, substrate heat pipes, fin heat pipes, and fin assembly. The substrate heat pipes are pre-embedded on one side of the heat sink substrate where the power components are attached, and the fin heat pipes perpendicular to the substrate are welded to the other side of the heat sink substrate. The fin heat pipes are fixedly connected to the fin assembly.

2. The high-efficiency heat dissipation module for a high-power inverter frequency converter according to claim 1, characterized in that, The substrate has multiple heat pipes, which are evenly distributed on the surface of the heat sink according to the layout of the power components. The heat pipes are positioned directly below the heat-generating chip of the power components.

3. The high-efficiency heat dissipation module for a high-power inverter frequency converter according to claim 1, characterized in that, The finned heat pipes and the substrate heat pipes are positioned in a one-to-one correspondence.

4. The high-efficiency heat dissipation module for a high-power inverter frequency converter according to claim 1, characterized in that, The finned heat pipe is prefabricated in a U-shape. The bottom of the U-shape is embedded in a blind groove on the back of the heat sink substrate and welded and fixed. The two ends of the U-shape of the finned heat pipe are welded and fixed with fin assemblies.

5. A high-efficiency heat dissipation module for a high-power inverter frequency converter according to claim 1, characterized in that, The fin assembly consists of multiple layers of heat dissipation fins stacked together. All the multiple layers of heat dissipation fins are parallel to the surface of the substrate and are arranged along the length of the heat pipe.

6. A high-efficiency heat dissipation module for a high-power inverter frequency converter according to claim 5, characterized in that, The multi-layer heat dissipation fins consist of 34 pieces with a spacing of 2mm.

7. A high-efficiency heat dissipation module for a high-power inverter frequency converter according to claim 5, characterized in that, The multi-layer heat dissipation fins consist of 29 pieces with a spacing of 2.5mm.

8. A high-efficiency heat dissipation module for a high-power inverter frequency converter according to claim 1, characterized in that, A thermally conductive layer is provided between the contact surface of the power component and the heat dissipation module, and the thermally conductive layer is made of graphite sheet material.

9. A design method for a high-efficiency heat dissipation module for a high-power inverter frequency converter, characterized in that, Includes the following steps: Step 1: Analyze the heat dissipation module and its working environment based on the existing research object. The heat dissipation module includes a substrate, fins and heat pipes. Set initial parameters and alternative parameters for the substrate, fins and heat pipes of the heat dissipation module respectively, and establish the heat dissipation module parameters to be optimized. The parameters include: material, connection process, architecture and heat dissipation. Step 2: Establish a simulation model, set the parameters of the simulation model, including initial parameters and alternative parameters, set the calculation conditions, simulate the working state, and use alternative parameters to replace the initial parameters one by one to carry out simulation experiments and record the test values. Adjust the parameter combinations to establish a simulation model after the combination replacement, conduct simulation experiments, summarize and compare the test values, and select the optimized simulation model. Step 3: Prototype fabrication and experimental verification. Based on the selected optimized simulation model, a prototype is fabricated and tested under the same test conditions as the simulated working state to verify the accuracy of the simulation results. Step 4: Based on the experimental verification results of the prototype, modify the simulation model, set the fan curve and the heat conduction layer deterioration rate until the simulation data and experimental data match, and complete the design of the heat dissipation module.

10. The design method of a high-efficiency heat dissipation module for a high-power inverter frequency converter according to claim 9, characterized in that, In step 2, (1) The materials include substrate material and fin material. The substrate and fin are selected with initial parameters and replacement parameters respectively in various permutation and combination forms; Substrate material: Initial parameter is aluminum, replacement parameter is copper; Fin material: The initial parameter is aluminum, and the replacement parameter is copper or a mixture of copper and aluminum; (2) Connection process: The initial parameter is cold pressing and filling, and the alternative parameter is soldering or vacuum brazing; (3) Architecture: The initial parameter is that only the heat dissipation fins are fixed on the back of the substrate. The alternative parameters are: heat pipes connected to the back of the substrate, a composite heat dissipation module consisting of fin heat pipes and fin groups connected in series on the back of the substrate, and heat pipes pre-embedded on the front of the substrate. The number of heat pipes on the substrate, the number of fin heat pipes, and the number of fins in the fin group are set to multiple options.

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