Packaging structure and corresponding preparation method

Abstract

The invention relates to the field of semiconductor packaging, and provides a packaging structure and a corresponding preparation method. The stacking structure is positioned on the surface of the substrate; the plastic package body is positioned on the surface of the substrate and covers the stacking structure; wherein the stacked structure comprises stacked photosensitive chips and corresponding light-transmitting electric connecting plates, the photosensitive chips are optically connected with the light-transmitting electric connecting plates, and at least one side surface of each light-transmitting electric connecting plate is exposed out of the plastic package body; and the corresponding photosensitive chip senses external light through at least one side surface light of the light-transmitting electric connecting plate. Therefore, the problem of light transmission can be solved only by pasting one light-transmitting electric connecting plate, the process is simple, and the cost of the product is not increased.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and discloses a packaging structure and a corresponding preparation method. Background Technology

[0002] Currently, the packaging process for photosensitive chips generally requires the photosensitive chip to sense light from the front of the filter. However, this type of process requires a variety of special materials and equipment, has many limitations, and is costly. Summary of the Invention

[0003] The purpose of this invention is to solve the problem that the current packaging process for photosensitive chips to sense external light requires a variety of special materials and equipment, has many process limitations, and is costly. This invention provides a packaging structure and a corresponding preparation method. To achieve the above objectives, the present invention provides a packaging structure, comprising: substrate; A stacked structure located on the surface of the substrate; A molding compound located on the surface of the substrate and covering the stacked structure; The stacked structure includes stacked photosensitive chips and corresponding phototransparent photoconnection plates. The photosensitive chips and the phototransparent photoconnection plates are optically connected, and at least one side of the phototransparent photoconnection plate is exposed to the encapsulation, so that the corresponding photosensitive chip senses external light through at least one side of the phototransparent photoconnection plate.

[0004] As one possible implementation, the photoelectric connecting plate is a glass carrier plate.

[0005] As one possible implementation, the stacked structure is at least one, and each stacked structure includes a phototransparent photoconnection plate and at least one corresponding photosensitive chip.

[0006] As one possible implementation, when the stacked structure includes at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

[0007] In one possible implementation, the photosensitive chip has a photosensitive area and a pad area, and the photosensitive chip pad area is connected to the phototransparent photoelectric connection plate through a first conductive bump.

[0008] As one possible implementation, the first conductive bump between the photosensitive chip pad area and the corresponding phototransparent photoconnector has an underfill adhesive.

[0009] As one possible implementation, a sealed cavity is provided between the photosensitive area of ​​the photosensitive chip and the phototransparent photoelectric connecting plate.

[0010] As one possible implementation, the phototransparent connecting plate has a baffle wall on the side surface facing the photosensitive chip, and the baffle wall forms a sealed cavity between the photosensitive chip and the corresponding phototransparent connecting plate.

[0011] As one possible implementation, the retaining wall is made of an adhesive.

[0012] As one possible implementation, the adhesive is glue.

[0013] In one possible implementation, the phototransparent photoconnector is located on the surface of the substrate, and the photosensitive chip is located on the corresponding surface of the phototransparent photoconnector. The photosensitive chip is electrically connected to the substrate through the phototransparent photoconnector.

[0014] In one possible implementation, the photoelectric connecting plate is electrically connected to the substrate via a second conductive bump.

[0015] In one possible implementation, the photosensitive chip is located on the surface of the substrate, the phototransparent photoelectric connection plate is located on the surface of the photosensitive chip, and the photosensitive chip is electrically connected to the substrate through the phototransparent photoelectric connection plate.

[0016] Accordingly, the present invention also provides a method for preparing a packaging structure, comprising: Provide substrate; A first stacked structure is disposed on the surface of the substrate, wherein the first stacked structure includes stacked photosensitive chips and corresponding phototransparent photoconnection plates, and the photosensitive chips and the phototransparent photoconnection plates are optically connected. The first stacked structure on the surface of the substrate is encapsulated with a molding compound to obtain a molded body, thereby obtaining a package containing the substrate, the first stacked structure and the molded body; The package is cut to obtain a single package structure comprising a substrate, a second stacked structure located on the surface of the substrate, and a plastic encapsulation covering the second stacked structure. The second stacked structure includes stacked photosensitive chips and corresponding phototransparent interconnects, and at least one side of the phototransparent interconnects is exposed to the plastic encapsulation, so that the corresponding photosensitive chip senses external light through at least one side of the phototransparent interconnects.

[0017] As one possible implementation, the photoelectric connecting plate is a glass carrier plate.

[0018] As one possible implementation, the step of disposing of the first stacked structure on the surface of the substrate includes: A phototransparent photoconnector is disposed on the surface of the substrate, and a photosensitive chip is disposed on the corresponding surface of the phototransparent photoconnector, wherein the photosensitive chip is electrically connected to the substrate through the phototransparent photoconnector.

[0019] As one possible implementation, the step of disposing of the first stacked structure on the surface of the substrate includes: A photosensitive chip is disposed on the surface of the substrate, and a phototransmitting photoelectric connecting plate is disposed on the corresponding photosensitive chip surface.

[0020] In one possible implementation, the photosensitive chip has a photosensitive area and a pad area, and the photosensitive chip pad area is connected to the phototransparent photoelectric connection plate through a first conductive bump.

[0021] As one possible implementation, after the step of disposing the phototransparent photoconnector on the surface of the corresponding photosensitive chip or disposing the photosensitive chip on the surface of the corresponding phototransparent photoconnector, the method further includes: A barrier is formed on the side surface of the phototransparent photoelectric connecting plate facing the photosensitive chip, so that there is a sealed cavity between the photosensitive chip and the corresponding phototransparent photoelectric connecting plate.

[0022] As one possible implementation, the retaining wall is made of an adhesive.

[0023] As one possible implementation, the adhesive is glue.

[0024] As one possible implementation, after the step of disposing the phototransparent photoconnector on the surface of the corresponding photosensitive chip or disposing the photosensitive chip on the surface of the corresponding phototransparent photoconnector, the following method is further included: A bottom filler is applied around the first conductive bump between the phototransparent photoelectric connection plate and the photosensitive chip pad area.

[0025] In one possible implementation, the photoelectric connecting plate is connected to the substrate via a second conductive bump.

[0026] As one possible implementation, there is at least one first stacked structure, and each first stacked structure includes a phototransparent photoconnection plate and at least one corresponding photosensitive chip.

[0027] As one possible implementation, when each phototransparent connecting plate in the first stacked structure corresponds to at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

[0028] As one possible implementation, cutting the package includes cutting the photoelectric connecting plate of the first stacked structure.

[0029] As one possible implementation, there is at least one second stacked structure, and each second stacked structure includes a phototransparent photoconnection plate and at least one corresponding photosensitive chip.

[0030] As one possible implementation, when the second stacked structure includes at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

[0031] The beneficial effects of this invention are: This invention provides a packaging structure and a corresponding fabrication method, comprising: a substrate; a stacked structure located on the surface of the substrate; and a molding compound located on the surface of the substrate and covering the stacked structure; wherein the stacked structure includes stacked photosensitive chips and corresponding phototransparent photoconnectors, the photosensitive chips and the phototransparent photoconnectors are optically connected, and at least one side of the phototransparent photoconnector is exposed to the molding compound, allowing the corresponding photosensitive chip to sense external light through the side light of the phototransparent photoconnector. This solves the light transmission problem by requiring only one phototransparent photoconnector, maintaining product thickness without increasing product cost. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of an encapsulation structure provided in some embodiments of the present invention, wherein the number of light-transmitting plates is one and there is a sealed cavity between the photosensitive chip and the light-transmitting photoelectric connection plate; Figure 2 This is a schematic diagram of an encapsulation structure provided in some embodiments of the present invention, which has two light-transmitting plates and a sealed cavity between the photosensitive chip and the light-transmitting photoelectric connection plate. Figure 3 This is a schematic diagram of an encapsulation structure provided in some embodiments of the present invention, wherein the number of light-transmitting plates is one and an adhesive film is provided between the light-transmitting photoelectric connecting plate and the photosensitive chip; Figures 4-10 This is a schematic diagram illustrating the fabrication process of the packaging structure provided in some embodiments of the present invention; Figure 11 This is a schematic diagram illustrating the fabrication process of the packaging structure provided in some embodiments of the present invention. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] It should be understood that terms such as “first” and “second” used herein to describe various elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. For example, the use of terms such as “first” and “second” herein does not imply order or sequence unless the context clearly indicates otherwise. For ease of description, spatially relative terms such as “upper” and “lower” may be used herein to describe the relationship of one element or feature to other elements or features as shown in the accompanying drawings. It should be understood that spatially relative terms are intended to include not only the orientations shown in the accompanying drawings but also different orientations of the device in use or operation.

[0035] In this application, unless otherwise expressly specified and limited, the terms "connected" and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples. It should be noted that the terms "comprising" and "having," and their variations, used in this application are intended to cover non-exclusive inclusion.

[0037] See Figure 1Some embodiments of the present invention provide a packaging structure, including: a substrate 10; a stacked structure located on the surface of the substrate 10; and a molding compound 40 located on the surface of the substrate 10 and covering the stacked structure; wherein the stacked structure includes stacked photosensitive chips 30 and corresponding phototransparent photoconnection plates 20, the photosensitive chips 30 and the phototransparent photoconnection plates 20 are optically connected, and at least one side of the phototransparent photoconnection plate 20 is exposed to the molding compound, such that the corresponding photosensitive chip 30 senses external light through at least one side of the phototransparent photoconnection plate 20. Specifically, as shown... Figure 1 As shown, external light can reach the photosensitive chip 30 through the propagation path indicated by the arrow.

[0038] In some embodiments, the substrate 10 may be specifically selected as a silicon substrate, which is widely used due to its mature manufacturing process and good electrical properties; or a silicon carbide substrate, which exhibits unique advantages in certain applications due to its high heat resistance, high conductivity, and excellent chemical stability; or a sapphire substrate, whose excellent hardness and light transmittance make it an ideal choice for applications requiring high transparency and wear resistance. The substrate 10 may also be a semiconductor structure substrate with one or more chip packaging structures. Of course, any other suitable substrate material can be selected according to actual needs to meet the specific requirements of different application scenarios.

[0039] In some embodiments, the photosensitive chip 30 can be a charge-coupled device (CCD), an integrated circuit that converts light into electrical charge and outputs these charges as electrical signals in an orderly manner through a series of complex transfer processes. Due to its high sensitivity and low noise characteristics, it plays an important role in high-end imaging equipment. Another type can be a complementary metal-oxide-semiconductor (CMOS) sensor, which integrates photodiodes, amplifiers, and analog-to-digital converters on the same chip, directly realizing the conversion of light signals to digital signals. Due to its low power consumption, high integration, and cost-effectiveness, it is widely used in various digital imaging devices, such as digital cameras and camcorders. Its main function is to convert light into electrical charge, and then generate digital signals for use in digital imaging devices such as digital cameras and camcorders. These chips capture light using highly sensitive semiconductor materials, convert the light signals into electrical signals, and then convert the electrical signals into digital signals through an analog-to-digital converter for easy storage and processing. The digital signals can then be transmitted to a computer for further image processing and analysis.

[0040] In some embodiments, the optical connection between the photosensitive chip 30 and the phototransparent photoelectric connection plate 20 means that light can be transmitted between the photosensitive chip 30 and the phototransparent photoelectric connection plate 20, thereby enabling the photosensitive chip 30 to sense external light through the side of the phototransparent photoelectric connection plate 20.

[0041] In some embodiments, the phototransparent photoelectric connection plate 20 can be a glass substrate. A glass substrate has good light transmittance, ensuring low light loss during transmission and making signal transmission more stable and reliable. Alternatively, it can be any other phototransparent photoelectric connection plate that allows the photosensitive chip 30 to sense external light, ensuring the imaging device can function normally and capture clear and accurate image information.

[0042] In some embodiments, see Figure 1 The photosensitive area of ​​the photosensitive chip 30 is located on the back side of the photosensitive chip 30, that is, the phototransparent photoelectric connecting plate 20 is located on the surface of the substrate 10, and the corresponding photosensitive chip 30 is located on the surface of the phototransparent photoelectric connecting plate 20. The back side of the photosensitive chip 30 senses external light through the side of the phototransparent photoelectric connecting plate 20.

[0043] In some embodiments, when the phototransparent photoconnector 20 is located on the surface of the substrate 10, and the photosensitive chip 30 is located on the corresponding surface of the phototransparent photoconnector 20, the photosensitive chip 30 has a photosensitive area and a pad area. The pad area of ​​the photosensitive chip 30 is connected to the phototransparent photoconnector 20 via a first conductive bump 80, and the phototransparent photoconnector 20 is electrically connected to the substrate 10 via a second conductive bump 90. In some embodiments, the material of the first conductive bump 80 is a metal, which may be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver. The material of the second conductive bump 90 is a metal, which may be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver.

[0044] In some embodiments, the photosensitive area of ​​the photosensitive chip 30 is located on the front side of the photosensitive chip 30, that is, the photosensitive chip 30 is located on the surface of the substrate 10, and the corresponding phototransparent photoelectric connection plate 20 is located on the surface of the photosensitive chip 30. The front side of the photosensitive chip 30 senses external light through the side of the phototransparent photoelectric connection plate 20.

[0045] In some embodiments, when the photosensitive chip 30 is located on the surface of the substrate 10, the corresponding light-transmitting photoelectric connection plate 20 is located on the surface of the photosensitive chip 30. The photosensitive chip 30 is electrically connected to the light-transmitting photoelectric connection plate 20 via a first conductive bump, and the light-transmitting transition plate 20 is electrically connected to the substrate 10 via a second conductive bump. In some embodiments, the first conductive bump is located on the surface of the pad area of ​​the photosensitive chip 30. By sequentially connecting the pads of the photosensitive chip 30 to the first conductive bump and the light-transmitting photoelectric connection plate 20, and the light-transmitting transition plate 20 being electrically connected to the substrate 10 via the second conductive bump, the photosensitive chip 30 and the substrate 10 are electrically connected. In some embodiments, the material of the pads is metal, which may be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver.

[0046] In some embodiments, the stacked structure is at least one, and each stacked structure includes a phototransparent photoconnector 20 and a corresponding at least one photosensitive chip 30. That is, each phototransparent photoconnector 20 and the corresponding at least one photosensitive chip 30 are connected. In some embodiments, when at least two photosensitive chips are provided on the side surface of each phototransparent photoconnector facing the photosensitive chip, the at least two photosensitive chips are arranged side by side. In some embodiments, when the stacked structure includes at least two photosensitive chips 30, the at least two photosensitive chips 30 are arranged side by side. See, for example, [link to relevant documentation]. Figure 1 The stacked structure is singular, meaning that the number of both the photosensitive chip 30 and the phototransparent photoelectric connection plate 20 is one, and one photosensitive chip 30 corresponds to one phototransparent photoelectric connection plate 20. See, for example... Figure 2 The stacked structure consists of two components, namely, two photosensitive chips 30 and two phototransparent photoelectric connecting plates 20, with each phototransparent photoelectric connecting plate 20 corresponding to one photosensitive chip 30.

[0047] In some embodiments, both the photosensitive chip 30 and the phototransparent photoconnector 20 are cubic in shape. In some embodiments, a first side 21 of the phototransparent photoconnector is exposed to the side of the encapsulation 40. In other embodiments, the phototransparent photoconnector may have multiple sides exposed to the encapsulation 40, thereby allowing the photosensitive chip to receive more external light.

[0048] In some embodiments, see Figure 1 A sealed cavity 60 is provided between the photosensitive area of ​​the photosensitive chip 30 and the phototransmitting photoelectric connecting plate 20, allowing the phototransmitting photoelectric connecting plate 20 to transmit external light to the photosensitive chip 30 through the sealed cavity 60. In some embodiments, see... Figure 1The phototransparent connecting plate 20 has a baffle 50 on the side facing the photosensitive chip 30. The baffle 50 is also located on the bottom outer side of the photosensitive chip 30, forming a sealed cavity between the photosensitive chip 30 and the corresponding phototransparent connecting plate 20. The baffle 50 prevents the molding compound from overflowing into the gap between the photosensitive chip 30 and the corresponding phototransparent connecting plate 20 during the subsequent molding process, thus ensuring the photosensitive effect of the photosensitive chip.

[0049] In some specific embodiments, the retaining wall 50 is designed to have a certain height, which is determined according to the actual application scenario to ensure that it can effectively perform functions such as blocking, supporting, or separating. Regarding the material of the retaining wall 50, an adhesive is used in this embodiment. This choice is based on the excellent bonding performance and plasticity of the adhesive, which allows the retaining wall 50 to adhere firmly to the required location while maintaining the stability and durability of the structure.

[0050] Furthermore, the adhesive is not limited to a specific type, but can be flexibly selected according to actual usage conditions and performance requirements. In some embodiments, the adhesive is a common glue, which is easy to use, cures quickly, and has high bonding strength, making it suitable for bonding various materials. In other embodiments, other types of adhesives can be selected, such as adhesives with special weather resistance, high temperature resistance, or chemical corrosion resistance, to meet the usage requirements in specific environments. In summary, the material selection of the retaining wall 50 fully considers various factors in practical applications to ensure that its performance reaches its optimal state.

[0051] In some embodiments, see Figure 3 The first conductive bump 80 between the pad area of ​​the photosensitive chip 30 and the corresponding phototransparent photoconnector 20 is surrounded by a bottom filler 70, and the bottom filler 70 is arranged around the photosensitive area of ​​the photosensitive chip 30 so that the molding compound in the subsequent molding process will not overflow into the gap between the photosensitive area of ​​the photosensitive chip 30 and the corresponding phototransparent photoconnector 20, thus ensuring the photosensitive effect of the photosensitive chip.

[0052] In some embodiments, the material of the molding compound 40 may be epoxy resin, polyimide resin, benzocyclobutene resin or polybenzoxazole resin, and the forming process may be injection molding or transfer molding.

[0053] In some embodiments, a method for preparing a packaging structure is also provided, such as... Figure 11 As shown, it includes: Step S10: Provide a substrate; Step S20: A first stacked structure is disposed on the surface of the substrate, wherein the first stacked structure includes stacked photosensitive chips and corresponding phototransparent photoconnection plates, and the photosensitive chips and the phototransparent photoconnection plates are optically connected. Step S30: Use molding compound to mold the first stacked structure on the surface of the substrate to obtain a molded body, thereby obtaining a package containing the substrate, the first stacked structure and the molded body; Step S40: The package is cut to obtain a single package structure including a substrate, a second stacked structure located on the surface of the substrate, and a plastic encapsulation covering the second stacked structure. The second stacked structure includes stacked photosensitive chips and corresponding phototransparent photoconnection plates, and at least one side of the phototransparent photoconnection plate is exposed to the plastic encapsulation, so that the corresponding photosensitive chip senses external light through at least one side of the phototransparent photoconnection plate.

[0054] For details, see Figure 4 A substrate 10 is provided.

[0055] In some embodiments, the substrate 10 may be specifically selected as a silicon substrate, which is widely used due to its mature manufacturing process and good electrical properties; or a silicon carbide substrate, which exhibits unique advantages in certain applications due to its high heat resistance, high conductivity, and excellent chemical stability; or a sapphire substrate, whose excellent hardness and light transmittance make it an ideal choice for applications requiring high transparency and wear resistance. Of course, any other suitable substrate material may be selected according to actual needs to meet the specific requirements of different application scenarios.

[0056] See Figure 5 and Figure 6 A first stacked structure is disposed on the surface of the substrate 10, wherein the first stacked structure includes a stacked photosensitive chip 30 and a corresponding phototransparent photoelectric connection plate 20, and the photosensitive chip and the phototransparent photoelectric connection plate are optically connected.

[0057] In some embodiments, the photosensitive chip 30 can be a charge-coupled device (CCD), an integrated circuit that converts light into electrical charge and outputs these charges as electrical signals in an orderly manner through a series of complex transfer processes. Due to its high sensitivity and low noise characteristics, it plays an important role in high-end imaging equipment. Another type can be a complementary metal-oxide-semiconductor (CMOS) sensor, which integrates photodiodes, amplifiers, and analog-to-digital converters on the same chip, directly realizing the conversion of light signals to digital signals. Due to its low power consumption, high integration, and cost-effectiveness, it is widely used in various digital imaging devices, such as digital cameras and camcorders. Its main function is to convert light into electrical charge, and then generate digital signals for use in digital imaging devices such as digital cameras and camcorders. These chips capture light using highly sensitive semiconductor materials, convert the light signals into electrical signals, and then convert the electrical signals into digital signals through an analog-to-digital converter for easy storage and processing. The digital signals can then be transmitted to a computer for further image processing and analysis.

[0058] In some embodiments, the optical connection between the photosensitive chip 30 and the phototransparent photoelectric connection plate 20 means that light can be transmitted between the photosensitive chip 30 and the phototransparent photoelectric connection plate 20, thereby enabling the photosensitive chip 30 to sense external light through the side of the phototransparent photoelectric connection plate 20.

[0059] In some embodiments, the phototransparent photoelectric connection plate 20 can be a glass substrate. A glass substrate has good light transmittance, ensuring low light loss during transmission and making signal transmission more stable and reliable. Alternatively, it can be any other phototransparent photoelectric connection plate that allows the photosensitive chip 30 to sense external light, ensuring the imaging device can function normally and capture clear and accurate image information.

[0060] In some embodiments, the step of disposing the first stacked structure on the surface of the substrate 10 includes: see Figure 5 A photoelectric connecting plate 20 is disposed on the surface of the substrate 10, see [reference]. Figure 6 The photosensitive chip 30 is disposed on the surface of the corresponding phototransparent photoelectric connection plate 20. This ensures that the photosensitive area of ​​the photosensitive chip 30 is located on the back side of the photosensitive chip 30, i.e., see [link to documentation]. Figure 1 The phototransparent photoelectric connecting plate 20 is located on the surface of the substrate 10, and the corresponding photosensitive chip 30 is located on the surface of the phototransparent photoelectric connecting plate 20. The back of the photosensitive chip 30 senses external light through the side of the phototransparent photoelectric connecting plate 20.

[0061] In some embodiments, when the phototransparent photoconnector 20 is located on the surface of the substrate 10, the corresponding photosensitive chip 30 is located on the surface of the phototransparent photoconnector 20. The photosensitive chip 30 is connected to the phototransparent photoconnector 20 via a first conductive bump 80, and the phototransparent photoconnector 20 and the substrate 10 are connected via a second conductive bump 90. In some embodiments, the material of the first conductive bump 80 is a metal, which may be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver. The material of the second conductive bump 90 is a metal, which may be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver.

[0062] In some embodiments, the step of disposing of the first stacked structure on the surface of the substrate 10 includes: disposing of a photosensitive chip 30 on the surface of the substrate 10, and disposing of a phototransparent photoconnector 20 on the corresponding surface of the photosensitive chip 30. At this time, the photosensitive area of ​​the photosensitive chip 30 is located on the front side of the photosensitive chip 30, the photosensitive chip 30 is located on the surface of the substrate 10, and the corresponding phototransparent photoconnector 20 is located on the surface of the photosensitive chip 30. The front side of the photosensitive chip 30 senses external light through the side of the phototransparent photoconnector 20.

[0063] In some embodiments, when the photosensitive chip 30 is located on the surface of the substrate 10, the corresponding light-transmitting photoelectric connection plate 20 is located on the surface of the photosensitive chip 30. The photosensitive chip 30 is electrically connected to the light-transmitting photoelectric connection plate 20 through a first conductive bump 80, and the light-transmitting adapter plate 20 is electrically connected to the substrate 10 through a second conductive bump 90.

[0064] In some embodiments, after the step of disposing the phototransparent photoconnector 20 on the surface of the corresponding photosensitive chip 30 or disposing the photosensitive chip 30 on the surface of the corresponding phototransparent photoconnector 20, the method further includes: See Figure 7 A baffle 50 is formed on the surface of the phototransparent photoconnector 20 facing the photosensitive chip 30, creating a sealed cavity 60 between the photosensitive chip 30 and the corresponding phototransparent photoconnector 20. The baffle 50 prevents the molding compound from overflowing into the gap between the photosensitive chip 30 and the corresponding phototransparent photoconnector 20 during the subsequent molding process, thus ensuring the photosensitive effect of the photosensitive chip.

[0065] In some specific embodiments, the retaining wall 50 is designed to have a certain height, which is determined according to the actual application scenario to ensure that it can effectively perform functions such as blocking, supporting, or separating. Regarding the material of the retaining wall 50, an adhesive is used in this embodiment. This choice is based on the excellent bonding performance and plasticity of the adhesive, which allows the retaining wall 50 to adhere firmly to the required location while maintaining the stability and durability of the structure.

[0066] In some embodiments and instances, after the step of disposing the phototransparent photoconnector 20 on the surface of the corresponding photosensitive chip 30 or disposing the photosensitive chip 30 on the surface of the corresponding phototransparent photoconnector 20, the method further includes: See Figure 8 An underfill adhesive 70 is filled around the first conductive bump 80 between the phototransparent photoconnector 20 and the pad area of ​​the photosensitive chip 30. The underfill adhesive 70 is disposed around the photosensitive area of ​​the photosensitive chip 30. This prevents the molding compound during the subsequent molding process from overflowing into the gap between the photosensitive area of ​​the photosensitive chip 30 and the corresponding phototransparent photoconnector 20, thus ensuring the photosensitive effect of the photosensitive chip.

[0067] In some embodiments, the first stacked structure is at least one, and each first stacked structure includes a phototransparent photoconnector 20 and a corresponding at least one photosensitive chip 30. In some embodiments, when each phototransparent photoconnector 20 in the first stacked structure corresponds to at least two photosensitive chips 30, the at least two photosensitive chips 30 are arranged side by side, that is, each phototransparent photoconnector 20 is connected to the corresponding at least one photosensitive chip 30. See, for example. Figure 6 Each phototransparent connecting plate 20 is connected to two corresponding photosensitive chips 30, and the two photosensitive chips 30 are located on the edge portions of opposite sides of the surface of the corresponding phototransparent connecting plate 20.

[0068] See Figure 9 A molding compound is used to mold the stacked structure on the surface of the substrate 10 to obtain a molding compound 40, thereby obtaining a package containing the substrate 10, the first stacked structure and the molding compound 40.

[0069] In some embodiments, the material of the molding compound 40 may be epoxy resin, polyimide resin, benzocyclobutene resin or polybenzoxazole resin, and the forming process may be injection molding or transfer molding.

[0070] See Figure 10 The package is cut to obtain a single package structure comprising a substrate 10, a second stacked structure located on the surface of the substrate 10, and a plastic encapsulator 40 located on the surface of the substrate 10 and covering the second stacked structure. The second stacked structure includes stacked photosensitive chips 30 and corresponding phototransparent photoconnectors 20, and at least one side of the phototransparent photoconnector 20 is exposed to the plastic encapsulator 40, so that the corresponding photosensitive chip 30 senses external light through the side light of the phototransparent photoconnector 20.

[0071] In some embodiments, the second stacked structure is obtained by cutting the first stacked structure. In some embodiments, cutting the package includes cutting the phototransparent connecting plate 20 of the first stacked structure. Further, when the first stacked structure includes two photosensitive chips 30, cutting the package includes cutting the phototransparent connecting plate 20 between the two photosensitive chips 30 in the first stacked structure. Specifically, during the process of placing the first stacked structure on the surface of the substrate 10, for example, see... Figure 8 Each phototransparent photoconnector plate 20 corresponds to two photosensitive chips 30, and the two photosensitive chips 30 are located on the edge portions of opposite sides of the surface of the corresponding phototransparent photoconnector plate 20. The cutting line can be the line of symmetry between the two photosensitive chips 30 corresponding to each phototransparent photoconnector plate 20.

[0072] In some embodiments, both the photosensitive chip 30 and the phototransparent photoconnector 20 are cubic in shape. In some embodiments, a first side 21 of the phototransparent photoconnector is exposed to the side of the encapsulation 40. In other embodiments, the phototransparent photoconnector may have multiple sides exposed to the encapsulation 40, thereby allowing the photosensitive chip 30 to receive more external light.

[0073] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. A packaging structure, characterized in that, include: substrate; A stacked structure located on the surface of the substrate; A molding compound located on the surface of the substrate and covering the stacked structure; The stacked structure includes stacked photosensitive chips and corresponding phototransparent photoconnectors. The photosensitive chips and the phototransparent photoconnectors are optically connected, and at least one side of the phototransparent photoconnector is exposed to the encapsulation, so that the corresponding photosensitive chip senses external light through at least one side of the phototransparent photoconnector.

2. The packaging structure according to claim 1, characterized in that, The photoelectric connecting plate is a glass carrier plate.

3. The packaging structure according to claim 1, characterized in that, The stacked structure is at least one, and each stacked structure includes a phototransparent connecting plate and at least one corresponding photosensitive chip.

4. The packaging structure according to claim 1, characterized in that, When the stacked structure includes at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

5. The packaging structure according to claim 1, characterized in that, The photosensitive chip has a photosensitive area and a pad area, and the pad area of ​​the photosensitive chip is connected to the phototransparent photoelectric connection plate through a first conductive bump.

6. The packaging structure according to claim 5, characterized in that, The first conductive bump between the photosensitive chip and the corresponding phototransparent connecting plate has a bottom filler adhesive around it, and the bottom filler adhesive is arranged around the photosensitive area of ​​the photosensitive chip.

7. The packaging structure according to claim 5, characterized in that, There is a sealed cavity between the photosensitive area of ​​the photosensitive chip and the phototransparent photoelectric connecting plate.

8. The packaging structure according to claim 7, characterized in that, The phototransparent connecting plate has a baffle wall on the side of the photosensitive chip facing the photosensitive chip, and the baffle wall forms a sealed cavity between the photosensitive chip and the corresponding phototransparent connecting plate.

9. The packaging structure according to claim 8, characterized in that, The retaining wall is made of adhesive.

10. The packaging structure according to claim 1, characterized in that, The phototransparent photoconnector is located on the surface of the substrate, and the photosensitive chip is located on the corresponding surface of the phototransparent photoconnector. The photosensitive chip is electrically connected to the substrate through the phototransparent photoconnector.

11. The packaging structure according to claim 10, characterized in that, The photoelectric connecting plate is electrically connected to the substrate through a second conductive bump.

12. The packaging structure according to claim 1, characterized in that, The photosensitive chip is located on the surface of the substrate, and the phototransparent photoelectric connection plate is located on the surface of the photosensitive chip. The photosensitive chip is electrically connected to the substrate through the phototransparent photoelectric connection plate.

13. A method for preparing a packaging structure, characterized in that, include: Provide substrate; A first stacked structure is disposed on the surface of the substrate, wherein the first stacked structure includes stacked photosensitive chips and corresponding phototransparent photoconnection plates, and the photosensitive chips and the phototransparent photoconnection plates are optically connected. The first stacked structure on the surface of the substrate is encapsulated with a molding compound to obtain a molded body, thereby obtaining a package containing the substrate, the first stacked structure and the molded body; The package is cut to obtain a single package structure comprising a substrate, a second stacked structure located on the surface of the substrate, and a plastic encapsulation covering the second stacked structure. The second stacked structure includes stacked photosensitive chips and corresponding phototransparent interconnects, and at least one side of the phototransparent interconnects is exposed to the plastic encapsulation, so that the corresponding photosensitive chip senses external light through at least one side of the phototransparent interconnects.

14. The method for preparing the packaging structure according to claim 13, characterized in that, The photoelectric connecting plate is a glass carrier plate.

15. The method for preparing the packaging structure according to claim 13, characterized in that, The step of disposing the first stacked structure on the surface of the substrate includes: A phototransparent photoconnector is disposed on the surface of the substrate, and a photosensitive chip is disposed on the corresponding surface of the phototransparent photoconnector, wherein the photosensitive chip is electrically connected to the substrate through the phototransparent photoconnector.

16. The method for preparing the packaging structure according to claim 13, characterized in that, The step of disposing the first stacked structure on the surface of the substrate includes: A photosensitive chip is disposed on the surface of the substrate, and a phototransparent photoconnector is disposed on the surface of the corresponding photosensitive chip, wherein the photosensitive chip is electrically connected to the substrate through the phototransparent photoconnector.

17. The method for preparing the packaging structure according to claim 15 or 16, characterized in that, The photosensitive chip has a photosensitive area and a pad area, and the pad area of ​​the photosensitive chip is connected to the phototransparent photoelectric connection plate through a first conductive bump.

18. The method for preparing the packaging structure according to claim 17, characterized in that, The step of placing the phototransparent photoconnector on the surface of the corresponding photosensitive chip or placing the photosensitive chip on the surface of the corresponding phototransparent photoconnector also includes: A barrier is formed on the side of the phototransparent photoelectric connecting plate facing the photosensitive chip, thereby forming a sealed cavity between the photosensitive chip and the corresponding phototransparent photoelectric connecting plate.

19. The method for preparing the packaging structure according to claim 18, characterized in that, The retaining wall is made of adhesive.

20. The method for preparing the packaging structure according to claim 17, characterized in that, The step following the step of placing the phototransparent connecting plate on the surface of the corresponding photosensitive chip or placing the photosensitive chip on the surface of the corresponding phototransparent connecting plate also includes: An underfill adhesive is filled around the first conductive bump between the photosensitive chip pad area and the corresponding phototransparent connecting plate, and the underfill adhesive is disposed around the photosensitive area of ​​the photosensitive chip.

21. The method for preparing the packaging structure according to claim 15 or 16, characterized in that, The photoelectric connecting plate is connected to the substrate via a second conductive bump.

22. The method for preparing the packaging structure according to claim 13, characterized in that, The first stacked structure is at least one, and each first stacked structure includes a phototransparent photoconnection plate and at least one corresponding photosensitive chip.

23. The method for preparing the packaging structure according to claim 22, characterized in that, When each phototransparent connecting plate in the first stacked structure corresponds to at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

24. The method for preparing the packaging structure according to claim 13, characterized in that, Cutting the package includes cutting the photoelectric connecting plate of the first stacked structure.

25. The method for preparing the packaging structure according to claim 13, characterized in that, The second stacked structure is at least one, and each second stacked structure includes a phototransparent photoconnection plate and at least one corresponding photosensitive chip.

26. The method for preparing the packaging structure according to claim 25, characterized in that, When the second stacked structure includes at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

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