Processing apparatus, adjustment method, and article manufacturing method

Abstract

The invention provides a processing apparatus, an adjustment method, and an article manufacturing method. A processing device disposed in a predetermined environment is provided with: a processing chamber for processing a member; a blower; a first flow path through which gas is conveyed from the blower to the processing chamber; a second flow path for returning the gas from the processing chamber to the blower; a pressure gauge for detecting the pressure difference between the pressure of the second flow path and the pressure of the predetermined environment; and an adjustment unit that performs adjustment to maintain the pressure difference at a positive value.

Description

Processing apparatus, adjustment method, and article manufacturing method Technical Field

[0001] This disclosure relates to processing apparatus, adjustment methods, and article manufacturing methods. Background Technology

[0002] Patent Document 1 describes a chamber device comprising a chamber and a mechanical chamber. Dry air is supplied to the chamber via a supply pipe, and the ambient air within the chamber is introduced into the mechanical chamber via an exhaust pipe. The ambient air discharged into the mechanical chamber via the exhaust pipe is discharged from the mechanical chamber through an air conditioning damper and an exhaust fan. A pressure sensor is installed within the chamber, and a controller controls the air conditioning damper and exhaust fan on the exhaust side to maintain the pressure within the chamber, as detected by the pressure sensor, at a positive pressure.

[0003] In the chamber device described in Patent Document 1, the pressure inside the chamber is maintained at a positive pressure as described above. In such a device, when air is circulated in a circulation path including the chamber, a region with negative pressure relative to the external space is formed downstream of the exhaust pipe. In this case, there is a possibility that air may intrude into the circulation system from the external space.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent No. 4407164 Summary of the Invention

[0007] This disclosure provides a technique that facilitates maintaining positive pressure relative to external space throughout the entire region of the circulation path.

[0008] The first aspect of this disclosure relates to a processing apparatus disposed in a specified environment, characterized in that the processing apparatus comprises: a processing chamber for processing a component; a blower; a first flow path for conveying gas from the blower to the processing chamber; a second flow path for returning gas from the processing chamber to the blower; a pressure gauge for detecting the pressure difference between the pressure of the second flow path and the pressure of the specified environment; and an adjustment unit for adjusting to maintain the pressure difference as a positive value.

[0009] The second aspect of this disclosure relates to an adjustment method for adjusting a processing apparatus disposed in a specified environment. The processing apparatus includes: a processing chamber for processing components; a blower; a first flow path for conveying gas from the blower to the processing chamber; and a second flow path for returning gas from the processing chamber to the blower. The adjustment method is characterized by comprising: a detection step for detecting the pressure difference between the pressure of the second flow path and the pressure of the specified environment; and an adjustment step for performing an adjustment to maintain the pressure difference as positive.

[0010] The third aspect of this disclosure relates to a method for manufacturing an article, characterized in that the method includes: a first processing step of processing a component using the processing apparatus described in the first aspect; and a second processing step of further processing the component that has undergone the first processing step to obtain an article. Attached Figure Description

[0011] Figure 1 is a diagram showing an example of the configuration of the main body of the processing device.

[0012] Figure 2 is a diagram showing an example of the configuration of the processing apparatus according to the first embodiment.

[0013] Figure 3 is a diagram showing an example of the configuration of the processing apparatus according to the second embodiment. Detailed Implementation

[0014] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Furthermore, the following embodiments do not limit the invention as defined in the claims. Several features are described in the embodiments, but not all of these features are essential components of the invention, and the features can be combined arbitrarily. Furthermore, in the accompanying drawings, the same or identical components are labeled with the same reference numerals, and repeated descriptions are omitted.

[0015] The following describes an embodiment of a processing apparatus configured in a specified environment. The processing apparatus may include: a processing chamber for processing a component; a blower; a first flow path for conveying gas from the blower to the processing chamber; a second flow path for returning gas from the processing chamber to the blower; and a pressure gauge for detecting the pressure difference of the second flow path relative to the pressure of the specified environment. Additionally, the processing apparatus may include an adjustment unit for adjusting to maintain the pressure difference in a positive value. The adjustment method for the processing apparatus may include: a detection step for detecting the pressure difference of the second flow path relative to the pressure of the specified environment; and an adjustment step for maintaining the pressure difference in a positive value. The processing unit for processing the component is configured in the processing chamber. This processing unit may be, for example, the main body of any of the following apparatuses: an inkjet apparatus, an exposure apparatus, an imprinting apparatus, a planarization apparatus, a bonding apparatus, a film-forming apparatus, an etching apparatus, a coating apparatus, a developing apparatus, etc.

[0016] Hereinafter, referring to FIGS. 1 and 2, an example will be described where the processing apparatus is configured as an inkjet device 1 and the main body MB of the inkjet device 1 is disposed in the processing chamber 201. In this specification and the accompanying drawings, as shown in FIG. 1, the direction of the processing chamber 201 is shown in an XYZ coordinate system where the plane parallel to the surface of the substrate 2, which is disposed as the component to be processed, is defined as the XY plane. For the main body MB disposed in the processing chamber 201, ink 4, a liquid material serving as a functional element, is applied to the substrate 2 to form a pattern. Furthermore, there are no particular limitations on the composition of the ink.

[0017] The main body MB may include a substrate transport stage 3 that holds and moves the substrate 2. The substrate 2 may be appropriately selected from various substrates such as glass substrates or plastic substrates, depending on the product to be manufactured. The substrate 2 is typically a plate-shaped component, but it is not limited to a specific shape as long as it is a component that can function as the substrate 2. For example, the substrate 2 may also be a circular substrate.

[0018] The substrate 2 is a component for forming a display device and may have a pixel array region 9 and alignment marks 10. Multiple pixels, serving as discharge targets for ink 4, are arranged in the pixel array region 9. The alignment marks 10 are used for measuring the position of the substrate 2. Additionally, the main body MB may include a discharge head 5 with multiple nozzles that discharge ink 4 toward the substrate 2.

[0019] Additionally, the main body MB may include a camera 7, a height sensor 8, and a control unit 6. The control unit 6 controls the substrate transport stage 3, the ejector head 5, the camera 7, and the height sensor 8. The control unit 6 may also be configured to control other components of the inkjet apparatus 1. For example, the control unit 6 uses the camera 7 to detect the position of the alignment mark 10, thereby measuring the position of the substrate 2. Furthermore, the control unit 6 controls the drive mechanism of the substrate transport stage 3 and the ejector head 5 to drive the substrate transport stage 3 to scan relative to the ejector head 5 in the Y direction, while simultaneously ejecting ink 4 from the ejector head 5 into the pixel array region 9 on the substrate 2. In addition, to improve the application position accuracy of the ink 4, the control unit 6 may also use the height sensor 8 to measure the height of the substrate 2, and control the distance between the ejector head 5 and the substrate 2 based on this result. The control unit 6 may be composed of, for example, a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), a general-purpose or special-purpose computer with embedded programs, or a combination of all or part of them.

[0020] Hereinafter, a first embodiment of the air conditioning unit of the inkjet apparatus 1, which is a processing device, will be described with reference to FIG2. The air conditioning unit may include an air conditioner 206 having a blower 219, a supply flow path (first flow path) 202, and a return flow path (second flow path) 203. In addition, the air conditioning unit may also include a purifier 216. The purifier 216 may include, for example, a purifier 209 and a dehumidifier 204. The purifier 216 may be arranged in a flow path that returns gas from the supply flow path 202 to a position upstream of the pressure gauge 205 in the return flow path 203. The air conditioner 206 may also include a temperature controller 207 and a filter 208 in addition to the blower 219. The blower 219, which constitutes part of the air conditioner 206, may be configured to send gas returning from the processing chamber 201 via the return flow path 203 to the temperature controller 207. The temperature controller 207 may include, for example, a cooler and a heater. Temperature controller 207 controls the gas temperature to the required accuracy for processing chamber 201. The temperature control accuracy is, for example, 23 ± 0.1°C or 23 ± 0.01°C. The temperature-controlled gas is then sent to filter 208. Filter 208 removes particulate matter contained in the gas, for example. Filter 208 can be selected, for example, a HEPA filter or a ULPA filter, depending on the required cleanliness of processing chamber 201. To remove chemicals such as ink generated inside processing chamber 201, a chemical filter such as activated carbon can also be installed. Furthermore, temperature controller 207 and filter 208 are arbitrary components. A portion of the gas passing through filter 208 can be sent to purifier 216 via a bypass path.

[0021] The dehumidifier 204 removes moisture from the gas, thereby sending the low-humidity gas to the purifier 209. The purifier 209 purifies the gas by removing oxygen, resulting in a gas with a reduced oxygen concentration, and returns it to the blower 219. By using the dehumidifier 204 and the purifier 209, high-purity N2 can be produced. Inert gases such as Ar can also be used as the circulating gas. Furthermore, the purifier 209 and the dehumidifier 204 can be any components. For example, if the ink used in the processing chamber 201 can also be exposed to oxygen, the purifier 209 is not needed. Also, if the environment in which the inkjet unit 1 is installed is a dehumidified environment, the dehumidifier 204 is not needed.

[0022] The blower 219 supplies gas to the processing chamber 201 via the supply flow path 202. When supplying dry air or inert gas to the processing chamber 201, from the viewpoint of device size or cost, it is preferable to circulate the dry air or inert gas between the processing chamber 201 and the air conditioner 206. For example, when the concentration of the target moisture or oxygen is low, gradually reducing the concentration through circulation can reduce the load on the dehumidifier / purifier, which is beneficial for reducing the size and cost of the dehumidifier / purifier.

[0023] Here, the issues in inkjet apparatus 1 will be explained. Since most organic EL materials undergo changes in material properties upon contact with moisture or oxygen, it is required to coat them in a dry air or inert gas atmosphere. If a gap exists between inkjet apparatus 1 and the external environment, air can intrude from the outside, potentially increasing the concentration of moisture and oxygen. Therefore, it is preferable that inkjet apparatus 1 is configured as a substantially sealed structure and is subjected to positive pressure relative to the external environment.

[0024] To improve the airtightness of the inkjet unit 1, using sealant or adhesive to fill gaps between components would increase costs or assembly time. Especially for panels that require disassembly and reassembly for maintenance, rubber washers are preferable for securing them. Using a large number of bolts for tightening to improve airtightness would increase maintenance time. Furthermore, if the panel deforms after tightening the bolts, gaps will form, necessitating the preparation of panels with sufficient thickness. This increases panel weight, leading to poorer maintainability and increased costs.

[0025] As described above, operations that improve airtightness are generally inversely related to equipment cost and assembly time. Therefore, it is important to design appropriately, taking into account equipment specifications, cost, and maintainability. Furthermore, by setting the equipment to positive pressure relative to the external environment, the inflow of air through gaps can be reduced. However, if the positive pressure in the processing room or air conditioning unit exceeds the necessary amount, there are concerns that increasing the pressure resistance beyond the required level will lead to higher costs or reduced maintainability. Therefore, a method for adjusting to an appropriate positive pressure value is required.

[0026] Next, the details of the air conditioning unit illustrated in Figure 2 will be explained. The supply path 202 is the gas flow path from the air conditioner 206 to the processing chamber 201. A thermostat 207, a filter 208, supply pipes 210 (210a~c), and flow regulating valves 211 (211a~c) can be installed in the supply path 202. Gas is supplied from the air conditioner 206 to the processing chamber 201 through the supply pipes 210. The supply pipes 210 are preferably made of materials that are difficult for moisture or oxygen to pass through, such as stainless steel or aluminum. Furthermore, to reduce temperature fluctuations of the gas controlled by the thermostat 207, the supply pipes 210 are preferably made of insulating components. For example, glass wool can be placed around the metal pipe. Additionally, the inner and outer surfaces of the insulating components constituting the pipe can be covered with a metal membrane. Flow regulating valves 211a, b, and c adjust the flow rate through the supply pipes 210a, b, and c, respectively. The flow regulating valves 211a, b, and c can be, for example, butterfly valves.

[0027] The return flow path 203 is the gas flow path from the processing chamber 201 to the air conditioner 206. Return pipes 221 (221a~d), flow regulating valves 212 (211a~d), etc., can be configured in the return flow path 203. Gas returns from the processing chamber 201 to the air conditioner 206 via the return pipes 221. The return pipes 221 are preferably made of a material that is difficult for moisture or oxygen to pass through, similar to the supply pipes 210, such as stainless steel or aluminum. Flow regulating valves 212a, b, c, and d respectively adjust the flow rate of the gas flowing through the return pipes 221a, b, c, and d. The gas passing through the return pipes 221a, b, c, and d merges with other gases in the air conditioner 206 and is drawn in by the blower 219.

[0028] The processing chamber 201, the blower 219, the supply path 202, and the return path 203 constitute a circulation path 225 for circulating gas. A purifier 216 operates to purify the gas circulating in the circulation path 225. The purifier 216 reduces the moisture content in the gas circulating in the circulation path 225. Additionally, the purifier 216 reduces the oxygen content in the gas circulating in the circulation path 225.

[0029] Pressure gauge 205 detects the pressure difference (Pr-Pe) between the pressure (Pr) of the return flow path 203 and the pressure (Pe) of the specified environment in which the inkjet device 1 is installed. For example, pressure gauge 205 detects the pressure difference (Pr-Pe) between the pressure (Pr) at a specified location in the return flow path 203 and the pressure (Pe) of the specified environment in which the inkjet device 1 is installed. This specified location is preferably between the blower 219 and the return pipe 221. Pressure gauge 205 may be constructed as a differential pressure gauge, and the two spaces for detecting the differential pressure may be connected to the differential pressure gauge via pressure guides. Adjustment unit 230 functions to maintain the differential pressure detected by pressure gauge 205 at a positive target value. This positive target value can be set according to design specifications.

[0030] The dehumidifier 204 can supply dehumidified gas to the upstream position of the pressure gauge 205 in the return flow path 203. The adjustment unit 230 may include a flow adjustment valve 213, which can adjust the flow rate of the gas supplied from the gas supply unit 220 to the upstream position of the pressure gauge 205 in the return flow path 203. The flow adjustment valve 213 is connected to the control unit 6 and can be controlled by the control unit 6.

[0031] Flow regulating valve 214 adjusts the flow rate of gas from filter 208 to dehumidifier 204. Flow regulating valves 215a and 215b adjust the flow rate of gas from dehumidifier 204 to purifier 209. Moisture is more readily released from components than oxygen, making it more difficult to reduce the moisture concentration in gas compared to oxygen concentration. Dehumidifier 204 typically requires a higher processing capacity than purifier 209, meaning it can handle larger volumes of gas. Therefore, flow regulating valves 215a and 215b can be used to allow purifier 209 to process a portion of the gas processed by dehumidifier 204.

[0032] The processing chamber 201 may have an exhaust port 217 for discharging gas from the processing chamber 201 or the inkjet unit 1. The adjustment unit 230 may include a pressure regulating valve 218 provided at the exhaust port 217. The pressure regulating valve 218 is connected to the control unit 6 and can be controlled by the control unit 6.

[0033] The gas supply unit 220 is connected to the upstream side of the pressure gauge 205 in the return flow path 203 to supply dry air or inert gas. When dry air is supplied, the gas supply unit 220 can directly utilize the dry air available in the building facility where the inkjet unit 1 is installed, or a dryer can be added to the dry air line to further reduce the moisture concentration. Alternatively, the gas supply unit 220 can be a desiccant dehumidifier that continuously and efficiently removes moisture from the atmosphere using a desiccant rotor shaped into a honeycomb structure with added desiccant. The specific components constituting the gas supply unit 220 can be selected according to the necessary dry air flow rate and moisture concentration. When inert gas is supplied, the gas supply unit 220 can utilize existing facilities or a gas cylinder containing the inert gas. If the inert gas is nitrogen, it can be a PSA-type or hollow fiber membrane type nitrogen generator, or a combination of these with a catalyst or chemical adsorption purification device.

[0034] The blower 219 is a drive source for circulating gas between the air conditioner 206 and the processing chamber 201 via the supply flow path 202 and the return flow path 203. Therefore, the pressure near the suction port of the blower 219 is the lowest, and the pressure near the discharge port of the blower 219 is the highest. If the pressure near the suction port of the blower 219 is positive relative to the external environment where the inkjet device 1 is installed (if the pressure difference detected by the pressure gauge 205 is positive), then the supply flow path 202, the processing chamber 201, and the return flow path 203 are all positive pressure. Therefore, by adjusting the pressure of the circulation path 225 based on the output of the pressure gauge 205 located near the suction port of the blower 219, positive pressure can be reliably and efficiently formed. Unlike this configuration, in the case where the pressure is adjusted based on the pressure of the processing chamber 201, there is a possibility that even if the processing chamber 201 is positive pressure, the area near the suction side of the blower 219 is negative pressure, and there is a possibility that air may flow in from the external environment. Alternatively, if the pressure adjustment of the treatment chamber 201 to positive pressure exceeds the necessary amount, excessive strength will be required for the treatment chamber 201 to ensure pressure resistance, which may lead to increased costs, reduced maintainability, or gas leakage.

[0035] The pressure adjustment of the circulation path 225 can be achieved by adjusting the opening of the pressure regulating valve 218. The gas supply unit 220 supplies gas to the circulation path 225 at a flow rate equal to the sum of the flow rate of gas leaking from the inkjet unit 1 through the gap in the inkjet unit 1 and the flow rate of gas discharged from the exhaust port 217, thereby maintaining the inkjet unit 1 at a positive pressure.

[0036] In the presence of inert gases, from a safety perspective, significant gas leakage from the inkjet unit 1 is not permitted. On the other hand, in the presence of dry air, some gas leakage is sometimes acceptable. Therefore, in the case of dry air where some leakage is permissible, the airtightness is relaxed, thus reducing costs. By moderately increasing the gas supply volume of the gas supply unit 220, a low-moisture concentration environment can be provided at low cost. Placing a pressure gauge 205 near the suction port of the blower 219 facilitates the appropriate adjustment of the gas supply volume required to maintain positive pressure in the inkjet unit 1 by the flow regulating valve 213. Alternatively, the flow rate of the gas discharged through the exhaust port 217 can also be appropriately adjusted by the pressure regulating valve 218. In this example, the exhaust port 217 and the pressure regulating valve 218 are located in the processing chamber 201, but this is not a limitation; they can also be located on the side of the air conditioner 206.

[0037] The supply pipe 210 may have an inner surface of an insulating component and an outer surface covered with a metal film. In this case, the gas, temperature-controlled by the temperature controller 207, is supplied to the processing chamber 201 in a state where the heat impact received from the external environment is reduced. Therefore, the temperature of the processing chamber 201 can be controlled with high precision. When the purifier 216 is configured to introduce gas into the suction side of the blower 219, the gas is agitated within the blower 219, thus ensuring that the concentrations of moisture and oxygen in the gas supplied through pipes 210a, b, and c are approximately uniform.

[0038] Hereinafter, a second embodiment of the air conditioning unit of the inkjet device 1, which is a processing device, will be described with reference to FIG3. Furthermore, matters not mentioned below can be addressed according to the first embodiment. In the second embodiment, the air conditioner 206 is positioned near the return port of the processing chamber 201. Therefore, the return flow path 203 is shorter than the supply flow path 202. The airtightness of the return pipe 221 is preferably higher than that of the supply pipe 210. A purifier 216 or a dehumidifier 204 can be positioned in the flow path through which gas flows from the processing chamber 201 to the blower 219 or the air conditioner 206. In the second embodiment, dry air is assumed to be the gas, and the oxygen-removing purifier 209 is omitted, but it may also be provided. The gas supply unit 220 is connected to the processing chamber 201 without passing through the supply flow path 202 and the return flow path 203. Furthermore, the exhaust port 217 can be configured as illustrated in FIG1(a) to exhaust the organic gases generated in the processing chamber 201, more specifically, to exhaust from the part of the processing chamber 201 where the concentration of organic gases such as ink is high. The pressure regulating valve 218 of the exhaust port 217 is connected to the control unit 6 and can be controlled by the control unit 6.

[0039] The gas supply unit 220 is connected to the processing chamber 201 and supplies gas to the processing chamber 201 without passing through the supply flow path 202 and the return flow path 203. This allows moisture and other contaminants in the processing chamber 201 to be quickly and effectively removed. Alternatively, the gas supply unit 220 can supply gas to mechanical components such as air-pressure actuators or air-support members of air-lift platforms that can be configured within the processing chamber 201, maintaining the inkjet unit 1 at a positive pressure in parallel with the driving of these mechanical components.

[0040] The following describes, illustratively, the methods for adjusting the flow rate of supply pipes 210a, b, and c in the first and second embodiments. The blower 219 delivers gas from the suction side to the discharge side, creating a positive pressure difference on the discharge side relative to the suction side, thereby circulating the gas in the circulation path 225. If the suction side is adjusted to a positive pressure, the pressure on the discharge side increases accordingly by the amount of the pressure difference. Therefore, if the output of the blower 219 is higher than necessary, the pressure on the discharge side increases accordingly, potentially leading to increased costs, reduced maintainability, or gas leakage due to deformation, given the required pressure resistance of the processing chamber 201. That is, the pressure loss generated during gas circulation in the circulation path 225 is reduced to the maximum extent possible, and then the output (discharge pressure) of the blower 219 is adjusted. As a result, the pressure difference between the processing chamber 201 and the external environment can be reduced after maintaining positive pressure in all parts of the circulation path 225.

[0041] Here, a more specific adjustment method is illustrated. First, all flow control valves 212 of the return pipe 221 are set to fully open. Then, in the supply pipes 210a, b, and c, when a preset flow rate has been reached, the flow control valve 211 corresponding to the supply pipe with the highest pressure loss is set to fully open or close to it. Maintaining this state, the output (speed) of the flow control valves and the blower 219 corresponding to the other two supply pipes is adjusted, thereby allowing a specified flow rate of gas to flow in each of the three supply pipes. Next, the flow control valve (any one of 212a to 212d) corresponding to the return pipe with the highest pressure loss when the preset flow rate has been reached is set to fully open or close to it. Maintaining this state, the output (speed) of the flow control valves and the blower 219 corresponding to the other three return pipes is then adjusted, thereby allowing a specified flow rate of gas to flow in each of the four return pipes. Through this adjustment, the pressure loss of the entire circulating air conditioning system is minimized, and the blower output is set to the necessary minimum. In addition, in cases where the supply or return pipelines have clearly defined pressure loss in their design, flow regulating valves may not be required in their lines.

[0042] Since the ejector head 5 ejects ink toward the substrate, mist floats around it. Furthermore, because ink components evaporate from the nozzle of the ejector head 5, the concentration of organic gases around the ejector head 5 is relatively high. As illustrated in Figure 1(a), by providing an exhaust port 217 near the ejector head 5, organic gases can be efficiently discharged from the inkjet unit 1. Alternatively, instead of providing the exhaust port 217 near the ejector head 5, the exhaust port 217 can be provided at other locations within the inkjet unit 1 where the concentration of organic gases is high.

[0043] The control unit 6 can adjust the pressure regulating valve 218 of the exhaust port 217 based on the output of the pressure gauge 205 so that the inkjet unit 1 reaches the target positive pressure value. In the processing chamber 201, when maintenance is performed or the panel is opened and closed during maintenance, it may be necessary to readjust the pressure of the inkjet unit 1 after maintenance. By automatically adjusting the pressure with the control unit 6, the device can be started quickly. Furthermore, when the supply flow rate of the gas supply unit 220 changes, the control unit 6 can maintain a constant pressure value in the processing chamber 201 by adjusting the pressure regulating valve 218 according to the output of the pressure gauge 205.

[0044] The air conditioner 206, including the blower 219, is configured such that the return flow path 203 is shorter than the supply flow path 202, meaning that the conductivity of the return flow path 203 is greater than that of the supply flow path 202. This configuration helps reduce pressure loss in the return flow path 203. Therefore, it reduces the risk that the pressure in the processing chamber 201 will rise excessively near the suction side of the blower 219, which is adjusted to positive pressure based on the pressure difference detected by the pressure gauge 205. To further reduce pressure loss in the return flow path, the number of return pipes 221 is increased or their diameter is increased relative to the supply pipe 210.

[0045] Because the internal pressure of the return pipe 221 is lower than that of the supply pipe 210, air can easily intrude from the outside. Therefore, it is preferable to make the airtightness of the return pipe 221 higher than that of the supply pipe 210, thereby reducing the intrusion of air from the outside.

[0046] The following describes a method for manufacturing an article using the processing apparatus described above. The article manufacturing method may include: a first processing step of processing a component using the processing apparatus; and a second processing step of further processing the component after the first processing step to obtain an article. The first processing step may, for example, be a process of applying liquid (ink) to a substrate using an inkjet printer, a process of exposing the substrate using an exposure apparatus, or a process of forming a pattern on the substrate using an imprinting apparatus. Alternatively, the first processing step may include, for example, a process of forming a planarization film on the substrate using a planarization apparatus, a process of joining two components using a bonding apparatus, a process of forming a film on the substrate using a film-forming apparatus, or a process of etching the substrate or a layer using an etching apparatus. Alternatively, the first processing step may include, for example, a process of applying a film material such as a photoresist to the substrate, or a process of developing the exposed substrate.

[0047] The following describes, as an example, a method for manufacturing a display such as an organic EL display (OLED). This manufacturing method may include: a coating step (first processing step) in which liquid (ink) is applied to a substrate by the inkjet apparatus 1 described above; and a processing step (second processing step) in which the substrate after the coating step is further processed to obtain the display. The coating step may include a step of applying liquid organic material to the substrate. This manufacturing method may include multiple coating steps, through which an organic layer including a light-emitting layer can be formed. As part of the second processing step, this manufacturing method may include a step of depressurized drying and firing of the liquid applied by the coating step. As part of the second processing step, this manufacturing method may include a step of forming a lower electrode before the coating step and a step of forming an upper electrode after the coating step.

[0048] The invention is not limited to the embodiments described above, and various changes and modifications can be made without departing from the concept and scope of the invention. Therefore, claims are appended to disclose the scope of the invention.

[0049] Explanation of reference numerals in the attached figures

[0050] 1: Inkjet unit (processing unit), 201: Processing chamber, 202: Supply flow path (first flow path), 203: Return flow path (second flow path), 205: Pressure gauge, 216: Purifier, 218: Pressure regulating valve, 219: Blower, 220: Gas supply unit, 225: Circulation path, 230: Adjustment unit.

Claims

1. A processing apparatus configured in a specified environment, characterized in that, The aforementioned processing apparatus includes: a processing chamber for processing components; a blower; a first flow path for conveying gas from the blower to the processing chamber; a second flow path for returning gas from the processing chamber to the blower; a pressure gauge for detecting the pressure difference between the pressure of the second flow path and the pressure of the specified environment; and an adjustment unit for adjusting to maintain the pressure difference at a positive value.

2. The processing apparatus as described in claim 1, characterized in that, The aforementioned processing apparatus also includes a purifier that purifies the gas circulating in the circulation path, which includes the aforementioned processing chamber, the aforementioned blower, the aforementioned first flow path, and the aforementioned second flow path.

3. The processing apparatus as described in claim 2, characterized in that, The aforementioned purifier reduces the moisture content in the gas circulating in the aforementioned circulation path.

4. The processing apparatus as described in claim 2, characterized in that, The aforementioned purifier reduces the amount of water and oxygen in the gas circulating in the aforementioned circulation path.

5. The processing apparatus as claimed in claim 1, characterized in that, The aforementioned blower is configured as part of an air conditioner, the aforementioned second flow path has a pipe connecting the aforementioned air conditioner to the aforementioned processing chamber, and the aforementioned pressure gauge is disposed between the aforementioned pipe and the aforementioned blower.

6. The processing apparatus as claimed in claim 1, characterized in that, The aforementioned processing apparatus has an exhaust port for discharging gas to the outside of the processing apparatus, and the aforementioned adjustment unit includes: a gas supply unit for supplying gas to a circulation path including the aforementioned processing chamber, the aforementioned blower, the aforementioned first flow path and the aforementioned second flow path; and a pressure regulating valve provided at the aforementioned exhaust port.

7. The processing apparatus as described in claim 6, characterized in that, The gas supply unit is connected to a position in the second flow path upstream of the pressure gauge.

8. The processing apparatus as described in claim 6, characterized in that, The gas supply unit is connected to the processing chamber.

9. The processing apparatus as claimed in claim 7, characterized in that, The gas supply unit supplies gas at a flow rate equal to the sum of the flow rate of the gas leaking from the processing device and the flow rate of the gas discharged from the exhaust port.

10. The processing apparatus as claimed in claim 6, characterized in that, The exhaust port is configured to discharge the organic gases generated in the processing chamber.

11. The processing apparatus as claimed in claim 2, characterized in that, The aforementioned purifier is configured to return gas from the first flow path to a position upstream of the pressure gauge in the second flow path.

12. The processing apparatus as claimed in claim 2, characterized in that, The aforementioned purifier is configured in the flow path that allows gas to flow from the aforementioned treatment chamber to the aforementioned blower.

13. The processing apparatus according to any one of claims 1 to 12, characterized in that, The pressure loss in the second flow path is smaller than that in the first flow path.

14. The processing apparatus according to any one of claims 1 to 12, characterized in that, The conductivity of the second flow path is greater than that of the first flow path.

15. The processing apparatus according to any one of claims 1 to 12, characterized in that, The second flow path is shorter than the first flow path.

16. The processing apparatus according to any one of claims 1 to 12, characterized in that, The aforementioned processing apparatus also includes a filter disposed in the aforementioned first flow path.

17. The processing apparatus according to any one of claims 1 to 12, characterized in that, The second flow path has higher airtightness than the first flow path.

18. The processing apparatus according to any one of claims 1 to 12, characterized in that, The first flow path described above has a pipe made of an insulating component, the inner and outer surfaces of which are covered by a metal film.

19. The processing apparatus according to any one of claims 6 to 10, characterized in that, The aforementioned adjustment unit adjusts the aforementioned pressure regulating valve so that the aforementioned pressure difference becomes a positive target value.

20. An adjustment method for adjusting a processing apparatus disposed in a specified environment, the processing apparatus comprising: a processing chamber for processing a component; a blower; a first flow path for conveying gas from the blower to the processing chamber; and a second flow path for returning gas from the processing chamber to the blower, characterized in that, The above adjustment method includes: a detection step, which detects the pressure difference between the pressure of the second flow path and the pressure of the specified environment; and an adjustment step, which performs an adjustment to maintain the pressure difference as positive.

21. A method for manufacturing an article, characterized in that, The above-mentioned article manufacturing method includes: a first processing step, processing a component using the processing apparatus according to any one of claims 1 to 12; and a second processing step, further processing the component that has undergone the first processing step to obtain an article.

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