Multi-dimensional correction coupling platform
By combining three-dimensional translation and oscillation components, multi-dimensional adjustment of the chip and substrate is achieved, which solves the shortcomings of traditional coupling platforms in attitude correction and precision control, and improves the coupling accuracy between the chip and substrate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGDONG HISENSE BROADBAND TECH CO LTD
- Filing Date
- 2025-10-29
- Publication Date
- 2026-05-01
AI Technical Summary
Existing coupling platforms can only translate along the X, Y, and Z axes, which cannot meet the increasingly complex alignment accuracy requirements of chip and substrate structures, especially when the chip angle is offset, it cannot correct the orientation.
The device employs a three-dimensional translation component and a three-dimensional swing component. The fixture is connected to the three-dimensional swing component. The three-dimensional translation component drives the fixture to translate along the X, Y, and Z axes, while the three-dimensional swing component drives the fixture to rotate around the X, Y, and Z axes, thereby achieving multi-dimensional adjustment of the chip.
It improves the attitude control precision when the chip contacts the substrate, enabling more precise adjustment of the chip-substrate bonding process and meeting the coupling requirements of complex structures.
Smart Images
Figure CN121969099A_ABST
Abstract
Description
A multi-dimensional correction coupling platform
[0001] This application claims priority to Chinese Patent Application No. 2024115361044, filed on October 31, 2024, entitled "A Multi-Dimensional Correction Coupling Platform", the entire contents of which are incorporated herein by reference. Technical Field
[0002] This application relates to the field of coupling technology, and in particular to a multi-dimensional corrective coupling platform. Background Technology
[0003] Coupling platforms are primarily used to assist in the precise positioning of the chip and the substrate. Currently, common coupling platforms can translate the chip along the X, Y, and Z axes, moving it to a designated position on the substrate for precise chip-substrate positioning. However, with the increasing complexity of chip and substrate structures, the alignment accuracy requirements between the chip and substrate are also increasing. For some specific chip-substrate combinations, coupling requires tilting the chip first to allow a portion of it to contact the substrate before rotating it to achieve full contact. Furthermore, traditional coupling platforms that can only translate along the X, Y, and Z axes cannot correct the chip's orientation when there is an angular deviation. Clearly, common coupling platforms that can only translate the chip along the X, Y, and Z axes cannot meet the increasingly demanding coupling requirements.
[0004] Therefore, overcoming the aforementioned shortcomings has become an important issue that urgently needs to be addressed by those skilled in the art. Summary of the Invention
[0005] This invention overcomes the shortcomings of the above-mentioned technologies and provides a multi-dimensional correction coupling platform.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: a multi-dimensional correction coupling platform, including a three-dimensional translation component, wherein the three-dimensional translation component is used to drive the carrier on it to translate along the X-axis, Y-axis and Z-axis respectively, the three-dimensional translation component is provided with a translation base for connecting the carrier, the translation base is connected to a three-dimensional swing component, the three-dimensional swing component is used to drive the carrier on it to rotate around the X-axis, Y-axis and Z-axis, and the three-dimensional swing component is driven to connect a clamp for holding a chip.
[0007] Preferably, the three-dimensional translation component includes an X-axis slide, a wedge-shaped Z-axis lifting platform is driven and connected to the X-axis slide, a Y-axis slide is driven and connected to the wedge-shaped Z-axis lifting platform, and the translation base is connected to the Y-axis slide and is directly driven to translate by the Y-axis slide.
[0008] Preferably, the three-dimensional swing assembly includes an X-axis turntable fixed on a translation base, a Z-axis angular displacement stage driven and connected to the X-axis turntable, a Y-axis angular displacement stage driven and connected to the Z-axis angular displacement stage, and a clamp connected to the Y-axis angular displacement stage and directly driven to swing by the Y-axis angular displacement stage.
[0009] Preferably, the rotation axes of the X-axis turntable, Z-axis angular displacement stage, and Y-axis angular displacement stage intersect at the same point, which is located outside the three-dimensional translation component and the three-dimensional swing component.
[0010] Preferably, the center point of the clamping position of the fixture coincides with the intersection of the rotation axes of the X-axis rotary table, the Z-axis angular displacement table, and the Y-axis angular displacement table.
[0011] Preferably, the clamp is a translational manipulator to facilitate the gripping of the chip, and / or the clamp is provided with a negative pressure air passage to facilitate the adsorption of the chip through negative pressure.
[0012] Preferably, the X-axis slide, the wedge-shaped Z-axis lifting platform, and the Y-axis slide are connected sequentially from bottom to top.
[0013] Preferably, the X-axis turntable, Z-axis angular displacement stage, and Y-axis angular displacement stage are sequentially connected outward along the rotation axis of the X-axis turntable.
[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: The multi-dimensional correction coupling platform provided in this application includes a three-dimensional translation component, which can drive a translation base to translate along the X-axis, Y-axis, and Z-axis respectively. A three-dimensional swing component is also connected to the translation base, and a fixture for holding the chip is connected to the three-dimensional swing component. The three-dimensional swing component can drive the fixture to rotate around the X-axis, Y-axis, and Z-axis respectively. Thus, when the three-dimensional translation component drives the three-dimensional swing component to translate through the translation base, it can also indirectly drive the fixture to translate along the X-axis, Y-axis, and Z-axis. At the same time, the three-dimensional swing component can further drive the fixture to swing around the X-axis, Y-axis, and Z-axis respectively based on the translation. In this way, any degree of freedom of the fixture can be adjusted as needed through the three-dimensional translation component and the three-dimensional swing component, thereby indirectly adjusting the position and orientation of the chip held by the fixture. Therefore, the multi-dimensional correction coupling platform provided in this application can more accurately control the posture of the chip when it contacts the substrate compared with the traditional coupling platform that can only translate the chip along the X-axis, Y-axis and Z-axis, and can further control the chip bonding process with the substrate. Attached Figure Description
[0015] Figure 1 is a schematic diagram of the coupling platform provided in this application.
[0016] Figure 2 is an exploded view of the coupling platform provided in this application.
[0017] Figure 3 is an enlarged view of section “A” in Figure 1. Detailed Implementation
[0018] The following embodiments further illustrate the features and other related features of the present invention to facilitate understanding by those skilled in the art: As shown in Figures 1 to 3, a multi-dimensional correction coupling platform includes a three-dimensional translation component 1, which drives a carrier on it to translate along the X-axis, Y-axis and Z-axis respectively. The three-dimensional translation component 1 is provided with a translation base 2 for connecting the carrier. A three-dimensional swing component 3 is connected to the translation base 2. The three-dimensional swing component 3 drives the carrier on it to rotate around the X-axis, Y-axis and Z-axis. A clamp 4 for holding a chip is driven and connected to the three-dimensional swing component 3.
[0019] As described above, the multi-dimensional correction coupling platform provided in this application includes a three-dimensional translation component 1. The three-dimensional translation component 1 can drive a translation base 2 to translate along the X-axis, Y-axis, and Z-axis respectively. A three-dimensional swing component 3 is also connected to the translation base 2, and a clamp 4 for holding the chip is connected to the three-dimensional swing component 3. The three-dimensional swing component 3 can drive the clamp 4 to rotate around the X-axis, Y-axis, and Z-axis respectively. Thus, when the three-dimensional translation component 1 drives the three-dimensional swing component 3 to translate via the translation base 2, it can also indirectly drive the clamp 4 to translate along the X-axis, Y-axis, and Z-axis. Simultaneously, the three-dimensional swing component 3 can further drive the clamp 4 to swing around the X-axis, Y-axis, and Z-axis respectively based on the translation. In this way, any degree of freedom of the clamp 4 can be adjusted as needed via the three-dimensional translation component 1 and the three-dimensional swing component 3, thereby indirectly adjusting the position and orientation of the chip held by the clamp 4. Therefore, the multi-dimensional correction coupling platform provided in this application can more accurately control the posture of the chip when it contacts the substrate compared with the traditional coupling platform that can only translate the chip along the X-axis, Y-axis and Z-axis, and can further control the chip bonding process with the substrate.
[0020] As shown in Figures 1 and 2, preferably, the three-dimensional translation component 1 includes an X-axis slide 11, a wedge-shaped Z-axis lifting platform 12 is driven and connected to the X-axis slide 11, a Y-axis slide 13 is driven and connected to the wedge-shaped Z-axis lifting platform 12, and the translation base 2 is connected to the Y-axis slide 13 and is directly driven to translate by the Y-axis slide.
[0021] As described above, the three-dimensional translation component 1 provided in this application includes an X-axis slide 11, a wedge-shaped Z-axis lifting platform 12, and a Y-axis slide 13. The X-axis slide 11 can drive the wedge-shaped Z-axis lifting platform 12 to move along the X-axis direction, while the wedge-shaped Z-axis lifting platform 12 can drive the Y-axis slide 13 to move along the Z-axis direction. The translation base 2 is connected to the Y-axis slide 13 and is driven by the Y-axis slide 13 to move along the Y-axis direction. Thus, the X-axis slide 11 and the wedge-shaped Z-axis lifting platform 12 can also indirectly drive the translation base 2 to translate along the X-axis and Z-axis directions, thereby allowing the translation base 2 to translate along the X-axis, Y-axis, and Z-axis directions respectively under the drive of the three-dimensional translation component 1. The three-dimensional translation component 1 provided in this application has the part used to realize the movement in the Z-axis direction set between the X-axis slide 11 and the Y-axis slide 13. At the same time, a wedge-shaped Z-axis lifting platform 12 is used instead of a Z-axis slide. This can effectively reduce the overturning moment of the three-dimensional translation component 1 when a load is connected to the translation base 2, thereby reducing the deformation of the X-axis slide 11, the wedge-shaped Z-axis lifting platform 12 and the Y-axis slide 13 due to the load and improving the coupling accuracy.
[0022] As shown in Figures 1 to 3, preferably, the three-dimensional swing assembly 3 includes an X-axis turntable 31 fixed on the translation base 2, a Z-axis angular displacement stage 32 driven and connected to the X-axis turntable 31, a Y-axis angular displacement stage 33 driven and connected to the Z-axis angular displacement stage 32, and the clamp 4 connected to the Y-axis angular displacement stage 33 and directly driven to swing by the Y-axis angular displacement stage 33.
[0023] As described above, the three-dimensional swing assembly 3 provided in this application includes an X-axis turntable 31, a Z-axis angular displacement stage 32, and a Y-axis angular displacement stage 33. The X-axis turntable 31 is fixed on the translation base 2. The X-axis turntable 31 can drive the Z-axis angular displacement stage 32 to rotate around the X-axis, and the Z-axis angular displacement stage 32 can drive the Y-axis angular displacement stage 33 to swing around the Z-axis. The clamp 4 is connected to the Y-axis angular displacement stage 33 and can be driven by the Y-axis angular displacement stage 33 to swing around the Y-axis. Thus, the X-axis turntable 31 and the Z-axis angular displacement stage 32 can also indirectly drive the clamp 4 to rotate around the X-axis and swing around the Z-axis, thereby allowing the clamp 4 to swing around the X-axis, Y-axis, and Z-axis under the drive of the three-dimensional swing assembly 3.
[0024] Thus, by cooperating with the X-axis slide 11, the wedge-shaped Z-axis lifting stage 12, the Y-axis slide 13, the X-axis rotary stage 31, the Z-axis angular displacement stage 32, and the Y-axis angular displacement stage 33, the coupling platform of this invention can control the six degrees of freedom of the fixture 4 respectively, and more accurately control the attitude of the chip when the chip is coupled to the substrate, thereby effectively improving the coupling accuracy.
[0025] Preferably, the rotation axes of the X-axis rotary table 31, the Z-axis angular displacement table 32, and the Y-axis angular displacement table 33 intersect at the same point, which is located outside the three-dimensional translation component 1 and the three-dimensional swing component 3. In this way, when the fixture 4 is driven to move by the three-dimensional translation component 1 and the three-dimensional swing component 3, the intersection of the rotation axes of the X-axis rotary table 31, the Z-axis angular displacement table 32, and the Y-axis angular displacement table 33 can be used as the action reference for control operation. Moreover, since this intersection point is located outside the three-dimensional translation component 1 and the three-dimensional swing component 3, the constraints of the three-dimensional translation component 1 and the three-dimensional swing component 3 on the movement path of the fixture 4 can be minimized.
[0026] Preferably, the center point of the clamping position of the fixture 4 coincides with the intersection of the rotation axes of the X-axis rotary table 31, the Z-axis angular displacement table 32, and the Y-axis angular displacement table 33. In this way, when a chip is fixed on the fixture 4, the movements of the three-dimensional translation component 1 and the three-dimensional swing component 3 do not need to undergo complex conversion calculations to obtain the actual movement of the chip. The movements of the three-dimensional translation component 1 and the three-dimensional swing component 3 can be directly reflected on the chip in a 1:1 ratio, which can further simplify the operation logic.
[0027] As shown in Figures 1 to 3, preferably, the clamp 4 is a translational manipulator to facilitate the gripping of the chip, and / or the clamp 4 is provided with a negative pressure airway 41 to facilitate the adsorption of the chip through negative pressure.
[0028] As described above, the clamp 4 provided in this application can be a translational manipulator for directly gripping the chip, or it can be connected to a vacuum pump through the negative pressure air channel 41 to form a negative pressure to adsorb the chip onto the clamp 4, or it can be a combination of the above two, so as to better adapt to the chip clamping requirements according to different working conditions.
[0029] As shown in Figures 1 and 2, preferably, the X-axis slide 11, the wedge-shaped Z-axis lifting platform 12, and the Y-axis slide 13 are connected sequentially from bottom to top. This allows the three-dimensional translation component 1 to utilize space more efficiently in the vertical direction, reducing its footprint. Simultaneously, the load-bearing structure via the bottom X-axis slide 11 helps improve the stability of the entire structure, reducing vibration during movement and ensuring accuracy. Furthermore, using the wedge-shaped Z-axis lifting platform 12 instead of the Z-axis slide allows for more accurate and rapid adjustment and confirmation of the movement of the three-dimensional translation component 1 in the Z-axis direction.
[0030] As shown in Figures 1 to 3, preferably, the X-axis rotary table 31, the Z-axis angular displacement table 32, and the Y-axis angular displacement table 33 are connected and arranged outward along the rotation axis of the X-axis rotary table 31. In this way, by selecting the Z-axis angular displacement table and the Y-axis angular displacement table 33 with appropriate rotation radii, the rotation axes of the X-axis rotary table 31, the Z-axis angular displacement table 32, and the Y-axis angular displacement table 33 can be made to intersect at the same point, thereby improving the control efficiency of the fixture 4.
[0031] As stated above, this application protects a multi-dimensional correction coupling platform, and all technical solutions that are the same as or similar to this application should be considered to fall within the protection scope of this application.
Claims
1. A multi-dimensional correction coupling platform, characterized in that, It includes a three-dimensional translation component (1), which is used to drive the carrier on it to translate along the X-axis, Y-axis and Z-axis respectively. The three-dimensional translation component (1) is provided with a translation base (2) for connecting the carrier. A three-dimensional swing component (3) is connected to the translation base (2). The three-dimensional swing component (3) is used to drive the carrier on it to rotate around the X-axis, Y-axis and Z-axis. A clamp (4) for holding the chip is driven and connected to the three-dimensional swing component (3).
2. The multi-dimensional correction coupling platform according to claim 1, characterized in that, The three-dimensional translation component (1) includes an X-axis slide (11), a wedge-shaped Z-axis lifting platform (12) is driven and connected to the X-axis slide (11), a Y-axis slide (13) is driven and connected to the wedge-shaped Z-axis lifting platform (12), and the translation base (2) is connected to the Y-axis slide (13) and is directly driven to translate by the Y-axis slide.
3. A multi-dimensional correction coupling platform according to claim 1 or 2, characterized in that, The three-dimensional swing assembly (3) includes an X-axis turntable (31) fixed on a translation base (2), a Z-axis angular displacement stage (32) driven and connected to the X-axis turntable (31), a Y-axis angular displacement stage (33) driven and connected to the Z-axis angular displacement stage (32), and a clamp (4) connected to the Y-axis angular displacement stage (33) and directly driven to swing by the Y-axis angular displacement stage (33).
4. The multi-dimensional correction coupling platform according to claim 3, characterized in that, The rotation axes of the X-axis turntable (31), Z-axis angular displacement stage (32) and Y-axis angular displacement stage (33) intersect at the same point, which is located outside the three-dimensional translation component (1) and the three-dimensional swing component (3).
5. A multi-dimensional correction coupling platform according to claim 4, characterized in that, The center point of the clamping position of the fixture (4) coincides with the intersection of the rotation axes of the X-axis turntable (31), the Z-axis angular displacement stage (32), and the Y-axis angular displacement stage (33).
6. The multi-dimensional correction coupling platform according to claim 1, characterized in that, The clamp (4) is a translational manipulator to facilitate the gripping of the chip, and / or the clamp (4) is provided with a negative pressure air passage (41) to facilitate the adsorption of the chip through negative pressure.
7. A multi-dimensional correction coupling platform according to claim 2, characterized in that, The X-axis slide (11), the wedge-shaped Z-axis lifting platform (12), and the Y-axis slide (13) are connected sequentially from bottom to top.
8. A multi-dimensional correction coupling platform according to claim 3, characterized in that, The X-axis turntable (31), Z-axis angular displacement stage (32) and Y-axis angular displacement stage (33) are sequentially connected outward along the rotation axis of the X-axis turntable (31).