Thermocompression bonding equipment and method based on multi-vision collaboration

Abstract

The invention discloses a thermocompression bonding device and method based on multi-vision collaboration, and belongs to the technical field of semiconductor packaging, the thermocompression bonding device comprises a carrier, a transfer platform, a pickup head, a bonding head, a first vision assembly, a second vision assembly and a third vision assembly, the pickup head is used for placing chips to be bonded on placement positions of the transfer platform one by one, and the bonding head is used for bonding the chips to be bonded on the placement positions of the transfer platform. The bonding head is used for picking up the plurality of to-be-bonded chips on the transfer platform and bonding the plurality of to-be-bonded chips to a substrate on the carrying platform at one time; wherein the first visual assembly and the second visual assembly cooperate to complete calibration of the transfer platform and alignment of the bonding head, the third visual assembly and the second visual assembly cooperate to achieve accurate alignment of the substrate and the bonding head, and the precision and stability of one-time bonding of multiple chips are guaranteed. According to the thermocompression bonding equipment based on multi-vision collaboration, efficient and accurate bonding of multiple chips and the substrate is achieved through transfer platform caching, multi-vision alignment and carrying table / bonding head collaboration movement.

Description

A thermocompression bonding device and method based on multi-vision collaboration Technical Field

[0001] This invention belongs to the field of semiconductor packaging technology, specifically relating to a thermocompression bonding device and method based on multi-vision collaboration. Background Technology

[0002] Thermocompression bonding is a precision process that achieves permanent bonding of materials by simultaneously applying precise heat and pressure. Its typical workflow includes picking up and flipping the chips to be bonded, identifying alignment marks and correcting positions based on a vision system, and finally, precise alignment and thermocompression bonding. In this process, visual alignment accuracy and equipment bonding efficiency are two core indicators for measuring the advancement of the equipment. Visual alignment accuracy directly determines the success or failure of high-density, micro-pitch interconnects and the final product yield; while equipment bonding efficiency (i.e., output per hour (UPH)) directly affects production costs and return on investment.

[0003] In the current field of advanced semiconductor packaging, conventional thermoforming bonding equipment generally adopts a serial, single-piece operation mode: the bonding head picks up a single product (such as a chip to be bonded) at a time, and sequentially completes visual alignment and thermoforming bonding. This traditional mode has an inherent efficiency bottleneck because the bonding cycle for each product independently includes complete pick-up, alignment, and bonding time, limiting further improvements in the equipment's up-per-hour (UPH). Furthermore, frequent pick-up and drop-off operations increase the risk of mechanical wear and the accumulation of positioning errors. Summary of the Invention

[0004] In response to one or more of the above-mentioned defects or improvement needs of the prior art, the present invention provides a thermocompression bonding device and method based on multi-vision collaboration, which can bond multiple chips to a substrate at one time, greatly improving the throughput and production efficiency of the device.

[0005] To achieve the above objectives, the present invention provides a multi-vision collaborative thermocompression bonding apparatus, comprising a stage, a transfer platform, a pickup head, a bonding head, a first vision component, a second vision component, and a third vision component; the stage is used to support the substrate, the substrate having multiple bonding positions and a first positioning mark; the stage is movable in space and can rotate around the Z-axis; the transfer platform is provided with multiple placement positions corresponding one-to-one with each of the bonding positions, for placing chips to be bonded; the transfer platform is also provided with a second positioning mark corresponding to the first positioning mark; the transfer platform is made of a transparent material to allow light to pass through; the transfer platform and the substrate are spaced apart along a first direction; the pickup head is used to place the chips to be bonded one by one onto the placement positions on the transfer platform; the pickup head is movable in space and can rotate around the Z-axis; the bonding head includes multiple nozzles corresponding one-to-one with each of the placement positions, the bonding head is used to pick up the multiple chips to be bonded on the transfer platform and bond the multiple chips to be bonded. The bonding head is positioned at the bonding point on the substrate; a third positioning mark corresponding to the first positioning mark is provided at the bottom of the bonding head; a first reflector and a fourth positioning mark are provided at the top of the bonding head, the first reflector being used to reflect the fourth positioning mark to the top of the bonding head for acquisition by the second and third vision components; the bonding head can move in space and rotate around the Z-axis; the first and second vision components are respectively positioned below and above the transfer platform; the third vision component is positioned above the stage, and the imaging images of the third vision component and the second vision component are parallel and have no relative rotation angle; a first calibration point is provided on the transfer platform, the first calibration point being used to map the image coordinate systems of the first and second vision components to the transfer platform coordinate system, thereby obtaining the coordinate transformation relationship between the two relative to the transfer platform coordinate system; a second calibration point is provided on the substrate, the second calibration point being used to transform the image coordinate system of the third vision component to the substrate coordinate system.

[0006] As a further improvement of the present invention, the first visual detection component includes a camera module and a second reflector. The second reflector is used to achieve a 90° bend in the optical path between the camera module and the transfer platform, so that the camera module can be horizontally positioned below the transfer platform.

[0007] As a further improvement of the present invention, the first reflector is a 45° reflector, used to realize a 90° turn in the optical path between the fourth positioning mark and the second and third visual components.

[0008] As a further improvement of the present invention, the fourth positioning mark is disposed on the reference plate, and the distance between the reference plate and the second reflector is adjustable.

[0009] As a further improvement of the present invention, a fifth positioning mark is provided on the side of the chip to be bonded facing the transfer platform, and a sixth positioning mark corresponding to the fifth positioning mark is provided at each placement position of the transfer platform.

[0010] As a further improvement of the present invention, each placement position of the transfer platform is provided with an adsorption hole at the bottom for adsorbing the chip to be bonded.

[0011] As a further improvement of the present invention, a translation guide rail extending along a first direction is included. The pickup head and the bonding head are respectively connected to the translation guide rail via a first translation motor and a second translation motor. The two translation motors can respectively drive the pickup head and the bonding head to move along the translation guide rail.

[0012] As a further improvement of the present invention, a first linear motor and a first rotary motor are provided between the translation motor and the pickup head; the first linear motor is used to drive the pickup head to move in a plane perpendicular to the first direction, and the first rotary motor is used to drive the pickup head to rotate around the Z-axis; a second linear motor and a second rotary motor are provided between the translation motor and the bonding head; the second linear motor is used to drive the bonding head to move in a plane perpendicular to the first direction, and the second rotary motor is used to drive the bonding head to rotate around the Z-axis.

[0013] On the other hand, the present invention also provides a multi-vision collaborative thermocompression bonding method, applied to the aforementioned thermocompression bonding equipment, comprising the following steps: S1, the first vision component and the second vision component simultaneously focus on the first calibration point of the transfer platform, calibrating the coordinate transformation relationship between the image coordinate system of the first vision component and the second vision component and the coordinate system of the transfer platform; S2, the pickup head picks up the chips to be bonded one by one and places them in the placement positions of the transfer platform until all placement positions are filled with the chips to be bonded; S3, the bonding head moves to the field of view of the first vision component, the first vision component collects the position information of the third positioning mark at the bottom of the bonding head, and the second vision component collects the position information of the second positioning mark of the transfer platform; based on the coordinate transformation relationship in step S1, the first compensation position information of the third positioning mark and the second positioning mark is calculated; the bonding head adjusts all its nozzles to precisely align with each placement position of the transfer platform according to the first compensation position information, and the bonding head picks up all the chips to be bonded at once; in this aligned state, the second vision component collects the fourth positioning mark reflected by the first reflector, and records the position information of the fourth positioning mark and the second positioning mark at this time. The third vision component focuses on the substrate and completes the transformation from its own image coordinate system to the substrate coordinate system through the second calibration point on the substrate. The third vision component collects the position information of the first positioning mark on the substrate and calculates the second compensation position information by combining it with the position information of the second positioning mark recorded by the second vision component in step S3. The stage is adjusted according to the second compensation position information so that the position information of the first positioning mark on the substrate in the third vision component is consistent with the position information of the second positioning mark recorded by the second vision component in step S3, so as to achieve the angular alignment between the substrate bonding position and the transfer platform placement position. The bonding head carries multiple chips to be bonded and moves to the field of view of the third vision component. The third vision component collects the position information of the fourth positioning mark on the top of the bonding head and calculates the XY direction compensation offset between the two by combining it with the position information of the fourth positioning mark recorded by the second vision component in step S3. The bonding head is adjusted according to the XY direction compensation offset to ensure that each of its nozzles is precisely aligned with each bonding position on the substrate. The bonding head performs a hot-press bonding action to bond multiple chips to be bonded to the corresponding bonding positions on the substrate at one time.

[0014] As a further improvement of the present invention, a fifth positioning mark is provided on the side of the chip to be bonded facing the transfer platform, and a sixth positioning mark corresponding to the fifth positioning mark is provided at each placement position of the transfer platform; step S2 includes the following process: S21, the pickup head picks up the chip to be bonded and moves it to the field of view of the first vision component, the first vision component collects the position information of the fifth positioning mark on the side of the chip to be bonded facing the transfer platform, and the second vision component collects the position information of the sixth positioning mark at the target placement position of the transfer platform; based on the coordinate transformation relationship obtained in step S1, the third compensation position information of the fifth positioning mark and the sixth positioning mark is calculated; S22, the pickup head is adjusted according to the third compensation position information to precisely align the chip to be bonded with the target placement position, and then the chip to be bonded is precisely placed at the target placement position; S23, steps S21 and S22 are repeated until all placement positions of the transfer platform have completed the loading of the chip to be bonded.

[0015] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0016] Overall, the beneficial effects of the above-described technical solutions conceived by this invention compared with the prior art include: (1) The multi-vision collaborative thermocompression bonding device of this invention includes a stage, a transfer platform, a pickup head, a bonding head, a first vision component, a second vision component, and a third vision component. The pickup head is used to place the chips to be bonded one by one on each placement position of the transfer platform. The bonding head is used to pick up multiple chips to be bonded on the transfer platform and to bond multiple chips to be bonded at once to the substrate located on the stage. Among them, the first and second vision components work together to complete the alignment of the transfer platform and the bonding head, and the third vision component works with the second vision component to achieve precise alignment of the substrate and the bonding head, ensuring the accuracy and stability of bonding multiple chips at once. The multi-vision collaborative thermocompression bonding device of this invention achieves efficient and accurate bonding of multiple chips to the substrate through transfer platform buffering, multi-vision alignment, and coordinated movement of the stage / bonding head.

[0017] (2) The hot-press bonding device based on multi-vision collaboration of the present invention sets the transfer platform to be made of transparent material, and sets the first calibration point and the second positioning mark directly on the transfer platform, which simplifies the visual calibration process of the first vision component and the second vision component and the alignment process of the transfer platform position, and facilitates multiple alignments and alignment accuracy detection.

[0018] (3) The hot-press bonding device based on multi-vision collaboration of the present invention, by installing a first reflector and a fourth positioning mark above the bonding head, enables the second vision component to capture the second positioning mark on the transfer platform while capturing the fourth positioning mark, and the third vision component to capture the first positioning mark on the substrate while capturing the fourth positioning mark. By utilizing the special imaging relationship between the second vision component and the third vision component, as well as the position information of the fourth and second positioning marks recorded by the second vision component when the multiple nozzles on the bonding head are aligned with the placement position of the transfer platform, the position information of the first and fourth positioning marks in the third vision component can be adjusted, thereby realizing the alignment of the multiple nozzles on the bonding head with the multiple bonding positions on the substrate, improving alignment efficiency and alignment accuracy.

[0019] (4) The hot-press bonding device based on multi-vision collaboration of the present invention has a first vision detection component including a camera module and a second reflector. The second reflector is used to realize a 90° bend in the optical path between the camera module and the transfer platform, so that the camera module can be installed horizontally below the transfer platform, saving the vertical installation space of the device.

[0020] (5) The multi-vision collaborative hot-press bonding method of the present invention first establishes a coordinate transformation relationship by aligning the first calibration point of the calibration transfer platform with the first / second vision components; then, the pick-up head, in conjunction with the dual vision, aligns the chip fifth positioning mark with the placement position sixth positioning mark to complete the precise loading of multiple chips on the transfer platform; subsequently, the bonding head executes the first compensation position information to achieve alignment between the bonding head and the placement position and batch pick up chips, while the second vision component records the alignment reference simultaneously; next, the third vision component completes the coordinate transformation through the second calibration point of the substrate, and the stage drives the substrate to execute the second compensation position information to achieve angular alignment between the substrate and the bonding head; finally, the bonding head carries the chips to move above the substrate, and the third vision component calculates the XY direction compensation offset between the substrate and the bonding head according to the alignment reference recorded by the second vision component, and the bonding head executes the XY direction compensation offset to achieve alignment between the bonding head and the substrate, and finally the bonding head hot-press bonds multiple chips onto the substrate at one time. The hot-press bonding method based on multi-vision collaboration of the present invention balances the bonding accuracy and efficiency of multi-chip one-time bonding, and has good application value and promotion prospects. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 is a schematic diagram of the overall structure of the thermocompression bonding device based on multi-vision collaboration in an embodiment of the present invention; Figure 2 is a schematic diagram of the placement alignment in an embodiment of the present invention; Figure 3 is a schematic diagram of the bonding alignment in an embodiment of the present invention; In all the figures, the same reference numerals indicate the same technical features, specifically: 1, stage; 2, transfer platform; 3, pickup head; 4, bonding head; 401, nozzle; 5, first vision component; 501, camera module; 502, second reflector; 6, second vision component; 7, third vision component; 8, substrate; 9, chip to be bonded; 10, first reflector; 11, reference plate; 12, translation guide rail; 13, first translation motor; 14, second translation motor; 15, first linear motor; 16, first rotary motor; 17, second linear motor; 18, second rotary motor. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0024] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0027] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0028] Example: Please refer to Figures 1 to 3. The hot-press bonding device based on multi-vision collaboration in the preferred embodiment of the present invention is used to bond multiple chips 9 to be bonded to a substrate 8 in one go. It includes a stage 1, a transfer platform 2, a pickup head 3, a bonding head 4, a first vision component 5, a second vision component 6, and a third vision component 7.

[0029] Specifically, the stage 1 is used to support the substrate 8, which has multiple bonding sites for bonding with the chip 9 to be bonded and a first positioning mark; the stage 1 can rotate around the Z-axis and move in space. In this embodiment, the stage 1 is provided with a driving component for driving the stage 1 to rotate around the Z-axis and move in space. In this invention, the X-axis, Y-axis, and Z-axis are perpendicular to each other, wherein the XY plane formed by the X-axis and Y-axis is a horizontal plane, and the Z-axis corresponds to the vertical direction.

[0030] Accordingly, the transfer platform 2 is provided with multiple placement positions corresponding one-to-one with each bonding position, and each placement position is used to place the chip 9 to be bonded; the transfer platform 2 is also provided with a second positioning mark corresponding to the first positioning mark. The transfer platform 2 is made of a transparent material to allow light to pass through. For example, the transfer platform 2 is made of glass. Further, the transfer platform 2 and the substrate 8 are spaced apart along a first direction, which is parallel to the XY plane. For example, the first direction can be the X-axis or the Y-axis. Preferably, each placement position of the transfer platform 2 has an adsorption hole at its bottom that communicates with a vacuum channel for adsorbing the chip 9 to be bonded.

[0031] Furthermore, the pick-up head 3 is used to pick up the chips 9 to be bonded and place them one by one on the placement positions of the transfer platform 2. The pick-up head 3 can move in space and rotate around the Z-axis. The bonding head 4 includes multiple nozzles 401 corresponding to each placement position. The bonding head 4 is used to pick up multiple chips 9 to be bonded on the transfer platform 2 and bond the multiple chips 9 to be bonded to the bonding positions of the substrate 8. Specifically, the bottom of the bonding head 4 is provided with a third positioning mark corresponding to the first positioning mark; the top of the bonding head 4 is provided with a reflector and a fourth positioning mark. The reflector reflects the fourth positioning mark to the top of the bonding head 4; and the bonding head 4 can move in space and rotate around the Z-axis. Preferably, the bonding head 4 has a built-in heating module and a pressure adjustment module. The heating module is used to raise the temperature of the bonding head 4 to the process set value, and the pressure adjustment module is used to apply precise bonding pressure to the chips 9 to be bonded.

[0032] Meanwhile, the first visual component 5 and the second visual component 6 are respectively disposed below and above the transfer platform 2; the third visual component 7 is disposed above the stage 1, and the imaging images of the third visual component 7 and the second visual component 6 are parallel and have no relative rotation angle; and a first calibration point is provided on the transfer platform 2 to map the image coordinate systems of the first visual component 5 and the second visual component 6 to the coordinate system of the transfer platform 2, thereby obtaining the coordinate transformation relationship between the two relative to the coordinate system of the transfer platform 2; a second calibration point is provided on the substrate 8 to transform the image coordinate system of the third visual component 7 to the coordinate system of the substrate 8.

[0033] The specific working process of the hot-press bonding device in this embodiment is as follows: First, the first vision component 5 and the second vision component 6 simultaneously focus on the first calibration point on the transfer platform 2, calibrating the coordinate transformation relationship between the image coordinate systems of the first vision component 5 and the second vision component 6 and the coordinate system of the transfer platform 2; then, the pickup head 3 picks up the chips 9 to be bonded one by one and places them in the placement positions on the transfer platform 2 until all placement positions are filled with the chips 9 to be bonded; next, the bonding head 4 moves into the field of view of the first vision component 5, the first vision component 5 collects the position information of the third positioning mark at the bottom of the bonding head 4, and the second vision component 6 collects the position information of the second positioning mark on the transfer platform 2; based on the first calibration point... The obtained coordinate transformation relationship is used to calculate the first compensation position information between the third positioning mark and the second positioning mark. The bonding head 4 adjusts all its nozzles 401 to precisely align with the placement positions of each part of the transfer platform 2 according to the first compensation position information, thereby picking up multiple chips 9 to be bonded on the transfer platform 2 at once. In this aligned state, the first reflector on the top of the bonding head 4 reflects the fourth positioning mark into the field of view of the second vision component 6. The second vision component 6 records the position information of the fourth positioning mark and the second positioning mark at this time, and the first vision component 5 records the position information of the third positioning mark at this time. Further, the third vision component 7 completes its own image coordinate system through the second calibration point on the substrate 8. The transformation to the coordinate system of substrate 8; since the imaging images of the third vision component 7 and the second vision component 6 are parallel and have no relative rotation angle, it is only necessary to adjust the position information of the first positioning mark on substrate 8 in the third vision component 7 to be completely consistent with the position information of the second positioning mark recorded by the second vision component 6, so as to achieve the angular alignment between the bonding position on substrate 8 and the placement position on transfer platform 2; the subsequent process is: the third vision component 7 collects the position information of the first positioning mark on substrate 8, and calculates the second supplementary position information by combining it with the position information of the second positioning mark recorded by the second vision component 6; the stage 1 moves to the position of the first positioning mark on substrate 8 in the third vision according to the second compensation position information. The position information in component 7 is completely consistent with the position of the second positioning mark recorded by the second vision component 6. At this time, the bonding position of the substrate 8 is at the same angle as the placement position of the transfer platform 2, and the angle is aligned with the nozzle 401 of the bonding head 4. Finally, the bonding head 4 carries multiple chips 9 to be bonded and moves to the field of view of the third vision component 7. The third vision component 7 collects the position information of the fourth positioning mark on the top of the bonding head 4, and calculates the XY direction compensation offset between the two by combining the position information of the fourth positioning mark recorded by the second vision component 6. The bonding head 4 adjusts the precise alignment of its nozzle 401 with the bonding position on the substrate 8 according to the XY direction compensation offset, and then simultaneously bonds multiple chips 9 to be bonded onto the substrate 8.

[0034] The first and second compensation position information in the above process both include XY direction compensation offset and angle compensation offset. The XY direction compensation offset is used to correct the translational deviation of the target object in the XY plane, and the angle compensation offset is used to correct the rotational deviation of the target object around the Z-axis. Specifically, the stage 1 translates in the XY plane and rotates around the Z-axis to complete the adjustment corresponding to the first compensation position information, and the bonding head 4 translates in the XY plane and rotates around the Z-axis to complete the adjustment corresponding to the second compensation position information.

[0035] For example, the first positioning mark is set at the center of multiple bonding positions on the substrate 8, the second positioning mark is set at the center of multiple placement positions on the transfer platform 2, and the third positioning mark is set at the center of multiple nozzles 401 at the bottom of the bonding head 4.

[0036] Preferably, the second vision component 6 is installed on the frame beam directly above the transfer platform 2, and the third vision component 7 is installed on the frame beam directly above the transfer platform 2; the second vision component 6 and the third vision component 7 are preferably fixedly installed on the same frame beam.

[0037] More preferably, as shown in Figure 2, a fifth positioning mark is provided on the side of the chip 9 to be bonded facing the transfer platform 2, and a sixth positioning mark corresponding to the fifth positioning mark is provided at each placement position on the transfer platform 2. The specific process of the pickup head 3 placing the chip 9 to be bonded on the transfer platform 2 is as follows: the pickup head 3 carries the chip 9 to be bonded and moves it to the field of view of the first vision component 5. The first vision component 5 collects the position information of the fifth positioning mark on the chip 9 to be bonded, and the second vision component 6 simultaneously collects the position information of the sixth positioning mark on the transfer platform 2. Based on the transformation relationship between the first vision, the second vision and the coordinate system of the transfer platform 2 obtained by previous calibration, the third compensation position information of the fifth positioning mark and the sixth positioning mark is calculated. The pickup head 3 adjusts according to the third compensation position information to ensure that the chip 9 to be bonded is precisely aligned with the target placement position, and finally the chip 9 to be bonded is precisely placed at the target placement position on the transfer platform 2.

[0038] Similarly, the third compensation position information also includes the XY direction compensation offset and the angle offset. The pickup head 3 translates in the XY axis plane and rotates around the Z axis to complete the adjustment corresponding to the third compensation position information.

[0039] Preferably, the first visual detection component includes a camera module 501 and a second reflector 502. The second reflector 502 is used to achieve a 90° bend in the optical path between the camera module 501 and the transfer platform 2, so that the camera module 501 can be installed horizontally below the transfer platform 2, saving vertical installation space of the device.

[0040] Preferably, the second reflector 502 is arranged at a 45° angle to the horizontal plane in the area below the transfer platform 2. The camera module 501 and the second reflector 502 are arranged at intervals along a second direction. The position of the second reflector 502 remains fixed, while the camera module 501 can move along the second direction, moving closer to or further away from the second reflector 502 to change the focal position of the camera module 501. The second direction is parallel to the XY plane; for example, as shown in Figure 2, the second direction can be the Y-axis.

[0041] For example, when the first vision component 5 calibrates its image coordinate system to the coordinate system of the transfer platform 2, the camera module 501 is adjusted to move along the second direction and focus on the first calibration point on the transfer platform 2. The light reflected from the first calibration point passes through the transfer platform 2 and is incident on the second reflector 502 at an angle of 45°. After being reflected by the second reflector 502, it enters the horizontally positioned camera module 501 along the second direction to form an image. When the first vision component 5 acquires the fifth positioning mark on the chip 9 to be bonded, the camera module 501 is adjusted to move along the second direction and focus on the bottom of the chip 9 to be bonded.

[0042] Preferably, the first reflector 10 is a 45° reflector, used to achieve a 90° bend in the optical path between the fourth positioning mark and the second vision component 6 and the third vision component 7. Specifically, the first reflector 10 is fixedly mounted on the top surface of the bonding head 4 at a 45° angle to the horizontal plane, and the fourth positioning mark and the second reflector 502 are arranged at intervals along a third direction, which is parallel to the XY plane. For example, as shown in FIG3, the third direction can be the Y-axis.

[0043] More preferably, the fourth positioning mark is disposed on the reference plate 11, and the distance between the reference plate 11 and the second reflector 502 is adjustable. Specifically, the reference plate 11 can move closer to or further away from the first reflector 10 along a third direction to adjust the fourth positioning mark to a suitable position, so that the second vision component 6 and the third vision component 7 can collect the position information of the fourth positioning mark through the first reflector 10 when the device is working.

[0044] Furthermore, the hot-press bonding apparatus of the present invention also includes a translation guide rail 12 extending along a first direction. The pickup head 3 and the bonding head 4 are respectively connected to the translation guide rail via a first translation motor 13 and a second translation motor 14. The two translation motors can respectively drive the pickup head 3 and the bonding head 4 to move along the translation guide rail 12.

[0045] Preferably, a first linear motor 15 and a first rotary motor 16 are provided between the translation motor and the pickup head 3; the first linear motor 15 is used to drive the pickup head 3 to move in a plane perpendicular to the first direction, and the first rotary motor 16 is used to drive the pickup head 3 to rotate around the Z-axis; a second linear motor 17 and a second rotary motor 18 are provided between the translation motor and the bonding head 4; the second linear motor 17 is used to drive the bonding head 4 to move in a plane perpendicular to the first direction, and the second rotary motor 18 is used to drive the bonding head 4 to rotate around the Z-axis.

[0046] In practical use, this invention also provides a multi-vision collaborative hot-press bonding method applied to the aforementioned hot-press bonding equipment, comprising the following steps: S1, the first vision component 5 and the second vision component 6 simultaneously focus on the first calibration point of the transfer platform 2, calibrating the coordinate transformation relationship between the image coordinate systems of the first vision component 5 and the second vision component 6 and the coordinate system of the transfer platform 2; S2, the pickup head 3 picks up the chips 9 to be bonded one by one and places them in the placement positions of the transfer platform 2 until all placement positions have completed the loading of the chips 9 to be bonded; S3, the bonding head 4 moves to the field of view of the first vision component 5. The first vision component 5 acquires the position information of the third positioning mark at the bottom of the bonding head 4, and the second vision component 6 acquires the position information of the second positioning mark on the transfer platform 2. Based on the coordinate transformation relationship in step S1, the first compensation position information of the third positioning mark and the second positioning mark is calculated. The bonding head 4 adjusts all its nozzles 401 to precisely align with each placement position on the transfer platform 2 according to the first compensation position information, and the bonding head 4 picks up all the chips 9 to be bonded at once. In this aligned state, the second vision component 6 acquires the fourth positioning mark reflected by the first mirror and records the position information of the fourth positioning mark and the second positioning mark at this time. In step S4, the third vision component 7 focuses on the substrate 8 and completes the transformation from its own image coordinate system to the substrate 8 coordinate system through the second calibration point on the substrate 8. The third vision component 7 acquires the position information of the first positioning mark on the substrate 8 and calculates the second compensation position information by combining it with the position information of the second positioning mark recorded by the second vision component 6 in step S3. The stage 1 is adjusted according to the second compensation position information until the position information of the first positioning mark on the substrate 8 in the third vision component 7 is consistent with the position information of the second positioning mark recorded by the second vision component 6 in step S3, thereby realizing the bonding of the substrate 8. The bonding head 4 is aligned with the angle of the placement position of the transfer platform 2; S5, the bonding head 4 carrying multiple chips 9 to be bonded moves to the field of view of the third vision component 7. The third vision component 7 collects the position information of the fourth positioning mark on the top of the bonding head 4, and calculates the XY direction compensation offset of the two by combining the position information of the fourth positioning mark recorded by the second vision component 6 in step S3; the bonding head 4 adjusts to the precise alignment of each of its nozzles 401 with each bonding position of the substrate 8 according to the XY direction compensation offset; the bonding head 4 performs a hot-press bonding action to bond multiple chips 9 to be bonded to the corresponding bonding positions of the substrate 8 at one time.

[0047] More preferably, a fifth positioning mark is provided on the side of the chip 9 to be bonded facing the transfer platform 2, and a sixth positioning mark corresponding to the fifth positioning mark is provided at each placement position of the transfer platform 2; step S2 includes the following process: S21, the pickup head 3 picks up the chip 9 to be bonded and moves it to the field of view of the first vision component 5, the first vision component 5 collects the position information of the fifth positioning mark on the side of the chip 9 to be bonded facing the transfer platform 2, and the second vision component 6 collects the position information of the sixth positioning mark at the target placement position of the transfer platform 2; based on the coordinate transformation relationship obtained in step S1, the third compensation position information of the fifth positioning mark and the sixth positioning mark is calculated; S22, the pickup head 3 adjusts the chip 9 to be bonded and the target placement position precisely according to the third compensation position information, and then precisely places the chip 9 to be bonded at the target placement position; S23, repeat steps S21 and S22 until all placement positions of the transfer platform 2 have completed the loading of the chip 9 to be bonded.

[0048] The multi-vision collaborative hot-press bonding device of this invention uses a pick-up head to pre-position multiple chips with high precision on a dedicated transfer platform. Then, the bonding head picks up these chips all at once and moves them to the bonding position for visual alignment before bonding. This fundamentally combines multiple single bonding processes into one, which can significantly improve the throughput and production efficiency of the equipment. At the same time, it reduces the number of reciprocating movements of the bonding head, creating favorable conditions for improving system accuracy and stability.

[0049] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A thermocompression bonding device based on multi-vision collaboration, characterized in that, The system includes a stage, a transfer platform, a pickup head, a bonding head, a first vision component, a second vision component, and a third vision component. The stage carries the substrate, which has multiple bonding positions and a first positioning mark. The stage is movable in space and can rotate around the Z-axis. The transfer platform has multiple placement positions corresponding to each bonding position for placing chips to be bonded. The transfer platform also has a second positioning mark corresponding to the first positioning mark. The transfer platform is made of a transparent material to allow light to pass through. The transfer platform and the substrate are spaced apart along a first direction. The pickup head is used to pick up the chips to be bonded. The bonding chips are placed one by one on the placement positions of the transfer platform; the pickup head can move in space and rotate around the Z-axis; the bonding head includes multiple nozzles corresponding one-to-one with each placement position, and the bonding head is used to pick up multiple chips to be bonded on the transfer platform and bond the multiple chips to be bonded to the bonding positions of the substrate; the bottom of the bonding head is provided with a third positioning mark corresponding to the first positioning mark; the top of the bonding head is provided with a first reflector and a fourth positioning mark, and the first reflector is used to reflect the fourth positioning mark to the top of the bonding head for acquisition by the second vision component and the third vision component; The bonding head can move in space and rotate around the Z-axis; the first vision component and the second vision component are respectively disposed below and above the transfer platform; the third vision component is disposed above the stage, and the imaging images of the third vision component and the second vision component are parallel and have no relative rotation angle; a first calibration point is provided on the transfer platform, which is used to map the image coordinate systems of the first vision component and the second vision component to the transfer platform coordinate system, thereby obtaining the coordinate transformation relationship between the two relative to the transfer platform coordinate system; a second calibration point is provided on the substrate, which is used to transform the image coordinate system of the third vision component to the substrate coordinate system.

2. The multi-vision collaborative thermocompression bonding device according to claim 1, characterized in that, The first visual inspection component includes a camera module and a second reflector. The second reflector is used to achieve a 90° bend in the optical path between the camera module and the transfer platform, so that the camera module can be horizontally positioned below the transfer platform.

3. The multi-vision collaborative thermocompression bonding device according to claim 1, characterized in that, The first reflector is a 45° reflector, used to achieve a 90° turn in the optical path between the fourth positioning mark and the second and third visual components.

4. The thermocompression bonding device based on multi-vision collaboration according to claim 1, characterized in that, The fourth positioning mark is set on the reference plate, and the distance between the reference plate and the second reflector is adjustable.

5. The thermocompression bonding device based on multi-vision collaboration according to claim 1, characterized in that, A fifth positioning mark is provided on the side of the chip to be bonded facing the transfer platform, and a sixth positioning mark corresponding to the fifth positioning mark is provided at each placement position of the transfer platform.

6. The multi-vision collaborative thermocompression bonding device according to claim 1, characterized in that, Each placement position on the transfer platform is equipped with an adsorption hole at the bottom for adsorbing the chip to be bonded.

7. The thermocompression bonding apparatus based on multi-vision collaboration according to any one of claims 1 to 6, characterized in that, Includes a translation guide rail extending along a first direction, wherein the pickup head and the bonding head are respectively connected to the translation guide rail via a first translation motor and a second translation motor, and the two translation motors can respectively drive the pickup head and the bonding head to move along the translation guide rail.

8. The multi-vision collaborative thermocompression bonding device according to claim 7, characterized in that, A first linear motor and a first rotary motor are provided between the translation motor and the pickup head; the first linear motor is used to drive the pickup head to move in a plane perpendicular to the first direction, and the first rotary motor is used to drive the pickup head to rotate around the Z-axis; a second linear motor and a second rotary motor are provided between the translation motor and the bonding head; the second linear motor is used to drive the bonding head to move in a plane perpendicular to the first direction, and the second rotary motor is used to drive the bonding head to rotate around the Z-axis.

9. A multi-vision collaborative hot-press bonding method, applied to the hot-press bonding equipment according to any one of claims 1 to 8, characterized in that, Includes the following steps: S1. The first and second vision components simultaneously focus on the first calibration point of the transfer platform, calibrating the coordinate transformation relationship between the image coordinate systems of the first and second vision components and the coordinate system of the transfer platform; S2. The pickup head picks up the chips to be bonded one by one and places them in the placement positions of the transfer platform until all placement positions have been filled with chips to be bonded; S3. The bonding head moves into the field of view of the first vision component, the first vision component collects the position information of the third positioning mark at the bottom of the bonding head, and the second vision component collects the position information of the second positioning mark on the transfer platform; Based on the coordinate transformation relationship in step S1, the first compensation position information of the third positioning mark and the second positioning mark is calculated; the bonding head adjusts all its nozzles to precisely align with each placement position of the transfer platform according to the first compensation position information, and the bonding head picks up all the chips to be bonded at once; in this aligned state, the second vision component collects the fourth positioning mark reflected by the first reflector and records the position information of the fourth positioning mark and the second positioning mark at this time; S4, the third vision component focuses on the substrate and completes the transformation from its own image coordinate system to the substrate coordinate system through the second calibration point on the substrate; The third vision component acquires the position information of the first positioning mark on the substrate, and calculates the second compensation position information by combining it with the position information of the second positioning mark recorded by the second vision component in step S3. The stage is adjusted according to the second compensation position information so that the position information of the first positioning mark on the substrate in the third vision component is consistent with the position information of the second positioning mark recorded by the second vision component in step S3, so as to achieve angular alignment between the substrate bonding position and the transfer platform placement position. In step S5, the bonding head carrying multiple chips to be bonded moves to the field of view of the third vision component. The third vision component acquires the position information of the fourth positioning mark on the top of the bonding head, and calculates the XY direction compensation offset between the two by combining it with the position information of the fourth positioning mark recorded by the second vision component in step S3. The bonding head is adjusted according to the XY direction compensation offset to ensure precise alignment between each nozzle and each bonding position on the substrate. The bonding head performs a hot-press bonding action to bond multiple chips to be bonded to the corresponding bonding positions on the substrate at one time.

10. The hot-press bonding method based on multi-vision collaboration according to claim 9, characterized in that, A fifth positioning mark is set on the side of the chip to be bonded facing the transfer platform, and a sixth positioning mark corresponding to the fifth positioning mark is set at each placement position on the transfer platform. Step S2 includes the following process: S21, the pickup head picks up the chip to be bonded and moves it into the field of view of the first vision component. The first vision component collects the position information of the fifth positioning mark on the side of the chip to be bonded facing the transfer platform, and the second vision component collects the position information of the sixth positioning mark at the target placement position on the transfer platform. Based on the coordinate transformation relationship obtained in step S1, the third compensation position information of the fifth positioning mark and the sixth positioning mark is calculated. S22, the pickup head is adjusted according to the third compensation position information to ensure that the chip to be bonded is precisely aligned with the target placement position, and then the chip to be bonded is accurately placed at the target placement position. S23, Steps S21 and S22 are repeated until all placement positions on the transfer platform have been loaded with the chip to be bonded.

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