Probe module, probe and medical imaging device

Abstract

The invention discloses a detector module, a detector and medical imaging equipment. The detector module comprises a photoelectric converter; an analog-to-digital conversion unit; the flexible circuit board comprises a detection connecting part and a component connecting part, the detection connecting part is arranged on one side of the photoelectric converter in the first direction and connected with the photoelectric converter, and the component connecting part is connected to at least one side edge of the detection connecting part in the second direction and extends away from the photoelectric converter in the first direction; the component connecting part comprises a plurality of connecting plate parts and at least one bending part, the plurality of connecting plate parts are arranged in a stacked mode in the second direction, every two adjacent connecting plate parts are connected through the corresponding bending part, and at least one connecting plate part is connected with at least one analog-to-digital conversion unit. According to the detector module, the flexible circuit board adopts a folding structure, so that the weldable element area of the flexible circuit board is increased, the material utilization rate is improved, and the signal receiving and processing requirements of a high-density photoelectric sensor are met.

Description

Technical Field

[0001] This invention relates to the field of medical device technology, and in particular to a detector module, a detector, and a medical imaging device. Background Technology

[0002] The detector is a core component of medical imaging equipment, and its performance directly determines image quality. Spatial resolution is a key indicator for measuring the image quality of equipment such as CT scanners. To improve this indicator, the industry generally adopts a high-density detector unit design with small pixels. This design allows for more pixel units to be arranged in the same space, enhancing the ability to identify subtle lesions and structures. However, it also introduces many technical challenges. The dramatic increase in the number of pixels brought about by high-density detector units not only requires more analog-to-digital converters to process signals but also significantly increases the output cable density of photoelectric converters, significantly increasing the wiring difficulty of the detector module. Currently, high-density detector modules in CT systems mostly use flexible circuit board designs, but the design requirements of small pixels are difficult to adapt to the limited space of the detector module, thus limiting the clinical application of detector modules in small-pixel CT systems. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a detector module whose flexible circuit board adopts a folded structure, increasing the area of ​​solderable components on the flexible circuit board, improving material utilization, and adapting to the signal reception and processing requirements of high-density photoelectric sensors.

[0004] The present invention also proposes a detector having the above-described detector module.

[0005] The present invention also proposes a medical imaging device having the above-mentioned detector.

[0006] According to a first aspect of the present invention, a detector module includes: a photoelectric converter; an analog-to-digital converter for converting analog signals into digital signals; and a flexible circuit board, the flexible circuit board including a detection connection portion and a component connection portion, the detection connection portion being disposed on one side of the photoelectric converter in a first direction and connected to the photoelectric converter, the component connection portion being connected to at least one side edge of the detection connection portion in a second direction, the first direction intersecting the second direction, the component connection portion including a plurality of connecting plate portions and at least one bending portion, two adjacent connecting plate portions being connected through the bending portion, and at least one connecting plate portion being connected to at least one analog-to-digital converter.

[0007] According to the detector module of the present invention, the flexible circuit board adopts a folded structure connecting the plate part and the bending part, which can produce a high-density, small-pixel detector module, increase the area of ​​solderable components on the flexible circuit board, improve material utilization, and adapt to the signal reception and processing requirements of high-density photoelectric sensors.

[0008] In some embodiments, one end of the component connection portion is connected to the detection connection portion, and the other end extends away from the photoelectric converter along the first direction, and a plurality of connection plates are stacked along the second direction.

[0009] In some embodiments, at least one of the bent portions is connected to one side edge of two adjacent connecting plate portions in a first direction, and / or at least one of the bent portions is connected to one side edge of two adjacent connecting plate portions in a third direction, wherein the first direction, the second direction, and the third direction intersect each other.

[0010] In some embodiments, at least one of the connection positions of the connecting plate portion and the bending portion is provided with a tear-resistant notch, which is arranged at the end of at least one end of the bending portion in the length direction to release stress at the end position of the bending portion.

[0011] In some embodiments, the detector module further includes: a reinforcing plate disposed between at least one pair of adjacent and stacked connecting plate portions, and the analog-to-digital conversion unit disposed on the side of the connecting plate portion facing away from the reinforcing plate in the second direction.

[0012] In some embodiments, the detector module further includes an adhesive member disposed between at least one pair of adjacent and stacked connecting plate portions, such that the two adjacent and stacked connecting plate portions are bonded together by the adhesive member.

[0013] In some embodiments, in at least one pair of adjacent and stacked connecting plate portions, the analog-to-digital conversion units arranged on the two connecting plate portions are spaced apart in a plane perpendicular to the stacking direction of the two connecting plate portions.

[0014] In some embodiments, one of the plurality of connecting plate portions is a first plate portion, one end of which is connected to one side edge of the detection connection portion in a second direction, and the other end extends away from the detection connection portion in the first direction. The remaining connecting plate portions are connected to the detection connection portion through the first plate portion and are arranged on one or both sides of the first plate portion in the second direction. The plurality of connecting plate portions includes a second plate portion, which is arranged on the side of the first plate portion in the second direction facing the other side edge of the detection connection portion. The at least one bending portion includes a first bending portion, and the first plate portion and the second plate portion are connected through the first bending portion. The first bending portion is connected on one side of the first plate portion and the second plate portion in a third direction, and / or the first bending portion is connected on the side of the first plate portion and the second plate portion away from the detection connection portion in the first direction.

[0015] In some embodiments, the plurality of connecting plate portions further include: a third plate portion disposed on the side of the first plate portion opposite to the second plate portion, the at least one bending portion including a second bending portion, the third plate portion being connected to the first plate portion via the second bending portion, the second bending portion and the first bending portion being located on different sides of the first plate portion.

[0016] In some embodiments, the plurality of connecting plate portions further include: a fourth plate portion disposed on the side of the third plate portion opposite to the first plate portion, the at least one bending portion including a third bending portion, the third plate portion and the fourth plate portion being connected by the third bending portion, the third bending portion and the second bending portion being located on different sides of the third plate portion.

[0017] In some embodiments, the flexible circuit board is a single-piece molded component.

[0018] According to a second aspect of the invention, a detector includes a support and a plurality of detector modules according to a first aspect of the invention, wherein at least two of the detector modules are arranged sequentially along a third direction and disposed on the support, and the first direction, the second direction and the third direction intersect each other.

[0019] According to the detector of the present invention, the flexible circuit board adopts a folded structure connecting the plate part and the bending part, which can be used to manufacture a high-density, small-pixel detector module, increase the area of ​​solderable components on the flexible circuit board, improve material utilization, and adapt to the signal reception and processing requirements of high-density photoelectric sensors.

[0020] According to a third aspect of the present invention, a medical imaging apparatus includes a scanning gantry, a radiation source, and a detector according to a second aspect of the present invention. The scanning gantry is formed with a scanning cavity for receiving a scanned object. The radiation source and the detector are respectively disposed on radial sides of the scanning cavity, and the radiation source and the detector are rotatable along the circumference of the scanning cavity.

[0021] According to the medical imaging device of the present invention, the flexible circuit board adopts a folded structure connecting the board part and the bending part, which can be used to manufacture high-density, small-pixel detector modules, increase the area of ​​solderable components on the flexible circuit board, improve material utilization, and adapt to the signal reception and processing requirements of high-density photoelectric sensors.

[0022] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the detector module according to Embodiment 1 of the present invention;

[0024] Figure 2 yes Figure 1 The diagram shows a cutting of a flexible circuit board on a flexible substrate roll. Figure 3 This is a schematic diagram of the detector module according to Embodiment 2 of the present invention; Figure 4 yes Figure 3 The front view of the detector module shown; Figure 5 yes Figure 3 The diagram shows a cutting of a flexible circuit board on a flexible substrate roll. Figure 6 This is a schematic diagram of the detector module according to Embodiment 3 of the present invention; Figure 7 yes Figure 6 Left view of the detector module shown; Figure 8 yes Figure 6 The diagram shows a cutting of a flexible circuit board on a flexible substrate roll. Figure 9 This is a schematic diagram of the detector module according to Embodiment 4 of the present invention; Figure 10 This is a schematic diagram of the structure of a medical imaging device scanning an object according to an embodiment of the present invention; Figure 11 yes Figure 10 A magnified view of point a, indicated by the middle circle.

[0025] Figure label: 1000, Detector Module; 100. Flexible circuit board; 10. Component connection parts; 11. Connecting plate; 111. First plate; 112. Second plate; 113. Third plate; 114. Fourth plate; 1101. First gap; 1102. Second gap; 1103. Third gap; 12. Bending section; 121. First bending section; 122. Second bending section; 123. Third bending section; 20. Detect the connection part; 200. Photoelectric converter; 300. Reinforcing plate; 400. Analog-to-digital converter unit; 2000, Flexible substrate roll; A10. Medical imaging equipment; A1. Scanning gantry; A2. Radiation source; A3. Detector; A4. Detector rotation path; A20, object to be scanned. Detailed Implementation

[0026] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0027] The following is for reference. Figures 1-11 A detector module 1000 according to an embodiment of the first aspect of the present invention is described.

[0028] like Figures 1-11 As shown, the detector module 1000 according to a first aspect embodiment of the present invention includes: a photoelectric converter 200, an analog-to-digital converter 400, and a flexible circuit board 100.

[0029] Specifically, the analog-to-digital converter 400 is used to convert analog signals into digital signals; the flexible circuit board 100 includes a detection connection portion 20 and a component connection portion 10, the detection connection portion 20 being disposed on the photoelectric converter 200 in a first direction (e.g., Figure 1 On one side of the vertical direction (in the middle), and connected to the photoelectric converter 200, the component connection part 10 is connected to the detection connection part 20 in the second direction (e.g., in the vertical direction). Figure 1 At least one edge on the left and right direction of the component (in the middle), the first direction intersects the second direction, the component connection part 10 includes a plurality of connecting plate parts 11 and at least one bending part 12, two adjacent connecting plate parts 11 are connected by the bending part 12, and at least one connecting plate part 11 is connected to at least one analog-to-digital conversion unit 400.

[0030] In some examples, such as Figure 1 As shown, the photoelectric converter 200 is rectangular in shape and is connected to the flexible circuit board 100 via soldering or other methods. Electrical signals are transmitted through the pads between the photoelectric converter 200 and the flexible circuit board 100 for signal acquisition by the detector module 1000. Specifically, it converts the received X-ray signal into an analog electrical signal, improving the accuracy of the detection signal. The analog-to-digital conversion unit 400 is a chip-like structure (e.g., an AD chip) and is fixed to the flexible circuit board 100 via soldering or other methods. The flexible circuit board 100 between the analog-to-digital conversion unit 400 and the photoelectric converter 200 has numerous printed wires, inputting the electrical signal of each pixel of the photoelectric converter 200 into the analog-to-digital conversion unit 400. This allows for the conversion of the analog signal output by the photoelectric converter 200 into a digital signal, achieving efficient analog-to-digital signal conversion.

[0031] In some examples, such as Figure 1 As shown, the detection connection portion 20 has a rectangular plate-like structure and is arranged on the lower side of the photoelectric converter 200. It achieves a stable electrical connection with the photoelectric converter 200 through welding or other methods, ensuring that the analog signal output by the photoelectric converter 200 can be transmitted to the flexible circuit board 100 without loss. The component connection portion 10 is connected to at least one edge of the detection connection portion 20 along the second direction. For example, there can be two component connection portions 10, such as... Figure 1 As shown, the two component connecting parts 10 are respectively connected to the left and right edges of the detection connecting part 20, or, the component connecting part 10 can be a single part, such as... Figure 9 As shown, the component connecting part 10 is connected to the left edge of the detection connecting part 20.

[0032] The connecting plate portion 11 is a flat, flexible structure, and the bending portion 12 is an arc-shaped flexible structure. Adjacent connecting plate portions 11 are bent 180° together via the bending portion 12. The bending portion 12 and the connecting plate portion 11 can be integrally formed. The number of connecting plate portions 11 can be flexibly set to two or more, and the corresponding number of bending portions 12 can be adjusted according to the number of connecting plate portions 11. Two adjacent connecting plate portions 11 are connected by one bending portion 12. The number of connecting plate portions 11 can be two, three, four, or more. For example, there can be two connecting plate portions 11, and each pair of connecting plate portions 11 requires one bending portion 12. This bending portion 12 can be configured as follows: Figure 3 As shown, it extends along the front-to-back direction and connects to the lower edge of the two connecting plate portions 11, or it can be like... Figure 6 As shown, it extends vertically and connects to the front edge of the two connecting plate portions 11. Alternatively, there may be four connecting plate portions 11, each with three corresponding bends 12. Adjacent connecting plate portions 11 are connected by one bend 12. The specific structure is as follows: Figure 1As shown.

[0033] In this embodiment, by setting the flexible circuit board 100 as a folded structure including a connecting plate portion 11 and a bending portion 12, the arrangement area of ​​solderable components can be effectively increased, and the number of arrangeable analog-to-digital conversion units 400 can be increased. The flexible circuit board 100 can be directly used to manufacture a high-density, small-pixel detector module 1000, which is adapted to the arrangement requirements of the high-density detector module 1000 for multiple analog-to-digital conversion units 400, making the data acquisition circuit structure of the detector module 1000 more compact and the bending arrangement method more flexible.

[0034] At least one analog-to-digital converter (ADC) unit 400 is connected to at least one connecting plate portion 11. For example, there may be one ADC unit 400 connected to one connecting plate portion 11, or multiple ADC units 400 connected to one connecting plate portion 11, or multiple connecting plate portions 11 may all be connected to ADC units 400. The ADC units 400 can be assembled onto the surface of the connecting plate portion 11 by means of welding or the like, which can realize the distributed arrangement of the ADC units 400 and signal splitting transmission, effectively reducing the wiring density of a single board and effectively reducing the signal transmission pressure of the flexible circuit board 100. The flexible circuit board 100 is connected to the photoelectric converter 200 through the detection connection portion 20 and to the ADC unit 400 through the component connection portion 10, which can efficiently realize the signal transmission between the photoelectric converter 200 and the ADC unit 400, and at the same time can flexibly adapt to the internal spatial layout of the detector module 1000, ensuring the stability of signal transmission.

[0035] It should be noted that the flexible circuit board 100 of the detector module 1000 is formed on a flexible substrate roll 2000. The substrate consists of a central polyimide film and copper foils bonded to both surfaces. The width of the roll is usually a fixed value. The flexible circuit board 100 undergoes multiple processes on the roll to form metal circuits, and is finally cut off to become an independent flexible circuit board 100. Because the flexible circuit board 100 is flexible, in order to prevent the flexible circuit board 100 from warping during the soldering of electronic components, and to avoid components detaching due to twisting of the flexible circuit board 100 after soldering, a reinforcing plate 300 needs to be attached to one side of the flexible circuit board 100 before the components are soldered. This means that only the other side of the flexible circuit board 100 can hold components.

[0036] In the detector A3 of the medical imaging device A10, the number of pixels is positively correlated with the number of analog-to-digital conversion units 400 and related components required; more pixels mean more components are needed. However, increasing the length of the flexible circuit board 100 to expand the component placement area presents a significant technical bottleneck: in the medical imaging device A10, such as... Figure 10 and Figure 11As shown, detector A3 rotates along a predetermined detector rotation path A4. Detector modules 1000 are vertically distributed within detector A3. During high-speed rotation, detector modules 1000 are subjected to a large tangential force. Increasing the length of the flexible circuit board 100 would increase the height of detector modules 1000, thus causing the top of detector modules 1000 to bear a greater tangential force during rotation. Therefore, the height of detector modules 1000 is limited. The area of ​​solderable components in the existing detector module 1000 solution is limited, which cannot meet the signal reception and processing requirements of higher-density photoelectric sensors.

[0037] The detector module 1000 of this embodiment, by setting the flexible circuit board 100 to a folded structure including a connecting plate portion 11 and a bending portion 12, can effectively increase the solderable area of ​​components on the flexible circuit board 100 without increasing the height of the detector module 1000. At the same time, it can also improve the material utilization rate of the flexible substrate roll 2000, ensure the manufacturing accuracy of the circuit of the flexible circuit board 100, and reduce material loss.

[0038] According to the detector module 1000 of the present invention, the flexible circuit board 100 adopts a folded structure of connecting plate portion 11 and bending portion 12, which can produce a high-density, small-pixel detector module 1000, increase the area of ​​solderable components of flexible circuit board 100, improve material utilization, and adapt to the signal reception and processing requirements of high-density photoelectric sensor.

[0039] In some embodiments of the present invention, such as Figure 1 As shown, one end of the component connecting portion 10 is connected to the detection connecting portion 20, and the other end extends away from the photoelectric converter 200 along a first direction, while multiple connecting plate portions 11 are stacked along a second direction. For example, as Figure 1 As shown, each of the left and right edges of the detection connection part 20 is connected to a component connection part 10. Both component connection parts 10 extend from top to bottom along the first direction, and each component connection part 10 is provided with four connection plates 11. The four connection plates 11 are stacked sequentially along the left and right direction, and adjacent connection plates 11 are connected by bending parts 12. By stacking multiple connection plates 11 along the second direction, the area of ​​solderable components in the component connection part 10 can be expanded without increasing the overall height of the detector module 1000 along the first direction. This allows the component connection part 10 to accommodate multiple sets of analog-to-digital conversion units 400, meeting the signal processing requirements of high-density detection units. At the same time, the stacked connection plates 11 form a compact structure, which can fit the limited installation space inside the detector module 1000, and can ensure that the analog-to-digital conversion units 400 on each connection plate 11 can achieve stable signal transmission with the photoelectric converter 200.

[0040] In some embodiments of the present invention, such as Figure 1and Figure 3 As shown, at least one bent portion 12 is connected to one side edge of two adjacent connecting plate portions 11 in a first direction. For example, as Figure 3 As shown, there is a bent portion 12 connected to the lower edge of two adjacent connecting plate portions 11. This bent portion 12 is connected to the lower edge of the first plate portion 111 and is located on the right side of the first plate portion 111, or, as... Figure 1 As shown, two bent portions 12 are connected to the lower edges of two adjacent connecting plate portions 11. One bent portion 12 is connected to the lower edge of the first plate portion 111 and located on the right side of the first plate portion 111, while the other bent portion 12 is connected to the lower edges of the other two adjacent connecting plate portions 11 and located on the left side of the first plate portion 111. By arranging the bent portions 12 on one side edge of two adjacent connecting plate portions 11 in the first direction, longitudinal bending of the connecting plate portions 11 can be achieved. After bending, each connecting plate portion 11 can be naturally stacked and arranged along the second direction, reducing the space occupied by the detector module 1000 and improving the adaptability of the flexible circuit board 100 and the overall structure of the detector module 1000.

[0041] In some embodiments of the present invention, such as Figure 1 and Figure 6 As shown, at least one bent portion 12 is connected to two adjacent connecting plate portions 11 in a third direction (e.g., Figure 1 On one side edge of the (front and rear directions) in the middle, the first direction, the second direction, and the third direction intersect each other. For example, there is a bend 12 connecting the front edge of two adjacent connecting plate portions 11, such as Figure 6 As shown, the bent portion 12 is connected to the front edge of the first plate portion 111 and is located on the side of the first plate portion 111 facing the detection connection portion 20, as shown in the figure. Figure 1 As shown, the bent portion 12 is connected to the front edge of the first plate portion 111 and is located on the side of the first plate portion 111 opposite to the detection connection portion 20. By arranging the bent portion 12 on the third-direction side edge of two adjacent connecting plate portions 11, the connecting plate portions 11 can be bent laterally. The bent connecting plate portions 11 can be naturally stacked and arranged along the second direction, reducing the space occupied by the detector module 1000 and improving the adaptability of the flexible circuit board 100 and the overall structure of the detector module 1000.

[0042] In this embodiment, the bending portion 12 is flexibly arranged on the edges of the connecting plate portion 11 in different directions, which can reasonably plan the bending path of the flexible circuit board 100. This not only enables the distributed arrangement of the analog-to-digital conversion unit 400, but also allows for flexible adjustment of the arrangement of each connecting plate portion 11 according to the actual required area of ​​the solderable components. At the same time, it effectively avoids spatial interference between the bending portion 12 and other components inside the detector module 1000.

[0043] In some examples, the connection between the bending portion 12 and the connecting plate portion 11 is a rounded transition structure. By setting this connection position as a rounded transition structure, sharp corner structures that are prone to stress concentration at the bend can be avoided. During the bending process of the flexible circuit board 100, bending stress can be effectively dispersed, preventing structural damage such as cracking and tearing at the connection position between the bending portion 12 and the connecting plate portion 11, thereby enhancing the overall robustness and structural stability of the flexible circuit board 100.

[0044] In some embodiments of the present invention, such as Figure 1 and Figure 6 As shown, at least one connecting plate portion 11 and the bending portion 12 are provided with a tear-resistant notch at the connection position. The tear-resistant notch is arranged at at least one end of the bending portion 12 in the length direction to release stress at the end position of the bending portion 12. For example, as Figure 6 As shown, a tear-resistant notch is provided at the connection position between the connecting plate portion 11 and the bending portion. This tear-resistant notch is located at the upper end of the bending portion 12, which extends in the vertical direction. For example, ... Figure 1 As shown, there are two connection positions between the connecting plate portion 11 and the bending portion 12, and two anti-tear notches are provided, which are respectively arranged at the upper end of the bending portion extending in the vertical direction and the front end of the bending portion extending in the front-back direction.

[0045] In this embodiment, the anti-tear notch can be an arc-shaped or other concave structure, which is correspondingly arranged in the end area where the bending stress of the bending part 12 is concentrated. It can effectively relieve the local stress generated during the bending process of the flexible circuit board 100 and avoid tearing damage at the connection position between the bending part 12 and the connecting plate part 11. At the same time, the setting of the anti-tear notch can make the bent connecting plate part 11 shrink inward into the detector module 1000, so that the analog-to-digital conversion unit 400 on the connecting plate part 11 can achieve stable signal transmission with the photoelectric converter 200.

[0046] In some embodiments of the present invention, such as Figure 4As shown, the detector module 1000 also includes a reinforcing plate 300, which is disposed between at least one pair of adjacent and stacked connecting plate portions 11. The analog-to-digital conversion unit 400 is disposed on the side of the connecting plate portion 11 facing away from the reinforcing plate 300 in a second direction. The reinforcing plate 300 can be made of a high-strength and high-rigidity material, and its size is adapted to the stacked area of ​​the connecting plate portion 11. It is fixedly connected to the connecting plate portion 11 by means of bonding or other methods, which can effectively enhance the structural strength of the stacked flexible circuit board 100 and avoid deformation problems such as warping and twisting of the flexible circuit board 100 during the welding process of the analog-to-digital conversion unit 400 and during operation, thus providing a stable welding foundation for the analog-to-digital conversion unit 400. By placing the analog-to-digital conversion unit 400 on the side facing away from the reinforcing plate 300, the weldable component areas of each connecting plate portion 11 can be independent and free from interference, which also facilitates subsequent inspection and maintenance operations.

[0047] In some embodiments of the present invention, such as Figure 1 As shown, the detector module 1000 further includes an adhesive component, which is disposed between at least one pair of adjacent and stacked connecting plate portions 11, so that the two adjacent and stacked connecting plate portions 11 are bonded together by the adhesive component. The adhesive component can be resin-based glue, sponge-based pad, double-sided adhesive tape, thermally conductive pad, etc., and is uniformly coated or laid between the mating surfaces of the connecting plate portions 11, so that the two adjacent stacked connecting plate portions 11 form a stable whole, preventing relative displacement between the connecting plate portions 11 during the operation of the detector module 1000, avoiding poor contact of the analog-to-digital conversion unit 400 on the flexible circuit board 100, and ensuring the stability of signal transmission.

[0048] In some embodiments of the present invention, such as Figure 1 As shown, in at least one pair of adjacent and stacked connecting plate portions 11, the analog-to-digital conversion units 400 arranged on the two connecting plate portions 11 are spaced apart in a plane perpendicular to the stacking direction of the two connecting plate portions. This spaced arrangement can adopt various layout forms such as vertical staggering or horizontal staggering, so that the analog-to-digital conversion units 400 on the two connecting plate portions 11 do not overlap in the projection plane. This can effectively disperse the heat generated by the analog-to-digital conversion units 400 during operation, avoid excessive local temperature leading to performance degradation of the analog-to-digital conversion units 400, improve heat dissipation efficiency and service life, and at the same time reduce electromagnetic interference between adjacent analog-to-digital conversion units 400, ensuring the accuracy and stability of signal transmission.

[0049] In some embodiments of the present invention, such as Figures 1-6As shown, one of the plurality of connecting plate portions 11 can be a first plate portion 111. One end of the first plate portion 111 is connected to one side edge of the detection connection portion 20 in the second direction, and the other end extends away from the detection connection portion 20 in the first direction. The remaining connecting plate portions 11 are connected to the detection connection portion 20 through the first plate portion 111 and are arranged on one or both sides of the first plate portion 111 in the second direction. The plurality of connecting plate portions 11 may include a second plate portion 112. The second plate portion 112 is arranged on the side of the first plate portion 111 facing the other side edge of the detection connection portion 20 in the second direction. At least one bending portion 12 includes a first bending portion 121. The first plate portion 111 and the second plate portion 112 are connected through the first bending portion 121. The first bending portion 121 is connected to the first plate portion 111 and the second plate portion 112 on the third side in the third direction, and / or the first bending portion 121 is connected to the first plate portion 111 and the second plate portion 112 on the side away from the detection connection portion 20 in the first direction.

[0050] In some examples, such as Figure 1 , Figure 3 and Figure 6 As shown, the first plate portion 111 is a rectangular sheet-like flexible structure. One end is connected to the detection connection portion 20 to receive signals, and the other end extends away from the photoelectric converter 200 to provide a basis for the arrangement of the remaining connection plate portions 11. The number of the remaining connection plate portions 11 can be one or more, arranged on one or both sides of the first plate portion 111 in the second direction. For example, the number of remaining connection plate portions 11 can be one. Figure 3 and Figure 6 As shown, the remaining connecting plate portions 11 are arranged on the side of the first plate portion 111 facing the photoelectric converter 200 in the second direction; or, the number of the remaining connecting plate portions 11 may be three, such as... Figure 1 As shown, one of the connecting plate portions 11 is arranged on the side of the first plate portion 111 facing the photoelectric converter 200 in the second direction, and the remaining two connecting plate portions 11 are arranged on the side of the first plate portion 111 facing away from the photoelectric converter 200 in the second direction.

[0051] In some examples, such as Figure 1 and Figure 6 As shown, the second plate portion 112 is a rectangular sheet-like flexible structure, which is attached to one side of the first plate portion 111 and forms a stacked structure, realizing a 180° bending and stacking of the first plate portion 111 and the second plate portion 112. One end of the second plate portion 112 is connected to the first plate portion 111 through the first bending portion 121, and is arranged on the side of the first plate portion 111 facing the detection connection portion 20, realizing signal transmission between the first plate portion 111 and the second plate portion 112, forming a signal transmission path of multiple connecting plate portions 11.

[0052] In some examples, such as Figure 6As shown, the first bending portion 121 connects to the first plate portion 111 and the second plate portion 112 on one side in the third direction, and extends along the first direction to realize the bending and stacking of the first plate portion 111 and the second plate portion 112. For example, the first bending portion 121 can be connected to the front or rear side of the first plate portion 111 and the second plate portion 112, such as... Figure 6 As shown, the first bent portion 121 is connected to the front edge of the first plate portion 111 and the second plate portion 112.

[0053] In some examples, such as Figure 1 and Figure 3 As shown, the first bent portion 121 connects the first plate portion 111 and the second plate portion 112 on the side opposite to the detection connection portion 20 in a first direction, and extends along a third direction to realize the bending and stacking of the first plate portion 111 and the second plate portion 112, for example, as Figure 1 and Figure 3 As shown, the first bent portion 121 is connected to the lower edge of the first plate portion 111 and the second plate portion 112.

[0054] In this embodiment, the first bending portion 121 is an arc transition structure, which ensures the flexibility of the flexible circuit board 100 when bending and enhances the structural strength. The first plate portion 111 and the second plate portion 112 are connected through the first bending portion 121, and the first bending portion 121 can be flexibly set on the edges of the connecting plate portion 11 in different directions according to actual needs, so as to rationally plan the bending path of the flexible circuit board 100. By setting the second plate portion 112 to connect with the first bending portion 121, the solderable area of ​​the flexible circuit board 100 can be increased without increasing the height of the detector module 1000, doubling the solderable area on the original basis. At the same time, the flexible connection of the first bending portion 121 makes the connection structure between the first plate portion 111 and the second plate portion 112 more robust, and the fit after bending is higher, effectively improving the overall structural compactness of the flexible circuit board 100. Moreover, the flexible arrangement of the first bending portion 121 can adapt to the internal spatial layout of the detector module 1000.

[0055] In some embodiments of the present invention, such as Figure 1 and Figure 2As shown, the plurality of connecting plate portions 11 may further include: a third plate portion 113, the third plate portion 113 being arranged on the side of the first plate portion 111 away from the second plate portion 112, at least one bending portion 12 including a second bending portion 122, the third plate portion 113 being connected to the first plate portion 111 through the second bending portion 122, the second bending portion 122 and the first bending portion 121 being located on different sides of the first plate portion 111. The third plate portion 113 is a rectangular sheet-like flexible structure, fitted to the side of the first plate portion 111 away from the second plate portion 112, and forming a double-sided stacked structure of the first plate portion 111 with the second plate portion 112, realizing a 180° bending stacking of the first plate portion 111 and the third plate portion 113, one end of the third plate portion 113 being connected to the first plate portion 111 through the second bending portion 122, and signal transmission with the detection connection portion 20 is realized through the first plate portion 111, forming a signal transmission path of the plurality of connecting plate portions 11.

[0056] The second bend 122 and the first bend 121 are located on different sides of the first plate portion 111. That is, if the first bend 121 is connected to the side of the first plate portion 111 facing the third direction, then the second bend 122 is connected to the other side of the first plate portion 111 facing the third direction, or connected to the side of the first plate portion 111 facing away from the detection connection portion 20 in the first direction. If the first bend 121 is connected to the side of the first plate portion 111 facing away from the detection connection portion 20 in the first direction, then the second bend 122 is connected to the side of the first plate portion 111 facing the third direction.

[0057] In some examples, such as Figure 1 As shown, the second bending portion 122 is located on one side of the first plate portion 111 and the third plate portion 113 in the third direction. The second bending portion 122 connects to the first plate portion 111 and the third plate portion 113 on the third direction, extending along the first direction to achieve the bending and stacking of the first plate portion 111 and the third plate portion 113. For example, the second bending portion 122 can connect to the front or rear side of the first plate portion 111 and the third plate portion 113, and is located on a different side of the first plate portion 111 from the first bending portion 121. Figure 1 As shown, the first bent portion 121 is connected to the lower side of the first plate portion 111, and the second bent portion 122 is connected to the front edge of the first plate portion 111 and the third plate portion 113.

[0058] In some examples, such as Figure 1As shown, the second bending portion 122 is located on the side of the first plate portion 111 and the third plate portion 113 opposite to the detection connection portion 20 in the first direction. The second bending portion 122 is connected to the side of the first plate portion 111 and the third plate portion 113 opposite to the detection connection portion 20 in the first direction, and extends along the third direction to realize the bending and stacking of the first plate portion 111 and the third plate portion 113. For example, the second bending portion 122 may be connected to the lower end edge of the first plate portion 111 and the third plate portion 113, and is located on different sides of the first plate portion 111 from the first bending portion 121.

[0059] In this embodiment, the second bending portion 122 adopts an arc transition structure, which not only ensures the flexibility of the flexible circuit board 100 in bending arrangement, but also enhances the structural strength. The first plate portion 111 and the third plate portion 113 are connected through the second bending portion 122. The second bending portion 122 can be flexibly set on the edges of the connecting plate portion 11 in different directions according to the actual space requirements of the detector module 1000, so as to rationally plan the bending path of the flexible circuit board 100 on both sides, expand the solderable area of ​​the flexible circuit board 100, and further double the solderable area to adapt to the higher density analog-to-digital conversion unit 400. At the same time, the flexible connection of the second bending portion 122 makes the connection structure between the first plate portion 111 and the third plate portion 113 more robust, and the fit after bending is higher, avoiding interference with other components inside the detector module 1000.

[0060] In some embodiments of the present invention, such as Figure 1 and Figure 2 As shown, the plurality of connecting plate portions 11 may further include: a fourth plate portion 114, the fourth plate portion 114 being arranged on the side of the third plate portion 113 away from the first plate portion 111, and at least one bending portion 12 including a third bending portion 123, the third plate portion 113 and the fourth plate portion 114 being connected by the third bending portion 123, the third bending portion 123 being located on a different side of the third plate portion 113 from the second bending portion 122. The fourth plate 114 is a rectangular sheet-like flexible structure, which is attached to the side of the third plate 113 away from the first plate 111, and forms a multi-level stacked structure with the first plate 111, the second plate 112, and the third plate 113, realizing a 180° bending stack between the third plate 113 and the fourth plate 114. One end of the fourth plate 114 is connected to the third plate 113 through the third bending part 123. The signal transmission with the detection connection part 20 is realized by the conduction of the third plate 113 and the first plate 111, thus improving the signal transmission path of the multi-connection plate 11.

[0061] The third bend 123 and the second bend 122 are located on different sides of the third plate portion 113. That is, if the second bend 122 is connected to the third plate portion 113 on the side facing the third direction, then the third bend 123 is connected to the other side facing the third direction of the third plate portion 113, or connected to the third plate portion 113 on one side in the first direction; if the second bend 122 is connected to the side of the third plate portion 113 facing away from the detection connection portion 20 in the first direction, then the third bend 123 is connected to the side facing the third direction of the third plate portion 113.

[0062] In some examples, such as Figure 1 As shown, the third bending portion 123 is connected to the third plate portion 113 and the fourth plate portion 114 on one side in the third direction, and extends along the first direction to realize the bending and stacking of the third plate portion 113 and the fourth plate portion 114. For example, the third bending portion 123 can be connected to the front or rear side of the third plate portion 113 and the fourth plate portion 114, and is located on different sides of the third plate portion 113 from the second bending portion 122.

[0063] In some examples, such as Figure 1 As shown, the third bend 123 is connected to one side of the third plate portion 113 and the fourth plate portion 114 in the first direction, and extends along the third direction to realize the bending and stacking of the third plate portion 113 and the fourth plate portion 114. For example, the third bend 123 can be connected to the upper or lower side of the third plate portion 113 and the fourth plate portion 114, such as... Figure 1 As shown, the third bend 123 can be connected to the lower edge of the third plate 113 and the fourth plate 114, and the second bend 122 is arranged on the front edge of the third plate 113. The third bend 123 and the second bend 122 are located on different sides of the third plate 113.

[0064] In this embodiment, the third bend 123 adopts an arc transition structure, which not only ensures the flexibility of the flexible circuit board 100 in bending arrangement, but also enhances the structural strength. The third bend 123 can be flexibly set at the edges of the connecting plate 11 in different directions according to the actual space requirements of the detector module 1000, thereby rationally planning the multi-layer bending path of the flexible circuit board 100. By connecting the fourth plate 114 to the third bend 123, the solderable area of ​​the flexible circuit board 100 can be expanded, further doubling the solderable area, adapting to the high-density analog-to-digital converter 400. At the same time, the flexible connection of the third bend 123 makes the connection structure between the third plate 113 and the fourth plate 114 more robust, resulting in a higher fit after bending, effectively improving the overall structural stability and spatial compactness of the flexible circuit board 100, and avoiding interference with other components inside the detector module 1000.

[0065] In some embodiments of the present invention, such as Figure 2As shown, the flexible circuit board 100 can be a single-piece molded component. The connecting plates 11 and bending portions 12 of the detection connection portion 20 and component connection portion 10 are integrated into a single unit without seams. The flexible circuit board 100 can be made of flexible materials such as polyimide or polyester film, with copper plating on the surface to form signal lines. By making the flexible circuit board 100 a single-piece molded component, the structural integrity and robustness of the flexible circuit board 100 can be improved, preventing signal transmission failures or structural breaks at the joints of the connecting plates 11 and bending portions 12. Simultaneously, the single-piece molding process of the flexible circuit board 100 ensures the accuracy of the circuitry, reduces signal transmission loss, and improves signal processing efficiency. Furthermore, the single-piece molded flexible circuit board 100 is easier to process and assemble, simplifying production and assembly processes and improving production efficiency.

[0066] In some embodiments of the present invention, such as Figure 4 As shown, the detector module 1000 may further include: a first reinforcing plate, disposed between the first plate portion 111 and the second plate portion 112, both the first plate portion 111 and the second plate portion 112 being connected to the first reinforcing plate; and analog-to-digital conversion units 400 disposed on the first plate portion 111 and the second plate portion 112 respectively disposed on the side of the first plate portion 111 and the second plate portion 112 opposite to the first reinforcing plate in a second direction. The first reinforcing plate is a rectangular plate structure, which may be made of FR4 sheet material, metal sheet material, fiberglass sheet material, etc. The size of the first reinforcing plate is adapted to the stacked area of ​​the first plate portion 111 and the second plate portion 112, and it can be connected to the first plate portion 111 and the second plate portion 112 by means of bonding, etc. The analog-to-digital conversion units 400 are welded to the opposite outer surfaces of the first plate portion 111 and the second plate portion 112, without interfering with each other. The first reinforcing plate mentioned in this embodiment is the aforementioned reinforcing plate 300.

[0067] By setting a first reinforcing plate between the first plate portion 111 and the second plate portion 112, the structural strength of the first plate portion 111 and the second plate portion 112 after being stacked can be effectively enhanced, the structural strength of the flexible circuit board 100 after bending can be enhanced, a stable welding foundation can be provided for the analog-to-digital conversion unit 400, and the flexible circuit board 100 can be prevented from warping or twisting during welding and operation, and the analog-to-digital conversion unit 400 can be prevented from detaching or making poor contact. In addition, by arranging the analog-to-digital conversion unit 400 on the outer side opposite to the first plate portion 111 and the second plate portion 112, the analog-to-digital conversion unit 400 can have an independent welding and working space, which is convenient for installation and heat dissipation, and avoids signal interference.

[0068] In some embodiments of the present invention, such as Figure 6 and Figure 7As shown, the first bend 121 can be connected to the first plate 111 and the second plate 112 on the third-direction side. A first notch 1101 is provided at the connection point between the first plate 111 and the first bend 121. The first notch 1101 is located at the end of the first bend 121 facing the probe connection portion 20. For example, as... Figure 7 As shown, the first notch 1101 can be an arc-shaped or other concave structure. The first notch 1101 mentioned in this embodiment is the aforementioned tear-resistant notch.

[0069] In this embodiment, when the first plate portion 111 and the second plate portion 112 of the flexible circuit board 100 have right angles at the bending edges, the flexible circuit board 100 is under stress after bending, and the right angle is prone to tearing. By setting the first notch 1101, the stress generated when the first bending portion 121 is bent can be effectively released, avoiding tearing at the corner and improving the service life of the flexible circuit board 100. At the same time, the first notch 1101 can make the second plate portion 112 retract closer to the side facing the detection connection portion 20 in the second direction when bending, ensuring that the flexible circuit board 100 will not interfere with the adjacent detector module 1000.

[0070] In some examples, such as Figure 7 As shown, the first notch 1101 can be formed by a third-direction recess from one side edge of the first plate portion 111, and the side wall of the first notch 1101 facing away from the detection connection portion 20 is flush with the end edge of the first bent portion 121 facing the detection connection portion 20. For example, as Figure 7 As shown, the first notch 1101 can be recessed from the front edge of the first plate portion 111 to the rear. The lower sidewall of the first notch 1101 is flush with the upper edge of the first bent portion 121, forming a smooth transition. The connection end of the first notch 1101 and the first bent portion 121 is adapted to each other and does not affect the bending action of the first bent portion 121. The connection position of the first notch 1101 and the first bent portion 121 forms a smooth connection, which can effectively avoid local stress concentration caused by structural misalignment and protruding edges, and optimize the stress dispersion effect. At the same time, the sidewall of the first notch 1101 and the edge of the first bent portion 121 remain flush, which can ensure the connection fit between the bent portion 12 and the connecting plate portion 11, ensure the structural compactness of the stacked arrangement of each connecting plate portion 11, and not occupy additional internal space of the detector module 1000, thus maintaining the space utilization rate of the folded structure of the flexible circuit board 100.

[0071] In some embodiments of the present invention, such as Figure 1 and Figure 2As shown, the second bend 122 can be located on one side of the first plate 111 and the third plate 113 in the third direction, and the third bend 123 is located on the side of the third plate 113 and the fourth plate 114 away from the detection connection 20 in the first direction. A second notch 1102 is provided at the connection position between the first plate 111 and the second bend 122, and the second notch 1102 is located at the ends of both ends of the second bend 122 in the first direction. A third notch 1103 is provided at the connection position between the third plate 113 and the third bend 123, and the third notch 1103 is located at the end of the third bend 123 facing the second bend 122. The second notch 1102 and the third notch 1103 mentioned in this embodiment are the aforementioned tear-resistant notches.

[0072] In some examples, such as Figure 1 As shown, the second bend 122 is located on the front side of the first plate portion 111 and the third plate portion 113, and the third bend 123 is located on the lower side of the third plate portion 113 and the fourth plate portion 114, as... Figure 2 As shown, the second notch 1102 can be formed by indenting inward from the side edge where the first plate portion 111 is connected to the second bent portion 122, and the third notch 1103 can be formed by indenting inward from the side edge where the third plate portion 113 is connected to the third bent portion 123.

[0073] In this embodiment, during the bending process of the multilayer connecting plate portion 11 of the flexible circuit board 100, when the connecting plate portion 11 has a right-angle structure at the bending edge, the connection position between the connecting plate portion 11 and the bending portion 12 is easily torn due to stress concentration. The second notch 1102 and the third notch 1103 can be concave structures such as arcs, and are integrally formed with the corresponding connecting plate portion 11, which can act on the area where bending stress is concentrated. By setting the second notch 1102, the stress generated when the second bending portion 122 is bent can be effectively released, avoiding tearing at the connection corner between the first plate portion 111 and the third plate portion 113. At the same time, it causes the third plate portion 113 to shrink inward toward the detector module 1000 when bending. The third notch 1103 can specifically release the stress generated when the third bending portion 123 is bent, preventing cracking at the connection position between the third plate portion 113 and the fourth plate portion 114, and making the bending area of ​​the fourth plate portion 114 closer to the detector module 1000.

[0074] In some examples, such as Figure 1 As shown, the second notch 1102 can be formed by recessing one side edge where the first plate portion 111 connects to the second bent portion 122. In the first direction, the side walls of the two second notches 1102 facing the second bent portion 122 are respectively flush with the end edges of the two ends of the second bent portion 122. For example, as Figure 1As shown, the second notch 1102 is adapted to the connecting end of the second bend 122, and does not affect the bending action of the second bend 122. The connection position of the second notch 1102 and the second bend 122 forms a smooth connection, which can effectively avoid local stress concentration caused by structural misalignment and protruding edges, and optimize the stress dispersion effect. At the same time, the sidewall of the second notch 1102 is flush with the end edge of the second bend 122, which can not only ensure the fit between the bend 12 and the connecting plate 11, but also enhance the structural strength of the bend connection, and avoid local damage caused by uneven force during bending.

[0075] In some embodiments of the present invention, such as Figure 2 As shown, the detector module 1000 may further include: a second reinforcing plate, which is disposed between the third plate portion 113 and the fourth plate portion 114. Both the third plate portion 113 and the fourth plate portion 114 are connected to the second reinforcing plate. Analog-to-digital conversion units 400 located on the third plate portion 113 and the fourth plate portion 114 are respectively disposed on the side of the third plate portion 113 and the fourth plate portion 114 away from the second reinforcing plate in a second direction. The second reinforcing plate is a rectangular plate structure and can be made of materials such as FR4 sheet, metal sheet, or fiberglass sheet. The size of the second reinforcing plate is adapted to the stacked area of ​​the third plate portion 113 and the fourth plate portion 114, and it can be connected to the third plate portion 113 and the fourth plate portion 114 by means of bonding or other methods. The analog-to-digital conversion units 400 are welded to the outer surfaces of the third plate portion 113 and the fourth plate portion 114 away from each other, without interfering with each other. The second reinforcing plate mentioned in this embodiment is the aforementioned reinforcing plate 300.

[0076] By setting a second reinforcing plate between the third plate portion 113 and the fourth plate portion 114, the structural strength of the stacked third plate portion 113 and the fourth plate portion 114 can be effectively enhanced, further improving the overall structural stability of the flexible circuit board 100. This provides a solid welding foundation for the analog-to-digital conversion unit 400, preventing the flexible circuit board 100 from warping or twisting during welding and operation, and preventing components from detaching or making poor contact. In addition, arranging the analog-to-digital conversion unit 400 on the outer side opposite to the third plate portion 113 and the fourth plate portion 114 allows the analog-to-digital conversion unit 400 to have an independent welding and working space, facilitating installation, inspection and maintenance, avoiding signal interference, and ensuring the working stability and signal conversion accuracy of the analog-to-digital conversion unit 400.

[0077] In some embodiments of the present invention, such as Figure 1As shown, an adhesive component is disposed between the first plate portion 111 and the third plate portion 113, and the first plate portion 111 and the third plate portion 113 are bonded together by the adhesive component. The adhesive component can be resin-based glue, sponge-based pad, double-sided adhesive tape, thermally conductive pad, etc., and is evenly coated or laid between the mating surfaces of the first plate portion 111 and the third plate portion 113 to achieve a firm bond between the first plate portion 111 and the third plate portion 113. By using the adhesive component to bond the first plate portion 111 and the third plate portion 113 together, the multi-layered flexible circuit board 100 can form a stable whole, preventing relative displacement between the connecting plates 11 and improving the structural stability of the flexible circuit board 100.

[0078] In some embodiments of the present invention, such as Figure 1 As shown, in the projection plane perpendicular to the second direction, the analog-to-digital conversion unit 400 arranged on the first plate 111 can be spaced apart from the analog-to-digital conversion unit 400 arranged on the third plate 113. Specifically, the analog-to-digital conversion units 400 can be arranged in a staggered vertical or horizontal layout, with no overlap between the units on the first plate 111 and the third plate 113 in the projection plane, forming a staggered arrangement, for example... Figure 1 As shown, if the analog-to-digital converter (ADC) unit 400 on the first board portion 111 is arranged on the upper side, the corresponding ADC unit 400 on the third board portion 113 is arranged on the lower side; or, if the ADC unit 400 on the first board portion 111 is arranged on the left side, the corresponding ADC unit 400 on the third board portion 113 is arranged on the right side. This spaced arrangement avoids heat concentration between the ADC units 400, distributing heat across different areas of the flexible circuit board 100, improving overall heat dissipation, and preventing performance degradation due to excessively high local temperatures. Simultaneously, the spaced arrangement reduces electromagnetic interference between the ADC units 400, improving signal transmission accuracy and stability, and enhancing the operational stability of the detector module 1000.

[0079] The following is for reference. Figure 10 and Figure 11 The detector A3 according to a second aspect embodiment of the present invention is described.

[0080] like Figure 10 and Figure 11 As shown, the detector A3 according to the second aspect embodiment of the present invention includes a bracket and a plurality of detector modules 1000 according to the first aspect embodiment of the present invention described above. At least two detector modules 1000 are arranged sequentially along a third direction and disposed on the bracket, with the first direction, the second direction and the third direction intersecting each other.

[0081] In some examples, such as Figure 10As shown, the bracket possesses excellent structural strength and thermal conductivity, and can be made of metal. At least two detector modules 1000 are arranged sequentially along a third direction and securely mounted on the bracket. The bracket is positioned in close contact with the analog-to-digital conversion unit 400 of the detector module 1000, enabling rapid conduction and dissipation of heat generated by the analog-to-digital conversion unit 400 during operation. This prevents localized overheating that could lead to performance degradation or shortened lifespan of the analog-to-digital conversion unit 400. By setting up the bracket, a stable mounting foundation is provided for multiple detector modules 1000, ensuring the detection stability of detector A3. Furthermore, the bracket's excellent thermal conductivity enables efficient heat dissipation, maintaining the analog-to-digital conversion unit 400 within a suitable temperature environment. This ensures the accuracy and reliability of signal conversion, thereby guaranteeing the overall detection performance and lifespan of detector A3.

[0082] According to the detector A3 of the present invention, the flexible circuit board 100 adopts a folded structure with a connecting plate portion 11 and a bending portion 12, which can produce a high-density, small-pixel detector module 1000, increase the area of ​​solderable components of the flexible circuit board 100, improve material utilization, and adapt to the signal reception and processing requirements of high-density photoelectric sensors.

[0083] The following is for reference. Figure 10 and Figure 11 A medical imaging device A10 according to an embodiment of a third aspect of the present invention is described.

[0084] like Figure 10 and Figure 11 As shown, a medical imaging device A10 according to a third aspect embodiment of the present invention includes a scanning frame A1, a radiation source A2, and a detector A3 according to the second aspect embodiment of the present invention described above. The scanning frame A1 is formed with a scanning cavity for receiving a scanning object A20. The radiation source A2 and the detector A3 are respectively disposed on the radial sides of the scanning cavity, and the radiation source A2 and the detector A3 are rotatable along the circumference of the scanning cavity.

[0085] In some examples, such as Figure 10 As shown, the medical imaging device A10, by incorporating the aforementioned high-density detector A3, and utilizing the folded structure of the flexible circuit board 100 in the detector module 1000 and the signal splitting transmission design, improves the spatial resolution of the imaging while ensuring the stability and accuracy of signal transmission through the use of small-pixel high-density detection units. The radiation source A2 and detector A3 can perform omnidirectional, blind-spot-free scanning of the object A20, reducing detection blind spots and improving the integrity and accuracy of tomographic imaging.

[0086] According to the medical imaging device A10 of the present invention, the flexible circuit board 100 adopts a folded structure of connecting plate portion 11 and bending portion 12, which can be used to manufacture a high-density, small-pixel detector module 1000, increase the area of ​​solderable components of the flexible circuit board 100, improve material utilization, and adapt to the signal reception and processing requirements of high-density photoelectric sensors.

[0087] The following will refer to Figures 1-11 The medical imaging device A10 of the present invention is described in four specific embodiments.

[0088] Example 1, Reference Figure 1 and Figure 10 The medical imaging device A10 includes: a scanning frame A1, a radiation source A2, and a detector A3. The scanning frame A1 has a cylindrical hollow scanning cavity. The detector A3 includes: a support and multiple detector modules 1000. The detector module 1000 includes: a photoelectric converter 200, an analog-to-digital converter 400, a flexible circuit board 100, a first reinforcing plate, a second reinforcing plate, and an adhesive.

[0089] Specifically, such as Figure 1 and Figure 2 As shown, the flexible circuit board 100 is an integrally formed flexible structure, including a detection connection part 20 and a component connection part 10. The component connection part 10 is composed of a first plate part 111, a second plate part 112, a third plate part 113, a fourth plate part 114, a first bending part 121, a second bending part 122, and a third bending part. The connection positions of the first plate part 111 and the first bending part 121, the first plate part 111 and the second bending part 122, and the third plate part 113 and the third bending part 123 are respectively provided with a first notch 1101, a second notch 1102, and a third notch 1103, all of which are arc-shaped recessed structures.

[0090] like Figure 1 As shown, the photoelectric converter 200 is a rectangular sheet structure, which is fixed to the upper surface of the detection connection part 20 by welding to achieve stable transmission of electrical signals. The analog-to-digital conversion unit 400 is a square chip structure.

[0091] like Figure 1 As shown, the first reinforcing plate and the second reinforcing plate are both rectangular rigid plates made of FR4 material, and are respectively bonded between the first plate part 111 and the second plate part 112, and between the third plate part 113 and the fourth plate part 114. The adhesive is resin glue, which is evenly applied between the mating surfaces of the first plate part 111 and the third plate part 113.

[0092] Example 2, like Figure 3As shown, the structure of this embodiment is roughly the same as that of Embodiment 1, with the same components using the same reference numerals. The only difference is that the plurality of connecting plate portions 11 in Embodiment 1 include: a first plate portion 111, a second plate portion 112, a third plate portion 113, and a fourth plate portion 114, while the plurality of connecting plate portions 11 in this Embodiment 2 include: a first plate portion 111 and a second plate portion 112.

[0093] Specifically, the first bending portion 121 makes the first plate portion 111 and the second plate portion 112 tightly stacked together, with only one first reinforcing plate filling between them, so that the outer surfaces of both plate portions can become areas for weldable components, thus meeting the basic multi-modal conversion unit 400 arrangement requirements.

[0094] The flexible circuit board 100 structure in this embodiment doubles the area of ​​solderable components without increasing the height of the detector module 1000 by lengthening and folding the design. The structure is simpler and the assembly is easier. Only a reinforcing plate 300 is added to the flexible circuit board 100 to increase the thickness of the flexible circuit board 100, which reduces the structural intrusion of the bracket and makes it suitable for the space-constrained assembly scenario of the detector A3.

[0095] Example 3, like Figure 6 As shown, the structure of this embodiment is roughly the same as that of embodiment two, with the same components using the same reference numerals. The only difference is that the first bending portion 121 described in embodiment one is arranged on the side of the first plate portion 111 away from the photoelectric converter 200 in the first direction and extends along the third direction, while the first bending portion 121 described in this embodiment three is arranged on the side of the first plate portion 111 in the third direction and extends along the first direction. This embodiment two also provides a first notch 1101.

[0096] Specifically, the first plate portion 111, the first bent portion 121, and the second plate portion 112 are components of a single flexible circuit board 100. The first bent portion 121 is arranged on the third-direction side of the first plate portion 111 and extends along the first direction. The first notch 1101 is arranged at the connection position between the first plate portion 111 and the first bent portion 121 and is close to one end of the photoelectric converter 200. It is recessed from the front edge of the first plate portion 111 to the rear side. The lower side wall of the first notch 1101 is flush with the upper edge of the first bent portion 121 and forms a smooth transition.

[0097] The flexible circuit board 100 in this embodiment doubles the area of ​​solderable components without increasing the height of the detector module 1000 by expanding the area laterally and folding the design. The flexible substrate roll 2000 of the same length has a larger effective area. The first notch 1101 can release bending stress and avoid tearing at the corner. At the same time, it shrinks the bending area to ensure that it will not interfere with the adjacent detector module 1000, thus balancing structural reliability and splicing flexibility.

[0098] Example 4, like Figure 9 As shown, the structure of this embodiment is roughly the same as that of Embodiment 1, with the same components using the same reference numerals. The only difference is that in Embodiment 1, there are two component connecting parts 10, which are connected to the left and right edges of the detection connecting part 20 and extend downwards, respectively. In this Embodiment 4, there is only one component connecting part 10, which is connected to one side edge of the detection connecting part 20 and extends downwards.

[0099] Specifically, the flexible circuit board 100 structure in this embodiment is adapted to the usage requirements of the single-sided component connection portion 10 when the detector module 1000 has only one side with space for the installation of the flexible circuit board 100. Without increasing the height of the detector module 1000, the area of ​​solderable components can still be doubled through the multi-board folding design, and the single-sided extended structure will not interfere with other components inside the detector module 1000, thus balancing spatial adaptability and detection performance.

[0100] The working process of the medical imaging device A10 in the above embodiment is described in detail below.

[0101] In use, the object to be scanned, A20, enters the scanning cavity of the scanning frame A1. The drive motor starts, causing the radiation source A2 and the detector A3 to rotate synchronously around the circumference of the scanning cavity. The radiation source A2 emits rays into the scanning cavity. After passing through the object to be scanned, the rays are received by the photoelectric converter 200 of the detector A3. The photoelectric converter 200 converts the ray signal into an analog electrical signal and transmits the analog signal to the component connection part 10 through the detection connection part 20 of the flexible circuit board 100. The analog signal is transmitted to the first plate part 111, the second plate part 112, the third plate part 113, and the fourth plate part 114 through the detection connection part 20. The analog-to-digital conversion unit 400 on each connection plate part 11 synchronously converts the received analog signal into a digital signal. Since the analog-to-digital conversion units 400 are arranged at intervals, the heat generated during operation is transferred to the support through the flexible circuit board 100 and dissipated to the outside through the heat dissipation fins of the support, avoiding heat concentration. Each bend 12 of the flexible circuit board 100 releases stress through the first notch 1101, the second notch 1102, and the third notch 1103, ensuring the stability of signal transmission. Simultaneously, each connecting plate 11 forms a stable whole through the first reinforcing plate, the second reinforcing plate, and the adhesive, preventing component detachment or circuit breakage due to vibration caused by the rotation of the detector A3. The detector A3 transmits the converted digital signal to the back-end processing system of the medical imaging device A10. The back-end processing system generates a tomographic image of the scanned object A20 based on the digital signal, completing the scanning imaging process.

[0102] According to the medical imaging device A10 of the present invention, by setting the flexible circuit board 100 including the detection connection part 20 and the component connection part 10 of the multi-board layer, and cooperating with the bending part 12 to realize the folding design of the flexible circuit board 100, the area of ​​solderable components is effectively increased without increasing the height of the detector module 1000, which adapts to the arrangement requirements of the multi-modal conversion unit 400 of the high-density detection unit. At the same time, the bending stress is released by the first notch 1101, the second notch 1102 and the third notch 1103, and the first reinforcing plate, the second reinforcing plate and the adhesive are set to improve the structural stability of the flexible circuit board 100, improve the problem of insufficient solderable area, and take into account both the improvement of the spatial resolution of the detector A3 and the compactness of the structure.

[0103] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0104] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0105] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0106] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0107] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A detector module (1000), characterized in that, include: Photoelectric converter (200); Analog-to-digital converter (400) is used to convert analog signals into digital signals; A flexible circuit board (100) includes a detection connection portion (20) and a component connection portion (10). The detection connection portion (20) is disposed on one side of the photoelectric converter (200) in a first direction and is connected to the photoelectric converter (200). The component connection portion (10) is connected to at least one side edge of the detection connection portion (20) in a second direction. The first direction intersects the second direction. The component connection portion (10) includes a plurality of connecting plate portions (11) and at least one bending portion (12). Two adjacent connecting plate portions (11) are connected through the bending portion (12). At least one connecting plate portion (11) is connected to at least one analog-to-digital conversion unit (400).

2. The detector module (1000) according to claim 1, characterized in that, One end of the component connecting part (10) is connected to the detection connecting part (20), and the other end extends away from the photoelectric converter (200) along the first direction, and a plurality of connecting plate parts (11) are stacked along the second direction.

3. The detector module (1000) according to claim 1, characterized in that, At least one of the bent portions (12) is connected to one side edge of two adjacent connecting plate portions (11) in a first direction, and / or at least one of the bent portions (12) is connected to one side edge of two adjacent connecting plate portions (11) in a third direction, wherein the first direction, the second direction and the third direction intersect each other.

4. The detector module (1000) according to claim 1, characterized in that, At least one of the connecting plate portions (11) and the bending portion (12) is provided with a tear-resistant notch, which is arranged at the end of at least one end of the bending portion (12) in the length direction to release stress at the end position of the bending portion (12).

5. The detector module (1000) according to claim 1, characterized in that, Also includes: A reinforcing plate (300) is disposed between at least one pair of adjacent and stacked connecting plate portions (11), and the analog-to-digital conversion unit (400) is disposed on the side of the connecting plate portion (11) facing away from the reinforcing plate (300) in the second direction.

6. The detector module (1000) according to claim 1, characterized in that, It also includes an adhesive element disposed between at least one pair of adjacent and stacked connecting plate portions (11) so that the adjacent and stacked connecting plate portions (11) are bonded together by the adhesive element.

7. The detector module (1000) according to claim 1, characterized in that, In at least one pair of adjacent and stacked connecting plate portions (11), the analog-to-digital conversion units (400) arranged on the two connecting plate portions (11) are spaced apart in a plane perpendicular to the stacking direction of the two connecting plate portions.

8. The detector module (1000) according to any one of claims 1-7, characterized in that, One of the plurality of connecting plate portions (11) is a first plate portion (111), one end of the first plate portion (111) is connected to one side edge of the detection connection portion (20) in the second direction, and the other end extends away from the detection connection portion (20) along the first direction. The remaining connecting plate portions (11) are connected to the detection connection portion (20) through the first plate portion (111) and are arranged on one or both sides of the first plate portion (111) in the second direction. The plurality of connecting plate portions (11) include a second plate portion (112) disposed on one side of the first plate portion (111) facing the other side edge of the detection connecting portion (20) in the second direction. The at least one bending portion (12) includes a first bending portion (121), and the first plate portion (111) and the second plate portion (112) are connected by the first bending portion (121). Wherein, the first bending portion (121) is connected to the first plate portion (111) and the second plate portion (112) on the third direction side, and / or, the first bending portion (121) is connected to the first plate portion (111) and the second plate portion (112) on the side opposite to the detection connection portion (20) in the first direction.

9. The detector module (1000) according to claim 8, characterized in that, The plurality of connecting plate portions (11) further include: a third plate portion (113) arranged on the side of the first plate portion (111) away from the second plate portion (112), the at least one bending portion (12) including a second bending portion (122), the third plate portion (113) being connected to the first plate portion (111) through the second bending portion (122), the second bending portion (122) and the first bending portion (121) being located on different sides of the first plate portion (111).

10. The detector module (1000) according to claim 9, characterized in that, The plurality of connecting plate portions (11) further include: a fourth plate portion (114), the fourth plate portion (114) being arranged on the side of the third plate portion (113) away from the first plate portion (111), the at least one bending portion (12) including a third bending portion (123), the third plate portion (113) and the fourth plate portion (114) being connected by the third bending portion (123), the third bending portion (123) and the second bending portion (122) being located on different sides of the third plate portion (113).

11. The detector module (1000) according to claim 1, characterized in that, The flexible circuit board (100) is a one-piece molded part.

12. A detector (A3), characterized in that, The device includes a support and a plurality of detector modules (1000) according to any one of claims 1-11, wherein at least two of the detector modules (1000) are arranged sequentially along a third direction and disposed on the support, wherein the first direction, the second direction and the third direction intersect each other.

13. A medical imaging device (A10), characterized in that, The device includes a scanning frame (A1), a radiation source (A2), and a detector (A3) according to claim 12. The scanning frame (A1) has a scanning cavity for receiving a scanning object (A20). The radiation source (A2) and the detector (A3) are respectively disposed on the radial sides of the scanning cavity, and the radiation source (A2) and the detector (A3) are rotatable along the circumference of the scanning cavity.

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