Anti-static high-heat-dissipation powder coating for cloud computing server and preparation method of anti-static high-heat-dissipation powder coating
By using molybdenum disulfide and silica heat dissipation fillers linked by carbon nanotubes and intermediate binders in cloud computing servers, the shortcomings of traditional coatings in terms of thermal management and electrostatic protection are solved, achieving efficient heat dissipation and antistatic properties, improving equipment reliability and reducing operation and maintenance costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HANGJIACAI NEW MATERIAL (GUANGDONG) CO LTD
- Filing Date
- 2026-03-05
- Publication Date
- 2026-05-05
AI Technical Summary
Traditional coating materials are insufficient in terms of thermal management and electrostatic protection in cloud computing servers. They cannot effectively cope with the risk of performance degradation and hardware damage caused by high heat and static electricity accumulation, and the high cost of heat dissipation fillers limits their application.
Carbon nanotubes are used as an antistatic agent, and molybdenum disulfide and silicon dioxide are linked by an intermediate linker to form a high-efficiency heat dissipation filler. The thermal conductivity of molybdenum disulfide and the high emissivity of silicon dioxide are utilized to achieve rapid heat transfer and dissipation.
It achieves efficient heat dissipation and anti-static properties for cloud computing servers, improves equipment reliability and stability, reduces maintenance difficulty, and is relatively economical in cost.
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Abstract
Description
Technical Field
[0001] This invention relates to the field of powder coating technology, specifically to an antistatic and high heat dissipation powder coating for cloud computing servers and its preparation method. Background Technology
[0002] With the explosive growth in the scale and computing power density of cloud computing data centers, servers are facing unprecedentedly harsh operating environments. Although traditional coatings have certain voltage resistance and electromagnetic shielding capabilities, their overall performance is still insufficient under multiple tests such as long-term high heat, frequent contact, and static electricity accumulation. Further breakthroughs in material stability and functional integration are urgently needed.
[0003] With the high-density deployment of data centers and high-end computing equipment, thermal management and electrostatic discharge (ESD) protection have become two core challenges restricting system reliability. On the one hand, the power consumption per unit volume is rising sharply, leading to a significant increase in heat dissipation pressure. Traditional coating materials generally have low thermal conductivity, forming significant thermal resistance at key heat-generating interfaces such as chips and power modules, severely hindering the efficient transfer of heat to heat sinks or the external environment. This localized heat accumulation not only causes performance degradation but also accelerates the aging of electronic components, directly threatening equipment operating efficiency and service life. On the other hand, high-speed, highly integrated circuits inside equipment are extremely sensitive to electrostatic discharge. Ordinary insulating coatings have extremely high surface resistivity, easily accumulating large amounts of static charge due to friction and induction during operation or maintenance. Once a momentary electrostatic discharge occurs, the resulting instantaneous high voltage and high current may directly break down precision circuits, causing irreversible hardware damage and posing a hidden but fatal threat to system stability.
[0004] Therefore, developing a composite functional powder coating with high heat dissipation and antistatic properties has become a key material technology innovation direction for improving the reliability of cloud computing servers, reducing the difficulty of operation and maintenance, and ensuring the continuous and stable operation of data centers. This is not only an upgrade in appearance protection, but also directly serves the core needs of equipment thermal management, electrical safety and full life cycle maintenance.
[0005] Chinese patent application CN201911408405.8 discloses a heat-dissipating powder coating and its preparation method. The powder coating includes saturated carboxyl-terminated polyester resin, curing agent, composite heat-dissipating filler, directional alignment agent, titanium dioxide, polytetrafluoroethylene, aluminum pigment, and other components. The composite heat-dissipating filler is prepared by ball milling, mixing, and spheroidizing hexagonal boron nitride, aluminum hydroxide, and alumina in sequence, which can effectively improve the thermal conductivity of the composite heat-dissipating filler and synergistically enhance the effect with aluminum pigment, so that the powder coating of this invention has a heat dissipation effect. However, this invention is limited by the high price of hexagonal boron nitride material, which faces a huge challenge in cost control. Based on this, this invention provides a relatively economical powder coating with excellent heat dissipation effect. Summary of the Invention
[0006] The purpose of this invention is to provide an antistatic, high-heat-dissipation powder coating for cloud computing servers and its preparation method.
[0007] The objective of this invention can be achieved through the following technical solutions: An antistatic, high-heat-dissipation powder coating for cloud computing servers comprises the following raw materials in parts by weight: 50-60 parts hydroxyl polyester resin, 2-5 parts carbon nanotubes, 3-6 parts heat dissipation filler, 3-5 parts curing agent, 0.3-0.5 parts accelerator, 2-5 parts leveling agent, 1-3 parts adhesion promoter.
[0008] Further, the curing agent is diphenylmethane diisocyanate or toluene diisocyanate; the accelerator is dibutyltin dilaurate or stannous octoate; the leveling agent is ethyl polyacrylate or butyl polyacrylate; and the adhesion promoter is silane coupling agent KH-560.
[0009] Furthermore, the method for preparing the heat dissipation filler includes the following steps: Step 1: Take 2.4-2.6g of 3,5-difluorobenzoic acid and add it to 50ml of N-methylpyrrolidone. After stirring evenly, add 1.2-1.4g of 2,2'-sulfonyl diethanol and 3.3-4g of alkaline catalyst. Heat to 110-120℃ and stir for 8-10h. Then continue to raise the temperature to 130-140℃ and stir for 3-6h. Then raise the temperature to 150-160℃ and stir for 3-6h. After the reaction is completed, cool to room temperature, filter, wash and dry to obtain the intermediate linker. Step 2: Add 1.3-1.6g of molybdenum disulfide and 1.5-1.8g of silicon dioxide to 200ml of 90-95% (v / v) ethanol aqueous solution. Adjust the pH to acidic with acetic acid. After ultrasonic dispersion, add 1.1-2.3g of silane coupling agent KH-550, heat to 50-60℃, stir for 2-3h, filter, wash, and dry to obtain the modified inorganic material. Add 1.8-2.1g of the modified inorganic material to 200ml of N,N-dimethylformamide, and ultrasonically disperse to obtain the modified inorganic material dispersion for later use. Step 3: Add 0.6-0.8g of intermediate linker to N,N-dimethylformamide, stir evenly, add modified inorganic dispersion and 0.05-0.07g of p-toluenesulfonic acid, heat to 80-90℃, keep warm and stir for 6-10h. After the reaction is complete, filter, wash and dry to obtain heat dissipation filler.
[0010] Furthermore, in the first step, the mass ratio of 3,5-difluorobenzoic acid and 2,2'-sulfonyl diethanol is 1:0.5-0.53.
[0011] Furthermore, in the first step, the alkaline catalyst is anhydrous potassium carbonate.
[0012] Through the above technical solution, the fluorine element of 3,5-difluorobenzoic acid and the hydroxyl group of 2,2'-sulfonyl diethanol undergo a substitution reaction to polymerize and obtain an intermediate linker, which then reacts with the amino and carboxyl groups on the surface of molybdenum disulfide and silica to obtain a heat dissipation filler.
[0013] A method for preparing an antistatic, high-heat-dissipation powder coating for cloud computing servers includes the following steps: Step 1: Mix hydroxyl polyester resin, carbon nanotubes, and heat dissipation filler, and stir at a rate of 900-1000 r / min to obtain a pre-dispersion. Step 2: Mix the pre-dispersant, curing agent, accelerator, leveling agent, light stabilizer, and adhesion promoter, and add them to a twin-screw extruder. Set the temperature to Zone 1: 90-100℃, Zone 2: 100-120℃, and Zone 3: 120-130℃ to obtain a high-temperature melt. Step 3: Add the high-temperature molten material to the cooling roller and press it into a thin sheet. After cooling, add the sheet to the crusher and crush it into small fragments. Then add the small fragments to the airflow vortex pulverizer and grind them into fine powder. Pass the powder through an 80-90um sieve to obtain powder coating.
[0014] The beneficial effects of this invention are: (1) The powder coating prepared by the present invention has excellent antistatic properties and high heat dissipation by adding carbon nanotubes and heat dissipation fillers.
[0015] (2) Carbon nanotubes are used as antistatic agents to effectively eliminate the impact of static electricity on electronic devices.
[0016] (3) The heat dissipation filler is made by linking molybdenum disulfide and silicon dioxide through an intermediate binder. Molybdenum disulfide has excellent thermal conductivity and silicon dioxide has high emissivity, which can dissipate the heat introduced by molybdenum disulfide in a timely manner. At the same time, the intermediate binder plays a connecting role, tightly combining molybdenum disulfide and silicon dioxide to form a composite. The heat introduced by molybdenum disulfide can be transferred to silicon dioxide in a timely manner, and the high emissivity of silicon dioxide can be used to quickly dissipate heat, achieving heat dissipation in the first time. Moreover, through the intermediate binder, the composite of molybdenum disulfide and silicon dioxide forms a continuous channel between each other, achieving faster heat transfer and timely heat dissipation.
[0017] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Detailed Implementation
[0018] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0019] Example 1 An antistatic, high-heat-dissipation powder coating for cloud computing servers comprises the following raw materials in parts by weight: 50 parts Eastman hydroxyl polyester resin MP-2101, 2 parts carbon nanotubes, 3 parts diphenylmethane diisocyanate, 0.3 parts dibutyltin dilaurate, 2 parts ethyl polyacrylate, and 1 part silane coupling agent KH-560.
[0020] The preparation method of powder coating includes the following steps: Step 1: Mix Eastman hydroxyl polyester resin MP-2101, carbon nanotubes, and heat dissipation filler, and stir at a rate of 900 r / min to obtain a pre-dispersion. Step 2: Mix the pre-dispersion, diphenylmethane diisocyanate, dibutyltin dilaurate, ethyl polyacrylate, and silane coupling agent KH-560, and add them to a twin-screw extruder. Set the temperature to Zone 1: 90℃, Zone 2: 100℃, and Zone 3: 120℃ to obtain a high-temperature melt. Step 3: Add the high-temperature molten material to the cooling roller and press it into a thin sheet. After cooling, add the sheet to the crusher and crush it into small fragments. Then add the small fragments to the airflow vortex pulverizer and grind them into fine powder. Pass the powder through an 80um sieve to obtain powder coating.
[0021] The preparation method of the heat dissipation filler includes the following steps: Step 1: Take 2.4g of 3,5-difluorobenzoic acid and add it to 50ml of N-methylpyrrolidone. After stirring evenly, add 1.2g of 2,2'-sulfonyl diethanol and 3.3g of anhydrous potassium carbonate. Heat to 130℃ and stir for 8h. Then continue to raise the temperature to 140℃ and stir for 3h. Then raise the temperature to 150℃ and stir for 6h. After the reaction is completed, cool to room temperature, filter, wash and dry to obtain the intermediate linker. Step 2: Add 1.3 g of molybdenum disulfide and 1.5 g of silicon dioxide to 200 ml of 95% (v / v) ethanol aqueous solution, adjust the pH to acidic with acetic acid, and after ultrasonic dispersion, add 1.1 g of silane coupling agent KH-550, heat to 60°C, stir for 3 h, filter, wash, and dry to obtain the modified inorganic material; add 1.8 g of the modified inorganic material to 200 ml of N,N-dimethylformamide, and after ultrasonic dispersion, obtain the modified inorganic material dispersion for later use; Third step: Take 0.8g of intermediate linker and add it to N,N-dimethylformamide. After stirring evenly, add modified inorganic dispersion and 0.07g of p-toluenesulfonic acid. Heat to 90℃ and keep stirring for 6 hours. After the reaction is completed, filter, wash and dry to obtain heat dissipation filler.
[0022] Example 2 An antistatic, high-heat-dissipation powder coating for cloud computing servers comprises the following raw materials in parts by weight: 53 parts Eastman hydroxyl polyester resin MP-2101, 3 parts carbon nanotubes, 5 parts heat dissipation filler, 3 parts diphenylmethane diisocyanate, 0.4 parts dibutyltin dilaurate, 3 parts ethyl polyacrylate, and 1 part silane coupling agent KH-560.
[0023] The preparation method of powder coating includes the following steps: Step 1: Mix Eastman hydroxyl polyester resin MP-2101, carbon nanotubes, and heat dissipation filler, and stir at a rate of 950 r / min to obtain a pre-dispersion. Step 2: Mix the pre-dispersion, diphenylmethane diisocyanate, dibutyltin dilaurate, ethyl polyacrylate, and silane coupling agent KH-560, and add them to a twin-screw extruder. Set the temperature to Zone 1: 95℃, Zone 2: 110℃, and Zone 3: 125℃ to obtain a high-temperature melt. Step 3: Add the high-temperature molten material to the cooling roller and press it into a thin sheet. After cooling, add the sheet to the crusher and crush it into small fragments. Then add the small fragments to the airflow vortex pulverizer and grind them into fine powder. Pass the powder through an 85um sieve to obtain powder coating.
[0024] The preparation method of the heat dissipation filler is the same as that in Example 1.
[0025] Example 3 An antistatic, high-heat-dissipation powder coating for cloud computing servers comprises the following raw materials in parts by weight: 60 parts Eastman hydroxyl polyester resin MP-2101, 5 parts carbon nanotubes, 6 parts heat dissipation filler, 5 parts diphenylmethane diisocyanate, 0.5 parts dibutyltin dilaurate, 5 parts ethyl polyacrylate, and 3 parts silane coupling agent KH-560.
[0026] The preparation method of powder coating includes the following steps: Step 1: Mix Eastman hydroxyl polyester resin MP-2101, carbon nanotubes, and heat dissipation filler, and stir at a rate of 1000 r / min to obtain a pre-dispersion. Step 2: Mix the pre-dispersion, diphenylmethane diisocyanate, dibutyltin dilaurate, ethyl polyacrylate, and silane coupling agent KH-560, and add them to a twin-screw extruder. Set the temperature to Zone 1: 100℃, Zone 2: 120℃, and Zone 3: 130℃ to obtain a high-temperature melt. Step 3: Add the high-temperature molten material to the cooling roller and press it into a thin sheet. After cooling, add the sheet to the crusher and crush it into small fragments. Then add the small fragments to the airflow vortex pulverizer and grind them into fine powder. Pass the powder through a 90um sieve to obtain powder coating.
[0027] The preparation method of the heat dissipation filler is the same as that in Example 1.
[0028] Comparative Example 1 An antistatic, high-heat-dissipation powder coating for cloud computing servers comprises the following raw materials in parts by weight: 53 parts Eastman hydroxyl polyester resin MP-2101, 3 parts carbon nanotubes, 2.3 parts molybdenum disulfide, 2.7 parts silica, 3 parts diphenylmethane diisocyanate, 0.4 parts dibutyltin dilaurate, 3 parts ethyl polyacrylate, and 1 part silane coupling agent KH-560.
[0029] The preparation method of powder coating includes the following steps: Step 1: Mix Eastman hydroxyl polyester resin MP-2101, carbon nanotubes, molybdenum disulfide, and silica, and stir at a rate of 950 r / min to obtain a pre-dispersion. Step 2: Mix the pre-dispersion, diphenylmethane diisocyanate, dibutyltin dilaurate, ethyl polyacrylate, and silane coupling agent KH-560, and add them to a twin-screw extruder. Set the temperature to Zone 1: 95℃, Zone 2: 110℃, and Zone 3: 125℃ to obtain a high-temperature melt. Step 3: Add the high-temperature molten material to the cooling roller and press it into a thin sheet. After cooling, add the sheet to the crusher and crush it into small fragments. Then add the small fragments to the airflow vortex pulverizer and grind them into fine powder. Pass the powder through an 85um sieve to obtain powder coating.
[0030] The difference between Comparative Example 1 and Example 1 is that silicon dioxide and molybdenum disulfide are used to replace the heat dissipation filler, while the rest are the same.
[0031] Comparative Example 2 An antistatic, high-heat-dissipation powder coating for cloud computing servers comprises the following raw materials in parts by weight: 53 parts Eastman hydroxyl polyester resin MP-2101, 3 parts carbon nanotubes, 3 parts diphenylmethane diisocyanate, 0.4 parts dibutyltin dilaurate, 3 parts ethyl polyacrylate, and 1 part silane coupling agent KH-560.
[0032] The preparation method of powder coating includes the following steps: Step 1: Mix Eastman hydroxyl polyester resin MP-2101 and carbon nanotubes, and stir at a rate of 950 r / min to obtain a pre-dispersion. Step 2: Mix the pre-dispersion, diphenylmethane diisocyanate, dibutyltin dilaurate, ethyl polyacrylate, and silane coupling agent KH-560, and add them to a twin-screw extruder. Set the temperature to Zone 1: 95℃, Zone 2: 110℃, and Zone 3: 125℃ to obtain a high-temperature melt. Step 3: Add the high-temperature molten material to the cooling roller and press it into a thin sheet. After cooling, add the sheet to the crusher and crush it into small fragments. Then add the small fragments to the airflow vortex pulverizer and grind them into fine powder. Pass the powder through an 85um sieve to obtain powder coating.
[0033] Comparative Example 3 An antistatic, high-heat-dissipation powder coating for cloud computing servers comprises the following raw materials in parts by weight: 53 parts Eastman hydroxyl polyester resin MP-2101, 5 parts heat dissipation filler, 3 parts diphenylmethane diisocyanate, 0.4 parts dibutyltin dilaurate, 3 parts ethyl polyacrylate, 2 parts Lyon UV-928, and 1 part silane coupling agent KH-560.
[0034] The preparation method of powder coating includes the following steps: Step 1: Mix Eastman hydroxyl polyester resin MP-2101 and heat dissipation filler, and stir at a rate of 950 r / min to obtain a pre-dispersion. Step 2: Mix the pre-dispersion, diphenylmethane diisocyanate, dibutyltin dilaurate, ethyl polyacrylate, Rianon UV-928, and silane coupling agent KH-560, and add them to a twin-screw extruder. Set the temperature to Zone 1: 95℃, Zone 2: 110℃, and Zone 3: 125℃ to obtain a high-temperature melt. Step 3: Add the high-temperature molten material to the cooling roller and press it into a thin sheet. After cooling, add the sheet to the crusher and crush it into small fragments. Then add the small fragments to the airflow vortex pulverizer and grind them into fine powder. Pass the powder through an 85um sieve to obtain powder coating.
[0035] The preparation method of the heat dissipation filler is the same as that in Example 1.
[0036] Performance testing The antistatic properties were tested according to standard GB / T 37977.51-2023 "Electrostatics - Part 5-1: General requirements for electrostatic protection of electronic devices"; The heat dissipation performance was tested according to the standard GB / T10294-2008 "Determination of Steady-State Thermal Resistance and Related Properties of Insulation Materials - Protective Hot Plate Method". The experimental results are shown in the table below: The surface resistance data shows that carbon nanotubes, as an antistatic agent, can effectively eliminate the impact of static electricity on electronic devices.
[0037] The thermal conductivity data shows a significant improvement in heat dissipation in this embodiment. This is because molybdenum disulfide in the heat dissipation filler has excellent thermal conductivity, and silicon dioxide has high emissivity and a porous structure, allowing the heat introduced by the molybdenum disulfide to dissipate quickly. Simultaneously, the intermediate binder acts as a connector, tightly binding the molybdenum disulfide and silicon dioxide into a unified whole. The heat introduced by the molybdenum disulfide can be transferred to the silicon dioxide in a timely manner, and the high emissivity of the silicon dioxide allows for rapid dissipation, achieving immediate heat dissipation. In Comparative Example 1, where the heat dissipation filler was replaced with molybdenum disulfide and silicon dioxide, the heat dissipation effect was not ideal due to the absence of the intermediate binder.
[0038] The above content is merely an example and illustration of the concept of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the scope defined by the concept of the invention, they should all fall within the protection scope of the present invention.
Claims
1. An antistatic, high-heat-dissipation powder coating for cloud computing servers, characterized in that, Including the following parts by weight of raw materials: 50-60 parts hydroxyl polyester resin, 2-5 parts carbon nanotubes, 3-6 parts heat dissipation filler, 3-5 parts curing agent, 0.3-0.5 parts accelerator, 2-5 parts leveling agent, 1-3 parts adhesion promoter.
2. The antistatic, high-heat-dissipation powder coating for cloud computing servers according to claim 1, characterized in that, The curing agent is diphenylmethane diisocyanate or toluene diisocyanate; the accelerator is dibutyltin dilaurate or stannous octoate; the leveling agent is ethyl polyacrylate or butyl polyacrylate; and the adhesion promoter is silane coupling agent KH-560.
3. The antistatic and high heat dissipation powder coating for cloud computing servers according to claim 1, characterized in that, The method for preparing the heat dissipation filler includes the following steps: Step 1: Add 3,5-difluorobenzoic acid to N-methylpyrrolidone, stir until homogeneous, then add 2,2'-sulfonyl diethanol and alkaline catalyst, heat to 110-120℃, keep warm and stir for 8-10 hours, then continue to heat to 130-140℃ and stir for 3-6 hours, then heat to 150-160℃ and stir for 3-6 hours. After the reaction is complete, cool to room temperature, filter, wash and dry to obtain intermediate linker. Step 2: Add molybdenum disulfide and silicon dioxide to an ethanol aqueous solution with a volume fraction of 90-95%. Adjust the pH to acidic using acetic acid. After ultrasonic dispersion, add silane coupling agent KH-550, heat to 50-60℃, stir for 2-3 hours, filter, wash, and dry to obtain the modified inorganic material. Add the modified inorganic material to N,N-dimethylformamide, and ultrasonically disperse to obtain a modified inorganic dispersion for later use. The third step involves adding the intermediate linker to N,N-dimethylformamide, stirring until homogeneous, then adding the modified inorganic dispersion and p-toluenesulfonic acid. The mixture is heated to 80-90℃ and stirred for 6-10 hours. After the reaction is complete, the mixture is filtered, washed, and dried to obtain the heat dissipation filler.
4. The antistatic and high heat dissipation powder coating for cloud computing servers according to claim 3, characterized in that, In the first step, the mass ratio of 3,5-difluorobenzoic acid and 2,2'-sulfonyl diethanol is 1:0.5-0.
53.
5. The antistatic, high-heat-dissipation powder coating for cloud computing servers according to claim 3, characterized in that, In the first step, the alkaline catalyst is anhydrous potassium carbonate.
6. A method for preparing an antistatic, high-heat-dissipation powder coating for cloud computing servers as described in claim 1, characterized in that, Includes the following steps: Step 1: Mix hydroxyl polyester resin, carbon nanotubes, and heat dissipation filler, and stir at a rate of 900-1000 r / min to obtain a pre-dispersion. Step 2: Mix the pre-dispersant, curing agent, accelerator, leveling agent, and adhesion promoter, and add them to a twin-screw extruder. Set the temperature to Zone 1: 90-100℃, Zone 2: 100-120℃, and Zone 3: 120-130℃ to obtain a high-temperature melt. Step 3: Add the high-temperature molten material to the cooling roller and press it into a thin sheet. After cooling, add the sheet to the crusher and crush it into small fragments. Then add the small fragments to the airflow vortex pulverizer and grind them into fine powder. Pass the powder through an 80-90um sieve to obtain powder coating.
Citation Information
Patent Citations
A heat-dissipating powder coating and its preparation method
CN111040592B