Wafer infrared detection test equipment

Abstract

The invention relates to wafer infrared detection testing equipment which comprises a working table, a driving motor is arranged at the bottom of the working table, a fixing mechanism is in driving connection with the top of the driving motor, an infrared laser detector is arranged at the top of the working table, and the fixing mechanism comprises a connecting base fixedly installed at the output end of the driving motor. A base is arranged at the top of the connecting seat, a centering mechanism and a clamping mechanism are arranged in the base, an over-limit protection mechanism is arranged at the end of the clamping mechanism and comprises an air cylinder, a piston rod is slidably connected into the air cylinder, and a buffer spring is arranged between the tail end of the piston rod and the inner wall of the air cylinder. A sliding plug is slidably connected into the front end of the piston rod, and hinge plates are hinged to the two ends of the sliding plug respectively. The beneficial effects of dual functions of stable adsorption and over-limit emergency protection in the wafer clamping process are achieved, so that wafer damage is effectively avoided while tight clamping is guaranteed, and the accuracy and reliability of a subsequent infrared detection result are guaranteed.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection technology, specifically to a wafer infrared inspection and testing device. Background Technology

[0002] In the semiconductor chip manufacturing process, wafer quality inspection is a crucial step in ensuring chip yield. Infrared detection technology, due to its advantages of non-contact and non-destructive testing, is widely used to detect wafer surface defects, internal cracks, and interlayer structural anomalies. As a core testing device, wafer infrared inspection equipment requires a fixing mechanism to stably position the wafer before the infrared detection module scans and inspects it. The performance of the fixing mechanism directly affects the inspection accuracy and wafer integrity, making it particularly suitable for inspecting easily damaged wafers such as ultra-thin wafers and compound semiconductor wafers.

[0003] Existing wafer infrared inspection and testing equipment typically employs mechanical clamping or simple vacuum adsorption structures for its fixing mechanism. Mechanical clamping structures fix the wafer by driving the clamps to close towards the center, while vacuum adsorption structures use negative pressure to fix the wafer to the support platform.

[0004] However, the existing structures lack effective over-limit protection mechanisms. Specifically, during the clamping process, differences in wafer thickness or fluctuations in the power output of the drive mechanism can easily lead to excessive clamping force. Mechanical clamping structures may cause wafer edge cracking and surface scratches due to rigid compression, while vacuum adsorption structures may cause wafer deformation due to excessive negative pressure. At the same time, existing structures are difficult to maintain a stable fixed state when the clamping force is moderate, and wafer slippage is prone to occur. This not only damages the wafer but also leads to positioning deviations in subsequent infrared detection, affecting the accuracy and reliability of the detection results and failing to meet the requirements of high-precision wafer detection. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer infrared detection and testing device, which aims to improve the problem in the prior art where the lack of an effective over-limit protection mechanism leads to excessive clamping force causing wafer edge cracking, surface scratches or deformation.

[0006] The objective of this invention is achieved through the following technical solution: a wafer infrared detection and testing device, including a worktable, a drive motor is provided at the bottom of the worktable, a fixing mechanism is connected to the top of the drive motor, and an infrared laser detector is provided at the top of the worktable. The fixing mechanism includes a connecting seat fixedly installed at the output end of the drive motor. A base is provided on the top of the connecting seat. A centering mechanism and a clamping mechanism are provided inside the base. An over-limit protection mechanism is provided at the end of the clamping mechanism. The over-limit protection mechanism includes an air cylinder, a piston rod is slidably connected inside the air cylinder, a buffer spring is provided between the tail end of the piston rod and the inner wall of the air cylinder, a sliding plug is slidably connected inside the front end of the piston rod, a hinge plate is hinged to both ends of the sliding plug, a suction cup is hinged to the other end of the hinge plate, and sealing plates are slidably connected inside the piston rod at both ends of the sliding plug.

[0007] As a further description of the above technical solution: The over-limit protection mechanism also includes a trigger cylinder fixedly connected to the top of the clamping mechanism. A gravity pressure plate is slidably connected inside the trigger cylinder. A through hole is provided between the trigger cylinder and the air cylinder. An air supply channel is provided at the center of the piston rod. As a further description of the above technical solution: The centering mechanism includes a circular groove opened on the inner side of the base, and a ball is rolled inside the circular groove. A spherical hinge is provided on the outer side of the ball, and an elastic support plate is provided at the other end of the spherical hinge. As a further description of the above technical solution: The inner side of the base is configured as a three-section conical surface, with the cone angle of the upper cone surface being 120°, the cone angle of the middle cone surface being 80°, and the cone angle of the lower cone surface being 60°. As a further description of the above technical solution: The clamping mechanism includes a lifting platform slidably connected to the center of the base, a wedge-shaped pile at the bottom of the lifting platform, and a return spring between the bottom of the lifting platform and the base. As a further description of the above technical solution: The clamping mechanism also includes a fixed cylinder fixedly connected inside the base. A sliding rod is slidably connected inside the fixed cylinder. A tension spring is provided between the sliding rod and the inside of the fixed cylinder. Two fixed rings are provided at the front end of the sliding rod, and an inclined clamping arm is fixedly connected between the two fixed rings. The bottom end of the inclined clamping arm abuts against the outer inclined surface of the wedge-shaped pile. As a further description of the above technical solution: The rear end of the suction cup is connected to the end of the piston rod via a telescopic hose, and the inside of the suction cup is a hollow, inflatable structure. As a further description of the above technical solution: The workbench is equipped with four balancing legs at the bottom and a vertical guide rail at the top. The infrared laser detector is mounted on the sliding end face of the vertical guide rail.

[0008] Compared with the prior art, the advantages of the present invention are as follows: 1. Through a pneumatic linkage structure of the suction cup, sliding plug, and piston rod, combined with the elastic buffering effect of the buffer spring and the triggering structure of the gravity pressure plate, the system achieves the dual benefits of stable adsorption and over-limit emergency protection during wafer clamping. When the clamping force is moderate, tension and pressure maintain a tight fit between the suction cup and the wafer. When the clamping force is too great, the sliding plug is automatically pushed to cause the suction cup to bulge and eject the wafer, effectively avoiding wafer damage and ensuring the accuracy and reliability of subsequent infrared detection results.

[0009] 2. By using a three-section conical surface of the base to drive the elastic support plate, and in conjunction with the linkage structure of the lifting platform and wedge-shaped piles to push the inclined clamping arm, the continuous action of coarse and fine centering is automatically completed after the wafer is placed. At the same time, the inclined clamping arm is driven to close towards the center and fit tightly against the edge of the wafer. This structure not only ensures the accuracy of wafer positioning and the stability of clamping, but also adapts to the shape characteristics of wafers of different specifications, effectively avoiding the adverse effects of wafer eccentricity on subsequent infrared detection. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the main body of an embodiment of a wafer infrared detection and testing device proposed in this invention; Figure 2 This is a schematic diagram of the fixing mechanism of a wafer infrared detection and testing device proposed in this invention; Figure 3 This is a schematic diagram of the base structure of a wafer infrared detection and testing device proposed in this invention; Figure 4 This is a schematic diagram of the clamping mechanism of a wafer infrared detection and testing device proposed in this invention; Figure 5 This is a schematic diagram of the structure of the fixing cylinder of the wafer infrared detection and testing equipment proposed in this invention; Figure 6 This is a schematic diagram of the over-limit protection mechanism of a wafer infrared detection and testing equipment proposed in this invention; Figure 7 for Figure 4 Enlarged view of point A in the middle; Figure 8 for Figure 6 Enlarged view of section B in the middle.

[0011] Labeling Explanation: 1. Workbench; 2. Balance support leg; 3. Drive motor; 4. Fixing mechanism; 41. Connecting seat; 42. Base; 43. Centering mechanism; 431. Conical surface; 432. Circular groove; 433. Ball bearing; 434. Spherical hinge; 435. Elastic support plate; 44. Clamping mechanism; 441. Lifting platform; 442. Wedge-shaped post; 443. Return spring; 444. Inclined clamping arm; 445. Fixed cylinder; 446. Slide rod; 447. Tension spring; 448. Fixed ring; 45. Over-limit protection mechanism; 451. Air cylinder; 452. Piston rod; 453. Buffer spring; 454. Trigger cylinder; 455. Gravity pressure plate; 456. Sliding plug; 457. Hinge plate; 458. Suction cup; 459. Sealing plate; 5. Vertical guide rail; 6. Infrared laser detector. Detailed Implementation

[0012] The present invention will now be described in detail with reference to the accompanying drawings and embodiments: like Figures 1 to 8 The diagram shown is an embodiment of a wafer infrared inspection and testing device provided by the present invention. The wafer infrared inspection and testing device includes a worktable 1, which provides a mounting base for various components and a stable support platform for device operation. A drive motor 3 is installed at the bottom of the worktable 1, driving a fixing mechanism 4 and the fixed wafer to rotate, thereby achieving omnidirectional infrared scanning inspection of the wafer. The fixing mechanism 4 is connected to the top of the drive motor 3, fixing the wafer to be inspected and ensuring the stability of the wafer's position during inspection. An infrared laser detector is installed at the top of the worktable 1. 6. The infrared laser detector 6 performs infrared scanning inspection of the wafer and collects the inspection data of the wafer. The bottom of the worktable 1 is equipped with four balance legs 2. The balance legs 2 maintain the stability of the worktable 1 and the overall equipment, and avoid shaking during the inspection process, which would affect the inspection accuracy. The top of the worktable 1 is equipped with a vertical guide rail 5. The vertical guide rail 5 provides a moving guide path for the infrared laser detector 6, realizes the position adjustment of the detector, and adapts to different inspection position requirements. The infrared laser detector 6 is set on the sliding end surface of the vertical guide rail 5. The sliding end surface supports the infrared laser detector 6 and ensures that the detector moves stably along the guide rail.

[0013] The fixing mechanism 4 includes a connecting seat 41 fixedly installed at the output end of the drive motor 3. The connecting seat 41 connects the drive motor 3 and the base 42, transmits the power of the drive motor 3, and drives the base 42 and the components above it to rotate synchronously. The base 42 is provided on the top of the connecting seat 41. The base 42 serves as the main support structure of the fixing mechanism 4 and accommodates sub-components such as the centering mechanism 43 and the clamping mechanism 44. The centering mechanism 43 and the clamping mechanism 44 are provided inside the base 42. The centering mechanism 43 completes the automatic centering operation of the wafer to ensure that the wafer is in the center position required for testing. The clamping mechanism 44 clamps and fixes the centered wafer to maintain the stability of the wafer during the testing process. The end of the clamping mechanism 44 is provided with an over-limit protection mechanism 45. The over-limit protection mechanism 45 prevents the wafer from being subjected to excessive clamping force, thereby achieving stable adsorption of the wafer and emergency over-limit protection.

[0014] The over-limit protection mechanism 45 includes an air cylinder 451, which provides space for the sliding of the piston rod 452 and serves as the basic carrier of the pneumatic linkage structure of the over-limit protection mechanism 45. The piston rod 452 is slidably connected inside the air cylinder 451. As the core component of the pneumatic linkage, the piston rod 452 transmits gas pressure and the elastic force of the buffer spring 453, driving the related components to move. A buffer spring 453 is installed between the tail end of the piston rod 452 and the inner wall of the air cylinder 451. This buffer spring 453 buffers the force during clamping, preventing damage to the wafer from excessive instantaneous clamping force. A sliding plug 456 is slidably connected inside the front end of the piston rod 452. This sliding plug 456 moves with changes in gas pressure, driving the hinge plate 45. 7. Action: Adjusting the state of the suction cup 458. Hinges 457 are hinged to both ends of the sliding plug 456, connecting the sliding plug 456 and the suction cup 458, transmitting the movement of the sliding plug 456, and realizing changes in the shape or position of the suction cup 458. The other end of the hinge plate 457 is hinged to the suction cup 458. The suction cup 458, through the cooperation of a hollow inflatable structure and a telescopic hose, achieves stable adsorption of the wafer. When the limit is exceeded, it can bulge and eject the wafer to avoid damage. The rear end of the suction cup 458 is connected to the end of the piston rod 452 through a telescopic hose. This telescopic hose ensures gas communication between the suction cup 458 and the piston rod 452, while also adapting to the movement and displacement of the suction cup 458. The interior of the suction cup 458 is a hollow inflatable structure. The sliding plug 456 is also provided with sealing plates 459 that are slidably connected inside the piston rod 452 at both ends. The sealing plates 459 seal the gas space inside the piston rod 452, ensuring the effective transmission of gas pressure and maintaining the effectiveness of pneumatic linkage. The over-limit protection mechanism 45 also includes a trigger cylinder 454 fixedly connected to the top of the clamping mechanism 44. The trigger cylinder 454 houses a gravity pressure plate 455, providing a space carrier for the gas triggering of the over-limit protection. The gravity pressure plate 455 is slidably connected inside the trigger cylinder 454. When the clamping force is too large, the gravity pressure plate 455 moves down, squeezing the gas inside the trigger cylinder 454 and activating the pneumatic linkage of the over-limit protection. A through hole is provided between the trigger cylinder 454 and the air cylinder 451, which allows gas to flow between the trigger cylinder 454 and the air cylinder 451, providing a channel for the pneumatic linkage of the over-limit protection. An air supply channel is provided at the center of the piston rod 452, which allows gas to flow inside the piston rod 452, transmitting the gas pressure of the trigger cylinder 454 and pushing the sliding plug 456 to move.

[0015] The centering mechanism 43 includes a circular groove 432 formed inside the base 42. This groove 432 provides a guiding path for the rolling of the ball bearing 433, ensuring the stability of the movement trajectory of the elastic support plate 435. The ball bearing 433 is rolled inside the circular groove 432, reducing the frictional resistance of the elastic support plate 435 during movement and making the centering action smoother. A spherical hinge 434 is provided on the outer side of the ball bearing 433, and the other end of the spherical hinge 434 is provided with the elastic support plate 435. This spherical hinge 434 allows the elastic support plate 435 to move smoothly. The elastic support plate 435 can adapt to the angle of the wafer edge, improving the fit and accuracy of centering. The elastic support plate 435 generates a rebound force under wafer compression, forming a radial centering component force to ensure that the wafer is accurately inserted into the center position. The inner side of the base 42 is set as a three-segment conical surface 431, with the cone angle of the upper cone surface being 120°, the cone angle of the middle cone surface being 80°, and the cone angle of the lower cone surface being 60°. The three-segment conical surface 431 guides the wafer to complete the continuous action of coarse centering and fine centering through different cone angles, adapting to the positioning requirements of the wafer.

[0016] The clamping mechanism 44 includes a lifting platform 441 slidably connected to the center of the base 42. The lifting platform 441 carries the wafer to be inspected. Its movement drives the wedge-shaped post 442, triggering the clamping mechanism 44. The bottom of the lifting platform 441 has the wedge-shaped post 442, which engages with the inclined clamping arm 444 via its inclined surface, driving the inclined clamping arm 444 to close towards the center, triggering the clamping action. A return spring 443 is provided between the bottom of the lifting platform 441 and the base 42. The return spring 443 supports the lifting platform 441 at its initial high position. After inspection, it resets the lifting platform 441, releasing the clamping mechanism 44. The clamping mechanism 44 also includes a fixed cylinder 445 fixedly connected inside the base 42. The fixed cylinder 445 provides guidance and accommodation space for the sliding rod 446, ensuring the stability of the sliding trajectory of the sliding rod 446. The internal sliding connection of the fixed cylinder 445... A sliding rod 446 is connected to a tension spring 447 and an inclined clamping arm 444, transmitting the tension of the tension spring 447 and driving the inclined clamping arm 444 to move. A tension spring 447 is provided between the sliding rod 446 and the inside of the fixed cylinder 445, providing a reset tension for the inclined clamping arm 444 and maintaining the contact between the inclined clamping arm 444 and the inclined surface of the wedge-shaped pile 442. Two fixing rings 448 are provided at the front end of the sliding rod 446. The fixed ring 448 connects the slide rod 446 and the inclined clamping arm 444 to ensure the stability of the connection between the two and transmit the movement of the slide rod 446. The inclined clamping arm 444 is fixedly connected between the two fixed rings 448. The inclined clamping arm 444 closes towards the center and fits against the edge of the wafer by adhering to the inclined surface of the wedge-shaped post 442, thereby achieving the initial clamping and fixing of the wafer. The bottom end of the inclined clamping arm 444 abuts against the outer inclined surface of the wedge-shaped post 442.

[0017] Working principle: Before the test begins, the lifting platform 441 in the fixed mechanism 4 is in a high position at the center of the base 42 under the support of the return spring 443, and the wedge-shaped pile 442 at its bottom is in a high position at the same time. The corresponding inclined clamping arm 444 is kept in an outward opening state under the action of the wedge-shaped pile 442. The elastic support plate 435 of the centering mechanism 43 is located in the outer area of ​​the three-section conical surface 431 of the base 42, and the ball 433 is in the initial rolling position in the circular groove 432. In the air cylinder 451 of the over-limit protection mechanism 45, the buffer spring 453 is in a naturally extended state, the piston rod 452 is in the initial position inside the air cylinder 451, the sliding plug 456 is in the middle position of the front end of the piston rod 452, the hinge plate 457 is in a retracted state, the suction cup 458 is in a retracted state near the front end of the piston rod 452, and the gravity pressure plate 455 in the trigger cylinder 454 is in the top position of the trigger cylinder 454. Meanwhile, the infrared laser detector 6 is positioned at the initial high position of the vertical guide rail 5, the drive motor 3 is in a stopped state, and the balance support leg 2 at the bottom of the worktable 1 maintains the overall stability of the equipment.

[0018] The wafer to be tested is placed on top of the lifting platform 441 of the fixing mechanism 4. The weight of the wafer itself acts directly on the lifting platform 441, causing the lifting platform 441 to overcome the elastic force of the reset spring 443 and begin to move downward. At the same time as the lifting platform 441 moves, the wedge-shaped pile 442 connected to its bottom also moves downward synchronously.

[0019] As the wafer moves downward with the support platform 441, the edge of the wafer gradually contacts the conical surface 431 of the centering mechanism 43. The upper conical surface uses the component of gravity to guide the wafer to slide towards the center, completing the initial centering. The middle conical surface causes the edge of the wafer to squeeze the elastic support plate 435. The rebound force of the elastic support plate 435 forms a "radial centering component force", forcing the wafer to accurately lock into the center and finally completing the automatic centering of the wafer.

[0020] The clamping mechanism 44 achieves initial clamping: As the lifting platform 441 drives the wedge-shaped post 442 to move downward, the outer slope of the wedge-shaped post 442 will abut against the bottom end of the inclined clamping arm 444. As the wedge-shaped post 442 continues to move downward, the tension of the tension spring 447 causes the inclined clamping arm 444 to close towards the middle, and its slope always fits against the outer slope of the wedge-shaped post 442. At the same time, the front end structure of the inclined clamping arm 444 will gradually approach the edge of the centered wafer until it fits tightly against the edge of the wafer, thus achieving initial clamping and fixing of the wafer.

[0021] After the inclined clamping arm 444 initially clamps the wafer, as the wedge block moves downward, the increasing clamping force causes the suction cup 458 to gradually press the wafer, thereby squeezing the gas inside the suction cup 458 into the front space of the piston rod 452. At this time, the suction cup 458 is in an inwardly concave state, thus using tension and pressure to adhere more tightly to the wafer surface, forming a stable adsorption state. The gas inside the suction cup 458 entering the front space of the piston rod 452 causes the sliding plug 456 to move backward, and the piston rod 452 moves backward synchronously. The entire clamping part of the suction cup 458 moves backward, compressing the buffer spring 453, and the buffer spring 453 cushions the impact. Throughout the process, the suction cup 458 keeps the wafer pressed firmly without causing excessive damage. When the clamping force is too great, the end of the piston rod 452 passes through the through hole between the trigger cylinder 454 and the air cylinder 451, causing the gravity plate 455 inside the trigger cylinder 454 to press down, forcing the gas inside the trigger cylinder 454 into the air cylinder 451, and then into the front end of the piston rod 452 through the air delivery channel of the piston rod 452. This pushes the sliding plug 456 to move forward in the opposite direction, allowing the gas to re-enter the suction cup 458, causing the suction cup 458 to bulge and eject the wafer. This ensures that the wafer will be ejected urgently when the clamping force is too great, avoiding damage to the wafer and affecting subsequent testing results.

[0022] Once the wafer is fully fixed and in a stable state, the drive motor 3 starts, driving the connecting seat 41 and the top fixing mechanism 4, and the wafer to rotate synchronously. At the same time, the infrared laser detector 6 moves down along the vertical guide rail 5 to the preset detection position, turns on the infrared laser detection function, and performs all-round infrared scanning detection on the wafer during the rotation process, continuously collecting the detection data of the wafer.

[0023] After the infrared detection operation is completed, the infrared laser detector 6 moves upward along the vertical guide rail 5 to the initial high position, and the drive motor 3 stops rotating. Then, the wafer is taken out away from the lifting platform 441, the pushing force of the wafer on the suction cup 458 disappears, the buffer spring 453 in the air cylinder 451 returns to its natural extended state, pushing the piston rod 452 back to the initial position, and the sliding plug 456 returns to the middle position of the front end of the piston rod 452 under its own gravity and the internal gas backflow, and the suction cup 458 retracts. At the same time, the lifting platform 441 moves upward under the elastic force of the reset spring 443, driving the wedge pile 442 back to the high position, the inclined clamping arm 444 opens outward under the squeezing action of the wedge pile 442, and the gravity pressure plate 455 returns to the top of the trigger cylinder 454 under pressure. The entire equipment returns to the initial standby state, waiting for the detection process of the next wafer to start.

Claims

1. A wafer infrared detection and testing device, comprising a worktable (1), characterized in that: The bottom of the workbench (1) is provided with a drive motor (3), the top of the drive motor (3) is connected to a fixing mechanism (4), and the top of the workbench (1) is provided with an infrared laser detector (6). The fixing mechanism (4) includes a connecting seat (41) fixedly installed at the output end of the drive motor (3). A base (42) is provided on the top of the connecting seat (41). A centering mechanism (43) and a clamping mechanism (44) are provided inside the base (42). An over-limit protection mechanism (45) is provided at the end of the clamping mechanism (44). The over-limit protection mechanism (45) includes an air cylinder (451), a piston rod (452) is slidably connected inside the air cylinder (451), a buffer spring (453) is provided between the tail end of the piston rod (452) and the inner wall of the air cylinder (451), a sliding plug (456) is slidably connected inside the front end of the piston rod (452), a hinge plate (457) is hinged to both ends of the sliding plug (456), a suction cup (458) is hinged to the other end of the hinge plate (457), and a sealing plate (459) is slidably connected inside the piston rod (452) at both ends of the sliding plug (456).

2. The wafer infrared detection and testing equipment according to claim 1, characterized in that: The over-limit protection mechanism (45) also includes a trigger cylinder (454) fixedly connected to the top of the clamping mechanism (44). A gravity pressure plate (455) is slidably connected inside the trigger cylinder (454). A through hole is provided between the trigger cylinder (454) and the air cylinder (451). An air delivery channel is provided at the center of the piston rod (452).

3. The wafer infrared detection and testing equipment according to claim 1, characterized in that: The centering mechanism (43) includes a circular groove (432) opened on the inner side of the base (42), and a ball (433) is rolled inside the circular groove (432). A spherical hinge (434) is provided on the outer side of the ball (433), and an elastic support plate (435) is provided at the other end of the spherical hinge (434).

4. The wafer infrared detection and testing equipment according to claim 3, characterized in that: The inner side of the base (42) is configured as a three-section conical surface (431), with the cone angle of the upper cone surface being 120°, the cone angle of the middle cone surface being 80°, and the cone angle of the lower cone surface being 60°.

5. The wafer infrared detection and testing equipment according to claim 1, characterized in that: The clamping mechanism (44) includes a lifting platform (441) slidably connected to the center of the base (42), a wedge-shaped post (442) is provided at the bottom of the lifting platform (441), and a return spring (443) is provided between the bottom of the lifting platform (441) and the base (42).

6. The wafer infrared detection and testing equipment according to claim 5, characterized in that: The clamping mechanism (44) further includes a fixed cylinder (445) fixedly connected inside the base (42). A slide rod (446) is slidably connected inside the fixed cylinder (445). A tension spring (447) is provided between the slide rod (446) and the inside of the fixed cylinder (445). Two fixed rings (448) are provided at the front end of the slide rod (446), and a slope clamping arm (444) is fixedly connected between the two fixed rings (448). The bottom end of the slope clamping arm (444) abuts against the outer slope of the wedge-shaped pile (442).

7. The wafer infrared detection and testing equipment according to claim 1, characterized in that: The rear end of the suction cup (458) is connected to the end of the piston rod (452) via a telescopic hose, and the interior of the suction cup (458) is a hollow inflatable structure.

8. The wafer infrared detection and testing equipment according to claim 1, characterized in that: The bottom of the workbench (1) is provided with four balancing legs (2), the top of the workbench (1) is provided with a vertical guide rail (5), and the infrared laser detector (6) is provided on the sliding end face of the vertical guide rail (5).

Images