Novel ruggedized computer board card heat dissipation device and method

Abstract

The invention provides a board card liquid cooling heat dissipation device for a ruggedized computer. The board card liquid cooling heat dissipation device comprises a liquid cooling source, a liquid cooling diverter and at least one liquid cooling plate. The liquid cooling flow divider is provided with a main inlet and a plurality of branch outlets; the main inlet is detachably connected with an output pipeline of the liquid cooling source through a first fluid connector; the outlet of each branch is detachably connected with the inlet of one liquid cooling plate through a second fluid connector; the liquid cooling plate is used for being in direct thermal contact with a heating chip on a board card in the ruggedized computer; cooling liquid sequentially flows through the first fluid connector, the liquid cooling flow divider and the second fluid connector from the liquid cooling source, enters the liquid cooling plate, takes away heat and then flows back. Compared with a traditional heat dissipation mode, the problem that the heat dissipation efficiency is low due to the fact that air-cooled heat dissipation makes contact with a heating device indirectly through an air channel is solved, the heat dissipation efficiency can be improved, meanwhile, the space occupied by installation of a fan can be saved, the size of the ruggedized computer is reduced, the production cost is reduced, and benefits are improved.

Description

Technical Field

[0001] This invention relates to the field of computer heat dissipation technology, specifically to a novel heat dissipation device and method for ruggedized computer boards. Background Technology

[0002] As military ruggedized computers become increasingly smaller and more integrated, the demand for internal heat dissipation is also constantly increasing. Traditional heat dissipation uses air cooling, with fans placed at the rear of the chassis to remove heat dissipated from the internal circuit boards through air intake, thus achieving the purpose of cooling.

[0003] With the increasing integration of electronic technology, electronic devices are required to be smaller and smaller, and the number of components is increasing, resulting in a significant increase in power density and heat concentration. Simple air cooling is no longer sufficient, and liquid cooling is playing an increasingly important role in the overall system thermal design. Based on this, a novel heat dissipation device and method for ruggedized computer boards are proposed. Summary of the Invention

[0004] 1. The technical problem that the invention aims to solve: The present invention provides a novel heat dissipation device and method for ruggedized computer boards, in order to solve the technical problems existing in the background art.

[0005] 2. Technical Solution: To achieve the above objectives, the technical solution of the present invention is as follows: In a first aspect, the present invention provides a liquid cooling heat dissipation device for ruggedized computer circuit boards, comprising: Liquid cooling source, liquid cooling distributor, and at least one liquid cooling plate; The liquid-cooled distributor is equipped with a main inlet and multiple branch outlets; The main inlet is detachably connected to the output pipe of the liquid cooling source via a first fluid connector; Each of the branch outlets is detachably connected to the inlet of one of the liquid cooling plates via a second fluid connector; The liquid cooling plate is used to make direct thermal contact with the heat-generating chips on the circuit boards inside the ruggedized computer. The coolant flows from the liquid cooling source through the first fluid connector, the liquid cooling distributor, and the second fluid connector into the liquid cooling plate, where it carries away heat and then flows back.

[0006] A further improvement is that one end of the first fluid connector is connected to the liquid cooling source, and the other end is connected to the main inlet of the liquid cooling distributor.

[0007] A further improvement is that the second fluid connector includes a second plug and a second socket; the second socket is disposed on the branch outlet of the liquid-cooled splitter, and the second plug is disposed on the inlet of the liquid-cooled plate; the second plug and the second socket can be connected or separated.

[0008] A further improvement is that the second fluid connector has a push-lock structure, and the mating surfaces of the second plug and the second socket have a planar sealing structure, which can maintain a seal in both the plugged and unplugged states.

[0009] A further improvement is that the first fluid connector and the second fluid connector have the same push-lock and planar sealing structure.

[0010] A further improvement is that the liquid cooling plate and the board are designed as an integrated module.

[0011] A further improvement is that the integrated module can be detachably fixed to the chassis of the ruggedized computer using a puller.

[0012] Secondly, the present invention also provides a board heat dissipation method based on the above-described device, comprising the following steps: Connect the main inlet of the liquid-cooled distributor to an external liquid cooling source via the first fluid connector; Assemble the board with the heat-generating chip with the liquid cooling plate so that the heat-generating chip and the liquid cooling plate are in direct thermal contact. The assembled liquid cooling plate is connected and locked to the second fluid connector on the branch outlet of the liquid cooling splitter via the second fluid connector on it. Turn on the liquid cooling source to allow the coolant to circulate through the liquid cooling distributor, the second fluid connector, and the liquid cooling plate, directly carrying away the heat generated by the circuit board.

[0013] 3. Beneficial effects: Compared with the prior art, the technical solution provided by this invention has the following advantages: Compared with traditional heat dissipation methods, this invention solves the problem of low heat dissipation efficiency caused by air cooling indirectly contacting heat-generating components through air ducts. This method can not only improve heat dissipation efficiency, but also save the space occupied by installing fans, reduce the size of ruggedized computers, reduce production costs, and improve efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the housing of the present invention; Figure 3 For the present invention Figure 2 Diagram showing the connection relationships in the middle section; Figure 4 For the present invention Figure 3 A diagram illustrating the split state; Figure 5 This is a schematic diagram of the second socket structure of the present invention; Figure 6 This is a schematic diagram of the second plug structure of the present invention.

[0015] Figure label: 1-Liquid cooling plate; 2a-First fluid connector; 2b-Second fluid connector; 21b-Second plug; 22b-Second socket; 3-Liquid cooling splitter; 4-Board. Detailed Implementation

[0016] To facilitate understanding of the present invention, a more complete description of the invention will be given below with reference to the accompanying drawings, which illustrate several embodiments of the invention. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the invention will be more thorough and complete.

[0017] In this invention, unless otherwise explicitly specified and limited, the terms "installed," "connected," "linked," "fixed," and "equipped" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Example 1

[0018] Reference Figure 1-6 This invention provides a liquid cooling heat dissipation device for ruggedized computer circuit boards, comprising: Liquid cooling source, liquid cooling distributor 3 (two sets of liquid cooling separators 3 are used in this embodiment), and at least one liquid cooling plate 1; The liquid-cooled splitter 3 is provided with a main inlet and multiple branch outlets; The main inlet is detachably connected to the output pipe of the liquid cooling source via a first fluid connector 2a; Each of the branch outlets is detachably connected to an inlet of one of the liquid cooling plates 1 via a second fluid connector 2b; The liquid cooling plate 1 is used to make direct thermal contact with the heat-generating chip on the board 4 inside the rugged computer. The coolant flows from the liquid cooling source through the first fluid connector 2a, the liquid cooling distributor 3, and the second fluid connector 2b into the liquid cooling plate 1, where it carries away heat and then flows back.

[0019] The liquid-cooled distributor interface is designed as a single-input, multi-output type, with a blind-pluggable fluid connector at each interface. After the coolant enters the distributor, it enters the single liquid-cooled plate 1 through the branch interface. The liquid-cooled distributor 3 and the liquid-cooled plate 1 are connected by a fluid connector to realize the transfer of coolant. The board 4 is installed on the liquid-cooled plate 1, and the heat-generating chip is in direct contact with the liquid-cooled plate 1. The heat is directly transferred to the liquid-cooled plate 1. The coolant circulates in the liquid-cooled plate 1, carrying away the heat and keeping the board 4 within a suitable operating temperature range.

[0020] In a preferred embodiment, one end of the first fluid connector 2a is connected to the liquid cooling source, and the other end is connected to the main inlet of the liquid cooling distributor 3.

[0021] In a preferred embodiment, the second fluid connector 2b includes a second plug 21b and a second socket 22b; the second socket 22b is disposed on the branch outlet of the liquid-cooled distributor 3, and the second plug 21b is disposed on the inlet of the liquid-cooled plate 1; the second plug 21b and the second socket 22b can be connected or separated.

[0022] In a preferred embodiment, the second fluid connector 2b is a push-lock structure, and the mating surfaces of the second plug 21b and the second socket 22b are planar sealing structures, which can maintain a seal in both the plugged and unplugged states.

[0023] In a preferred embodiment, the first fluid connector 2a and the second fluid connector 2b have the same push-lock and planar sealing structure, and the first fluid connector 2a and the second fluid connector 2b are connected by a pipe, such as... Figure 4 As shown.

[0024] In a preferred embodiment, the liquid cooling plate 1 and the board 4 are designed as an integrated module.

[0025] In a preferred embodiment, the integrated module is detachably fixed to the chassis of the ruggedized computer using a puller. Example 2

[0026] The present invention also provides a board heat dissipation method based on the device described in Embodiment 1, comprising the following steps: The main inlet of the liquid-cooled distributor 3 is connected to an external liquid cooling source through the first fluid connector 2a; Assemble the board 4 with the heating chip and the liquid cooling plate 1 so that the heating chip and the liquid cooling plate 1 are in direct thermal contact. The assembled liquid cooling plate 1 is connected and locked to the second fluid connector 2b on the branch outlet of the liquid cooling splitter 3 via the second fluid connector 2b on it. Start the liquid cooling source to make the coolant circulate through the liquid cooling distributor 3, the second fluid connector 2b and the liquid cooling plate 1, directly carrying away the heat generated by the board 4.

[0027] It should be noted that since other structures inside the computer case of this invention are adjustments made based on the heat dissipation device of this invention, and are not the focus of this invention, they will not be described in detail.

[0028] The above-described embodiments are merely illustrative of certain implementations of the present invention, and are described in a relatively specific and detailed manner. However, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements are all within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A liquid cooling heat dissipation device for ruggedized computer circuit boards, characterized in that, include: Liquid cooling source, liquid cooling distributor (3), at least one liquid cooling plate (1). The liquid-cooled distributor (3) is provided with a main inlet and multiple branch outlets; The main inlet is detachably connected to the output pipe of the liquid cooling source via a first fluid connector (2a); Each of the branch outlets is detachably connected to the inlet of one of the liquid cooling plates (1) via a second fluid connector (2b); The liquid cooling plate (1) is used to make direct thermal contact with the heat-generating chip on the board (4) inside the ruggedized computer; The coolant flows from the liquid cooling source through the first fluid connector (2a), the liquid cooling distributor (3), and the second fluid connector (2b) into the liquid cooling plate (1), where it carries away heat and then flows back.

2. The circuit board liquid cooling heat dissipation device according to claim 1, characterized in that, One end of the first fluid connector (2a) is connected to the liquid cooling source, and the other end is connected to the main inlet of the liquid cooling distributor (3).

3. A liquid cooling heat dissipation device for ruggedized computer circuit boards according to claim 1 or 2, characterized in that, The second fluid connector (2b) includes a second plug (21b) and a second socket (22b); the second socket (22b) is disposed on the branch outlet of the liquid-cooled distributor (3), and the second plug (21b) is disposed on the inlet of the liquid-cooled plate (1). The second plug (21b) and the second socket (22b) can be connected or separated.

4. A liquid cooling heat dissipation device for ruggedized computer circuit boards according to claim 3, characterized in that, The second fluid connector (2b) is a push-lock structure, and the mating surfaces of the second plug (21b) and the second socket (22b) are planar sealing structures, which can maintain a seal in both the plugged and unplugged states.

5. A liquid cooling heat dissipation device for ruggedized computer circuit boards according to claim 4, characterized in that, The first fluid connector (2a) and the second fluid connector (2b) have the same push-lock and planar sealing structure.

6. A liquid cooling heat dissipation device for ruggedized computer circuit boards according to claim 1, characterized in that, The liquid cooling plate (1) and the board (4) are designed as an integrated module.

7. A liquid cooling heat dissipation device for ruggedized computer circuit boards according to claim 6, characterized in that, The integrated module is detachably fixed to the chassis of the ruggedized computer using a puller.

8. A method for heat dissipation of a circuit board based on the device of claim 1, characterized in that, Includes the following steps: The main inlet of the liquid-cooled distributor (3) is connected to an external liquid cooling source through the first fluid connector (2a); Assemble the board (4) with the heating chip with the liquid cooling plate (1) so that the heating chip and the liquid cooling plate (1) are in direct thermal contact. The assembled liquid cooling plate (1) is connected and locked to the second fluid connector (2b) on the branch outlet of the liquid cooling splitter (3) through the second fluid connector (2b) on it; Start the liquid cooling source to make the coolant circulate through the liquid cooling distributor (3), the second fluid connector (2b) and the liquid cooling plate (1), directly carrying away the heat generated by the board (4).

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