Semiconductor storage container detection method and cleaning equipment

Abstract

The invention relates to a semiconductor storage container detection method and cleaning equipment. The detection method comprises the steps that a semiconductor storage container to be cleaned is moved to a detection unit, the semiconductor storage container is made to be in the gravity direction of the semiconductor storage container, a cover body of the semiconductor storage container is located below a box body of the semiconductor storage container, and the detection unit is arranged in cleaning equipment; the cover body and the box body are separated, and a detection space exists between the cover body and the box body; and determining whether foreign matters exist on the cover body from the detection space. According to the detection method, the cleaning period of the cleaning equipment cannot be prolonged, and then the cleaning effect of the cleaning equipment is improved on the premise that the cleaning efficiency is guaranteed. Besides, the detection unit is arranged in the cleaning equipment, so that the space utilization efficiency in the cleaning equipment for the semiconductor storage container is improved, and the size of the equipment does not need to be additionally increased while a device for detecting the residual foreign matters in the semiconductor storage container is added.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a method for testing and cleaning equipment for semiconductor storage containers. Background Technology

[0002] In the semiconductor wafer manufacturing process, wafers are stored in FOUPs (Front Opening Unified Pods) for transfer between different process equipment. After undergoing various processes, especially wet chemical processes, contaminants adhere to the wafer surface. When stored inside the FOUP, these contaminants contaminate the FOUP through contact, potentially contaminating the next batch of wafers stored. Therefore, FOUPs are periodically cleaned using specialized equipment to ensure their cleanliness.

[0003] In reality, there are residual wafers in the FOUPs that are sent to the fully automatic cleaning machine for cleaning. The wafers or wafer fragments left in the FOUP will not only damage the fully automatic cleaning machine, but the residual wafers will also be damaged, causing significant losses to the wafer processing plant.

[0004] Therefore, it is necessary to check whether there are any wafer residues inside the FOUP before cleaning it.

[0005] However, confirming whether there are residual wafers inside the FOUP requires a separate detection mechanism, which affects the cleaning efficiency of the cleaning equipment. Summary of the Invention

[0006] In view of this, the present application provides a method for detecting and a cleaning device for semiconductor storage containers to solve at least one problem existing in the background art.

[0007] In a first aspect, embodiments of this application provide a method for detecting a semiconductor storage container, the detection method comprising:

[0008] In the transfer step, the semiconductor storage container to be cleaned is moved to the detection unit, with the cover of the semiconductor storage container located below the box of the semiconductor storage container. The detection unit is located inside the cleaning equipment and above the loading unit. The cleaning equipment is used to clean the semiconductor storage container.

[0009] In the container separation step, the drive mechanism separates the cover and the box, and forms a detection space between the cover and the box. The drive mechanism is located in the detection unit, and the height of the detection space is less than a first preset threshold.

[0010] The foreign object detection step involves confirming whether there is a foreign object on the cover from the detection space. The foreign object is an object other than the semiconductor storage container.

[0011] In conjunction with a first aspect of this application, in an alternative embodiment, the transfer step includes:

[0012] The semiconductor storage container to be cleaned is moved to the detection unit using a transfer unit. After the semiconductor storage container is moved to the detection unit, the transfer unit moves away from the detection unit.

[0013] In conjunction with a first aspect of this application, in an alternative embodiment, the transfer step includes:

[0014] The semiconductor storage container to be cleaned is moved to the detection unit using a conveying mechanism.

[0015] In conjunction with the first aspect of this application, in an optional embodiment, after the foreign object detection step, the method further includes the step of:

[0016] The driving mechanism drives the cover and the box to reset;

[0017] The unlocking mechanism locks the box body and the cover body together;

[0018] Send a request signal to the control unit;

[0019] The transfer unit moves to the detection unit;

[0020] The transfer unit picks up the semiconductor storage container inside the detection unit.

[0021] In conjunction with the first aspect of this application, in an optional embodiment, after the transfer unit grasps the semiconductor storage container within the detection unit, the method further includes the step of:

[0022] Remove the semiconductor storage container that has completed the test from the test unit;

[0023] When the presence of the foreign object is confirmed on the cover, the transfer unit performs a feeding operation on the semiconductor storage container;

[0024] Once it is confirmed that there are no foreign objects on the cover, the transfer unit transfers the semiconductor storage container to the cleaning unit, which is used to clean the semiconductor storage container.

[0025] In conjunction with the first aspect of this application, in an optional embodiment, before the transfer unit moves the semiconductor storage container to be cleaned to the detection unit, the step further includes:

[0026] The semiconductor storage container to be cleaned is moved to the loading unit, and the semiconductor storage container to be cleaned is weighed and tested.

[0027] Secondly, embodiments of this application also provide a method for detecting a semiconductor storage container, the detection method comprising:

[0028] The weighing and testing step involves weighing the semiconductor storage containers to be cleaned in the feeding unit, dividing them into those that pass the weighing test and those that fail.

[0029] In the transfer step, the transfer unit transfers the semiconductor storage container that failed the weighing test to the detection unit. The cover of the semiconductor storage container is located below the box of the semiconductor storage container. The detection unit is located inside the cleaning equipment, which is used to clean the semiconductor storage container. After the semiconductor storage container is moved to the detection unit, the transfer unit moves away from the detection unit.

[0030] In the container separation step, the drive mechanism separates the cover and the box of the semiconductor storage container that failed the re-inspection and is to be cleaned, and forms a detection space between the cover and the box. The drive mechanism is disposed in the detection unit, and the height of the detection space is less than a first preset threshold.

[0031] The foreign object detection step involves confirming whether there is a foreign object on the cover from the detection space. The foreign object is an object other than the semiconductor storage container.

[0032] In conjunction with a second aspect of this application, in an optional embodiment, after confirming the presence of a foreign object on the cover from the detection space, the method further includes the step of:

[0033] The driving mechanism drives the cover and the box to reset;

[0034] The unlocking mechanism locks the box body and the cover body together;

[0035] Send a request signal to the control unit;

[0036] The transfer unit moves to the detection unit;

[0037] The transfer unit picks up the semiconductor storage container inside the detection unit.

[0038] In conjunction with a second aspect of this application, in an optional embodiment, after the transfer unit grasps the semiconductor storage container within the detection unit, the method further includes the step of:

[0039] Remove the semiconductor storage container that has completed the test from the test unit;

[0040] When the presence of the foreign object is confirmed on the cover, the transfer unit performs a feeding operation on the semiconductor storage container;

[0041] Once it is confirmed that there are no foreign objects on the cover, the transfer unit transfers the semiconductor storage container to the cleaning unit, which is used to clean the semiconductor storage container.

[0042] Thirdly, embodiments of this application also provide a semiconductor storage container cleaning device, wherein the container includes a housing and a cover; the cleaning device includes a detection unit, a feeding unit, a cleaning unit, and a transfer unit.

[0043] The feeding unit is used to feed semiconductor storage containers;

[0044] The transfer unit is used to enable the semiconductor storage container to move between the feeding unit, the cleaning unit, and the detection unit;

[0045] The cleaning unit is used to clean the semiconductor storage container that has been tested by the detection unit.

[0046] The detection unit includes a detection device, which includes:

[0047] A support mechanism is provided for placing the semiconductor storage container. When the semiconductor storage container is placed on the support mechanism, the cover of the semiconductor storage container is located below the box body of the semiconductor storage container.

[0048] A driving mechanism is provided to drive the cover or the box to cause relative displacement between the cover and the box, and a gap exists between the cover and the box.

[0049] An unlocking mechanism, used to unlock and lock the housing and the cover;

[0050] A detection mechanism, used to confirm whether there are foreign objects on the cover through the gap;

[0051] The control unit is electrically connected to the drive mechanism, the unlocking mechanism, and the detection mechanism, and schedules the transfer unit.

[0052] The semiconductor storage container detection method provided in this application includes moving the semiconductor storage container to be cleaned to a detection unit, where the detection unit detects whether foreign matter remains inside the semiconductor storage container. Since the cleaning time of the semiconductor storage container is much longer than the detection time, detecting the semiconductor storage container in the detection unit does not prolong the cleaning cycle of the cleaning equipment, thereby improving the cleaning effect of the cleaning equipment while ensuring cleaning efficiency. Furthermore, the detection unit is located inside the semiconductor storage container cleaning equipment, above the loading unit, eliminating the need for a separate detection station and not occupying space in the horizontal plane of the equipment. This improves the space utilization efficiency inside the semiconductor storage container cleaning equipment, and while adding a detection device for foreign matter remaining inside the semiconductor storage container, it does not require additional increase in the size of the equipment.

[0053] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0054] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0055] Figure 1 This is a top view of the overall structure of the cleaning equipment provided in the embodiments of this application;

[0056] Figure 2 This is a side view of the overall structure of the cleaning equipment provided in an embodiment of this application;

[0057] Figure 3 A schematic diagram of a state structure of a detection device for a semiconductor memory container provided in an embodiment of this application;

[0058] Figure 4 Another schematic diagram of the state structure of the detection device for the semiconductor storage container provided in the embodiments of this application;

[0059] Figure 5 This is a schematic diagram of the overall process of the detection method for a semiconductor storage container provided in the first embodiment of this application;

[0060] Figure 6 This is a schematic diagram of the overall process of the detection method for a semiconductor storage container provided in the second embodiment of this application;

[0061] Figure 7 This is a schematic diagram of the overall process of the detection method for a semiconductor storage container provided in the third embodiment of this application.

[0062] Icon labels:

[0063] a. Semiconductor storage container; a1. Cover; a2. Box; b. Foreign object; c. Detection space;

[0064] 1. Cleaning unit; 2. Drying unit; 3. Transfer unit; 4. Loading unit; 5. Unloading unit;

[0065] 6. Detection unit; 60. Bracket; 61. Unlocking mechanism; 62. Drive mechanism; 621. Operating component; 622. Conveying component. Detailed Implementation

[0066] Exemplary embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope of the disclosure of the present application to those skilled in the art.

[0067] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0068] In the accompanying drawings, for clarity, the dimensions of layers, areas, and elements, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0069] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0070] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below,” “under,” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0071] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0072] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solution of this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0073] In existing technologies, the presence of foreign objects remaining in the FOUP before cleaning is currently determined by weighing. The weight of the FOUP is compared to that of a standard FOUP to determine if any foreign objects remain. Specific foreign objects include semiconductor substrates, semiconductor substrate fragments, and other objects that may be present in the semiconductor storage container and fall into the cleaning equipment during the cleaning process, causing damage.

[0074] Typically, a standard weight database is established for different brands and models of FOUPs. Then, the standard weight value in the database is matched with the actual value by reading the type label on the FOUP. If the difference exceeds the preset range, it is determined that there is foreign matter residue.

[0075] However, in actual use, the actual weight of a FOUP can sometimes differ significantly from its standard weight due to various reasons. Therefore, even if there are no foreign objects remaining inside the semiconductor storage container, false alarms may occur. While this can be mitigated by increasing the allowable range, excessively large adjustments can lead to situations where foreign objects are actually present inside the semiconductor storage container, but the alarm is not triggered due to the excessively large allowable range. Therefore, relying solely on weight detection is insufficient for accurately detecting foreign objects remaining in the FOUP.

[0076] To address the aforementioned technical problems, this application provides a semiconductor storage container detection device. This device is positioned above the loading unit of a semiconductor storage container cleaning equipment, eliminating the need for a separate detection station and improving the space utilization efficiency within the equipment. While adding a detection device for residual foreign matter (b) within the semiconductor storage container, it does not require additional equipment size. Furthermore, the semiconductor storage container detection device provided in this application does not rely solely on weight for detection, thus improving the detection accuracy of residual foreign matter in FOUPs.

[0077] The semiconductor storage container a includes a separable housing a2 and a cover a1. The semiconductor storage container a also includes a knob assembly. The housing a2 and the cover a1 are locked or unlocked by the knob assembly. That is, the knob assembly can achieve a closed connection between the cover a1 and the housing a2, or it can achieve the separation of the cover a1 and the housing a2.

[0078] like Figure 1 and Figure 2As shown in the embodiment of this application, the semiconductor storage container cleaning equipment includes a loading unit 4, a unloading unit 5, a cleaning unit 1, a drying unit 2, and a transfer unit 3. The loading unit 4 is used to move the semiconductor storage container to be cleaned to the working area, and the transfer unit 3 is used to realize the transfer of the semiconductor storage container a between the loading unit 4, the cleaning unit 1, the drying unit 2, and the unloading unit 5. The loading unit 4 and the unloading unit 5 are arranged side by side in the EFEM (Equipment Front End Module). The number of loading units 4 and unloading units 5 is set according to specific needs, and this embodiment of the application does not limit it. The transfer unit 3 is a robotic arm, but it can also be a robot, and this embodiment of the application does not limit it.

[0079] In this embodiment, the feeding unit includes a loading station and an unloading station located on both sides of the feeding port of the equipment, and a conveying component is provided between the loading station and the unloading station.

[0080] The semiconductor storage container cleaning equipment also includes a detection unit 6, which has multiple detection stations. When the semiconductor storage container cleaning equipment reaches its maximum capacity, the semiconductor storage containers a to be cleaned that have been detected in the detection unit are temporarily stored in the detection station. When the cleaning unit is idle, the transfer unit transfers the semiconductor storage containers to be cleaned into the cleaning unit. Similarly, when the semiconductor storage containers in the cleaning unit are cleaned and there is no waiting drying unit, the cleaned semiconductor storage containers a to be dried are temporarily stored in the detection station. When the drying unit is idle, the transfer unit transfers the semiconductor storage containers to be dried into the drying unit.

[0081] The semiconductor storage container testing device includes an unlocking mechanism 61, a driving mechanism 62, and a testing mechanism. The testing unit 6 has a bracket 60 for supporting the semiconductor storage container a. The unlocking mechanism 61, the driving mechanism 62, and the testing mechanism are all mounted on the bracket 60.

[0082] The semiconductor storage container is placed at the loading station outside the cleaning equipment via an external transfer unit, and then transferred to the unloading station inside the cleaning equipment via a conveying component.

[0083] The transfer unit 3 transports the semiconductor storage container a to be cleaned from the unloading station to the support 60 of the inspection unit 6, with the cover a1 of the semiconductor storage container a facing downwards. The unlocking mechanism 61 unlocks the semiconductor storage container, and the drive mechanism separates the container body a2 from the cover a1. After the semiconductor storage container a completes the inspection, the transfer unit 3 moves it away from the inspection unit 6. As an example, the unlocking mechanism 61 includes a rotary motor (not shown) and a working head (not shown). The working head is connected to the rotary motor and matches a knob assembly. The working head rotates under the driving force of the rotary motor, causing the knob assembly to rotate synchronously to lock or unlock the knob assembly. However, the structural principle of the unlocking mechanism 61 is not limited to this.

[0084] In this embodiment, the detection unit is located above the unloading station. It is understood that, on the one hand, to improve equipment efficiency, the movement distance and path of the transfer unit need to be minimized during the transfer of semiconductor storage containers between different stations. Positioning the detection unit above the unloading station shortens the time required to transfer the semiconductor storage containers from the unloading station to the detection unit. Furthermore, compared to detection units located in other positions, the detection unit in this embodiment is closer to the unloading unit. Therefore, when the detection unit detects an abnormality in the semiconductor storage container, the time required for the semiconductor storage container to exit the detection unit (i.e., to transfer the potentially problematic semiconductor storage container from the detection unit to outside the cleaning equipment via the transfer unit) is shorter. By reducing the time it takes for the semiconductor storage container to be removed from the detection unit, the time occupied by this process in the transfer unit is reduced, thereby improving the overall efficiency of the cleaning equipment.

[0085] Secondly, by placing the detection unit in the upper space of the entire equipment, in existing cleaning equipment, all processing units are placed on the same horizontal plane, resulting in a large amount of unused space above the processing units. The detection unit has a relatively simple structure and lower weight requirements on the equipment's load-bearing mechanism. Therefore, the detection unit can be placed in the upper space of the equipment. In this embodiment, by placing the detection unit above the unloading station, not only can the semiconductor storage container be transferred from the unloading station to the detection unit in a linear motion, but the detection unit placed above the cleaning equipment can also make full use of the space in the upper part of the equipment, thereby reducing the equipment's footprint. In semiconductor manufacturing plants, the cost of cleanrooms used to manufacture semiconductors is very high, and the equipment's footprint is one of the important parameters for measuring equipment performance. Reducing the equipment's footprint helps reduce the cost of using the equipment for customers, thereby improving the product's market competitiveness.

[0086] Thirdly, generally speaking, there are a certain amount of contaminants inside the semiconductor storage container sent into the detection unit. During the process of opening the semiconductor storage container for detection, the contaminants inside the semiconductor storage container can easily diffuse from the semiconductor storage container into the cleaning equipment, affecting the subsequent cleaning of the semiconductor storage container. Compared with other functional areas of the cleaning equipment (such as the areas corresponding to the washing and drying units), the cleanliness requirements of the EFEM area are relatively lower. In this embodiment, by setting the detection unit above the unloading station, the contaminants inside the semiconductor storage container can be effectively reduced from contaminating other functional units in the cleaning equipment when the semiconductor storage container is opened.

[0087] In an optional embodiment, a gas supply component is provided above the detection unit. The gas supply component continuously blows clean and dry gas into the detection unit, and the gas containing contaminants is discharged to the outside of the cleaning equipment by an exhaust component located below the EFEM, thereby reducing the impact of contaminants generated by the detection unit when detecting semiconductor storage containers on the cleaning equipment.

[0088] In an alternative embodiment, such as Figure 3 and Figure 4 As shown, the driving mechanism 62 acts on the cover a1 and drives the cover a1 to move downward a certain distance so that the cover a1 separates from the box a2. Thus, when there is a foreign object b remaining in the semiconductor storage container a, it can follow the cover a1 and move to the detection space c between the cover a1 and the box a2.

[0089] The detection space c is the space formed between the cover a1 and the box a2 after they are separated. Specifically, the lower boundary of this space is the bottom plane of the cover (i.e., the plane where the cover contacts the box), and the upper boundary is the opening plane of the box. The surrounding boundaries are formed by the side walls of the box extending vertically downwards. The distance between the opening plane of the box and the bottom plane of the cover is a first preset threshold. The detection mechanism can detect and confirm whether there are foreign objects in the detection space c. The foreign objects are objects other than the semiconductor storage container.

[0090] In an optional embodiment, the driving mechanism 62 acts on the housing a2 and drives the housing a2 to move upward a certain distance, so that the cover a1 and the housing a2 are separated. The foreign object falls to the lower surface of the cover under the action of gravity, and there is a distance between the cover a1 and the housing a2, so that when the foreign object b remains in the semiconductor storage container a, it is located in the gap between the cover a1 and the housing a2.

[0091] As an example, the drive mechanism 62 includes an operating element 621 and a conveying assembly 622. The operating element 621 is connected to the conveying assembly 622, which is mounted on the bracket 60. The conveying direction of the conveying assembly 622 is vertical. The operating element 621 acts on the box a2 or the cover a1 and moves upward or downward under the action of the conveying assembly 622 to separate the cover a1 from the box a2. Of course, the structure of the drive mechanism 62 is not limited to this. The operating element 621 is a top block, which lifts the box a2 under the action of the conveying assembly 622 to separate the cover a1 from the box a2. The operating element 621 can also be other components, which are not limited in this embodiment.

[0092] The detection mechanism is used to detect whether there is a foreign object b on the separated cover a1. The detection mechanism can be used by means of grating, sensor or camera, etc., and this application embodiment does not limit it.

[0093] Please refer to Figure 4 When a complete semiconductor substrate remains inside the semiconductor storage container, the semiconductor storage container a has a slot for containing the foreign object b, ensuring that the foreign object b will not tilt even when the cover a1 is facing downwards. When the housing a2 moves upwards and separates from the cover a1, the foreign object b inside the semiconductor storage container a is located on the cover a1 and can be positioned in the gap between the housing a2 and the cover a1 as the housing a2 moves upwards. When the cover a1 moves downwards, the foreign object b inside the semiconductor storage container a moves along the slot with the cover a1 and is positioned in the gap between the housing a2 and the cover a1. During the separation process of the housing a2 and the cover a1, the foreign object b remains on the cover a1, and the small separation distance between the housing a2 and the cover a1 greatly reduces the possibility of damage to the foreign object b.

[0094] The semiconductor storage container testing device provided in this application embodiment, after using the transfer unit 3 to move the semiconductor storage container a to be cleaned to the testing unit 6, does not require further transfer. Furthermore, during the entire testing process, only the transfer unit 3 is needed to move the semiconductor storage container a to be cleaned to the testing unit 6. Subsequent unlocking of the semiconductor storage container a, lifting of the housing a2 or cover a1, and testing of the semiconductor storage container a do not require the use of the transfer unit 3, greatly reducing the time occupied by the transfer unit 3, improving testing efficiency, and further improving the cleaning efficiency of the semiconductor storage container a. In an optional embodiment, the semiconductor storage container testing device also includes a weighing mechanism (not shown in the figure), located outside the testing unit 6 at the unloading station 4. The weighing mechanism includes a weighing unit and a comparison unit. The weighing unit is used to weigh the semiconductor storage container a and obtain its weight value. The comparison unit is used to compare the weight value measured by the weighing unit with the standard weight value stored in the database. When the difference between the actual weight value and the standard weight value is within the preset range, it indicates that the semiconductor storage container a is in normal condition; when the difference between the actual weight value and the standard weight value exceeds the preset range, it indicates that the semiconductor storage container a is in abnormal condition.

[0095] Understandably, for most semiconductor storage containers a, when there is no foreign object b inside, the weight of semiconductor storage container a matches the weight in the standard database. Weighing detection can eliminate more than 90% of semiconductor storage containers a that do not contain foreign object b, thereby reducing the impact of opening detection on the overall efficiency of the cleaning equipment. Furthermore, by controlling the difference between the actual weight value and the standard weight value of semiconductor storage container a within a preset range, and setting corresponding preset ranges based on the type of semiconductor storage container, the material of the semiconductor storage container, and the foreign object loaded inside the semiconductor storage container, the identification rate of abnormal semiconductor storage containers a is improved, while the false detection rate is reduced.

[0096] The weighing mechanism is installed in the feeding unit 4 and can weigh the semiconductor storage container a during the feeding process, eliminating the need for a separate weighing operation for semiconductor storage container a. Weighing semiconductor storage container a by the weighing mechanism does not increase the time required for cleaning semiconductor storage container a, nor does it increase the space occupied. As an example, the weighing mechanism is a load cell, but it is not limited to this.

[0097] The cleaning equipment provided in this embodiment has multiple semiconductor storage container detection stations at its detection unit 6. These multiple stations ensure continuous operation of the equipment and prevent disruption to normal operation due to a malfunction in one station. Similarly, when an abnormal semiconductor storage container is detected, that station is temporarily suspended, while the other stations continue to detect semiconductor storage containers normally. Once the semiconductor storage container in the previous station is removed, the station resumes operation.

[0098] In this embodiment, multiple semiconductor storage container testing stations are set up to test semiconductor storage containers that need to be tested. For semiconductor storage containers that do not need to be tested or that have already been tested, the semiconductor storage containers are transferred to the cleaning unit when the cleaning unit is idle.

[0099] In one optional embodiment, the first preset threshold is determined comprehensively based on the type of semiconductor storage container, the spacing of the slots used to limit the substrate, the distance between the upper surface of the slots and the opening of the box, the thickness of the substrate, and the size of the substrate.

[0100] In this embodiment, if the semiconductor storage container contains a substrate or substrate fragments, when the gap between the housing and the cover is too large, the substrate or substrate fragments will fall into the cleaning equipment through the detection space c. This not only fails to achieve the purpose of detection, but also increases the range of substrate or substrate fragments falling into the cleaning equipment.

[0101] Understandably, although the slot inside the box can limit the substrate or substrate fragment, the slot still provides a certain amount of sliding space for the substrate or substrate fragment. When the gap between the box and the cover is too large, the substrate or substrate fragment can slide out from the gap.

[0102] In the above embodiments, the first preset threshold is between 5mm and 50mm.

[0103] In an optional embodiment, the detection device is provided with a limiting mechanism to prevent misalignment between the box a2 and the cover a1 when the box a2 lifts and the cover a1 descends.

[0104] Example 1

[0105] This application also provides a method for detecting semiconductor storage containers, such as... Figure 5 As shown, it includes the following steps:

[0106] S11. Move the semiconductor storage container to be cleaned onto the support of the detection unit, and ensure that the cover of the semiconductor storage container is below the box body in the direction of gravity.

[0107] The semiconductor storage container to be cleaned, located in the loading unit, is transported to the support in the inspection unit using a transfer unit. During the transfer from the loading unit to the inspection unit, the semiconductor storage container is flipped over so that its opening faces downwards. When the semiconductor storage container is placed on the support, the cover contacts the support.

[0108] In this step, the transfer unit moves the semiconductor storage container onto the support of the inspection unit and then resets. Subsequent inspection operations no longer require the assistance of the transfer unit, which can perform other tasks, such as picking up containers to be transferred from other inspection stations and moving them to the processing unit. By improving the efficiency of the transfer unit, the cleaning efficiency of the entire semiconductor storage container cleaning equipment can be improved.

[0109] When the cleaning equipment is operating at full capacity, in order to improve the efficiency of the cleaning equipment, the semiconductor storage containers in the feeding unit are transferred to the detection unit. That is, the detection unit is full of semiconductor storage containers. Since the time required for opening and detecting semiconductor storage containers is much shorter than the time required for cleaning in the cleaning unit (generally, cleaning a single semiconductor storage container takes 3-5 minutes, while opening and detecting takes 10-60 seconds), opening and detecting semiconductor storage containers in the detection unit will not affect the efficiency of the cleaning equipment.

[0110] In an optional embodiment, a conveying mechanism is used to move the semiconductor memory container to be cleaned to the inspection unit. As an example, the conveying mechanism is a slide rail mechanism. The transfer unit is not required until the semiconductor memory container passes inspection, further reducing the involvement of the transfer unit in the inspection process.

[0111] Before step S11, the semiconductor storage container is placed at the loading station in the feeding unit, and then the semiconductor storage container is sent to the unloading station inside the cleaning equipment by the conveying component.

[0112] It should be noted that, due to the size limitations of the entire cleaning equipment, only one transfer unit is configured within it. In contrast, cleaning equipment typically has multiple drying and cleaning units. The transfer of semiconductor storage containers within the cleaning equipment relies entirely on this transfer unit. Therefore, the overall cleaning efficiency is affected by the transfer unit. To reduce equipment failure rates and the risk of product damage during processing, the cleaning equipment needs to be equipped with a transfer unit with high movement precision. Given the limitations of existing transfer units, high-speed, high-precision transfer units are more expensive, while slower, high-precision transfer units are relatively cheaper. By reducing the time spent on transfer units during detection steps, the transfer efficiency of the transfer unit can be improved, thereby enhancing the overall efficiency of the cleaning equipment. This ensures that even slower, high-precision transfer units can meet the requirements of the cleaning equipment, preventing a decrease in cleaning efficiency due to the transfer unit being unable to transfer the processed containers in time.

[0113] S12, Unlock the semiconductor storage container.

[0114] The knob assembly of the semiconductor storage container is matched with the unlocking mechanism. The knob assembly rotates and unlocks under the action of the unlocking mechanism to unlock the box and the cover.

[0115] S13. Separate the cover and the box to create a detection space between them.

[0116] The cover is moved downwards by a drive mechanism, or the box is moved upwards by a drive mechanism, that is, along... Figure 4 The arrow 's' shown in the figure is directed to create a detection space between the box and the cover. The drive mechanism is located in the detection unit. The height of the detection space is less than a first preset threshold. The first preset threshold is based on the detection mechanism's ability to detect the detection space. When the height of the detection space is greater than or equal to the first preset threshold, the fragments located inside the box and the cover may detach from the cover, affecting the accuracy of the measurement.

[0117] S14. Inspect the detection space between the lid and the box to confirm whether there are any foreign objects on the lid.

[0118] The lid is inspected using a detection mechanism, exemplified by a through-beam grating. If there are no foreign objects inside the semiconductor storage container, the gap between the container and the lid will not be obstructed after separation, allowing the laser emitted by the through-beam grating to pass through the area. Conversely, laser light emitted from one side of the lid will be blocked by foreign objects and cannot be received by the receiving device on the other side. Alternatively, sensors, cameras, or other similar devices can be used to confirm the presence of foreign objects on the lid. In this embodiment, the container is placed in the loading unit by an external transfer mechanism, then transferred from outside the equipment to inside via the loading unit, and finally directly transferred to the detection unit via a transfer unit. This means the container undergoes no inspection in the loading unit and is directly subjected to "open-lid inspection" at the detection station. Compared to weighing inspection, "open-lid inspection" has a higher accuracy rate, avoiding missed or incorrect detections.

[0119] S15, the drive mechanism is reset, and the casing and cover of the semiconductor storage container are locked.

[0120] The unlocking mechanism is used to match the knob assembly of the semiconductor storage container to relock the box and the cover.

[0121] S16. Send a request signal to the control unit.

[0122] By sending a request signal to the control unit, the transfer unit can be scheduled in advance, reducing the scheduling time of the transfer unit and improving overall efficiency. At the same time, by scheduling the transfer unit in advance, the transfer unit can perform other tasks during the container inspection process, and then move to the inspection station to pick up the container after receiving the scheduling signal, thereby improving the utilization efficiency of the transfer unit.

[0123] S17. Remove the semiconductor storage container that has completed the test from the support of the test unit.

[0124] When step S14 confirms that there is a foreign object on the cover, the semiconductor storage container is moved to the unloading mechanism using the transfer unit.

[0125] When step S14 confirms that there are no foreign objects on the cover, it checks whether there is a cleaning unit in standby mode. If there is, the semiconductor storage container is moved to the cleaning unit for cleaning using the transfer unit. If not, it waits for the cleaning unit to complete the cleaning operation before moving the semiconductor storage container to the cleaning unit for cleaning.

[0126] In an optional embodiment, step S16 further includes confirming the status of the next workstation of the semiconductor storage container based on the detection result of step S14. If the semiconductor storage container detection result is unqualified, confirm whether the unloading mechanism is occupied by the semiconductor storage container. If not, request the scheduling of the transfer unit; otherwise, wait for the unloading mechanism to be idle before scheduling. If the semiconductor storage container detection result is qualified, confirm whether there is an idle cleaning unit waiting. If so, request the scheduling of the transfer unit; otherwise, the semiconductor storage container in the cleaning unit is idle.

[0127] Example 2

[0128] This application also provides a method for detecting semiconductor storage containers, such as... Figure 6 As shown, it includes the following steps:

[0129] S21. Move the semiconductor storage container to be cleaned to the feeding unit, weigh the semiconductor storage container to be cleaned, and divide the semiconductor storage container to be cleaned into semiconductor storage containers that pass the weighing test and semiconductor storage containers that fail the weighing test.

[0130] S22. The transfer unit transfers the semiconductor storage container that failed the weighing test to the detection unit. The cover of the semiconductor storage container is located below the box body of the semiconductor storage container. The detection unit is located inside the cleaning equipment, which is used to clean the semiconductor storage container. After the semiconductor storage container is moved to the detection unit, the transfer unit moves away from the buffer unit.

[0131] S24. The drive mechanism separates the cover and the box of the semiconductor storage container that failed the weighing test, and forms a detection space between the cover and the box. The drive mechanism is set in the detection unit. The height of the detection space is less than a first preset threshold. The first preset threshold is based on the detection mechanism's ability to detect the detection space. When the height of the detection space is greater than or equal to the first preset threshold, the fragments located in the box and the cover may detach from the cover, affecting the accuracy of the measurement.

[0132] S25. Confirm from the detection space whether there are foreign objects on the cover.

[0133] The semiconductor storage containers located at the loading unit are weighed and tested, and a weighing error tolerance value is set, which is the difference between the actual weight and the standard weight of the semiconductor storage container. When the weighing test result is abnormal, that is, exceeding the weighing error tolerance value, the semiconductor storage container with abnormal weighing test result, that is, the semiconductor storage container that fails the weighing test and needs to be cleaned, is moved to the testing unit for testing using the transfer unit. For semiconductor storage containers that pass the weighing test, they are moved to the cleaning unit for cleaning using the transfer unit, without needing to perform steps S22 to S24. This embodiment can set a smaller weighing error tolerance value, that is, a more stringent one, which can ensure the detection effect and greatly improve the detection efficiency of whether there are foreign objects remaining in the semiconductor storage container.

[0134] In the above embodiments, the allowable weighing error is set comprehensively based on factors such as the type of semiconductor storage container, the material of the semiconductor storage container, the type of substrate loaded inside the semiconductor storage container, the number of times the semiconductor storage container is used, the detection efficiency of the entire device, and the false judgment rate.

[0135] Understandably, on the one hand, different types of unloaded semiconductor memory containers have different weights, and the weight difference between unloaded semiconductor memory containers of the same type also varies. Therefore, the allowable weighing error value needs to be set according to the type of semiconductor memory container. Similarly, the material of the semiconductor memory container, the type of substrate loaded inside the semiconductor memory container, and the number of times the semiconductor memory container has been used will also affect the value of the allowable weighing error. On the other hand, when the allowable weighing error is set too low, the difference between the actual weight and the theoretical weight of the unloaded semiconductor memory container is greater than the allowable weighing error, causing qualified semiconductor memory containers to be falsely detected, thereby reducing the detection efficiency of the equipment. On the other hand, when the allowable weighing error is set too high, there may be a situation where the difference between the actual weight of a semiconductor memory container containing substrates or substrate fragments and the theoretical weight of the unloaded semiconductor memory container is less than the allowable weighing error, resulting in problematic semiconductor memory containers not being detected, affecting the overall false judgment rate of the equipment. Therefore, the allowable weighing error value needs to be determined comprehensively by considering many factors.

[0136] In an optional embodiment, the following is included before step S24:

[0137] S23. The semiconductor storage container is unlocked by the unlocking mechanism so that the housing and the cover are unlocked. The unlocking mechanism is located in the detection unit.

[0138] In an optional embodiment, the step S25 is followed by the step:

[0139] S26. The driving mechanism drives the cover and the box to reset, and the unlocking mechanism locks the cover and the box.

[0140] In an optional embodiment, the step S26 is further included by:

[0141] S27. Send a request signal to the control unit, and the transfer unit grabs the semiconductor storage container in the detection unit.

[0142] In an optional embodiment, the step S26 is further included by:

[0143] S28. Remove the semiconductor storage container that has completed the detection from the detection unit.

[0144] When the presence of the foreign object is confirmed on the cover in step S25, the transfer unit performs a feeding operation on the semiconductor storage container.

[0145] When it is confirmed in step S25 that no foreign object is present on the cover, the transfer unit moves the semiconductor storage container to the cleaning unit, which cleans the semiconductor storage container. In an optional embodiment, for semiconductor storage containers that have passed the weighing test, a robotic arm transfers the semiconductor storage container from the loading unit to the cleaning unit.

[0146] In the above embodiment, it is determined whether the cleaning unit is idle. If not, the process is transferred to the detection unit. Once the cleaning unit is idle, the semiconductor storage container is transferred from the detection unit to the cleaning unit.

[0147] Example 3

[0148] This application also provides a method for detecting semiconductor storage containers, such as... Figure 7 As shown, it includes the following steps:

[0149] S31. Move the semiconductor storage container to be cleaned to the feeding unit, weigh the semiconductor storage container to be cleaned, and divide the semiconductor storage container to be cleaned into semiconductor storage containers that pass the weighing test and semiconductor storage containers that fail the weighing test.

[0150] S32. The semiconductor storage container to be cleaned is moved to the detection unit. The cover of the semiconductor storage container is located below the box of the semiconductor storage container. The detection unit is located inside the cleaning equipment. The cleaning equipment is used to clean the semiconductor storage container.

[0151] S34. The drive mechanism separates the cover and the box of the semiconductor storage container that failed the weighing test, and makes a detection space exist between the cover and the box. The drive mechanism is set in the detection unit. The height of the detection space is less than a first preset threshold. The first preset threshold is based on the detection mechanism's ability to detect the detection space. When the height of the detection space is greater than or equal to the first preset threshold, the fragments located in the box and the cover may detach from the cover, affecting the accuracy of the measurement.

[0152] S35. Confirm from the detection space whether there are foreign objects on the cover.

[0153] The semiconductor storage container located at the loading unit is weighed and tested, and a weighing error tolerance value is set, which is the difference between the actual weight and the standard weight of the semiconductor storage container. Regardless of whether the semiconductor storage container to be cleaned passes the weighing test or fails the weighing test, the semiconductor storage container at the loading unit is transferred to the testing unit equipped with a semiconductor storage container testing device, and the semiconductor storage container is tested in the order of steps S32-S34.

[0154] In this embodiment, the semiconductor storage container after weighing is further tested. Both the semiconductor storage container that passes the weighing test and the semiconductor storage container that fails the weighing test are reconfirmed, which can improve the accuracy and precision of the test.

[0155] When the confirmation result in step S35 does not match the weighing test result in step S31, that is, the test result in step S31 is that the weighing test is qualified, but the confirmation result in step S35 is that there is a foreign object on the cover; or the test result in step S31 is that the weighing test is unqualified, but the confirmation result in step S35 is that there is no foreign object on the cover. In the above situations, the semiconductor storage container can be reconfirmed to ensure the accuracy and precision of the test.

[0156] Understandably, even when opening semiconductor memory containers for inspection, missed detections can occur due to reasons such as substrate fragments adhering to the inner wall of the container and not falling onto the lid surface after opening, the inspection equipment failing to distinguish fallen substrate fragments, and equipment malfunctions. Therefore, for cleaning equipment used to load semiconductor memory containers with advanced process substrates, secondary inspection is needed to reduce the probability of missed detections, improve inspection accuracy, and avoid damage to the cleaning equipment caused by missed detections.

[0157] In an optional embodiment, in step S34, for semiconductor storage containers whose detection result in step S31 is that the weighing test is unqualified, the value of the first preset threshold is smaller, further reducing the risk of foreign objects falling into the cleaning equipment from the semiconductor storage container.

[0158] In an optional embodiment, the step S34 is further included:

[0159] S33. The semiconductor storage container is unlocked by the unlocking mechanism so that the housing and the cover are unlocked. The unlocking mechanism is located in the detection unit.

[0160] In an optional embodiment, the step S35 is followed by the step:

[0161] S36. The drive mechanism drives the cover and the box to reset, the unlocking mechanism locks the cover and the box, sends a request signal to the control unit, and the transfer unit grabs the semiconductor storage container in the detection unit.

[0162] In an optional embodiment, the step S35 is followed by the step:

[0163] S37. Remove the semiconductor storage container that has completed the detection from the detection unit.

[0164] When the presence of the foreign object is confirmed on the cover in step S35, the transfer unit performs a feeding operation on the semiconductor storage container.

[0165] When it is confirmed in step S35 that there are no foreign objects on the cover, the transfer unit moves the semiconductor storage container to the cleaning unit, which is used to clean the semiconductor storage container.

[0166] It should be noted that the actual weight of the empty semiconductor storage container mostly matches the weight in the standard database, with a few exceptions. Weighing can greatly improve detection efficiency and ensure detection results.

[0167] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations included in the claims. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A method for detecting a semiconductor storage container, characterized in that, The detection method includes: In the transfer step, the semiconductor storage container to be cleaned is moved to the detection unit, with the cover of the semiconductor storage container located below the box of the semiconductor storage container. The detection unit is located inside the cleaning equipment and above the loading unit. The cleaning equipment is used to clean the semiconductor storage container. In the container separation step, the drive mechanism separates the cover and the box, and forms a detection space between the cover and the box. The drive mechanism is located in the detection unit, and the height of the detection space is less than a first preset threshold. The foreign object detection step involves confirming whether there is a foreign object on the cover from the detection space. The foreign object is an object other than the semiconductor storage container.

2. The method for detecting a semiconductor storage container according to claim 1, characterized in that, The transfer step includes: The semiconductor storage container to be cleaned is moved to the detection unit using a transfer unit. After the semiconductor storage container is moved to the detection unit, the transfer unit moves away from the detection unit.

3. The method for detecting a semiconductor storage container according to claim 1, characterized in that, The transfer step includes: The semiconductor storage container to be cleaned is moved to the detection unit using a conveying mechanism.

4. The detection method for a semiconductor storage container according to claim 1, characterized in that, Following the foreign object detection step, the following step is also included: The driving mechanism drives the cover and the box to reset; The unlocking mechanism locks the box body and the cover body together; Send a request signal to the control unit; The transfer unit moves to the detection unit; The transfer unit picks up the semiconductor storage container inside the detection unit.

5. The method for detecting a semiconductor storage container according to claim 4, characterized in that, After the transfer unit picks up the semiconductor storage container from the detection unit, the process further includes the following steps: Remove the semiconductor storage container that has completed the test from the test unit; When the presence of the foreign object is confirmed on the cover, the transfer unit performs a feeding operation on the semiconductor storage container; Once it is confirmed that there are no foreign objects on the cover, the transfer unit transfers the semiconductor storage container to the cleaning unit, which is used to clean the semiconductor storage container.

6. The method for detecting a semiconductor storage container according to claim 1, characterized in that, Before the transfer unit moves the semiconductor storage container to be cleaned to the detection unit, the following steps are also included: The semiconductor storage container to be cleaned is moved to the loading unit, and the semiconductor storage container to be cleaned is weighed and tested.

7. A method for detecting a semiconductor storage container, characterized in that, The detection method includes: The weighing and testing step involves weighing the semiconductor storage containers to be cleaned in the feeding unit, dividing them into those that pass the weighing test and those that fail. In the transfer step, the transfer unit transfers the semiconductor storage container that failed the weighing test to the detection unit. The cover of the semiconductor storage container is located below the box of the semiconductor storage container. The detection unit is located inside the cleaning equipment, which is used to clean the semiconductor storage container. After the semiconductor storage container is moved to the detection unit, the transfer unit moves away from the detection unit. In the container separation step, the drive mechanism separates the cover and the box of the semiconductor storage container that failed the re-inspection and is to be cleaned, and forms a detection space between the cover and the box. The drive mechanism is disposed in the detection unit, and the height of the detection space is less than a first preset threshold. The foreign object detection step involves confirming whether there is a foreign object on the cover from the detection space. The foreign object is an object other than the semiconductor storage container.

8. The method for detecting a semiconductor storage container according to claim 7, characterized in that, After confirming the presence of foreign objects on the cover from the detection space, the method further includes the following steps: The driving mechanism drives the cover and the box to reset; The unlocking mechanism locks the box body and the cover body together; Send a request signal to the control unit; The transfer unit moves to the detection unit; The transfer unit picks up the semiconductor storage container inside the detection unit.

9. The method for detecting a semiconductor storage container according to claim 8, characterized in that, After the transfer unit picks up the semiconductor storage container from the detection unit, the process further includes the following steps: Remove the semiconductor storage container that has completed the test from the test unit; When the presence of the foreign object is confirmed on the cover, the transfer unit performs a feeding operation on the semiconductor storage container; Once it is confirmed that there are no foreign objects on the cover, the transfer unit transfers the semiconductor storage container to the cleaning unit, which is used to clean the semiconductor storage container.

10. A semiconductor storage container cleaning device, the container comprising a housing and a lid; characterized in that, The cleaning equipment includes a detection unit, a feeding unit, a cleaning unit, and a transfer unit. The feeding unit is used to feed semiconductor storage containers; The transfer unit is used to enable the semiconductor storage container to move between the feeding unit, the cleaning unit, and the detection unit; The cleaning unit is used to clean the semiconductor storage container that has been tested by the detection unit. The detection unit includes a detection device, which includes: A support mechanism is provided for placing the semiconductor storage container. When the semiconductor storage container is placed on the support mechanism, the cover of the semiconductor storage container is located below the box body of the semiconductor storage container. A driving mechanism is provided to drive the cover or the box to cause relative displacement between the cover and the box, and a gap exists between the cover and the box. An unlocking mechanism, used to unlock and lock the housing and the cover; A detection mechanism, used to confirm whether there are foreign objects on the cover through the gap; The control unit is electrically connected to the drive mechanism, the unlocking mechanism, and the detection mechanism, and schedules the transfer unit.

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