Display module and display device

Abstract

The invention discloses a display module (000) and a display device. The display module (000) comprises a display panel (100), a flexible circuit board (200) and a first supporting part (300), by making the distance between the first portion (201) in the flexible circuit board (200) and the first panel portion (101) equal to the distance between the second portion (202) in the flexible circuit board (200) and the first panel portion (101), it can be ensured that the flexible circuit board (200) is not in a bent state, thereby making a conductive layer (220) integrated inside the flexible circuit board (200) not have rebound force. Therefore, the second part (202) in the flexible circuit board (200) does not apply a pulling force to the back surface of the second panel part (102) in the display panel (100), so that the flatness of the back surface of the first panel part (101) in the display panel (100) is high, and the probability that the front surface of the display module (000) has impressions can be effectively reduced.

Description

Display module and display device Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the development of display technology, the demand for and application range of display devices are constantly expanding. Commonly used display devices include mobile phones, televisions, tablets, laptops, and monitors.

[0003] Display devices typically include a display module and a frame (often referred to as a mid-frame). The display module may include a display panel and a flexible circuit board bonded to the display panel, which is usually located on the back of the display panel.

[0004] However, the flatness of the flexible circuit board on the back of the display panel is usually low. During the assembly process of the display panel and the flexible circuit board, the flexible circuit board will exert additional force on the back of the display panel, which will result in defects such as marks on the front of the display module, thus leading to low reliability of the display module.

[0005] Summary of the Invention

[0006] This application provides a display module and a display device. It can solve the problem of low reliability in existing display modules. The technical solution is as follows:

[0007] On the one hand, a display module is provided, including: a display panel, a flexible circuit board, and a first support portion;

[0008] The display panel includes: a first panel portion and a second panel portion, and a panel bending portion for connecting the first panel portion and the second panel portion. The first panel portion has a display surface and a back surface disposed opposite to the display surface. The second panel portion is disposed on one side of the back surface of the first panel portion.

[0009] The flexible circuit board is distributed on one side of the back of the first panel portion, and the flexible circuit board includes: a first part and a second part, and a connecting part for connecting the first part and the second part, wherein the first part is bonded to the side of the second panel portion opposite to the first panel portion.

[0010] The first support portion is located between the second portion and the back of the first panel portion;

[0011] The distance between the first part and the first panel portion is equal to the distance between the second part and the first panel portion.

[0012] Optionally, the distance between the connecting portion and the first panel portion is equal to the distance between the first portion and the first panel portion.

[0013] Optionally, the side of the first portion facing the first panel portion is coplanar with the side of the second portion facing the first panel portion, and is also coplanar with the side of the connecting portion facing the first panel portion;

[0014] The side of the flexible circuit board facing the first panel is parallel to the back side of the first panel.

[0015] Optionally, the display module further includes a second support portion located between the first panel portion and the second panel portion;

[0016] The thickness of the first support portion is greater than the thickness of the second support portion.

[0017] Optionally, the sum of the thicknesses of the second support portion and the second panel portion is equal to the thickness of the first support portion.

[0018] Optionally, the flexible circuit board includes: a flexible substrate, at least two conductive layers, and at least two insulating layers stacked together;

[0019] The at least two conductive layers and the at least two insulating layers correspond one-to-one. The insulating layer is located on the side of the corresponding conductive layer that is away from the flexible substrate, and the orthogonal projection of the conductive layer on the flexible substrate is located within the orthogonal projection of the corresponding insulating layer on the flexible substrate.

[0020] Optionally, the conductive layer includes a plurality of conductive bodies, with a gap between two adjacent conductive bodies;

[0021] The insulating layer includes: a first insulating portion covering the conductive body, and a second insulating portion distributed between two adjacent conductive bodies;

[0022] The thickness of the second insulating part is greater than the thickness of the first insulating part.

[0023] Optionally, the side of the second insulating portion facing away from the flexible substrate is coplanar with the side of the first insulating portion facing away from the flexible substrate.

[0024] Optionally, the at least two conductive layers include: a first conductive layer and a second conductive layer, wherein the first conductive layer is a conductive layer distributed on the side of the flexible substrate facing the first panel portion and being the farthest from the flexible substrate, and the second conductive layer is a conductive layer distributed on the side of the flexible substrate away from the first panel portion and being the farthest from the flexible substrate.

[0025] The at least two insulating layers include: a first insulating layer corresponding to the first conductive layer, and a second insulating layer corresponding to the second conductive layer;

[0026] The flexible display panel further includes: a first shielding layer located on the side of the first insulating layer opposite to the first conductive layer, and a second shielding layer located on the side of the second insulating layer opposite to the second conductive layer.

[0027] Optionally, the second conductive layer has an external portion, and the flexible circuit board has a cutout area for penetrating the second shielding layer and the second insulating layer, wherein the orthographic projection of the cutout area on the flexible substrate is located within the orthographic projection of the external portion on the flexible substrate;

[0028] Wherein, the orthographic projection of the hollow area on the first panel portion is located within the orthographic projection of the first support portion on the first panel portion.

[0029] On the other hand, a display module is provided, including: a display panel, a flexible circuit board, and a first support portion;

[0030] The display panel includes: a first panel portion and a second panel portion, and a panel bending portion for connecting the first panel portion and the second panel portion. The first panel portion has a display surface and a back surface disposed opposite to the display surface. The second panel portion is disposed on one side of the back surface of the first panel portion.

[0031] The flexible circuit board is distributed on one side of the back of the first panel portion, and the flexible circuit board includes: a first part and a second part, and a connecting part for connecting the first part and the second part, wherein the first part is bonded to the side of the second panel portion opposite to the first panel portion.

[0032] The first support portion is located between the second portion and the back of the first panel portion;

[0033] The flexibility of the connecting portion is greater than that of the first portion and also greater than that of the second portion.

[0034] Optionally, the rigidity of the material used to make the connecting portion is less than the rigidity of the material used to make the first portion and less than the rigidity of the material used to make the second portion;

[0035] And / or, the connecting portion has a plurality of through holes that penetrate the connecting portion in a direction parallel to the thickness of the connecting portion.

[0036] Optionally, the distance between the first part and the first panel portion is greater than or equal to the distance between the second part and the first panel portion.

[0037] Optionally, the flexible circuit board includes: a flexible substrate, at least two conductive layers, and at least two insulating layers stacked together;

[0038] The at least two conductive layers and the at least two insulating layers correspond one-to-one. The insulating layer is located on the side of the corresponding conductive layer that is away from the flexible substrate, and the orthographic projection of the conductive layer on the flexible substrate is located within the orthographic projection of the corresponding insulating layer on the flexible substrate.

[0039] In this configuration, all regions of the insulating layer on the side facing away from the flexible substrate are coplanar.

[0040] In another aspect, a display device is provided, the display device comprising: a frame, and a display module connected to the frame, the display module being the display module described above.

[0041] The beneficial effects of the technical solutions provided in this application include at least the following:

[0042] By ensuring that the distance between the first portion of the flexible circuit board and the first panel portion is equal to the distance between the second portion of the flexible circuit board and the first panel portion, the flexible circuit board can be prevented from bending, thus eliminating the rebound force on the conductive layer integrated within the flexible circuit board. Therefore, the second portion of the flexible circuit board does not exert a tensile force on the back of the second panel portion of the display panel, resulting in a higher flatness of the back of the first panel portion of the display panel. This effectively reduces the probability of imprints on the front of the display module. Consequently, the probability of users seeing imprints from the front of the display module is low, leading to higher reliability of the display module. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 is a schematic diagram of the film layer structure of a display module;

[0045] Figure 2 is a schematic diagram of the reflection on the front of the display module when the back of the display module is uneven;

[0046] Figure 3 is a rendering of a defective area that may have marks when viewed from the front of the display module;

[0047] Figure 4 is a schematic diagram of the film layer structure of a display module provided in an embodiment of this application;

[0048] Figure 5 is a schematic diagram of the film layer structure of another display module provided in an embodiment of this application;

[0049] Figure 6 is a schematic diagram of the film layer structure of a flexible circuit board provided in an embodiment of this application;

[0050] Figure 7 is a schematic diagram of another flexible circuit board film structure provided in an embodiment of this application;

[0051] Figure 8 is a schematic diagram of the film layer structure of another flexible circuit board provided in an embodiment of this application;

[0052] Figure 9 is a schematic diagram of the film layer structure of another display module provided in an embodiment of this application;

[0053] Figure 10 is a partial top view of a flexible circuit board provided in an embodiment of this application;

[0054] Figure 11 is a schematic diagram of the film layer structure of another display module provided in an embodiment of this application. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0056] Please refer to Figure 1, which is a schematic diagram of the film layer structure of a display module. The display module may include: a display panel 01, a flexible circuit board 02, and a first support part 03.

[0057] A portion of the non-display portion of the display panel 01 can be bent to the back of the display panel 01 to be bonded to the flexible circuit board 02, and the flexible circuit board 02 can also be connected to the back of the display panel 01 via the first support portion 03.

[0058] The distance from the portion of the flexible circuit board 02 that is bonded to the display panel 01 to the back of the display panel 01 differs from the distance from the portion of the flexible circuit board 02 that is connected to the first support portion 03 to the back of the display panel 01. Therefore, the flatness of the side of the flexible circuit board 02 facing the display panel 01 is lower. Furthermore, because the flexible circuit board 02 integrates a metal layer, this metal layer generates a certain amount of rebound force after bending. Therefore, the flexible circuit board 02 applies a certain amount of tensile force to the back of the display panel 01, resulting in lower flatness of the back of the display panel 01.

[0059] Please refer to Figure 2, which illustrates the reflection on the front of the display module when the back of the display module is uneven. When external light enters the display module from the front, the light path reflected by the first area 01a (which has protrusions or depressions on the back of the display panel 01) differs from the light path reflected by the second area 01b (which has a relatively flat back of the display panel 01). Therefore, the front of the display module may have defects such as marks, leading to lower reliability of the display module.

[0060] For example, please refer to Figure 3, which is a rendering of a defective area with imprints that may be visible when viewed from the front of the display module. On the front of the display module, area A corresponding to the flexible circuit board 02 may have imprints, causing users to see imprints distributed within area A when viewing the display module from the front.

[0061] This application provides a display module. Please refer to Figure 4, which is a schematic diagram of the film layer structure of a display module provided in this application embodiment. The display module 000 may include: a display panel 100, a flexible circuit board 200, and a first support portion 300.

[0062] The display panel 100 in the display module 000 may include a first panel portion 101 and a second panel portion 102, and a panel bending portion 103 for connecting the first panel portion 101 and the second panel portion 102. That is, the panel bending portion 103 may be located between the first panel portion 101 and the second panel portion 102, and one side of the panel bending portion 103 may be connected to the first panel portion 101, and the other side of the panel bending portion 103 may be connected to the second panel portion 102. Here, the first panel portion 101 in the display panel 100 may have a display surface S1 and a back surface S2 disposed opposite to the display surface S1, and the second panel 102 in the display panel 200 may be distributed on the back surface S2 of the first panel portion 101 under the bending action of the panel bending portion 103.

[0063] The flexible circuit boards 200 in the display module 000 can all be distributed on the back side S2 of the first panel portion 101 in the display panel 100. Here, the flexible circuit board 200 in the display module 000 can include: a first portion 201 and a second portion 202, and a connecting portion 203 for connecting the first portion 201 and the second portion 202. That is, the connecting portion 203 in the flexible circuit board 200 can be located between the first portion 201 and the second portion 202, and one side of the connecting portion 203 can be connected to the first portion 201, and the other side of the connecting portion 203 can be connected to the second portion 202.

[0064] The first portion 201 of the flexible circuit board 200 can be bonded to the side of the second panel portion 102 of the display panel 100 opposite to the first panel portion 101. It should be noted that the second panel portion 102 of the display panel 100 integrates signal traces. After the flexible circuit board 200 is bonded to the side of the second panel portion 102 opposite to the first panel portion 101, the flexible circuit board 200 can be electrically connected to these signal traces.

[0065] The first support layer 300 in the display module 000 can be located between the second portion 202 of the flexible circuit board 200 and the first panel portion 101 of the display panel 100. Here, the first support layer 300 has adhesive properties; for example, the first support layer 300 can be made of an insulating adhesive. Therefore, the second portion 202 of the flexible circuit board 200 can be bonded to the back surface S2 of the first panel portion 101 through the first support layer 300.

[0066] The distance between the first part 201 and the first panel part 101 in the flexible circuit board 200 can be equal to the distance between the second part 202 and the first panel part 101 in the flexible circuit board 200.

[0067] In this embodiment, when the distance between the first portion 201 and the first panel portion 101 in the flexible circuit board 200 is equal to the distance between the second portion 202 and the first panel portion 101 in the flexible circuit board 200, the flexible circuit board 200 will not be in a bent state, thereby preventing the conductive layer integrated inside the flexible circuit board 200 from exhibiting a rebound force. Therefore, the second portion 202 in the flexible circuit board 200 will not exert a pulling force on the back surface S2 of the first panel portion 101 in the display panel 100, resulting in a higher flatness of the back surface S2 of the first panel portion 101 in the display panel 100, which effectively reduces the probability of imprints on the front surface of the display module 000. Consequently, the probability of a user seeing imprints from the front surface of the display module 000 is low, resulting in higher reliability of the display module 000.

[0068] In summary, the display module provided in this application includes a display panel, a flexible circuit board, and a first support portion. When the distance between the first portion of the flexible circuit board and the first panel portion is equal to the distance between the second portion of the flexible circuit board and the first panel portion, the flexible circuit board will not be in a bent state, thus preventing the conductive layer integrated within the flexible circuit board from experiencing rebound force. Therefore, the second portion of the flexible circuit board will not exert a tensile force on the back side of the second panel portion of the display panel, resulting in a higher flatness of the back side of the first panel portion of the display panel, thereby effectively reducing the probability of imprints on the front side of the display module. Consequently, the probability of users seeing imprints from the front of the display module is low, resulting in higher reliability of the display module.

[0069] Optionally, as shown in Figure 4, the distance between the connecting portion 203 in the flexible circuit board 200 and the first panel portion 101 in the display panel 100 can be equal to the distance between the first portion 201 in the flexible circuit board 200 and the first panel portion 101 in the display panel 100. That is, the distances from the first portion 201, the second portion 202, and the connecting portion 203 in the flexible circuit board 200 to the first panel portion 101 are all equal.

[0070] For example, the side of the first portion 201 of the flexible circuit board 200 facing the first panel portion 101 can be coplanar with the side of the second portion 202 of the flexible circuit board 200 facing the first panel portion 101, and can also be coplanar with the side of the connecting portion 203 of the flexible circuit board 200 facing the first panel portion 101. Therefore, the side of the flexible circuit board 200 facing the first panel portion 101 can be parallel to the back surface S2 of the first panel portion 101.

[0071] In this configuration, the conductive layer integrated within the flexible circuit board 200 can be distributed parallel to the back surface S2 of the first panel portion 101, preventing the conductive layer from being bent and thus eliminating any rebound force. Consequently, the first portion 201, the second portion 202, and the connecting portion 203 of the flexible circuit board 200 do not exert additional force on the display panel 100, further improving the flatness of the back surface S2 of the first panel portion 101 in the display panel 100.

[0072] Optionally, as shown in Figure 5, which is a schematic diagram of the film layer structure of another display module provided in an embodiment of this application, the display module 000 may further include a second support portion 400 located between the first panel portion 101 and the second panel portion 102 in the display panel 100. Here, the first panel portion 101, the second support portion 400, and the second panel portion 102 may be stacked in a direction perpendicular to the display surface S1 of the first panel portion 101. The second support portion 400 can provide support force to the second panel portion 102 located on the back surface S2 of the first panel portion 101, so that the second panel portion 102 can be bent more stably to the back surface S2 of the first panel portion 101.

[0073] In this embodiment, since both the side of the second support portion 400 facing the first panel portion 101 and the side of the first support portion 300 facing the first panel portion 101 are used to bond to the back surface S2 of the first panel portion 101, the side of the second support portion 400 facing the first panel portion 101 and the side of the first support portion 300 facing the first panel portion 301 are flush. The side of the first support portion 300 facing away from the first panel portion 101 is directly connected to the second portion 202 in the flexible circuit board 200, while the side of the second support portion 300 facing away from the first panel portion 101 needs to be connected to the first portion 201 in the flexible circuit board 200 through the second panel portion 102. Therefore, to ensure that the distance between the first portion 201 in the flexible circuit board 200 and the first panel portion 101 is equal to the distance between the second portion 202 in the flexible circuit board 200 and the first panel portion 101, the thickness of the first support portion 300 needs to be increased so that the thickness of the first support portion 300 can be greater than the thickness of the second support portion 400.

[0074] For example, in order to ensure that the distance between the first portion 201 and the first panel portion 101 in the flexible circuit board 200 is equal to the distance between the second portion 202 and the first panel portion 101 in the flexible circuit board 200, it is necessary to ensure that the sum of the thicknesses of the second support portion 400 and the second panel portion 102 is equal to the thickness of the first support portion 300. In this case, it can be ensured that all areas of the flexible circuit board 200 facing the first panel portion 101 are coplanar and can be parallel to the back surface S2 of the first panel portion 101 in the display panel 100.

[0075] Optionally, please refer to Figure 6, which is a schematic diagram of the film layer structure of a flexible circuit board according to an embodiment of this application. The flexible circuit board 200 may include: a flexible substrate 210, at least two conductive layers 220 and at least two insulating layers 230 stacked together.

[0076] Here, for any conductive layer 220, the conductive layer 220 can be distributed on the side of the flexible substrate 210 facing the first panel portion 101, or it can be located on the side of the flexible substrate 210 away from the first panel portion 101. The embodiments of this application do not limit this.

[0077] In this application, at least two conductive layers 220 can correspond one-to-one with at least two insulating layers 230. Each insulating layer 230 can be located on the side of its corresponding conductive layer 220 facing away from the flexible substrate 210, and the orthographic projection of each conductive layer 220 on the flexible substrate 210 can lie within the orthographic projection of its corresponding insulating layer 230 on the flexible substrate 210. Therefore, each insulating layer 230 in the flexible circuit board 200 can provide insulating protection for its corresponding conductive layer 220, making the corresponding conductive layer 220 less susceptible to corrosion from water and oxygen in the external environment.

[0078] Optionally, the conductive layer 220 in the flexible circuit board 200 may include multiple conductor bodies 220a. A gap Z may exist between two adjacent conductive bodies 220a in the same conductive layer 220. Here, the conductive bodies 220a in the same conductive layer 220 can be conductive structures such as signal traces or connecting electrodes. Therefore, two adjacent conductive bodies 220a in the same conductive layer 220 can be insulated from each other by the gap Z located between them.

[0079] It should be noted that the insulating layer 230 located on the side of the conductive layer 220 facing away from the flexible substrate 210 is usually made of inorganic material. During the formation of the insulating layer 230 on the side of the conductive layer 220 facing away from the flexible substrate 210, an insulating layer 230 with a thickness of approximately equal at various locations is usually formed. That is, the thickness of the portion of the insulating layer 230 located on the side of the conductive body 220a facing away from the flexible substrate 210 is approximately equal to the thickness of the portion of the insulating layer 230 located in the gap Z between two adjacent conductive bodies 220a. This results in a certain step difference inside the flexible circuit board 200. The flexible circuit board 200 with the step difference may exert different forces on the back side S2 of the first panel body 101, resulting in marks on the front side of the display module 000. For example, as shown in Figure 3, in the front side of the display module, the area B corresponding to the part with the step difference in the flexible circuit board may have a defective phenomenon of marks, which may be visible to the user when viewing the display module from the front.

[0080] Therefore, in this application, please refer to FIG7, which is a schematic diagram of another film layer structure of a flexible circuit board provided in an embodiment of this application. The insulating layer 230 in the flexible circuit board 200 may include: a first insulating portion 230a covering the conductive body 220a, and a second insulating portion 230b distributed between two adjacent conductive bodies 220a. Here, the thickness of the second insulating portion 230b may be greater than the thickness of the first insulating portion 230a. That is, the insulating layer 230 located on the side of the conductive layer 220 away from the flexible substrate 210 is an insulating layer of unequal thickness.

[0081] This ensures that the vertical height between the side of the first insulating portion 230a facing away from the flexible substrate 210 and the side of the second insulating portion 230b facing away from the flexible substrate 210 is small, resulting in a smaller step difference within the flexible circuit board 200. This also ensures that the difference in the force exerted by the flexible circuit board 200 on the back surface S2 of the first panel body 101 is small, further reducing the probability of imprints on the front surface of the display module 000.

[0082] In one possible implementation, during the formation of the unequal-thickness insulating layer 230 on the side of the conductive layer 220 facing away from the flexible substrate 210, an insulating filling structure can first be formed only within the gap Z between two adjacent conductive bodies 220a in the conductive layer 220, such that the thickness of the insulating filling structure is equal to the thickness of the conductive layer 220. Subsequently, an insulating deposition layer of equal thickness is formed on the side facing away from the conductive layer 220 and the insulating filling structure through uniform film deposition. Here, the insulating filling structure and the insulating deposition layer together constitute the unequal-thickness insulating layer 230.

[0083] Optionally, for insulating layers 230 of unequal thickness, the side of the second insulating portion 230b facing away from the flexible substrate 210 can be coplanar with the side of the first insulating portion 230a facing away from the flexible substrate 210. That is, the thickness of the second insulating portion 230b can be equal to the sum of the thicknesses of the first insulating portion 230a and the conductive layer 220. This ensures that the step difference inside the flexible circuit board 200 is minimized, thereby reducing the probability of imprints on the front side of the display module 000 as much as possible.

[0084] In this embodiment of the application, as shown in FIG8, FIG8 is a schematic diagram of the film layer structure of another flexible circuit board provided in this embodiment of the application. The at least two conductive layers 220 in the flexible circuit board 200 may include: a first conductive layer 221 and a second conductive layer 222.

[0085] Here, the first conductive layer 221 can be the conductive layer distributed on the side of the flexible substrate 210 facing the first panel portion 101 and furthest from the flexible substrate 210; the second conductive layer 222 can be the conductive layer distributed on the side of the flexible substrate 210 away from the first panel portion 101 and furthest from the flexible substrate 210. That is, the first conductive layer 221 and the second conductive layer 222 are respectively the two outermost conductive layers of the flexible circuit board 200.

[0086] The at least two insulating layers 230 in the flexible circuit board 200 may include: a first insulating layer 231 corresponding to the first conductive layer 221, and a second insulating layer 232 corresponding to the second conductive layer 222. That is, the first insulating layer 231 may be distributed on the side of the first conductive layer 221 away from the flexible substrate 210, and the second insulating layer 232 may provide insulation protection for the second conductive layer 222.

[0087] In this application, the flexible circuit board 200 may further include: a first shielding layer 240 located on the side of the first insulating layer 231 opposite to the first conductive layer 221, and a second shielding layer 250 located on the side of the second insulating layer 232 opposite to the second conductive layer 222. Here, the first shielding layer 240 and the second shielding layer 250 can provide electromagnetic shielding for both sides of the flexible circuit board 200, so that the signals transmitted inside the flexible circuit board 200 are not affected by external interference.

[0088] In this embodiment, the second conductive layer 222 in the flexible circuit board 220 may have an external portion 222a. The flexible circuit board 220 may have a cutout area U for penetrating the second shielding layer 250 and the second insulating layer 232, and the orthographic projection of the cutout area U on the flexible substrate 210 may be located within the orthographic projection of the external portion 222a on the flexible substrate 210.

[0089] Here, the external portion 222a in the flexible circuit board 220 can be used to connect to an external circuit, which can pass through the cutout area U and connect to the external portion 222a. For example, the external portion 222a can serve as a grounding structure for the flexible circuit board 220, thereby allowing the flexible circuit board 220 to connect to an external grounding component through the external portion 222a and the cutout area U.

[0090] It should be noted that, since the cutout area U of the flexible circuit board 200 needs to penetrate the second shielding layer 250 and the second insulating layer 232, the flatness of the side of the flexible circuit board 200 facing away from the first panel portion 102 will be relatively low. In order to reduce the difference in the force exerted by the uneven flexible circuit board 200 on the back surface S2 of the first panel body 101, a buffer structure opposite to the cutout area U needs to be provided on the side of the flexible circuit board 200 facing the first panel body 101, and the thickness of the buffer structure needs to be large.

[0091] Furthermore, since the flexible circuit board 200 needs to have a first support portion 300 on the side facing the first panel body 101 to be bonded to the back surface S2 of the first panel body 101, and the first support portion 300 is made of insulating adhesive, the first support portion 300 itself has a certain cushioning capacity. At the same time, since the first part 201 and the second part 202 of the flexible circuit board 200 need to be flush with the side facing the first panel part 101, the thickness of the first support portion 300 needs to be relatively large. Therefore, a portion of the first support portion 300 can be used as a cushioning structure on the side of the flexible circuit board 200 facing the first panel body 101 and opposite to the cutout area U.

[0092] In this configuration, the orthographic projection of the cutout area U of the flexible circuit board 200 onto the first panel portion 101 can be located within the orthographic projection of the first support portion 300 onto the first panel portion 101. The first support portion 300 can also compensate for any unevenness in the flexible circuit board 200 caused by the cutout area U, ensuring that the difference in the force exerted by the flexible circuit board 200 on the back surface S2 of the first panel body 101 is small, thereby further reducing the probability of imprints on the front surface of the display module 000.

[0093] In summary, the display module provided in this application includes a display panel, a flexible circuit board, and a first support portion. When the distance between the first portion of the flexible circuit board and the first panel portion is equal to the distance between the second portion of the flexible circuit board and the first panel portion, the flexible circuit board will not be in a bent state, thus preventing the conductive layer integrated within the flexible circuit board from experiencing rebound force. Therefore, the second portion of the flexible circuit board will not exert a tensile force on the back side of the second panel portion of the display panel, resulting in a higher flatness of the back side of the first panel portion of the display panel, thereby effectively reducing the probability of imprints on the front side of the display module. Consequently, the probability of users seeing imprints from the front of the display module is low, resulting in higher reliability of the display module.

[0094] This application also provides another display module. Please refer to FIG9, which is a schematic diagram of the film layer structure of another display module provided in this application embodiment. The display module 000 may include: a display panel 100, a flexible circuit board 200, and a first support portion 300.

[0095] The display panel 100 in the display module 000 may include a first panel portion 101 and a second panel portion 102, and a panel bending portion 103 for connecting the first panel portion 101 and the second panel portion 102. That is, the panel bending portion 103 may be located between the first panel portion 101 and the second panel portion 102, and one side of the panel bending portion 103 may be connected to the first panel portion 101, and the other side of the panel bending portion 103 may be connected to the second panel portion 102. Here, the first panel portion 101 in the display panel 100 may have a display surface S1 and a back surface S2 disposed opposite to the display surface S1, and the second panel 102 in the display panel 200 may be distributed on the back surface S2 of the first panel portion 101 under the bending action of the panel bending portion 103.

[0096] The flexible circuit boards 200 in the display module 000 can all be distributed on the back side S2 of the first panel portion 101 in the display panel 100. Here, the flexible circuit board 200 in the display module 000 can include: a first portion 201 and a second portion 202, and a connecting portion 203 for connecting the first portion 201 and the second portion 202. That is, the connecting portion 203 in the flexible circuit board 200 can be located between the first portion 201 and the second portion 202, and one side of the connecting portion 203 can be connected to the first portion 201, and the other side of the connecting portion 203 can be connected to the second portion 202.

[0097] The first portion 201 of the flexible circuit board 200 can be bonded to the side of the second panel portion 102 of the display panel 100 opposite to the first panel portion 101. It should be noted that the second panel portion 102 of the display panel 100 integrates signal traces. After the flexible circuit board 200 is bonded to the side of the second panel portion 102 opposite to the first panel portion 101, the flexible circuit board 200 can be electrically connected to these signal traces.

[0098] The first support layer 300 in the display module 000 can be located between the second portion 202 of the flexible circuit board 200 and the first panel portion 101 of the display panel 100. Here, the first support layer 300 has adhesive properties; for example, the first support layer 300 can be made of an insulating adhesive. Therefore, the second portion 202 of the flexible circuit board 200 can be bonded to the back surface S2 of the first panel portion 101 through the first support layer 300.

[0099] The flexibility of the connecting portion 203 in the flexible circuit board 200 is greater than that of the first portion 201 in the flexible circuit board 200, and also greater than that of the second portion 202 in the flexible circuit board 200.

[0100] In this embodiment, when the flexibility of the connecting portion 203 in the flexible circuit board 200 is higher than that of the first portion 201 and higher than that of the second portion 202, even if the flexible circuit board 200 is in a bent state due to the difference between the distance from the first portion 201 to the first panel portion 101 and the distance from the second portion 202 to the first panel portion 101, the stress inside the flexible circuit board 200 can be released through the more flexible connecting portion 203. This results in a smaller pulling force exerted by the second portion 202 in the flexible circuit board 200 on the back surface S2 of the first panel portion 101 in the display panel 100, ensuring a higher flatness of the back surface S2 of the first panel portion 101 in the display panel 100. This effectively reduces the probability of imprints on the front surface of the display module 000. Therefore, the probability of users seeing imprints from the front surface of the display module 000 is low, resulting in higher reliability of the display module 000.

[0101] In summary, the display module provided in this application includes a display panel, a flexible circuit board, and a first support portion. When the flexibility of the connecting portion in the flexible circuit board is higher than that of the first portion and also higher than that of the second portion, even if the distance from the first portion to the first panel portion differs from that of the second portion to the first panel portion, causing the flexible circuit board to be in a bent state, the stress present inside the flexible circuit board can be released through the more flexible connecting portion. This results in a smaller tensile force exerted by the second portion of the flexible circuit board on the back of the second panel portion of the display panel, ensuring a higher flatness of the back of the first panel portion of the display panel. This effectively reduces the probability of imprints on the front of the display module. Therefore, the probability of users seeing imprints from the front of the display module is low, resulting in higher reliability of the display module.

[0102] In this embodiment of the application, in order to make the connecting portion 203 in the flexible circuit board 200 more flexible, the following three possible implementation methods are provided:

[0103] One possible implementation is to make the rigidity of the material used to fabricate the connecting portion 203 in the flexible circuit board 200 less than the rigidity of the material used to fabricate the first portion 201 in the flexible circuit board 200, and less than the rigidity of the material used to fabricate the second portion 202 in the flexible circuit board 200. For example, since the flexible circuit board 200 includes multiple stacked film layer structures, the rigidity of the material of at least a portion of the film layer structures located within the connecting portion 202 can be less than the rigidity of the material of the local film layer located within the first portion 201, and less than the rigidity of the material of the local film layer located within the second portion 202.

[0104] In this case, the connecting portion 203 in the flexible circuit board 200 can be made more flexible than the first portion 201 and the second portion 202, so that the connecting portion 203 can better release the stress inside the flexible circuit board 200.

[0105] The second possible implementation is shown in Figure 10, which is a partial top view of a flexible circuit board provided in an embodiment of this application. The connecting portion 203 in the flexible circuit board 200 may have multiple through holes V, which can penetrate the connecting portion 203 in a direction parallel to the thickness of the connecting portion 203.

[0106] Here, the material used to make the connecting portion 203 in the flexible circuit board 200 can be the same as the material used to make the first portion 201 and the second portion 202 in the flexible circuit board 200.

[0107] In this case, by providing multiple through holes V in the connecting portion 203, the connecting portion 203 in the flexible circuit board 200 can be made more flexible, so that the connecting portion 203 can better release the stress inside the flexible circuit board 200.

[0108] A third possible implementation is to make the rigidity of the material of the connecting portion 203 in the flexible circuit board 200 less than the rigidity of the material of the first portion 201 in the flexible circuit board 200, and less than the rigidity of the material of the second portion 202 in the flexible circuit board 200. Simultaneously, multiple through holes V can be provided within the connecting portion 203 in the flexible circuit board 200.

[0109] Optionally, the distance between the first portion 201 and the first panel portion 101 in the flexible circuit board 200 is greater than or equal to the distance between the second portion 202 and the first panel portion 101 in the flexible circuit board 200. Here, since the connecting portion 203 in the flexible circuit board 200 can be made more flexible through the above three possible implementations, even when the distance between the first portion 201 and the first panel portion 101 is greater than the distance between the second portion 202 and the first panel portion 101, it can be ensured that the second portion 202 in the flexible circuit board 200 exerts a smaller pulling force on the back surface S2 of the first panel portion 101 in the display panel 100.

[0110] It should be noted that when the distance between the first part 201 and the first panel portion 101 is equal to the distance between the second part 202 and the first panel portion 101, the pulling force exerted by the second part 202 in the flexible circuit board 200 on the back surface S2 of the first panel portion 101 in the display panel 100 can be further reduced. The principle can be referred to the corresponding content in the foregoing embodiments. It will not be repeated here.

[0111] Optionally, the flexible circuit board includes: a flexible substrate, at least two conductive layers, and at least two insulating layers stacked together; the at least two conductive layers and at least two insulating layers correspond one-to-one, with the insulating layer located on the side of the corresponding conductive layer facing away from the flexible substrate, and the orthographic projection of the conductive layer on the flexible substrate falling within the orthographic projection of the corresponding insulating layer on the flexible substrate; wherein, all regions on the side of the insulating portion facing away from the flexible substrate are coplanar. The design principle of the internal structure of the flexible circuit board can be referred to the corresponding content in the foregoing embodiments. It will not be repeated here.

[0112] In summary, the display module provided in this application includes a display panel, a flexible circuit board, and a first support portion. When the flexibility of the connecting portion in the flexible circuit board is higher than that of the first portion and also higher than that of the second portion, even if the distance from the first portion to the first panel portion differs from that of the second portion to the first panel portion, causing the flexible circuit board to be in a bent state, the stress present inside the flexible circuit board can be released through the more flexible connecting portion. This results in a smaller tensile force exerted by the second portion of the flexible circuit board on the back of the second panel portion of the display panel, ensuring a higher flatness of the back of the first panel portion of the display panel. This effectively reduces the probability of imprints on the front of the display module. Therefore, the probability of users seeing imprints from the front of the display module is low, resulting in higher reliability of the display module.

[0113] This application also provides another display module. Please refer to Figure 11, which is a schematic diagram of the film layer structure of another display module provided in this application embodiment. In addition to including the display panel 100, flexible circuit board 200, first support part 300 and second support part 400 mentioned in the above embodiments, the display module 000 may also include: a driver chip 500 and a heat dissipation support layer 600.

[0114] The driver chip 500 in the display module 000 can be bonded to the side of the second panel portion 102 of the display panel 100 opposite to the first panel portion 101. It should be noted that signal traces are integrated within both the panel bending portion 103 and the second panel portion 102 of the display panel 100. After the driver chip 500 is bonded to the second panel portion 102 of the display panel 100, the driver chip 500 can be electrically connected to these signal traces, and these signal traces can also be electrically connected to the sub-pixels within the first panel portion 101. In this way, the driver chip 500 can send driving signals to the sub-pixels within the first panel portion 101 through these signal traces, causing the sub-pixels within the first panel portion 101 to emit light outwards, thereby enabling the first panel portion 101 to display the corresponding image.

[0115] The heat dissipation support layer 600 in the display module 000 can be bonded to the back surface S2 of the first panel portion 101. Here, the heat dissipation support layer 600 can dissipate the heat generated by the display panel 100 during the display process.

[0116] The first support portion 300 can be located between the heat dissipation support layer 600 and the second portion 202 in the flexible circuit board 200. That is, the two sides of the first support portion 300 are respectively bonded to the side of the heat dissipation support layer 600 away from the first panel portion 101, and to the side of the second portion 202 facing the first panel portion 101.

[0117] The second support portion 400 can be located between the heat dissipation support layer 600 and the second panel portion 102 in the display panel 100. That is, the second support portion 400 can be bonded to the side of the heat dissipation support layer 600 away from the first panel portion 101 and to the side of the second panel portion 102 facing the first panel portion 101.

[0118] Optionally, as shown in Figure 11, the display module 000 may also include: a circular polarizer 700, an optical adhesive layer 800, and a protective cover plate 900.

[0119] In the display module 000, the circular polarizer 700 is located on the side of the first panel portion 101 away from the heat dissipation support layer 600, the protective cover plate 900 is located on the side of the circular polarizer 700 away from the first panel portion 101, and the optical adhesive layer 800 is located between the circular polarizer 700 and the protective cover plate 900.

[0120] The protective cover 900 in the display module 000 can be a glass cover. The protective cover 900 can protect the first panel portion 101 in the display panel 100, so as to ensure that the protective cover 900 can withstand the impact force after the front of the display module 000 is hit, thereby reducing the probability that the first panel portion 101 in the display panel 100 will be broken.

[0121] The optical adhesive layer 800 in the display device 000 is used to bond the protective cover 900 between the circular polarizers 700, and the optical adhesive layer 800 is typically made of transparent adhesive (e.g., acrylic adhesive). This ensures that light emitted from the first panel portion 101 in the display panel 100 passes through the optical adhesive layer 800 and the protective cover 900 before exiting. Furthermore, the optical adhesive layer 800 also has good cushioning properties, thus reducing the probability of the protective cover 900 breaking after the front of the display module 000 is subjected to impact.

[0122] The circular polarizer 700 in the display module 000 can reduce the reflectivity of the first panel 101 to ambient light, so as to ensure that the display area in the first panel 101 displays a better image.

[0123] This application also provides a display device, which can be any product or component with display function, such as a mobile phone, tablet computer, television, advertising machine, display screen, digital photo frame, or vehicle terminal. The display device may include a frame and a display module connected to the frame, wherein the display module is any of the display modules described in the above embodiments.

[0124] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0125] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0126] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display module, characterized in that, include: Display panel (100), flexible circuit board (200) and first support part (300); The display panel (100) includes: a first panel portion (101) and a second panel portion (102), and a panel bending portion (103) for connecting the first panel portion (101) and the second panel portion (102). The first panel portion (101) has a display surface (S1) and a back surface (S2) disposed opposite to the display surface (S1). The second panel portion (102) is distributed on one side of the back surface (S2) of the first panel portion (101). The flexible circuit board (200) is distributed on one side of the back (S2) of the first panel portion (101), and the flexible circuit board (200) includes: a first part (201) and a second part (202), and a connecting part (203) for connecting the first part (201) and the second part (202), wherein the first part (201) is bonded to the side of the second panel portion (102) opposite to the first panel portion (101); The first support portion (300) is located between the second portion (202) and the back surface (S2) of the first panel portion (101); The distance between the first part (201) and the first panel part (101) is equal to the distance between the second part (202) and the first panel part (101).

2. The display module according to claim 1, characterized in that, The distance between the connecting portion (203) and the first panel portion (101) is equal to the distance between the first portion (201) and the first panel portion (101).

3. The display module according to claim 2, characterized in that, The side of the first portion (201) facing the first panel portion (101) is coplanar with the side of the second portion (202) facing the first panel portion (101), and is also coplanar with the side of the connecting portion (203) facing the first panel portion (101); The flexible circuit board (200) facing the first panel portion (101) is parallel to the back side (S2) of the first panel portion (101).

4. The display module according to claim 1, characterized in that, The display module further includes a second support portion (400) located between the first panel portion (101) and the second panel portion (102); The thickness of the first support part (300) is greater than the thickness of the second support part (400).

5. The display module according to claim 4, characterized in that, The sum of the thicknesses of the second support portion (400) and the second panel portion (102) is equal to the thickness of the first support portion (300).

6. The display module according to any one of claims 1 to 5, characterized in that, The flexible circuit board (200) includes: a flexible substrate (210) stacked together, at least two conductive layers (220) and at least two insulating layers (230); The at least two conductive layers (220) and the at least two insulating layers (230) correspond one-to-one. The insulating layer (230) is located on the side of the corresponding conductive layer (220) away from the flexible substrate (210), and the orthographic projection of the conductive layer (220) on the flexible substrate (210) is located within the orthographic projection of the corresponding insulating layer (230) on the flexible substrate (210).

7. The display module according to claim 6, characterized in that, The conductive layer (220) includes a plurality of conductive bodies (220a), and there is a gap (Z) between two adjacent conductive bodies (220a); The insulating layer (230) includes: a first insulating portion (230a) covering the conductive body (220a), and a second insulating portion (230b) distributed between two adjacent conductive bodies (220a); The thickness of the second insulating part (230b) is greater than the thickness of the first insulating part (230a).

8. The display module according to claim 7, characterized in that, The side of the second insulating portion (230b) facing away from the flexible substrate (210) is coplanar with the side of the first insulating portion (230a) facing away from the flexible substrate (210).

9. The display module according to claim 7 or 8, characterized in that, The at least two conductive layers (220) include: a first conductive layer (221) and a second conductive layer (222), wherein the first conductive layer (221) is a conductive layer distributed on the side of the flexible substrate (210) facing the first panel portion (101) and being the farthest from the flexible substrate (210), and the second conductive layer (222) is a conductive layer distributed on the side of the flexible substrate (210) away from the first panel portion (102) and being the farthest from the flexible substrate (210); The at least two insulating layers (230) include: a first insulating layer (231) corresponding to the first conductive layer (221), and a second insulating layer (232) corresponding to the second conductive layer (222); The flexible display panel (200) further includes: a first shielding layer (240) located on the side of the first insulating layer (231) away from the first conductive layer (221), and a second shielding layer (250) located on the side of the second insulating layer (232) away from the second conductive layer (222).

10. The display module according to claim 9, characterized in that, The second conductive layer (222) has an external portion (222a), and the flexible circuit board (200) has a cutout area (U) for penetrating the second shielding layer (250) and the second insulating layer (232). The orthographic projection of the cutout area (U) on the flexible substrate (210) is located within the orthographic projection of the external portion (222a) on the flexible substrate (210). The orthographic projection of the hollow area (U) on the first panel portion (101) is located within the orthographic projection of the first support portion (300) on the first panel portion (101).

11. A display module, characterized in that, include: Display panel (100), flexible circuit board (200) and first support part (300); The display panel (100) includes: a first panel portion (101) and a second panel portion (102), and a panel bending portion (103) for connecting the first panel portion (101) and the second panel portion (102). The first panel portion (101) has a display surface (S1) and a back surface (S2) disposed opposite to the display surface (S1). The second panel portion (102) is distributed on one side of the back surface (S2) of the first panel portion (101). The flexible circuit board (200) is distributed on one side of the back (S2) of the first panel portion (101), and the flexible circuit board (200) includes: a first part (201) and a second part (202), and a connecting part (203) for connecting the first part (201) and the second part (202), wherein the first part (201) is bonded to the side of the second panel portion (102) opposite to the first panel portion (101); The first support portion (300) is located between the second portion (202) and the back surface (S2) of the first panel portion (101); The flexibility of the connecting portion (203) is greater than that of the first portion (201) and greater than that of the second portion (202).

12. The display module according to claim 11, characterized in that, The rigidity of the material used to make the connecting part (203) is less than the rigidity of the material used to make the first part (201) and less than the rigidity of the material used to make the second part (202); And / or, the connecting portion (203) has a plurality of through holes (V) that penetrate the connecting portion (203) in a direction parallel to the thickness of the connecting portion (203).

13. The display module according to claim 11, characterized in that, The distance between the first part (201) and the first panel part (101) is greater than or equal to the distance between the second part (202) and the first panel part (101).

14. The display module according to any one of claims 11 to 13, characterized in that, The flexible circuit board (200) includes: a flexible substrate (210) stacked together, at least two conductive layers (220) and at least two insulating layers (230); The at least two conductive layers (220) and the at least two insulating layers (230) correspond one-to-one. The insulating layer (230) is located on the side of the corresponding conductive layer (220) away from the flexible substrate (210), and the orthographic projection of the conductive layer (220) on the flexible substrate (210) is located within the orthographic projection of the corresponding insulating layer (230) on the flexible substrate (210). In this case, all regions of the insulating layer (230) on the side facing away from the flexible substrate (210) are coplanar.

15. A display device, characterized in that, The display device includes: a frame, and a display module connected to the frame, wherein the display module is the display module according to any one of claims 1 to 14.

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