Semiconductor package and physical quantity deriving device

Abstract

The invention provides a semiconductor package and a physical quantity deriving device. A semiconductor package includes: a first input terminal pair connected to a terminal pair of a first light receiving element that outputs a first current signal corresponding to a received light amount of light emitted from a light source, and disposed adjacent to each other; a second input terminal pair connected to a terminal pair of a second light-receiving element that outputs a second current signal corresponding to the amount of received light emitted from the light source, the second input terminal pair being disposed adjacent to each other; a third terminal disposed adjacent to one first input terminal of the first input terminal pair and one second input terminal of the second input terminal pair; and a generation unit that generates a digital signal based on the first current signal and the second current signal.

Description

Technical Field

[0001] This invention relates to a semiconductor package and a device for deriving physical quantities. Background Technology

[0002] Patent Document 1 describes a gas sensor that performs A / D conversion on a target gas signal that depends on the concentration of the target gas and a reference signal that does not depend on the concentration of the target gas, and estimates the concentration of the target gas based on their ratio.

[0003] [Existing Technical Documents]

[0004] [Patent Literature]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2014-173896 Summary of the Invention

[0006] [The problem the invention aims to solve]

[0007] In a semiconductor package having two input terminal pairs connected to the respective terminal pairs of the two elements of the output current signal, it is desirable to achieve miniaturization and suppress the increase in measurement error caused by leakage current flowing into or out of the input terminal pairs.

[0008] [Methods used to solve problems]

[0009] One embodiment of the semiconductor package of the present invention may include a first input terminal pair connected to a terminal pair of a first light-receiving element that outputs a first current signal, and having two terminals arranged adjacent to each other, the first current signal corresponding to the amount of light received from light emitted from a light source. The semiconductor package may also include a second input terminal pair connected to a terminal pair of a second light-receiving element that outputs a second current signal, and having two other terminals arranged adjacent to each other, the second current signal corresponding to the amount of light received from light emitted from the light source. The semiconductor package may also include a third terminal arranged adjacent to one of the two terminals constituting the first input terminal pair and one of the other two terminals constituting the second input terminal pair. The semiconductor package may further include a generation unit that generates a digital signal based on the first current signal and the second current signal.

[0010] In the semiconductor package, when viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, and the third terminal can be arranged along the outer periphery of the semiconductor package.

[0011] In any of the semiconductor packages, when viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, and the third terminal can be arranged along a first side of the outer periphery of the semiconductor package.

[0012] In any of the semiconductor packages, when viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, and the third terminal may be disposed on a first side of the outer periphery of the semiconductor package.

[0013] Any of the semiconductor packages may further include: a first output terminal for outputting current to a third element; and a fourth terminal disposed between the first output terminal and the other of the other two terminals constituting the second input terminal pair, and configured adjacent to the other of the other two terminals constituting the second input terminal pair.

[0014] In any of the semiconductor packages, when viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, the third terminal, the first output terminal, and the fourth terminal may be arranged along the outer periphery of the semiconductor package.

[0015] In any of the semiconductor packages, when viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, and the third terminal are arranged along a first side of the outer periphery of the semiconductor package, and when viewed from the mounting surface of the semiconductor package, the first output terminal is arranged along a second side of the outer periphery of the semiconductor package that is different from the first side.

[0016] In any of the semiconductor packages, when viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, and the third terminal are disposed on a first side of the outer periphery of the semiconductor package, and when viewed from the mounting surface of the semiconductor package, the first output terminal is disposed on a second side of the outer periphery of the semiconductor package that is different from the first side.

[0017] In any of the semiconductor packages, the third element may be the light source.

[0018] In any of the semiconductor packages, the third terminal may be a voltage output terminal that outputs a constant potential.

[0019] In any of the semiconductor packages, the second light-receiving element can be used to compensate for temperature or aging changes in the first light-receiving element.

[0020] One embodiment of the physical quantity deriving device of the present invention may include the semiconductor package, which derives physical quantities based on the digital signal.

[0021] The physical quantity deriving device may also include the first light-receiving element and the second light-receiving element.

[0022] One embodiment of the physical quantity deriving device of the present invention may further include the semiconductor package as described in claim 5, the first light-receiving element, the second light-receiving element, and the light source as the third element, deriving physical quantities based on the digital signal.

[0023] In one embodiment of the present invention, a semiconductor package may include a first input terminal pair connected to a terminal pair of a first element that outputs a first current signal. The semiconductor package may also include a second input terminal pair connected to a terminal pair of a second element that outputs a second current signal. The semiconductor package may further include a third terminal disposed between the first input terminal pair and the second input terminal pair.

[0024] Furthermore, the above summary of the invention does not list all the features of the invention. Additionally, sub-combinations of these feature groups can also constitute inventions. Attached Figure Description

[0025] Figure 1 This is a functional block diagram illustrating an example of the structure of the gas sensor according to this embodiment.

[0026] Figure 2 This diagram shows an example of the pin configuration of the circuit constituting the gas sensor of this embodiment.

[0027] Figure 3 This is a diagram illustrating an example of the circuit structure of the first light-receiving element and the signal processing IC.

[0028] [Explanation of reference numerals in the attached figures]

[0029] 10 Gas Sensors

[0030] 20 First light-receiving element

[0031] 30 Second light-receiving element

[0032] 40 Light-emitting elements

[0033] 50 air chambers

[0034] 100 Signal Processing ICs

[0035] 102 A / D Conversion Unit

[0036] 104 Export Department

[0037] 106 Component Control Unit

[0038] TIN1P, TIN1N First Input Terminal Pair

[0039] TIN2P, TIN2N Second Input Terminal Pair

[0040] T1 Third terminal T2 Fourth terminal

[0041] TOUT First output terminal

[0042] Terminal pairs of the first light-receiving element 20, TP1N and TP1P

[0043] Terminal pairs of the second light-receiving element 30 (TP2N, TP2P)

[0044] Terminals of TLIN LED 40 Detailed Implementation

[0045] The present invention will now be described through embodiments thereof, but these embodiments do not limit the invention as defined in the claims. Furthermore, the combinations of features described in the embodiments are not necessarily all necessary for the solutions provided by the invention.

[0046] Figure 1 This is a functional block diagram illustrating an example of the structure of a gas sensor 10. The gas sensor 10 includes a first light-receiving element 20, a second light-receiving element 30, a light-emitting element 40, a gas chamber 50, and a signal processing IC 100. The gas sensor 10 is an example of a physical quantity extraction device that derives a specific physical quantity. For example, the gas sensor 10 can be a breath sensor, or an NDIR (non-dispersive infrared) sensor utilizing the unique absorption wavelength of carbon dioxide contained in exhaled breath. Alternatively, the gas sensor 10 can be an NDIR (non-dispersive infrared) sensor utilizing the unique absorption wavelength of alcohol contained in exhaled breath. Furthermore, the gas sensor 10 can be an NDIR (non-dispersive infrared) sensor utilizing the unique absorption wavelength of methane gas contained in the atmosphere. The gas sensor in this embodiment can be applied to various devices. For example, it can be used for environmental measurement in buildings, as a portable, small measuring device for integration into portable communication devices such as smartphones, and for indoor gas detection in mobile structures such as automobiles, trains, or airplanes.

[0047] According to the structure of the gas sensor in this embodiment, it can be used as a light-receiving and light-emitting device for purposes other than gas detection. That is, the disclosure derived by replacing "gas sensor" described above with "optical concentration measuring device," "optical physical quantity measuring device," "light-receiving and light-emitting device," "optical device," etc., is included within the scope of this disclosure. For example, it can detect the state of the optical path space (the presence or concentration of a specific component of a fluid, for example, other than a gas). For example, it can be used as a component detection device or component concentration measuring device for substances (e.g., water or bodily fluids) existing in the optical path space between the light-emitting part and the light-receiving part. For example, if the substance existing in the optical path space is blood, the component detection device or component concentration measuring device can be used to measure the glucose concentration in the blood.

[0048] The component detection device or component concentration measuring device can determine the glucose concentration in blood glucose by measuring the absorption of light with a wavelength of 1 to 10 μm. In measuring the glucose concentration in blood glucose, it is preferable to measure the absorption of light at wavelengths of 1.6 μm, 2.0–2.3 μm, and 9.6 μm. A small, high-precision, and highly reliable non-invasive glucose concentration meter can be achieved. With such a glucose concentration meter, for example, diabetic patients can accurately monitor blood glucose levels without causing invasive damage to their skin. Furthermore, based on the measured blood glucose levels, more accurate management of medication (e.g., insulin) can be achieved.

[0049] The gas chamber 50 introduces the gas to be measured into its interior and then outputs the gas to the exterior. Inside the gas chamber 50 are arranged a first light-receiving element 20 for measurement, a second light-receiving element 30 for reference, and a light-emitting element 40. The second light-receiving element 30 can be arranged adjacent to the light-emitting element 40. The second light-receiving element 30 and the light-emitting element 40 can also be constructed from a single semiconductor chip.

[0050] Preferably, at least a portion of the interior of the gas chamber 50 is made of a light-reflecting material to guide the light emitted by the light-emitting element 40 to the first light-receiving element 20 and / or the second light-receiving element 30. For example, the gas chamber 50 is made of metallic materials such as aluminum and copper. Alternatively, the gas chamber 50 may be made of resin, and at least a portion of its inner surface may have a thin film of metallic materials such as aluminum and copper. Furthermore, the gas to be measured may also be a flammable gas such as carbon dioxide, breath alcohol (ethanol, etc.), methane, propane, hydrogen, ethylene, or MCH (methylcyclohexane). Additionally, the gas to be measured may also be a toxic gas such as carbon monoxide, hydrogen sulfide, formaldehyde, or ammonia. Moreover, the gas to be measured may also be a greenhouse gas such as nitric oxide or refrigerant gas used in air conditioners or refrigerators.

[0051] The first light-receiving element 20 outputs a first current signal corresponding to the amount of light received from the light-emitting element 40. The second light-receiving element 30 outputs a second current signal corresponding to the amount of light received from the light-emitting element 40. The first current signal is a gas sensing signal dependent on the concentration of the target gas within the gas chamber 50, while the second current signal is a reference signal independent of the concentration of the target gas within the gas chamber 50 or dependent to a different degree than the first current signal. The second light-receiving element 30 can be used to compensate for temperature or aging changes in the first light-receiving element 20. That is, the reference signal can be used to compensate for temperature or aging changes in the gas sensing signal.

[0052] The signal processing IC 100 includes an A / D conversion unit 102, an output unit 104, and a component control unit 106. The signal processing IC 100 is an example of a semiconductor package. The signal processing IC 100 outputs the concentration of the target gas based on a first current signal and a second current signal. The concentration of the target gas is an example of a specific physical quantity.

[0053] The A / D converter 102 converts the first current signal and the second current signal from analog signals to digital signals and outputs the first digital signal and the second digital signal. The A / D converter 102 is an example of a generation unit that generates digital signals based on the first current signal and the second current signal. The derivation unit 104 derives the concentration of the target gas based on the first digital signal and the second digital signal. The second light-receiving element 30 can be disposed adjacent to the light-emitting element 40 and directly receive the light emitted from the light-emitting element 40. That is, the light emitted from the light-emitting element 40 can be received by the second light-receiving element 30 without passing through the space where the target gas is present. On the other hand, the first light-receiving element 20 can receive light in the wavelength region of the light emitted from the light-emitting element 40 that is not absorbed by the gas input to the gas chamber 50 and remains there. The derivation unit 104 can derive the concentration of the target gas based on the ratio of the value shown by the first digital signal to the value shown by the second digital signal. When the second light-receiving element 30 and the light-emitting element 40 are separately arranged, the light emitted from the light-emitting element 40 can pass through an optical filter that limits the wavelength to a band with less influence on the gas to be measured, and the second light-receiving element 30 receives the light transmitted through the optical filter.

[0054] The component control unit 106 controls the luminous intensity of the light-emitting element 40. The light-emitting element 40 emits light of an intensity corresponding to the driving signal input from the component control unit 106. The emitted light, as light emitted by the light-emitting element 40, is incident on the first light-receiving element 20 and the second light-receiving element 30. The light-emitting element 40 outputs emitted light of a wavelength corresponding to the absorption band of the gas to be measured. In addition, the light-emitting element 40 outputs emitted light of a band that the first light-receiving element 20 and the second light-receiving element 30 have sensitivity to. For example, the emitted light of the light-emitting element 40 is light in the infrared region, light in the ultraviolet region, or light in other bands. The light-emitting element 40 can be an LED, an incandescent lamp, a ceramic heater, or a MEMS (Micro Electro Mechanical Systems) heater, etc. In this embodiment, the light-emitting element 40 is a mid-infrared LED that emits infrared light as emitted light.

[0055] The first light-receiving element 20 is sensitive to the infrared radiation emitted by the light-emitting element 40. The first light-receiving element 20 outputs a first current signal corresponding to the intensity of the incident infrared radiation. The second light-receiving element 30 is sensitive to the infrared radiation emitted by the light-emitting element 40. The first light-receiving element 20 outputs a second current signal corresponding to the intensity of the incident infrared radiation. The first and second current signals are input to the A / D conversion unit 102. The first light-receiving element 20 and the second light-receiving element 30 can be quantum infrared sensors such as photodiodes or thermal infrared sensors such as pyroelectric sensors, thermopile, and bolometers. In this embodiment, the first light-receiving element 20 and the second light-receiving element 30 are mid-infrared photodiodes.

[0056] As described above, in addition to the first light-receiving element 20 for measuring gas concentration, the gas sensor 10 also includes a second light-receiving element 30 for reference. By having two light-receiving elements, the gas sensor 10 can suppress the influence of noise such as deviations in the luminous intensity of the luminous element 40, and can stably and accurately measure gas concentration.

[0057] To achieve miniaturization of the gas sensor 10, it is effective to use an ASIC for the signal processing IC 100. However, the output (first current signal) of the first light-receiving element 20 used for gas concentration measurement shows little change in relation to the gas concentration. Therefore, if leakage current from other wiring of the gas sensor 10 flows into the wiring connecting the first light-receiving element 20 and the signal processing IC, or if leakage current flows out to other wiring, the gas concentration derived from the first current signal may have a large error. If miniaturization of the gas sensor 10 is desired, the wiring density also increases, making leakage current more likely to occur.

[0058] The ASIC performs, for example, current-to-voltage conversion on the first current signal output from the first light-receiving element 20 and the second current signal output from the second light-receiving element 30, and inputs the converted voltage to the A / D converter. This current-to-voltage conversion circuit or A / D converter can use the same components for both the first and second current signals via a switching circuit. However, in this case, to shorten the wiring within the ASIC's semiconductor package, it is preferable to arrange the ASIC's connection terminals for connecting to the first and second light-receiving elements 20 and 30 respectively close to each other. However, if the connection terminals of the first and second light-receiving elements 20 and 30 are adjacent, the wiring of the first light-receiving element 20 for measurement and the wiring of the second light-receiving element 30 for reference must be adjacent, resulting in leakage current between these wirings, or making it difficult to take additional leakage countermeasures such as shielding the wiring.

[0059] Therefore, in this embodiment, a one-pin terminal is disposed between one terminal of a first input terminal pair having two terminals connected to and arranged adjacent to the terminal pair of the first light-receiving element 20 for measurement, and one terminal of a second input terminal pair having two terminals connected to and arranged adjacent to the terminal pair of the second light-receiving element 30 for reference. This one-pin terminal is disposed adjacent to one of the first input terminal pairs connected to the terminal pair of the first light-receiving element 20 for measurement and one of the second input terminal pairs connected to the terminal pair of the second light-receiving element 30 for reference. As a result, the leakage current between the wiring of the first light-receiving element 20 for measurement and the wiring of the second light-receiving element 30 for reference is reduced. Furthermore, additional measures such as shielded wiring or guard rings can be easily taken to further reduce this leakage current. Here, "two terminals arranged adjacent to each other" means that no other terminal is disposed between the two terminals, regardless of the distance between them.

[0060] Figure 2 This diagram shows an example of the pin configuration of the circuit constituting the gas sensor 10 of this embodiment. Figure 2 As shown, the signal processing IC 100, which is an ASIC, has multiple terminals. The signal processing IC 100 can be a QFN, an LGA, or a QFP.

[0061] The signal processing IC 100 may be rectangular when viewed from above. The signal processing IC 100 has a plurality of terminals arranged along its outer periphery when viewed from above from the mounting surface of the substrate. The signal processing IC 100 includes at least a first input terminal pair TIN1N, TIN1P connected to the terminal pairs TP1N, TP1P of the first light-receiving element 20, and a second input terminal pair TIN2N, TIN2P connected to the terminal pairs TP2N, TP2P of the second light-receiving element 30 as a plurality of terminals.

[0062] Figure 3 An example of the circuit structure of the first light-receiving element 20 and the signal processing IC 100 is shown. The signal processing IC 100 has a current-to-voltage conversion circuit 110 that converts a first current signal output from the first light-receiving element 20 into a voltage signal. The current-to-voltage conversion circuit 110 includes an operational amplifier 112 and a feedback resistor R1. The current-to-voltage conversion circuit 110 converts the first current signal I1, input to the first input terminals TIN1N and TIN1P via the terminals TP1N and TP1P of the first light-receiving element 20, into a voltage signal I1×R1, which is output as VOUT1. In order to input the first current signal into the signal processing IC 100, the potentials of the first input terminals TIN1N and TIN1P can be controlled to become a first internal potential VP1, which is a predetermined potential. Furthermore, in order to input the second current signal into the signal processing IC 100, the potentials of the second input terminals TIN2N and TIN2P can be controlled to become a second internal potential VP2, which is a predetermined potential. The first internal potential VP1 and the second internal potential VP2 can also be the same potential.

[0063] The signal processing IC 100 also includes a third terminal T1 disposed between the first input terminal pair TIN1N, TIN1P and the second input terminal pair TIN2N, TIN2P. The third terminal T1 is disposed adjacent to a first input terminal TIN1N of the first input terminal pair and a second input terminal TIN2P of the second input terminal pair. The third terminal T1 can output a constant potential. The third terminal T1 can be a voltage output terminal that, when viewed from above, is electrically connected to a guard ring surrounding at least one of the first light-receiving element 20 and the second light-receiving element 30 and provides a potential to the guard ring. The potential provided by the third terminal T1 to the guard ring can be a first internal potential VP1 or a second internal potential VP2.

[0064] When viewed from the mounting surface of the signal processing IC 100, the first input terminal pair TIN1N, TIN1P, the second input terminal pair TIN2N, TIN2P, and the third terminal T1 can be arranged along the outer periphery of the signal processing IC 100. When viewed from the mounting surface of the signal processing IC 100, the first input terminal pair TIN1N, TIN1P, the second input terminal pair TIN2N, TIN2P, and the third terminal T1 can be arranged along the first side 100a of the outer periphery of the signal processing IC 100.

[0065] If the signal processing IC 100 is a QFN, then when viewed from the mounting surface of the signal processing IC 100, the first input terminal pair TIN1N, TIN1P, the second input terminal pair TIN2N, TIN2P, and the third terminal T1 can be arranged spaced apart from the first side 100a of the outer periphery of the signal processing IC 100. If the signal processing IC 100 is an LGA, then when viewed from the mounting surface of the signal processing IC 100, the first input terminal pair TIN1N, TIN1P, the second input terminal pair TIN2N, TIN2P, and the third terminal T1 can be arranged spaced apart along the first side 100a of the outer periphery of the signal processing IC 100. If the signal processing IC 100 is a QFP, then when viewed from the mounting surface of the signal processing IC 100, the first input terminal pair TIN1N, TIN1P, the second input terminal pair TIN2N, TIN2P, and the third terminal T1 can be arranged spaced apart and protrude from the first side surface constituting the first side 100a of the outer periphery of the signal processing IC 100.

[0066] The signal processing IC 100 may also include a first output terminal TOUT. The signal processing IC 100 may have the function of driving a light-emitting element by means of a voltage or current output from the first output terminal TOUT. In this case, the driving method of the light-emitting element based on the voltage or current output from the first output terminal TOUT may be intermittent constant voltage driving or constant current driving. Here, "intermittent" means, for example, driving with a constant current of 100mA for a certain period of time, and not driving or driving with a current sufficiently small compared to the aforementioned 100mA during other periods. The signal processing IC 100 may also include a fourth terminal T2, which is disposed between the first output terminal TOUT and another second input terminal TIN2N of the second input terminal pair TIN2N and TIN2P, and is arranged adjacent to the second input terminal TIN2N. The first output terminal TOUT may be connected to the terminal TLIN of the light-emitting element 40. The fourth terminal T2 may be a voltage output terminal electrically connected to a guard ring surrounding at least one of the first light-receiving element 20 and the second light-receiving element 30, and providing a potential to the guard ring, the potential of which may be constant. Here, "constant potential" means that, during any 80% of the time period in which the gas sensor is driven, there may be a deviation of about 20% from the average potential of the protection ring during drive. "Constant potential" includes the condition of being approximately constant after considering errors such as potential variations caused by the operation of peripheral circuits, potential variations caused by component deviations, and potential variations caused by temperature characteristics. Furthermore, the potentials provided by the third terminal T1 and the fourth terminal T2 can be the same.

[0067] When viewed from the mounting surface of the signal processing IC 100, the first input terminal pair TIN1N, TIN1P, the second input terminal pair TIN2N, TIN2P, the third terminal T1, the fourth terminal T2, and the first output terminal TOUT can be arranged along the outer periphery of the signal processing IC 100. The first input terminal pair TIN1N, TIN1P, the second input terminal pair TIN2N, TIN2P, the third terminal T1, and the fourth terminal T2 can be arranged along a first side 100a of the outer periphery of the signal processing IC 100 when viewed from the mounting surface. The first output terminal TOUT can be arranged along a second side 100b of the outer periphery of the signal processing IC 100, which is different from the first side 100a, when viewed from the mounting surface. The second side 100b is an angled side with the first side 100a.

[0068] If the signal processing IC100 is a QFN, the first input terminal pair TIN1N, TIN1P, the second input terminal pair TIN2N, TIN2P, the third terminal T1, and the fourth terminal T2 can be arranged at intervals from the first side 100a of the outer periphery of the signal processing IC100 when viewed from the mounting surface of the signal processing IC100, and the first output terminal TOUT can be arranged on the second side 100b of the outer periphery of the signal processing IC100, which is different from the first side 100a, when viewed from the mounting surface of the signal processing IC100.

[0069] If the signal processing IC100 is an LGA, the first input terminal pair TIN1N, TIN1P, the second input terminal pair TIN2N, TIN2P, the third terminal T1, and the fourth terminal T2 can be arranged at intervals along the first side 100a of the outer periphery of the signal processing IC100 when viewed from the mounting surface of the signal processing IC100, and the first output terminal TOUT can be arranged along the second side 100b of the outer periphery of the signal processing IC100, which is different from the first side 100a, when viewed from the mounting surface of the signal processing IC100.

[0070] If the signal processing IC100 is a QFP, the first input terminal pair TIN1N, TIN1P, the second input terminal pair TIN2N, TIN2P, the third terminal T1, and the fourth terminal T2 can be arranged to protrude from the first side of the signal processing IC100 constituting the outer periphery of the signal processing IC100 at intervals when viewed from the mounting surface of the signal processing IC100, and the first output terminal TOUT can be arranged to protrude from the second side of the signal processing IC100 constituting the outer periphery of the signal processing IC100, which is different from the first side 100a, when viewed from the mounting surface of the signal processing IC100.

[0071] According to the signal processing IC 100 configured as described above, by providing a third terminal T1 between the first input terminal pair TIN1N, TIN1P and the second input terminal pair TIN2N, TIN2P, the leakage current between the wiring of the first light-receiving element 20 for measurement and the wiring of the second light-receiving element 30 for reference is reduced. Furthermore, additional measures such as shielded wiring or guard rings can be easily implemented to further reduce this leakage current.

[0072] More specifically, the first output terminal TOUT outputs current or voltage to drive the light-emitting element 40. The driving power of the light-emitting element 40 is typically greater than the signal source (in this embodiment, the second light-receiving element 30) of the second current signal input to the second input terminal pair TIN2N, TIN2P. Therefore, the voltage or current processed by the first output terminal TOUT is greater than the current or voltage processed by each of the second input terminal pairs TIN2N, TIN2P. That is, potentially, by driving the light-emitting element 40 through the first output terminal TOUT, leakage current can easily flow into the wiring connected to the second input terminal pair TIN2N, TIN2P. Therefore, by having a fourth terminal T2 disposed between the first output terminal TOUT and the second input terminal TIN2N, which is one of the second input terminal pairs, and arranged adjacent to the second input terminal TIN2N, the leakage current generated by driving the light-emitting element 40 through the first output terminal TOUT is reduced. Furthermore, additional measures such as shielded wiring or guard rings can be easily taken to further reduce this leakage current.

[0073] Furthermore, since the first output terminal TOUT outputs current or voltage to drive the light-emitting element 40, it is desirable to widen the width of the wiring connected to the first output terminal TOUT to reduce wiring resistance. When viewed from the mounting surface of the signal processing IC 100, the first output terminal TOUT is positioned along the second side 100b, which is different from the first side 100a, on the outer periphery of the signal processing IC 100. This suppresses the influence on the wiring connected to the first input terminal pairs TIN1N and TIN1P, the second input terminal pairs TIN2N and TIN2P, the third terminal T1, and the fourth terminal T2, and also allows for wider wiring connected to the first output terminal TOUT. Additionally, compared to the case where the first output terminal TOUT is located on the first side 100a, i.e., the second input terminal TIN2N, the fourth terminal T2, and the first output terminal TOUT are arranged laterally as one side of the second input terminal pair, the wiring connected to the first output terminal TOUT and the wiring connected to the second input terminal TIN2N can be further separated, reducing leakage current. In addition, it is easy to take additional measures such as shielded wiring or guard rings to further reduce the leakage current.

[0074] Furthermore, in this embodiment, the signal processing IC 100 is described as an example of an ASIC that performs signal processing on the gas sensor 10 and outputs the concentration of the target gas. However, any semiconductor package having two input terminal pairs connected to the terminal pairs of the two elements that output the current signal can also be applied to an ASIC other than an ASIC that outputs the concentration of the target gas.

[0075] The present invention has been described above using embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications or improvements can be made to the above embodiments. As can be seen from the claims, such modifications or improvements are also included within the technical scope of the present invention.

[0076] It should be noted that the execution order of actions, steps, procedures, and stages in the apparatus, system, program, and method shown in the claims, specification, and drawings can be implemented in any order, unless specifically stated as "first," "first," etc., and unless the output of a previous process is used in a later process. Even if the flow of actions in the claims, specification, and drawings is described using terms such as "firstly" or "next" for convenience, it does not mean that the actions must be performed in that order.

Claims

1. A semiconductor package comprising: The first input terminal pair is connected to the terminal pair of the first light-receiving element that outputs the first current signal, and is arranged adjacent to each other. The first current signal corresponds to the amount of light received from the light source. The second input terminal pair is connected to the terminal pair of the second light-receiving element that outputs the second current signal, and is arranged adjacent to each other. The second current signal corresponds to the amount of light received from the light source. The third terminal is configured adjacent to a first input terminal in the first input terminal pair and a second input terminal in the second input terminal pair; and The generation unit generates a digital signal based on the first current signal and the second current signal.

2. The semiconductor package according to claim 1, wherein, When viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, and the third terminal are arranged along the outer periphery of the semiconductor package.

3. The semiconductor package according to claim 1, wherein, When viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, and the third terminal are arranged along a first side of the outer periphery of the semiconductor package.

4. The semiconductor package according to claim 1, wherein, When viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, and the third terminal are disposed on a first side of the outer periphery of the semiconductor package.

5. The semiconductor package according to claim 1, wherein, The semiconductor package also includes: The first output terminal outputs current to the third component; and The fourth terminal is disposed between the first output terminal and another second input terminal in the second input terminal pair, and is configured adjacent to the other second input terminal in the second input terminal pair.

6. The semiconductor package according to claim 5, wherein, When viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, the third terminal, the first output terminal, and the fourth terminal are arranged along the outer periphery of the semiconductor package.

7. The semiconductor package according to claim 5, wherein, When viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, and the third terminal are arranged along a first side of the outer periphery of the semiconductor package. When viewed from the mounting surface of the semiconductor package, the first output terminal is arranged along a second side of the outer periphery of the semiconductor package that is different from the first side.

8. The semiconductor package according to claim 5, wherein, When viewed from the mounting surface of the semiconductor package, the first input terminal pair, the second input terminal pair, and the third terminal are disposed on a first side of the outer periphery of the semiconductor package. When viewed from the mounting surface of the semiconductor package, the first output terminal is disposed on a second side of the outer periphery of the semiconductor package, which is different from the first side.

9. The semiconductor package according to claim 5, wherein, The third element is the light source.

10. The semiconductor package according to claim 1, wherein, The third terminal is a voltage output terminal that outputs a constant potential.

11. The semiconductor package according to claim 1, wherein, The second light-receiving element is used to compensate for temperature or aging changes in the first light-receiving element.

12. A device for deriving a physical quantity, wherein, The physical quantity deriving device comprises a semiconductor package as described in any one of claims 1 to 11. Physical quantities are derived based on the digital signals.

13. The physical quantity deriving device according to claim 12, wherein, The physical quantity deriving device also includes the first light-receiving element and the second light-receiving element.

14. A device for deriving a physical quantity, wherein, The physical quantity deriving device includes: The semiconductor package according to claim 5; and The first light-receiving element, the second light-receiving element, and the light source that serves as the third element. Physical quantities are derived based on the digital signals.

15. A semiconductor package, wherein, The semiconductor package includes: The first input terminal pair is connected to the terminal pair of the first element that outputs the first current signal; The second input terminal pair is connected to the terminal pair of the second element that outputs the second current signal; and The third terminal is disposed between the first input terminal pair and the second input terminal pair.

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