Switching terminal, POP (Package on Package) structure and packaging method thereof

Abstract

The invention belongs to the technical field of lamination welding packaging of a switching power supply, and provides a conversion terminal, a POP lamination packaging structure and a packaging method thereof, a first layer component and a surface insulation device of the lamination packaging structure are pasted and welded on a carrier plate, and an upper layer component is supported and laminated on the surface insulation device through the conversion terminal. According to the conversion terminal, the integrated arch-shaped connecting section and the welding expansion section are lifted to be in a suspended state through the supporting legs, a stable supporting structure is formed, the overall gravity center is lowered, the problem that an existing terminal is prone to toppling after surface mounting and before reflow soldering is solved, and a stable foundation is provided for subsequent packaging and processing; moreover, the conversion terminal separates the welding expansion sections at the two sides through the arched connecting section, and the arched connecting section is removed after plastic packaging, so that the welding expansion sections at the two sides can be disconnected and exposed, effective separation of a welding area and pin extension reconstruction are realized, and the welding communication requirements of different pin ends of an upper-layer component are met. The problem of poor matching of the upper and lower layers of pads is effectively solved.

Description

Technical Field

[0001] This application belongs to the field of stacked soldering and packaging technology of switching power supplies, specifically, it relates to an adapter terminal, a POP stacked packaging structure and its packaging method. Background Technology

[0002] With the rapid development of electronic products towards miniaturization and high-density integration, POP (Package on Package) stacked packaging technology has become one of the core technologies for improving package integration density due to its ability to significantly improve the space utilization of module power supplies. In the application of POP stacked packaging technology, the industry typically assembles various commonly used surface-insulated devices such as DFN, QFN, SOT, and SOP on the carrier board. These devices generally only have planar pads or short lead structures and cannot directly provide vertical electrical connection points. To achieve stable connection and support between upper-layer components and the lower-layer carrier board and surface-insulated devices, the industry generally uses metal terminals as intermediate transition structures. This structure completes the support and positioning of upper-layer components and the electrical connection between upper and lower layer circuits, thus meeting the core requirements of stacked integrated layout.

[0003] However, when adapting to the above packaging scenarios, existing metal terminals have gradually revealed many insurmountable defects. First, the position and area of ​​the pads of surface insulating devices vary significantly, and the pin layout of upper-layer components is also diverse. Existing metal terminals have a simple structure and cannot extend or reconstruct the pins, which leads to mismatch problems between upper and lower layer pads and terminals, affecting the stability of electrical connections. Second, due to the limited space of the carrier board, the area of ​​pads that can be allocated to metal terminals is limited. Traditional metal terminals are mostly cylindrical structures with a high center of gravity. During the processing after tinning and before reflow soldering, it is difficult to form stable support, which makes them prone to tipping over and seriously affects production yield. Summary of the Invention

[0004] To address the issues of mismatched soldering areas and easy tipping of terminals encountered when using metal terminals for interconnection in existing switching power supply products due to differences in the layout, pad area, and position of upper and lower layer components, this application provides an adapter terminal, a POP stacked package structure, and a packaging method thereof.

[0005] In one embodiment, an adapter terminal is provided, which is made of a metallic conductor material and includes an arched connecting section, a welded extension section, and a support foot.

[0006] The welded extension section is a set of horizontal structures formed by bending the two ends of the arched connecting section extending horizontally downwards twice, and the relative height of the bottom end face of the arched connecting section in the vertical direction is higher than the top end face of the two welded extension sections; the support foot is a set of vertical structures formed by bending the side of each welded extension section away from the arched connecting section downwards once; the support foot lifts the arched connecting section and the welded extension section from below into a suspended state, and the support foot constrains the arched connecting section and the welded extension section to form a gap below.

[0007] Furthermore, the support foot is constructed by extending from one end of the welded extension section along the length of the welded extension section, and the extension length of the support foot in the horizontal direction is less than the extension length of the welded extension section.

[0008] Furthermore, the welded extension section has a downward-bending foot on the side opposite to the support foot; the projection of the foot in the vertical direction is perpendicular to the support foot, and the extension height of the foot in the vertical direction is less than the extension height of the support foot.

[0009] Furthermore, the adapter terminal is made from a single piece of metal raw material through etching or sheet metal processing.

[0010] In one embodiment, a POP stacked package structure is provided, including a carrier board, first-layer components, surface insulating devices, and upper-layer components. The first-layer components and surface insulating devices are soldered onto the carrier board via several pads provided on the carrier board. The upper-layer components are stacked on top of the surface insulating devices. The upper-layer components are supported and stacked on top of the surface insulating devices via adapter terminals as described in the above embodiment, and are electrically connected.

[0011] Specifically, the support feet are mounted on the same carrier plate and are welded to the pads of the carrier plate; the carrier plate, the first layer components, the surface insulating components and the adapter terminals are encapsulated as a whole, and the arched connecting section is removed to disconnect the welding extension sections on both sides; the pins of the upper layer components are welded to the top end faces of the two welding extension sections respectively.

[0012] Furthermore, one end of the weld extension extends above the surface insulating device, or the foot is placed on top of the surface insulating device.

[0013] In one embodiment, the two support feet of the adapter terminal span across two adjacent carrier plates, and each support foot is soldered to the pads of each carrier plate; the two sets of pins of the upper-layer components are soldered to the top end faces of the solder extension sections of the two adjacent adapter terminals.

[0014] In one embodiment, a packaging method for a POP stacked package structure is provided, which is applied to the packaging implementation of the POP stacked package structure in the above embodiment. The method includes the following steps: S1. Apply tin to each pad and soldering area of ​​the carrier board, and mount the first layer of components and surface insulating devices. S2. Install the adapter terminal on the carrier board. The support feet of the adapter terminal are placed on the pads or soldering areas of the carrier board. One end of the soldering extension extends to the top of the surface insulating device, or the foot is placed on the top of the surface insulating device to form an auxiliary support. S3. The carrier board carries the first layer of components, surface insulating devices, and adapter terminals for reflow soldering. S4. Perform overall plastic encapsulation of the carrier board, first-layer components, surface insulating components and adapter terminals; S5. Grind the top end face of the weld extension section as the reference surface, process and remove the arched connecting section of the adapter terminal, so that the weld extension sections on both sides of the adapter terminal are disconnected from each other and the top end face is exposed. S6. Apply tin to the top end face of the exposed solder extension section, and mount the upper-layer components so that the pins of the upper-layer components are correspondingly placed on the top end face of the solder extension section. S7. The carrier board carries the first-layer components, surface insulating components, adapter terminals, and upper-layer components for secondary reflow soldering.

[0015] Furthermore, the surface insulating devices are DFN, QFN, SOT, or SOP devices; the upper-layer components are surface-mount capacitors, resistors, inductors, DFN devices, FC chips, or a second carrier board.

[0016] The beneficial effects of this application are: This application's adapter terminal uses support feet to lift the integrated arched connecting section and solder extension section into a suspended state, forming a stable support structure. This significantly lowers the overall center of gravity and effectively solves the problem of existing terminals easily tipping over after mounting and before reflow soldering, providing a stable foundation for subsequent packaging processing. Furthermore, the adapter terminal separates the solder extension sections on both sides through the arched connecting section. After molding, removing the arched connecting section can disconnect and expose the solder extension sections on both sides, achieving effective separation of the soldering area and pin extension reconstruction. This adapts to the soldering connection requirements of different pins of upper-layer components and effectively solves the problem of poor matching between upper and lower layer pads. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the adapter terminal in one embodiment of this application; Figure 2 This is an assembly schematic diagram of a POP stacked packaging structure in one embodiment of this application; Figure 3 This is a schematic diagram of the bottom layer mounting of a POP stacked packaging structure in one embodiment of this application; Figure 4 This is a schematic diagram of a POP stacked packaging structure in one embodiment of this application; Figure 5 This is a schematic diagram of the grinding process of a POP stacked packaging structure in one embodiment of this application; Figure 6 This is a schematic diagram of the upper layer mounting of a POP stacked packaging structure in one embodiment of this application; Figure 7 This is a schematic diagram of a POP stacked packaging structure in one embodiment of this application; Labels for each item in the figure: 1. Adapter terminal; 11. Arched connecting section; 12. Welding extension section; 121. Foot; 13. Support foot; 2. Carrier plate; 3. First layer components; 4. Surface insulating components; 5. Upper layer components; 6. Molded enclosure. Detailed Implementation

[0019] The specific embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but are not intended to limit the scope of this application. Similarly, the following examples are only some embodiments of this application, not all embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] In this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0024] To address the issues of mismatched soldering areas and easy tipping of terminals encountered when using metal terminals for interconnection in switching power supply products due to differences in the layout, pad area, and position of upper and lower layer components, this application provides an adapter terminal, with specific embodiments as follows: In one embodiment, please refer to Figure 1 A converter terminal is provided, which is made of metal conductor material and includes an arched connecting section 11, a welding extension section 12 and a support foot 13.

[0025] In this embodiment, the weld extension section 12 is a set of horizontal surface structures constructed on both sides of the arched connecting section 11. Specifically, it is formed by bending both ends of the arched connecting section 11 downwards twice, which extends horizontally. That is, the arched connecting section 11 is a stepped surface that protrudes upwards relative to the weld extension sections 12 on both sides. Moreover, the bottom end face of the arched connecting section 11 is higher than the top end face of the two weld extension sections 12 in the vertical direction. The top of the weld extension section 12 is provided with a number of dot-shaped, strip-shaped, or irregularly shaped welding pads, or the top end face of the weld extension section 12 is plated as a whole to optimize welding adaptability.

[0026] In this embodiment, the support foot 13 is a set of vertical structures constructed below the two welded extension sections 12, specifically formed by bending each welded extension section 12 downwards once on the side opposite to the arched connecting section 11. Furthermore, the support foot 13 lifts the arched connecting section 11 and the welded extension section 12 from below, creating a suspended state, and constrains a gap below the arched connecting section 11 and the welded extension section 12. In particular, the end of the support foot 13 can be locally plated to optimize welding compatibility.

[0027] In this embodiment, the adapter terminal 1 is made of a single piece of metal raw material through etching or sheet metal processing. It can be standardized and adapted according to different usage layout requirements without the need for personalized mold opening, which greatly reduces the manufacturing cost and takes into account adaptability, stability and economy.

[0028] Furthermore, the support leg 13 extends from one end of the welded extension section 12 along the length of the welded extension section 12, and the horizontal extension length of the support leg 13 is less than the horizontal extension length of the welded extension section 12. Furthermore, with the adapter terminal 1 using the support leg 13 as its support base, the welded extension section 12 and the arched connecting section 11 can be further extended to obtain a larger support contact area; wherein, the portion of the welded extension section 12 longer than the support leg 13 can also serve as a horizontal support leg erected on other components to assist in support and stability.

[0029] Furthermore, the side edge of the welded extension section 12 opposite to the support leg 13, i.e., the end of the welded extension section 12 that is longer than the support leg 13, is also bent downwards to form a foot 121. The projection of the foot 121 in the vertical direction is perpendicular to the support leg 13, and the vertical extension height of the foot 121 is less than the vertical extension height of the support leg 13. In actual assembly and use, the foot 121 can serve as an auxiliary support for the adapter terminal 1, mounted on other components for auxiliary support and fixation.

[0030] Therefore, the adapter terminal 1 of this application raises the integrated arched connecting section 11 and the solder extension section 12 into a suspended state through the support foot 13, forming a stable support structure, which greatly reduces the overall center of gravity and effectively solves the problem that existing terminals are prone to tipping over after mounting and before reflow soldering, providing a stable foundation for subsequent packaging processing; and the adapter terminal 1 separates the solder extension sections 12 on both sides through the arched connecting section 11. After plastic encapsulation, removing the arched connecting section 11 can realize the mutual disconnection and exposure of the solder extension sections 12 on both sides, realizing the effective separation of the soldering area and pin extension reconstruction, adapting to the soldering connection requirements of different pin ends of the upper layer component 5, and effectively solving the problem of poor matching between upper and lower layer pads.

[0031] In one embodiment, please refer to Figures 2 to 7A POP stacked packaging structure is provided, including a carrier board 2, a first-layer component 3, a surface insulating device 4, and an upper-layer component 5. The first-layer component 3 and the surface insulating device 4 are soldered and assembled on the carrier board 2 through a plurality of pads provided on the carrier board 2. The upper-layer component 5 is stacked and assembled on the surface insulating device 4. The upper-layer component 5 is supported and stacked on the surface insulating device 4 through the adapter terminal 1 as described in the above scheme, and is electrically connected.

[0032] Specifically, the support foot 13 is mounted across the same carrier plate 2, and the support foot 13 is welded and fixed to the pads of the carrier plate 2; the carrier plate 2, the first layer component 3, the surface insulating device 4 and the adapter terminal 1 are integrally encapsulated to form a plastic body 6 on the carrier plate 2, and the arched connecting section 11 is removed by grinding, cutting and other processing methods, so that the welding extension sections 12 on both sides of the arched connecting section 11 are disconnected from each other; the pins of the upper layer component 5 are welded and fixed to the top end face of the two welding extension sections 12 respectively.

[0033] In this embodiment, the first-layer components 3 include magnetic components, capacitors, resistors, chips, switching transistors, etc. The gap area formed between the support feet 13 of the adapter terminal 1 can also be used as the arrangement area of ​​the first-layer components 3 on the carrier board 2. Each first-layer component 3 arranged on the carrier board 2 does not contact the support feet 13. The height of the first-layer components 3 arranged in the gap area of ​​the adapter terminal 1 is lower than the height of the support feet. The surface insulating device 4 is a square flat no-lead package device with double-sided pins, a square flat no-lead package device with four-sided pins, a small outline transistor device, or a small outline surface mount device, etc. The upper-layer components 5 are surface mount capacitors, resistors, inductors, DFN devices, FC chips, second carrier boards, etc. By mounting the second carrier board as the upper-layer components 5, a multi-layer stacked package structure can be realized.

[0034] In this embodiment, the type of carrier board 2 includes, but is not limited to, commonly used carrier boards 2 such as PCB boards and lead frames. The soldering area of ​​the carrier board 2 does not need to refer to the large-area solder pads of traditional terminal designs. Matching solder pads can be designed according to the cross-sectional shape and size limits of the support foot 13 of the adapter terminal 1, thereby leaving more board area for the first layer components 3 and achieving high integration requirements.

[0035] In one embodiment, based on the aforementioned embodiment, when the adapter terminal 1 is mounted onto the carrier plate 2, one end of the solder extension section 12 extends above the surface insulating device 4, or the foot 121 is placed on the top of the surface insulating device 4. Thus, the edge of the solder extension section 12 or the foot 121 is placed on the top of the surface insulating device 4 to form an auxiliary support, further ensuring the stability of the adapter terminal 1 after mounting and before reflow soldering, as well as during the processing and removal of the arched connecting section 11.

[0036] In one embodiment, based on the foregoing embodiments, this application also provides a packaging method for a POP stacked packaging structure, which is applied to the packaging implementation of the POP stacked packaging structure in the above-described scheme. The method includes the following steps: S1, Solder printing and component placement before mounting of components on the bottom layer of carrier board 2.

[0037] Solder paste is evenly printed on the pre-set pads and soldering areas of the carrier board 2. Lead-free solder alloy can be used to ensure that the amount of solder meets the reliability requirements of subsequent soldering. Then, the first-layer components 3 and surface insulating devices 4 are precisely mounted on the corresponding positions of the carrier board 2 using a high-precision pick-and-place machine. During the mounting process, it is necessary to ensure that the device pins are accurately aligned with the pads of the carrier board 2, thereby completing the basic layout of the bottom circuit and providing a stable support foundation for the subsequent installation of the adapter terminal 1.

[0038] S2, Precise installation and auxiliary support construction of adapter terminal 1.

[0039] Please see Figure 2 and Figure 3 The adapter terminal 1 is precisely positioned in the designated area of ​​the carrier board 2. The support feet 13 of the adapter terminal 1 must be accurately aligned with the pads or reserved soldering areas of the carrier board 2 and placed stably, ensuring full contact between the support feet 13 and the solder paste. Simultaneously, one end of the solder extension section 12 of the adapter terminal 1 extends above the surface insulating device 4, or the dabbing feet 121 of the solder extension section 12 are directly placed on the top end face of the surface insulating device 4, forming an auxiliary support structure. The support provided by the surface insulating device 4 further enhances the stability of the adapter terminal 1 before reflow soldering, preventing it from tipping over due to terminal center of gravity shift or external disturbance. Furthermore, the extended arrangement of the solder extension section 12 allows for advance planning of the soldering area for the upper-layer components 5, reserving space for subsequent pin interconnection.

[0040] S3. The underlying structure is fixed by a single reflow soldering process.

[0041] The carrier board 2, which has been mounted, along with the first-layer components 3, surface insulating devices 4, and adapter terminals 1, is sent into a reflow oven. The reflow oven is used for soldering, such as using a lead-free reflow soldering profile. Through one reflow soldering process, the first-layer components 3, surface insulating devices 4, and adapter terminals 1 are reliably fixed to the carrier board 2, while ensuring the electrical conductivity of each connection part, thus completing the integrated molding of the bottom layer packaging structure.

[0042] S4. The overall plastic sealing achieves overall internal protection and fixation of the underlying structure.

[0043] Please see Figure 4The underlying structure, consisting of carrier board 2, first-layer components 3, surface insulating devices 4, and adapter terminals 1, can be encapsulated using a transfer molding process. High-temperature resistant, low-stress epoxy resin can be used as the encapsulation material to ensure that the encapsulation material fully fills all structural gaps without defects such as bubbles or insufficient adhesive. This provides mechanical protection and insulation for the internal structure of the underlying layer, preventing structural damage during subsequent grinding and upper-layer mounting. It also enhances the overall mechanical strength of the package, providing a stable structural foundation for subsequent high-precision grinding.

[0044] S5. Grinding the reference surface removes the arched connecting section 11 and exposes the welded extension section 12.

[0045] Please see Figure 5 Using the top surface of the welding extension section 12 of the adapter terminal 1 as a reference surface, a composite processing technology combining precision mechanical grinding and chemical mechanical polishing is employed for grinding and thinning. First, the plastic sealant and the arched connecting section 11 of the adapter terminal 1 are initially removed using mechanical grinding, with a diamond wheel as the grinding tool. Then, CMP (chemical mechanical polishing) is used for fine polishing to ensure the flatness of the welding surface. This step must ensure that the arched connecting section 11 is completely removed, breaking the connection between the welding extension sections 12 on both sides, while ensuring that the top surface of the welding extension section 12 is precisely exposed, providing a flat and reliable welding reference surface for the mounting and soldering of the upper-layer components 5. Alternatively, depending on actual production needs, processes such as laser cutting can be used to precisely cut off the arched connecting section 11, followed by simple grinding to finish the surface of the welding extension section 12.

[0046] S6. Solder printing and placement before mounting of upper-layer components 5.

[0047] Please see Figure 6 Solder paste is printed on the top surfaces of the exposed solder extension sections 12 on both sides after grinding. The printing thickness is adjusted according to the pin size of the upper component 5 to ensure that the amount of solder is suitable for subsequent soldering requirements. Then, the different pins of the upper component 5 are respectively placed on the top surfaces of the solder extension sections 12 on both sides. The independent solder extension sections 12 realize the partitioning of different pins of the upper component 5, solving the problem of mismatch in the position and area of ​​the upper and lower pads in traditional packaging.

[0048] S7. The structure is formed by secondary reflow welding.

[0049] The package with the upper component 5 mounted is sent back to the reflow oven for a second reflow soldering using a reflow soldering profile adapted to the plastic encapsulation structure. This ensures a reliable solder connection between the pins of the upper component 5 and the top end face of the solder extension section 12, achieving electrical connectivity between the upper component 5 and the underlying circuitry. After soldering, subsequent processes such as cleaning and testing complete the formation of the entire POP stacked package structure.

[0050] In summary, the adapter terminal 1 of this application, by setting an integrated structure of an arched connecting section 11, a soldering extension section 12 and a support foot 13, utilizes the support foot 13 to mount and erect on the carrier plate 2 to form a stable support structure, raising the arched connecting section 11 and the soldering extension section 12 into a suspended state. Compared with traditional cylindrical terminals, this significantly lowers the overall center of gravity, effectively solving the problem that traditional terminals are prone to tipping over after mounting and before reflow soldering, providing a stable foundation for subsequent packaging processing and improving production yield. Meanwhile, this application adopts a process flow of "mounting-reflow soldering-molding-grinding-upper-mounting-secondary reflow" based on the POP stacked packaging structure of the adapter terminal 1. The arched connecting section 11 of the adapter terminal 1 is used to separate the two solder extension sections 12. The reference surface during molding is set as the solder extension section 12. Since the bottom end face of the arched connecting section 11 is higher than the top end face of the solder extension section 12, the arched connecting section 11 can be accurately removed after packaging with the grinding and thinning process, so that the two solder extension sections 12 are disconnected and exposed. This achieves precise separation and pin extension reconstruction of the soldering area of ​​the upper component 5, which can adapt to the independent soldering requirements of different pin ends of the upper component 5. Furthermore, the solder extension section 12 can be flexibly designed according to the differences in area and position of the upper and lower pads, effectively solving the problem of poor matching between traditional terminals and upper and lower pads. In addition, the adapter terminal 1 is made of metal conductor material through integral bending, which can be standardized and adapted according to the layout requirements of different surface insulation devices 4 and upper components 5. No personalized mold opening is required, which greatly reduces the manufacturing cost and takes into account adaptability, stability and economy.

[0051] In one embodiment, a POP stacked package structure is provided, including a carrier board 2, a first-layer component 3, a surface insulating device 4, and an upper-layer component 5. The first-layer component 3 and the surface insulating device 4 are soldered and assembled on the carrier board 2 through a plurality of pads provided on the carrier board 2. The upper-layer component 5 is stacked and assembled on the surface insulating device 4. The upper-layer component 5 is supported and stacked on the surface insulating device 4 through the adapter terminal 1 as described in the above scheme, and is electrically connected.

[0052] In this configuration, the two support feet 13 of the adapter terminal 1 span two adjacent carrier plates 2, and each support foot 13 is soldered and fixed to the pads of each carrier plate 2. The two sets of pins of the upper component 5 are respectively soldered and fixed to the top end face of the solder extension section 12 of the two adjacent adapter terminals 1. For example, the support feet 13 of each adapter terminal 1 can be divided into first side pins and second side pins. The first side pin of the first adapter terminal 1 is soldered and connected to the first carrier plate 2, and the second side pin of the first adapter terminal 1 is soldered and connected to the second carrier plate 2. The assembly structure of the second adapter terminal 1 repeats the specific assembly steps described above, and the different pin ends of the upper component 5 are respectively soldered and fixed to the solder extension section 12 of the first adapter terminal 1 and the solder extension section 12 of the second adapter terminal 1.

[0053] The above are merely optional embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An adapter terminal, made of a metallic conductor material, characterized in that, Includes arched connecting sections, welded extension sections, and supporting legs; The welded extension section is a set of horizontal surface structures formed by bending the two ends of the arched connecting section extending in the horizontal direction downward twice, and the relative height of the bottom end face of the arched connecting section in the vertical direction is higher than the top end face of the two welded extension sections. The support leg is a set of vertical surface structures formed by bending each of the welded extension sections downward once on the side away from the arched connecting section; the support leg lifts the arched connecting section and the welded extension section from below into a suspended state, and the support leg constrains the arched connecting section and the welded extension section to form a gap below them.

2. The adapter terminal according to claim 1, characterized in that, The support leg is constructed by extending one end of the welded extension section along the length direction of the welded extension section, and the extension length of the support leg in the horizontal direction is less than the extension length of the welded extension section.

3. The adapter terminal according to claim 2, characterized in that, The welded extension section has a downward bend along the side edge opposite to the supporting foot, forming a foot-like structure. The projection of the foot in the vertical direction is perpendicular to the support foot, and the vertical extension height of the foot is less than the vertical extension height of the support foot.

4. The adapter terminal according to claim 3, characterized in that, The adapter terminal is made from a single piece of metal raw material through etching or sheet metal processing.

5. A POP (Package Opening) stacked package structure, comprising a carrier board, first-layer components, surface insulating devices, and upper-layer components; wherein the first-layer components and the surface insulating devices are soldered onto the carrier board via a plurality of pads provided on the carrier board, and the upper-layer components are stacked and assembled on top of the surface insulating devices, characterized in that, The upper-layer components are supported and stacked on the surface insulating device by the adapter terminal as described in claim 1, and are electrically connected. The support feet are mounted across the same carrier plate, and the support feet are welded and fixed to the pads of the carrier plate; The carrier board, the first-layer components, the surface insulating devices, and the adapter terminals are encapsulated as a whole, and the arched connecting section is removed to disconnect the welding extension sections on both sides; the pins of the upper-layer components are welded and fixed to the top end faces of the two welding extension sections respectively.

6. A POP (Package Opening) stacked package structure, comprising a carrier board, first-layer components, surface insulating devices, and upper-layer components; wherein the first-layer components and the surface insulating devices are soldered onto the carrier board via a plurality of pads provided on the carrier board, and the upper-layer components are stacked and assembled on top of the surface insulating devices, characterized in that, The upper-layer components are supported and stacked on the surface insulating device by the adapter terminals as described in any one of claims 2 to 4, and are electrically connected. The support feet are mounted across the same carrier plate, and the support feet are welded and fixed to the pads of the carrier plate; The carrier board, the first-layer components, the surface insulating devices, and the adapter terminals are encapsulated as a whole, and the arched connecting section is removed to disconnect the welding extension sections on both sides; the pins of the upper-layer components are welded and fixed to the top end faces of the two welding extension sections respectively.

7. The POP stacked packaging structure according to claim 6, characterized in that, One end of the weld extension extends above the surface insulating device, or the foot rests on top of the surface insulating device.

8. A packaging method for a POP stacked packaging structure, characterized in that, For a packaging implementation of the POP stacked packaging structure as described in claim 7, the method includes the following steps: S1. Apply tin to each pad and soldering area of ​​the carrier board, and mount the first layer of components and surface insulating devices. S2. Install the adapter terminal on the carrier board. The support feet of the adapter terminal are placed on the pads or soldering areas of the carrier board. One end of the soldering extension extends to the top of the surface insulating device, or the foot is placed on the top of the surface insulating device to form an auxiliary support. S3. The carrier board carries the first layer of components, surface insulating devices, and adapter terminals for reflow soldering. S4. Perform overall plastic encapsulation of the carrier board, first-layer components, surface insulating components and adapter terminals; S5. Grind the top end face of the weld extension section as the reference surface, process and remove the arched connecting section of the adapter terminal, so that the weld extension sections on both sides of the adapter terminal are disconnected from each other and the top end face is exposed. S6. Apply tin to the top end face of the exposed solder extension section, and mount the upper-layer components so that the pins of the upper-layer components are correspondingly placed on the top end face of the solder extension section. S7. The carrier board carries the first-layer components, surface insulating components, adapter terminals, and upper-layer components for secondary reflow soldering.

9. The packaging method for the POP stacked packaging structure according to claim 8, characterized in that, The surface insulating device is a DFN, QFN, SOT, or SOP device; the upper-layer components are surface-mount capacitors, resistors, inductors, DFN devices, FC chips, or a second carrier board.

10. A POP (Package Opening) stacked package structure, comprising a carrier board, first-layer components, surface insulating devices, and upper-layer components; wherein the first-layer components and the surface insulating devices are soldered onto the carrier board via a plurality of pads provided on the carrier board, and the upper-layer components are stacked and assembled on top of the surface insulating devices, characterized in that, The upper-layer components are supported and stacked on the surface insulating device by the adapter terminals as described in any one of claims 1 to 4, and are electrically connected. The two support feet of the adapter terminal are mounted across two adjacent carrier plates, and each support foot is welded and fixed to the pad of each carrier plate; the two sets of pins of the upper component are respectively welded and fixed to the top end face of the welding extension section of the two adjacent adapter terminals.

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