Optical module and upper computer of optical module

Abstract

The invention provides an optical module and an upper computer of the optical module, and the optical module comprises a circuit board which is provided with an electric connector on the surface; the electric connector is connected with a high-speed analog electric signal from an upper computer, and the high-speed analog electric signal is subjected to digital equalization processing; the analog equalizer is arranged on the surface of the circuit board, the input end of the analog equalizer is electrically connected with the electric connector, and the analog equalizer receives the high-speed analog electric signal and performs analog equalization on the high-speed analog electric signal; the laser driving chip is arranged on the surface of the circuit board, the input end of the laser driving chip is electrically connected with the output end of the analog equalizer, and the laser driving chip receives the high-speed analog electric signal subjected to analog equalization and generates a modulation electric signal; and the input end of the laser chip or the optical modulation chip is electrically connected with the output end of the laser driving chip, and the laser chip or the optical modulation chip receives the modulation electric signal and outputs an optical signal.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module and a host computer for the optical module. Background Technology

[0002] With the rise of hyperscale data centers and artificial intelligence (AI) / machine learning (ML) application environments, users have raised demands for optical modules with characteristics such as high bandwidth, low power consumption, low latency, and low cost. Because the amount of data to be transmitted is enormous, optical modules need to have high transmission bandwidth; however, the transmission bandwidth of a single optical module is limited, so multiple optical modules are combined to expand the transmission bandwidth. However, increasing the number of optical modules leads to a negative increase in power consumption and cost; at the same time, the high-speed data transmission requirements also necessitate further reductions in latency, and current optical modules are insufficient to fully meet user needs. Summary of the Invention

[0003] Some embodiments provide an optical module, including: a circuit board with an electrical connector disposed on its surface; the electrical connector receives a high-speed analog electrical signal from a host computer, the high-speed analog electrical signal being digitally equalized; an analog equalizer disposed on the surface of the circuit board, its input terminal being electrically connected to the electrical connector, receiving the high-speed analog electrical signal, and performing analog equalization on the high-speed analog electrical signal; a laser driver chip disposed on the surface of the circuit board, its input terminal being electrically connected to the output terminal of the analog equalizer, receiving the analog-equalized high-speed analog electrical signal, and generating a modulated electrical signal; and a laser chip or optical modulation chip, its input terminal being electrically connected to the output terminal of the laser driver chip, receiving the modulated electrical signal, and outputting an optical signal.

[0004] Some embodiments provide an optical module, including: a circuit board with an electrical connector disposed on its surface; the electrical connector receiving a high-speed digital electrical signal from a host computer; a digital equalizer disposed on the surface of the circuit board, its input terminal electrically connected to the electrical connector, receiving the high-speed digital electrical signal and performing digital equalization on the high-speed digital electrical signal; a digital-to-analog signal converter disposed on the surface of the circuit board, its input terminal electrically connected to the output terminal of the digital equalizer, receiving the digitally equalized high-speed digital electrical signal and converting the received high-speed digital electrical signal into a high-speed analog electrical signal; an analog equalizer disposed on the surface of the circuit board, its input terminal electrically connected to the output terminal of the digital-to-analog signal converter, receiving the high-speed analog electrical signal and performing analog equalization on the high-speed analog electrical signal; a laser driver chip disposed on the surface of the circuit board, its input terminal electrically connected to the output terminal of the analog equalizer, receiving the analog-equalized high-speed analog electrical signal and generating a modulated electrical signal; and a laser chip or optical modulation chip, its input terminal electrically connected to the output terminal of the laser driver chip, receiving the modulated electrical signal and outputting an optical signal.

[0005] Some embodiments provide a host computer for an optical module, including: a PAM4 chip / NRZ chip that outputs a high-speed digital electrical signal; a digital equalizer whose input is electrically connected to the PAM4 chip / NRZ chip, receives the high-speed digital electrical signal, and performs digital equalization on the high-speed digital electrical signal; a digital-to-analog converter whose input is electrically connected to the output of the digital equalizer, receives the digitally equalized high-speed digital electrical signal, and converts the received high-speed digital electrical signal into a high-speed analog electrical signal; an analog equalizer whose input is electrically connected to the output of the digital-to-analog converter, receives the high-speed analog electrical signal, and performs analog equalization on the high-speed analog electrical signal; and an electrical connector electrically connected to the analog equalizer, transmitting the digitally and analogly equalized high-speed analog electrical signal to the optical module.

[0006] Some embodiments provide a host computer for an optical module, including: a PAM4 chip / NRZ chip that outputs a high-speed digital electrical signal; a digital equalizer whose input is electrically connected to the PAM4 chip / NRZ chip, receives the high-speed digital electrical signal, and performs digital equalization on the high-speed digital electrical signal; a digital-to-analog signal converter whose input is electrically connected to the output of the digital equalizer, receives the digitally equalized high-speed digital electrical signal, and converts the received high-speed digital electrical signal into a high-speed analog electrical signal; and an electrical connector electrically connected to the digital-to-analog signal converter to transmit the digitally equalized high-speed analog electrical signal to the optical module.

[0007] Electrical signals experience loss during transmission. Before being transmitted to the optical module, the electrical signal output from the PAM4 / NRZ chip in the host computer undergoes digital equalization / compensation. This digital equalization / compensation, performed when the signal quality is already high, improves the signal quality retained after loss, providing a better foundation for subsequent analog equalization / compensation. While digital compensation by the equalizer improves the signal quality, performance is limited when using only digital equalization to compensate for low modulation bandwidth and / or high RF connection loss due to peak-to-average power ratio (PAPR). Therefore, digital and analog equalization must be combined. A digital-to-analog converter converts the high-speed digital signal (after digital equalization) into a high-speed analog signal. An analog equalizer then performs analog equalization on this high-speed analog signal. The resulting high-speed analog signal, after both digital and analog equalization, is provided to the laser driver chip to drive the laser chip or modulation chip to output the optical signal. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly introduced below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0009] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments;

[0010] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0011] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0012] Figure 4 An exploded view of an optical module according to some embodiments;

[0013] Figure 5 This is an internal structural diagram of an optical module according to some embodiments;

[0014] Figure 6 This is a diagram showing the electrical signal connection between an optical module and a host computer according to some embodiments;

[0015] Figure 7 This is a diagram showing the electrical connection relationship between an optical module and a host computer according to some embodiments;

[0016] Figure 8 This is a diagram showing the electrical connection relationship between an optical module and a host computer according to some embodiments. Detailed Implementation

[0017] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0018] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0019] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0020] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0021] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0022] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0023] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0024] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0025] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0026] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0027] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0028] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0029] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0030] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0031] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0032] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0033] Figure 2This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0034] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0035] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0036] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0037] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0038] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0039] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0040] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0041] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0042] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0043] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0044] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0045] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include one or more of the following: a microcontroller unit (MCU), a laser driver chip, a transimpedance amplifier (TIA), a limiting amplifier (LA), and a power management chip.

[0046] The host computer sends high-speed data signals to the optical module, which converts the high-speed data signals into optical signals. These optical signals then propagate through the optical fiber / cable to achieve data transmission with the remote end. Alternatively, the optical module receives optical signals from the optical fiber / cable, converts them into high-speed data signals, and sends these high-speed data signals to the host computer. An electrical connection is established between the optical module and the host computer to enable bidirectional transmission of high-speed data signals.

[0047] The circuit board of the optical module is equipped with an electrical connector to establish an electrical connection with the host computer; the electrical connector can be an electrical connection pin or a pin header.

[0048] In some embodiments, the optical module includes a circuit board with electrical connection pins. By inserting these pins into the electrical connector of a host computer, bidirectional transmission of high-speed data signals is achieved. The circuit board can be a rigid circuit board (PCB) or a flexible circuit board (FPC). The electrical connection pins can be gold finger-type pins disposed on the surface of the circuit board, consisting of multiple independent pins.

[0049] In some embodiments, the optical module has a circuit board with pads on it and pins soldered onto the pads. By establishing an electrical connection between the pins and a host computer, high-speed bidirectional data signal transmission between the optical module and the host computer can be achieved. The circuit board can be a rigid circuit board (PCB) or a flexible circuit board (FPC).

[0050] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0051] In some implementations, the gold fingers are located on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers are set on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is large.

[0052] In some implementations, the gold fingers of the circuit board extend from the electrical port and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0053] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0054] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0055] In some embodiments, the optical module includes a light emitting component 400, such as... Figure 4 As shown. The light emitting component 400 is used to emit light signals.

[0056] In some embodiments, the optical module includes an optical receiving component 500, such as... Figure 4 As shown. The optical receiving unit 500 is used to receive optical signals and convert them into electrical signals.

[0057] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0058] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0059] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0060] Figure 5 This is an internal structural diagram of an optical module according to some embodiments. In some embodiments, an analog equalizer 310 may be disposed on the surface of the circuit board 300. The analog equalizer 310 can process electrical signals transmitted from the host computer to the gold fingers, and can also process electrical signals transmitted from the optical receiving component 500 to the gold fingers.

[0061] In some implementations, a laser driver chip can be provided on the surface of the circuit board 300. One end of the laser driver chip can be connected to the analog equalizer 310, and the other end of the laser driver chip can be connected to the light emitting component 400, so that the laser driver chip provides a high-frequency drive signal under the action of the electrical signal processed by the analog equalizer 310, thereby causing the light emitting component 400 to emit a light signal under the action of the high-frequency drive signal.

[0062] In some embodiments, the optical receiver 500 can be connected to the analog equalizer 310 via a second signal line, so that the analog equalizer 310 can process the high-frequency electrical signal transmitted from the optical receiver 500 to the gold finger via the second signal line. For example, the transimpedance amplifier chip of the optical receiver 500 can be connected to the analog equalizer 310 via the second signal line.

[0063] In some embodiments, the light emitting component 400 and the light receiving component 500 are staggered along the length of the circuit board 300, and the light emitting component 400 and the light receiving component 500 have no overlapping portion along the width of the circuit board 300. The light receiving component 500 and the analog equalizer 310 are located on the same surface of the circuit board 300.

[0064] In some embodiments, the light receiving component 500 may include a first light receiving component 502. The first light receiving component 502 may be located on one side of the light emitting component 400. The first light receiving component 502 may be disposed on the surface of the circuit board 300. For example, the first light receiving component 502 is located on the upper surface of the circuit board 300.

[0065] The light receiving component 500 may include a second light receiving component 501. The second light receiving component 501 may be located on the other side of the light emitting component 400. The second light receiving component 501 may be disposed on the surface of the circuit board 300. For example, the second light receiving component 501 may be disposed on the upper surface of the circuit board 300.

[0066] like Figure 5 As shown, taking a rigid PCB as an example, gold fingers are provided on one end surface of the PCB. The gold fingers are inserted into the host computer to receive high-speed data signals from the host computer.

[0067] A laser driver chip is placed on the surface of a rigid circuit board. The laser driver chip provides electrical signals to the laser chip to drive the laser chip to emit light signals.

[0068] In hyperscale data centers and AI / ML application environments, users have raised demands for optical modules with characteristics such as high bandwidth, low power consumption, low latency, and low cost. Because the amount of data to be transmitted in these environments is enormous, optical modules require high transmission bandwidth. However, the transmission bandwidth of a single optical module is limited, so multiple optical modules are combined to expand the bandwidth. However, increasing the number of optical modules leads to a negative increase in power consumption and cost. At the same time, the high-speed data transmission requirements necessitate further reductions in latency, and current optical modules are insufficient to fully meet user needs.

[0069] During the development of optical modules, the applicant discovered that the digital signal processing (DSP) chip is one of the key factors affecting power consumption, latency, and cost in optical modules. The applicant's research shows that in an 800G optical module based on 100G / channel and 8 optical channels, the DSP accounts for more than 50% of the total power consumption; in a 1.6T optical module based on 200G / channel and 8 optical channels, the DSP accounts for more than 60% of the total power consumption. Furthermore, the DSP also leads to high latency, thus limiting the use of DSP-based optical modules in AI / ML applications.

[0070] In optical modules, DSPs are mainly used to recover distorted electrical signals. Whether the electrical signals come from the host computer or from the received light after conversion, these electrical signals have obvious signal distortion. Electrical signal distortion will cause system errors and affect the quality of data transmission.

[0071] DSPs play a crucial role in recovering electrical signals in optical modules, but they also bring problems such as high power consumption, high cost, and high latency. Therefore, removing DSPs from optical modules can meet users' needs for low power consumption, low latency, and low cost, but ensuring the quality of electrical signals at the same time becomes a technical problem that needs to be solved.

[0072] The optical signal emitted by the optical module is based on the electrical signal from the host computer. During the transmission of the electrical signal from the host computer to the optical module, the adverse phenomenon of electrical signal distortion may occur. After analyzing the transmission path and transmission results of the electrical signal, the applicant found that the distortion of the electrical signal is mainly manifested in the reduction of the amplitude of the high-frequency part of the electrical signal, which weakens the amplitude difference between the high-frequency part and the low-frequency part, thus reducing the distinguishability between the high-frequency part and the low-frequency part of the signal, making it impossible to extract data from the electrical signal, resulting in the phenomenon of electrical signal distortion.

[0073] In response, the applicant provides an electrical signal equalization scheme that reduces or eliminates losses during electrical signal transmission by equalizing the electrical signal, so that the electrical signal after transmission loss maintains a high degree of high and low frequency differentiation, and the amplitude difference between the high-frequency and low-frequency components of the electrical signal is sufficient to resolve the data.

[0074] In some embodiments, the laser driver chip needs to be input with an analog signal / the optical module uses an analog signal to drive the laser chip to emit light, while the host computer of the optical module processes digital signals. In response, the applicant provides a solution that combines digital equalization and analog equalization to improve the compensation effect on electrical signals.

[0075] In some embodiments, when only digital equalization is used to compensate for low modulation bandwidth and / or high RF connection loss, the performance will be limited due to the influence of peak-to-average power ratio (PAPR). To address this, the applicant provides a scheme that combines digital equalization and analog equalization to improve the compensation effect on electrical signals.

[0076] Figure 6 This is a diagram showing the electrical signal connections between an optical module and a host computer according to some embodiments. In some embodiments, such as... Figure 6 As shown, the host computer / Serdes100 includes a PAM4 chip / NRZ chip 111, whose output provides high-speed data electrical signals to the optical module; the output of the PAM4 chip / NRZ chip 111 is a high-speed digital electrical signal, which can also be converted into a high-speed analog electrical signal.

[0077] In some embodiments, such as Figure 6 As shown, the host computer / Serdes100 includes a digital equalizer 112, which can perform equalization compensation on high-speed digital electrical signals. The digital equalizer can be an FFE (Feed Forward Equalizer) chip or a DFE (Decision Feedback Equalizer) chip.

[0078] The electrical signal obtained after the high-speed digital electrical signal is equalized by the digital equalizer is significantly different from the initial electrical signal in the host computer / Serdes (such as the high-speed data electrical signal output by the PAM4 chip / NRZ chip). The digital equalizer reduces the amplitude of the low-frequency part of the digital electrical signal and can also extend the bandwidth of the high-speed digital electrical signal.

[0079] DSPs restore electrical signals, for example, restoring them to the state they were in when output by a PAM4 chip / NRZ chip. Unlike DSPs, digital equalizers do not restore signals; instead, they pre-improve them to account for subsequent losses.

[0080] The processing effect of a digital equalizer can be adjusted by adjusting the tap factor (TAP). By monitoring the emission dispersion eye diagram closed-loop four-phase TDECQ parameters of the output optical signal, the tap factor (TAP) can be adjusted to obtain a more suitable TAP.

[0081] In some embodiments, such as Figure 6 As shown, the input terminal of the digital equalizer 112 is electrically connected to the PAM4 chip / NRZ chip 111 to receive high-speed data electrical signals. At this time, the high-speed data electrical signals are high-speed digital electrical signals, and the digital equalizer performs equalization compensation on the high-speed digital electrical signals. The output terminal of the digital equalizer is electrically connected to the digital-to-analog signal converter (DAC) 113 to transmit the digitally equalized electrical signals to the DAC 113.

[0082] In some embodiments, such as Figure 6 As shown, the host computer / Serdes includes a DAC 113, which can convert digital electrical signals into analog electrical signals. In some embodiments, the input of the DAC 113 is electrically connected to the output of a digital equalizer to receive the digitally equalized digital electrical signal, which is then converted into an analog electrical signal by the DAC 113, and the output of the DAC 113 outputs the analog electrical signal.

[0083] The electrical signals output by the PAM4 / NRZ chips carry the data required for the optical modules to transmit optical signals. The PAM4 / NRZ chips are the data source, and their output electrical signals are of high quality. During transmission, electrical signals experience loss. Before reaching the optical module, the electrical signals output by the PAM4 / NRZ chips undergo digital equalization / compensation. This equalization / compensation, performed when the signal quality is already high, improves the signal quality retained after loss, providing a better foundation for subsequent analog equalization / compensation. For severely attenuated electrical signals, the data signal is difficult to distinguish due to its low quality. Therefore, even equalization / compensation of severely attenuated signals may not recover the data. Thus, equalization must be performed when the signal quality is already high.

[0084] Digital equalization can improve the quality of electrical signals after loss. However, when using digital equalization alone to compensate for low modulation bandwidth and / or high RF connection loss, the performance will be limited due to the peak-to-average power ratio (PAPR). Therefore, it is necessary to combine digital equalization with analog equalization.

[0085] In some embodiments, such as Figure 6As shown, the host computer / Serdes includes an analog equalizer 310, which can reduce the amplitude of the low-frequency part of the analog electrical signal. The analog equalizer 310 is a circuit composed of resistors, inductors, capacitors, etc. By adjusting the resistance, inductance, or capacitance values ​​of the circuit, the equalization effect of the analog equalizer 310 can be adjusted.

[0086] In some embodiments, the analog equalizer 310 in the host computer can be an active analog equalizer, which can boost the high-frequency portion of the analog electrical signal. The active analog equalizer includes an amplifier, and the equalization effect can be adjusted by controlling the amplifier gain.

[0087] In some embodiments, the input of the analog equalizer 310 is electrically connected to the DAC 310, and its output provides an equalized high-speed analog electrical signal to the optical module.

[0088] Due to the influence of peak-to-average power ratio (PAPR), the equalization performance of digital equalizers is limited. The performance defects of digital equalizers can be compensated by having an analog equalizer further equalize the digitally equalized electrical signal.

[0089] In some embodiments, such as Figure 6 As shown, the optical module includes an electrical connector 211 disposed on the surface of the circuit board. The high-speed analog electrical signal output by the analog equalizer 310 is connected through the electrical connection pin / electrical connector 211, and the high-speed analog electrical signal is transmitted to the laser driver chip 213 by the electrical connector 211.

[0090] In some embodiments, such as Figure 6 As shown, the optical module includes a laser driver chip 213 mounted on the surface of a circuit board. The laser driver chip can output a modulation signal based on a high-speed analog electrical signal to modulate the optical signal. The input terminal of the laser driver chip 213 is electrically connected to an electrical connector 211.

[0091] In some embodiments, the optical module includes a laser chip or an optical modulation chip, the input of which is electrically connected to the output of the laser driver chip, receives the modulation electrical signal, and outputs an optical signal.

[0092] Figure 7 This is a diagram showing the electrical signal connection between an optical module and a host computer according to some embodiments. Figure 7 As shown, in some embodiments, the optical module includes a digital equalizer 112, which can perform equalization compensation on high-speed digital electrical signals. The digital equalizer 112 can be an FFE (Feed Forward Equalizer) chip or a DFE (Decision Feedback Equalizer) chip.

[0093] The electrical signal obtained after the high-speed digital electrical signal is equalized by the digital equalizer is significantly different from the initial electrical signal in the host computer / Serdes (such as the high-speed data electrical signal output by the PAM4 chip / NRZ chip). The digital equalizer reduces the amplitude of the low-frequency part of the digital electrical signal and can also extend the bandwidth of the high-speed digital electrical signal.

[0094] DSPs restore electrical signals, for example, restoring them to the state they were in when output by a PAM4 chip / NRZ chip. Unlike DSPs, digital equalizers do not restore signals; instead, they pre-improve them to account for subsequent losses.

[0095] The processing effect of a digital equalizer can be adjusted by adjusting the tap factor (TAP). By monitoring the emission dispersion eye diagram closed-loop four-phase TDECQ parameters of the output optical signal, the tap factor (TAP) can be adjusted to obtain a more suitable TAP.

[0096] In some embodiments, such as Figure 7 As shown, the high-speed data electrical signals output by the PAM4 chip / NRZ chip in the host computer / Serdes are transmitted to the digital equalizer of the optical module. The input of the digital equalizer is electrically connected to the electrical connector 211 on the circuit board in the optical module to receive high-speed analog electrical signals from the host computer / Serdes. The electrical connector can be an electrical connection pin or a pin header.

[0097] At this time, the high-speed data signal is a high-speed digital signal. The digital equalizer performs equalization compensation on the high-speed digital signal. The output of the digital equalizer is electrically connected to the digital-to-analog converter (DAC) to transmit the digitally equalized signal to the DAC.

[0098] In some embodiments, such as Figure 7 As shown, the optical module includes a digital-to-analog signal converter (DAC) 113 disposed on the surface of a circuit board. The DAC 113 can convert digital electrical signals into analog electrical signals. In some embodiments, the input terminal of the DAC 113 is electrically connected to the output terminal of a digital equalizer to receive the digitally equalized digital electrical signal, which is then converted into an analog electrical signal by the DAC 113, and the output terminal of the DAC 113 outputs the analog electrical signal.

[0099] Digital equalization improves the quality of an electrical signal after it has lost signal quality. However, when using only digital equalization to compensate for low modulation bandwidth and / or high RF connection loss, performance is limited due to the peak-to-average power ratio (PAPR). Therefore, it is necessary to combine digital equalization with analog equalization. The applicant proposes a technical solution that combines digital and analog equalization. After digital equalization, the digital signal is converted to an analog signal using a DAC 113 for subsequent analog equalization.

[0100] In some embodiments, such as Figure 7 As shown, the optical module includes an analog equalizer 310 mounted on the surface of the circuit board. The analog equalizer can reduce the amplitude of the low-frequency portion of the analog electrical signal. The analog equalizer is a circuit composed of resistors, inductors, capacitors, etc. By adjusting the resistance, inductance, or capacitance values ​​of the circuit, the equalization effect of the analog equalizer can be adjusted.

[0101] In some embodiments, the analog equalizer 310 of the optical module is an active analog equalizer, which can boost the high-frequency portion of the analog electrical signal. The active analog equalizer includes an amplifier, and the equalization effect can be adjusted by controlling the amplifier gain.

[0102] In some embodiments, the input of the analog equalizer 310 in the optical module is electrically connected to the DAC 113, and its output provides an equalized high-speed analog electrical signal.

[0103] Figure 8 Here is another diagram showing the electrical connection relationship between the optical module and the host computer according to some embodiments, such as Figure 8 As shown, the input terminal of the analog equalizer 310 in the optical module 200 is electrically connected to the electrical connector 211 on the circuit board of the optical module to receive high-speed analog electrical signals from the host computer / Serdes. The electrical connector can be an electrical connection pin or a pin header. The host computer / Serdes 100 includes a digital equalizer 112, which performs digital equalization; the host computer / Serdes also includes a DAC 113, which converts the high-speed digital signal into a high-speed analog electrical signal and transmits the high-speed analog electrical signal to the optical module.

[0104] Due to the influence of peak-to-average power ratio (PAPR), the equalization performance of digital equalizers is limited. The performance defects of digital equalizers can be compensated by having analog equalizer 310 further equalize the electrical signal after digital equalization.

[0105] In some embodiments, the high-speed analog electrical signal output by the analog equalizer 310 is transmitted to the laser driver chip in the optical module, and the laser driver chip 213 drives the laser chip to emit an optical signal based on the high-speed analog electrical signal. The analog equalizer can be set in the optical module to output the high-speed analog electrical signal; alternatively, the analog equalizer can be set in the host computer / Serdes to output the high-speed analog electrical signal, and then the high-speed analog electrical signal is transmitted to the optical module.

[0106] In some embodiments, such as Figure 8 As shown, the optical module 200 includes a laser driver chip 213. The laser driver chip 213 receives high-speed data signals and provides driving signals to the laser chip based on the high-speed data signals, so as to drive the laser chip or the optical modulation chip to emit optical signals.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: A circuit board with electrical connectors on its surface; The electrical connector receives a high-speed analog electrical signal from the host computer, which is digitally equalized. An analog equalizer is disposed on the surface of the circuit board, and its input terminal is electrically connected to the electrical connector. It receives the high-speed analog electrical signal and performs analog equalization on the high-speed analog electrical signal. A laser driver chip is disposed on the surface of the circuit board. Its input terminal is electrically connected to the output terminal of the analog equalizer. It receives the high-speed analog electrical signal after analog equalization and generates a modulated electrical signal. The laser chip or optical modulation chip has its input terminal electrically connected to the output terminal of the laser driver chip, receives the modulation electrical signal, and outputs an optical signal.

2. An optical module, characterized in that, include: The circuit board has an electrical connector on its surface; the electrical connector is connected to a high-speed digital electrical signal from a host computer. A digital equalizer is disposed on the surface of the circuit board, and its input terminal is electrically connected to the electrical connector to receive the high-speed digital electrical signal and perform digital equalization on the high-speed digital electrical signal. A digital-to-analog signal converter is disposed on the surface of the circuit board. Its input terminal is electrically connected to the output terminal of the digital equalizer. It receives the high-speed digital electrical signal after digital equalization and converts the received high-speed digital electrical signal into a high-speed analog electrical signal. An analog equalizer is disposed on the surface of the circuit board. Its input terminal is electrically connected to the output terminal of the digital-to-analog signal converter. It receives the high-speed analog electrical signal and performs analog equalization on the high-speed analog electrical signal. A laser driver chip is disposed on the surface of the circuit board. Its input terminal is electrically connected to the output terminal of the analog equalizer. It receives the high-speed analog electrical signal after analog equalization and generates a modulated electrical signal. The laser chip or optical modulation chip has its input terminal electrically connected to the output terminal of the laser driver chip, receives the modulation electrical signal, and outputs an optical signal.

3. A host computer for an optical module, characterized in that, include: PAM4 chip / NRZ chip, outputs high-speed digital electrical signals; A digital equalizer, whose input is electrically connected to the PAM4 chip / NRZ chip, receives the high-speed digital electrical signal and performs digital equalization on the high-speed digital electrical signal; A digital-to-analog signal converter, whose input is electrically connected to the output of the digital equalizer, receives a high-speed digital electrical signal after digital equalization and converts the received high-speed digital electrical signal into a high-speed analog electrical signal. An analog equalizer, whose input is electrically connected to the output of the digital-to-analog signal converter, receives the high-speed analog electrical signal and performs analog equalization on the high-speed analog electrical signal; An electrical connector is electrically connected to the analog equalizer to transmit high-speed analog electrical signals, which have undergone digital and analog equalization, to the optical module.

4. A host computer for an optical module, characterized in that, include: PAM4 chip / NRZ chip, outputs high-speed digital electrical signals; A digital equalizer, whose input is electrically connected to the PAM4 chip / NRZ chip, receives the high-speed digital electrical signal and performs digital equalization on the high-speed digital electrical signal; A digital-to-analog signal converter, whose input is electrically connected to the output of the digital equalizer, receives a high-speed digital electrical signal after digital equalization and converts the received high-speed digital electrical signal into a high-speed analog electrical signal. An electrical connector is electrically connected to the digital-to-analog signal converter to transmit the digitally equalized high-speed analog electrical signal to the optical module.

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