Vacuum chuck and wafer processing equipment

Abstract

The invention discloses a vacuum chuck and wafer processing equipment. The vacuum suction cup is arranged on the wafer processing device, the wafer processing device comprises a connecting platform, the first negative pressure port is arranged on the connecting platform, the vacuum suction cup comprises a suction cup body and a supporting structure, the suction cup body comprises a first end face, a second end face, an adsorption groove and an adsorption hole, and the first end face and the second end face are oppositely arranged in the first direction. The adsorption groove is formed by recessing the second end face and comprises a first sub-groove and a second sub-groove which are communicated with each other, the first sub-groove is used for being connected with the first negative pressure port, the second sub-groove is used for adsorbing the connecting platform, the adsorption hole penetrates through the first end face and is communicated with the second sub-groove, and the adsorption hole is used for adsorbing the wafer. The supporting structure is at least arranged on the first end face and located in the same plane in the first direction, and the projection of the supporting structure and the projection of the adsorption groove are arranged at intervals. And the adsorption structure of the vacuum chuck is simplified.

Description

Technical Field

[0001] This application relates to the field of wafer processing technology, and in particular to a vacuum chuck and wafer processing equipment. Background Technology

[0002] This section provides only background information related to the present invention and is not necessarily prior art.

[0003] Currently, in wafer fabrication technology, wafers to be processed need to be fixed, supported, and moved using chucks during relevant processing steps to ensure high-precision positioning and smooth wafer fabrication. Typically, wafer adsorption mainly employs two methods: electrostatic adsorption and vacuum adsorption. Compared to electrostatic adsorption, vacuum adsorption, through the rigid contact between the wafer and the chuck, provides a stable, flat, and thermally controllable reference surface for the wafer, enabling nanoscale processing. Therefore, vacuum adsorption has become the preferred adsorption method for wafers in semiconductor processing.

[0004] In the development of wafer fabrication technology, how to optimize the adsorption structure of chucks is a technical problem that urgently needs to be solved. Summary of the Invention

[0005] The purpose of this application is to at least solve the problem of how to optimize the suction structure of a suction cup. This purpose is achieved through the following means: The first aspect of this application discloses a vacuum chuck for connection to a wafer processing apparatus. The wafer processing apparatus includes a connection platform and a first negative pressure port, the first negative pressure port being disposed on the connection platform. The vacuum chuck includes a chuck body and a support structure. The chuck body includes a first end face, a second end face, an adsorption groove, and an adsorption hole. The first end face and the second end face are disposed opposite to each other along a first direction, which is parallel to the thickness direction of the chuck body. The adsorption groove is formed by a recess in the second end face and includes a first sub-groove and a second sub-groove that are connected. The first sub-groove is used to connect to the first negative pressure port, and the second sub-groove is used to adsorb the connection platform. The adsorption hole penetrates the first end face and the second sub-groove and is used to adsorb a wafer. The support structure is at least disposed on the first end face, along the first direction and in the same plane, with the projection of the support structure and the projection of the adsorption groove spaced apart.

[0006] In the vacuum chuck of this application, the interconnected design of the adsorption groove and the adsorption orifice allows the vacuum chuck to adsorb wafers through a single adsorption channel, while increasing the reliability of the connection with the connection platform, significantly simplifying the structure of the adsorption channel, and reducing the complexity of multi-channel designs. Furthermore, the segmented arrangement of the first and second sub-grooves in the adsorption groove avoids the negative pressure from concentrating in the adsorption orifice due to the first negative pressure port being too close to it, thus preventing the weakening of the adsorption force between the vacuum chuck and the connection platform and further ensuring the adsorption effect. On the other hand, it expands the adsorption contact area between the vacuum chuck and the connection platform, enhancing adsorption stability.

[0007] In some embodiments, the second sub-slot includes at least one of a straight section and an arcuate section.

[0008] In some embodiments, the second sub-groove includes a straight section and an arc-shaped section, the arc-shaped section having the geometric center of the second end face as its arc center, the straight section extending from the end of the arc-shaped section in a direction away from the geometric center, and the first sub-groove connecting to the end of the straight section away from the arc-shaped section.

[0009] In some embodiments, the number of adsorption holes is set to multiple, and the second sub-groove includes an arc-shaped segment, with multiple adsorption holes spaced apart on the arc-shaped segment.

[0010] In some embodiments, the number of adsorption tanks includes multiple adsorption tanks, which are symmetrically arranged around the centerline of the second end face.

[0011] In some embodiments, the support structure includes a first support unit disposed on the second end face, the first support unit protruding from the second end face, and the first support unit and the adsorption groove being spaced apart.

[0012] In some embodiments, the support structure includes a plurality of second support units disposed on a first end face, the second support units protruding from the first end face, the second support units being spaced apart from the adsorption holes, and the plurality of second support units being spaced apart along a direction intersecting the first direction.

[0013] In some embodiments, the suction cup body further includes a clearance hole, which extends through the first end face and the second end face. The clearance hole is used to avoid the ejector pin assembly of the wafer processing apparatus. Any two of the clearance hole, the suction groove, and the support structure are spaced apart. The vacuum suction cup also includes a first sealing structure, which is at least disposed on the second end face and surrounds the edge of the clearance hole.

[0014] In some embodiments, the vacuum suction cup further includes: a second sealing structure, at least disposed on the second end face, the second sealing structure extending along the edge of the second end face.

[0015] A second aspect of this application discloses a wafer processing apparatus, including a vacuum chuck as described in the first aspect and a wafer processing device. The wafer processing device includes a connecting platform and a first negative pressure port, the first negative pressure port being disposed on the connecting platform, and the vacuum chuck being disposed on the connecting platform. Attached Figure Description

[0016] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. Wherein: Figure 1 This is a structural diagram of a wafer processing apparatus according to some embodiments of this application; Figure 2 This is a partial cross-sectional view of a wafer processing apparatus according to some embodiments of this application; Figure 3 This is a partial cross-sectional view of a wafer processing apparatus according to some embodiments of this application; Figure 4 This is a bottom view of the vacuum suction cups of some embodiments of this application; Figure 5 This is a top view of the vacuum suction cups according to some embodiments of this application; Figure 6 for Figure 5 An enlarged structural diagram of P in the middle; Figure 7 for Figure 4 A cross-sectional structural diagram of AA; Figure 8 This is a partial cross-sectional view of a wafer processing apparatus according to some embodiments of this application.

[0017] The labels in the attached diagram are as follows: 100. Vacuum chuck; 200. Wafer processing apparatus; 210. Connecting platform; 220. First negative pressure port; 230. Ejector pin assembly; 240. Second negative pressure port; 300. Wafer; 10. Suction cup body; 10a. First end face; 10b. Second end face; 11. Adsorption groove; 111. First sub-groove; 112. Second sub-groove; 1121. Straight section; 1122. Arc-shaped section; 12. Adsorption hole; 13. Clearance hole; 20. Support structure; 21. First support unit; 22. Second support unit; 31. First sealing structure; 32. Second sealing structure; 33. Third sealing structure; 40. Sealing part; Z, First direction. Detailed Implementation

[0018] Exemplary embodiments of this application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of this application are shown in the drawings, it should be understood that this application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of this application and to fully convey the scope of this application to those skilled in the art.

[0019] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0020] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0021] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure rotates, then an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0022] In the description of the application, the technical terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential", "height direction", "first direction", "second direction", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed, operated or used in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0023] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] Figure 1 This is a structural diagram of a wafer processing apparatus according to some embodiments of this application. Figure 2 This is a partial cross-sectional view of a wafer processing apparatus according to some embodiments of this application. Figure 3 This is a partial cross-sectional view of a wafer processing apparatus according to some embodiments of this application. Figure 4 This is a bottom view of the vacuum suction cups of some embodiments of this application.

[0025] like Figures 1 to 4As shown, according to an embodiment of the present invention, a vacuum chuck 100 and a wafer processing apparatus 200 are provided. The wafer processing apparatus 200 includes a connecting platform 210 and a first negative pressure port 220. The first negative pressure port 220 is disposed on the connecting platform 210, and the vacuum chuck 100 is disposed on the connecting platform 210.

[0026] Optionally, the wafer processing apparatus 200 includes semiconductor equipment, which includes a motion component and an optical system. The motion component may include a connecting platform 210 and a moving member that can move in one or more directions. The connecting platform 210 is connected to the moving member and moves with the moving member. The connecting platform 210 is connected to a vacuum chuck 100. The movement of the moving member causes the connecting platform 210 to move, which in turn causes the vacuum chuck 100 to move, thereby enabling relative movement between the wafer 300 and the optical system, thus achieving wafer processing.

[0027] Optionally, the first negative pressure port 220 is disposed on the connecting platform 210, which may have a connecting surface. The vacuum suction cup 100 covers the connecting surface, and the first negative pressure port 220 is formed on the connecting surface. The first negative pressure port 220 may protrude from the connecting surface so that it abuts against the first sub-groove 111. The first negative pressure port 220 may be connected to a negative pressure device. When the negative pressure device is turned on, the first negative pressure port 220 generates negative pressure, causing the suction hole 12 to generate suction force, thereby fixing the vacuum suction cup 100 to the wafer 300. Optionally, as... Figure 3 As shown, after the vacuum chuck 100 is fixedly connected to the wafer 300, the adsorption hole 12 is blocked by the wafer 300, and the adsorption groove 11 forms a closed space. The negative pressure in the adsorption groove 11 can generate an adsorption force on the connection platform 210, so that the vacuum chuck 100 is connected to the connection platform 210. Optionally, as Figure 2 As shown, the wafer processing apparatus 200 further includes a second negative pressure port 240, which is disposed on the connecting platform 210. The first negative pressure port 220 and the second negative pressure port 240 are spaced apart. The second negative pressure port 240 is used to adsorb the vacuum chuck 100. Optionally, along the first direction Z and in the same plane, the projection of the second negative pressure port 240 is spaced apart from the projection of the adsorption tank 11.

[0028] Figure 5 This is a top view of the vacuum suction cups according to some embodiments of this application. Figure 6 for Figure 5 An enlarged structural diagram of P.

[0029] like Figures 1 to 6As shown, according to an embodiment of the present invention, a vacuum chuck 100 is provided. The vacuum chuck 100 is disposed on a wafer processing apparatus 200. The wafer processing apparatus 200 includes a connecting platform 210 and a first negative pressure port 220. The first negative pressure port 220 is disposed on the connecting platform 210. The vacuum chuck 100 includes a chuck body 10 and a support structure 20. The suction cup body 10 includes a first end face 10a, a second end face 10b, an adsorption groove 11, and an adsorption hole 12. The first end face 10a and the second end face 10b are arranged opposite each other along a first direction Z, which is parallel to the thickness direction of the suction cup body 10. The adsorption groove 11 is formed by a recess in the second end face 10b and includes a first sub-groove 111 and a second sub-groove 112 that are connected. The first sub-groove 111 is used to connect to the first negative pressure port 220, and the second sub-groove 112 is used to adsorb the connecting platform 210. The adsorption hole 12 penetrates the first end face 10a and the second sub-groove 112 and is used to adsorb the wafer 300. The support structure 20 is at least disposed on the first end face 10a, along the first direction Z and in the same plane. The projection of the support structure 20 and the projection of the adsorption groove 11 are spaced apart.

[0030] The vacuum chuck 100 can be configured as a circular structure, or it can be configured as a structure of other shapes depending on factors such as the shape of the wafer 300. In this embodiment, the vacuum chuck 100 is configured as a circular structure for adsorbing and fixing the wafer 300 as an example for explanation.

[0031] The vacuum suction cup 100 includes a suction cup body 10, which can be a plate-shaped structure. One side of the suction cup body 10 along the first direction Z is a first end face 10a, and the other side along the first direction Z is a second end face 10b. The shape and area of ​​the first end face 10a and the second end face 10b can be the same or different. For example, both the first end face 10a and the second end face 10b can be circular. The areas of the first end face 10a and the second end face 10b can be the same, i.e., the suction cup body 10 is cylindrical. Alternatively, both the first end face 10a and the second end face 10b can be circular. The areas of the first end face 10a and the second end face 10b can be different, i.e., the suction cup body 10 is frustum-shaped.

[0032] In this embodiment, the first negative pressure port 220 is connected to the first sub-groove 111, the first sub-groove 111 is connected to the second sub-groove 112, and the adsorption hole 12 penetrates the first end face 10a and connects to the second sub-groove 112. That is, the vacuum suction cup 100 forms two types of adsorption channels that work together. One is the wafer adsorption channel: When the first negative pressure port 220 activates the negative pressure function, it quickly extracts the gas from the first sub-slot 111, the second sub-slot 112, and the adsorption hole 12, creating a negative pressure inside the adsorption hole 12. This negative pressure can generate a stable adsorption force on the wafer 300 placed on the first end face 10a, thereby firmly fixing the wafer 300 to the first end face 10a.

[0033] Secondly, the adsorption channel of the connecting platform 210: After the wafer 300 is fixed to the first end face 10a, the first sub-groove 111 and the second sub-groove 112 form a sealed space, creating a negative pressure environment in the two sub-grooves, which in turn generates an adsorption force to tightly pull the second end face 10b of the suction cup body 10 toward the connecting platform 210, thereby improving the connection reliability between the vacuum suction cup 100 and the connecting platform 210. The adsorption groove 11 is formed by a recess in the second end face 10b. The adsorption groove 11 includes a first sub-groove 111, which is used to connect with the first negative pressure port 220. At least a portion of the first negative pressure port 220 can be embedded in the first sub-groove 111; or, the first negative pressure port 220 and the first sub-groove 111 are spaced apart. When at least a portion of the first negative pressure port 220 can be embedded in the first sub-groove 111, the first negative pressure port 220 can be provided with a clearance structure. The clearance structure is located at the connection between the first sub-groove 111 and the second sub-groove 112, and the clearance structure allows the first negative pressure port 220 to extract gas from the second sub-groove 112.

[0034] Optionally, the first sub-groove 111 can be a blind hole formed by the recess of the second end face 10b, and the second sub-groove 112 can be an extension groove formed by the recess of the second port.

[0035] The adsorption tank 11 includes a second sub-tank 112, which is used to adsorb the connecting platform 210. The adsorption hole 12 is disposed in the second sub-tank 112. That is, the second sub-tank 112 may include a bottom wall and a side wall. The adsorption hole 12 may be opened in the bottom wall or the side wall.

[0036] Optionally, the recess depth of the first sub-groove 111 and the recess depth of the second sub-groove 112 can be the same or different.

[0037] The support structure 20 can be disposed on the first end face 10a, and the support structure 20 can support the wafer 300. Along the first direction Z, and in the same plane, such as when the first plane is perpendicular to the first direction Z, the orthographic projection of the support structure 20 on the first plane and the orthographic projection of the adsorption groove 11 on the first plane are spaced apart. Since the adsorption hole 12 is located within the adsorption groove 11, the orthographic projection of the support structure 20 on the first plane and the orthographic projection of the adsorption hole 12 on the first plane are spaced apart. The spaced arrangement of the support structure 20 and the adsorption hole 12 reduces the possibility of local depressions in the support structure 20. Optionally, the support structure 20 may include multiple sub-units. The support structure 20 may also be an extension structure extending in one or more directions. Optionally, a portion of the support structure 20 is disposed on the first end face 10a, and another portion of the support structure 20 is disposed on the second end face 10b.

[0038] In the vacuum chuck 100 provided in this embodiment, the interconnected design of the adsorption groove 11 and the adsorption hole 12 allows the vacuum chuck 100 to adsorb the wafer 300 through a single adsorption channel, while increasing the reliability of the connection with the connection platform 210, significantly simplifying the structure of the adsorption channel, and reducing the complexity of multi-channel design. Furthermore, the segmented arrangement of the first sub-groove 111 and the second sub-groove 112 in the adsorption groove 11 avoids the negative pressure from concentrating in the adsorption hole 12 due to the first negative pressure port 220 being too close to it, thus preventing the weakening of the adsorption force between the vacuum chuck 100 and the connection platform 210 and further ensuring the adsorption effect. On the other hand, it expands the adsorption contact area between the vacuum chuck 100 and the connection platform 210, enhancing adsorption stability.

[0039] In some alternative embodiments, such as Figure 4 As shown, the second sub-slot 112 includes at least one of a straight section 1121 and an arc-shaped section 1122.

[0040] In some examples, the number of straight segments 1121 can be one or more. For example, multiple straight segments 1121 are connected end to end to form a ring structure.

[0041] In some examples, the number of arc segments 1122 can be one or more. For example, multiple arc segments 1122 are connected end to end to form a planar spiral structure.

[0042] In some embodiments, the second sub-groove 112 includes a combination structure of a straight section 1121 and an arc-shaped section 1122, that is, the straight section 1121 and the arc-shaped section 1122 are connected.

[0043] In these alternative embodiments, by setting a straight section 1121, it is beneficial to reduce the difficulty of preparing the second sub-groove 112. By setting an arc-shaped section 1122, it is beneficial to disperse the local tensile stress generated during negative pressure adsorption, reduce the possibility of stress concentration at a certain corner causing cracks or even deformation in the second sub-groove 112, and extend the service life of the suction cup body 10.

[0044] In some alternative embodiments, such as Figure 4 As shown, the second sub-groove 112 includes a straight section 1121 and an arc section 1122. The arc section 1122 has the geometric center of the second end face 10b as its arc center. The straight section 1121 extends from the end of the arc section 1122 in a direction away from the geometric center. The first sub-groove 111 is connected to the end of the straight section 1121 away from the arc section 1122.

[0045] Optionally, the second sub-groove 112 may include a straight segment 1121 and an arc segment 1122. The arc segment 1122 has the geometric center of the second end face 10b as its arc center and has two ends extending along its own extension direction. The straight segment 1121 is connected to one of the ends and extends away from the geometric center so that the straight segment 1121 extends toward the edge of the suction cup body 10, so that the first sub-groove 111 is located close to the edge of the suction cup body 10.

[0046] Optionally, the adsorption hole 12 can be located in the arc-shaped section 1122, or it can be located in the straight section 1121.

[0047] In these alternative embodiments, the arc-shaped segment 1122 forms an "annular adsorption zone" around the geometric center, which can cover the core area of ​​the suction cup body 10. The straight segment 1121 extends from the end of the arc-shaped segment 1122 away from the center, which can further extend the adsorption range to the edge of the suction cup body 10, achieving full-area adsorption coverage from the center to the edge. This design significantly increases the adsorption contact area between the vacuum suction cup 100 and the connecting platform 210. Furthermore, since the first negative pressure port 220 is located at the edge of the suction cup body 10, the possibility of edge warping due to insufficient edge adsorption force is reduced, allowing the vacuum suction cup 100 to fit tightly against the connecting platform 210. This reduces the possibility of the vacuum suction cup 100 shifting due to adsorption loosening during processing, and improves the overall structural stability.

[0048] In some alternative embodiments, such as Figure 4 As shown, the number of adsorption holes 12 is set to multiple, and the second sub-groove 112 includes an arc-shaped segment 1122, with multiple adsorption holes 12 spaced apart on the arc-shaped segment 1122.

[0049] Optionally, the multiple adsorption holes 12 can be set at equal intervals, or the multiple adsorption holes 12 can be set at unequal intervals.

[0050] The multiple adsorption holes 12 are equally spaced on the arc segment 1122, which means that the projections of the multiple adsorption holes 12 are equally spaced along the first direction Z and in the same plane, and the multiple adsorption holes 12 are distributed along the arc trajectory of the arc segment 1122.

[0051] In these alternative embodiments, by setting multiple spaced adsorption holes 12, uniformly distributed negative pressure adsorption points can be formed in the arc segment 1122, so that there are no obvious strong and weak areas in the negative pressure field between the wafer 300 and the vacuum chuck 100, reducing the possibility of local deformation of the wafer 300 due to excessive local negative pressure.

[0052] In some alternative embodiments, such as Figure 4 As shown, the number of adsorption tanks 11 includes multiple adsorption tanks 11, which are symmetrically arranged around the center line of the second end face 10b.

[0053] For example, each adsorption tank 11 includes a first sub-tank 111 and a second sub-tank 112. The second sub-tank 112 of each adsorption tank 11 may include a straight section 1121 and an arc-shaped section 1122. The first sub-tank 111 of each adsorption tank 11 is located at the end of the straight section 1121 of the second sub-tank 112 of each adsorption tank 11 away from the arc-shaped section 1122.

[0054] The centerline of the second end face 10b can be a straight line passing through the geometric center of the second end face 10b (which can be understood as the "diameter line" of the circular end face), and is the reference axis for symmetrical design.

[0055] Multiple adsorption tanks 11 are symmetrically arranged with respect to the center line of the second end face 10b. Specifically, the multiple adsorption tanks 11 are mirror-distributed with respect to the center line as the axis of symmetry, that is, the adsorption tanks 11 on both sides of the axis of symmetry have the same shape.

[0056] For example, taking four adsorption tanks 11, with a first center line and a second center line perpendicular to each other, the four adsorption tanks 11 are divided into two groups. The two groups of adsorption tanks 11 are symmetrically distributed about the first center line, and the two adsorption tanks 11 in each group are symmetrically distributed about the second center line. Furthermore, each adsorption tank 11 includes an arc-shaped segment 1122 with multiple equally spaced adsorption holes 12. The line connecting all the adsorption holes 12 of the four adsorption tanks 11 can form a circle with the geometric center of the second end face 10b as the center.

[0057] The function of the adsorption groove 11 is to fix the vacuum chuck 100 to the connecting platform 210 and the adsorption hole 12 to the wafer 300 through negative pressure. The symmetrical distribution of the center line allows the negative pressure to be evenly transmitted to each area of ​​the second end face 10b along the center line, so that the contact pressure between the chuck body 10 and the connecting platform 210 is equal everywhere, reducing the possibility of deformation of the chuck body 10 (such as warping or denting) caused by uneven negative pressure, and ensuring the flatness of the vacuum chuck 100.

[0058] In some alternative embodiments, such as Figure 4 and Figure 7 As shown, the support structure 20 includes a first support unit 21 disposed on the second end face 10b. The first support unit 21 protrudes from the second end face 10b and is spaced apart from the adsorption groove 11.

[0059] The function of the first support unit 21 is to provide physical support for the suction cup body 10, bear the weight of the suction cup body 10 itself, the negative pressure pulling force during adsorption, and the contact pressure when it is attached to the connecting platform 210, thereby reducing the connection stress between the suction cup body 10 and the connecting platform 210, and thus reducing the possibility of the suction cup body 10 losing flatness due to local deformation caused by connection stress.

[0060] Both the first support unit 21 and the adsorption groove 11 are disposed on the second end face 10b (i.e., the side where the vacuum suction cup 100 contacts the connecting platform 210), and the first support unit 21 and the adsorption groove 11 are distributed at intervals. Optionally, the shape of the first support unit 21 can be cylindrical, prismatic, or annular (such as small cylinders evenly distributed around the outer periphery of the adsorption groove 11).

[0061] Optionally, the number of first support units 21 may include one or more, and multiple first support units 21 may be arranged in an array with equal spacing.

[0062] In some alternative embodiments, such as Figure 3 and Figure 4 As shown, the support structure 20 includes a plurality of second support units 22 disposed on the first end face 10a. The second support units 22 protrude from the first end face 10a and are spaced apart from the adsorption holes 12. The plurality of second support units 22 are spaced apart along a direction intersecting the first direction Z.

[0063] The second support unit 22 is located on the first end face 10a of the suction cup body 10, that is, the side of the vacuum suction cup 100 used to place and adsorb the wafer 300. It needs to be distributed at intervals with the adsorption holes 12 on the first end face 10a to reduce the possibility of the second support unit 22 blocking the adsorption holes 12 and affecting the negative pressure adsorption. Optionally, the shape of the second support unit 22 can be cylindrical, prismatic, or annular (such as small cylinders evenly distributed around the outer periphery of the adsorption groove 11).

[0064] Multiple second support units 22 are spaced apart. They can be spaced at equal intervals or at unequal intervals.

[0065] The first direction Z is the thickness direction of the suction cup body 10 (perpendicular to the first end face 10a). The direction intersecting the first direction Z refers to any direction in the plane parallel to the first end face 10a (e.g., when the suction cup body 10 is circular, it can be a radial, circumferential, or a combination of both mesh directions). Multiple second support units 22 are evenly distributed along this intersecting direction. With the geometric center of the first end face 10a as the center, multiple rings of second support units 22 are arranged. The number of second support units 22 in each ring gradually increases in the direction away from the geometric center of the first end face 10a, and the second support units 22 in the same ring are evenly spaced circumferentially (parallel to the ring direction of the first end face 10a). Furthermore, adjacent rings of second support units 22 are evenly spaced radially (in a straight line from the center to the edge).

[0066] Optionally, along the first direction Z and in the same plane, the projections of at least a portion of the first support units 21 overlap with the projections of at least a portion of the second support units 22.

[0067] In these alternative embodiments, the second support unit 22 can provide support between the first end face 10a and the wafer 300, thereby creating a gap between the first end face 10a and the wafer 300. This reduces the contact area between the wafer 300 and the first end face 10a, lowering the likelihood of large-area contact between the wafer 300 and the first end face 10a causing scratches on the surface of the wafer 300 and reducing the possibility of the vacuum chuck 100 scratching the wafer 300. At the same time, multiple second support units 22 are spaced apart to ensure that the supporting force evenly covers the wafer 300, reducing the possibility of edge warping or center depression of the wafer 300. This keeps the wafer 300 flat in the adsorption state, providing a stable reference surface for wafer processing and other processes.

[0068] Figure 8 This is a partial cross-sectional view of a wafer processing apparatus according to some embodiments of this application.

[0069] In some alternative embodiments, such as Figure 4 , Figure 7 as well as Figure 8As shown, the suction cup body 10 also includes a clearance hole 13, which is disposed through the first end face 10a and the second end face 10b. The clearance hole 13 is used to avoid the ejector pin assembly 230 of the wafer processing device. Any two of the clearance hole 13, the suction groove 11, and the support structure 20 are spaced apart. The vacuum suction cup 100 also includes a first sealing structure 31, which is disposed at least on the second end face 10b and surrounds the edge of the clearance hole 13.

[0070] The ejector pin assembly 230 is a component in the wafer processing apparatus 200 used to transfer the wafer 300 (for example, after the wafer 300 is processed, the ejector pin passes through the clearance hole 13 from the second end face 10b and lifts the wafer 300 on the first end face 10a, making it easy for the robotic arm to take it away; or when the wafer 300 is placed on the vacuum chuck 100 from the outside, the ejector pin assists in positioning). The clearance hole 13 is essentially to provide dedicated space for the lifting and lowering movement of the ejector pin, so as to avoid collision and damage between the ejector pin and the chuck body 10.

[0071] The clearance hole 13 is a through hole that penetrates the first end face 10a (wafer placement surface) and the second end face 10b (connecting platform 210 mating surface) of the suction cup body 10. It is a "through" channel structure. The hole diameter needs to be slightly larger than the diameter of the ejector pin assembly 230 to ensure that the ejector pin can pass through without interference and avoid friction and jamming between the ejector pin and the hole wall.

[0072] The interval between any two of the clearance hole 13, the adsorption groove 11 and the support structure 20 means that the projections of the clearance hole 13 and the adsorption groove 11, the clearance hole 13 and the support structure 20 and the adsorption groove 11 and the support structure 20 in the same projection plane along the first direction Z do not overlap.

[0073] Optionally, the shape of the first sealing structure 31 can be the same as the shape of the clearance hole 13. For example, both the shape of the first sealing structure 31 and the shape of the clearance hole 13 can be circular. Of course, they can also be different. For example, the shape of the first sealing structure 31 can be polygonal, and the shape of the clearance hole 13 can be circular.

[0074] Optionally, the first sealing structure 31 may include two first sub-sealing structures, one of which is disposed on the second end face 10b and the other of which is disposed on the first end face 10a, with both first sub-sealing structures disposed around the edge of the clearance hole 13.

[0075] The clearance hole 13 is a through hole. When the vacuum chuck 100 is attached to the connecting platform 210, the gap between the vacuum chuck 100 and the connecting platform 210 and the clearance hole 13 are sealed by the first sealing structure 31, preventing air from entering the gap between the vacuum chuck 100 and the connecting platform 210 from the clearance hole 13. This reduces the possibility of the vacuum chuck 100 and the connecting platform 210 becoming loose and the adsorption force of the adsorption hole 12 on the wafer 300 decreasing. This allows the vacuum chuck 100 to integrate functions such as adsorbing the wafer 300, supporting the wafer 300, and avoiding the ejector pins, thereby improving the compatibility of the vacuum chuck 100.

[0076] In some alternative embodiments, such as Figure 4 As shown, the vacuum suction cup 100 also includes a second sealing structure 32. The second sealing structure 32 is at least disposed on the second end face 10b and extends along the edge of the second end face 10b.

[0077] The second sealing structure 32 is disposed on the second end face 10b of the suction cup body 10 and extends along the edge contour of the second end face 10b (if the second end face 10b is circular, the second sealing structure 32 is annular and coaxial with the edge of the end face). The second sealing structure 32 can be an annular sealing ring, an annular sealing protrusion integrally formed with the suction cup body 10, or other shapes. The second sealing structure 32 can seal the gap between the edge of the suction cup body 10 and the connecting platform 210, and prevent external air from seeping in in large quantities from the edge, reducing the possibility of rapid loss of negative pressure in the adsorption tank 11.

[0078] Optionally, the second sealing structure 32 may include two second sub-sealing structures, one of which is disposed on the second end face 10b and the other of which is disposed on the first end face 10a, with both second sub-sealing structures extending along the edge of the second end face 10b.

[0079] Optionally, the vacuum suction cup 100 also includes a third sealing structure 33. The third sealing structure 33 may be disposed on the second end face 10b, and the third sealing structure 33 is located on the side of the second sealing structure 32 facing the geometric center. The third sealing structure 33 can seal the opening in the connecting platform 210, thereby reducing the possibility of adsorption failure between the connecting platform 210 and the vacuum suction cup 100.

[0080] A second aspect of this application provides a wafer processing apparatus, which includes a vacuum chuck 100 and a wafer processing device 200 as described in any of the above embodiments. The wafer processing device 200 includes a connecting platform 210 and a first negative pressure port 220, the first negative pressure port 220 being disposed on the connecting platform 210, and the vacuum chuck 100 being disposed on the connecting platform 210.

[0081] Specifically, the wafer processing equipment can be a wafer etching device or a wafer bonding device. Since the wafer processing equipment includes the vacuum chuck 100 of any of the above embodiments, it has the same technical features as the vacuum chuck 100 of any of the above embodiments, and can achieve the same technical effect as the vacuum chuck 100 of any of the above embodiments, it will not be described in detail here.

[0082] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A vacuum chuck, disposed on a wafer processing apparatus, the wafer processing apparatus comprising a connecting platform and a first negative pressure port, the first negative pressure port being disposed on the connecting platform, characterized in that, The vacuum suction cup includes: The suction cup body includes a first end face, a second end face, an adsorption groove, and an adsorption hole. The first end face and the second end face are arranged opposite to each other along a first direction, which is parallel to the thickness direction of the suction cup body. The adsorption groove is formed by a recess in the second end face. The adsorption groove includes a first sub-groove and a second sub-groove that are connected to each other. The first sub-groove is used to connect to the first negative pressure port, and the second sub-groove is used to adsorb the connection platform. The adsorption hole penetrates the first end face and the second sub-groove and is used to adsorb the wafer. A support structure is provided at least on the first end face, along the first direction and in the same plane, with the projection of the support structure and the projection of the adsorption groove being spaced apart.

2. The vacuum suction cup according to claim 1, characterized in that, The second sub-slot includes at least one of a straight section and an arc section.

3. The vacuum suction cup according to claim 2, characterized in that, The second sub-groove includes a straight section and an arc section. The arc section has the geometric center of the second end face as its arc center. The straight section extends from the end of the arc section away from the geometric center. The first sub-groove is connected to the end of the straight section away from the arc section.

4. The vacuum suction cup according to claim 2, characterized in that, The number of adsorption holes is set to multiple, and the second sub-groove includes an arc-shaped segment, with multiple adsorption holes spaced apart on the arc-shaped segment.

5. The vacuum chuck according to any one of claims 1 to 4, characterized in that, The number of adsorption tanks includes multiple tanks, which are symmetrically arranged around the centerline of the second end face.

6. The vacuum chuck according to any one of claims 1 to 4, characterized in that, The support structure includes a first support unit disposed on the second end face, the first support unit protruding from the second end face, and the first support unit and the adsorption groove being spaced apart.

7. The vacuum chuck according to any one of claims 1 to 4, characterized in that, The support structure includes a plurality of second support units disposed on the first end face. The second support units protrude from the first end face and are spaced apart from the adsorption holes. The plurality of second support units are spaced apart along a direction intersecting the first direction.

8. The vacuum chuck according to any one of claims 1 to 4, characterized in that, The suction cup body also includes a clearance hole, which is provided through the first end face and the second end face. The clearance hole is used to avoid the ejector pin assembly of the wafer processing device. Any two of the clearance hole, the suction groove and the support structure are spaced apart. The vacuum suction cup also includes a first sealing structure, which is at least disposed on the second end face and surrounds the edge of the clearance hole.

9. The vacuum chuck according to any one of claims 1 to 4, characterized in that, The vacuum suction cup also includes: A second sealing structure is provided at least on the second end face, and the second sealing structure extends along the edge of the second end face.

10. A wafer processing equipment, characterized in that, include: The vacuum chuck as described in any one of claims 1 to 9; And the wafer processing apparatus, wherein the first negative pressure port is disposed on the connection platform, and the vacuum chuck is disposed on the connection platform.

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