Surface member

Abstract

A surface member for removable application to cover at least a portion of a surface of an immersion lithographic apparatus is disclosed herein. The surface member has two predominantly orthogonal dimensions and comprises: a first layer comprising an adhesive configured to adhere the surface member to the surface of the immersion lithographic apparatus; a second layer disposed on the first layer; a third layer disposed on the second layer; a fourth layer disposed on the third layer; and a fifth layer disposed on the fourth layer. The third layer includes an adhesive configured to adhere the second layer to the fourth layer. At least the second layer is patterned to tune a stiffness of the surface member in at least one of amplitude and directivity.

Description

Cross-references to related applications

[0001] This application claims priority to EP application 23203323.3, filed on October 12, 2023, which is incorporated herein by reference in its entirety. Technical Field

[0002] The present invention relates to a surface component and a photolithography apparatus including the surface component. Background Technology

[0003] A lithography apparatus is a machine configured to apply a desired pattern onto a substrate. For example, a lithography apparatus can be used to manufacture integrated circuits (ICs). For instance, a lithography apparatus can use a projection system to project a pattern (often referred to as a “design layout” or “design”) of a patterning device (such as a mask) onto a radiation-sensitive material (resist) layer provided on a substrate (such as a wafer). Known lithography apparatuses include: so-called steppers, in which each target portion is irradiated by exposing the entire pattern onto the target portion at once; and so-called scanners, in which each target portion is irradiated by scanning the pattern with a radiation beam in a given direction (“scanning” direction) while simultaneously scanning the substrate parallel to or antiparallel to that direction.

[0004] As semiconductor manufacturing processes continue to advance, the size of circuit elements has been continuously shrinking, while the number of functional elements (such as transistors) in each device has been steadily increasing for decades, following a trend commonly known as 'Moore's Law'. To keep pace with Moore's Law, the semiconductor industry has been pursuing technologies capable of creating increasingly smaller features. To project patterns onto a substrate, photolithography equipment uses electromagnetic radiation. The wavelength of this radiation determines the minimum size of the features that can be patterned on the substrate. Typical wavelengths currently used are 365 nm (i-line), 248 nm, 193 nm, and 13.5 nm.

[0005] Further improvements in resolution for smaller features can be achieved by providing an immersion fluid (such as water) with a relatively high refractive index on the substrate during exposure. The effect of the immersion fluid is that it enables imaging of smaller features because the exposure radiation has a shorter wavelength in a fluid compared to in a gas. The effect of the immersion fluid can also be viewed as increasing the effective numerical aperture (NA) of the system and also increasing the depth of focus.

[0006] A substrate is mounted on a substrate stage for aligning the substrate with a patterned radiation beam. Sensors can be used on the substrate stage. Sensors may include a Parallel Integrated Lens Interferometry Sensor at Scanner (PARIS), a Transmission Image Sensor (TIS), a Spectral Purity Observation Tool (SPOT) sensor, and an Integrated Lens Interferometry Sensor at Scanner (ILIAS).

[0007] There may be a gap between the substrate stage and the sensor. An adhesive, also known as a surface member, can be provided to reduce the possibility of immersion liquid leakage into this gap. For example, a surface member can be placed to bridge the gap between the top surface of the sensor and the top surface of the substrate stage WT, thereby sealing the gap between the sensor and the substrate stage.

[0008] Mechanical strain may be generated in the surface component due to the expansion and / or contraction of one or more layers. This expansion and / or contraction may cause undesirable product overlay errors due to sensor displacement. Summary of the Invention

[0009] The present invention relates to providing a surface component and a photolithography apparatus including the surface component.

[0010] According to one aspect of the invention, a surface member is provided for a removable application to cover at least a portion of the surface of an immersion lithography apparatus. The surface member has two principal orthogonal dimensions and includes: a first layer comprising an adhesive configured to adhere the surface member to the surface of the immersion lithography apparatus; a second layer disposed on the first layer; a third layer disposed on the second layer; a fourth layer disposed on the third layer; and a fifth layer disposed on the fourth layer. The third layer includes an adhesive configured to adhere the second layer to the fourth layer. At least the second layer is patterned to tune the stiffness of the surface member in at least one aspect of magnitude and orientation.

[0011] According to another aspect of this disclosure, a photolithography apparatus is provided, including the aforementioned surface component.

[0012] Other embodiments, features, and advantages of the present invention, as well as the structure, operation, features, and advantages of various embodiments of the present invention, are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0013] Embodiments of the invention will now be described by way of example only with reference to the accompanying schematic diagrams, wherein corresponding reference numerals indicate corresponding parts, and wherein: Figure 1 A schematic overview of a photolithography apparatus is provided. Figure 2 The substrate stage is depicted, showing recesses for various sensors and closed disc supports, all of which have three second base portions of a glued-in base. Figure 3 The substrate stage is depicted in a plan view, on which the substrate and sensor are mounted. Figure 4 Depicting Figure 3 The substrate stage and sensor are located through the cross-section of line XX, and also include surface components. Figure 5 A plan view of the surface components is depicted. Figure 6 Depicting Figure 5 The surface components are schematically represented by the cross-section of line AA. Figures 7A to 7C The arrangement of the surface components is depicted in a cross-sectional view, wherein the thickness of the second layer varies with the circumferential and / or radial position on the surface components. Figures 8A to 8C The arrangement of surface components, including the filling material, is depicted in cross-sectional view. Figure 9 A plan view of the surface component is depicted, in which the second layer is discontinuous in the circumferential direction of the surface component. Figures 10A to 10B Depicting through Figure 9 Cross-sectional views of lines BB and CC. The features shown in the accompanying drawings are not necessarily drawn to scale, and the dimensions and / or arrangements depicted are not limiting. It is to be understood that the drawings include optional features that may not be essential to the invention. Furthermore, not all features of the device are depicted in every drawing, and these drawings may only show some parts relevant to describing a particular feature. Detailed Implementation

[0014] In this document, the terms “radiation” and “beam” are used to cover all types of electromagnetic radiation, including ultraviolet radiation (e.g., with wavelengths of 365, 248, 193, 157, or 126 nm).

[0015] As used herein, the terms “mask,” “mask,” or “patterning device” can be broadly interpreted to refer to any general patterning device that can be used to impart a patterned cross-section to an incoming radiation beam, corresponding to a pattern to be created in a target portion of a substrate. The term “optical valve” can also be used in this context. Examples of such patterning devices, in addition to classic masks (transmissive or reflective masks, binary masks, phase-shifting masks, hybrid masks, etc.), include programmable mirror arrays and programmable LCD arrays.

[0016] Figure 1A lithography apparatus is schematically depicted. The lithography apparatus includes an irradiation system (also called an irradiator) IL configured to modulate a radiation beam B (e.g., UV radiation or DUV radiation), a mask support (e.g., a mask stage) MT configured to support a patterning device (e.g., a mask) MA and connected to a first positioner PM (configured to accurately position the patterning device MA according to certain parameters), a substrate stage (e.g., a support stage) WT configured to hold a substrate (e.g., a resist-coated wafer) W and connected to a second positioner PW (configured to accurately position the substrate stage WT according to certain parameters), and a projection system (e.g., a refractive projection lens system) PS configured to project a pattern imparted by the radiation beam B by the patterning device MA onto a target portion C (e.g., including one or more dies) of the substrate W.

[0017] In operation, the irradiation system IL receives the radiation beam B from the radiation source SO, for example, via the beam delivery system BD. The irradiation system IL may include various types of optical components for guiding, shaping, and / or controlling the radiation, such as refractive, reflective, magnetic, electromagnetic, electrostatic, and / or other types of optical components or any combination thereof. The irradiator IL can be used to adjust the radiation beam B to achieve a desired spatial and angular intensity distribution in its cross-section at the plane of the patterning device MA.

[0018] As used herein, the term "projection system" (PS) should be interpreted broadly to encompass all types of projection systems, including refractive, reflective, refracting-reflective, distorting, magnetic, electromagnetic, and / or electrostatic optical systems or any combination thereof, as appropriate, depending on the exposure radiation and / or other factors used, such as the use of immersion or vacuum. Any use of the term "projection lens" herein may be considered synonymous with the more general term "projection system" (PS).

[0019] Photolithography apparatuses are of the type in which at least a portion of a substrate W can be covered by an immersion liquid (e.g., water) having a relatively high refractive index to fill the immersion space between the projection system PS and the substrate W; this is also known as immersion lithography. Further information on immersion techniques is given in US 6,952,253, which is incorporated herein by reference.

[0020] Photolithography equipment can be of the type with two or more substrate stages WT (also known as "dual stages"). In such "multi-stage" machines, substrate stages WT can be used in parallel, and / or the step of preparing a substrate W for subsequent exposure can be performed on a substrate W located on one of the substrate stages WT, while another substrate W on the other substrate stage WT is used to expose a pattern on the other substrate W.

[0021] In addition to the substrate stage WT, the lithography apparatus may include a measurement platform (not depicted in the figures). The measurement platform is arranged to hold sensors and / or cleaning devices. The sensors may be arranged to measure the properties of the projection system PS or the properties of the radiation beam B. The measurement platform may hold multiple sensors. The cleaning devices may be arranged to clean part of the lithography apparatus, such as part of the projection system PS or part of a system providing immersion solution. The measurement platform may move below the projection system PS when the substrate stage WT is moved away from the projection system PS.

[0022] In operation, a radiation beam B is incident on a patterning device (e.g., a mask) MA held on a mask support MT and patterned by a pattern (design layout) present on the patterning device MA. After traversing the mask MA, the radiation beam B passes through a projection system PS, which focuses the beam onto a target portion C of the substrate W. With the aid of a second positioner PW and a position measurement system IF, the substrate stage WT can be moved precisely, for example, to position different target portions C in the path of the radiation beam B at a focused and aligned location. Similarly, a first positioner PM and possibly another position sensor (not shown in the image)... Figure 1 (As clearly depicted in the diagram) can be used to accurately position the patterning device MA relative to the path of the radiation beam B. The patterning device MA and the substrate W can be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2. Although the substrate alignment marks P1, P2, as illustrated, occupy dedicated target portions, they can be located in the space between the target portions. When the substrate alignment marks P1, P2 are located between the target portions C, these are referred to as scribing alignment marks.

[0023] To illustrate the invention, a Cartesian coordinate system is used. A Cartesian coordinate system has three axes: the x-axis, the y-axis, and the z-axis. Each of these three axes is orthogonal to the other two. A rotation about the x-axis is called an Rx rotation. A rotation about the y-axis is called an Ry rotation. A rotation about the z-axis is called an Rz rotation. The x-axis and y-axis define a horizontal plane, while the z-axis is in the vertical direction. The Cartesian coordinate system is not limiting of the invention but is used only for illustration. Conversely, another coordinate system (such as a cylindrical coordinate system) can be used to illustrate the invention. The orientation of the Cartesian coordinate system can be different, for example, such that the z-axis has a component along the horizontal plane.

[0024] Immersion lithography has been introduced into photolithography systems to achieve improved resolution for smaller features. In immersion lithography, a liquid layer of an immersion solution with a relatively high refractive index is inserted into the immersion space between the apparatus's projection system PS (through which a patterned radiation beam B is projected toward the substrate W) and the substrate W. The immersion solution at least covers a portion of the substrate W beneath the final element of the projection system PS. Therefore, at least a portion of the substrate W undergoing exposure is immersed in the immersion solution.

[0025] In commercial immersion lithography, the immersion solution is water. Typically, this water is highly purified distilled water, such as ultrapure water (UPW), commonly used in semiconductor manufacturing plants. In immersion systems, the UPW is usually purified and may undergo additional treatment steps before being supplied to the immersion space as the immersion solution. Besides water, other liquids with high refractive indices can also be used as immersion solutions, such as hydrocarbons (e.g., fluorinated hydrocarbons) and / or aqueous solutions. Furthermore, the use of fluids other than liquids in immersion lithography has been envisioned.

[0026] In this specification, reference will be made to partial immersion, in which the immersion fluid is confined during use to an immersion space between the final component and the surface facing the final component. The facing surface is the surface of the substrate W or the surface of a support platform (i.e., the substrate stage WT or substrate support) coplanar with the surface of the substrate W. (Note that unless explicitly stated otherwise, references to the surface of the substrate W below also refer to, or are alternative to, the surface of the substrate stage WT or substrate support; and vice versa). A fluid handling structure IH, existing between the projection system and the substrate stage WT or substrate support, is used to confine the immersion fluid to the immersion space. The immersion space, filled with the immersion fluid, is smaller in plane than the top surface of the substrate W, and remains substantially stationary relative to the projection system PS as the substrate W and the substrate stage WT or substrate support move below.

[0027] Other immersion systems have been envisioned, such as unconfined immersion systems (so-called 'fully wetted' immersion systems) and bath immersion systems. In an unconfined immersion system, the area covered by the immersion liquid is larger than the surface beneath the final component. The liquid outside the immersion space exists as a thin liquid film. The liquid can cover the entire surface of the substrate W, or even the substrate W and the substrate stage WT or substrate support coplanar with the substrate W. In a bath system, the substrate W is completely immersed in a bath of immersion liquid.

[0028] A fluid handling structure IH is a structure that supplies immersion liquid into an immersion space, removes immersion liquid from the immersion space, and thereby confines the immersion liquid within the immersion space. It includes features that are part of a fluid supply system. The arrangement disclosed in PCT patent application publication number WO 99 / 49504 is an earlier fluid handling structure that includes conduits for supplying or recovering immersion liquid from the immersion space and operates depending on the relative movement of the platform below the projection system PS. In more recent designs, the fluid handling structure IH extends along at least a portion of the boundary of the immersion space between the final element of the projection system PS and the substrate stage WT, substrate support, or substrate W, thereby partially defining the immersion space.

[0029] A fluid handling structure (IH) can have a selection of different functions. Each function can be derived from the corresponding feature that enables the fluid handling structure IH to perform that function. The fluid handling structure IH can be referred to by many different terms, each referring to a function, such as barrier components, sealing components, fluid supply systems, fluid removal systems, liquid confinement structures, etc.

[0030] The immersion liquid can be used as the immersion fluid. In this case, the fluid handling structure IH can be a liquid handling system. Referring to the above description, references to features defined relative to the fluid in this paragraph can be understood to include features defined relative to the liquid.

[0031] The photolithography apparatus has a projection system PS. During exposure of the substrate W, the projection system PS projects a patterned radiation beam B onto the substrate W. To reach the substrate W, the path of the radiation beam B passes from the projection system PS through an immersion liquid confined by a fluid processing structure IH between the projection system PS and the substrate W. The projection system PS has a lens element in contact with the immersion liquid, i.e., the last element in the path of the radiation beam B. This lens element in contact with the immersion liquid may be referred to as the 'last lens element' or 'final element'. The final element is at least partially surrounded by the fluid processing structure IH. The fluid processing structure IH can confine the immersion liquid below the final element and above the facing surface.

[0032] like Figure 1 The lithography apparatus depicted includes a controller 500. The controller 500 is configured to control the substrate stage WT.

[0033] Within a photolithography apparatus, the substrate W can be held in place by a support (such as a bump or protrusion). The support can be referred to as a substrate support.

[0034] Figure 2 The substrate stage WT for an immersion lithography apparatus is shown above, where the immersion liquid is positioned between the projection system PS and the substrate W during imaging. Figure 2 The substrate stage WT in the diagram is shown as having no components attached.

[0035] A protrusion or support (not shown) can be positioned in the recess 10. During imaging, the protrusion or support holds the substrate W in place.

[0036] Typically, during the thermal expansion and contraction of the sensor—which can be particularly problematic in immersion lithography apparatuses where the immersion solution is placed between the projection system PS and the object being imaged—the sensor's position on the substrate stage WT can drift. This can lead to inaccurate positioning of the substrate W and is a result of friction, hysteresis, and / or deformation at the adhesive interface between the sensor and the substrate stage WT. This is a particular problem in immersion lithography systems, but also in non-immersion systems. For example, sensors such as energy sensors, Parallel Integrated Lens Interferometry Sensors at Scanners (PARIS), Transmission Image Sensors (TIS), Spectral Purity Observation Tool (SPOT) sensors, or Integrated Lens Interferometry Sensors at Scanners (ILIAS) sensors can be positioned within the recess 20.

[0037] exist Figure 2 In the plan view, the recess 20 of the sensor is circular or round, which is different from the convention that sensors are shaped to minimize the forces they encounter during immersion lithography and to minimize the space they occupy on the substrate stage WT. Therefore, the recess 20 can be circular or non-circular (e.g., square or triangular). The shape of the recess 20 can depend on the type of sensor to be positioned in the recess 20. For example, the substrate stage WT can define multiple recesses 20 of different shapes, or it can define multiple recesses 20 of all the same shape.

[0038] In immersion lithography, temperature control of the sensors during imaging can be challenging (sensors are wet-imaged, i.e., they are immersed in a liquid between themselves and the projection system PS under the same conditions as the substrate W). Typically, the sensors are glued to the appropriate position on the substrate stage WT, and large thermal expansion or contraction can cause positional drift of the sensors relative to the substrate stage WT due to friction and hysteresis at the solid interface from the sensor to the substrate stage WT.

[0039] exist Figure 2 In the depicted arrangement, the sensor is mounted in the recess 20 such that a gap exists between the outer surface of the sensor (e.g., the surface defining the outer periphery) and the inner surface of the recess 20 (e.g., the surface defining the inner periphery). Therefore, the sensor can expand and contract without being restricted by the presence of the substrate stage WT. Providing a circular sensor allows for an arrangement that ensures the center of the sensor (the location where the sensing element is positioned) remains substantially stationary relative to the substrate stage WT. This is because a circular sensor (which may be cylindrical) will expand and contract uniformly around its thermal center axis.

[0040] Providing a circular sensor also simplifies the sealing of the gap between the substrate stage WT and the sensor, preventing immersion liquid from leaking into that gap. For example, a simple adhesive, also known as a surface member, can be placed to bridge the gap between the top surface of the sensor and the top surface of the substrate stage WT, thereby sealing the gap between the sensor and the substrate stage WT. In this case, symmetrical displacement is easier to handle.

[0041] Furthermore, the use of circular sensors allows for the use of sensor bases to position the sensor between the substrate stage WT and the sensor itself. These bases are arranged symmetrically about a thermal axis that passes through the thermal center of the sensor (which would be its center in the case of a circular sensor) and is perpendicular to the top surfaces of both the sensor and the substrate stage WT. The bases are symmetrically positioned around this thermal axis and are equidistant from it. The bases can be in the form of leaf springs (with equal elastic constants), which are fixedly attached to the bottom of the substrate stage WT and the sensor (e.g., by gluing), and the thermal expansion or contraction of the sensor causes the thermal center of the sensor to remain stationary relative to the substrate stage WT, because each leaf spring base elastically expands and contracts the sensor size by the same amount as temperature fluctuations.

[0042] Figure 3 The substrate stage WT is schematically shown from above (i.e., in a plan view). Figure 3 In the arrangement shown, the substrate W is disposed on the substrate stage WT, and the sensor 21 is disposed within the recess 20 of the substrate stage WT. The substrate W may also be held by a substrate support (not shown) in the recess 10.

[0043] Figure 4 The illustration shows the substrate stage WT and sensor 21 passing through... Figure 3 A cross-sectional view of line XX. Furthermore... Figure 4 The arrangement also includes a surface member 600. The surface member 600 is configured such that when it is as... Figure 4 When in place, the surface member 600 at least substantially surrounds the edge of the sensor 21. In other words, the surface member 600 has two principal orthogonal dimensions, such that the surface member 600 in... Figure 3 It extends in the X and Y directions. In the two main orthogonal dimensions, at least a portion of the surface member 600 extends beyond the outer extent of the sensor 21.

[0044] exist Figure 4 In the arrangement, the surface member 600 is preferably configured to interact with the surface of the sensor 21 (and... Figure 4The surface member 600 overlaps with the surface of the substrate stage WT in the Z direction. The surface member 600 is preferably configured to bridge the gap 22 between the edge of the sensor 21 and the structure defining the recess 20 in which the sensor 21 is mounted (in this case, the substrate stage WT). In this way, the surface member 600 preferably at least suppresses and preferably prevents immersion liquid from entering the gap 22 in the recess 20 between the sensor 21 and the surrounding structure of the substrate stage WT.

[0045] Figure 5 Provided Figure 4 A plan view of surface component 600. (See attached image.) Figure 5 As shown, the surface member 600 can have a substantially annular shape. In other words, the surface member 600 can have a ring shape, with a circular outer shape and defining a central circular opening. This shape may be particularly suitable for generally circular or disc-shaped sensors 21. For example, the diameter of the opening 651 of the surface member 600 can be smaller than the diameter of the sensor 21. The diameter of the outer extent 652 of the surface member 600 can be larger than the diameter of the sensor 21, and desirably larger than the diameter of the recess 20 configured to receive the sensor 21.

[0046] In an alternative arrangement, the surface member 600 may have a non-annular shape; for example, the surface member 600 may define an elliptical, rectangular, square, or irregular shape in its two principal orthogonal dimensions. Furthermore, the opening 651 of the surface member 600 may have the same shape as the outer extent 652, or it may have a different shape. Desiredly, the opening 651 of the surface member 600 has a shape similar to that of the corresponding sensor 21 in both principal orthogonal directions. Desiredly, the outer extent 652 of the surface member 600 has a shape similar to that of the recess 20 in both principal orthogonal directions, the recess 20 being configured to accommodate the corresponding sensor 21.

[0047] As mentioned above, the surface member 600 optionally defines an opening 651, which may be circular or non-circular. Desiredly, the dimensions of the opening 651 in the two principal orthogonal dimensions are smaller than the dimensions of the sensor 21 in the two principal orthogonal dimensions. In this way, the surface member 600 can be configured to overlap with and surround the sensor 21 during use. The dimensions of the outer extent 652 of the surface member 600 in the two principal orthogonal dimensions are desirously larger than the dimensions of the recess 20 in the two principal orthogonal dimensions. In this way, the surface member 600 can be configured to overlap with the structure of the substrate stage WT defining the recess 20 during use. Therefore, the surface member 600 can bridge the gap 22 between the sensor 21 and the substrate stage WT. In particular, the surface member 600 can provide a bridging between the upper surface of the sensor 21 and the upper surface of the substrate stage WT.

[0048] As mentioned above, relative to Figure 2 and Figure 4 As explained, a gap 22 typically exists between the substrate stage WT and the sensor 21. A surface member 600 can be provided to reduce the possibility of immersion liquid leakage into this gap 22. Mechanical strain may be generated in the surface member 600 due to the expansion and / or contraction of one or more layers of the surface member 600. This expansion and / or contraction may cause undesirable product overlay errors due to sensor displacement. Furthermore, mechanical strain may cause deformation of the surface member 600, thereby impairing its ability to seal the gap. Therefore, it is desirable to provide a surface member 600 that is not easily expanded and contracted, and thus does not easily experience mechanical strain.

[0049] The surface member typically comprises three layers. These three layers include: a bottom layer configured to adhere the surface member to the sensor 21 and the substrate stage WT; a top layer configured to be hydrophobic; and an intermediate layer disposed between the top and bottom layers. Most of the expansion / contraction of the surface member 600 can occur in the intermediate layer, which typically comprises or is composed of metal.

[0050] This can be at least partially addressed by reducing the thickness of the intermediate layer. However, this may introduce a deterioration in the dynamic response of the surface member during use. To address this issue, an additional layer can be introduced into the surface member instead of making the intermediate layer thinner. In particular, the surface member 600 may also include an additional layer located between the hydrophobic layer and the intermediate layer, which may be a thinner layer than the intermediate layer. The additional layer may have the desired effect of reducing the heating and cooling of the intermediate layer. In this way, the surface member 600 can be configured to experience fewer extreme levels of expansion / contraction and mechanical strain.

[0051] Furthermore, by utilizing this arrangement including the additional layers, at least one layer can be configured to tune the stiffness of the surface member 600 in at least one aspect of amplitude and directionality. Specifically, at least one layer can be patterned from materials of varying thicknesses and / or materials to achieve the tuning stiffness. Therefore, problems such as sensor displacement and fluid leakage into the gap 22 can be reduced.

[0052] like Figure 6 As shown in the arrangement, the surface member 600 according to the invention comprises five layers. In particular, the surface member 600 comprises a first layer 610; a second layer 620 disposed on the first layer 610; a third layer 611 disposed on the second layer 620; a fourth layer 621 disposed on the third layer 611; and a fifth layer 630 disposed on the fourth layer 621.

[0053] The first layer 610 includes an adhesive configured to adhere the surface member 600 to the surface to which it is attached. For example, the adhesive may be used to adhere the surface member 600 to one or more surfaces of an immersion lithography apparatus, such as the substrate stage WT and / or the upper surface of the sensor 21. In other words, the first layer 610 is configured to contact and adhere to the surfaces(s) on which the surface member 600 is applied. Specifically, the first layer 610 is configured to adhere a second layer 620 to the surface on which the surface member 600 is applied. Optionally, the first layer 610 may be an adhesive layer. In other words, the first layer 610 may consist of an adhesive.

[0054] The third layer 611 includes an adhesive configured to adhere the second layer 620 to the fourth layer 621. Optionally, the third layer 611 may be an adhesive layer. In other words, the third layer 611 may consist of an adhesive.

[0055] The fifth layer 630 preferably includes a hydrophobic coating. The fifth layer 630 can be a hydrophobic layer. In other words, the fifth layer 630 can be composed of a hydrophobic material. In this way, the fifth layer 630 can reduce the likelihood of immersion liquids and moisture coming into contact with any of the first to fourth layers 610, 620, 611, 621 of the surface member 600. In particular, the fifth layer 630 can prevent immersion liquids from contacting the upper surface of the fourth layer 621.

[0056] The fifth layer 630 is expected to be continuous. In other words, the fifth layer 630 is expected to not define any holes or openings. The fifth layer 630 may extend across the entire area covered by the fourth layer 621 in two principal orthogonal dimensions. The fifth layer 630 is expected to extend across the entire area covered by the first layer 610 in two principal orthogonal dimensions. The fifth layer 630 may optionally (in...) Figure 6 (in the Z direction) extends to one or both ends of the surface member 600 (in Figure 5 (in the Y direction). For example, the fifth layer 630 may extend to cover one or both terminals of the fourth layer 621, optionally further cover one or both terminals of the third layer 611, optionally further cover one or both terminals of the second layer 620, and optionally further cover one or both terminals of the first layer 610. In this way, the fifth layer 630 can protect the terminals of the first to fourth layers 610, 620, 611, 621 of the surface member 600, especially from moisture.

[0057] The thickness of the surface member 600 is preferably between 0.1 and 50 micrometers, more preferably between 10 and 40 micrometers, and even more preferably between 20 and 30 micrometers. The dimensions of the surface member 600 (including its thickness) may depend on the dimensions of the sensor 21 and the dimensions of the corresponding recess 20 to which the surface member 600 is configured for interface connection.

[0058] At least one of the second layer 620 and the fourth layer 621 may preferably include a metal. The metal may include stainless steel, Invar, tungsten, or titanium. Optionally, at least one of the second layer 620 and the fourth layer 621 may include carbon fiber.

[0059] The fourth layer 621 is expected to be continuous. In other words, the fourth layer 621 is expected to not define any holes or openings. The fourth layer 621 is expected to extend across the entire area covered by the fifth layer 630 in two principal orthogonal dimensions. The fourth layer 621 may extend across the entire area covered by the fifth layer 630 in two principal orthogonal dimensions. The fourth layer 621 is expected to extend across the entire area covered by the first layer 610 in two principal orthogonal dimensions.

[0060] The fourth layer 621 may have a thickness of 10 to 1000 nm, preferably 100 to 1000 nm, and more preferably 200 to 800 nm. The second layer 620 may preferably have a greater thickness than the fourth layer 621. In particular, the average thickness of the second layer 620 may preferably be greater than the average thickness of the fourth layer 621. For example, the thickness of the second layer 620 may be 5 to 40 micrometers, preferably 10 to 40 micrometers, and more preferably 20 to 30 micrometers. In this way, the second layer 620 may provide most of the strength and stiffness of the surface member 600, while the fourth layer 621 may provide the desired surface profile. For example, the fourth layer 621 may have a smooth, flat, and / or continuous upper surface, while the second layer 620 may not have a smooth, flat, continuous upper surface.

[0061] The fourth layer 621 may be a continuous, flat layer. Since the fourth layer 621 exists to provide the desired upper surface profile for applying the fifth layer 630, the second layer 620 need not perform this function. Instead, the second layer 620 may be configured to tune the stiffness of the surface member 600 in at least one aspect of amplitude and directionality. For example, as explained further below, the second layer 620 may be stepped, corrugated, wave-like, and / or define a plurality of holes.

[0062] Furthermore, the fourth layer 621 is preferably configured to reflect light, such as deep ultraviolet light. Specifically, the fourth layer 621 can be configured to reflect light that has already passed through the fifth layer 630. In other words, the fourth layer 621 can reflect light away from the third layer 611. In this way, the fourth layer 621 can protect the adhesive of the third layer 611 from light (especially deep ultraviolet light). Therefore, the integrity of the adhesive of the third layer 611 can be maintained. The fourth layer 621 performs the function of protecting the adhesive layer, a function that the second layer 620 does not need to perform. Therefore, the second layer 620 can be patterned to tune the amplitude and / or direction of the stiffness of the surface member 600. In other words, the presence of the fourth layer 621 allows for greater design freedom in the second layer 620. This use of the second layer 620 and the fourth layer 621 can be expected to result in better mechanical properties of the surface member 600.

[0063] The surface of the fourth layer 621 that contacts the fifth layer 630 is a substantially flat surface. For example, as mentioned above, the fourth layer 621 can be a continuous flat layer. Alternatively, the upper surface of the fourth layer 621 that contacts the fifth layer 630 can be substantially flat, and the lower surface of the fourth layer 621 that contacts the third layer 611 can have a non-flat profile. In this way, the reflective upper surface of the fourth layer 621 can be flat. Furthermore, the fifth layer 630 (desirably the outermost layer of the surface member 600) can be provided on a flat surface. Therefore, the outermost surface of the surface member 600 can also be flat. This can facilitate desired fluid flow on the surface member 600 while minimizing disturbance to the flow.

[0064] In surface member 600, at least a second layer 620 is patterned to tune the stiffness of surface member 600 in at least one aspect of amplitude and directionality. In other words, the second layer 620 can vary at different radial or circumferential locations of surface member 600, for example, in terms of thickness and / or material. In this way, the amplitude and / or direction of the stiffness of surface member 600 can differ from the case where the second layer 620 is a flat, continuous layer of solid material.

[0065] Figures 7A to 7C A cross-sectional view of a surface member 600 with a second layer 620 having a different pattern is provided. Figures 7A to 7C Surface component 600 includes, in other respects, referenced above. Figure 6 The surface component 600 describes the same five layers 610, 620, 611, 621, and 630.

[0066] exist Figure 7A and Figure 7BIn one arrangement, the second layer 620 is patterned such that its thickness varies with its position on the surface member 600. In both arrangements, the thickness of the second layer 620 varies with its radial position on the surface member 600. However, in another arrangement, the thickness of the second layer 620 may alternatively or additionally vary with its circumferential position on the surface member 600.

[0067] exist Figure 7A In this arrangement, the thickness of the second layer 620 at its radially inward position is less than the thickness of the surface member 600 at its radially outward position. Furthermore, in this arrangement, there is a step change between the different thicknesses. In an alternative configuration, the thickness of the second layer 620 can vary gradually, rather than a step (or vertically). Additionally, the thickness of the second layer 620 at the radially outward position of the surface member 600 can optionally be greater than the thickness at its radially inward position.

[0068] exist Figure 7B In this arrangement, the second layer 620 defines a corrugated pattern. Using this arrangement, the surface member 600 can be expected to have increased flexibility.

[0069] The wavy pattern defines a series of recesses 801. In other words, multiple different positions of the second layer 620 correspond to the recesses 801, and the positions of the second layer 620 between adjacent recesses 801 correspond to the peaks 802 between the recesses 801. The thickness of the second layer 620 at the recesses 801 is less than the thickness of the second layer 620 at the peaks 802.

[0070] exist Figure 7B In the arrangement shown, the corrugation pattern is a regular pattern. In other words, the thickness of the second layer 620 is the same at the location of each of the plurality of recesses 801, and the thickness of the second layer 620 is the same at the location of each of the peaks 802. In an alternative arrangement, the depth of the recesses 801 and / or the peaks 802 (in...) Figure 7B The depth (in the Z direction) can vary. For example, the radially outward concave portion 801 can correspond to a greater thickness (shallower concave portion) of the second layer 620 compared to the radially inward concave portion in the corrugated pattern. Furthermore, in Figure 7B In the arrangement, there is a step change between the concave portion 801 and the peak portion 802 of the corrugated pattern. In an alternative configuration, the thickness of the second layer 620 can vary gradually, rather than in a step (or vertical) manner.

[0071] exist Figure 7B In the arrangement shown, the recessed portion 801 of the corrugated pattern can extend (along...) Figure 7B (in the X direction) to form multiple recessed channels. Figure 7BIn one arrangement, each recessed channel extends in a generally circumferential direction of the surface member 600. In an alternative arrangement, the second layer 620 may define a corrugated pattern extending in a circumferential direction, with recesses 801 and corresponding peaks 802 located at different circumferential (rather than radial) positions on the surface member 600. Using such an arrangement, the recesses 801 of the corrugated pattern can extend to form a plurality of recessed channels extending in a substantially radial direction.

[0072] The upper surface of the second layer 620 can have a patterned shape outline, such as... Figures 7A to 7B As shown. The lower surface of the second layer 620 can be substantially flat. In this way, the first layer 610 can more easily provide a substantially flat lowermost surface for the surface member 600 to be adhered to the structure on which the surface member 600 is disposed.

[0073] Optionally, the fourth layer 621 can also be patterned to tune the stiffness of the surface member 600 in at least one aspect of amplitude and directionality. In other words, the fourth layer 621 can vary at different radial or circumferential locations of the surface member 600, for example, in terms of thickness. In this way, the amplitude and / or direction of the stiffness of the surface member 600 can differ from the case where the fourth layer 621 is a flat, continuous layer of solid material. Figures 7A to 7B A cross-sectional view of a surface member 600 of a fourth layer 621 with different patterns is provided.

[0074] exist Figure 7A and Figure 7B In one arrangement, the fourth layer 620 is patterned such that the thickness of the fourth layer 621 varies with its position on the surface member 600. In both arrangements, the thickness of the fourth layer 621 varies with its radial position on the surface member 600. However, in another arrangement, the thickness of the fourth layer 621 may alternatively or additionally vary with its circumferential position on the surface member 600.

[0075] The second layer 620 and the fourth layer 621 can be separated only by a third layer 611, which can have a substantially constant thickness and can follow the contour of the upper surface of the second layer 620 and / or the contour of the lower surface of the fourth layer 621. The pattern of the fourth layer 621 can correspond to the pattern of the second layer 620. In other words, the contour of the lower surface of the fourth layer 621 can substantially match the contour of the upper surface of the second layer 620. For example, in Figure 7AIn this arrangement, the thickness of the fourth layer 621 at its radially inward position is greater than the thickness of the surface member 600 at its radially outward position. The position of the greater thickness of the fourth layer 621 corresponds to the position of the smaller thickness of the second layer 620. Therefore, when the pattern of the fourth layer 621 corresponds to the pattern of the second layer 620, the total thickness of the surface member 600 can remain substantially constant with radial and / or circumferential positions, regardless of the pattern.

[0076] exist Figure 7B In the arrangement, the fourth layer 621 defines a corrugated pattern. The corrugated pattern defines a series of peaks 812. In other words, multiple different positions of the fourth layer 621 correspond to peaks 812, and the positions of the fourth layer 621 between adjacent peaks 812 correspond to recesses 811 between peaks 812. The thickness of the fourth layer 621 at the peaks 812 is greater than the thickness of the fourth layer 621 at the recesses 811.

[0077] The lower surface of the fourth layer 621 can have a patterned outline, such as... Figures 7A to 7B As shown. The upper surface of the fourth layer 621 is expected to be substantially flat. In this way, the fifth layer 630 can more easily provide a substantially flat uppermost surface for the surface member 600.

[0078] As shown above (refer to the reference) Figures 7A to 7B As discussed, the second layer 620 can be patterned by varying its thickness along its position on the surface member 600. Alternatively or additionally, the second layer 620 can be patterned such that it is discontinuous. For example, as Figure 7C As shown, the second layer 620 may define a plurality of holes 700 therein. Each hole 700 is preferably extended between the first layer 610 and the third layer 611, such that the second layer 620 is discontinuous. With this arrangement, the average Young's modulus of the surface member 600 can be reduced compared to an arrangement having a solid second layer 620. In certain applications, a lower Young's modulus may be beneficial to the mechanical response of the surface member 600. Furthermore, the introduction of the holes 700 can reduce the average coefficient of thermal expansion of the second layer 620. This can advantageously reduce the thermal expansion / contraction of the surface member 600.

[0079] exist Figure 7C In the arrangement, holes 700 are provided at different radial positions on the surface member 600, such that the second layer 620 is discontinuous in the radial direction of the surface member 600. Optionally, the holes 700 may additionally extend in the circumferential direction of the surface member 600 to form a channel break in the second layer 620. The holes 700 may optionally extend completely around the circumference of the surface member 600.

[0080] Figures 8A to 8CThe surface member 600 has a second layer 620, which has layers respectively with reference to the above. Figures 7A to 7C The pattern described is the same as the pattern. However, in Figures 8A to 8C In the arrangement, the second layer 620 also includes filling material 710.

[0081] The filler material 710 is preferably configured such that at least one (preferably both) of the upper and lower surfaces of the second layer 620 is substantially flat. For example, the filler material 710 may be provided on ( Figure 7B Within one or more recesses 801 (as arranged) Figure 8B As shown. Additionally or alternatively, filler material 710 may be provided in ( Figure 7C (The arrangement) within one or more holes 700, such as Figure 8C As shown. Similarly, filler material 710 can be provided at locations corresponding to the lower thickness of the second layer 620 (such as... Figure 7A The radial inward position of the arrangement), such as Figure 8A As shown. In this way, the upper surface of the second layer 620 can have a substantially flat profile. The lower surface of the fourth layer 621 can also be substantially flat. In other words, the fourth layer 621 can have a constant thickness. Therefore, the surface member 600 can have a substantially constant thickness.

[0082] In such Figure 8B In the arrangement, the second layer 620 has a corrugated pattern defining a plurality of recesses 801, and a filling material 710 is intended to completely fill at least one recess 801. Furthermore, the filling material 710 is intended to be disposed in each of the plurality of recesses 801, optionally filling each recess. As described above relative to... Figure 7B As described, the recess 801 can extend to form a recessed channel. A filling material 710 is preferably disposed in at least one (preferably all) of the recessed channels and optionally fills these recessed channels.

[0083] In such Figure 8C In the arrangement, the second layer 620 has a pattern defining a plurality of holes 700 (alternatively referred to as spaces), and a filling material 710 is intended to completely fill at least one hole 700. Furthermore, the filling material 710 is intended to be disposed in each of the plurality of holes 700, optionally filling these holes. As described above relative to... Figure 7C As described, the hole 700 can extend to form a channel fracture in the second layer 620. A filler material 710 is preferably disposed in at least one (preferably all) of the channel fractures, optionally filling these channel fractures.

[0084] The filler material 710 is expected to have a different coefficient of thermal expansion than the other materials of the second layer 620. For example, the filler material 710 may comprise a polymer, while the other materials of the second layer 620 may be metals, such as stainless steel. In this way, the stiffness of the surface member 600 in at least one aspect of amplitude and orientation can be tuned by a pattern of different materials in the second layer 620. In this way, the filler material 710 can be selected based on its stiffness and / or coefficient of thermal expansion, which is beneficial to the mechanical and thermal response of the surface member 600 to the expected conditions of a given application.

[0085] Figure 9 The surface component 600 is shown in a plan view. Figure 10A Provided via Figure 9 The cross-sectional view of line BB, and Figure 10B Provided Figure 9 A cross-sectional view of line CC. Figure 9 and Figures 10A to 10B The second layer 620 is depicted in a discontinuous arrangement in the circumferential direction of the surface member 600. In particular, the second layer 620 of the surface member 600 defines a plurality of spaces 900. The spaces 900 are disposed at different circumferential positions around the surface member 600. Figure 10A A cross-sectional view is shown, illustrating a portion of a space within a space 900 via surface member 600. (As shown) Figure 10A As shown, space 900 is optionally filled with filler material 710. Figure 10B A cross-sectional view is shown through a portion of surface member 600, which does not include a space in space 900. (As shown) Figure 10B As shown, at some circumferential locations, the second layer 620 may be continuous in the radial direction of the surface member 600.

[0086] This invention can provide a photolithography apparatus. This photolithography apparatus may have any / all other features or components described above. For example, the photolithography apparatus may optionally include at least one or more of a source SO, an irradiation system IL, a projection system PS, a substrate stage WT, a substrate support, etc.

[0087] While this article provides specific references to the use of lithography equipment in IC manufacturing, it should be understood that the lithography equipment described herein can have other applications. Possible other applications include the fabrication of integrated optical systems, guiding and detecting patterns in magnetic domain memories, flat panel displays, liquid crystal displays (LCDs), thin-film magnetic heads, etc.

[0088] Where the context permits, embodiments of the invention may be implemented using hardware, firmware, software, or any combination thereof. Embodiments of the invention may also be implemented by instructions stored on a machine-readable medium, which may be read and executed by one or more processors. A machine-readable medium may include any means for storing or transmitting information in a form readable by a machine (e.g., a computing device). For example, a machine-readable medium may include read-only memory (ROM); random access memory (RAM); magnetic storage media; optical storage media; flash memory devices; electrical, optical, acoustic, or other forms of propagation signals (e.g., carrier waves, infrared signals, digital signals, etc.); and others. Further, firmware, software, routines, and instructions may be described herein as performing certain actions. However, it should be understood that this description is merely for convenience, and such actions are in fact produced by a computing device, processor, controller, or other means of executing firmware, software, routines, instructions, etc., and doing so enables actuators or other devices to interact with the physical world.

[0089] Although embodiments of the invention may be specifically referred to herein in the context of lithography equipment, embodiments of the invention can be used in other equipment. Embodiments of the invention may form part of mask inspection equipment, metrology equipment, or any equipment for measuring or processing objects such as wafers (or other substrates) or masks (or other patterning devices). These devices may generally be referred to as lithography tools.

[0090] Although specific references may have been made above to the use of embodiments of the invention in the context of optical lithography, it is to be understood that the invention is not limited to optical lithography where the context permits.

[0091] While specific embodiments of the invention have been described above, it should be understood that the invention can be practiced in other ways than those described. The above description is intended to be illustrative and not restrictive. Therefore, it will be apparent to those skilled in the art that modifications can be made to the described invention without departing from the scope of the claims set forth below.

[0092] The embodiments include the following numbered clauses: 1. A surface member for a removable application to cover at least a portion of the surface of an immersion lithography apparatus, the surface member having two principal orthogonal dimensions and comprising: The first layer includes an adhesive configured to adhere the surface member to the surface of the immersion lithography apparatus; The second layer is set on top of the first layer; The third layer is set on top of the second layer; The fourth layer is disposed on the third layer; and The fifth layer is located on top of the fourth layer; The third layer includes an adhesive configured to adhere the second layer to the fourth layer, and at least the second layer is patterned to tune the stiffness of the surface member in at least one aspect of amplitude and directionality. 2. The surface member according to Clause 1, wherein the fourth layer is patterned to tune the stiffness of the surface member in at least one aspect of amplitude and directionality. 3. The surface member according to Clause 2, wherein the pattern of the fourth layer corresponds to the pattern of the second layer. 4. The surface member according to clause 2 or 3, wherein the profile of the lower surface of the fourth layer matches the profile of the upper surface of the second layer. 5. The surface member according to any of the preceding clauses, wherein the surface member is configured to at least substantially surround the edge of the sensor. 6. The surface member according to Clause 5, wherein the surface member is configured to bridge the gap between the sensor and the structure defining the recess in which the sensor is mounted. 7. The surface member according to clause 5 or 6, wherein the sensor is configured for the immersion lithography apparatus. 8. The surface member according to any one of clauses 5 to 7, wherein the sensor comprises a scanner-integrated lens interferometry sensor, a scanner-integrated lens interferometry sensor, or a transmission image sensor. 9. The surface member according to any of the preceding clauses, wherein the surface member has a substantially annular shape. 10. The surface member according to any one of clauses 5 to 9, wherein at least one of the second layer and the fourth layer is patterned such that the thickness of the second layer and / or the thickness of the fourth layer varies with circumferential and / or radial position on the surface member. 11. The surface member according to Clause 10, wherein the second layer and / or the fourth layer defines a corrugated pattern. 12. The surface member according to clause 10 or 11, wherein the pattern includes one or more recessed channels, wherein each of the recessed channels extends in a substantially circumferential direction of the surface member. 13. The surface member according to clause 10 or 11, wherein the corrugated pattern comprises a plurality of said recessed channels arranged at different circumferential locations around the surface member, wherein each of said recessed channels extends in a substantially radial direction of the surface member. 14. The surface member according to clause 12 or 13, wherein at least one of the second and fourth layers further comprises a filling material disposed in at least one of the recessed channels. 15. The surface member according to Clause 14, wherein the filling material completely fills at least one of the recessed channels. 16. The surface member according to clause 14 or 15, wherein the filling material is disposed in each of the recessed channels. 17. The surface member according to any of the preceding clauses, wherein the second layer is patterned such that the second layer is discontinuous. 18. The surface member according to Clause 17 when it is subordinate to any of Clauses 5 to 9, wherein the second layer is discontinuous in the circumferential direction of the surface member. 19. The surface member according to clause 17 or 18 when it is subordinate to any of clauses 5 to 9, wherein the second layer is discontinuous in the radial direction of the surface member. 20. The surface member according to any one of clauses 17 to 19, wherein the second layer is patterned such that the second layer defines a plurality of holes therein. 21. The surface member according to Clause 20, wherein each of the holes extends between the first layer and the third layer. 22. The surface member according to any one of clauses 17 to 21, wherein the second layer defines one or more spaces, and wherein the second layer contains the filling material including at least one aperture disposed in the one or more spaces. 23. The surface member according to Clause 22, wherein the filling material completely fills at least one aperture in one or more of the spaces. 24. The surface member according to clause 22 or 23, wherein the filling material is disposed in each of the one or more spaces. 25. The surface member according to any one of clauses 14 to 16 and 22 to 24, wherein the filling material has a different coefficient of thermal expansion than the other materials of the second layer. 26. The surface member according to any one of clauses 14 to 16 and 22 to 24, wherein the filler material comprises a polymer. 27. The surface member according to any of the preceding clauses, wherein the fourth layer is continuous. 28. The surface member according to any of the preceding clauses, wherein the fourth layer extends across the entire area covered by the fifth layer in two principal orthogonal dimensions. 29. The surface member according to any of the preceding clauses, wherein the second layer has a greater thickness than the fourth layer. 30. The surface member according to Clause 29, wherein the thickness of the second layer is two to six times the thickness of the fourth layer. 31. The surface member according to any of the preceding clauses, wherein the fourth layer is configured to reflect light. 32. The surface member according to Clause 31, wherein the fourth layer is configured to reflect light that has passed through the fifth layer away from the third layer. 33. The surface member according to clause 31 or 32, wherein the fourth layer is configured to reflect deep ultraviolet light. 34. The surface member according to any of the preceding clauses, wherein the surface in contact with the fifth layer of the fourth layer is a substantially flat surface. 35. The surface member according to any of the preceding clauses, wherein at least one of the second and fourth layers comprises metal. 36. The surface member according to Clause 35, wherein the metal comprises stainless steel, Invar, tungsten, or titanium. 37. The surface member according to any of the preceding clauses, wherein at least one of the second and fourth layers comprises carbon fiber. 38. The surface member according to any of the preceding clauses, wherein the fifth layer comprises a hydrophobic coating. 39. The surface member according to any of the preceding clauses, wherein the thickness of the surface member is between 0.1 and 50 micrometers. 40. An immersion lithography apparatus comprising the surface member of any one of the preceding clauses. 41. The immersion lithography apparatus according to Clause 40 further includes: The sensor; and The structure that defines the recess in which the sensor is mounted; The surface member extends across the gap between the sensor and the structure.

Claims

1. A surface member for a removable application to cover at least a portion of the surface of an immersion lithography apparatus, the surface member having two principal orthogonal dimensions and comprising: The first layer includes an adhesive configured to adhere the surface member to the surface of the immersion lithography apparatus; The second layer is set on top of the first layer; The third layer is set on top of the second layer; The fourth layer is located on top of the third layer; as well as The fifth layer is located on top of the fourth layer; The third layer includes an adhesive configured to adhere the second layer to the fourth layer, and at least the second layer is patterned to tune the stiffness of the surface member in at least one of amplitude and orientation.

2. The surface member of claim 1, wherein the fourth layer is patterned to tune the stiffness of the surface member in at least one aspect of amplitude and directionality, wherein the pattern of the fourth layer corresponds to the pattern of the second layer, and wherein the pattern of the fourth layer corresponds to the pattern of the second layer.

3. The surface member of claim 1 or 2, wherein the surface member is configured to at least substantially surround the edge of the sensor, wherein the surface member is preferably configured to bridge the gap between the sensor and a structure defining a recess in which the sensor is mounted, wherein the sensor is preferably configured for the immersion lithography apparatus, and wherein the sensor preferably comprises a scanner-integrated lens interferometry sensor, a scanner-integrated lens interferometry sensor, or a transmission image sensor.

4. A surface member according to any one of the preceding claims, wherein the surface member has a substantially annular shape, wherein at least one of the second and fourth layers is patterned such that the thickness of the second layer and / or the thickness of the fourth layer varies with circumferential and / or radial positions on the surface member, wherein the second and / or fourth layers define a corrugated pattern, wherein the pattern comprises one or more recessed channels, wherein each recessed channel extends in a substantially circumferential direction on the surface member, wherein the corrugated pattern comprises a plurality of recessed channels arranged around the surface member at different circumferential positions, wherein each recessed channel extends in a substantially radial direction on the surface member, wherein at least one of the second and fourth layers further comprises a filler material disposed in at least one recessed channel, wherein the filler material completely fills the at least one recessed channel, and wherein the filler material is disposed in each of the recessed channels.

5. The surface member according to any one of the preceding claims, wherein the second layer is patterned such that the second layer is discontinuous.

6. The surface member according to claim 5 when dependent on claim 3 or 4, wherein the second layer is discontinuous in the circumferential direction of the surface member, and / or wherein the second layer is discontinuous in the radial direction of the surface member.

7. The surface member of claim 5 or 6, wherein the second layer is patterned such that the second layer defines a plurality of holes therein, wherein each hole of the holes extends between the first layer and the third layer, and / or wherein the second layer defines one or more spaces, and wherein the second layer includes a filling material comprising at least one of the one or more spaces, wherein the filling material preferably completely fills at least one of the one or more spaces, wherein the filling material preferably is disposed in each of the one or more spaces.

8. The surface member according to claim 4 or 7, wherein the filler material has a different coefficient of thermal expansion than the other materials of the second layer, or wherein the filler material comprises a polymer.

9. The surface member according to any one of the preceding claims, wherein the fourth layer is continuous, and / or wherein the fourth layer extends across the entire area covered by the fifth layer in the two principal orthogonal dimensions, and / or wherein the second layer has a greater thickness than the fourth layer, and preferably wherein the thickness of the second layer is two to six times the thickness of the fourth layer.

10. The surface member according to any one of the preceding claims, wherein the fourth layer is configured to reflect light.

11. The surface member of claim 10, wherein the fourth layer is configured to reflect light that has passed through the fifth layer away from the third layer, and / or wherein the fourth layer is configured to reflect deep ultraviolet light.

12. The surface member according to any one of the preceding claims, wherein the surface of the fourth layer in contact with the fifth layer is a substantially flat surface, and / or wherein at least one of the second layer and the fourth layer comprises a metal.

13. The surface member of claim 12, wherein the metal comprises stainless steel, Invar, tungsten, or titanium.

14. The surface member according to any one of the preceding claims, wherein at least one of the second and fourth layers comprises carbon fiber, and / or wherein the fifth layer comprises a hydrophobic coating, and / or wherein the thickness of the surface member is between 0.1 micrometers and 50 micrometers.

15. An immersion lithography apparatus comprising the surface member of any one of the preceding claims, preferably further comprising: sensor; as well as The structure of the recess in which the sensor is mounted is defined; The surface member extends across the gap between the sensor and the structure.

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