Pressing detection device and electronic equipment

Abstract

The invention discloses a pressing detection device and electronic equipment. The pressing detection device comprises a circuit board, a bracket and a plurality of sensors, the sensor comprises a first electrode and a second electrode, the first electrode is arranged on the lower surface of the circuit board, the second electrode is connected with the lower surface of the circuit board, a first containing groove is formed in the area, surrounding the sensor, of the lower surface of the circuit board, and the first containing groove is used for containing scaling powder left when the second electrode is welded to the circuit board; the bracket is fixed on a shell of the electronic equipment, and the bracket is propped against the second electrode; when the pressing detection device receives pressing operation, the second electrode deforms, and the distance between the first electrode and the second electrode is changed, so that the sensor generates a pressing signal; the circuit board can transmit the pressing signal to the control unit, and enables the control unit to carry out pressing detection according to the pressing signal. The pressing detection device can carry out global pressing detection, the first containing groove can contain residual scaling powder, and the detection sensitivity is high.

Description

Press detection device and electronic device

[0001] The present application claims priority to the application with the application date of June 27, 2024, the application number of PCT / CN2024 / 101908, and the patent name of "Press detection device and electronic device", the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the technical field of touchpads, in particular to a press detection device and an electronic device. BACKGROUND

[0003] The touchpad is a flat plate arranged on the C shell of a notebook computer. The touchpad on the notebook computer can recognize touch instructions and press instructions. When the user's finger slides on the touch area of the touchpad, the cursor in the notebook computer can be moved. When the user's finger is pressed on the touchpad, the touchpad can recognize the press instruction to make the notebook computer execute the corresponding operation.

[0004] The existing touchpad uses a mechanical press structure in the form of a half-area press or a separate key to recognize press instructions.

[0005] However, the separate key form occupies the touch area of the touchpad, reducing the area of the touch area. The half-area press form needs to be pressed at a specific position to recognize the press instruction. Therefore, the existing touchpad has poor user experience. SUMMARY

[0006] Therefore, embodiments of the present application provide a press detection device and an electronic device to at least partially solve the above problems.

[0007] According to a first aspect of the embodiments of the present application, a press detection device is provided, which is applied to an electronic device, and includes a circuit board, a support and a plurality of sensors. The sensor includes a first electrode and a second electrode. The first electrode is arranged on the lower surface of the circuit board, and the second electrode is connected with the lower surface of the circuit board. The lower surface of the circuit board is provided with a first accommodating groove around the area of the sensor. The first accommodating groove is used to accommodate the flux remaining when the second electrode is welded on the circuit board. The support is fixed on the shell of the electronic device, and the support is in abutment with the second electrode. When the press detection device receives a press operation, the second electrode is deformed, the distance between the first electrode and the second electrode changes, and the sensor generates a press signal. The circuit board is used to transmit the press signal to a control unit, and makes the control unit perform press detection according to the press signal.

[0008] According to a second aspect of the embodiment of the present application, an electronic device is provided, comprising a housing and the pressing detection device according to the first aspect of the embodiment of the present application; the support in the pressing detection device is fixed on the housing.

[0009] According to the pressing detection device provided by the embodiment of the present application, the pressing detection device comprises a circuit board, a support and a plurality of sensors. When the pressing detection device receives a pressing operation, the relative distance between the first electrode and the second electrode in the sensor changes, so that the sensor can generate a pressing signal. The circuit board can transmit the pressing signal to the control unit, so as to realize the recognition of the user's pressing operation. Since no physical button is arranged, the area of the touch area is larger than that of the touchpad in the prior art in the form of a single button. Since the pressing position is not limited, the pressing signal can be generated when the pressing detection device receives the pressing operation, so that the user can press anywhere without pressing at a specific position, thereby improving the user experience. In addition, the lower surface of the circuit board is provided with the first accommodating groove around the area of the sensor, so that the residual flux can be accommodated through the first accommodating groove after the second electrode is welded to the circuit board, thereby preventing the flux from affecting the sensitivity of the pressing detection by remaining on the surface of the circuit board, and the pressing detection device can have higher sensitivity. BRIEF DESCRIPTION OF DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the embodiments of the present application, and other drawings can also be obtained by those skilled in the art based on these drawings.

[0011] FIG. 1 is a schematic diagram of a touchpad in the form of a single button provided by the embodiment of the present application;

[0012] FIG. 2 is a schematic diagram of a pressing detection device provided by the embodiment of the present application;

[0013] FIG. 3 is a schematic diagram of a support provided by the embodiment of the present application;

[0014] FIG. 4 is a schematic diagram of a circuit board provided by the embodiment of the present application;

[0015] FIG. 5 is a schematic diagram of a first accommodating groove provided by the embodiment of the present application;

[0016] FIG. 6 is a schematic diagram of another first accommodating groove provided by the embodiment of the present application;

[0017] FIG. 7 is a schematic diagram of a circuit board comprising a second accommodating groove provided by the embodiment of the present application;

[0018] FIG. 8 is a partial enlarged view of a circuit board according to an embodiment of the present application;

[0019] FIG. 9 is a schematic view of an electrical connection region according to an embodiment of the present application;

[0020] FIG. 10 is a schematic view of another electrical connection region according to an embodiment of the present application;

[0021] FIG. 11 is a schematic view of a second electrode according to an embodiment of the present application;

[0022] FIG. 12 is a sectional view of a second electrode according to an embodiment of the present application;

[0023] FIG. 13 is a schematic view of another pressing detection device according to an embodiment of the present application;

[0024] FIG. 14 is an exploded view of a pressing detection device according to an embodiment of the present application;

[0025] FIG. 15 is a schematic view of a silica gel pad according to an embodiment of the present application;

[0026] FIG. 16 is a schematic view of a sensing portion according to an embodiment of the present application;

[0027] FIG. 17 is a schematic view of another circuit board according to an embodiment of the present application;

[0028] FIG. 18 is a schematic view of a pressing detection device including a feedback unit according to an embodiment of the present application;

[0029] FIG. 19 is a sectional view of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0030] In order to make personnel in the art better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and in detail below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art should belong to the scope of protection of the embodiments of the present application.

[0031] As described above, the touchpad is a flat plate arranged on the notebook computer C shell, and the touchpad on the notebook computer can identify touch instructions and pressing instructions. When the user's finger slides on the touch area of the touchpad, the cursor in the notebook computer can be moved. When the user's finger presses on the touchpad, the touchpad can identify the pressing instructions to make the notebook computer execute corresponding operations. The existing touchpad adopts a mechanical pressing structure in a half-area pressing mode or a separate key mode to identify the pressing instructions. For example, FIG. 1 is a schematic diagram of a touchpad in a separate key mode according to an embodiment of the present application. As shown in FIG. 1, the touchpad in the separate key mode includes two keys. The user inputs the pressing instructions through the two keys. Specifically, the left key 102 can simulate the left key of the mouse, and the right key 103 can simulate the right key of the mouse. However, the separate key mode occupies part of the area of the touch area 101 of the touchpad, reduces the area of the touch area 101, and the half-area pressing mode needs to be pressed at a specific position to identify the pressing instructions. For example, the half-area pressing mode needs to be pressed at the lower left corner to simulate the left key of the mouse and needs to be pressed at the lower right corner to simulate the right key of the mouse. Therefore, the existing touchpad has poor user experience.

[0032] In the embodiment of the present application, a pressing detection device is provided. The pressing detection device includes a circuit board, a support and a plurality of sensors. When the pressing detection device receives a pressing operation, the relative distance between the first electrode and the second electrode in the sensor changes, so that the sensor can generate a pressing signal. The circuit board can transmit the pressing signal to a control unit to identify the user's pressing operation. Since no physical key is arranged, the area of the touch area is larger than that of the touchpad in the separate key mode in the prior art. Since the pressing position is not limited, the pressing signal can be generated when the pressing detection device receives the pressing operation, so that the user can press at any position without pressing at a specific position, thereby improving the user experience. In addition, the lower surface of the circuit board is provided with a first accommodating groove around the area of the sensor, so that the residual flux can be accommodated in the first accommodating groove after the second electrode is welded to the circuit board, thereby preventing the flux from remaining on the surface of the circuit board to affect the sensitivity of the pressing detection, and the pressing detection device has high sensitivity.

[0033] The pressing detection device provided by the present application will be described below through an embodiment.

[0034] FIG. 2 is a schematic diagram of a pressing detection device according to an embodiment of the present application, which is applied to an electronic device. As shown in FIG. 2, the pressing detection device comprises a circuit board 202, a support 203 and a plurality of sensors, the sensors comprising a first electrode 2041 and a second electrode 2042, the first electrode 2041 being arranged on a lower surface of the circuit board 202, and the second electrode 2042 being connected to the lower surface of the circuit board 202, the lower surface of the circuit board 202 being provided with a first accommodating groove 206 around a region of the sensors, the first accommodating groove 206 being used to accommodate a flux remaining when the second electrode 2042 is welded on the circuit board 202, the support 203 being fixed to a housing 301 of the electronic device, and the support 203 abutting against the second electrode 2042. When the pressing detection device receives a pressing operation, the second electrode 2042 is deformed, the distance between the first electrode 2041 and the second electrode 2042 is changed, and a pressing signal is generated by the sensor. The circuit board 202 can transmit the pressing signal to a control unit, and the control unit can perform pressing detection according to the pressing signal. Optionally, the pressing detection can comprise pressing operation detection and / or pressure detection.

[0035] The sensors are arranged between the circuit board 202 and the support 203, and the support 203 is fixed to the housing 301 of the electronic device. In an example, the support 203 can be made of metal, and in another example, the support 203 can be made of plastic. The support 203 can be fixed to the housing 301 of the electronic device by means of bolts, clamps or the like. The specific fixing method is not limited herein. It should be understood that the plurality of sensors can be distributed at different positions on the circuit board 202. Optionally, the plurality of sensors can be uniformly distributed at the edges of the circuit board 202.

[0036] When the pressing detection device receives a pressing operation, for example, a user's finger pressing, the circuit board 202 is displaced in the direction of the pressure, and relative movement is generated between the circuit board 202 and the support 203. At this time, since the support 203 is fixed to the housing 301 of the electronic device, the circuit board 202 is displaced relative to the support 203. The first electrode 2041 is arranged on the circuit board 202, and the second electrode 2042 abuts against the support 203. When the circuit board 202 is displaced relative to the support 203, the second electrode 2042 is deformed, the relative distance between the first electrode 2041 and the second electrode 2042 is changed, the capacitance of the sensor is changed, and thus the sensor generates a pressing signal. After the circuit board 202 receives the pressing signal sent by the sensor, the pressing signal is transmitted to the control unit. The control unit can identify the pressing signal, and perform a pressing operation according to the pressing signal. In an example, the control unit can be a pressing detection chip arranged on the circuit board 202, a touch chip arranged on the circuit board 202, or a processor of the electronic device, and the like.

[0037] It should be understood that when the second electrode 2042 is welded on the circuit board 202 by soldering, flux needs to be used to assist the solder to adhere, so that the second electrode 2042 can be successfully welded on the lower surface of the circuit board 202. However, since the flux has fluidity at high temperature, after the welding of the second electrode 2042 is completed, part of the flux will remain on the circuit board 202, and at least part of the flux remaining on the circuit board 202 will flow into the space between the first electrode 2041 and the second electrode 2042. Since the flux has viscosity, it will cause the second electrode 2042 to fail to rebound, and since the flux remains between the first electrode 2041 and the second electrode 2042, the signal change between the second electrode 2042 and the first electrode 2041 after the deformation of the second electrode 2042 will be small, resulting in low sensitivity of the press detection. To solve the above problem, a first accommodating groove 206 is arranged on the lower surface of the circuit board 202 around the sensor. Optionally, the first accommodating groove 206 is arranged outside the second electrode 2042. After the second electrode 2042 is welded on the lower surface of the circuit board 202, the remaining flux can flow into the first accommodating groove 206, thereby reducing the flux remaining on the lower surface of the circuit board 202 and overcoming the above problem.

[0038] In an example, FIG. 3 is a schematic view of a support provided by an embodiment of the present application. As shown in FIG. 3, the support 203 can be connected to the shell 301 of the electronic device through a plurality of connecting components 2031 extending from the support 203. Specifically, the connecting components 2031 can be fixed on the shell 301 of the electronic device through bolts and bolt holes of the connecting components 2031. In another example, the support 203 can also be bonded or clamped on the shell 301 of the electronic device. The specific connection manner is not limited herein.

[0039] Optionally, when the press detection device receives a press operation, the relative distance between the first electrode 2041 and the second electrode 2042 changes, causing the capacitance of the sensor to change, thereby causing the sensor to generate a press signal. When the relative distance between the first electrode 2041 and the second electrode 2042 changes by different amounts, the capacitance of the sensor changes by different amounts, and the signal intensity of the generated press signal is different (for example, when the press signal is a current signal, the current changes by different amounts, and when the press signal is a voltage signal, the voltage changes by different amounts). When the pressing force of the press operation is large, the relative distance between the first electrode 2041 and the second electrode 2042 changes greatly. Therefore, the signal intensity of the press signal can be used to determine the amount of change of the relative distance between the first electrode 2041 and the second electrode 2042, thereby determining the pressing force of the press operation received by the press detection device. For example, when the intensity of the press signal is large, the pressing force is large, and when the intensity of the press signal is small, the pressing force is small. Thus, the pressure of the press operation can be detected to determine the pressure of the press operation.

[0040] It should be noted that one of the first electrode 2041 and the second electrode 2042 receives a driving signal generated by a control unit on the circuit board 202 as a driving electrode, and the other of the first electrode 2041 and the second electrode 2042 outputs a pressing signal to the control unit on the circuit board as a receiving electrode, so as to realize pressing detection. Preferably, the second electrode 2042 receives the driving signal transmitted by the circuit board 202 as the driving electrode, and the first electrode 2041 generates an induced signal as the receiving electrode. The first electrode 2041 as the receiving electrode has at least the following advantages: 1. The first electrode 2041 is located in a fixed area on the circuit board and will not move or deform, and the electrical characteristics are stable. 2. A ground or shielding layer can be arranged around the receiving electrode to prevent the induced signal from being disturbed by external noise and improve detection sensitivity.

[0041] In the embodiment of the present application, the pressing detection device includes the circuit board 202, the support 203, and a plurality of sensors. When the pressing detection device receives a pressing operation, the relative distance between the first electrode 2041 and the second electrode 2042 in the sensor changes, so that the sensor can generate a pressing signal. The circuit board 202 can transmit the pressing signal to the control unit to realize recognition of the user's pressing operation. Since no physical keys are provided, the area of the touch control area is larger than that of the touchpad with separate key forms in the prior art. Since the pressing position is not limited, the pressing signal can be generated when the pressing detection device receives the pressing operation, so that the user can press anywhere without pressing at a specific position, which improves the user experience. In addition, the lower surface of the circuit board 202 is provided with the first accommodating groove 206 around the area of the sensor, so that the residual flux can be accommodated through the first accommodating groove 206 after the second electrode 2042 is welded to the circuit board, thereby preventing the residual flux from affecting the sensitivity of the pressing detection on the surface of the circuit board 202, and the pressing detection device can have higher sensitivity.

[0042] In a possible implementation, as shown in FIG. 2, the pressing detection device further includes a cover plate 201. The upper surface of the cover plate 201 provides a pressing surface, and the lower surface of the cover plate 201 is attached to the upper surface of the circuit board 202. The upper surface of the cover plate 201 is opposite to the lower surface, and the upper surface of the circuit board 202 is opposite to the lower surface. When the cover plate 201 is pressed, the pressing detection device receives a pressing operation.

[0043] The upper surface of the cover plate 201 provides a pressing surface. In an example, the cover plate 201 can be made of glass. The circuit board 202 is arranged between the sensor and the cover plate 201. When the cover plate 201 is pressed, for example, a user presses the cover plate 201, the pressing detection apparatus receives the pressing operation, the cover plate 201 drives the circuit board 202 to move in the pressure direction and generates relative movement with the support 203. At this time, since the support 203 is fixed on the shell 301 of the electronic device, the circuit board 202 generates displacement relative to the support 203, and since the first electrode 2041 is arranged on the circuit board 202, the second electrode 2042 abuts against the support 203. When the circuit board 202 generates displacement relative to the support 203, the second electrode 2042 deforms to change the relative distance between the first electrode 2041 and the second electrode 2042, so that the capacitance of the sensor changes, thereby generating a pressing signal of the sensor. Thus, the pressing operation of the user can be recognized. In an example, as shown in FIG. 2, the cover plate 201 can be bonded to the circuit board 202 through the first adhesive layer 401.

[0044] Optionally, the circuit board 202 can be a circuit board 202 with touch recognition function. At this time, the cover plate 201 can also provide a touch surface. When a finger slides on the cover plate 201, the circuit board 202 performs touch recognition on the sliding track of the finger to generate a touch recognition signal. The circuit board 202 can transmit the touch recognition signal to a touch recognition chip on the circuit board 202 or a processing unit of the electronic device, so that the electronic device performs a corresponding operation corresponding to the finger sliding, for example, moving a cursor, moving a page, zooming a page, and the like, which will not be described herein.

[0045] In the embodiment of the present application, the pressing detection apparatus further includes the cover plate 201, so that a pressing surface can be provided to the user. When the user presses the cover plate 201, the pressing detection apparatus can receive the pressing operation, so that the pressing operation of the user can be recognized by the pressing detection apparatus. Since the pressing position is not limited, the pressing signal can be generated when the cover plate 201 is pressed. Therefore, compared with the pressing detection scheme in the prior art, the user can press anywhere on the cover plate 201 without pressing at a specific position, thereby improving the user experience.

[0046] FIG. 4 is a schematic view of a circuit board according to an embodiment of the present application. As shown in FIG. 4, the circuit board 202 is provided with an electrically connected area 205 in the form of a ring. The electrically connected area 205 is used to be electrically connected with the second electrode 2042, and the first electrode 2041 is arranged inside the inner edge of the electrically connected area 205. The first accommodating groove 206 is arranged around the outer edge of the electrically connected area 205.

[0047] The electrical connection area 205 on the circuit board 202 can be an annular electrical connection area 205. In an example, as shown in FIG. 4, the electrical connection area 205 can be a circular annular electrical connection area 205. The first electrode 2041 is arranged in the inner edge of the electrical connection area 205, and the second electrode 2042 can be welded on the electrical connection area 205, so that the second electrode 2042 is arranged opposite to the first electrode 2041. It should be understood that the contact area of the annular electrical connection area 205 with the second electrode 2042 is larger than the contact area of other shapes of electrical connection area 205 with the second electrode 2042, for example, the contact area of the circular annular electrical connection area 205 with the second electrode 2042 is larger than the contact area of a point-shaped electrical connection area 205, a rectangular electrical connection area 205 with the same area as the annular electrical connection area 205, and the like. The first accommodating groove 206 is arranged around the outer edge of the electrical connection area 205. That is, as shown in FIG. 4, the first accommodating groove 206 is an annular accommodating groove, and the inner edge of the annular accommodating groove can be in contact with the outer edge of the annular electrical connection area 205.

[0048] In the embodiment of the present application, the annular electrical connection area 205 is arranged on the circuit board 202, the electrical connection area 205 is electrically connected with the second electrode 2042, and the first electrode 2041 is arranged in the inner edge of the electrical connection area 205. The first accommodating groove 206 is arranged around the outer edge of the electrical connection area 205. Since the outer edge of the electrical connection area 205 is surrounded by the first accommodating groove 206, the flux remaining on the lower surface of the circuit board 202 during welding of the second electrode 2042 can be accommodated, so that the flux remaining on the surface of the circuit board 202 does not affect the sensitivity of the pressing detection, and the user experience can be improved.

[0049] FIG. 5 is a schematic view of a first accommodating groove according to an embodiment of the present application. As shown in FIG. 5, the first accommodating groove 206 is an arc-shaped groove, and the inner edge of the first accommodating groove 206 is in contact with the outer edge of the electrical connection area 205.

[0050] FIG. 5 shows an enlarged view of a part of the circuit board 202. As shown in FIG. 5, for the case that the electrical connection area 205 is close to the edge of the circuit board, the first accommodating groove 206 can be an arc-shaped groove, for example, a C-shaped groove as shown in FIG. 5. That is, the first accommodating groove 206 is arranged only around part of the electrical connection area 205, and the inner edge of the arc-shaped groove is in contact with the outer edge of the annular electrical connection area 205.

[0051] In the embodiment of the present application, the first accommodating groove 206 is an arc-shaped groove, and the inner edge of the first accommodating groove 206 is in contact with the outer edge of the electric connection area 205. In this way, the first accommodating groove 206 can be arranged only in the partial area of the outer edge of the electric connection area 205, and can be applicable to the case where the first accommodating groove 206 cannot be arranged in the partial area outside the electric connection area 205 due to the proximity of the edge of the circuit board 202, and the first accommodating groove 206 is an arc-shaped groove, which has a smaller area of the circuit board 202 to be slotted compared with the annular groove shown in FIG. 4, and can reduce the cost.

[0052] FIG. 6 is a schematic view of another first accommodating groove provided in the embodiment of the present application. As shown in FIG. 6, the first accommodating groove 206 includes at least two sub-accommodating grooves 2061, each of which is an arc-shaped groove, the inner edges of the at least two sub-accommodating grooves 2061 are in contact with the outer edge of the electric connection area 205, and the at least two sub-accommodating grooves 2061 are not connected.

[0053] Similar to the principle of the scheme shown in FIG. 5, when the electric connection area 205 is close to the edge of the circuit board 202, the partial area around the electric connection area 205 cannot be slotted, and in this case, the first accommodating groove 206 can be arranged only around the partial electric connection area 205. As shown in FIG. 6, the first accommodating groove 206 can include at least two sub-accommodating grooves 2061, the inner edges of the sub-accommodating grooves 2061 are in contact with the outer edge of the electric connection area 205, and the at least two sub-accommodating grooves 2061 can form a first accommodating groove 206 in a ring-shaped distribution.

[0054] In the embodiment of the present application, the first accommodating groove 206 includes at least two sub-accommodating grooves 2061, each of which is an arc-shaped groove, the inner edges of the at least two sub-accommodating grooves 2061 are in contact with the outer edge of the electric connection area 205, and the at least two sub-accommodating grooves 2061 are not connected, and the two sub-accommodating grooves 2061 can form a first accommodating groove 206 in a ring-shaped distribution, which can be applicable to the case where the first accommodating groove 206 cannot be arranged in the partial area outside the electric connection area 205 due to the proximity of the edge of the circuit board 202, and compared with the first accommodating groove 206 with an arc-shaped groove in the foregoing embodiment, the volume of the first accommodating groove 206 can be increased, so that the first accommodating groove 206 can accommodate more residual flux.

[0055] FIG. 7 is a schematic view of a circuit board including a second accommodating groove provided in the embodiment of the present application. As shown in FIG. 7, the lower surface of the circuit board 202 is provided with a second accommodating groove 207, the second accommodating groove 207 is arranged between the electric connection area 205 and the first electrode 2041, and a first insulating layer 208 is arranged between the second accommodating groove 207 and the first electrode 2041, and the thickness of the first insulating layer 208 is greater than or equal to 0.05 mm in the direction parallel to the circuit board 202.

[0056] The second accommodating groove 207 can be an annular groove, an arc-shaped groove or a groove of other shapes. The second accommodating groove 207 has the same function as the first accommodating groove 206, and can accommodate the flux remaining on the lower surface of the circuit board 202 after the second electrode 2042 is welded to the circuit board 202. It should be understood that the second electrode 2042 is arranged opposite to the first electrode 2041 after the second electrode 2042 is welded to the circuit board 202. During welding, the flux flows into the space between the first electrode 2041 and the second electrode 2042 at high temperature. The second accommodating groove 207 is arranged to accommodate the remaining flux flowing into the space between the first electrode 2041 and the second electrode 2042.

[0057] The first electrode 2041 further includes a first insulating layer 208 arranged on the side surface of the first electrode 2041. In an example, FIG. 8 is an enlarged view of a partial region of a circuit board according to an embodiment of the present application. As shown in FIG. 8, the first insulating layer 208 is arranged between the first electrode 2041 and the second accommodating groove 207 in the horizontal direction. The thickness of the first insulating layer 208 is greater than or equal to 0.05 mm, that is, the length A in FIG. 8 is greater than or equal to 0.05 mm.

[0058] In the embodiment of the present application, the lower surface of the circuit board 202 is provided with the second accommodating groove 207 arranged between the electrically connecting region 205 and the first electrode 2041. Thus, the second accommodating groove 207 can accommodate the remaining flux flowing into the space between the first electrode 2041 and the second electrode 2042, so as to prevent the flux from being located between the first electrode 2041 and the second electrode 2042, which can reduce the signal amount of the sensor after the second electrode 2042 is deformed. The sensitivity of the press detection can be improved. The first insulating layer 208 is arranged between the first electrode 2041 and the second accommodating groove 207, and the thickness of the first insulating layer 208 is greater than or equal to 0.05 mm. Thus, the first electrode 2041 can be prevented from being electrically connected to external components, and the sensor can be prevented from being short-circuited and disabled. The reliability of the press detection device can be improved.

[0059] FIG. 9 is a schematic view of an electrically connecting region according to an embodiment of the present application. As shown in FIG. 9, the electrically connecting region 205 has an arc-shaped sheet structure. The lower surface of the circuit board 202 is provided with a third accommodating groove 209 arranged in the region between the two ends of the electrically connecting region 205. The third accommodating groove 209 is in communication with the first accommodating groove 206.

[0060] The electric connection area 205 can be in an arc-shaped sheet structure, for example, as shown in FIG. 9, the electric connection area 205 is in a C-shaped sheet structure, and a third accommodating groove 209 is arranged on the lower surface of the circuit board 202 between the two ends of the electric connection, for example, the third accommodating groove 209 is arranged in the gap of the C-shaped structure, the third accommodating groove 209 is a groove structure, and the third accommodating groove 209 is in communication with the first accommodating groove 206.

[0061] In the embodiment of the present application, the electric connection area 205 is in an arc-shaped sheet structure, thereby reducing the area of the electric connection area 205 and reducing the cost, and the third accommodating groove 209 is arranged on the lower surface of the circuit board 202 between the two ends of the electric connection, the third accommodating groove 209 is in communication with the first accommodating groove 206, thereby eliminating the need to arrange a groove (for example, the second accommodating groove 207 shown in FIG. 7 in the above embodiment) between the electric connection area 205 and the first electrode 2041, the residual flux between the first electrode 2041 and the second electrode 2042 can flow into the third accommodating groove 209 and then flow into the first accommodating groove 206 through the third accommodating groove 209, and the flux between the first electrode 2041 and the second electrode 2042 can be accommodated while reducing the cost.

[0062] FIG. 10 is a schematic view of another electric connection area provided by the embodiment of the present application, as shown in FIG. 10, the electric connection area 205 includes at least two sub-electric connection areas 2051, each sub-electric connection area 2051 is in an arc-shaped sheet structure, and the at least two sub-electric connection areas 2051 are arranged in a ring shape, and a fourth accommodating groove 210 is arranged on the lower surface of the circuit board 202 between adjacent sub-electric connection areas 2051, and the fourth accommodating groove 210 is in communication with the first accommodating groove 206.

[0063] The electric connection area 205 can also be a split structure, specifically, the electric connection area 205 includes at least two sub-electric connection areas 2051, and the at least two sub-electric connection areas 2051 are arranged in a ring shape, for example, as shown in FIG. 10, four sub-electric connection areas 2051 are arranged in a ring shape to form the electric connection area 205, and each sub-electric connection area 2051 is in an arc-shaped sheet structure.

[0064] The fourth accommodating groove 210 is arranged between adjacent sub-electric connection areas 2051, and each fourth accommodating groove 210 is in communication with the first accommodating groove 206, and the principle of the third accommodating groove 209 in the above embodiment is similar, when the second electrode 2042 is welded to the lower surface of the circuit board 202, the residual flux between the first electrode 2041 and the second electrode 2042 can flow into the fourth accommodating groove 210 and then flow into the first accommodating groove 206 through the fourth accommodating groove 210, thereby accommodating the residual flux between the first electrode 2041 and the second electrode 2042.

[0065] In the embodiment of the present application, the electric connection area 205 comprises at least two sub electric connection areas 2051, the sub electric connection areas 2051 are in the shape of arc-shaped sheet, and the at least two sub electric connection areas 2051 are distributed in a ring shape. Compared with the electric connection area 205 provided in a complete ring shape, the cost is lower, and the area on the lower surface of the circuit board 202 between adjacent sub electric connection areas 2051 is provided with a fourth accommodating groove 210, which is in communication with the first accommodating groove 206. Thus, the residual flux between the electric connection area 205 and the first electrode 2041 (for example, the second accommodating groove 207 shown in FIG. 7 in the above embodiment) can flow into the fourth accommodating groove 210, and then into the first accommodating groove 206 through the fourth accommodating groove 210, so that the flux between the first electrode 2041 and the second electrode 2042 can be accommodated while the cost is reduced.

[0066] FIG. 11 is a schematic view of a second electrode provided in an embodiment of the present application. As shown in FIG. 11, the second electrode 2042 comprises an integrally formed sensing portion 20423, a deformation portion 20422 and a connecting portion 20421. The sensing portion 20423 is in the shape of a circular sheet, the connecting portion 20421 is in the shape of a circular ring, the radius of the sensing portion 20423 is smaller than the inner radius of the connecting portion 20421, the sensing portion 20423 and the connecting portion 20421 are connected through the deformation portion 20422, the sensing portion 20423 and the connecting portion 20421 are in different planes, and the center line of the sensing portion 20423 and the connecting portion 20421 is perpendicular to the circuit board 202. The connecting portion 20421 is welded with the electric connection area 205, and in the direction perpendicular to the circuit board 202, the sensing portion 20423 is arranged opposite to the first electrode 2041. When the pressing detection device receives a pressing operation, the deformation portion 20422 is deformed, the sensing portion 20423 moves towards the first electrode 2041, and the distance between the first electrode 2041 and the sensing portion 20423 changes to make the sensor generate a pressing signal.

[0067] The induction portion 20423 is connected to the connecting portion 20421 through the deformation portion 20422. The induction portion 20423 has a circular plate structure, and the connecting portion 20421 has a circular ring structure. It should be understood that, because there is a gap between the circuit board 202 and the support 203, the connecting portion 20421 and the induction portion 20423 are not in the same plane. Therefore, the connecting portion 20421 can be electrically connected to the circuit board 202, the induction portion 20423 can be in abutment with the support 203, and because the radius of the induction portion 20423 is smaller than the inner radius of the connecting portion 20421, the deformation portion 20422 can have a hollow circular truncated cone structure, as shown in FIG. 2. The large circular face of the circular truncated cone structure of the deformation portion 20422 is connected to the inner circle of the connecting portion 20421, and the small circular face of the circular truncated cone structure of the deformation portion 20422 is connected to the edge of the induction portion 20423. In this way, the induction portion 20423, the deformation portion 20422, and the connecting portion 20421 combine to form a disc-shaped second electrode 2042.

[0068] The line connecting the centers of the induction portion 20423 and the connecting portion 20421 is perpendicular to the circuit board 202, that is, the centers of the induction portion 20423 and the connecting portion 20421 are located on a straight line in a direction perpendicular to the circuit board 202, that is, the projections of the induction portion 20423 and the connecting portion 20421 on the circuit board 202 have the same center in a direction perpendicular to the circuit board 202.

[0069] When the pressing detection device receives a pressing operation, for example, when the upper surface of the cover plate 201 is pressed, the cover plate 201 drives the circuit board 202 and the support 203 to move relatively, so that the relative distance between the circuit board 202 and the support 203 is reduced. At this time, because the induction portion 20423 is in abutment with the support 203, the circuit board 202 drives the connecting portion 20421 to move downward, so that the deformation portion 20422 deforms, and the relative distance between the first electrode 2041 and the induction portion 20423 is reduced. The sensor generates a pressing signal. When the upper surface of the cover plate 201 stops being pressed, the deformation portion 20422 rebounds, and the circuit board 202 and the support 203 move relatively. The relative distance between the circuit board 202 and the support 203 is increased, the relative distance between the first electrode 2041 and the induction portion 20423 is increased, and the relative distance between the first electrode 2041 and the induction portion 20423 returns to the initial state. The sensor stops generating the pressing signal.

[0070] In an example, the second electrode 2042 can be integrally formed by stamping a metal sheet. For example, the second electrode 2042 can be formed by stamping a steel sheet. The material of the second electrode 2042 can be a metal or a metal alloy, such as 304 stainless steel or 301 stainless steel. For example, the material of the second electrode 2042 can be stainless steel + nickel plating, or beryllium copper + nickel plating.

[0071] Optionally, the center line of the annular electric connection region 205 and the connecting portion 20421 is perpendicular to the circuit board 202. In an example, after the connecting portion 20421 is electrically connected with the electric connection region 205 on the circuit board 202, the electric connection region 205 is located inside the connecting portion 20421, that is, the inner circle and the outer circle of the electric connection region 205 are both located between the inner circle and the outer circle of the connecting portion 20421.

[0072] In the embodiment of the present application, the second electrode 2042 includes a deformation portion 20422, a connecting portion 20421 and a sensing portion 20423. The connecting portion 20421 is electrically connected with the circuit board 202. The deformation portion 20422 connects the sensing portion 20423 and the connecting portion 20421. The sensing portion 20423 is in abutment with the support 203. When the pressing detection device receives a pressing operation, the deformation portion 20422 deforms, and the relative distance between the first electrode 2041 and the sensing portion 20423 changes, thereby generating a pressing signal, and the pressing detection is realized. Since the deformation portion 20422 is provided, when the pressing detection device receives a pressing operation, the deformation portion 20422 can deform, the sensor generates a pressing signal, and when the pressing is stopped, the deformation portion 20422 can rebound, the first electrode 2041 and the sensing portion 20423 return to the initial state, the sensor stops generating the pressing signal, and the pressing detection is realized.

[0073] FIG. 12 is a sectional view of a second electrode provided in an embodiment of the present application. As shown in FIG. 12, the deformation portion 20422 includes a first sub-deformation portion 20426 and a second sub-deformation portion 20425. The first end of the first sub-deformation portion 20426 is connected with the connecting portion 20421. The second end of the first sub-deformation portion 20426 is connected with the first end of the second sub-deformation portion 20425. The second end of the second sub-deformation portion 20425 is connected with the sensing portion 20423. The second sub-deformation portion 20425 is arc-shaped in the direction perpendicular to the circuit board 202.

[0074] The deformation portion 20422 can include the first sub-deformation portion 20426 and the second sub-deformation portion 20425. In the direction perpendicular to the circuit board 202, the cross section of the second sub-deformation portion 20425 is arc-shaped. Optionally, as shown in FIG. 12, the cross section of the second sub-deformation portion 20425 is semicircular. The cross section of the first sub-deformation portion 20426 can be a sheet structure.

[0075] In the embodiment of the present application, the deformation portion 20422 includes a first sub-deformation portion 20426 and a second sub-deformation portion 20425, the second sub-deformation portion 20425 is arc-shaped in the direction perpendicular to the circuit board 202, so that the deformation portion 20422 of the second electrode 2042 has a whole folded ring structure, which can reduce the rebound of the stamping forming of the second electrode 2042, and can make the deformation of the second electrode 2042 concentrate in the deformation portion 20422, and the deformation amount is larger, which can improve the signal amount generated by the pressing detection device when it is pressed.

[0076] In a possible implementation, the distance between the first electrode 2041 and the sensing portion 20423 in the direction perpendicular to the circuit board 202 is in the range of [0.1mm, 0.3mm], and preferably, the distance between the first electrode 2041 and the sensing portion 20423 is 0.15±0.1mm.

[0077] In the embodiment of the present application, the distance between the first electrode 2041 and the sensing portion 20423 is in the range of [0.1mm, 0.3mm], so that when the relative distance between the first electrode 2041 and the sensing portion 20423 changes, the signal amount of the pressing signal generated is larger, which prevents the signal amount of the pressing signal from being too small due to the close relative distance between the first electrode 2041 and the sensing portion 20423, so that the control unit cannot recognize the pressing operation, and the sensitivity of the pressing detection device in pressing detection is improved.

[0078] In a possible implementation, when the connecting portion 20421 is electrically connected to the electrical connection area 205 through conductive glue, the difference between the outer radius and the inner radius of the electrical connection area 205 is greater than or equal to 1mm, and when the connecting portion 20421 is electrically connected to the electrical connection area 205 through soldering, the difference between the outer radius and the inner radius of the electrical connection area 205 is greater than or equal to 0.5mm.

[0079] Since the reliability of soldering electrical connection is higher, the width of the electrical connection area 205 can be narrower, and the width of the circular ring of the electrical connection area 205 can be greater than or equal to 0.5mm, that is, the difference between the outer radius and the inner radius is greater than or equal to 0.5mm, and it should be understood that the circular ring-shaped electrical connection area 205 is a standard circular ring, that is, the inner circle and the outer circle share the same center.

[0080] In the embodiment of the present application, the difference between the outer radius and the inner radius of the electrical connection area 205 is greater than or equal to 0.5mm, which ensures the reliability of the electrical connection between the connecting portion 20421 and the electrical connection area 205, prevents the connecting portion 20421 and the electrical connection area 205 from being disconnected under the action of external force, and improves the reliability of the pressing detection device.

[0081] In a possible implementation, the first electrode 2041 is in a circular plate structure, and a line connecting the center of the first electrode 2041 and the center of the electric connection area 205 is perpendicular to the circuit board 202.

[0082] In some other examples, the first electrode 2041 can be in a rectangular shape, a triangular shape, or the like. It should be understood that, since the electric connection area 205 is in a circular ring shape, and the first electrode 2041 is arranged inside the inner circle of the electric connection area 205, the area of the first electrode 2041 in the circular plate structure is greater than that of the first electrode 2041 in other shapes.

[0083] In the embodiment of the present application, the first electrode 2041 is in a circular plate structure, and a line connecting the center of the first electrode 2041 and the center of the electric connection area 205 is perpendicular to the circuit board 202. Compared with the first electrode 2041 in other shapes, the first electrode 2041 in the circular plate structure has a larger area, and thus, compared with the electrode in other shapes, the first electrode 2041 in the circular plate structure can make the sensor generate a larger amount of press signals when performing press detection, thereby improving the sensitivity of press detection.

[0084] In a possible implementation, the area of the first electrode 2041 is greater than or equal to 20 square millimeters.

[0085] In the embodiment of the present application, the area of the first electrode 2041 is greater than or equal to 20 square millimeters, and thus, compared with the first electrode 2041 with a smaller area, the first electrode 2041 can generate a larger amount of signals, thereby improving the sensitivity of press detection.

[0086] In a possible implementation, the slot width of the first accommodating groove 206 is greater than or equal to 0.5 mm, that is, the distance B in FIG. 8 is greater than or equal to 0.5 mm. Preferably, the slot width of the first accommodating groove 206 is 1 mm.

[0087] In the embodiment of the present application, the slot width of the first accommodating groove 206 is greater than or equal to 0.5 mm. By limiting the slot width of the first accommodating groove 206, the capacity of the first accommodating groove 206 can be limited, and thus more residual flux can be accommodated.

[0088] In a possible implementation, the slot width of the second accommodating groove 207 is greater than or equal to 0.25 mm, that is, the distance C in FIG. 8 is greater than or equal to 0.5 mm. Preferably, the slot width of the second accommodating groove 207 is 0.65 mm.

[0089] In the embodiment of the present application, the slot width of the second accommodating groove 207 is greater than or equal to 0.25 mm. By limiting the slot width of the second accommodating groove 207, the capacity of the second accommodating groove 207 can be limited, and thus more residual flux between the first electrode 2041 and the second electrode 2042 can be accommodated.

[0090] In a possible implementation, a difference between the inner radius of the electrically connecting area 205 and the radius of the first electrode 2041 is greater than or equal to 0.3 mm.

[0091] The electrically connecting area 205 is a circular ring-shaped electrically connecting area 205, and a line connecting the center of the electrically connecting area 205 and the first electrode 2041 is perpendicular to the circuit board 202, so the outer circle, the inner circle of the electrically connecting area 205 and the first electrode 2041 share a common center. When the difference between the inner radius of the electrically connecting area 205 and the radius of the first electrode 2041 is greater than or equal to 0.3 mm, that is, the distance between the inner circle of the electrically connecting area 205 and the edge of the first electrode 2041 is greater than or equal to 0.3 mm, the deformed portion 20422 can prevent the first electrode 2041 and the second electrode 2042 from contacting after deformation, and can prevent the electrically connecting area 205 from being electrically connected to the first electrode 2041 when the electrically connecting area 205 is electrically connected to the connecting portion 20421, for example, when the electrically connecting area 205 is electrically connected to the first electrode 2041 by soldering.

[0092] In the embodiment of the present application, the difference between the inner radius of the electrically connecting area 205 and the radius of the first electrode 2041 is greater than or equal to 0.3 mm, so that the deformed portion 20422 can prevent the first electrode 2041 and the second electrode 2042 from contacting after deformation, and can prevent the electrically connecting area 205 from being electrically connected to the first electrode 2041 when the electrically connecting area 205 is electrically connected to the connecting portion 20421, thereby ensuring normal operation of the sensor.

[0093] In a possible implementation, the radius of the sensing portion 20423 is greater than or equal to the radius of the first electrode 2041, and the first electrode 2041 is located within the edge of the projection of the sensing portion 20423 in a direction perpendicular to the circuit board 202.

[0094] The radius of the sensing portion 20423 is greater than or equal to the radius of the first electrode 2041, that is, the area of the sensing portion 20423 is greater than or equal to the area of the first electrode 2041, and in a direction perpendicular to the circuit board 202, the projection of the first electrode 2041 on the circuit board 202 is located within the projection of the sensing portion 20423 on the circuit board 202, that is, in a direction perpendicular to the circuit board 202, the first electrode 2041 is covered by the second electrode 2042.

[0095] Optionally, the line connecting the center of the first electrode 2041 and the sensing portion 20423 is perpendicular to the circuit board 202, and the first electrode 2041 and the sensing portion 20423 have the same area.

[0096] In the embodiment of the present application, the radius of the inductive portion 20423 is greater than or equal to the radius of the first electrode 2041, and the first electrode 2041 is located within the edge of the projection of the inductive portion 20423 in the direction perpendicular to the circuit board 202, so that the entire area of the first electrode 2041 can participate in the pressing detection, a pressing signal with a large signal amount can be generated, and the sensitivity of the pressing detection is improved.

[0097] In a possible implementation, the first electrode 2041 is integrated into the lower surface of the circuit board 202, or the first electrode 2041 is arranged on the lower surface of the circuit board 202.

[0098] FIG. 13 is a schematic view of another pressing detection device provided by the embodiment of the present application. As shown in FIG. 13, the first electrode 2041 can be bonded or welded on the lower surface of the circuit board 202, and the first electrode 2041 and the second electrode 2042 are electrically connected with the circuit board 202. In another implementation, as shown in FIG. 2, the first electrode 2041 can be integrated into the lower surface of the circuit board 202.

[0099] It should be noted that, in the scheme in which the first electrode 2041 is integrated into the lower surface of the circuit board 202 as shown in FIG. 2, the first electrode can be a metal layer in the circuit board, for example, a copper plating process is performed on the circuit board 202 to form the first electrode 2041 at a position corresponding to the first electrode 2041 to be arranged, and in the scheme in which the first electrode 2041 is arranged on the lower surface of the circuit board 202 as shown in FIG. 13, the first electrode 2041 can be bonded or welded with a first electrical connection area on the circuit board 202 corresponding to the first electrode 2041, for example, through conductive glue bonding or through tin soldering electrical connection. In an example, the area of the first electrical connection area corresponding to the first electrode 2041 is less than or equal to the first electrode 2041, and after the first electrode 2041 is electrically connected with the first electrical connection area, the edge of the first electrical connection area is located within the edge of the first electrode 2041, so that the first electrode 2041 covers the first electrical connection area. It should be further noted that the first electrical connection area corresponding to the first electrode 2041 can be located outside the inner circular edge of the annular electrical connection area 205 corresponding to the second electrode 2042. For example, the circular first electrical connection area can have the same center as the electrical connection area 205, and the radius is less than the inner circular radius of the electrical connection area 205, so that the first electrical connection area is arranged outside the inner circular edge of the electrical connection area 205. It should be understood that the first electrical connection area is not in communication with the electrical connection area 205, so that the first electrode 2041 and the second electrode 2042 can be prevented from being electrically connected.

[0100] In the embodiment of the present application, the first electrode 2041 is integrated on the lower surface of the circuit board 202, or the first electrode 2041 is adhered on the lower surface of the circuit board 202. When the first electrode 2041 is integrated on the lower surface of the circuit board 202, the overall thickness of the sensor can be reduced, thereby the thickness of the press detection device can be reduced. When the first electrode 2041 is adhered on the lower surface of the circuit board 202, the first electrode 2041 can be easily replaced when the first electrode 2041 is damaged, and the circuit board 202 does not need to be specially treated, and the cost is low.

[0101] In a possible implementation, the plurality of sensors are distributed close to the edge of the circuit board 202, and the distance between the plurality of sensors and the edge of the circuit board 202 ranges from 10 mm to 15 mm.

[0102] As shown in FIG. 4, the plurality of sensors can be distributed on the edge of the circuit board 202. It should be understood that FIG. 4 is only an example, and the number of sensors can be set as required. Alternatively, at least four sensors can be provided and distributed on the four corners of the circuit board 202. When the number of sensors is greater than 4, the sensors can be uniformly distributed along the four edges of the circuit board 202.

[0103] It should be understood that when the press detection device receives a press operation, for example, when the cover plate 201 is pressed, the displacement of the edge of the circuit board 202 relative to the center of the circuit board 202 is larger. Therefore, the press sensors are distributed on the edge of the circuit board 202, and the distance between the sensors and the edge of the circuit board 202 ranges from 10 mm to 15 mm, so that the press detection can be more sensitive. And there can be a gap between the edge of the circuit board 202, which facilitates the setting of the first accommodating groove 206.

[0104] In the embodiment of the present application, the plurality of sensors are distributed close to the edge of the circuit board 202, and the distance between the plurality of sensors and the edge of the circuit board 202 ranges from 10 mm to 15 mm, so that the sensitivity of the press detection of the press detection device can be improved, and the user can press with a smaller force to detect the press signal, thereby improving the user experience. There can be a gap between the edge of the circuit board 202, which facilitates the setting of the first accommodating groove 206, so that the first accommodating groove 206 can accommodate the residual flux, thereby improving the sensitivity of the press detection.

[0105] In a possible implementation, the induction part 20423 abuts against the support 203 through the silica gel pad 402. In the direction perpendicular to the circuit board 202, the projection of the silica gel pad 402 on the circuit board 202 is located within the edge of the projection of the induction part 20423 on the circuit board 202.

[0106] As shown in FIG. 2 and FIG. 13, the inductive portion 20423 is in abutment with the support 203 through the silica gel pad 402. In an example, one side of the silica gel pad 402 is bonded with the inductive portion 20423, and the other side of the silica gel pad 402 is bonded with the support 203. Optionally, the distance between the edge of the side of the silica gel pad 402 in contact with the inductive portion 20423 and the edge of the inductive portion 20423 is greater than or equal to 5 mm. In an example, the silica gel pad 402 can be a cylindrical silica gel pad 402, the upper surface of the silica gel pad 402 is in contact with the inductive portion 20423, the line connecting the center of the inductive portion 20423 and the upper surface of the silica gel pad 402 is perpendicular to the circuit board 202, and the difference between the radius of the inductive portion 20423 and the radius of the upper surface of the silica gel pad 402 is greater than or equal to 0.25 mm.

[0107] FIG. 14 is an exploded view of a pressing detection device provided in an embodiment of the present application. As shown in FIG. 14, the lower surface of the cover plate 201 is bonded with the upper surface of the circuit board 202 through the first adhesive layer 401. The upper surface of the cover plate 201 is opposite to the lower surface. The sensor includes a first electrode 2041 and a second electrode 2042. The first electrode 2041 and the second electrode 2042 are respectively connected with the lower surface of the circuit board 202. The inductive portion 20423 in the second electrode 2042 is in abutment with the support 203 through the silica gel pad 402. It should be understood that the second electrode 2042 is electrically connected with the circuit board 202 through soldering.

[0108] In the embodiment of the present application, the inductive portion 20423 is in abutment with the support 203 through the silica gel pad 402. Thus, when the pressing detection device receives a pressing operation, the relative distance between the circuit board 202 and the support 203 changes, the silica gel pad 402 is against the inductive portion 20423, the deformed portion 20422 is deformed, the relative distance between the inductive portion 20423 of the first electrode 2041 and the second electrode 2042 changes, and the generation of the pressing signal is realized. In the direction perpendicular to the circuit board 202, the projection of the silica gel pad 402 on the circuit board 202 is located within the edge of the projection of the inductive portion 20423 on the circuit board 202. Therefore, the force can be concentrated on the inductive portion 20423, the deformed portion 20422 in the second electrode 2042 can be successfully deformed, and the normal pressing detection of the pressing detection device is ensured.

[0109] FIG. 15 is a schematic view of a silica gel pad provided in an embodiment of the present application. As shown in FIG. 15, the silica gel pad 402 includes a first adhesive layer 4022, a second adhesive layer 4023, and a silica gel 4021. The silica gel 4021 is arranged between the first adhesive layer 4022 and the second adhesive layer 4023. The silica gel pad 402 is bonded with the inductive portion 20423 and the support 203 through the first adhesive layer 4022 and the second adhesive layer 4023 respectively.

[0110] Optionally, the first adhesive layer 4022 and the second adhesive layer 4023 can be double-sided adhesive tapes, and the Shore hardness of the silica gel 4021 can be A.

[0111] In the embodiment of the present application, the silica gel pad includes the first adhesive layer 4022, the second adhesive layer 4023, and the silica gel 4021. One side of the silica gel 4021 is bonded to the sensing portion 20423 through the first adhesive layer 4022, and the other side of the silica gel 4021 is bonded to the bracket 203 through the second adhesive layer 4023, so that the sensing portion 20423 of the second electrode 2042 abuts against the bracket 203 through the silica gel pad 402. When the pressing detection device receives a pressing operation, the relative distance between the circuit board 202 and the bracket 203 changes, the silica gel pad 402 abuts against the sensing portion 20423, the deformed portion 20422 of the second electrode 2042 is deformed, and the relative distance between the sensing portion 20423 of the first electrode 2041 and the sensing portion 20423 of the second electrode 2042 changes, so that the generation of the pressing signal is realized.

[0112] In a possible implementation, the thickness of the silica gel pad 402 ranges from 0.4 mm to 0.8 mm, the thickness of the silica gel 4021 ranges from 0.3 mm to 0.6 mm, and the thickness of the first adhesive layer 4022 and the second adhesive layer 4023 ranges from 0.05 mm to 0.2 mm. Preferably, the thickness of the silica gel 4021 is 0.4 mm, and the thickness of the first adhesive layer 4022 and the second adhesive layer 4023 is 0.1 mm.

[0113] In the embodiment of the present application, the thickness of the silica gel pad 402 ranges from 0.4 mm to 0.8 mm, the thickness of the silica gel 4021 ranges from 0.3 mm to 0.6 mm, and the thickness of the first adhesive layer 4022 and the second adhesive layer 4023 ranges from 0.05 mm to 0.2 mm. The thickness of each part of the silica gel pad 402 can be set as needed, so that the thickness of the pressing detection device as a whole can be reduced, and at the same time, the deformed portion 20422 of the second electrode 2042 can be deformed when a user presses, and the pressing detection function is realized.

[0114] FIG. 16 is a schematic view of a sensing portion according to an embodiment of the present application. As shown in FIG. 16, the sensing portion 20423 of the second electrode 2042 includes a first through hole 20424, and the edge of the first through hole 20424 is located within the edge of the silica gel pad 402. When the second electrode 2042 is electrically connected to the circuit board 202, the first through hole 20424 can balance the air pressure on both sides of the second electrode 2042 in the direction perpendicular to the circuit board.

[0115] When the second electrode 2042 is electrically connected with the electrical connection area 205 on the circuit board 202, the excess air between the second electrode 2042 and the circuit board 202 can be discharged through the first through hole 20424, so that the air pressure on both sides of the second electrode 2042 in the direction perpendicular to the circuit board 202 is balanced. When the second electrode 2042 is electrically connected with the circuit board 202, the silica gel pad 402 abuts against the support 203, and the silica gel pad 402 covers the first through hole 20424 when abutting, that is, the edge of the first through hole 20424 is located within the edge of the surface of the silica gel pad 402 abutting against the second electrode 2042. The silica gel pad 402 blocks the side of the first through hole 20424 close to the silica gel pad 402, so that a sealed cavity is formed between the second electrode 2042 and the first electrode 2041.

[0116] In the embodiment of the present application, the sensing part 20423 of the second electrode 2042 includes the first through hole 20424, and the edge of the first through hole 20424 is located within the edge of the silica gel pad 402. Thus, when the second electrode 2042 is assembled on the circuit board 202, the air pressure on both sides of the second electrode 2042 in the direction perpendicular to the circuit board 202 can be balanced through the first through hole 20424, so that the electrical connection between the second electrode 2042 and the circuit board 202 is prevented from being affected by air and forming a gap. When the sensing part 20423 of the second electrode 2042 abuts against the support 203 through the silica gel pad 402, the silica gel pad 402 blocks the first through hole 20424, so that a sealed cavity is formed between the second electrode 2042 and the first electrode 2041. This can prevent foreign matter or liquid from entering between the first electrode 2041 and the second electrode 2042, and can improve the dustproof and waterproof capability of the pressing detection device. Thus, the pressing detection device can be used in various use scenarios, and has high applicability.

[0117] In a possible implementation, the diameter of the first through hole 20424 ranges from 0.8 mm to 1.2 mm.

[0118] In the embodiment of the present application, the diameter of the first through hole 20424 ranges from 0.8 mm to 1.2 mm. Thus, when the second electrode 2042 is electrically connected with the circuit board 202, the air pressure on both sides of the second electrode 2042 in the direction perpendicular to the circuit board 202 can be balanced through the first through hole 20424. The first through hole 20424 can be blocked by the silica gel pad 402. Since the diameter of the first through hole 20424 is small, the reliability of the second electrode 2042 is higher than that of the second electrode 2042 with a larger first through hole 20424, and the reliability of the pressing detection device is improved.

[0119] In a possible implementation, the surface of the first electrode 2041 is covered with a second insulating layer.

[0120] In an example, the second insulating layer covering the surface of the first electrode 2041 is insulating ink, and the second insulating layer is arranged between the first electrode 2041 and the second electrode 2042. Specifically, the insulating ink can be applied on the surface of the circuit board 202, and then a hole can be formed on the electrically connected area 205 but not on the position corresponding to the first electrode 2041, so that the surface of the first electrode 2041 is covered with the insulating ink. In some other examples, the second insulating layer can be a second insulating layer of other materials, and the specific type of the second insulating layer is not limited herein. Optionally, the second insulating layer and the first insulating layer 208 can be integrally formed.

[0121] In the embodiment of the present application, the surface of the first electrode 2041 is covered with the second insulating layer, so that when the relative distance between the sensing part 20423 of the second electrode 2042 and the first electrode 2041 changes, the first electrode 2041 and the second electrode 2042 can be prevented from contacting, the sensor can be prevented from short-circuiting, the sensor can normally generate a pressing signal, and the reliability of the pressing detection device is improved.

[0122] In a possible implementation, the second electrode 2042 is made of metal, and the thickness of the second electrode 2042 ranges from 0.1 mm to 0.2 mm.

[0123] In an example, the second electrode 2042 can be made of stainless steel, for example, 304 stainless steel, 301 stainless steel, or the like.

[0124] In the embodiment of the present application, the second electrode 2042 is made of metal, so that after the second electrode 2042 is electrically connected with the circuit board 202, the second electrode 2042 can be electrified. When the relative distance between the electrified second electrode 2042 and the electrified first electrode 2041 changes, the capacitance of the sensor changes to generate a pressing signal, and the thickness of the second electrode 2042 ranges from 0.1 mm to 0.2 mm, so that the strength of the second electrode 2042 can be improved while ensuring that the overall pressing detection device is thin, the connection part 20421 of the second electrode 2042 can be prevented from being broken due to deformation, and the reliability of the pressing detection device is improved.

[0125] FIG. 17 is a schematic view of another circuit board provided in the embodiment of the present application. As shown in FIG. 17, the circuit board 202 is provided with a first via hole 2021 penetrating the circuit board 202, and the first electrode 2041 includes a second through hole 20411 opposite to the first via hole 2021 in the direction perpendicular to the circuit board 202. The first electrode 2041 is electrically connected with the control unit 400 through the electrically connected line accommodated in the first via hole 2021, and the second through hole 20411 can balance the air pressure on both sides of the second electrode 2042 in the direction perpendicular to the circuit board 202 when the second electrode 2042 is connected with the circuit board 202.

[0126] As shown in FIG. 17, the electrical connection area 205 on the circuit board 202 can accommodate the electrical connection line of the control unit 400 through the second via hole 2022, and after the second electrode 2042 is electrically connected with the electrical connection area 205, the second electrode 2042 can be electrically connected with the control unit 400 through the electrical connection line accommodated in the second via hole 2022. It should be understood that FIG. 17 only shows a schematic diagram of a wiring mode, and the specific wiring mode is not limited in the present application. Specifically, the electrical connection area 205 and the first electrode 2041 can be wired through the first accommodating groove 206, the second accommodating groove 207, the third accommodating groove 209 and the fourth accommodating groove 210.

[0127] In the embodiment of the present application, the first via hole 2021 is arranged on the circuit board 202, so that the first electrode 2041 can be electrically connected with the control unit 400 by wiring through the first via hole 2021, realizing the electrical connection of the first electrode 2041. Since the second through hole 20411 is arranged on the first electrode 2041, the first via hole 2021 is opposite to the second through hole 204111, and the first via hole 2021 penetrates the circuit board 202, so that the air pressure on both sides of the second electrode 2042 can be balanced when the second electrode 2042 is electrically connected with the electrical connection area 205 on the circuit board 202. Compared with the scheme of arranging the first through hole 20424 on the sensing part 20423 of the second electrode 2042 in the foregoing embodiment, since the through hole is arranged on the first electrode 2041, the through hole does not need to be arranged on the second electrode 2042, so that the strength of the second electrode 2042 is higher, and the reliability of the pressing detection device is improved.

[0128] In a possible implementation, the diameter of the second through hole 20411 ranges from 0.15 mm to 0.3 mm.

[0129] In the embodiment of the present application, the diameter of the second through hole 20411 ranges from 0.15 mm to 0.3 mm, so that the area of the first electrode 2041 can be ensured to be larger, and the signal strength of the pressing signal can be prevented from being weak due to the smaller area of the first electrode 2041 caused by arranging a larger second through hole 20411.

[0130] In a possible implementation, the thickness of the support 203 is greater than or equal to 0.5 mm.

[0131] The support 203 can be a support 203 made of various materials, including but not limited to plastic, stainless steel, magnesium alloy, aluminum alloy, titanium alloy, etc. In order to ensure the strength of the support 203, the thickness of the support 203 is greater than or equal to 0.5 mm.

[0132] In the embodiment of the present application, the thickness of the support 203 is greater than or equal to 0.5 mm, thereby ensuring the strength of the support 203, so that the support 203 can be fixed on the shell 301 of the electronic device, improving the reliability of the press detection device, and when the press detection device receives a press operation, for example, when the cover plate 201 is pressed, the support 203 with high strength is less likely to change position compared with the support 203 with low strength, and the distance between the circuit board 202 and the support 203 can be changed when the press detection device receives a press operation, thereby generating a press signal, ensuring that the press detection device can normally perform press detection.

[0133] In a possible implementation, the thickness of the solder between the sensor and the circuit board 202 in the direction perpendicular to the circuit board 202 ranges from 30 μm to 70 μm.

[0134] In the embodiment of the present application, the thickness of the solder between the sensor and the circuit board 202 in the direction perpendicular to the circuit board 202 ranges from 30 μm to 70 μm, which can ensure the strength of the electrical connection between the circuit board 202 and the second electrode 2042 while ensuring the thinness of the press detection device, prevent the second electrode 2042 from being disconnected from the circuit board 202, and improve the reliability of the press detection device.

[0135] In a possible implementation, FIG. 18 is a schematic diagram of a press detection device including a feedback unit according to an embodiment of the present application. As shown in FIG. 18, the press detection device further includes a feedback unit 211, which is arranged on the lower surface of the circuit board 202. The control unit can send a feedback signal to the feedback unit 211 after detecting a press operation, and the feedback unit 211 can vibrate the press detection device after receiving the feedback signal, thereby providing vibration feedback to the user's press operation. Optionally, the feedback unit 211 can be a linear vibration actuator (LRA) or a voice coil motor (VCM), and the number of feedback units 211 can be set as needed.

[0136] In the embodiment of the present application, the press detection device further includes a feedback unit 211. When a user's press is detected, the control unit can send a feedback signal to the feedback unit 211, so that the feedback unit 211 drives the circuit board 202 to vibrate, thereby providing vibration feedback to the user's press operation, simulating the press feeling of a physical press key, and informing the user that a press operation has been detected, thereby improving the user experience.

[0137] The embodiment of the present application also provides an electronic device including a shell 301 and a press detection device according to any of the above embodiments, and the support 203 in the press detection device is fixed on the shell 301.

[0138] In an example, the bracket 203 can be clamped or thermally glued on the shell 301 of the electronic device, and in another example, the bracket 203 can be fixed on the shell 301 of the electronic device by bolts, which are not limited herein.

[0139] In a possible implementation, the electronic device includes a notebook computer, and the bracket 203 in the pressing detection apparatus is fixed on a C shell of the notebook computer.

[0140] FIG. 19 is a cross-sectional view of an electronic device according to an embodiment of the present application. As shown in FIG. 19, the bracket 203 in the pressing detection apparatus is fixed on the C shell of the notebook computer by bolts.

[0141] In the embodiment of the present application, the bracket 203 in the pressing detection apparatus can be fixed on the C shell of the notebook computer, so that the bracket 203 can be fixed on the shell 301 of the electronic device, and when the pressing detection apparatus receives a pressing operation, for example, when the circuit board 202 is pressed, the second electrode 2042 on the bracket 203 can be deformed to make the sensor 204 generate a pressing signal, so that the detection of the pressing operation is realized.

[0142] It should be understood that each of the embodiments in the specification is described in a progressive manner, and the same or similar parts of each embodiment can be referred to each other, and each embodiment mainly describes the difference from other embodiments. Especially, for the method embodiment, since it is basically similar to the method described in the device and system embodiment, the description is relatively simple, and the related parts can refer to the part of the description of other embodiments.

[0143] It should be understood that the above describes specific embodiments of the present application. Other embodiments are within the scope of the claims. In some cases, the actions or steps recited in the claims can be performed in an order different than the order in which the actions or steps are recited in the embodiments, and still achieve the desired result. In addition, the processes depicted in the figures do not necessarily require the particular order shown, or sequential order, to achieve the desired results. In certain implementations, multitasking and parallel processing can be advantageous or possible.

[0144] It should be understood that the element described in the singular form or only shown in the figure in the singular form does not mean that the number of the element is limited to one. In addition, the modules or elements described or shown as separated in the text can be combined into a single module or element, and the modules or elements described or shown as single in the text can be split into multiple modules or elements.

[0145] It is also to be understood that the terminology and phraseology employed herein is for the purpose of description and the specification one or more embodiments of the present application should not be limited to the terms used. The use of such terms and expressions does not therefore admit of any limitation on the scope of the application, it being recognized that the various modifications are possible to the embodiments in view of the teachings and adversities made and that modifications are to be included within the scope of the present application. Other modifications, variations, and alternatives are also possible. Accordingly, the claims should be regarded as encompassing all such equivalents.

Claims

1. A pressure detection device, applied to electronic devices, characterized in that, include: Circuit board, bracket, and multiple sensors; The sensor includes a first electrode and a second electrode. The first electrode is disposed on the lower surface of the circuit board, and the second electrode is connected to the lower surface of the circuit board. A first receiving groove is provided on the lower surface of the circuit board around the area of ​​the sensor. The first receiving groove is used to contain flux residues left when the second electrode is soldered onto the circuit board. The bracket is fixed to the housing of the electronic device, and the bracket abuts against the second electrode; When the pressure detection device receives a pressure operation, the second electrode deforms, and the distance between the first electrode and the second electrode changes, causing the sensor to generate a pressure signal. The circuit board is used to transmit the pressing signal to the control unit, and to enable the control unit to perform pressing detection based on the pressing signal.

2. The pressure detection device according to claim 1, characterized in that, The circuit board has an annular electrical connection area, which is electrically connected to the second electrode. The first electrode is located within the inner edge of the electrical connection area, and the first receiving groove is located around the outer edge of the electrical connection area.

3. The pressure detection device according to claim 2, characterized in that, The first receiving groove is an arc-shaped groove, and the inner edge of the first receiving groove contacts the outer edge of the electrical connection area.

4. The pressure detection device according to claim 2, characterized in that, The first receiving groove includes at least two sub-receiving grooves, each of which is an arc-shaped groove. The inner edges of the at least two sub-receiving grooves are in contact with the outer edge of the electrical connection area, and the at least two sub-receiving grooves are not connected to each other.

5. The pressure detection device according to any one of claims 2-4, characterized in that, A second receiving groove is provided on the lower surface of the circuit board. The second receiving groove is disposed between the electrical connection area and the first electrode, and a first insulating layer is disposed between the second receiving groove and the first electrode. In the direction parallel to the circuit board, the thickness of the first insulating layer is greater than or equal to 0.05 mm.

6. The pressure detection device according to claim 2, characterized in that, The electrical connection area is an arc-shaped sheet structure. A third receiving groove is provided on the lower surface of the circuit board in the area between the two ends of the electrical connection area. The third receiving groove is connected to the first receiving groove.

7. The pressure detection device according to claim 2, characterized in that, The electrical connection area includes at least two sub-electrical connection areas, each sub-electrical connection area having an arc-shaped sheet structure. The at least two sub-electrical connection areas are arranged in a ring. A fourth receiving groove is provided on the lower surface of the circuit board in the area between adjacent sub-electrical connection areas, and the fourth receiving groove is connected to the first receiving groove.

8. The pressure detection device according to claim 2, characterized in that, The second electrode includes an integrally formed sensing part, a deformation part, and a connecting part; The sensing part is a circular plate structure, and the connecting part is a circular ring structure. The radius of the sensing part is smaller than the inner circle radius of the connecting part. The sensing part and the connecting part are connected through the deformation part. The sensing part and the connecting part are on different planes, and the center line connecting the sensing part and the connecting part is perpendicular to the circuit board. The connecting portion is welded to the electrical connection area, and the sensing portion is disposed opposite to the first electrode in a direction perpendicular to the circuit board; When the pressure detection device receives a pressure operation, the deformation part deforms, the sensing part moves towards the first electrode, and the change in distance between the first electrode and the sensing part causes the sensor to generate the pressure signal.

9. The pressure detection device according to claim 8, characterized in that, The deformation part includes a first sub-deformation part and a second sub-deformation part. The first end of the first sub-deformation part is connected to the connecting part, the second end of the first sub-deformation part is connected to the first end of the second sub-deformation part, and the second end of the second sub-deformation part is connected to the sensing part. The second sub-deformation part has an arc-shaped cross-section in the direction perpendicular to the circuit board.

10. The pressure detection device according to claim 8, characterized in that, In the direction perpendicular to the circuit board, the distance between the first electrode and the sensing part ranges from [0.1mm, 0.3mm].

11. The pressure detection device according to claim 8, characterized in that, The difference between the outer radius and the inner radius of the electrical connection area is greater than or equal to 1 mm; the difference between the outer radius and the inner radius of the connection part is in the range of [1 mm, 1.6 mm], and is less than the difference between the outer radius and the inner radius of the electrical connection area.

12. The pressure detection device according to claim 2, characterized in that, The first electrode has a circular plate structure, and the line connecting the center of the first electrode and the electrical connection area is perpendicular to the circuit board.

13. The pressure detection device according to claim 12, characterized in that, The area of ​​the first electrode is greater than or equal to 20 square millimeters.

14. The pressure detection device according to any one of claims 1-4, characterized in that, The width of the first receiving groove is greater than or equal to 0.5 mm.

15. The pressure detection device according to claim 5, characterized in that, The width of the second receiving groove is greater than or equal to 0.25 mm.

16. The pressure detection device according to claim 2, characterized in that, The difference between the inner radius of the electrical connection area and the radius of the first electrode is greater than or equal to 0.3 mm.

17. The pressure detection device according to claim 1, characterized in that, The first electrode is integrated into the lower surface of the circuit board, or the first electrode is disposed on the lower surface of the circuit board.

18. The pressure detection device according to claim 1, characterized in that, The plurality of sensors are distributed close to the edge of the circuit board, and the distance between the plurality of sensors and the edge of the circuit board ranges from [10mm, 15mm].

19. The pressure detection device according to claim 8, characterized in that, The sensing element abuts against the bracket via a silicone pad. In a direction perpendicular to the circuit board, the projection of the silicone pad on the circuit board is located within the edge of the projection of the sensing element on the circuit board.

20. The pressure detection device according to claim 19, characterized in that, The silicone pad includes a first adhesive layer, a second adhesive layer, and silicone. The silicone is disposed between the first adhesive layer and the second adhesive layer. The silicone pad is bonded to the sensing part and the bracket through the first adhesive layer and the second adhesive layer, respectively.

21. The pressure detection device according to claim 20, characterized in that, The thickness range of the silicone pad is [0.4mm, 0.8mm], the thickness range of the silicone is [0.3mm, 0.6mm], and the thickness range of the first adhesive layer and the second adhesive layer is [0.05mm, 0.2mm].

22. The pressure detection device according to claim 19, characterized in that, The sensing part includes a first through hole, and the edge of the first through hole is located inside the edge of the silicone pad; The first through hole is used to balance the air pressure on both sides of the second electrode in a direction perpendicular to the circuit board when the second electrode is electrically connected to the circuit board.

23. The pressure detection device according to claim 22, characterized in that, The diameter of the first through hole ranges from [0.8 mm to 1.2 mm].

24. The pressure detection device according to claim 1, characterized in that, The surface of the first electrode is covered with a second insulating layer.

25. The pressure detection device according to claim 1, characterized in that, The second electrode is made of metal and has a thickness ranging from 0.1 mm to 0.2 mm.

26. The pressure detection device according to claim 1, characterized in that, The circuit board is provided with a through hole that penetrates the circuit board. The first electrode includes a second through hole, and in a direction perpendicular to the circuit board, the second through hole is opposite to the through hole. The first electrode is electrically connected to the control unit through an electrical connection wire housed in the via; The second through hole is used to balance the air pressure on both sides of the second electrode in a direction perpendicular to the circuit board when the second electrode is connected to the circuit board.

27. The pressure detection device according to claim 26, characterized in that, The diameter of the second through hole ranges from [0.15mm, 0.3mm].

28. The pressure detection device according to claim 1, characterized in that, The thickness of the solder between the sensor and the circuit board in the direction perpendicular to the circuit board ranges from 30μm to 70μm.

29. An electronic device, characterized in that, Includes a housing and a pressure detection device as described in any one of claims 1-28; The bracket in the pressure detection device is fixed to the outer shell.

30. The device according to claim 29, characterized in that, The electronic device includes: a laptop computer; The bracket in the pressure detection device is fixed to the C-shell of the laptop computer.

Images