Garment refrigerating device

Abstract

The invention discloses a garment refrigerating device, and belongs to the technical field of garment refrigeration, the garment refrigerating device comprises a garment body and a cooling structure arranged on the garment body and used for active refrigeration and cooling in the garment; the cooling structure comprises a front refrigeration module arranged on the two sides of the chest of the garment body and a rear refrigeration module arranged on the back of the garment body. According to the garment refrigerating device, a global refrigerating layout is formed through the front refrigerating module and the rear refrigerating module, cooling is uniform, the temperature difference between the front body feeling and the rear body feeling of the human body can be prevented from being too large, the refrigerating efficiency and the wearing comfort are effectively improved, meanwhile, a cold source is directly provided through the front semiconductor refrigerating sheet and the rear semiconductor refrigerating sheet, and an airflow cold-carrying direct blowing mode is adopted; the cooling effect is stronger and more durable, the garment body made of the self-heat-dissipation fabric is matched, external heat is blocked, cooling capacity loss is reduced, the endurance is prolonged while the refrigeration efficiency is improved, and comfortable, safe and stable personal heat management experience is provided for a wearer.

Description

Technical Field

[0001] This application relates to the field of clothing refrigeration technology, specifically a clothing refrigeration device. Background Technology

[0002] With global warming and the increasing number of high-temperature work scenarios, personal thermal management and wearable cooling devices have become key equipment for ensuring thermal comfort, improving work efficiency, and preventing heatstroke and heat exhaustion in outdoor work, industrial production, commuting, sports and fitness, and medical and health care scenarios.

[0003] Traditional air-conditioned clothing often uses external air intake, passive air cooling, or a single back cooling module structure. It mainly relies on the inflow of external air and the cooperation of a fan to achieve evaporative heat dissipation. The cooling effect depends on the ambient temperature and cannot actively generate a cold source. In high temperature and high humidity environments, the cooling efficiency is low. The single back cooling module structure leaves no cooling configuration in the chest area, which can easily cause a large temperature difference between the front and back of the body, uneven cooling, and poor overall cooling coverage and comfort. Furthermore, a Chinese invention patent with publication number CN115336820A discloses an air-conditioning garment. This garment utilizes cooling and air-blowing modules containing refrigerant and a cooling fan, located at the front and back, to cool hot air before blowing it into the garment, achieving rapid cooling of the skin. While this garment employs cooling modules at both the front and back, it relies on passive cooling through the refrigerant. However, the refrigerant's temperature rises rapidly after absorbing heat, making sustained and stable cooling impossible. In high-temperature environments, the cooling effect diminishes quickly, requiring repeated freezing or replacement. This makes it unsuitable for the continuous cooling needs of outdoor, factory, production line, and medical settings requiring prolonged exposure to high temperatures. Additionally, existing air-conditioning garments generally use conventional clothing fabrics lacking active heat dissipation and insulation capabilities. Direct sunlight and external heat are easily conducted into the garment, resulting in high power consumption and significant loss of cooling capacity, making it difficult to maintain a stable and comfortable microclimate inside the garment.

[0004] Therefore, this application provides a garment cooling device to solve the above-mentioned problems. Summary of the Invention

[0005] This application provides a clothing cooling device, which aims to solve the problems mentioned in the background art, such as the inability to actively and continuously cool clothing, uneven cooling, large loss of cooling capacity, and inability to adapt to long-term high-temperature work.

[0006] To achieve the above objectives, this application provides the following technical solution: a clothing cooling device, comprising a clothing body and a cooling structure disposed on the clothing body for active cooling and temperature reduction inside the clothing; The cooling structure includes a front cooling module disposed on both sides of the chest of the garment body and a rear cooling module disposed on the back of the garment body. The front cooling module includes a front encapsulation component disposed on the chest of the garment body, a front semiconductor cooling chip disposed within the front encapsulation component, and a dual-fan airflow assembly disposed on the front encapsulation component for driving airflow through the front semiconductor cooling chip for in-garment air circulation and external heat dissipation. The rear cooling module includes a rear encapsulation component located at the back of the garment body, a rear semiconductor cooling chip located within the rear encapsulation component, and a single-fan airflow assembly located within the rear encapsulation component for driving airflow through the rear semiconductor cooling chip to deliver air into the garment and dissipate heat from the outside. Both the front and rear semiconductor refrigeration chips are provided with at least two sets; The garment itself is made of self-heating fabric. Independent internal cooling circulation within the garment is achieved through a front encapsulation component, a front semiconductor cooling chip, and a dual-fan airflow assembly. Continuous cooling airflow to the back is achieved through a rear encapsulation component, a rear semiconductor cooling chip, and a single-fan airflow assembly, forming a comprehensive cooling layout. This results in more even cooling, prevents large temperature differences between the front and back of the body, and enhances cooling efficiency and comfort consistency. Simultaneously, the front and rear semiconductor cooling chips directly provide a cold source, utilizing airflow to carry the cold directly for cooling. Compared to traditional evaporative cooling methods, this provides a more powerful and lasting cooling effect, thus protecting against the risk of heat injury in high-temperature environments and providing the wearer with a comfortable and safe personal thermal management experience. Furthermore, the self-heating fabric effectively blocks external heat and reduces cold loss, extending the device's battery life while improving cooling efficiency.

[0007] Preferably, in order to achieve the installation, use, shock absorption, and quiet operation of the front cooling module, a disassembly piece for accommodating the front cooling module is fastened to the front of the garment body. The disassembly piece is a silicone sleeve or a rubber sleeve. Since the silicone sleeve or rubber sleeve has flexible clamping and cushioning shock absorption characteristics, by accommodating the front cooling module and fastening it to the garment body, the installation of the front cooling module can be convenient, and there is no foreign body sensation during installation and wearing. Shock absorption and quiet operation improve the user experience.

[0008] Preferably, to achieve isolation between hot and cold airflows, the front packaging component includes an inner shell disposed within the disassembly component and an outer shell disposed within the disassembly component and fixedly connected to one side of the bottom of the inner shell. The front thermoelectric cooler penetrates through the inner shell and the outer shell and is fixedly installed within them. The cold end of the front thermoelectric cooler is located within the inner shell, and the hot end is located within the outer shell. The inner shell forms an internal cold airflow channel, and the outer shell forms an external heat dissipation channel. The separate arrangement of the hot and cold ends of the front thermoelectric cooler blocks heat conduction, making the hot and cold air channels completely independent, resulting in higher cooling efficiency and avoiding a decrease in cooling effect due to hot and cold air mixing.

[0009] Preferably, to achieve both internal cooling and external heat dissipation, the dual-fan airflow assembly includes a cold-end fan fixedly installed inside the inner shell and located above the cold end of the front semiconductor cooling chip for drawing air from inside the garment body; an internal air inlet located on the side of the inner shell away from the outer shell and on the side of the cold-end fan for communicating with the interior of the garment body; an internal air outlet located on the inner shell and below the cold end of the front semiconductor cooling chip for delivering cold air into the garment body; and an external air inlet fixedly installed inside the outer shell and located below the hot end of the front semiconductor cooling chip for drawing air from outside. The garment includes a hot-end fan, an external air inlet located on the side of the outer shell away from the inner shell and on the side of the hot-end fan for communication with the outside, and an external air outlet located on the outer shell above the hot end of the front semiconductor cooling chip for dissipating heat to the outside. By drawing air from inside the garment through the internal air inlet using the cold-end fan, cooling it at the cold end of the front semiconductor cooling chip, and then sending it into the garment through the internal air outlet, while the hot-end fan draws outside air through the external air inlet, carrying away the heat from the hot end of the front semiconductor cooling chip and dissipating it through the external air outlet, a closed-loop internal cooling system can be achieved inside the garment, without introducing external hot air, resulting in faster and more stable cooling, and smooth heat dissipation to ensure continuous cooling.

[0010] Preferably, in order to support the rear cooling module, a pocket is provided at the back of the garment body for accommodating the front cooling module; by providing a pocket, the rear cooling module can be wrapped and limited to prevent it from shifting or falling off during wear, making the installation of the rear cooling module simple and not affecting the overall aesthetics and comfort of the garment.

[0011] Preferably, in order to facilitate the integration of the rear thermoelectric cooler and the single-fan airflow assembly, the rear package includes a housing disposed within the pocket, and the rear thermoelectric cooler is fixedly installed within the housing; the housing can provide stable support and a regular airflow channel for the rear thermoelectric cooler and the single-fan airflow assembly, making it easy to fit the whole package into the pocket for integrated wear.

[0012] Preferably, to achieve back-side cooling and heat dissipation, the single-fan airflow assembly includes a circulating fan fixedly installed inside the housing and located below the rear semiconductor cooling chip for drawing in external air; a hot channel and a cold channel located inside the housing above the circulating fan for communicating with the hot and cold ends of the rear semiconductor cooling chip, respectively; a main air inlet located on the housing and next to the circulating fan for communicating with the outside; a hot air outlet located on the housing and above the hot end of the rear semiconductor cooling chip for dissipating heat; and a cold air outlet located on the housing and above the cold end of the rear semiconductor cooling chip for delivering cold air into the garment. By having the circulating fan draw in air through the main air inlet and deliver it into the hot and cold channels, hot air is discharged through the hot air outlet, and cold air is delivered into the garment through the cold air outlet, achieving uniform back-side airflow and simultaneous cooling and heat dissipation.

[0013] Preferably, in order to improve the heat dissipation efficiency of the hot ends of the front and rear thermoelectric coolers, heat sinks are fixedly installed on the hot ends of both the front and rear thermoelectric coolers. By setting heat sinks, the heat exchange area of ​​the hot ends can be increased, heat can be dissipated quickly, the temperature difference loss between the hot and cold ends of the thermoelectric cooler can be reduced, and the thermoelectric cooler can operate more stably and have a longer lifespan.

[0014] Preferably, in order to reduce heat transfer and reduce cooling loss, the inner shell, outer shell and inner wall of the casing are all filled with heat insulation cotton. By setting heat insulation cotton, heat transfer between the inner shell, outer shell and casing can be blocked, and the cold air inside the clothing can be prevented from being offset by external heat, resulting in lower cooling energy consumption, higher cooling efficiency, faster cooling inside the clothing and longer heat preservation.

[0015] Preferably, in order to enhance the overall air circulation inside the garment and help improve the cooling sensation, a ventilation fan is fixedly installed on the front side of the garment body, and the ventilation fan is located below the front packaging component; by setting the ventilation fan, the airflow circulation inside the garment body can be accelerated, and the cold air coverage range can be expanded in conjunction with the front cooling module and the rear cooling module, thereby further improving the cooling comfort and heat dissipation efficiency.

[0016] The clothing cooling device achieves independent internal circulation cooling inside the garment through the front encapsulation component, the front semiconductor cooling chip and the dual fan airflow assembly, and achieves continuous cooling and air delivery to the back through the rear encapsulation component, the rear semiconductor cooling chip and the single fan airflow assembly. This can form a full-area cooling layout, making the cooling more uniform, preventing large temperature differences between the front and back of the body, and enhancing the cooling efficiency and the consistency of body feeling. The clothing cooling device provides a cold source directly through the front semiconductor cooling chip and the rear semiconductor cooling chip, and uses airflow to carry the cold directly to lower the temperature. Compared with the traditional evaporative cooling method, the cooling effect is more powerful and lasting, thereby protecting against the risk of heat injury in high-temperature environments and providing wearers with a comfortable and safe personal thermal management experience. The garment cooling device uses a self-heating fabric for the garment body, which can effectively block external heat and reduce cold loss, thereby improving cooling efficiency and extending the device's operating time. Attached Figure Description

[0017] Figure 1 A schematic diagram of the structure of the chest area of ​​a garment in a garment refrigeration device; Figure 2 A schematic diagram of the structure of the back of a garment in a garment refrigeration device; Figure 3 This is a schematic diagram of the structure of the front cooling module in a clothing refrigeration device; Figure 4 A cross-sectional structural schematic diagram of the front cooling module in a garment refrigeration device; Figure 5 This is a schematic diagram of the structure of an outlet air vent in a clothing refrigeration device. Figure 6 This is a partial structural diagram of the external air inlet in a clothing refrigeration device. Figure 7 This is a schematic diagram of the structure of a post-cooling module in a garment refrigeration device; Figure 8 A cross-sectional structural schematic diagram of the post-cooling module in a garment refrigeration device; Figure 9 This is an exploded structural diagram of the post-cooling module in a clothing refrigeration device.

[0018] In the picture: 1. Clothing body; 2. Cooling structure; 21. Front package; 211. Inner shell; 212. Outer shell; 22. Front thermoelectric cooler; 23. Dual-fan airflow assembly; 231. Cold end fan; 232. Inner air inlet; 233. Inner air outlet; 234. Hot end fan; 235. Outer air inlet; 236. Outer air outlet; 24. Rear package; 241. Housing; 25. Rear thermoelectric cooler; 26. Single-fan airflow assembly; 261. Circulating fan; 262. Hot aisle; 263. Cold aisle; 264. Main air inlet; 265. Hot air outlet; 266. Cold air outlet; 3. Pocket; 4. Disassembled parts; 5. Ventilation fan. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] This embodiment provides a clothing cooling device, such as... Figures 1-9 As shown, the garment cooling device includes a garment body 1 and a cooling structure 2 disposed on the garment body 1 for active cooling inside the garment. The cooling structure 2 includes a front cooling module disposed on both sides of the chest of the garment body 1 and a rear cooling module disposed on the back of the garment body 1. The front cooling module includes a front encapsulation component 21 disposed on the chest of the garment body 1, a front semiconductor cooling chip 22 disposed within the front encapsulation component 21, and a dual-fan airflow assembly 23 disposed on the front encapsulation component 21 for driving airflow through the front semiconductor cooling chip 22 for air circulation inside the garment and external heat dissipation. The rear cooling module includes a rear encapsulation component 24 disposed at the back of the garment body 1, a rear semiconductor cooling chip 25 disposed within the rear encapsulation component 24, and a single-fan airflow assembly 26 disposed within the rear encapsulation component 24 for driving airflow through the rear semiconductor cooling chip 25 for air circulation inside the garment and external heat dissipation. At least two sets of both the front semiconductor cooling chip 22 and the rear semiconductor cooling chip 25 are provided. The garment body 1 is made of self-heating fabric.

[0021] It should be added that the inner layer of the garment body 1 is a closed layer, which allows the blown-in cold air to circulate effectively inside, thereby gradually reducing the temperature inside the garment and ensuring effective air utilization. The clothing cooling device also includes a control unit, a high-precision biosensor installed inside the clothing body 1 for real-time acquisition of the wearer's surface temperature and humidity signals, and a multi-level adjustment switch installed on the clothing body 1 for manual graded control. The high-precision biosensor transmits the acquired surface temperature and humidity data to the intelligent control unit. The control unit dynamically adjusts the cooling power of the front semiconductor cooling chip 22 and the rear semiconductor cooling chip 25, as well as the rotation speed of the dual-fan airflow assembly 23 and the single-fan airflow assembly 26, through AI algorithms to achieve on-demand active temperature control of the microclimate inside the clothing. The entire device is powered by a power bank, providing stable power to the front semiconductor cooling chip 22, the rear semiconductor cooling chip 25, the dual-fan airflow assembly 23, the single-fan airflow assembly 26, the high-precision biosensor, and the control unit.

[0022] In use, the garment body 1 serves as the overall supporting foundation. It is made of self-heating fabric with an inner sealing layer, effectively blocking external heat transfer and creating a closed-loop space within the garment to ensure the retention and circulation of cool air. After the device is activated, the cooling structure 2 begins operation. The front cooling modules located on both sides of the chest of the garment body 1 and the rear cooling module on the back work together. When the front semiconductor cooling chip 22 in the front cooling module is powered on, it achieves cooling on one side and heating on the other based on the Peltier effect. The dual-fan airflow assembly 23 operates synchronously, drawing air from inside the garment into the front encapsulation 21 and flowing through the cooling side of the front semiconductor cooling chip 22 to form cool air, which is then sent into the garment body 1 to achieve internal circulation airflow. Simultaneously, it dissipates the heat generated on the heating side of the front semiconductor cooling chip 22 to the outside. Similarly, the rear semiconductor cooling chip 25 in the rear cooling module achieves both cooling and heating based on the Peltier effect. The single-fan airflow assembly 26 drives the airflow through the rear semiconductor cooling chip 25 to complete the cooling of the back. For both heat dissipation and external cooling, at least two sets of front and rear semiconductor cooling chips 22 and 25 are provided to improve cooling capacity and uniformity. During this process, a high-precision biosensor installed inside the garment body 1 collects the wearer's surface temperature and humidity signals in real time and transmits the data to the control unit. The control unit analyzes and processes the data through a built-in AI algorithm and dynamically adjusts the cooling power of the front and rear semiconductor cooling chips 22 and the rotation speed of the dual-fan airflow assembly 23 and the single-fan airflow assembly 26 to achieve on-demand, precise, and active temperature control of the microclimate inside the garment. At the same time, a multi-level adjustment switch on the garment body 1 allows the wearer to manually adjust the cooling power and fan speed in stages to meet different scenarios and comfort needs. Through the sealed layer of the garment body 1 and the cooling structure 2, the cold air is efficiently circulated inside the garment, continuously reducing the temperature inside the garment. Combined with the heat insulation and heat dissipation effect of the self-heating fabric of the garment body 1, a stable and efficient cooling effect can be achieved.

[0023] In order to achieve the installation, use and shock absorption of the front cooling module, the front of the garment body 1 is fastened with a disassembly part 4 for accommodating the front cooling module. The disassembly part 4 is a silicone sleeve or a rubber sleeve. Since the silicone sleeve or rubber sleeve has flexible clamping and cushioning shock absorption characteristics, by accommodating the front cooling module and fastening it to the garment body 1, the front cooling module can be installed conveniently and without foreign body sensation when installed and worn. The shock absorption and noise reduction improve the user experience. The disassembly part 4 is fastened to the pre-reserved fastener or buttonhole on the garment body 1 by the fastener, so as to achieve detachable fixation, which is firm and easy to install and remove.

[0024] To achieve isolation between hot and cold airflows, the front package 21 includes an inner shell 211 disposed within the disassembly component 4 and an outer shell 212 disposed within the disassembly component 4 and fixedly connected to one side of the bottom of the inner shell 211. The front thermoelectric cooler 22 passes through the inner shell 211 and the outer shell 212 and is fixedly installed within them. The cold end of the front thermoelectric cooler 22 is located within the inner shell 211, and the hot end is located within the outer shell 212. The inner shell 211 forms an internal cold airflow channel, and the outer shell 212 forms an external heat dissipation channel. The separate arrangement of the hot and cold ends of the front thermoelectric cooler 22 blocks heat conduction, making the hot and cold air channels completely independent, resulting in higher cooling efficiency and avoiding a decrease in cooling effect due to hot and cold air mixing.

[0025] Specifically, the dual-fan airflow assembly 23 includes a cold-end fan 231 fixedly installed inside the inner shell 211 and located above the cold end of the front semiconductor cooling chip 22 for drawing air from inside the garment body 1; an inner air inlet 232 located on the side of the inner shell 211 away from the outer shell 212 and on the side of the cold-end fan 231 for communicating with the inside of the garment body 1; an inner air outlet 233 located on the inner shell 211 and below the cold end of the front semiconductor cooling chip 22 for delivering cold air into the garment body 1; a hot-end fan 234 fixedly installed inside the outer shell 212 and located below the hot end of the front semiconductor cooling chip 22 for drawing air from outside; an outer air inlet 235 located on the side of the outer shell 212 away from the inner shell 211 and on the side of the hot-end fan 234 for communicating with the outside; and an outer air outlet 236 located on the outer shell 212 and above the hot end of the front semiconductor cooling chip 22 for dissipating heat to the outside.

[0026] When cooling is required, the dual-fan airflow assembly 23 operates synchronously. The cold-end fan 231, located inside the inner shell 211 and above the cold end of the front semiconductor cooling chip 22, starts and draws air from inside the garment body 1 through the inner air inlet 232 on the inner shell 211. The airflow is cooled as it passes the cold end of the front semiconductor cooling chip 22, and then is sent into the garment body 1 through the inner air outlet 233 on the inner shell 211, forming a closed-loop internal cooling airflow inside the garment. Simultaneously, the fan 231, located inside the outer shell 212 and above the cold end of the front semiconductor cooling chip 22, operates in tandem. When the hot end fan 234 below the hot end is started, it draws in external air through the external air inlet 235 on the outer shell 212. The external airflow carries away heat after passing through the hot end of the front semiconductor cooling chip 22, and is discharged to the outside through the external air outlet 236 on the outer shell 212, completing the hot end heat dissipation cycle. Through the separation and cooperation between the inner shell 211 and the outer shell 212, and the independent driving of the cold end fan 231 and the hot end fan 234, the internal circulation cooling of the garment body 1 and the heat dissipation of the front semiconductor cooling chip 22 can be realized, ensuring cooling efficiency and wearing comfort.

[0027] In addition, in order to support the rear cooling module, a pocket 3 is provided at the back of the garment body 1 for accommodating the front cooling module; by setting the pocket 3, the rear cooling module can be wrapped and limited to prevent it from shifting or falling off during wear, making the installation of the rear cooling module easy and not affecting the overall appearance and comfort of the garment.

[0028] To facilitate the integration of the rear thermoelectric cooler 25 and the single-fan airflow assembly 26, the rear package 24 includes a housing 241 disposed inside the pocket 3, and the rear thermoelectric cooler 25 is fixedly installed inside the housing 241; the housing 241 can provide stable support and regulate the airflow for the rear thermoelectric cooler 25 and the single-fan airflow assembly 26, making it easy to fit the whole into the pocket 3 to achieve integrated wear.

[0029] Furthermore, the single-fan airflow assembly 26 includes a circulating fan 261 fixedly installed inside the housing 241 and located below the rear thermoelectric cooler 25 for drawing in external air; a hot channel 262 and a cold channel 263 respectively connected to the hot end and cold end of the rear thermoelectric cooler 25 inside the housing 241 above the circulating fan 261; a main air inlet 264 connected to the outside by opening on the housing 241 and located to one side of the circulating fan 261; a hot air outlet 265 for discharging heat outward by opening on the housing 241 and located above the hot end of the rear thermoelectric cooler 25; and a cold air outlet 266 for delivering cold air into the garment body 1 by opening on the housing 241 and located above the cold end of the rear thermoelectric cooler 25.

[0030] When the dual-fan airflow assembly 23 starts to circulate and cool the garment body 1, the single-fan airflow assembly 26 operates synchronously. At this time, the circulating fan 261, located inside the housing 241 and below the rear semiconductor cooling chip 25, starts. The circulating fan 261 draws in outside air through the main air inlet 264 on the housing 241. The airflow is driven upward by the circulating fan 261 and enters the hot channel 262 inside the housing 241 that is connected to the hot end of the rear semiconductor cooling chip 25, as well as the hot channel 262 that is connected to the rear semiconductor cooling chip 25. The cold channel 263, which is connected to the cold end of the chip 25, allows the airflow entering the hot channel 262 to pass through the hot end of the semiconductor cooling chip 25. After carrying away the heat generated by its operation, the airflow is discharged to the outside through the hot air outlet 265 on the housing 241, completing the heat dissipation process at the hot end. After the airflow entering the cold channel 263 is cooled down by passing through the cold end of the semiconductor cooling chip 25, it forms a low-temperature airflow that is stably delivered into the interior of the garment body 1 through the cold air outlet 266 on the housing 241, realizing back cooling airflow. It can be combined with the front cooling module to form a full-area cooling layout.

[0031] Furthermore, heat sinks are fixedly installed at the hot ends of both the front thermoelectric cooler 22 and the rear thermoelectric cooler 25.

[0032] The heat sink is in close contact with the hot end surfaces of the front thermoelectric cooler 22 and the rear thermoelectric cooler 25, which can increase the heat exchange area of ​​the hot end and quickly disperse the concentrated heat of the hot end of the front thermoelectric cooler 22 and the rear thermoelectric cooler 25 to the entire heat dissipation surface of the heat sink. Therefore, when the hot end fan 234 draws in external air through the external air inlet 235, the airflow passes over the heat sink surface of the front thermoelectric cooler 22 and quickly carries away the heat absorbed by the front thermoelectric cooler 22 hot end on the heat sink. Then it is discharged from the outer casing 212 through the external air outlet 236, realizing efficient heat dissipation of the hot end of the front thermoelectric cooler 22. When the external air drawn in by the circulating fan 261 enters the hot channel 262 through the main air inlet 264 and flows over the heat sink surface of the rear thermoelectric cooler 25, it can carry away the heat generated by the hot end of the rear thermoelectric cooler 25. Then it is discharged from the casing 241 through the hot air outlet 265, thus completing the heat dissipation of the hot end of the rear thermoelectric cooler 25, thereby further improving the cooling efficiency and operational stability of the device.

[0033] Furthermore, the inner shell 211, outer shell 212, and inner walls of the housing 241 are all filled with heat insulation cotton.

[0034] The heat insulation cotton on the inner wall of the inner shell 211 can prevent the cold energy generated by the cold end of the front semiconductor cooling chip 22 from being transferred outward and lost. The heat insulation cotton on the inner wall of the outer shell 212 can block external heat from entering the interior and prevent the heat from the hot end of the front semiconductor cooling chip 22 from flowing back to the inside of the garment. The heat insulation cotton on the inner wall of the casing 241 can form a heat barrier between the cold end and the hot end of the rear semiconductor cooling chip 25, preventing the heat in the hot channel 262 and the cold energy in the cold channel 263 from crossing temperatures, thereby reducing the heat transfer between hot and cold airflows, improving the utilization rate of cold energy and heat dissipation efficiency, and ensuring the long-term stable and efficient operation of the front cooling module and the rear cooling module.

[0035] It is worth noting that a ventilation fan 5 is fixedly installed on the front side of the garment body 1, and the ventilation fan 5 is located below the front encapsulation component 21.

[0036] When the front and rear cooling modules are running to cool down, the ventilation fan 5 can also be activated to help accelerate the airflow circulation inside the garment body 1, further promote the diffusion of cold air inside the garment, improve the utilization rate of cold energy, and reduce the stuffiness inside the garment.

[0037] It should be noted that both the inner shell 211 and the outer shell 241 are fixedly provided with rubber plugs for wrapping the wire harness, and the external wire harnesses are partially fixed inside the garment body 1 by Velcro to ensure that the wire harnesses will not slide or fall off inside the garment.

[0038] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this application, based on the technical solution and concept of this application, should be included within the scope of protection of this application.

Claims

1. A garment cooling device, comprising a garment body (1) and a cooling structure (2) disposed on the garment body (1) for active cooling and temperature reduction inside the garment. Its features are: The cooling structure (2) includes a front cooling module disposed on both sides of the chest of the garment body (1) and a rear cooling module disposed on the back of the garment body (1). The front cooling module includes a front encapsulation component (21) disposed on the chest of the garment body (1), a front semiconductor cooling chip (22) disposed in the front encapsulation component (21), and a dual-fan airflow assembly (23) disposed on the front encapsulation component (21) for driving airflow through the front semiconductor cooling chip (22) for in-garment airflow circulation and external heat dissipation. The rear cooling module includes a rear encapsulation component (24) disposed at the back of the garment body (1), a rear semiconductor cooling chip (25) disposed in the rear encapsulation component (24), and a single fan airflow assembly (26) disposed in the rear encapsulation component (24) for driving airflow through the rear semiconductor cooling chip (25) for in-garment air supply and external heat dissipation. Both the front semiconductor refrigeration chip (22) and the rear semiconductor refrigeration chip (25) are provided with at least two sets; The garment body (1) is made of a self-heating fabric.

2. The garment refrigeration device according to claim 1, characterized in that: The garment body (1) has a detachable part (4) fastened to the front for accommodating the front cooling module. The detachable part (4) is a silicone sleeve or a rubber sleeve.

3. The garment refrigeration device according to claim 2, characterized in that: The front package (21) includes an inner shell (211) disposed within the disassembly component (4) and an outer shell (212) disposed within the disassembly component (4) and fixedly connected to one side of the bottom of the inner shell (211). The front thermoelectric cooler (22) passes through the inner shell (211) and the outer shell (212) and is fixedly installed within the inner shell (211) and the outer shell (212). The cold end of the front thermoelectric cooler (22) is located within the inner shell (211), and the hot end of the front thermoelectric cooler (22) is located within the outer shell (212).

4. The garment refrigeration device according to claim 3, characterized in that: The dual-fan airflow assembly (23) includes a cold-end fan (231) fixedly installed inside the inner shell (211) and located above the cold end of the front semiconductor cooling chip (22) for drawing air from inside the garment body (1); an inner air inlet (232) located on the side of the inner shell (211) away from the outer shell (212) and located on the side of the cold-end fan (231) for communicating with the inside of the garment body (1); and an air inlet located on the inner shell (211) and below the cold end of the front semiconductor cooling chip (22) for supplying air to the garment body. (1) An internal air outlet (233) for conveying cold air, a hot-end fan (234) fixedly installed inside the outer shell (212) and located below the hot end of the front semiconductor cooling chip (22) for drawing in external air, an external air inlet (235) opened on the side of the outer shell (212) away from the inner shell (211) and located on the side of the hot-end fan (234) for communicating with the outside, and an external air outlet (236) opened on the outer shell (212) and located above the hot end of the front semiconductor cooling chip (22) for discharging heat to the outside.

5. The garment refrigeration device according to claim 1, characterized in that: The garment body (1) has a pocket (3) at the back for accommodating the front cooling module.

6. The garment refrigeration device according to claim 5, characterized in that: The rear package (24) includes a housing (241) disposed within the pocket (3), and the rear semiconductor cooling chip (25) is fixedly mounted within the housing (241).

7. The garment refrigeration device according to claim 6, characterized in that: The single-fan airflow assembly (26) includes a circulating fan (261) fixedly installed inside the housing (241) and located below the rear semiconductor refrigeration chip (25) for drawing in external air; a hot channel (262) and a cold channel (263) opened inside the housing (241) above the circulating fan (261) for communicating with the hot end and cold end of the rear semiconductor refrigeration chip (25) respectively; a main air inlet (264) opened on the housing (241) and located on one side of the circulating fan (261) for communicating with the outside; a hot air outlet (265) opened on the housing (241) and located above the hot end of the rear semiconductor refrigeration chip (25) for discharging heat outward; and a cold air outlet (266) opened on the housing (241) and located above the cold end of the rear semiconductor refrigeration chip (25) for delivering cold air into the garment body (1).

8. The garment refrigeration device according to claim 1, characterized in that: Heat sinks are fixedly installed on the hot ends of both the front semiconductor cooling chip (22) and the rear semiconductor cooling chip (25).

9. The garment refrigeration device according to claim 3 or 6, characterized in that: The inner walls of the inner shell (211), outer shell (212) and housing (241) are all filled with heat insulation cotton.

10. The garment refrigeration device according to claim 1, characterized in that: A ventilation fan (5) is fixedly installed on the front side of the garment body (1), and the ventilation fan (5) is located below the front packaging component (21).

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