Cathode roller surface processing device and copper foil preparation method

Abstract

The invention provides a cathode roller surface processing device and a copper foil preparation method. The cathode roller surface processing device comprises a roller body; the laser processing structure is arranged on one side of the roller body, and the laser processing structure is used for emitting laser beams to the surface of the roller body; the detection structure is arranged on the laser processing structure, and the detection structure is used for obtaining surface parameters of the roller body; and the control structure is electrically connected with the laser machining structure and the detection structure, and the control structure is used for adjusting the machining state of the laser machining structure according to a preset machining path and surface parameters. According to the method and the device, the shapes of the gullies on the surface of the cathode roller are accurately controlled, the production quality of copper foil is improved, and impedance fluctuation and reflection interference in the electric signal transmission process are reduced.

Description

Technical Field

[0001] This application relates to the field of copper foil preparation technology, and in particular to a cathode roller surface processing device and a copper foil preparation method. Background Technology

[0002] In applications such as 5G communication, millimeter-wave communication, and high-frequency circuits, RTF copper foil (reverse copper foil) needs to possess a highly uniform surface microstructure to reduce impedance fluctuations and reflection interference during signal transmission. The cathode roller is a key piece of equipment in the electrolytic copper foil production process. Under the influence of direct current, copper ions in the electrolyte are deposited and crystallized on the surface of the rotating cathode roller to form electrolytic copper foil. Therefore, the quality of the surface microstructure of RTF copper foil (reverse copper foil) is closely related to the quality of the grooves on the cathode roller surface.

[0003] In existing technologies, cathode rollers are typically polished using polishing brushes. These brushes remove uneven areas from the cathode roller surface through physical friction, creating a grooved structure. However, the groove shape formed by polishing brushes cannot be precisely controlled, easily leading to problems such as uneven groove depth and deviations in sidewall tilt angles. This makes it difficult to meet the signal transmission stability requirements of RTF copper foil (reverse copper foil). Summary of the Invention

[0004] This application provides a cathode roller surface processing device and a copper foil preparation method, which realizes precise processing of the groove morphology on the cathode roller surface, improves the production quality of copper foil, and reduces impedance fluctuations and reflection interference during electrical signal transmission.

[0005] To achieve the above-mentioned objectives, this application adopts the following approach:

[0006] In a first aspect, this application provides a cathode roller surface processing apparatus, comprising:

[0007] Roller body;

[0008] A laser processing structure is disposed on one side of the roller body, and the laser processing structure is used to emit a laser beam toward the surface of the roller body;

[0009] A detection structure is disposed on the laser processing structure, and the detection structure is used to acquire the surface parameters of the roller body;

[0010] A control structure is electrically connected to both the laser processing structure and the detection structure. The control structure is used to adjust the processing state of the laser processing structure according to a preset processing path and the surface parameters.

[0011] In one possible implementation, the laser processing structure includes:

[0012] A laser emitter for emitting a laser beam toward the surface of the roller;

[0013] A diffractive optical element, wherein the diffractive optical element is used to shape the laser beam into a flat-top line beam;

[0014] A telecentric lens, used to project the flat-top line beam onto the surface of the roller;

[0015] A scanning component, the scanning component being used to move the flat-top line beam along the axial direction of the roller body;

[0016] The control structure is electrically connected to both the laser emitter and the scanning component.

[0017] In one possible implementation, the scanning component includes a scanning mirror for driving the flat-top line beam to move along the axial direction of the roller.

[0018] In one possible implementation, the scanning component includes a linear motion structure for driving the laser processing structure to move along the axial direction of the roller.

[0019] In one possible implementation, the detection structure includes:

[0020] A laser confocal sensor is disposed on one side of the laser emitter, and the measurement optical path of the laser confocal sensor intersects with the processing optical path of the laser emitter.

[0021] A dichroic mirror is disposed at the intersection of the measurement optical path and the processing optical path, and the dichroic mirror has an angle with both the measurement optical path and the processing optical path.

[0022] An optical shutter, wherein the optical shutter is disposed between the laser confocal sensor and the dichroic mirror;

[0023] The dichroic mirror is disposed between the laser emitter and the diffractive optical element, and the control structure is electrically connected to the laser confocal sensor and the optical shutter, respectively.

[0024] In one possible implementation, the control structure includes:

[0025] A path generation unit is used to receive the forming parameters of the roller and calculate the laser processing path based on the forming parameters.

[0026] The controller is electrically connected to the path generation unit, the laser processing structure, and the detection structure, respectively.

[0027] In one possible implementation, it also includes:

[0028] A nitrogen curtain is provided on both sides of the laser emitter, and there is an angle between the nitrogen curtain and the laser emitter.

[0029] The intersection point of the nitrogen curtains on both sides of the laser emitter is located above the flat-top line beam.

[0030] In one possible implementation, it also includes:

[0031] The roller body is rotatably installed in the mounting groove, and one end of the roller body is connected to the output end of the drive device.

[0032] An isolation cover is movably mounted on the mounting groove, and the isolation cover is used to form a closed area with the mounting groove to enclose the roller body;

[0033] An air extraction port is provided on the isolation cover, and the isolation cover is connected to a negative pressure device through the air extraction port;

[0034] The laser processing structure and the detection structure are disposed within the enclosed area;

[0035] The isolation enclosure is also equipped with a spray structure and a purging structure.

[0036] Secondly, this application provides a method for preparing copper foil, using the cathode roller surface processing apparatus described in any of the above claims, the method comprising:

[0037] Obtain the laser processing path for the roller to be processed;

[0038] The surface of the roller is polished according to the laser processing path;

[0039] In response to the completion of the roller polishing process, copper foil is electrolyzed on the surface of the roller to form copper foil.

[0040] In one possible implementation, the step of electrolytically generating copper foil on the roller surface in response to the completion of the roller polishing process includes:

[0041] A first layer of copper foil is generated on the surface of the roller with a first current density, and a second layer of copper foil is generated on the surface of the first layer of copper foil with a second current density, wherein the first current density is less than the second current density.

[0042] The cathode roller surface processing device of this application emits a laser beam onto the surface of the cathode roller through a laser processing structure, forming periodic grooves on the surface of the cathode roller according to a preset processing path. The groove morphology is detected in real time by a detection structure, and the detection results are transmitted to a control structure. The control structure adjusts the operating state of the laser processing structure according to the detection results, thereby achieving precise control of the groove morphology on the cathode roller surface. This improves the production quality of copper foil, reduces impedance fluctuations and reflection interference during electrical signal transmission, and improves the signal stability and transmission efficiency of high-frequency communication equipment. Attached Figure Description

[0043] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0044] Figure 1 This is a schematic diagram of the structure of the cathode roller surface processing device in one embodiment of this application;

[0045] Figure 2 This is a topological diagram of a cathode roller surface processing apparatus in one embodiment of this application;

[0046] Figure 3 This is a flowchart of a copper foil preparation method in one embodiment of this application.

[0047] Explanation of reference numerals in the attached figures:

[0048] 100. Roller body; 200. Laser processing structure; 300. Detection structure; 400. Control structure; 500. Mounting groove; 600. Isolation cover; 601. Air extraction port; 700. Lifting device. Detailed Implementation

[0049] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0050] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The following will be combined with the appendix... Figure 1-3The embodiments of this application will be described below.

[0051] This application provides a cathode roller surface processing device, see [link to relevant documentation]. Figure 1 and Figure 2 The cathode roller surface processing device includes: a roller body 100, a laser processing structure 200, a detection structure 300, and a control structure 400. The laser processing structure 200 is disposed on one side of the roller body 100 and is used to emit a laser beam onto the surface of the roller body 100. The detection structure 300 is disposed on the laser processing structure 200 and is used to acquire the surface parameters of the roller body 100. The control structure 400 is electrically connected to the laser processing structure 200 and the detection structure 300 respectively, and is used to adjust the processing state of the laser processing structure 200 according to the preset processing path and surface parameters.

[0052] In this embodiment, the laser processing structure 200 is installed on one side of the rotatable roller 100, the detection structure 300 is installed on the laser processing structure 200, and the control structure 400 is electrically connected to the laser processing structure 200 and the detection structure 300 respectively. The laser processing structure 200 emits a laser beam to the surface of the rotating roller 100, forming periodic grooves on the surface of the roller 100 according to a preset processing path. The detection structure 300 detects the morphological parameters of the formed grooves in real time. The control structure 400 calculates the deviation of the grooves based on the measurement results and outputs correction commands to the laser processing structure 200, dynamically adjusting the laser pulse energy and laser scanning speed of the laser processing structure 200 to compensate for the roundness error and thermal deformation of the roller 100 surface, improve the processing accuracy of the grooves on the roller 100 surface, eliminate the randomness of the grooves caused by equipment wear, acid corrosion and other factors in traditional polishing processes, significantly improve the global consistency and regularity of the groove morphology, reduce impedance fluctuations and reflection interference in the electrical signal transmission process, and improve the signal stability and transmission efficiency of high-frequency communication equipment.

[0053] Understandably, when it is necessary to process grooves on the surface of the roller 100, the electrolytic production of copper foil is stopped, the roller 100 is removed from the electrolyte, and then the grooves are processed on the surface by the laser processing structure 200.

[0054] It should be noted that during the process of the laser processing structure 200 emitting a laser beam onto the surface of the roller 100, the roller 100 rotates at a low speed.

[0055] In one example, the rotational speed of the roller 100 can be 1 to 2 rpm.

[0056] In some embodiments, the depth of the grooves on the surface of the roller 100 can be 0.5-2 μm, the period of the grooves can be 10-30 μm, and the sidewall angle of the grooves can be 70-85°.

[0057] In one possible implementation, the deviation in trench depth can be ±8%.

[0058] In some embodiments, the laser processing structure 200 includes a laser emitter, a diffractive optical element, a telecentric lens, and a scanning component. A control structure 400 is electrically connected to the laser emitter and the scanning component. The laser emitter emits a laser beam onto the surface of the roller 100. The diffractive optical element shapes the laser beam into a flat-top line beam. The telecentric lens projects the flat-top line beam onto the surface of the roller 100. The scanning component moves the flat-top line beam along the axial direction of the roller 100. This allows for precise processing of the groove morphology on the surface of the roller 100, improving the production quality of RTF copper foil and consequently enhancing its high-frequency communication performance.

[0059] It should be noted that after the flat-top line beam is projected onto the surface of the roller 100, a light spot is formed on the surface of the roller 100.

[0060] In one possible implementation, the light spot is linearly focused, with a minor axis dimension of 10-20 μm, a major axis dimension of 20-50 mm, and an energy uniformity of >85%.

[0061] In one possible implementation, the laser emitter can be a solid-state laser with a wavelength of 355 nm.

[0062] In one possible implementation, the telecentric lens can be a telecentric F-θ lens.

[0063] Understandably, the laser emitted by the laser emitter is shaped by diffractive optical elements to form a flat-top line beam. This beam is then projected onto the surface of the roller 100 through a telecentric F-θ lens. The diffractive optical elements control the beam distribution to ensure uniformity of the spot energy and focusing accuracy. The telecentric F-θ lens further corrects optical path distortion, achieving high-precision processing of the groove structure.

[0064] In some embodiments, the scanning component can be a scanning galvanometer, which drives the flat-top line beam to move along the axial direction of the roller 100. In this way, the projection path of the laser beam can be controlled, so that the laser beam moves along a preset processing path on the surface of the roller 100, thereby achieving precise processing of the groove morphology on the surface of the roller 100.

[0065] Understandably, the scanning galvanometer is used to drive the laser beam to scan along the axial direction of the roller 100, so that the light spot on the surface of the roller 100 moves along the axial direction of the roller 100. It should be noted that the axial scanning speed of the laser beam is matched with the rotational speed of the roller 100, so that the grooves formed on the roller 100 extend along the axial direction of the roller 100.

[0066] In other embodiments, the scanning component can be a linear motion structure, which drives the laser processing structure 200 to move along the axial direction of the roller 100. This allows control of the laser beam's projection path, enabling the laser beam to move along a preset processing path on the surface of the roller 100, thus achieving precise processing of the groove morphology on the roller 100 surface.

[0067] Understandably, the linear motion structure is used to drive the laser emitter to scan along the axial direction of the roller 100, so that the laser beam and the light spot on the surface of the roller 100 move along the axial direction of the roller 100. It should be noted that the axial scanning speed of the laser beam is matched with the rotational speed of the roller 100, so that the grooves formed by the roller 100 extend along the axial direction of the roller 100.

[0068] It should be noted that if the scanning component is a scanning galvanometer, the laser emitter, diffractive optical element, telecentric lens, and scanning galvanometer can be integrated and mounted. If the scanning component is a linear motion structure, the laser emitter, diffractive optical element, and telecentric lens can be integrated and mounted, and the linear motion structure can drive the integrated laser emitter, diffractive optical element, and telecentric lens to move along the roller body 100 axial direction.

[0069] In one possible implementation, the scanning component may include a scanning galvanometer and a linear motion structure, with the scanning galvanometer and linear motion structure working in tandem. This allows for flexible control of the laser beam projection path, enabling precise adjustment of the trench structure's period and sidewall angles to meet the needs of different RTF copper foils.

[0070] In some embodiments, the detection structure 300 includes a laser confocal sensor, a dichroic mirror, and an optical shutter. The laser confocal sensor is disposed on one side of the laser emitter, and its measurement optical path intersects with the processing optical path of the laser emitter. The dichroic mirror is disposed at the intersection of the measurement and processing optical paths, and forms an angle with both the measurement and processing optical paths. The optical shutter is disposed between the laser confocal sensor and the dichroic mirror, wherein the dichroic mirror is disposed between the laser emitter and the diffractive optical element. The control structure 400 is electrically connected to both the laser confocal sensor and the optical shutter. This allows the measurement optical path of the laser confocal sensor and the processing optical path of the laser emitter to be coaxially arranged, enabling precise detection of the parameters of the grooves on the surface of the roller 100 and improving the processing accuracy of the grooves on the surface of the roller 100.

[0071] It is understandable that the measurement optical path and the processing optical path are arranged coaxially, therefore, the detection wave emitted by the laser confocal sensor also scans and detects along the axial direction of the roller 100.

[0072] In one possible implementation, the axes of the laser confocal sensor and the dichroic mirror are perpendicular to the axes of the laser emitter and the dichroic mirror. The dichroic mirror is positioned at the intersection of the measurement optical path and the processing optical path, and is set at a 45-degree angle to both the measurement optical path and the processing optical path.

[0073] Of course, the axes of the laser confocal sensor and the dichroic mirror may not be perpendicular to the axes of the laser emitter and the dichroic mirror. Correspondingly, the dichroic mirror may be set at other angles to the measurement optical path and the processing optical path, respectively.

[0074] It should be noted that the dichroic mirror is used to achieve wavelength isolation between the laser confocal sensor and the laser emitter, and the optical shutter is used to achieve time-division multiplexing between the laser confocal sensor and the laser emitter. In this way, the measurement sampling window of the laser confocal sensor is located in the processing pulse gap of the laser emitter, thereby realizing real-time measurement of the grooves on the surface of the roller body 100.

[0075] In one example, the time synchronization accuracy between the laser confocal sensor and the laser emitter is less than 100 ns.

[0076] In one possible implementation, the sampling frequency of the laser confocal sensor is ≥20kHz.

[0077] In some embodiments, the control structure 400 includes a path generation unit and a controller. The path generation unit receives forming parameters from the roller 100 and calculates a laser processing path based on the forming parameters. The controller is electrically connected to the path generation unit, the laser processing structure 200, and the detection structure 300. This allows for precise control of the groove morphology on the surface of the roller 100, improving the production quality of the copper foil.

[0078] It should be noted that the controller controls the operation of the laser processing structure 200 and the detection structure 300 according to the laser processing path, forming grooves on the surface of the roller 100. The groove depth can be stepped by 0.1 μm in the range of 0.5-2 μm, the groove period can be stepped by 1 μm in the range of 10-30 μm, and the sidewall angle of the groove can be stepped by 2° in the range of 70-85°.

[0079] In one possible implementation, the controller can be a PID controller.

[0080] It should be noted that the response time of the PID controller can be no more than 50ms. In this way, the PID controller has high control accuracy, which can improve the processing accuracy of the grooves on the surface of the roller body 100.

[0081] In some embodiments, the cathode roller surface processing device further includes a nitrogen curtain disposed on both sides of the laser emitter, with an angle between the nitrogen curtain and the laser emitter, wherein the intersection point of the nitrogen curtains on both sides of the laser emitter is located above the flat-top line beam. Thus, by spraying nitrogen through the nitrogen curtain, the acidic gas generated by the evaporation of the electrolyte on the isolation roller 100 is isolated, thereby protecting the laser emitter and improving its service life.

[0082] In one possible implementation, a nitrogen curtain can be positioned on both sides of the laser processing structure 200 and the detection structure 300.

[0083] Understandably, the nitrogen curtain sprays nitrogen gas, forming a V-shaped laminar flow gas wall on both sides of the laser processing structure 200 and the detection structure 300. This gas wall acts as a physical barrier, isolating the acidic gas generated by the evaporation of the electrolyte on the roller 100, effectively inhibiting the corrosion of the laser processing structure 200 and the detection structure 300 by the acidic gas, and improving the service life of the laser processing structure 200 and the detection structure 300. At the same time, the nitrogen curtain sprays nitrogen gas onto the surface of the roller 100, blowing away the electrolyte on the surface of the roller 100, keeping the surface of the roller 100 dry, facilitating the laser emitter to emit laser light to process the surface of the roller 100, and improving the processing accuracy of the grooves on the surface of the roller 100.

[0084] In one possible implementation, the nitrogen curtain can be integrated with the laser processing structure 200.

[0085] In one possible implementation, the nitrogen curtains on both sides of the laser emitter can be arranged in a double-row opposing configuration, and the angle between the nitrogen curtains and the laser emitter can be 30-45°.

[0086] In one possible implementation, the nozzle of the nitrogen curtain can be a Φ1mm stainless steel capillary tube, and the distance between two adjacent capillary tubes is no more than 10mm.

[0087] In one possible implementation, the nitrogen injection velocity of the nitrogen curtain can be 15-25 m / s, and the nitrogen purity can be no less than 99.999%.

[0088] In one possible implementation, the intersection of the nitrogen curtains on both sides of the laser emitter is located 10-15 mm above the flat-top line beam.

[0089] In some embodiments, see Figure 1The cathode roller surface processing device further includes: a mounting groove 500, an isolation cover 600, and an exhaust port 601. The roller body 100 is rotatably mounted in the mounting groove 500, with one end connected to the output end of the drive device. The isolation cover 600 is movably mounted on the mounting groove 500, forming a closed area for the roller body 100 with the mounting groove 500. The exhaust port 601 is located on the isolation cover 600, which is connected to a negative pressure device. The laser processing structure 200 and the detection structure 300 are located within the closed area. This isolation of the processing area of ​​the roller body 100 effectively inhibits the corrosion of the equipment by acidic gases generated by electrolyte evaporation, thus extending the equipment's service life.

[0090] It should be noted that the mounting groove 500 is the electrolytic cell. When the surface of the roller 100 needs to be processed, the electrolyte in the electrolytic cell should be drained in advance.

[0091] In one possible implementation, the isolation cover 600 may include a first cover and a second cover, with at least one air extraction port 601 respectively on the first cover and the second cover, and the isolation cover 600 is connected to the negative pressure device through the air extraction port 601.

[0092] Understandably, after the first and second covers are closed, the isolation cover 600 and the mounting groove 500 form a closed area of ​​the closed roller 100. The air in the closed area is extracted by the negative pressure device, so that the closed area is kept in a slightly positive pressure state, while reducing the concentration of acidic gas in the closed area.

[0093] Furthermore, pressure sensors and gas concentration sensors can be installed on the inner walls of the first and second enclosures. The pressure sensors are used to detect the air pressure in the enclosed area, and the gas concentration sensors are used to detect the concentration of acidic gas in the enclosed area.

[0094] In one example, the gas pressure within the enclosed area can be 30-80 Pa, and the concentration of acidic gas within the enclosed area can be less than 1 ppm.

[0095] In one possible implementation, the first and second covers can be slidably mounted on the top of the mounting groove 500, or they can be rotatably mounted on the top of the mounting groove 500. It should be noted that the opening and closing time of the first and second covers is less than 15 seconds.

[0096] In one possible implementation, the isolation enclosure 600 is provided with an observation window made of a transparent PC board.

[0097] In one possible implementation, the inner wall of the isolation enclosure 600 is coated with an acid-resistant coating.

[0098] In some embodiments, the isolation cover 600 is further provided with a spray structure and a purging structure. In this way, the surface of the processed roller 100 can be cleaned and dried.

[0099] In this embodiment, after the grooves on the surface of the roller 100 are processed, 0.5 MPa deionized water is sprayed onto the surface of the roller 100 through a spray structure for no less than 3 minutes to clean the surface of the roller 100. Then, 200W Ar plasma is blown onto the surface of the roller 100 through a purging structure for no less than 2 minutes, and then 50°C nitrogen hot air is blown onto the surface of the roller 100 through a purging structure to dry the surface of the roller 100.

[0100] It should be noted that deionized water can be ultrapure water with a resistivity of not less than 18 MΩ•cm.

[0101] In one possible implementation, the drive device is electrically connected to the control structure 400. Thus, the control structure 400 adjusts the rotational speed of the roller 100 and the axial scanning speed of the laser beam, adapting the axial scanning speed of the laser beam to the rotational speed of the roller 100, causing the grooves formed by the roller 100 to extend along the axial direction of the roller 100.

[0102] In some embodiments, see Figure 1 A lifting device 700 is installed in the enclosed area. The lifting device 700 is used to drive the laser processing structure 200 and the detection structure 300 to rise or fall.

[0103] It is understandable that the lifting device 700 adjusts the height of the laser processing structure 200 and the detection structure 300 to facilitate the adjustment of the relative position of the laser processing structure 200 and the detection structure 300 with the roller body 100, thereby facilitating the processing of the surface of the roller body 100.

[0104] In one possible implementation, the lifting device 700 can be housed within the mounting slot 500. This improves the stability of the lifting device 700.

[0105] It should be noted that if the scanning component is a scanning galvanometer, the integrated laser emitter, diffractive optical element, telecentric lens, and scanning galvanometer are located at the output end of the lifting device 700, and the height of the laser emitter is adjusted by the lifting device 700. If the scanning component is a linear motion structure, the integrated laser emitter, diffractive optical element, and telecentric lens are located at the output end of the lifting device 700, which is mounted on the linear motion structure. The linear motion structure drives the lifting device 700 and the integrated laser emitter, diffractive optical element, and telecentric lens to move axially along the roller 100, and the height of the laser emitter is adjusted by the lifting device 700.

[0106] Furthermore, the linear motion structure can be set within the mounting slot 500.

[0107] It should be noted that the lifting device 700 and the linear motion structure can be positioned above or below the electrolyte surface.

[0108] In one possible implementation, the lifting device 700 can be a gantry.

[0109] In some embodiments, the control structure 400 further includes a topography database server electrically connected to the path generation unit. The topography database server stores trench parameters corresponding to different copper foil specifications. This enables intelligent matching of different copper foil specifications, improving the preparation efficiency of RTF copper foil.

[0110] In addition, this application also provides a method for preparing copper foil, see [link to relevant documentation]. Figure 3 Using the cathode roller surface processing apparatus in any of the above embodiments, the copper foil preparation method includes:

[0111] Step S101: Obtain the laser processing path of the roller body 100 to be processed.

[0112] Step S102: Polish the surface of the roller 100 according to the laser processing path.

[0113] Step S103: In response to the completion of the polishing process of the roller body 100, copper foil is electrolyzed on the surface of the roller body 100.

[0114] In this embodiment, the groove parameters of the roller 100 are selected by the morphology database server. The path generation unit generates a laser processing path for the roller 100 based on the selected groove parameters. The controller activates the laser processing structure 200 to emit a laser beam, which processes periodic grooves on the surface of the roller 100 according to the laser processing path. The laser confocal sensor detects the morphology parameters of the formed periodic grooves in real time, including the groove depth, period, and sidewall angle. The laser confocal sensor feeds back the detection results to the control structure 400. Based on the feedback detection results, the control structure 400 dynamically adjusts the pulse energy and scanning speed of the laser beam to compensate for the roundness error and thermal deformation of the roller 100 surface, so that the laser beam processes the surface of the roller 100 along the preset laser processing path, thereby improving the processing accuracy of the grooves on the roller 100 surface. After the groove processing on the roller 100 surface is completed, the roller 100 surface is cleaned by a spray structure and dried by a blower structure. After the surface of roller 100 is dried, copper foil is generated by electrolysis on the surface of roller 100.

[0115] It should be noted that when it is necessary to process grooves on the surface of the roller 100, the electrolytic production of copper foil is stopped, the roller 100 is separated from the electrolyte, and the roller 100 is adjusted to a low-speed rotation state. The laser processing structure 200 and the detection structure 300 are adjusted to a suitable position by the lifting device 700. The first and second covers are closed, and nitrogen gas is sprayed through the nitrogen curtain to isolate the acidic gas generated by the evaporation of the electrolyte on the roller 100, inhibiting the corrosion of the laser processing structure 200 and the detection structure 300 by the acidic gas. The air in the closed area is extracted by the negative pressure device to keep the closed area in a slightly positive pressure state, while reducing the concentration of acidic gas in the closed area, thus completing the preparation work before laser processing.

[0116] In some embodiments, in response to the completion of polishing of the roller 100, copper foil is electrolytically generated on the surface of the roller 100, including:

[0117] A first layer of copper foil is formed on the surface of the roller 100 with a first current density, and a second layer of copper foil is formed on the surface of the first layer of copper foil with a second current density, wherein the first current density is less than the second current density.

[0118] In this embodiment, the first current density is the initial current density for copper foil electrolytic production, and the second current density is the current density for normal copper foil production. The first current density is 20-30% lower than the second current density. The first layer of copper foil is deposited on the surface of the roller 100 using the first current density. At low current density, the copper ion reduction rate is slower, which densely fills the gaps between particles remaining after laser processing on the surface of the roller 100, reducing the porosity generated on the surface of the copper foil. At the same time, it gradually eliminates the stress anomalies generated by laser processing on the surface of the roller 100. After the first layer of copper foil is produced, the second current density is used to generate the second layer of copper foil on the surface of the first layer of copper foil, thereby improving the production quality of the copper foil.

[0119] It should be noted that the first and second copper foil layers are continuously generated, forming an integrated structure, or different layers of the same copper foil.

[0120] It should be noted that after laser processing, residual particles will be generated on the groove surface of the roller 100. If a high current density copper layer is directly deposited, the copper ion reduction rate is fast, resulting in uneven coating of the residue and easy formation of pore-like defects on the copper foil surface. If a low current density copper layer is deposited first, the copper ion reduction rate is slower, resulting in dense filling of the gaps around the particles and reducing the formation of pores. In addition, after laser processing, the groove surface of the roller 100 will experience micro-stress changes. If a high current density copper layer is directly deposited, it will lead to abnormal local grain deposition in the copper foil. If a low current density copper layer is deposited first, the abnormal stress can be gradually eliminated, improving the production quality of the copper foil.

[0121] In one possible implementation, the deposition thickness of the first copper foil layer can be 1.5-2 μm, and the pinhole rate of the first copper foil layer is less than 0.5 pins / m².

[0122] In one possible implementation, the first current density can be 40 A / dm², and the second current density can be 55 A / dm².

[0123] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," and "some embodiments" used in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Additionally, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0124] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A cathode roller surface processing device, characterized in that, include: Roller body (100); A laser processing structure (200) is disposed on one side of the roller body (100) and is used to emit a laser beam onto the surface of the roller body (100); A detection structure (300) is disposed on the laser processing structure (200), and the detection structure (300) is used to acquire the surface parameters of the roller (100); A control structure (400) is electrically connected to the laser processing structure (200) and the detection structure (300) respectively. The control structure (400) is used to adjust the processing state of the laser processing structure (200) according to the preset processing path and the surface parameters.

2. The cathode roller surface processing apparatus according to claim 1, characterized in that, The laser processing structure (200) includes: A laser emitter for emitting a laser beam toward the surface of the roller (100); A diffractive optical element, wherein the diffractive optical element is used to shape the laser beam into a flat-top line beam; A telecentric lens, the telecentric lens being used to project the flat-top line beam onto the surface of the roller (100); A scanning component for moving the flat-top line beam along the axial direction of the roller (100); The control structure (400) is electrically connected to the laser emitter and the scanning component, respectively.

3. The cathode roller surface processing apparatus according to claim 2, characterized in that, The scanning component includes a scanning galvanometer for driving the flat-top line beam to move along the axial direction of the roller (100).

4. The cathode roller surface processing apparatus according to claim 2, characterized in that, The scanning component includes a linear motion structure for driving the laser processing structure (200) to move along the axial direction of the roller (100).

5. The cathode roller surface processing apparatus according to claim 2, characterized in that, The detection structure (300) includes: A laser confocal sensor is disposed on one side of the laser emitter, and the measurement optical path of the laser confocal sensor intersects with the processing optical path of the laser emitter. A dichroic mirror is disposed at the intersection of the measurement optical path and the processing optical path, and the dichroic mirror has an angle with both the measurement optical path and the processing optical path. An optical shutter, wherein the optical shutter is disposed between the laser confocal sensor and the dichroic mirror; The dichroic mirror is disposed between the laser emitter and the diffractive optical element, and the control structure (400) is electrically connected to the laser confocal sensor and the optical shutter respectively.

6. The cathode roller surface processing apparatus according to claim 1, characterized in that, The control structure (400) includes: A path generation unit is used to receive the forming parameters of the roller (100) and calculate the laser processing path based on the forming parameters; The controller is electrically connected to the path generation unit, the laser processing structure (200), and the detection structure (300), respectively.

7. The cathode roller surface processing apparatus according to claim 2, characterized in that, Also includes: A nitrogen curtain is provided on both sides of the laser emitter, and there is an angle between the nitrogen curtain and the laser emitter. The intersection point of the nitrogen curtains on both sides of the laser emitter is located above the flat-top line beam.

8. The cathode roller surface processing apparatus according to claim 1, characterized in that, Also includes: Mounting groove (500), the roller body (100) is rotatably mounted in the mounting groove (500), and one end of the roller body (100) is connected to the output end of the drive device; An isolation cover (600) is movably mounted on the mounting groove (500) and is used to form a closed area with the mounting groove (500) to enclose the roller body (100); An air extraction port (601) is provided on the isolation cover (600), and the isolation cover (600) is connected to the negative pressure device through the air extraction port (601); The laser processing structure (200) and the detection structure (300) are disposed within the enclosed area; The isolation cover (600) is also equipped with a spray structure and a purging structure.

9. A method for preparing copper foil, characterized in that, The method using the cathode roller surface processing apparatus according to any one of claims 1-8 comprises: Obtain the laser processing path of the roller (100) to be processed; The surface of the roller (100) is polished according to the laser processing path; In response to the completion of the polishing process of the roller body (100), copper foil is electrolyzed on the surface of the roller body (100).

10. The method for preparing copper foil according to claim 9, characterized in that, The step of electrolytically generating copper foil on the surface of the roller (100) in response to the completion of the polishing process of the roller (100) includes: A first layer of copper foil is generated on the surface of the roller (100) at a first current density, and a second layer of copper foil is generated on the surface of the first layer of copper foil at a second current density, wherein the first current density is less than the second current density.

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