Polishing machine, polishing pad detection method and device, detection equipment, product and medium

Abstract

The invention provides a polishing machine, a polishing pad detection method and device, detection equipment, a product and a medium, and belongs to the technical field of semiconductor manufacturing. The polishing machine comprises an upper fixed disc, an upper polishing pad is arranged on the upper fixed disc, the polishing machine further comprises a mechanical arm and a swing arm servo motor, the upper fixed disc is arranged at one end of the mechanical arm, the other end of the mechanical arm is connected with the swing arm servo motor, and the swing arm servo motor is used for driving the mechanical arm to rotate; the air cylinder and the upper fixed disc servo motor are arranged between the upper fixed disc and the mechanical arm, the air cylinder is used for driving the upper fixed disc to move in the vertical direction, and the upper fixed disc servo motor is used for driving the upper fixed disc to rotate; the device comprises a support, a plurality of industrial cameras and a drying mechanism, the drying mechanism and the plurality of industrial cameras are arranged on the support, the drying mechanism is used for drying the upper polishing pad, and the industrial cameras are used for shooting the upper polishing pad to obtain a plurality of original images. According to the technical scheme, the abnormal condition of the polishing pad can be efficiently and accurately detected.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a polishing machine, a polishing pad testing method, apparatus, testing equipment, product, and medium. Background Technology

[0002] In the semiconductor silicon wafer manufacturing industry, double-side polishing is a crucial process for ensuring the flatness and quality of the silicon wafer surface. During the polishing process, the polishing pad, which is attached to the mounting plate, comes into direct contact with the silicon wafer surface, and the surface condition of the polishing pad has a significant impact on the polishing effect of the silicon wafer.

[0003] Over long-term use, the polishing pad on the mounting plate may develop cracks (such as...) due to friction, wear, carrier burrs, etc. Figure 1 As shown), damaged (such as) Figure 2 Defects such as those shown in the image can lead to surface scratches and poor flatness on silicon wafers if they are not detected in time and the abnormal polishing pads are used for polishing. This can seriously affect the performance of the silicon wafers and subsequent processing steps.

[0004] Currently, the detection of damage to the polishing pads on the plate mainly relies on manual visual inspection. However, manual inspection requires stopping the machine, which not only takes up a lot of time and reduces production efficiency, but also the accuracy of manual inspection is limited by factors such as the experience and sense of responsibility of the personnel, which can easily lead to missed or false detections.

[0005] In addition, some existing automated inspection methods, such as using a single camera fixed to the periphery of the polishing pad, are available to capture images of the polishing pad. However, due to the large size of the polishing pad in a double-sided polishing machine, a single camera cannot fully cover the polishing pad, resulting in blind spots and unsatisfactory inspection results. Furthermore, the polishing slurry and water used during silicon wafer polishing adhere to the surface of the polishing pad after polishing. As the polishing pad swings out or rotates, these residual polishing slurry and water can easily drip onto the camera surface, affecting the clarity of image capture and inspection accuracy.

[0006] Therefore, there is an urgent need for an efficient and accurate method for detecting anomalies in polishing pads that can also avoid the camera being affected by water droplets. Summary of the Invention

[0007] This invention provides a polishing machine, a polishing pad detection method, a device, a detection equipment, a product, and a medium, which can efficiently and accurately detect abnormalities in polishing pads.

[0008] To achieve the above objectives, the technical solution adopted in the embodiments of the present invention is as follows: A polishing machine includes an upper fixed plate on which an upper polishing pad is disposed; the polishing machine also includes: The robotic arm and the swing arm servo motor are connected to the upper fixed plate at one end of the robotic arm and the other end of the robotic arm is connected to the swing arm servo motor. The swing arm servo motor is used to drive the robotic arm to perform rotational motion. The cylinder and the upper plate servo motor are located between the upper plate and the robotic arm. The cylinder is used to drive the upper plate to move in the vertical direction, and the upper plate servo motor is used to drive the upper plate to rotate. The system includes a support frame, multiple industrial cameras, and a drying mechanism. The drying mechanism and multiple industrial cameras are mounted on the support frame. The drying mechanism is used to dry the upper polishing pad, and the industrial cameras are used to capture images of the upper polishing pad to obtain multiple raw images. The raw images are used to analyze whether there are any abnormalities on the upper polishing pad. The multiple industrial cameras are arranged linearly, and the shooting areas of each industrial camera overlap.

[0009] In some embodiments, the drying mechanism includes multiple air nozzles, each of which is fixed on a bracket and spaced apart from each industrial camera; The blowing areas of each nozzle overlap, and the angle between the nozzle's blowing direction and the horizontal plane is between 25° and 35°.

[0010] In some embodiments, the polishing machine further includes: The processor is used to obtain the detection results corresponding to the upper polishing pad based on the original image; An audible and visual alarm is used to issue an alarm signal when an abnormality occurs on the upper polishing pad; The display screen is used to show the corresponding test results for the upper polishing pad when an abnormality occurs.

[0011] This invention also provides a polishing pad detection method, applied to the polishing machine described above, including: After the silicon wafer polishing process is completed, the control cylinder drives the upper plate to rise to the first preset position; Control the upper plate servo motor to drive the upper plate to rotate for a preset time; The control cylinder drives the upper plate to rise to the second preset position, which is higher than the first preset position; The control arm servo motor drives the robotic arm to rotate to the third preset position, and when the robotic arm starts to rotate, the control drying mechanism continuously performs drying operation on the upper polishing pad. The upper plate servo motor is controlled to drive the upper plate to rotate one revolution at a preset speed. During the rotation of the upper plate, the industrial camera is controlled to capture images of the upper polishing pad at a preset frame rate to obtain multiple raw images. Based on multiple original images, the detection results corresponding to the upper polishing pad are obtained.

[0012] In some embodiments, the detection result corresponding to the upper polishing pad is obtained based on multiple original images, including: Multiple original images are preprocessed to obtain the target image corresponding to each original image; Multiple target images are compared and analyzed with a reference image to obtain the detection results. The reference image is the image obtained by acquiring images of an unused and intact polishing pad surface.

[0013] In some embodiments, the method further includes: If the test results indicate an abnormality in the polishing pad, perform at least one of the following: Control the audible and visual alarm to emit an alarm signal; The control display shows the test results corresponding to the polishing pad.

[0014] This invention also provides a polishing pad detection device, applied to the polishing machine described above, comprising: The first control module is used to control the cylinder to drive the upper plate to rise to the first preset position after the silicon wafer polishing process is completed. The second control module is used to control the upper plate servo motor to drive the upper plate to rotate for a preset time. The third control module is used to control the cylinder to drive the upper plate to rise to the second preset position, which is higher than the first preset position. The fourth control module is used to control the swing arm servo motor to drive the robotic arm to rotate to the third preset position, and to control the drying mechanism to continuously dry the upper polishing pad when the robotic arm starts to rotate. The fifth control module is used to control the upper plate servo motor to drive the upper plate to rotate one revolution at a preset speed, and during the rotation of the upper plate, control the industrial camera to take pictures of the upper polishing pad at a preset frame rate to obtain multiple raw images. The first processing module is used to obtain the detection results corresponding to the upper polishing pad based on multiple original images.

[0015] In some embodiments, the first processing module includes: The image processing unit is used to preprocess multiple original images to obtain the target image corresponding to each original image; The comparison analysis unit is used to compare and analyze multiple target images with a reference image to obtain detection results. The reference image is an image obtained by image acquisition of an unused and intact polishing pad surface.

[0016] In some embodiments, the apparatus further includes: The sixth control module is used to perform at least one of the following actions when the polishing pad is found to be abnormal in the test results: Control the audible and visual alarm to emit an alarm signal; The control display shows the test results corresponding to the polishing pad.

[0017] This application also provides a testing device, including a memory, a processor, and a computer program stored in the memory and executable on the processor; when the processor executes the computer program, it implements the polishing pad testing method described above.

[0018] This invention also provides a computer program product, including computer instructions that, when executed by a processor, implement the steps of the polishing pad detection method described above.

[0019] To achieve the above objectives, embodiments of the present invention provide a readable storage medium storing a program or instructions thereon, which, when executed by a processor, implement the steps in the polishing pad detection method described above.

[0020] The beneficial effects of this invention are: In this embodiment, multiple industrial cameras are arranged linearly to ensure comprehensive coverage of the polishing pad, avoiding blind spots caused by a single camera. Driven by the swing arm servo motor and the upper fixed plate servo motor, the upper fixed plate can swing out and rotate. Combined with a drying mechanism, the polishing pad is dried before shooting, removing residual moisture and particles from its surface, thereby improving the image quality captured by the industrial cameras and enhancing the accuracy of defect identification. Through a fully automated control and shooting process, automated polishing pad inspection is achieved, significantly improving inspection efficiency compared to manual inspection methods and meeting the needs of mass production. Attached Figure Description

[0021] Figure 1 This diagram illustrates the crack pattern on the pad. Figure 2 This diagram illustrates the damage to the pad. Figure 3 A structural diagram of a polishing machine according to an embodiment of the present invention; Figure 4 A side view of a polishing machine according to an embodiment of the present invention; Figure 5 This diagram illustrates the control relationships in an embodiment of the present invention. Figure 6 One of the flowcharts illustrating the polishing pad detection method according to an embodiment of the present invention; Figure 7 The second flowchart illustrating the polishing pad detection method according to an embodiment of the present invention; Figure 8 This is a structural diagram showing the polishing pad detection device according to an embodiment of the present invention. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention are within the scope of protection of the present invention.

[0023] To address the aforementioned technical problems, embodiments of the present invention provide a polishing machine, a polishing pad detection method, an apparatus, a detection device, a product, and a medium, which can efficiently and accurately detect abnormalities in polishing pads.

[0024] like Figure 3-4 As shown, an embodiment of the present invention provides a polishing machine, including an upper fixed plate 1, on which an upper polishing pad 2 is disposed. The polishing machine further includes: 3. Robotic arm, 4. Swing arm servo motor, 5. Cylinder, 6. Upper plate servo motor, 7. Bracket, 8. Multiple industrial cameras, and 9. Drying mechanism.

[0025] The upper fixed plate 1 is located at one end of the robotic arm 3, and the other end of the robotic arm 3 is connected to the swing arm servo motor 4, which drives the robotic arm 3 to rotate. The drying mechanism and multiple industrial cameras 8 (or industrial cameras) are mounted on the bracket 7. The drying mechanism is used to dry the upper polishing pad 2, and the industrial cameras 8 are used to capture images of the upper polishing pad 2 to obtain multiple raw images. The raw images are used to analyze whether there are any abnormalities in the upper polishing pad 2. The multiple industrial cameras 8 are arranged linearly, and the shooting areas of each industrial camera 8 overlap.

[0026] It should be noted that, as Figure 3 As shown, after the polishing machine completes the polishing of the silicon wafer 12, the upper polishing pad 2 can be inspected to determine if it is abnormal. If there is no abnormality, the polishing machine stops subsequent material feeding; otherwise, it automatically enters the polishing preparation stage for the next batch. Here, a high-resolution industrial camera (i.e., industrial camera 8) can be used for imaging, ensuring the clarity and quality of the captured images, providing a good foundation for subsequent image processing and defect identification. Furthermore, by analyzing the images of the upper polishing pad 2 captured by the industrial camera 8, it can be determined whether the upper polishing pad 2 is abnormal.

[0027] In some specific examples, the polishing machine includes a frame, a lower platen 13 (on which a lower polishing pad 14 is mounted), and a support 7 that can be mounted on the frame, on which five sets of industrial cameras 8 can be mounted. Figure 3As shown, the bracket 7 is positioned outside the lower fixed plate 13, and five sets of industrial cameras 8 are linearly and evenly arranged on the bracket 7. After the upper fixed plate 1 is tilted at a certain angle (e.g., 45 degrees), the arrangement direction of the five sets of industrial cameras 8 coincides with a certain diameter of the upper fixed plate 1. The shooting areas of the multiple industrial cameras 8 cooperate with each other and overlap (e.g., 10%-15% overlap). Therefore, this embodiment of the invention can capture a more comprehensive image of the upper polishing pad 2 through multiple industrial cameras 8 (combining all the captured original images can fully cover the surface of the upper polishing pad 2), ensuring no detection blind spots and improving the comprehensiveness of detection and shooting efficiency.

[0028] It should also be noted that, such as Figure 3 As shown, the bracket 7 is positioned outside the lower fixed plate 13. After the polishing machine completes the polishing of the silicon wafer 12, the robotic arm 3 can be driven to rotate by the swing arm servo motor 4, thereby causing the upper fixed plate 1 to swing out from above the lower fixed plate 13 to above the industrial camera 8. Before reaching above the industrial camera 8, the upper polishing pad 2 can be dried to prevent water droplets from falling onto the industrial camera 8 and affecting the shooting, thus enabling more accurate detection of any abnormalities in the upper polishing pad 2.

[0029] In some specific examples, cylinder 5 and upper plate servo motor 6 are arranged between upper plate 1 and robotic arm 3. Cylinder 5 is used to drive upper plate 1 to move in the vertical direction, and upper plate servo motor 6 is used to drive upper plate 1 to rotate.

[0030] It should be noted that after the polishing machine completes the polishing of the silicon wafer 12, the upper fixed plate 1 is driven to rotate by the upper fixed plate servo motor 6, which can initially remove most of the water on the upper polishing pad 2. Furthermore, when the industrial camera 8 is filming the upper polishing pad 2, the upper fixed plate 1 can be driven to rotate by the upper fixed plate servo motor 6, causing the upper polishing pad 2 to rotate above the industrial camera 8. The rotation speed of the upper fixed plate 1 can also be controlled, in conjunction with the frame rate of the industrial camera 8, so that a full image of the upper polishing pad 2 can be captured by multiple industrial cameras 8 after one rotation of the upper fixed plate 1.

[0031] In this embodiment, multiple industrial cameras 8 are arranged linearly to ensure comprehensive coverage of the polishing pad, avoiding blind spots caused by a single camera. Driven by the swing arm servo motor 4 and the upper fixed plate servo motor 6, the upper fixed plate 1 can swing out and rotate. Combined with the drying mechanism, the polishing pad can be dried before shooting, removing residual moisture and particles from the surface of the polishing pad, thereby improving the image quality captured by the industrial cameras 8 and enhancing the accuracy of defect identification. Through fully automatic control and shooting processes, automated inspection of the polishing pad is achieved, which significantly improves inspection efficiency compared to manual inspection methods and can meet the needs of mass production.

[0032] In some embodiments, the drying mechanism includes multiple nozzles 9, each nozzle 9 fixed on a bracket 7 and spaced apart from each industrial camera 8. The blowing areas of each nozzle 9 overlap, and the angle between the blowing direction of the nozzle 9 and the horizontal plane is between 25° and 35°.

[0033] In some specific examples, the drying mechanism includes a clean compressed air source (i.e., compressed air with an adjustable pressure of 0.2-0.5 MPa) and six sets of adjustable-angle jet nozzles 9 (specifically, high-pressure jet nozzles). For example... Figure 3 As shown, these nozzles 9 are evenly spaced on the bracket 7, and each nozzle 9 is spaced apart from each industrial camera 8.

[0034] In this embodiment, multiple air nozzles 9 are provided. When the robotic arm 3 is driven to rotate by the swing arm servo motor 4, the multiple air nozzles 9 continuously dry the upper polishing pad 2. The airflow direction of the air nozzles 9 forms a certain angle with the horizontal plane (or with the lower surface of the upper polishing pad 2) (30° is a preferred angle), and the blowing areas of each air nozzle 9 overlap by 10%-15%. This ensures both effective drying and prevents water blown from the upper polishing pad 2 from falling onto the industrial camera 8, thus avoiding interference with the shooting results.

[0035] In some embodiments, the polishing machine further includes a processor, an audible and visual alarm 10, and a display screen 11.

[0036] The processor is used to obtain the detection result corresponding to the upper polishing pad 2 based on the original image.

[0037] Here, as Figure 5 As shown, the processor can specifically be an industrial computer equipped with an image processing system. This image processing system can detect an image of the intact upper polishing pad (which can be used as a reference image) each time a new upper polishing pad is replaced on the polishing machine, and write the obtained image information of the upper polishing pad into the preprocessing module. The image processing system can also reduce noise, add images, and process and identify defects (or anomalies) in the images of the upper polishing pad 2 captured by the industrial camera 8 each time.

[0038] The audible and visual alarm 10 is used to issue an alarm signal when an abnormality occurs in the upper polishing pad 2.

[0039] In a specific example, a PLC controller can be used as the control system, connecting it to various components (such as the processor, the audible and visual alarm 10, and the display screen 11). The PLC controller can then control the audible and visual alarm 10 and the display screen 11 based on the detection results analyzed by the processor. For instance, the control system can promptly receive the detection results and control the audible and visual alarm 10 to issue an alarm signal, facilitating timely handling by operators and preventing quality problems with the silicon wafer 12 caused by abnormalities in the polishing pad 2, thereby improving the product yield.

[0040] The display screen 11 is used to display the detection result corresponding to the upper polishing pad 2 when an abnormality occurs in the upper polishing pad 2.

[0041] Understandably, the display screen 11 can display the information output by the aforementioned industrial computer (i.e., processor) in real time.

[0042] The following provides specific examples illustrating the solutions provided in the embodiments of this application.

[0043] like Figure 6 As shown, the detection process of the polishing pad in the polishing machine in this embodiment of the invention is as follows: S1: After the polishing machine (such as a double-sided polishing machine) has finished processing the silicon wafer 12 normally, the PLC controls the cylinder 5 to drive the upper plate 1 to rise to a low position (that is, to rise to the first preset position, for example, rise about 1cm). Then the upper plate servo motor 6 drives the upper plate 1 to rotate quickly (for example, at a speed of about 30r / min) for a preset time (or a preset number of rotations, such as 3 rotations), thereby shaking off most of the moisture attached to the upper polishing pad 2.

[0044] It should be noted that the plane of the first preset position is lower than the plane of the industrial camera. This can prevent the water adhering to the upper polishing pad 2 from being splashed onto the industrial camera when the upper plate 1 rotates.

[0045] S2: After the upper fixed plate 1 finishes rotating, the PLC-controlled cylinder 5 drives the upper fixed plate 1 to rise to the normal swing height (that is, to the second preset position). Then, the PLC controls the upper fixed plate 1 to swing outward by about 45 degrees, and the upper fixed plate 1 reaches the third preset position. During the initial swing, the air nozzle 9 on the bracket 7 continuously sprays 0.3 MPa of air onto the upper polishing pad 2 to blow away any residual moisture on the upper polishing pad 2.

[0046] like Figure 3 As shown, in an optional example, the robotic arm 3 can be controlled to swing (or rotate) 0-45 degrees via the swing arm servo motor 4 to ensure that the upper polishing pad 2 is fully exposed above the industrial camera 8. The upper plate 1 automatically swings out about 45 degrees and then begins to rotate, allowing for comprehensive image capture of the surface of the upper polishing pad 2 using multiple sets of industrial cameras 8.

[0047] After the upper platen 1 is placed out, the lower platen 13 begins to rotate, which can transport the silicon wafer 12 to the designated position for unloading.

[0048] S3: After the upper fixed plate 1 is positioned at 45 degrees, multiple industrial cameras 8 begin to operate. For example, the industrial cameras 8 capture images of the surface of the upper polishing pad 2 at a frame rate of 10 frames per second. Simultaneously, the upper fixed plate 1 is driven to rotate once at a speed of 5 r / min via the upper fixed plate servo motor 6. During this rotation, the air nozzles 9 continue to spray air onto the surface of the upper polishing pad 2 to ensure that the images captured by the industrial cameras 8 (i.e., the original images) are clean and water-free until the rotation ends and the industrial cameras 8 have finished capturing the image.

[0049] During the above process, when the upper fixed plate 1 rises to the first preset position, its rapid rotation can shake off most of the moisture on the upper polishing pad 2. As the upper fixed plate 1 begins to swing out, i.e., after reaching the third preset position, the air nozzle 9 continuously sprays air onto the upper polishing pad 2 to reduce moisture residue and dripping. In this way, the impact of water droplets on the industrial camera 8 can be reduced from the source, further improving detection accuracy and stability. S4: The industrial camera 8 can transmit the captured images (i.e., the original images) to the industrial computer via a gigabit network. The image processing system in the industrial computer can preprocess the original images to eliminate noise, enhance contrast, and correct distortion. Then, the detection module in the industrial computer is called to compare and analyze the processed image (i.e., the target image) with the reference image (i.e., the image obtained by capturing images of the unused and intact polishing pad surface) to identify damage or other defects (or anomalies) of the upper polishing pad 2.

[0050] S5: If a defect is detected in the upper polishing pad 2, the industrial calculator can send a signal to the PLC, the PLC controls the audible and visual alarm 10 to sound an alarm, and can also control the display screen 11 to display the defect information (or detection results) of the upper polishing pad 2. The polishing machine stops subsequent feeding. If there are no defects, it will automatically enter the next batch of silicon wafer processing preparation stage.

[0051] Understandably, the above polishing pad inspection process is carried out automatically during the silicon wafer 12 unloading waiting process, and has no impact on normal production.

[0052] In this embodiment, multiple industrial cameras 8 are arranged linearly to ensure comprehensive coverage of the polishing pad, avoiding blind spots caused by a single camera. Driven by the swing arm servo motor 4 and the upper fixed plate servo motor 6, the upper fixed plate 1 can swing out and rotate. Combined with the air nozzle 9, the polishing pad can be dried before shooting, removing residual moisture and particles from the surface of the polishing pad, thereby improving the image quality captured by the industrial camera 8 and enhancing the accuracy of defect identification. Through fully automatic control and shooting process, automated and accurate detection of the polishing pad is achieved without manual intervention, significantly improving detection efficiency, reducing downtime, meeting the needs of mass production, increasing productivity, and improving the quality of silicon wafer polishing. like Figure 7 As shown, this embodiment of the invention also provides a polishing pad detection method, applied to the polishing machine described above, including: Step 701: After the polishing process of silicon wafer 12 is completed, control cylinder 5 drives the upper plate 1 to rise to the first preset position.

[0053] Step 702: Control the upper plate servo motor 6 to drive the upper plate 1 to rotate for a preset time.

[0054] It should be noted that within the preset time period, the upper plate 1 can rotate at a certain speed (e.g., 30 r / min) for a preset number of revolutions (e.g., 3 revolutions) to initially remove most of the moisture from the upper polishing pad 2.

[0055] In one example, the rotational speed of the upper plate 1 driven by the upper plate servo motor 6 can be adjusted between 0-30 r / min.

[0056] Step 703: Control cylinder 5 to drive upper plate 1 to rise to the second preset position, the second preset position is higher than the first preset position.

[0057] Step 704: Control the swing arm servo motor 4 to drive the robotic arm 3 to rotate to the third preset position, and control the drying mechanism to continuously dry the upper polishing pad 2 when the robotic arm 3 starts to rotate.

[0058] It is understood that the drying mechanism here can refer to the drying mechanism in the above-described polishing machine embodiment, that is, the drying mechanism may include multiple air nozzles 9.

[0059] Here, the drying mechanism further reduces the residual moisture and dripping on the upper polishing pad 2, thereby reducing the impact of water droplets on the industrial camera 8 and improving the detection accuracy and stability of the polishing pad.

[0060] Step 705: Control the upper plate servo motor 6 to drive the upper plate 1 to rotate one revolution at a preset speed, and control the industrial camera 8 to take pictures of the upper polishing pad 2 at a preset frame rate during the rotation of the upper plate 1 to obtain multiple raw images.

[0061] Here, the preset speed can be 5 r / min.

[0062] Step 706: Obtain the detection results corresponding to the upper polishing pad 2 based on multiple original images.

[0063] In this embodiment, multiple industrial cameras 8 can comprehensively capture images of the polishing pad, avoiding blind spots caused by a single camera. Driven by the swing arm servo motor 4 and the upper fixed plate servo motor 6, the upper fixed plate 1 can swing out and rotate. Combined with the drying mechanism, the polishing pad can be dried before shooting, removing residual moisture and particles from the surface of the polishing pad, thereby improving the image quality captured by the industrial cameras 8 and enhancing the accuracy of defect identification. Through fully automatic control and shooting processes, automated inspection of the polishing pad is achieved, which significantly improves inspection efficiency compared to manual inspection methods and can meet the needs of mass production.

[0064] In some embodiments, the detection result corresponding to the upper polishing pad 2 is obtained based on multiple original images, including: preprocessing multiple original images to obtain a target image corresponding to each original image; comparing and analyzing multiple target images with a reference image to obtain the detection result, wherein the reference image is an image obtained by image acquisition of the surface of an unused and intact polishing pad.

[0065] In this embodiment, a comparative detection algorithm is used to compare and analyze the original image and reference image captured by the industrial camera 8. The algorithm is simple and efficient, and can accurately identify various types of damage anomalies. It has high recognition accuracy and can effectively reduce the occurrence of missed detections and false detections.

[0066] In some embodiments, the method applied to the polishing machine described above further includes: If the test results indicate that the polishing pad 2 is abnormal, perform at least one of the following: control the audible and visual alarm 10 to issue an alarm signal; control the display screen 11 to display the test results corresponding to the polishing pad 2.

[0067] It should be noted that the polishing pad detection method provided in this embodiment of the invention is applied to the polishing machine described above. The structure, method, and beneficial effects involved are similar to those in the various embodiments of the polishing machine described above. The same parts and beneficial effects will not be described in detail here.

[0068] In this embodiment, multiple industrial cameras 8 can comprehensively capture images of the polishing pad, avoiding blind spots caused by a single camera. Driven by the swing arm servo motor 4 and the upper fixed plate servo motor 6, the upper fixed plate 1 can swing out and rotate. With the help of the air nozzle 9, the polishing pad can be dried before shooting, removing residual moisture and particles from the surface of the polishing pad, thereby improving the image quality captured by the industrial cameras 8 and enhancing the accuracy of defect identification. Through the fully automatic control and shooting process, the polishing pad is automatically inspected, which significantly improves the inspection efficiency compared to manual inspection methods and can meet the needs of mass production.

[0069] like Figure 8 As shown, this embodiment of the invention also provides a polishing pad detection device, applied to the polishing machine described above, comprising: The first control module 810 is used to control the cylinder 5 to drive the upper plate 1 to rise to the first preset position after the polishing process of the silicon wafer 12 is completed. The second control module 820 is used to control the upper plate servo motor 6 to drive the upper plate 1 to rotate for a preset time. The third control module 830 is used to control the cylinder 5 to drive the upper plate 1 to rise to the second preset position, which is higher than the first preset position. The fourth control module 840 is used to control the swing arm servo motor 4 to drive the robotic arm 3 to rotate to the third preset position, and to control the drying mechanism to continuously dry the upper polishing pad 2 when the robotic arm 3 starts to rotate. The fifth control module 850 is used to control the upper plate servo motor 6 to drive the upper plate 1 to rotate one revolution at a preset speed, and during the rotation of the upper plate 1, control the industrial camera 8 to take pictures of the upper polishing pad 2 at a preset frame rate to obtain multiple raw images. The first processing module 860 is used to obtain the detection results corresponding to the upper polishing pad 2 based on multiple original images.

[0070] In this embodiment, multiple industrial cameras 8 can comprehensively capture images of the polishing pad, avoiding blind spots caused by a single camera. Driven by the swing arm servo motor 4 and the upper fixed plate servo motor 6, the upper fixed plate 1 can swing out and rotate. Combined with the drying mechanism, the polishing pad can be dried before shooting, removing residual moisture and particles from the surface of the polishing pad, thereby improving the image quality captured by the industrial cameras 8 and enhancing the accuracy of defect identification. Through fully automatic control and shooting processes, automated inspection of the polishing pad is achieved, which significantly improves inspection efficiency compared to manual inspection methods and can meet the needs of mass production.

[0071] In some embodiments, the first processing module 810 includes: The image processing unit is used to preprocess multiple original images to obtain the target image corresponding to each original image; The comparison analysis unit is used to compare and analyze multiple target images with a reference image to obtain detection results. The reference image is an image obtained by image acquisition of an unused and intact polishing pad surface.

[0072] In some embodiments, the apparatus further includes: The sixth control module is used to perform at least one of the following actions when the polishing pad 2 shows an abnormality in the test results: Control the audible and visual alarm 10 to emit an alarm signal; The control display screen 11 displays the test results corresponding to the upper polishing pad 2.

[0073] This application also provides a testing device, including a memory, a processor, and a computer program stored in the memory and executable on the processor; when the processor executes the computer program, it implements the polishing pad testing method described above.

[0074] This application also provides a computer program product, including computer instructions, which, when executed by a processor, implement the above-described... Figure 7 The various processes of the method embodiments shown can achieve the same technical effect, and will not be described again here to avoid repetition.

[0075] This application also provides a readable storage medium storing a program or instructions thereon, which, when executed by a processor, implement the steps in the polishing pad detection method described above.

[0076] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, since the embodiments are basically similar to the product embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the product embodiments.

[0077] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0078] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0079] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0080] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A polishing machine, characterized in that, The polishing machine includes an upper fixed plate (1) on which an upper polishing pad (2) is disposed, and the polishing machine further includes: The robotic arm (3) and the swing arm servo motor (4) are provided. The upper fixed plate (1) is set at one end of the robotic arm (3), and the other end of the robotic arm (3) is connected to the swing arm servo motor (4). The swing arm servo motor (4) is used to drive the robotic arm (3) to rotate. A cylinder (5) and an upper plate servo motor (6) are disposed between the upper plate (1) and the robotic arm (3). The cylinder (5) is used to drive the upper plate (1) to move in the vertical direction, and the upper plate servo motor (6) is used to drive the upper plate (1) to rotate. The bracket (7), multiple industrial cameras (8) and drying mechanism are arranged on the bracket (7). The drying mechanism is used to dry the upper polishing pad (2). The industrial cameras (8) are used to take pictures of the upper polishing pad (2) to obtain multiple original images. The original images are used to analyze whether there are any abnormalities in the upper polishing pad (2). The multiple industrial cameras (8) are arranged linearly, and the shooting areas of each industrial camera (8) overlap.

2. The polishing machine according to claim 1, characterized in that, The drying mechanism includes multiple air nozzles (9), each of which is fixed on a bracket (7) and spaced apart from each of the industrial cameras (8); Among them, the blowing areas of each jet nozzle (9) have overlapping areas, and the angle between the jet direction of the jet nozzle (9) and the horizontal plane is between 25° and 35°.

3. The polishing machine according to claim 1, characterized in that, The polishing machine also includes: A processor is configured to obtain the detection result corresponding to the upper polishing pad (2) based on the original image; An audible and visual alarm (10) is used to issue an alarm signal when an abnormality occurs in the upper polishing pad (2); The display screen (11) is used to display the detection result corresponding to the upper polishing pad (2) when the upper polishing pad (2) is abnormal.

4. A method for detecting polishing pads, characterized in that, Applied to the polishing machine as described in any one of claims 1 to 3, comprising: After the polishing process of the silicon wafer (12) is completed, the control cylinder (5) drives the upper plate (1) to rise to the first preset position; The upper fixed plate servo motor (6) is controlled to drive the upper fixed plate (1) to rotate for a preset time; The control cylinder (5) drives the upper plate (1) to rise to the second preset position, which is higher than the first preset position; The control arm servo motor (4) drives the robotic arm (3) to rotate to the third preset position, and when the robotic arm (3) starts to rotate, the control drying mechanism continuously performs drying operation on the upper polishing pad (2); The upper fixed plate servo motor (6) is controlled to drive the upper fixed plate (1) to rotate one revolution at a preset speed. During the rotation of the upper fixed plate (1), the industrial camera (8) is controlled to take pictures of the upper polishing pad (2) at a preset frame rate to obtain multiple original images. Based on the multiple original images, the detection results corresponding to the upper polishing pad (2) are obtained.

5. The polishing pad testing method according to claim 4, characterized in that, The step of obtaining the detection result corresponding to the upper polishing pad (2) based on the multiple original images includes: The multiple original images are preprocessed to obtain a target image corresponding to each original image; The detection results are obtained by comparing and analyzing multiple target images with reference images. The reference image is an image obtained by acquiring images of an unused and intact polishing pad surface.

6. The polishing pad detection method according to claim 4, characterized in that, The method, applied to the polishing machine as described in claim 3, further includes: If the test results indicate that the upper polishing pad (2) is abnormal, perform at least one of the following: Control the audible and visual alarm (10) to emit an alarm signal; The control display screen (11) displays the test results corresponding to the upper polishing pad (2).

7. A polishing pad detection device, characterized in that, Applied to the polishing machine as described in any one of claims 1 to 3, comprising: The first control module is used to control the cylinder (5) to drive the upper plate (1) to rise to the first preset position after the polishing process of the silicon wafer (12) is completed; The second control module is used to control the upper plate servo motor (6) to drive the upper plate (1) to rotate for a preset time; The third control module is used to control the cylinder (5) to drive the upper plate (1) to rise to the second preset position, which is higher than the first preset position; The fourth control module is used to control the swing arm servo motor (4) to drive the robotic arm (3) to rotate to the third preset position, and to control the drying mechanism to continuously dry the upper polishing pad (2) when the robotic arm (3) starts to rotate. The fifth control module is used to control the upper fixed plate servo motor (6) to drive the upper fixed plate (1) to rotate one revolution at a preset speed, and during the rotation of the upper fixed plate (1), control the industrial camera (8) to take pictures of the upper polishing pad (2) at a preset frame rate to obtain multiple original images; The first processing module is used to obtain the detection result corresponding to the upper polishing pad (2) based on the multiple original images.

8. A detection device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor; characterized in that, When the processor executes the computer program, it implements the polishing pad detection method as described in any one of claims 4 to 6.

9. A computer program product, characterized in that, It includes computer instructions that, when executed by a processor, implement the steps of the polishing pad detection method as described in any one of claims 4 to 6.

10. A readable storage medium having a program or instructions stored thereon, characterized in that, When the program or instructions are executed by the processor, they implement the steps in the polishing pad detection method as described in any one of claims 4 to 6.

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