Strain type forming and laminating device suitable for VR product and method of strain type forming and laminating device

Abstract

The invention discloses a strain type forming and attaching device suitable for VR products and an attaching method thereof.The device comprises a forming module and an attaching module, the forming module is composed of a die head, a sealing pressing plate, a silica gel sheet, a lower cavity and a spoiler, and the attaching module comprises a laser ranging unit, a CCD visual alignment unit, a dispensing unit and a UV curing unit; the method comprises a front-stage strain type forming method and a rear-stage strain type forming and attaching method, and the forming method achieves precise forming of a membrane material through the steps of die head heating, silica gel sheet tensioning, pre-forming, pressure forming and the like. According to the fitting method, high-precision fitting of the formed film material and the VR lens is achieved through the steps of plasma cleaning, precise dispensing, CCD alignment, UV curing and the like. Forming and attaching integrated operation is achieved, the film material is evenly stressed, the attaching precision and the product yield are improved, the production cost is reduced, VR products of different curved surfaces and different materials are adapted, and the mass production requirement is met.

Description

Technical Field

[0001] This invention relates to the field of electronic manufacturing technology, specifically to a strain gauge molding bonding device and bonding method suitable for VR products. Background Technology

[0002] In the manufacturing process of near-eye display products such as VR / AR, the bonding of optical films to curved lenses is one of the core processes, directly affecting the product's optical performance and yield. Currently, the mainstream bonding solutions fall into two main categories: 1. Rigid mold bonding process: This method uses a rigid mold that matches the curved surface of the product to directly apply pressure for bonding. This method has concentrated pressure, which can easily lead to damage or deformation of the film or lens. In addition, the mold needs to be made separately for different products, which has poor versatility and cannot be adapted to complex curved surface structures.

[0003] 2. Flexible PAD pressing head bonding process: Using flexible pressing heads such as silicone PADs for pressure application alleviates the problem of damage to rigid mold heads, but the deformation of silicone is uncontrollable, the pressure distribution is uneven, and defects such as bubbles, wrinkles, and localized poor bonding are easily generated on the bonding surface, resulting in a yield rate generally below 85%. At the same time, the manufacturing process of silicone PADs is complex, costly, has a short service life, and poor versatility. Furthermore, existing bonding processes are mostly step-by-step operations of "molding + bonding," requiring multiple sets of carriers and equipment, resulting in a cumbersome process. The high pressure during bonding can easily cause product deformation and displacement, making it difficult to meet the high precision requirements of ±0.02mm for VR products, thus becoming a core bottleneck for mass production in the industry. Corresponding existing devices also suffer from problems such as complex structure, poor versatility, insufficient precision, and susceptibility to product defects. Summary of the Invention

[0004] To address the problems of low yield, uneven pressure, easy product breakage and deformation, numerous air bubbles and wrinkles, poor bonding accuracy, and insufficient versatility in existing VR product bonding processes, as well as the defects of unreasonable structure and poor adaptability of existing devices, this invention provides a strain-type molding bonding device and bonding method suitable for VR products. It realizes integrated molding and bonding operations, improves bonding accuracy and product yield, reduces production costs, and adapts to the mass production needs of complex curved VR products.

[0005] To solve the above technical problems, the present invention achieves this through the following solution: The present invention provides a strain-type molding and bonding device for VR products, used to realize the integrated operation of VR product film molding and lens bonding, including a molding module and a bonding module; The molding module includes: The mold head is equipped with a heating unit and a vacuum adsorption channel inside, which is connected to a vacuum source. The sealing pressure plate is movable up and down and has a through cavity for the die head to pass through; Silicone film, used for sealing; The lower cavity is located directly below the sealing pressure plate and has a stepped cavity that runs through the upper and lower ends and is wider at the top and narrower at the bottom. The silicone skin is tensioned and set on the top of the lower cavity. The sealing pressure plate presses down against the silicone skin so that the silicone skin completely covers the stepped cavity and forms a seal between the lower cavity and the silicone skin. A spoiler is fixedly disposed in the lower cavity and located in the pressurization channel area, which is used to evenly disperse the compressed air in the lower cavity; The bonding module includes: A laser ranging unit is used to measure the height position of the molded film material and the VR lens. The CCD visual alignment unit includes upper and lower dual CCD cameras, which are used to photograph and align the molded film material with the VR lens. The dispensing unit is linked with the laser ranging unit and the CCD vision alignment unit to accurately apply adhesive. The UV curing unit is used to cure the glue after bonding.

[0006] Furthermore, the silicone skin is made of silicone material that allows for adjustment of tension along its circumference.

[0007] Furthermore, the mold head has a curved profile.

[0008] The present invention provides a strain-type molding and bonding method applicable to VR products, wherein the strain-type molding and bonding method is implemented using the aforementioned molding and bonding device.

[0009] Furthermore, the strain-forming bonding method includes a pre-stage strain-forming method and a post-stage strain-forming bonding method.

[0010] Furthermore, the strain-forming method comprises the following steps: S1, Material preparation: Heat the mold head to the working temperature, and stretch and tighten the silicone skin outwards along the perimeter; S2, Loading: Place the membrane material on the taut silicone sheet; S3, Pre-forming: The die head slowly descends to the forming pressure position. When the die head contacts the film material, the taut silicone skin gradually releases the tension as the die head descends, thus pre-forming the film material. S4, Pressure molding: The die head descends and fully fits the film material. The sealing plate presses down to seal the lower cavity. Compressed air is filled into the lower cavity. The airflow is evenly applied to the silicone skin by the baffle plate, and the film material is squeezed towards the die head to form the shape. S5, Pressure Holding and Cooling: Maintain the lower cavity filling pressure, cool the die head to room temperature, and eliminate residual stress in the film material; S6, Pressure Relief: The mold head is activated for vacuum adsorption, the lower cavity is depressurized, the sealing plate rises, and the film forming is completed.

[0011] Furthermore, the steps of the strain-forming bonding method are as follows: S1, Loading and Cleaning: Plasma cleaning of VR lenses; S2, Top and bottom glue application: The height position of the formed film material and the lens is measured by laser and combined with CCD vision positioning to apply glue to the top of the convex surface of the formed film material and the bottom of the concave surface of the lens. S3, CCD alignment: Use upper and lower dual CCD cameras to photograph and align the formed film material and lens to correct horizontal position deviation. S4, bonding and curing: The mold head drives the formed film material to descend, squeezes the adhesive to the preset bonding position, and cures it by UV light after bonding is completed.

[0012] Furthermore, the working temperature of the die head is set according to the material of the film, and ranges from 80 to 120°C.

[0013] Furthermore, the lower cavity is pressurized at a pressure ranging from 0.2 to 0.4 MPa.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. The strain-forming bonding device of the present invention improves product yield: the strain-forming process and device make the film material uniformly stressed, completely eliminating defects such as bubbles, wrinkles, and poor bonding, thus improving product yield; at the same time, it avoids the problem of pressure concentration of rigid mold heads and reduces product breakage rate; 2. The strain-type molding and bonding device of the present invention reduces production costs: the integrated molding and bonding device design reduces the number of carriers and molds used, simplifies equipment layout, and reduces equipment procurement and maintenance costs; the silicone sheet can be reused to replace the high-cost flexible PAD, further reducing consumable costs; 3. The strain-forming bonding method of the present invention improves bonding accuracy: the dual positioning structure of laser + vision, combined with the precise control of the control module, achieves precise control of bonding thickness and horizontal position, the bonding accuracy meets the requirements of VR products, and improves the consistency of optical performance; 4. The strain-type molding and bonding method of the present invention enhances the versatility of the process and equipment: it can be adapted to VR optical films and lenses of different materials and different curvatures. Only one mold head needs to be replaced and the control module parameters need to be adjusted to adapt to new products, thus shortening the new product introduction cycle. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the strain-type molding and bonding device of the present invention.

[0016] Figure 2 This is a schematic diagram of step S1 of the strain-type forming method in the first stage of the present invention.

[0017] Figure 3 This is a schematic diagram of step S2 in the strain-type forming method of the present invention.

[0018] Figure 4 This is a schematic diagram of step S3 in the strain-type forming method of the present invention.

[0019] Figure 5 This is a schematic diagram of step S4 in the strain-type forming method of the present invention.

[0020] Figure 6 This is a schematic diagram of step S5 in the strain-type forming method of the present invention.

[0021] Figure 7 This is a schematic diagram of step S6 in the strain-type forming method of the present invention.

[0022] Figure 8 This is a schematic diagram of step S1 of the strain-type molding and bonding method in the later stage of the present invention.

[0023] Figure 9 This is a schematic diagram of step S2 of the strain-type molding and bonding method in the later stage of the present invention.

[0024] Figure 10 This is a schematic diagram of step S3 in the strain-type molding and bonding method of the later stage of the present invention.

[0025] Figure 11 This is a schematic diagram of step S4 in the strain-type molding and bonding method of the present invention.

[0026] The following labels are used in the attached diagram: 1-Die head, 2-Sealing pressure plate, 3-Silicone skin, 4-Lower cavity, 5-Membrane material, 6-Break plate, 7-Membrane material after molding, 8-VR lens, 9-Glue, 10-Laser ranging unit, 11-CCD vision alignment unit, 12-UV lamp, 13-Glue layer. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention. Obviously, the embodiments described in this invention are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0029] Example 1: The specific structure of the present invention is as follows: Please refer to the appendix. Figure 1 The present invention provides a strain-type molding and bonding device for VR products, which is used to realize the integrated operation of VR product film molding and lens bonding, including a molding module and a bonding module. The molding module includes: The mold head 1 is equipped with a heating unit and a vacuum adsorption channel inside, which is connected to a vacuum source; the mold head also has a curved profile that matches the VR lens 8. The sealing plate 2 can move up and down and has a through cavity for the die head 1 to pass through; Silicone film 3, used for sealing; The lower cavity 4 is located directly below the sealing pressure plate 2 and has a stepped cavity that runs through the upper and lower ends and is wider at the top and narrower at the bottom. The silicone skin 3 is tensioned and set on the top of the lower cavity 4. The sealing pressure plate 2 presses down and abuts against the silicone skin 3 so that the silicone skin 3 completely covers the stepped cavity and forms a seal between the lower cavity 4 and the silicone skin 3. The spoiler 6 is fixedly disposed in the lower cavity 4 and located in the pressurization channel area, and is used to evenly disperse the compressed air in the lower cavity. The bonding module includes: A laser ranging unit is used to measure the height position of the molded film material and the VR lens. The CCD visual alignment unit includes upper and lower dual CCD cameras, which are used to photograph and align the molded film material with the VR lens. The dispensing unit is linked with the laser ranging unit and the CCD vision alignment unit to accurately apply adhesive. The UV curing unit is used to cure the glue after bonding.

[0030] The silicone skin is made of silicone material whose tension can be adjusted around its perimeter. Example

[0031] The present invention provides a strain-type molding and bonding method applicable to VR products. The strain-type molding and bonding method is implemented using the aforementioned molding and bonding device, and includes a pre-stage strain-type molding method and a post-stage strain-type molding and bonding method.

[0032] like Figure 2-7 As shown, the steps of the strain-forming method are as follows: S1. Material preparation: Heat the mold head 1 to the working temperature (the working temperature is set according to the film material, and the range is 80-120℃). At the same time, stretch the silicone skin 3 outwards along the perimeter to ensure that the surface of the silicone skin 3 is flat and wrinkle-free, so as to provide stable support for the placement of the film material 5.

[0033] S2. Feeding: Place the film material to be formed on the taut silicone sheet 3, adjust the position of the film material 5 to ensure that the film material 5 is centered, and avoid displacement that will affect the subsequent forming accuracy.

[0034] S3. Pre-forming: The die head 1 slowly descends to the forming pressure position. When the die head 1 contacts the film material, the taut silicone skin 3 gradually releases the tension as the die head 1 descends, so that the film material 5 slowly deforms with the curved contour of the die head 1 to complete the pre-forming and avoid the film material 5 from being damaged or wrinkled due to sudden force.

[0035] S4. Pressure molding: The die head 1 continues to descend and fully fits the film material 5. Then, the sealing plate 2 presses down, pressing the silicone skin 3 tightly against the top of the lower cavity 4, so that a seal is formed between the lower cavity 4 and the silicone skin 3. Compressed air is filled into the lower cavity 4 (the filling pressure range is 0.2-0.4MPa). The airflow is evenly dispersed by the baffle plate 6 and then acts on the silicone skin 3. The silicone skin 3 squeezes the film material 5 towards the die head 1, so that the film material 5 fully fits the curved surface of the die head 1, and the molding is completed.

[0036] S5. Pressure holding and cooling: Keep the charging pressure of the lower cavity 4 constant, and at the same time cool the mold head 1 to room temperature. The residual stress generated during the molding process of the film material 5 is eliminated by pressure holding and cooling, so as to avoid the springback of the film material 5 after molding and ensure molding accuracy.

[0037] S6. Depressurization: Open the vacuum adsorption channel inside the mold head 1 (the vacuum adsorption channel is connected to the vacuum source) to adsorb and fix the formed film material; then the lower cavity 4 is depressurized, the sealing plate 2 rises, and the overall forming of the film material 5 is completed, waiting for the subsequent bonding process.

[0038] like Figure 8-11 As shown, the steps of the strain-type molding and bonding method are as follows: S1. Loading and Cleaning: Load the VR lens 8 and perform plasma cleaning on the bonding surface of the VR lens 8 to remove dust, oil and other impurities from the surface of the VR lens 8, improve the adhesion of the adhesive and prevent air bubbles from forming after bonding.

[0039] S2. Top and bottom dispensing: The CCD vision alignment unit 11 takes pictures of the bonding area and positions it. Combined with the laser ranging unit 10, the height position of the molded film material and the VR lens 8 is measured to accurately determine the dispensing position. The dispensing unit works in conjunction with the laser ranging unit and the CCD vision alignment unit to accurately apply the glue to the top of the convex surface of the molded film material and the bottom of the concave surface of the VR lens 8, ensuring that the amount of glue 9 is uniform and the position is accurate.

[0040] S3.CCD Alignment: The upper and lower dual CCD cameras are used to photograph and align the molded film material with the VR lens 8. The horizontal position deviation between the two is corrected by image analysis to ensure that the bonding surfaces are completely aligned and meet the high-precision bonding requirements of the VR lens 8.

[0041] S4. Bonding and Curing: The mold head 1 slowly lowers the formed film material 7, squeezing the adhesive 9 to the preset bonding position after laser detection, so that the film material 5 and the VR lens 8 are completely bonded. The adhesive 9 is evenly distributed on the bonding surface to form an adhesive layer 13. After bonding, the adhesive layer 13 is irradiated with a UV lamp 12 to achieve rapid curing of the adhesive and complete the entire bonding process.

[0042] In summary, the strain-forming bonding device of the present invention improves product yield: the strain-forming process and device ensure uniform stress on the film material, completely eliminating defects such as bubbles, wrinkles, and incomplete bonding, thereby improving product yield; at the same time, it avoids the pressure concentration problem of rigid mold heads, reducing product breakage rate; The strain-type molding and bonding device of this invention reduces production costs: the integrated molding and bonding device design reduces the number of carriers and molds used, simplifies equipment layout, and reduces equipment procurement and maintenance costs; the silicone sheet is reusable, replacing high-cost flexible PADs, further reducing consumable costs; The strain-forming bonding method of this invention improves bonding accuracy: the dual positioning structure of laser and vision, combined with the precise control of the control module, enables precise control of bonding thickness and horizontal position, and the bonding accuracy meets the requirements of VR products, improving the consistency of optical performance; The strain-forming bonding method of this invention enhances the versatility of the process and equipment: it can be adapted to VR optical films and lenses of different materials and curvatures. Only one mold head needs to be replaced and the control module parameters adjusted to adapt to new products, thus shortening the new product introduction cycle.

[0043] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A strain gauge molding and bonding device for VR products, used to achieve integrated operation of VR product film molding and lens bonding, characterized in that, Includes molding modules and bonding modules; The molding module includes: The mold head (1) is equipped with a heating unit and a vacuum adsorption channel inside it, which is connected to a vacuum source. The sealing plate (2) can move up and down and has a through cavity for the die head (1) to pass through; Silicone film (3), used for sealing; The lower cavity (4) is located directly below the sealing pressure plate (2) and has a stepped cavity that runs through the upper and lower ends and is wider at the top and narrower at the bottom. The silicone skin (3) is tensioned and set on the top of the lower cavity (4). The sealing pressure plate (2) presses down against the silicone skin (3) so that the silicone skin (3) completely covers the stepped cavity and forms a seal between the lower cavity (4) and the silicone skin (3). A spoiler (6) is fixedly installed in the lower cavity (4) and located in the pressurization channel area. It is used to evenly disperse the compressed air in the lower cavity. The bonding module includes: A laser ranging unit is used to measure the height position of the molded film material and the VR lens. The CCD visual alignment unit includes upper and lower dual CCD cameras, which are used to photograph and align the molded film material with the VR lens. The dispensing unit is linked with the laser ranging unit and the CCD vision alignment unit to accurately apply adhesive. The UV curing unit is used to cure the glue after bonding.

2. The strain-type molding and bonding device for VR products according to claim 1, characterized in that, The silicone skin is made of silicone material whose tension can be adjusted around its perimeter.

3. The strain-type molding and bonding device for VR products according to claim 1, characterized in that, The mold head (1) has a curved profile.

4. A strain-fitting molding method suitable for VR products, characterized in that, It is achieved using the molding and bonding device described in any one of claims 1-4.

5. The strain-fitting molding method for VR products according to claim 4, characterized in that, It includes a pre-stage strain-based molding method and a post-stage strain-based molding bonding method.

6. The strain-fitting molding method for VR products according to claim 5, characterized in that, The strain-forming method has the following steps: S1, Material preparation: Heat the mold head (1) to the working temperature, and stretch and tighten the silicone skin (3) outwards from all sides; S2, Loading: Place the membrane material (5) on the taut silicone sheet (3); S3, Pre-forming: The die head (1) slowly descends to the forming pressure position. When the die head (1) contacts the film material (5), the taut silicone skin (3) gradually releases the tension as the die head (1) descends, and pre-forms the film material (5). S4, Pressure molding: The die head (1) descends and fully fits the film material (5), the sealing plate (2) presses down to seal the lower cavity (4), the lower cavity (4) is filled with compressed air, and the airflow is evenly applied to the silicone skin (3) through the baffle plate (6) to extrude the film material (5) towards the die head (1) to form the film material; S5, Pressure holding and cooling: Maintain the charging pressure of the lower cavity (4), and cool the mold head (1) to room temperature to eliminate residual stress in the film material (5); S6, depressurization: Open the mold head (1) for vacuum adsorption, depressurize the lower cavity (4), and the sealing plate (2) rises to complete the forming of the membrane material (5).

7. The strain-fitting molding method for VR products according to claim 6, characterized in that, The steps of the strain-type molding and bonding method are as follows: S1, Loading and Cleaning: Plasma cleaning of VR lenses; S2, Top and bottom glue application: The height position of the formed film material and the lens is measured by laser and combined with CCD vision positioning to apply glue to the top of the convex surface of the formed film material and the bottom of the concave surface of the lens. S3, CCD alignment: Use upper and lower dual CCD cameras to photograph and align the formed film material and lens to correct horizontal position deviation. S4, bonding and curing: The mold head (1) drives the molded film to descend, squeezes the glue to the preset bonding position, and cures it by UV lamp after bonding is completed.

8. The strain-forming bonding method according to claim 7, characterized in that, The working temperature of the die head (1) is set according to the material of the film, and the range is 80-120℃.

9. The strain-modulated molding and bonding method according to claim 7, characterized in that, The lower cavity (4) is pressurized at a pressure range of 0.2-0.4 MPa.

Images