TEC self-adaptive anti-condensation heat dissipation control method and device, medium and product

Abstract

The invention provides a TEC self-adaptive anti-condensation heat dissipation control method and device, a medium and a product, and the method comprises the following steps: obtaining and calculating the environment temperature and humidity of the device and the refrigeration surface temperature of a TEC module in real time, calculating the real-time dew-point temperature through a preset dew-point model, determining a first temperature threshold value in combination with a safety temperature margin, and calculating the temperature of the refrigeration surface of the TEC module according to the first temperature threshold value; and a buffer difference value is added to obtain a higher second temperature threshold value. When the refrigeration surface temperature is higher than a second threshold value, a first driving current is determined through negative feedback logic based on the difference value between the real-time temperature and the target refrigeration temperature; when the temperature is between the two threshold values, the difference value between the real-time temperature and the first threshold value is multiplied by the proportionality coefficient to obtain the second driving current. By implementing the method, the TEC driving current can be dynamically adjusted according to the environmental condition and the equipment operation state, the heat dissipation effect is optimized on the premise of ensuring no condensation, the self-adaptive balance of anti-condensation and heat dissipation performance is realized, the operation stability and the use reliability of the computing equipment are effectively improved, and the service life of the equipment is prolonged.

Description

Technical Field

[0001] This application relates to the field of temperature control technology for electronic devices, and in particular to a TEC adaptive anti-condensation heat dissipation control method, device, medium, and product. Background Technology

[0002] With the rapid development of high-performance computing hardware towards miniaturization and integration, MINI-PCs (mini PCs) are becoming increasingly popular in office, entertainment, and industrial control fields due to their small size and high performance. How to efficiently dissipate heat from the high-heat-density CPU (Central Processing Unit) within a limited chassis space has become a core requirement for ensuring device performance and operational stability. TEC (Thermo Electric Cooler) technology, with its active and efficient cooling capabilities, is widely used to solve the heat dissipation bottleneck problem of such highly integrated electronic devices.

[0003] In existing technologies, to prevent condensation during TEC (Digital Cooling Device) cooling, global heating and dehumidification or control strategies based on preset fixed temperature thresholds are typically employed. For example, the TEC's operating temperature is set above a fixed safe value, or a heating device is used to raise the ambient temperature. However, existing fixed-threshold control methods lack adaptability to complex and variable environmental temperatures and humidity (such as high-temperature, high-humidity or low-temperature, dry environments). This makes it easy to limit the TEC's cooling potential in dry environments and difficult to prevent condensation on cold surfaces in humid environments. This results in limited heat dissipation efficiency and the risk of PCBA short-circuit faults due to condensation during actual operation of electronic devices. Summary of the Invention

[0004] In view of this, this application provides a TEC adaptive anti-condensation heat dissipation control method, device, medium, and product to solve the above problems.

[0005] Firstly, a TEC adaptive anti-condensation heat dissipation control method is provided, the method comprising:

[0006] It can acquire real-time ambient temperature and humidity data of the environment in which the computing device is located, and also acquire real-time temperature data of the cooling surface of the TEC module attached to the CPU surface inside the computing device.

[0007] Based on ambient temperature and humidity data, the real-time dew point temperature value is calculated using a preset dew point calculation model.

[0008] The real-time dew point temperature value is added to the preset safe temperature margin value to obtain the first temperature threshold, and the first temperature threshold is added to the preset buffer difference to obtain the second temperature threshold. The second temperature threshold is greater than the first temperature threshold.

[0009] When the real-time temperature data is higher than the second temperature threshold, the difference between the real-time temperature data and the preset target cooling temperature is calculated to obtain the target difference value. The first drive current value corresponding to the target difference value is calculated according to the negative feedback control logic, and the TEC module is driven by the first drive current value.

[0010] When the real-time temperature data is between the first temperature threshold and the second temperature threshold, the difference between the real-time temperature data and the first temperature threshold is calculated to obtain the threshold difference value. The threshold difference value is multiplied by a preset scaling factor to obtain the second drive current value, and the TEC module is driven by the second drive current value.

[0011] The above technical solution collects real-time data on the ambient temperature and humidity of the computing device, as well as the temperature of the TEC cooling surface. It then calculates the dew point temperature using a dew point calculation model, determining two temperature thresholds. This allows the system to dynamically adjust the TEC drive current based on the temperature range. When the temperature exceeds the second threshold, rapid cooling occurs; when the temperature is between the two thresholds, the cooling current is flexibly controlled. This effectively maintains the CPU temperature without producing condensation, achieving a balance between condensation prevention and heat dissipation efficiency.

[0012] Optionally, the first temperature threshold is obtained by adding the real-time dew point temperature value to a preset safe temperature margin value, specifically including:

[0013] The rate of change of ambient humidity data is continuously monitored according to a preset sampling period.

[0014] When the rate of change exceeds the preset humidity abrupt change threshold, a preset compensation function is invoked to generate a dynamic compensation value that is positively correlated with the rate of change.

[0015] The preset basic safety value and the dynamic compensation value are summed to obtain the current safe temperature margin value, and the safe temperature margin value is added to the real-time dew point temperature value to obtain the first temperature threshold.

[0016] The above technical solution detects the rate of change in ambient humidity and dynamically compensates for the safety temperature margin when humidity changes abruptly, allowing the safety margin to be automatically adjusted according to changes in external humidity. When a sudden increase in ambient humidity causes the dew point to rise, the system can immediately increase the safety margin, thereby raising the anti-condensation threshold and preventing condensation on the cooling surface caused by sudden environmental changes.

[0017] Optionally, the second temperature threshold is obtained by adding the first temperature threshold to a preset buffer difference, specifically including:

[0018] Based on the preset interval mapping relationship, determine the buffer difference that is proportional to the safe temperature margin value;

[0019] The second temperature threshold is obtained by adding the first temperature threshold to the buffer difference.

[0020] The above technical solution determines a buffer difference proportional to the safety temperature margin, allowing the second temperature threshold to dynamically change with the environmental safety margin. When changes in environmental humidity or temperature cause the safety margin to increase or decrease, the buffer difference changes synchronously, thereby ensuring that the interval between the two temperature control zones is always reasonable, preventing frequent switching due to an overly narrow control zone or sluggish response due to an overly wide control zone.

[0021] Optionally, the target difference is obtained by calculating the difference between the real-time temperature data and the preset target cooling temperature, specifically including:

[0022] Real-time acquisition of the current core load rate and current operating frequency of the CPU in the computing device;

[0023] Find the recommended operating temperature value corresponding to the current core load rate and current operating frequency in the preset energy efficiency optimization mapping table;

[0024] Assign the recommended operating temperature value to the target cooling temperature;

[0025] The target difference is calculated by subtracting the target cooling temperature from the real-time temperature data.

[0026] The above technical solution dynamically selects the recommended operating temperature as the target cooling temperature from the energy efficiency mapping table by real-time collection of CPU core load rate and operating frequency, thus matching the cooling target with the CPU's real-time power consumption. This allows for lowering the target temperature to enhance heat dissipation under high CPU load and appropriately raising the target temperature to reduce energy consumption under light load, thereby balancing performance and energy efficiency.

[0027] Optionally, the method also includes:

[0028] A target temperature arbitration mechanism is established, defining the recommended operating temperature value as a candidate target value to be verified;

[0029] The candidate target values ​​are substituted into the safety constraints based on the second temperature threshold for legality verification;

[0030] If the candidate target value is less than the second temperature threshold, it is determined that the candidate target value has not passed the safety constraint condition, and the second temperature threshold is determined as the final effective target cooling temperature;

[0031] If the candidate target value is greater than or equal to the second temperature threshold, the candidate target value is determined to pass the safety constraint conditions, and the candidate target value is determined as the final effective target cooling temperature.

[0032] The above technical solution employs a target temperature arbitration mechanism to verify the validity of candidate target values ​​determined based on the load. If a candidate value is lower than a safety threshold, it is automatically adjusted to the safety threshold, ensuring that the cooling target does not fall below the anti-condensation temperature limit. This mechanism effectively prevents condensation on the cooling surface due to excessively low target temperature settings in high-humidity environments, thereby guaranteeing long-term stable system operation.

[0033] Optionally, the threshold difference is multiplied by a preset scaling factor to obtain the second drive current value, specifically including:

[0034] Calculate the rate of decrease of real-time temperature data over time;

[0035] Based on the preset damping adjustment model, a dynamic proportional coefficient that is negatively correlated with the descent rate is generated, wherein the larger the descent rate, the smaller the dynamic proportional coefficient.

[0036] The second drive current value is obtained by multiplying the threshold difference by the dynamic scaling factor.

[0037] The above technical solution calculates the real-time temperature drop rate and generates a dynamic proportional coefficient negatively correlated with it based on a damping adjustment model. This causes the proportional coefficient to automatically decrease when the temperature drops rapidly, thereby reducing the amplitude of drive current changes. This design avoids temperature fluctuations or condensation caused by over-cooling, improving the smoothness of the control process and the stability of the system response.

[0038] Optionally, the TEC module can be driven using either a first drive current value or a second drive current value, specifically including:

[0039] Use the first or second drive current value to be loaded as the target current value;

[0040] Obtain the stored historical drive current value from the previous moment, and calculate the current change between the target current value and the historical drive current value.

[0041] If the change in current exceeds the preset current ramp-up limit, the change in the target current value is limited based on the current ramp-up limit, and a smoothed final drive control signal is generated and loaded into the TEC module.

[0042] The above technical solution calculates the change between the target current and the previous drive current before applying the drive current, and uses a preset current ramp-up limit to limit the amplitude, making the drive current change of the TEC module smoother. This measure can prevent thermal shock and mechanical stress to the TEC device caused by sudden current changes, extend the module's service life, and reduce system noise and energy consumption.

[0043] In a second aspect, an electronic device is provided, including a processor, a memory, a user interface, and a network interface, wherein the memory is used to store instructions, the user interface and the network interface are both used to communicate with other devices, and the processor is used to execute the instructions stored in the memory to cause the electronic device to perform the method as described in any of the above.

[0044] Thirdly, a computer-readable storage medium is provided that stores instructions which, when executed, perform the method as described in any of the preceding descriptions.

[0045] Fourthly, a computer program product containing instructions is provided, which, when run on a server, causes the server to perform the method described in the first aspect and any possible implementation thereof.

[0046] Understandably, the electronic device provided in the second aspect, the computer-readable storage medium provided in the third aspect, and the computer program product provided in the fourth aspect are all used to execute the method provided in this application. Therefore, the beneficial effects they can achieve can be referred to the beneficial effects in the corresponding methods, and will not be repeated here.

[0047] In summary, implementing one or more technical solutions provided in this application has at least the following technical effects or advantages:

[0048] Addressing the shortcomings of existing technologies that typically employ fixed temperature threshold control strategies, which fail to fully unleash the cooling potential of the TEC (Digital Temperature Controller) in dry, low-humidity environments, while causing condensation due to the rigid threshold in high-temperature, high-humidity environments, this application offers a significant improvement: by introducing a multi-threshold adaptive control mechanism based on real-time dew point calculation, this application achieves multi-dimensional dynamic linkage between environmental conditions, CPU load conditions, and TEC cooling drive. Compared to fixed threshold schemes, this solution automatically lowers the safety threshold in dry environments, allowing the TEC to operate at lower temperatures, thereby significantly improving heat dissipation efficiency; while in humid environments, it automatically raises the safety threshold and widens the buffer zone, achieving a soft landing through dynamic damping control. Overall, this technical solution achieves integrated control combining prediction, decision-making, and execution, balancing anti-condensation safety, heat dissipation efficiency, response stability, and energy consumption optimization, providing an efficient and reliable intelligent control method for the thermal management of compact devices such as computing equipment. Attached Figure Description

[0049] Figure 1 This is an exemplary system architecture diagram of a TEC adaptive anti-condensation heat dissipation control method disclosed in this application;

[0050] Figure 2This is a schematic flowchart of a TEC adaptive anti-condensation heat dissipation control method disclosed in this application;

[0051] Figure 3 This is a schematic diagram of the structure of an electronic device disclosed in this application.

[0052] Explanation of reference numerals in the attached figures: 100, System architecture; 101, First terminal device; 102, Second terminal device; 103, Third terminal device; 104, Network; 105, Server; 301, Processor; 302, Communication bus; 303, User interface; 304, Network interface; 305, Memory. Detailed Implementation

[0053] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0054] In the description of the embodiments of this application, the words "for example" or "for instance" are used to indicate examples, illustrations, or explanations. Any embodiment or design that is described as "for example" or "for instance" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design options. Rather, the use of the words "for example" or "for instance" is intended to present the relevant concepts in a specific manner.

[0055] In the description of the embodiments of this application, the term "multiple" means two or more. For example, multiple systems means two or more systems, and multiple screen terminals means two or more screen terminals. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. The terms "comprising," "including," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0056] Figure 1 An exemplary system architecture diagram is shown, illustrating an embodiment of a TEC adaptive anti-condensation heat dissipation control method applicable to this application.

[0057] like Figure 1As shown, the system architecture 100 may include a first terminal device 101, a second terminal device 102, a third terminal device 103, a network 104, and a server 105. The network 104 is used as a medium to provide communication links between the terminal devices 101, 102, 103, and the server 105. The network 104 may include various connection types, such as wired or wireless communication links or fiber optic cables, etc.

[0058] Users can use terminal devices 101, 102, and 103 to interact with server 105 via network 104 to receive or send messages, etc. Various communication client applications can be installed on terminal devices 101, 102, and 103, such as model training applications, video recognition applications, web browser applications, social platform software, etc.

[0059] Terminal devices 101, 102, and 103 can be either hardware or software. When terminal devices 101, 102, and 103 are hardware, they can be various electronic devices with displays, including but not limited to smartphones, tablets, e-book readers, MP3 (Moving Picture Experts Group Audio Layer III) players, MP4 (Moving Picture Experts Group Audio Layer IV) players, laptops, and desktop computers, etc. When terminal devices 101, 102, and 103 are software, they can be installed in the aforementioned electronic devices. They can be implemented as multiple software programs or software modules (e.g., multiple software programs or software modules used to provide distributed services) or as a single software program or software module. No specific limitations are imposed here.

[0060] When terminals 101, 102, and 103 are hardware devices, video capture devices can also be installed on them. These video capture devices can be various devices capable of capturing video, such as cameras, sensors, etc. Users can use the video capture devices on terminals 101, 102, and 103 to capture video.

[0061] Server 105 can be a server that provides various services, such as a backend server for processing data displayed on terminal devices 101, 102, and 103. The backend server can analyze and process the received data and can feed back the processing results (such as recognition results) to the terminal devices.

[0062] It should be noted that a server can be either hardware or software. When the server is hardware, it can be implemented as a distributed server cluster consisting of multiple servers, or as a single server. When the server is software, it can be implemented as multiple software programs or software modules (e.g., multiple software programs or software modules used to provide distributed services), or as a single software program or software module. No specific limitations are made here.

[0063] It should be understood that Figure 1 The number of terminal devices, networks, and servers shown is merely illustrative. Depending on implementation needs, any number of terminal devices, networks, and servers can be included. In particular, if the target data does not need to be obtained remotely, the above system architecture may exclude the network and include only terminal devices or servers.

[0064] Figure 2 This is a flowchart illustrating a TEC adaptive anti-condensation heat dissipation control method according to an embodiment of this application. This method can be implemented using a computer program or a microcontroller. The computer program can be integrated into the application or run as a standalone utility application. The specific steps of a TEC adaptive anti-condensation heat dissipation control method are described in detail below.

[0065] S201: Real-time acquisition of ambient temperature and humidity data of the environment in which the computing device is located, and real-time temperature data of the cooling surface of the TEC module attached to the CPU surface inside the computing device.

[0066] In the embodiments of this application, the TEC module refers to a thermoelectric control device that utilizes the Peltier effect of semiconductor materials to achieve cooling or heating, used for active and precise temperature control of electronic components with high heat density. For example, in this solution, the TEC module is placed between the CPU and the heat sink base of a computing device (such as a minicomputer), and drives heat from the cooling surface to the heat dissipation surface by input current, thereby reducing the operating temperature of the CPU.

[0067] Specifically, in order to collect the thermodynamic boundary conditions of the equipment in real time and establish an input benchmark for anti-condensation control, a temperature and humidity composite sensor with a preset measurement error within a predetermined tolerance range (e.g., temperature error ≤ ±0.3℃, humidity error ≤ ±2%RH) needs to be installed at the air inlet of the minicomputer chassis, on the outer wall of the chassis, or at a location that can represent the external environmental conditions. This sensor continuously monitors the thermodynamic state of the external air according to a preset sampling period (e.g., 10ms to 100ms), collects the corresponding analog electrical signals, and converts them into digital environmental temperature and humidity data via an analog-to-digital converter (ADC). Meanwhile, within the minicomputer's internal structure, for the core area of ​​semiconductor cooling, an NTC thermistor or digital temperature probe with a thermal response time less than a preset threshold (e.g., <1s) is tightly attached to the cooling surface of the TEC module (i.e., the side where the TEC module is directly thermally coupled to the CPU surface). The thermal readings at this location are read in real time via internal bus protocols such as I2C (Inter-Integrated Circuit) and SPI (Serial Peripheral Interface), thereby obtaining real-time temperature data of the TEC module's cooling surface that reflects the actual cooling capacity at the current cooling end. This process ensures that the system can simultaneously monitor the dew point potential of the external environment and the actual temperature of the internal cold source at the same time point.

[0068] S202: Based on ambient temperature and humidity data, the real-time dew point temperature value is calculated using a preset dew point calculation model.

[0069] In this embodiment, the preset dew point calculation model refers to a mathematical algorithm logic or data mapping table based on thermodynamic principles, pre-stored in a control chip or memory. This model represents the critical temperature condition at which gaseous water molecules in the air reach saturation and begin to condense into liquid water droplets under the current atmospheric pressure. For example, this model can be an algorithm program based on Magnus's empirical formula and its modified version.

[0070] Specifically, as a preferred implementation, to obtain an accurate condensation boundary, this embodiment uses a modified Magnus empirical formula for calculation. The system retrieves ambient temperature data T (unit: °C) and ambient humidity data RH (unit: %), and calculates the real-time dew point temperature value using the following formula. : Among them, intermediate variables The calculation formula is: In the above formula, b and c are constant parameters based on atmospheric physical properties. In a preferred embodiment, the parameter values ​​are set to the following range: (For example, the value is 17.62). (For example, a value of 243.12). This calculation model is suitable for conventional calculation environments ranging from -45℃ to 60℃, and can control the dew point calculation error within ±0.1℃, thereby providing high-precision reference data for subsequent anti-condensation control.

[0071] In another possible implementation, to reduce the processor's floating-point operation burden and improve response speed, the preset dew point calculation model can employ a look-up table (LUT) based on saturated vapor pressure. Specifically, the system pre-stores a dew point lookup table in non-volatile memory. This lookup table is a two-dimensional array or hash table constructed based on saturated vapor pressure data, using ambient temperature (e.g., in 0.5°C increments) and ambient humidity (e.g., in 1% increments) as index keys and the corresponding dew point temperature as index values. During step S202, the processor directly quantizes and rounds the collected ambient temperature and humidity data, uses this as an index to retrieve the corresponding real-time dew point temperature value from the dew point lookup table. Although the accuracy of this method is limited by the table resolution, the computation time is extremely short (typically nanoseconds), making it particularly suitable for embedded microcontroller environments with limited computing power.

[0072] Furthermore, it should be understood that the dew point calculation model can also be constructed based on the Arden-Burk formula, the Tetens formula, or a simple linear approximation formula. As long as the critical point of condensation can be derived based on temperature and humidity data, it falls within the protection scope of this application.

[0073] S203: The real-time dew point temperature value is added to the preset safe temperature margin value to obtain a first temperature threshold, and the first temperature threshold is added to the preset buffer difference to obtain a second temperature threshold, wherein the second temperature threshold is greater than the first temperature threshold.

[0074] For example, the core objective of this step is to construct a hierarchical, multi-level threshold protection strategy. The first temperature threshold is set as the first control boundary, which adds a safety redundancy to the theoretical dew point to offset uncontrollable risks caused by sensor errors or local temperature differences. The second temperature threshold is set as the second control boundary, triggering the switching control logic that changes the control strategy. By defining these two thresholds, the system divides the temperature axis into three distinct control regions: a negative feedback control zone above the second temperature threshold, a buffer control zone between the two, and a prohibited operation zone below the first temperature threshold. This dual-threshold architecture establishes the physical benchmark for subsequent segmented control, ensuring that the system can match the appropriate control strength and strategy according to the different risk levels of the real-time temperature.

[0075] In one possible implementation, the first temperature threshold is obtained by adding the real-time dew point temperature value to a preset safe temperature margin value. Specifically, this includes: continuously monitoring the rate of change of environmental humidity data according to a preset sampling period; when the rate of change exceeds a preset humidity mutation threshold, calling a preset compensation function to generate a dynamic compensation value that is positively correlated with the rate of change; summing the preset basic safety value and the dynamic compensation value to obtain the safe temperature margin value at the current moment, and adding the safe temperature margin value to the real-time dew point temperature value to obtain the first temperature threshold value.

[0076] In this embodiment, the safe temperature margin refers to a temperature buffer zone reserved above the theoretical dew point temperature to mitigate the risk of condensation caused by sensor physical lag, calculation delay, or local micro-environmental differences. It represents an additional safety baseline for anti-condensation control. For example, this value can be composed of a fixed base value (such as 2°C) and a dynamic value that fluctuates with the rate of change in ambient humidity, ensuring absolute safety under various operating conditions.

[0077] Specifically, to overcome the response delay problem of traditional sensors when environmental humidity changes drastically, a rate-of-change-based response logic needs to be established to address humidity abrupt changes. Based on a time interval set by a clock interrupt or timer (i.e., a preset sampling period), continuously collected environmental humidity data is subjected to differential or finite calculations to quantify the rate of change of the environmental humidity data in real time. This rate of change is then compared with a preset humidity abrupt change threshold in the system, which defines the critical line for determining whether a drastic fluctuation has occurred in the environment (such as a sudden downpour or the activation of a humidifier). Once the detected rate of change exceeds this threshold, the feedforward compensation logic is immediately activated, calling a preset compensation function (e.g., a linear gain function or an exponential growth function) to calculate a dynamic compensation value that is directly proportional to the rate of change; that is, the faster the humidity rises, the larger the compensation value is generated, thus offsetting the risk caused by sensor lag. This dynamically generated compensation value is then summed with a default preset basic safety value used to cope with normal operating conditions to synthesize a safe temperature margin value for the current moment that can adapt to the current extreme operating conditions.

[0078] In one possible implementation, the system achieves feedforward compensation by monitoring the rate of change of ambient humidity data. Specifically, the preset compensation function adopts a piecewise linear gain model. Assuming the monitored rate of change of ambient humidity is ΔH (unit: % / s): when ΔH ≤ threshold A (e.g., 0.5% / s), it is determined to be a normal fluctuation in ambient humidity, and the dynamic compensation value T is determined. comp =0; When threshold A < ΔH ≤ threshold B (e.g., 2.0% / s), the ambient humidity is determined to be in the first rising range, and the system adopts linear compensation mode: T comp=K1×(ΔH-A), where K1 is the first gain coefficient (e.g., 1.5); when ΔH≥threshold B, the ambient humidity is determined to be in the second rising range (or abrupt change range), and the system adopts the enhanced compensation mode: T comp =K1×(BA)+K2×(ΔH-B), where K2 is a second gain coefficient greater than K1 (e.g., 3.0). The preset baseline safety value (e.g., 2℃) is then compared with the dynamically compensated value T calculated above. comp The summation yields the current safe temperature margin value. This tiered compensation strategy ensures that it does not trigger falsely under fluctuations with a rate of change less than the first threshold, while under drastic changes, it can adjust the safety line with a large gain coefficient to compensate for the physical hysteresis of the sensor.

[0079] Furthermore, the dynamically corrected safety temperature margin value is added to the previously calculated real-time dew point temperature value to determine the final first temperature threshold that ensures no condensation occurs on the cooling surface of the TEC module under any high dynamic humidity environment.

[0080] In one possible implementation, the first temperature threshold is added to a preset buffer difference to obtain a second temperature threshold. Specifically, this includes: determining a buffer difference that is proportional to the safe temperature margin value according to a preset interval mapping relationship; and adding the first temperature threshold to the buffer difference to obtain the second temperature threshold.

[0081] In this embodiment, the preset buffer difference refers to the temperature span between the first temperature threshold and the second temperature threshold, used to represent the "soft landing" range width of the control strategy when smoothly switching from high-performance negative feedback logic to high-safety proportional control logic. For example, this difference is not fixed, but like the braking distance of a car, it automatically lengthens when the environmental risk is high and automatically shortens when the environment is stable, so as to achieve a dynamic balance between control robustness and heat dissipation efficiency.

[0082] Specifically, to construct a defense depth that can adaptively adjust to the environmental risk level, the current safe temperature margin value calculated in the previous steps is obtained. This value directly reflects the severity of humidity fluctuations and the potential condensation risk level in the current environment. Based on a pre-defined interval mapping relationship (such as a linear gain function or a piecewise lookup table) that defines the width between the safety level and the control buffer, a buffer difference value proportional to this safe temperature margin value is calculated and determined. That is, the more severe the current environment and the larger the safety margin, the wider the buffer deceleration zone automatically planned by the system will be to offset the greater risk of control overshoot. This dynamically calculated buffer difference value is then added to the first temperature threshold, which serves as the absolute physical bottom line, to define the upper limit boundary for triggering the heat dissipation mode switching, thus obtaining the second temperature threshold.

[0083] In one possible implementation, the preset interval mapping relationship is defined as a linear expansion function: ,in, For dynamic buffering difference, Set the base buffer width (e.g., 1.5°C). This is the currently calculated safe temperature margin value. This is the mapping coefficient (e.g., 0.5). This means that when harsh environments lead to a safety margin... When calculated at 4℃, the buffer width expands to 1.5 + 0.5 × 4 = 3.5℃. This mechanism makes the braking distance proportional to the risk level; the higher the risk, the wider the buffer zone of proportional control, thereby significantly improving the robustness of control.

[0084] S204: When the real-time temperature data is higher than the second temperature threshold, calculate the difference between the real-time temperature data and the preset target cooling temperature to obtain the target difference value, calculate the first drive current value corresponding to the target difference value according to the negative feedback control logic, and use the first drive current value to drive the TEC module.

[0085] For example, this step defines the control strategy when the system is in the "safe and efficient cooling range". Under this condition, since the real-time temperature has not yet reached the anti-condensation warning line (i.e., the second temperature threshold), the system determines that there is no immediate risk of condensation, so the control logic mainly responds to the heat dissipation demand. By introducing a negative feedback control mechanism (e.g., proportional-integral-derivative PID control), the system can establish a closed-loop adjustment loop for the target temperature difference, automatically calculating the required cooling driving force based on the current temperature deviation. This process aims to utilize the active cooling capability of the TEC module to quickly and accurately eliminate temperature errors, allowing the CPU surface temperature to converge to the preset target operating temperature point set by the user or planned by the system with a response speed matching its negative feedback bandwidth, without triggering safety limits.

[0086] In one possible implementation, the target difference is obtained by calculating the difference between the real-time temperature data and the preset target cooling temperature. Specifically, this includes: acquiring the current core load rate and current operating frequency of the CPU in the minicomputer in real time; looking up the recommended operating temperature value corresponding to the current core load rate and current operating frequency in a preset energy efficiency optimization mapping table; assigning the recommended operating temperature value as the target cooling temperature; and subtracting the target cooling temperature from the real-time temperature data to calculate the target difference.

[0087] In this embodiment, the preset energy efficiency optimization mapping table refers to a multi-dimensional data association matrix stored in the system's non-volatile memory, constructed through extensive thermal testing and performance calibration experiments. It represents the optimal cooling target reference system that balances CPU performance release and TEC energy consumption ratio under different combinations of computational load intensity and operating frequency. For example, in a laboratory environment, a full-condition scan is performed on this CPU model; at each "CPU load rate - operating frequency" coordinate point, different TEC cooling temperatures are traversed, and the total system power consumption (CPU power consumption + TEC power consumption) is recorded; the temperature corresponding to the lowest total system power consumption is selected as the "recommended operating temperature value" for that coordinate point. For example, under low CPU load (e.g., <30%), to save TEC power, the recommended temperature may be set to a higher 40°C; while under high load (e.g., >80%), to suppress leakage current power consumption, the recommended temperature may be set to a lower 30°C. After the system obtains the CPU status in real time, the recommended value balancing performance and energy consumption can be obtained by looking up the table.

[0088] Specifically, to achieve on-demand cooling and maximize the system's energy efficiency ratio, the system uses low-level operating system interfaces or hardware monitoring buses (such as the PECI interface) to capture in real-time the CPU's current core load rate (usually expressed as a percentage) and current operating frequency (usually in GHz), reflecting the current computing power requirements. These two real-time performance parameters are used as index coordinates to search and match a pre-set energy efficiency optimization mapping table within the system, locating the recommended operating temperature value that ensures the CPU doesn't throttle while avoiding excessive TEC power consumption under the current operating conditions. The energy efficiency optimization mapping table can be stored using a multidimensional lookup table or hash table data structure. This table uses the CPU core load rate range and operating frequency range as index keys, and the experimentally calibrated optimal cooling temperature as the index value. For example, the mapping table sets the recommended operating temperature to 35°C when the core load rate is in the range of (70%, 80%) and the operating frequency is in the range of (3.0GHz, 3.5GHz); and to 40°C when the core load rate is in the range of (30%, 40%) and the operating frequency is in the range of (1.5GHz, 2.0GHz). The principle behind this recommended value is to minimize the total system power consumption (CPU power consumption + TEC power consumption) while ensuring that the CPU does not thermally throttle. This optimal temperature value is directly assigned to update the target cooling temperature in the control logic, serving as the tracking target for TEC cooling control at the current moment. To ensure that the target value obtained from the lookup table does not exceed the safety threshold, the system executes a maximum value selection arbitration strategy. Let the recommended operating temperature be... The currently calculated second temperature threshold (i.e., the upper limit of the anti-condensation buffer zone) is: The final effective target cooling temperature The calculation is as follows: This logic indicates that if the candidate target value (recommended operating temperature) is less than the second temperature threshold, it means the recommended cooling target is too low, posing a risk of intruding into the buffer zone. Therefore, the target cooling temperature is forcibly set to the higher second temperature threshold. If the candidate target value is greater than or equal to the second temperature threshold, the candidate target value is directly determined as the target cooling temperature. Through this mechanism, the system ensures that the target temperature is always above the safety boundary during the negative feedback control phase.

[0089] Furthermore, the real-time temperature data of the TEC cold surface collected by the sensor is subtracted from the dynamically set target cooling temperature. The deviation of the current actual temperature from the ideal target is quantified by the subtraction operation, which is used to calculate the target difference value for subsequent negative feedback control calculations.

[0090] In one possible implementation, the method further includes: constructing a target temperature arbitration mechanism, defining the recommended operating temperature value as a candidate target value to be verified; substituting the candidate target value into a safety constraint condition based on a second temperature threshold for legality verification; if the candidate target value is less than the second temperature threshold, determining that the candidate target value has not passed the safety constraint condition, and determining the second temperature threshold as the final effective target cooling temperature; if the candidate target value is greater than or equal to the second temperature threshold, determining that the candidate target value has passed the safety constraint condition, and determining the candidate target value as the final effective target cooling temperature.

[0091] In this embodiment, the target temperature arbitration mechanism refers to a priority decision and numerical correction logic between the upper-level energy efficiency decision logic and the lower-level PID control loop. It represents a conflict resolution strategy that enforces the safety-first principle when a numerical conflict arises between the ideal control target generated based on performance requirements and the safety boundary generated based on the environmental dew point. For example, this mechanism is equivalent to a logic judgment unit with a lower limit function, ensuring that the target value ultimately sent to the controller never exceeds the physical safety threshold.

[0092] Specifically, to prevent the control target from being set too low due to high load heat dissipation requirements, which could lead to the risk of TEC overcooling and condensation, the input commands need to be filtered for validity. The recommended operating temperature value obtained from the previous steps, which only considers the load energy efficiency ratio, is marked as a candidate target value to be verified, but it is not yet effective. This candidate value is then substituted into a safety constraint condition with the second temperature threshold (i.e., the upper limit of the anti-condensation buffer) as the baseline for numerical comparison and verification. During this verification process, if the candidate target value is found to be less than the second temperature threshold, it indicates that the recommended temperature has fallen into a dangerous range that could easily trigger proportional control or even be below the dew point. Therefore, the candidate target value is determined to have failed the safety constraint condition, and a boundary clamping operation is performed to forcibly lock the second temperature threshold and determine it as the final effective target cooling temperature, thereby limiting the PID controller's depth. Conversely, if the candidate target value is higher than or equal to the second temperature threshold, it indicates that the recommended temperature is within an absolutely safe operating range. Therefore, the candidate target value is determined to have passed the safety constraint condition, and the original candidate target value is directly determined as the final effective target cooling temperature for heat dissipation control as originally planned.

[0093] S205: When the real-time temperature data is between the first temperature threshold and the second temperature threshold, calculate the difference between the real-time temperature data and the first temperature threshold to obtain the threshold difference value, multiply the threshold difference value by a preset proportional coefficient to obtain the second drive current value, and use the second drive current value to drive the TEC module.

[0094] For example, in this step, to prevent overshoot when the temperature approaches the safety threshold, the preset damping adjustment model adopts a reverse decay function based on the rate of descent. Let the preset base proportional coefficient of the system be... (For example, based on the system's thermal inertia identification results, the set value is 0.5 A / ℃), and the real-time monitored temperature drop rate is... Defined as Take positive values, where Given real-time temperature data, where t is time, then the dynamic scaling factor is... ,in, This is the damping sensitivity factor (e.g., 2.0). It is a non-linear exponent (e.g., 2). According to the model: when the temperature decreases at a rate of... When the denominator approaches 0, the denominator term Approaching 1, the dynamic scaling factor is made to... Maintain the basic ratio coefficient At the numerical level, the system maintains its original approximation rate; when the temperature decreases at a certain rate... As the denominator increases, the denominator increases exponentially, leading to an increase in the dynamic proportionality coefficient. Numerical values ​​decay significantly (e.g., decay to) (less than 10%). This is equivalent to automatically reducing the control gain when the cooling rate is detected to be too fast, and using the thermal inertia of the TEC itself to glide to the target point, achieving a monotonic convergent temperature control effect.

[0095] In one possible implementation, the threshold difference is multiplied by a preset proportional coefficient to obtain the second drive current value. Specifically, this includes: calculating the rate of decrease of the real-time temperature data over time; generating a dynamic proportional coefficient that is negatively correlated with the rate of decrease according to a preset damping adjustment model, wherein the larger the rate of decrease, the smaller the dynamic proportional coefficient; and multiplying the threshold difference by the dynamic proportional coefficient to obtain the second drive current value.

[0096] In the embodiments of this application, the preset damping adjustment model refers to a pre-established nonlinear functional relationship or algorithmic logic used to adjust the control gain in real time according to the rate of change of the current state of the controlled object. This model represents the intermittent or decaying output applied to prevent temperature overshoot due to thermal inertia when approaching a safety threshold. For example, the model can be an inverse proportional function or decay curve, specifying that when the temperature drops extremely rapidly, the controller should output a very small proportional gain to suppress cooling inertia, and vice versa.

[0097] Specifically, to achieve small-step or variable-gain adjustment control when the temperature approaches the first temperature threshold (i.e., the dew point risk line), based on continuously acquired time-series data, differential or time-difference calculations are performed on the real-time temperature data to quantify the rate of temperature decrease of the current TEC cold surface, i.e., to calculate the rate of decrease. This calculated rate of decrease is then input into a preset damping adjustment model for mapping calculation. This model follows the negative feedback damping principle of "the faster the speed, the smaller the gain." When the temperature decrease rate exceeds the preset rate threshold, it automatically outputs a smaller value to weaken the cooling force; conversely, it outputs a larger value to maintain the approach speed, thus generating a dynamic proportional coefficient negatively correlated with the rate of decrease. The threshold difference obtained in the previous steps, reflecting the distance between the current temperature and the safety baseline, is multiplied by this dynamically generated coefficient to calculate the second driving current value after damping correction, which maintains the cooling trend while preventing the temperature from falling below the dew point due to inertia.

[0098] In one possible implementation, the TEC module is driven using a first drive current value or a second drive current value. Specifically, this includes: using the first drive current value or the second drive current value to be loaded as the target current value; obtaining the stored historical drive current value from the previous moment and calculating the current change between the target current value and the historical drive current value; if the current change exceeds a preset current ramp-up limit, limiting the change range of the target current value based on the current ramp-up limit, and generating a smoothed final drive control signal to be loaded onto the TEC module.

[0099] In this embodiment, the preset current ramp-up limit is a threshold value for the maximum rate of change of current set to prevent severe thermal stress caused by a sudden change in the drive current, which could lead to the shedding of internal crystals of the semiconductor cooling chip or cracking of the ceramic substrate. It is used to represent the physical safety protection boundary at the hardware drive level. For example, this limit value can be set to a current increment of no more than 0.5 amperes per control cycle to achieve a "soft start" effect similar to that in motor control.

[0100] Specifically, to ensure the TEC module's lifespan during switching between different operating conditions or severe load fluctuations, smoothing filtering needs to be implemented in the underlying drive stage. The first drive current value (from negative feedback control) or the second drive current value (from proportional control) calculated and output by the preceding control logic is normalized and marked as the target current value for the current control cycle. The historical drive current value actually applied to the hardware at the previous control moment is retrieved from the system register or non-volatile memory, and the difference between the current target current value and this historical value (usually taking the absolute value) is calculated to quantify the degree of current amplitude jump requested at the current moment, i.e., the current change amount. This calculated change amount is then compared with a preset current ramp-up limit. If the current change exceeds the upper limit (e.g., the requested current jumps instantaneously from zero to full load, exceeding the physical slope the device can withstand), the slew rate limiting logic is immediately activated. Based on this current ramp-up upper limit, the change in the target current value is forcibly clamped; that is, the original target is replaced by adding or subtracting an allowed ramp-up upper limit step size from the historical value. The smoothed and limited current value is mapped to the corresponding PWM duty cycle or analog voltage signal to generate the final drive control signal. This signal (usually a PWM pulse width modulation signal) is loaded into the power drive circuit connected to the TEC module. In a preferred hardware embodiment, the drive circuit uses an H-bridge topology or a Buck converter circuit, with an LC filter unit (inductor-capacitor filter) connected in series. The LC filter unit converts the PWM signal with a frequency within a preset modulation range (e.g., 20kHz to 100kHz) into a DC voltage with a ripple amplitude within a preset range (e.g., <50mV). This not only complements the current ramp-up limiting algorithm at the software level, but also reduces the mechanical stress damage to the semiconductor chips inside the TEC caused by large current steps at the physical level, achieving dual protection of "software limiting + hardware filtering" and significantly extending the service life of the equipment.

[0101] Furthermore, this application embodiment also includes emergency protection logic for an absolute safety baseline: when the real-time temperature data is less than or equal to a first temperature threshold, the system is determined to be in a high-risk condensation zone. For example, under this condition, although theoretically the temperature has not yet reached the absolute dew point (because the first threshold includes a safety margin), in order to avoid any potential condensation risk, the control system will execute a forced shutdown or active heating strategy. In a preferred embodiment (forced shutdown): the control system immediately forces the target drive current value to zero (0A), cutting off the power supply circuit of the TEC module. At this time, utilizing the thermal conductivity characteristics of the TEC module's ceramic substrate and the CPU, the CPU's own heat generation causes the cold surface temperature to naturally rise, quickly moving it out of the dew point danger zone. In another possible embodiment (active heating): if extremely high ambient humidity is detected and the temperature continues not to rise, the control system can output a reverse current (i.e., heating mode current) to the TEC module, utilizing the Peltier effect's active heating function to quickly raise the cold surface temperature above the first temperature threshold, thereby actively eliminating the risk of trace condensation.

[0102] This embodiment also discloses an electronic device, as shown in the reference. Figure 3 The electronic device may include: at least one processor 301, at least one communication bus 302, user interface 303, network interface 304, and at least one memory 305.

[0103] The communication bus 302 is used to enable communication between these components.

[0104] The user interface 303 may include a display screen and a camera. Optionally, the user interface 303 may also include a standard wired interface and a wireless interface.

[0105] The network interface 304 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface).

[0106] The processor 301 may include one or more processing cores. The processor 301 connects to various parts of the server using various interfaces and lines, and performs various server functions and processes data by running or executing instructions, programs, code sets, or instruction sets stored in memory 305, and by calling data stored in memory 305. Optionally, the processor 301 may be implemented using at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). The processor 301 may integrate one or a combination of several of the following: Central Processing Unit (CPU), Graphics Processing Unit (GPU), and modem. The CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the content required for display; and the modem handles wireless communication. It is understood that the modem may also not be integrated into the processor 301 and may be implemented as a separate chip.

[0107] The memory 305 may include random access memory (RAM) or read-only memory. Optionally, the memory 305 may include a non-transitory computer-readable storage medium. The memory 305 can be used to store instructions, programs, code, code sets, or instruction sets. The memory 305 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as touch function, sound playback function, image playback function, etc.), instructions for implementing the above-described method embodiments, etc.; the data storage area may store data involved in the above-described method embodiments, etc. Optionally, the memory 305 may also be at least one storage device located remotely from the aforementioned processor 301. Figure 3 As shown, the memory 305, which serves as a computer storage medium, may include an operating system, a network communication module, a user interface module, and an application program for a TEC adaptive anti-condensation heat dissipation control method.

[0108] exist Figure 3In the electronic device shown, the user interface 303 is mainly used to provide an input interface for the user and to obtain the user input data; while the processor 301 can be used to call an application program stored in the memory 305 for a TEC adaptive anti-condensation heat dissipation control method. When executed by one or more processors 301, the electronic device performs one or more methods as described in the above embodiments.

[0109] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0110] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0111] In some embodiments of this application, a computer-readable storage medium is provided, including instructions that, when executed on the electronic device, cause the electronic device to perform a TEC adaptive anti-condensation heat dissipation control method according to an embodiment of this application.

[0112] In some embodiments of this application, a computer program product is also provided, which, when run on an electronic device, causes the electronic device to execute a TEC adaptive anti-condensation heat dissipation control method according to an embodiment of this application.

[0113] In the several embodiments provided in this application, it should be understood that the disclosed apparatus can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the shown or discussed mutual couplings or direct couplings or communication connections may be through some service interfaces; indirect couplings or communication connections between apparatuses or units may be electrical or other forms.

[0114] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0115] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0116] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage device (CMD). Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a memory 305 and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned memory 305 includes various media capable of storing program code, such as a USB flash drive, external hard drive, magnetic disk, or optical disk.

[0117] The foregoing description is merely an exemplary embodiment of this disclosure and should not be construed as limiting the scope of this disclosure. Any equivalent changes and modifications made in accordance with the teachings of this disclosure shall still fall within the scope of this disclosure. Those skilled in the art will readily conceive of other embodiments of this disclosure upon considering the disclosure in this specification. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not described in this disclosure. The specification and embodiments are considered exemplary only, and the scope of this application is defined by the claims.

Claims

1. A TEC adaptive anti-condensation heat dissipation control method, characterized in that, The method includes: The system acquires real-time ambient temperature and humidity data of the environment in which the computing device is located, and also acquires real-time temperature data of the cooling surface of the TEC module attached to the CPU surface inside the computing device. Based on the ambient temperature data and the ambient humidity data, the real-time dew point temperature value is calculated using a preset dew point calculation model. The real-time dew point temperature value is added to a preset safe temperature margin value to obtain a first temperature threshold, and the first temperature threshold is added to a preset buffer difference value to obtain a second temperature threshold, wherein the second temperature threshold is greater than the first temperature threshold. When the real-time temperature data is higher than the second temperature threshold, the difference between the real-time temperature data and the preset target cooling temperature is calculated to obtain the target difference value. The first drive current value corresponding to the target difference value is calculated according to the negative feedback control logic, and the first drive current value is used to drive the TEC module. When the real-time temperature data is between the first temperature threshold and the second temperature threshold, the difference between the real-time temperature data and the first temperature threshold is calculated to obtain the threshold difference value. The threshold difference value is multiplied by a preset scaling factor to obtain the second drive current value, and the second drive current value is used to drive the TEC module.

2. The method according to claim 1, characterized in that, The step of adding the real-time dew point temperature value to a preset safety temperature margin value to obtain the first temperature threshold specifically includes: The rate of change of the environmental humidity data is continuously monitored according to a preset sampling period; When the rate of change exceeds a preset humidity abrupt change threshold, a preset compensation function is invoked to generate a dynamic compensation value that is positively correlated with the rate of change. The preset basic safety value is summed with the dynamic compensation value to obtain the current safe temperature margin value, and the safe temperature margin value is added to the real-time dew point temperature value to obtain the first temperature threshold.

3. The method according to claim 2, characterized in that, The step of adding the first temperature threshold to a preset buffer difference to obtain the second temperature threshold specifically includes: Based on the preset interval mapping relationship, a buffer difference proportional to the safe temperature margin value is determined; The first temperature threshold is added to the buffer difference to obtain the second temperature threshold.

4. The method according to claim 1, characterized in that, The calculation of the difference between the real-time temperature data and the preset target cooling temperature to obtain the target difference value specifically includes: The current core load rate and current operating frequency of the CPU in the computing device are obtained in real time. Find the recommended operating temperature value corresponding to the current core load rate and the current operating frequency in the preset energy efficiency optimization mapping table; The recommended operating temperature value is assigned to the target cooling temperature; The target difference is calculated by subtracting the target cooling temperature from the real-time temperature data.

5. The method according to claim 4, characterized in that, The method further includes: A target temperature arbitration mechanism is constructed, and the recommended operating temperature value is defined as a candidate target value to be verified; The candidate target value is substituted into the safety constraint condition based on the second temperature threshold for legality verification; If the candidate target value is less than the second temperature threshold, it is determined that the candidate target value has not passed the safety constraint condition, and the second temperature threshold is determined as the final effective target cooling temperature; If the candidate target value is greater than or equal to the second temperature threshold, then the candidate target value is determined to pass the safety constraint condition, and the candidate target value is determined as the final effective target cooling temperature.

6. The method according to claim 1, characterized in that, The step of multiplying the threshold difference by a preset scaling factor to obtain the second drive current value specifically includes: Calculate the rate of decrease of the real-time temperature data over time; Based on a preset damping adjustment model, a dynamic proportional coefficient negatively correlated with the descent rate is generated, wherein the larger the descent rate, the smaller the dynamic proportional coefficient. The second drive current value is obtained by multiplying the threshold difference by the dynamic scaling factor.

7. The method according to claim 1, characterized in that, The step of driving the TEC module using the first drive current value, or driving the TEC module using the second drive current value, specifically includes: Use the first drive current value or the second drive current value to be loaded as the target current value; Obtain the stored historical drive current value from the previous moment, and calculate the current change between the target current value and the historical drive current value; If the change in current exceeds the preset current ramp-up limit, the change in the target current value is limited based on the current ramp-up limit, and a smoothed final drive control signal is generated and loaded into the TEC module.

8. An electronic device, characterized in that, Including processor and memory; The memory is used to store computer program code, the computer program code including computer instructions, and the processor invokes the computer instructions to cause the electronic device to perform the method as described in any one of claims 1-7.

9. A computer-readable storage medium storing computer instructions, characterized in that, When the computer instructions are executed on the electronic device, the electronic device causes the electronic device to perform the method as described in any one of claims 1-7.

10. A computer program product, characterized in that, When the computer program product is run on an electronic device, it causes the electronic device to perform the method as described in any one of claims 1-7.

Images