Large-size resin material physical property test sample for semiconductor packaging and manufacturing method thereof

Abstract

The invention relates to a large-size resin material physical property test sample for semiconductor packaging and a manufacturing method thereof, and belongs to the field of semiconductor materials. At least one of the problems of high sample preparation cost, poor surface flatness, difficulty in controlling the dimensional precision, insufficient process adaptability, low yield and the like of a large-size resin material physical property test sample in the prior art is solved. The invention discloses a manufacturing method of a large-size resin material physical property test sample for semiconductor packaging. The manufacturing method comprises the following steps: providing a double-sided copper-clad plate; a through groove used for containing the target sample array is formed in the double-sided copper-clad plate; filling the through groove with a to-be-tested resin material to obtain a filled composite structure; performing treatment; pressing and curing; and milling the large-size resin material physical property test sample in a machining manner. According to the method, the sample preparation cost is reduced, the surface flatness and the size control precision are improved, the process adaptability is good, and the yield is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor materials technology, and in particular to a large-size resin material property test sample for semiconductor packaging and its manufacturing method. Background Technology

[0002] In the semiconductor packaging field, the physical property testing of resin materials typically requires fabricating the materials into specific shapes and sizes. For example, measuring the permeability of organic magnetic resins requires preparing toroidal standard samples. When evaluating key properties such as the coefficient of thermal expansion (CTE) and Young's modulus of thin film materials like ABF and PI, the industry generally prefers the more reliable dilatation method. Dilatation testing requires preparing thick, blocky samples of the thin film material. These samples are relatively large, but the number needed for a single test is small. If traditional injection molding processes are used to create dedicated molds, the cost is prohibitive. Furthermore, the resins being tested come in various forms, including semi-cured dry film magnetic films and liquid resin slurries, further increasing the complexity of standardized sample preparation.

[0003] Currently, the industry commonly uses two main non-mold sample preparation methods: one is the traditional casting method, which involves creating holes in a core board and then filling it with liquid resin; the other is the prepreg lamination method for dry film resins. However, both methods have significant drawbacks. The casting method is easily affected by surface tension and gravity during the curing process, resulting in uneven sample surfaces, inconsistent thickness, and difficulty in eliminating internal air bubbles. The prepreg lamination method, on the other hand, makes it difficult to precisely control the lamination thickness and filling density, and the resin is prone to displacement or deformation during lamination, resulting in poor sample consistency and low yield.

[0004] Therefore, how to efficiently, cost-effectively, and with high precision prepare large-size resin material property test samples for use in the semiconductor field has long been a technical challenge that has plagued the industry. Summary of the Invention

[0005] Based on the above analysis, the present invention aims to provide a large-size resin material property test sample for semiconductor packaging and a method for manufacturing the same, in order to solve at least one of the problems in the prior art, such as high sample preparation cost, poor surface flatness, difficulty in controlling dimensional accuracy, insufficient process adaptability, and low yield.

[0006] The objective of this invention is achieved through the following technical solution:

[0007] This invention provides a method for manufacturing large-size resin material property testing samples for semiconductor packaging, comprising the following steps: S1. Provide a double-sided copper-clad laminate, the thickness of which is the same as the thickness of the target sample; and open a through slot on the double-sided copper-clad laminate to accommodate one or more target sample arrays, the width of which is greater than the outer edge of the target sample and the length of which is less than the length of the double-sided copper-clad laminate. The surface of the groove wall is roughened. After surface roughening treatment, a core plate with a through groove having roughened groove walls is obtained; S2. Fill the through groove with the resin material to be tested, and make the thickness of the filled resin not less than the thickness of the core board to obtain the filled composite structure. S3. Pre-form the filled composite structure; S4. The pre-formed composite structure is placed in a laminator and pressed and cured in a vacuum environment using a mirror steel plate, so that the resin material to be tested is completely cured and the upper and lower surfaces of the resin material in the through groove are flush with the surface of the core board. S5. Through mechanical processing, a large-size resin material physical property test sample with a specific shape and size for semiconductor packaging is milled out from the cured resin structure in the through groove of the core board.

[0008] Furthermore, in step S2, the resin material to be tested is a dry film type resin in a semi-cured state; The filling step includes: The dry film type resin is cut into an inner resin sheet and an outer resin sheet; Wherein, in any direction parallel to the surface of the core board, the outline dimensions of the inner resin sheet are... The distance between the inner walls of the through groove and the outline dimensions of the outer resin sheet Satisfying Relationship: ; in, This is the one-sided difference between the outline dimension of the inner resin sheet and the distance between the inner wall of the through groove; At least one outer resin sheet is used as the bottom layer group to cover and adhere to the bottom opening of the through groove. An inner resin sheet group consisting of at least one inner resin sheet is stacked on the bottom layer group. Then, at least one outer resin sheet is used as the top layer group to stack on the inner resin sheet group, so that the total thickness of the stacked resin is greater than or equal to the thickness of the core board.

[0009] Furthermore, in any direction parallel to the surface of the core plate, the distance between the inner walls of the through grooves and the outline dimensions of the outer resin sheet Satisfying Relationship: ; in, The amount by which the outer resin sheet's outline extends beyond one side of the inner wall of the channel.

[0010] Furthermore, all inner resin sheets are of equal thickness; The number N of inner resin sheets in the inner resin sheet group is determined according to the following formula: ; in, This indicates a floor function, where T is the thickness of the core board. The thickness of a single inner resin sheet.

[0011] Furthermore, the thickness of the outer resin sheet The thickness T of the core plate satisfies: ; and / or, The thickness of the inner resin sheet The thickness T of the core plate satisfies: .

[0012] Furthermore, the resin material to be tested is a semi-cured dry film type resin, and the pre-forming process in step S3 is to perform a low-temperature vacuum pressing molding process on the filled composite structure in a vacuum press, wherein the temperature of the low-temperature vacuum pressing molding process is 100℃~120℃.

[0013] Further, in step S2, the resin material to be tested is a liquid resin slurry; The filling step includes: A high-temperature resistant temporary bonding film is attached to the bottom opening of the through groove to seal the through groove and form a receiving cavity; The liquid resin slurry is injected into the receiving cavity using a vacuum screen printing machine.

[0014] Furthermore, the pre-forming process in step S3 includes: baking the liquid resin slurry injected into the receiving cavity at a low temperature, so that the degree of curing of the liquid resin slurry reaches 40% to 60%, forming a semi-cured state.

[0015] Further, in step S4, the pressing and curing are carried out in the laminator under the following process conditions: (a) Vacuum pressing stage: First, maintain the vacuum level below 100-1000 Pa for 30-60 min at a temperature of 110-130℃ and a pressure of 1.0-3.0 MPa; (b) Curing stage: Under a vacuum of less than 100-1000 Pa, the temperature is raised to the curing temperature of the resin material to be tested, and maintained at a pressure of 1.0~3.0 MPa for 60-100 min.

[0016] This invention provides a large-size resin material property test sample for semiconductor packaging, which is obtained by the manufacturing method described above.

[0017] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects: This invention constructs a systematic sample preparation scheme through multiple closely linked process steps. Each step complements and synergistically works, forming a complete and controllable process chain. Specifically: S1 (core board preparation) establishes the thickness benchmark and array carrier, providing a structural basis for mass production; S2 (resin filling) performs active full or interference filling to ensure the cavity is filled with material.

[0018] S3 (pre-forming process) achieves venting and initial stabilization, preparing a dense intermediate for final curing.

[0019] S4 (Mirror Press Curing) uses a mirror steel plate for constraint and vacuum hot pressing to force the resin to cure and form a high degree of flatness. S5 (machining) performs radial finishing on the molded surface after the mirror steel plate has been pressed and cured, ultimately achieving full-dimensional control of the sample size.

[0020] Through the systematic coordination of the above steps, this invention effectively solves the core problems of high sample preparation cost, poor accuracy, and low yield in the prior art.

[0021] To address the issues of high sample preparation costs and low efficiency, this invention achieves an array-based layout design by creating one or more through slots on the double-sided copper-clad board to accommodate multiple target sample arrays. Combined with subsequent steps of uniform filling, pre-forming, and pressing and curing the entire board, this transforms the traditional single-sample preparation mode into a parallel forming mode for the entire board of samples, significantly improving production efficiency and reducing unit costs.

[0022] To address the issues of uneven surface and inconsistent thickness, this invention employs a multi-stage synergistic process: S1 provides a thickness reference; S2 ensures sufficient material through adequate or interference filling; S3 pre-forming reduces shrinkage disturbance; and finally, S4 utilizes the absolute flatness constraint of the mirror-finished steel plate and the vacuum hot-pressing environment to force the resin to cure within a closed cavity. This completely eliminates free surface deformation, ensuring the resin surface is perfectly flush with the core board. This multi-stage synergistic process transforms uncontrollable "free curing" into precisely controllable "constrained curing," thereby improving sample flatness and thickness uniformity.

[0023] To address the challenge of controlling dimensional accuracy, this invention achieves precise control through multi-dimensional synergistic control of axial, radial, cavity filling, and intermediate stability: S1 provides an axial reference using the core substrate thickness; S2 employs a full or interference filling strategy to ensure sufficient material; S3 forms a dimensionally stable, dense intermediate through venting and preliminary shaping, reducing final curing variations; S4 utilizes mirror constraint and pressure extrusion to ensure cavity fullness and control thickness during curing; S5 performs high-precision milling on the previously formed reliable preform (a resin preform with a smooth surface flush with the core, a dense interior, and located in a large-size through-groove) to complete the final refinement of the radial dimensions. Furthermore, the roughening treatment of the groove walls in S1 enhances resin bonding, further suppressing dimensional deviations that may be caused by curing shrinkage. The interconnected control chain of each step collectively achieves precise control of the three-dimensional dimensions of large-size resin material property test samples.

[0024] To address the issue of insufficient process adaptability, this invention employs a modular process design to accommodate different resin forms: In some specific embodiments, dry film resins are shaped through stacking and low-temperature vacuum pre-pressing (steps S2 and S3), while liquid resin slurries are converted into a semi-cured state through injection and low-temperature baking (steps S2 and S3). Both are ultimately cured through a unified mirror-finished steel plate vacuum pressing process, and the process parameters can be adjusted to adapt to the resin material characteristics, achieving broad applicability to various resin forms such as semi-cured films and liquid slurries.

[0025] To address the issue of low yield, this invention effectively improves process stability through end-to-end process control: S1 establishes a basic structure for mass production by creating through-slots to accommodate multiple sample arrays, and the roughening treatment of the slot walls further enhances resin bonding; S2 ensures sufficient or overfilling to prevent material shortages; S3's pre-forming process involves active vacuum pressing and degassing to prevent bubble formation; S4's mirror-finish vacuum pressing ensures uniform curing and surface flatness; S5 performs high-precision milling on a reliable preform (a resin preform with a flat surface flush with the core board, dense internal structure, and located in a large-sized through-slot) to complete the final finishing of radial dimensions. The controllable design of each step transforms the sample preparation process from experience-dependent manual operation to a standardized process with clearly defined parameters and repeatable results, thereby achieving a higher and more stable yield.

[0026] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the description or be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained from what is particularly pointed out in the description and drawings. Attached Figure Description

[0027] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0028] Figure 1 The following is a flowchart of step S1 in an embodiment of the present invention: (a) shows the provision of a double-sided copper-clad board; (b1) shows a front view of a core board with a through groove having roughened groove walls; and (b2) is a top view of (b1). Figure 2 This is a schematic diagram of the process of dry film resin lamination filling, preforming, and mirror steel plate pressing and curing in Embodiment 1 of the present invention. (a) shows the dry film resin lamination filling; (b) shows the composite structure after preforming; (c) shows the mirror steel plate pressing and curing before mold closing; (d) shows the mirror steel plate pressing and curing after mold closing; (e1) is a front view of the core board with completely cured resin after being pressed and cured by the mirror steel plate; (e2) is a top view of (e1). Figure 3 This is a schematic diagram of the process of liquid resin filling, preforming, and mirror steel plate pressing and curing in Embodiment 2 of the present invention. (a) is a core plate with a cavity formed by sealing the through groove with a high-temperature resistant temporary bonding film before filling; (b) liquid resin material is filled into the cavity; (c) mirror steel plate pressing and curing; (d) core plate with completely cured resin in the through groove after mirror steel plate pressing and curing; (e) removal of the high-temperature resistant temporary bonding film. Figure 4 (c) is a schematic diagram of a sample machined and milled in an embodiment of the present invention; (b) is a schematic diagram of a large-size magnetic ring test sample milled from part A in (b); Figure 5 A schematic diagram of the preparation process of the magnetic ring test samples provided for Comparative Examples 1 and 2; Figure label: 1-Double-sided copper clad laminate; 2-Insulating substrate; 3-Front copper foil; 4-Back copper foil; 5-Core board; 6-Through groove; 7-Outer resin sheet; 8-Inner resin sheet; 91-Liquid resin slurry; 92-Cured resin; 10-High temperature resistant temporary bonding film; 11-Mirror steel plate; 12-Target sample; 13-Receiving cavity; 14-Edge overflow. Detailed Implementation

[0029] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0030] This invention provides a method for manufacturing large-size resin material property testing samples for semiconductor packaging, comprising the following steps: S1. Provide a double-sided copper-clad laminate, the thickness of which is the same as the thickness of the target sample; and open a through slot on the double-sided copper-clad laminate to accommodate one or more target sample arrays, the width of which is greater than the outer edge of the target sample and the length of which is less than the length of the double-sided copper-clad laminate. The surface of the groove wall is roughened. After surface roughening treatment, a core plate with a through groove having roughened groove walls is obtained; S2. Fill the through groove with the resin material to be tested, and make the thickness of the filled resin not less than the thickness of the core board to obtain the filled composite structure. S3. Pre-form the filled composite structure; S4. The pre-formed composite structure is placed in a laminator and pressed and cured in a vacuum environment using a mirror steel plate to further remove air bubbles in the uncured resin, so that the resin material to be tested is completely cured and the upper and lower surfaces of the resin material in the through groove are flush with the surface of the core board. S5. Through mechanical processing, a large-size resin material physical property test sample with a specific shape and size for semiconductor packaging is milled out from the cured resin structure in the through groove of the core board.

[0031] Specifically, the double-sided copper-clad laminate includes an intermediate insulating substrate and copper foil covering both sides of the intermediate insulating substrate. The insulating substrate is one of an epoxy resin substrate, a polyimide substrate, a BT resin substrate, or a ceramic-filled polymer substrate.

[0032] For example, the thickness of the double-sided copper-clad laminate is 0.5 mm to 3 mm. For example, 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, and 3.0 mm.

[0033] For example, the thickness tolerance of the double-sided copper-clad laminate does not exceed ±0.01 mm.

[0034] For example, in step S1, the through groove is a straight groove extending along the length direction of the double-sided copper-clad laminate.

[0035] In some embodiments, the width, length, and number of the through slots satisfy at least one of the following relationships: (1) Width of the through groove The maximum outer dimensions of the target sample satisfy ,in, The The lower limit provides the necessary process tolerance and machining allowance for the resin filling operation and subsequent milling of the sample's outer edge, while the upper limit prevents excessive resin filling and overflow due to excessive groove width, and ensures that the resin can be effectively constrained during subsequent pressing. For example, The values ​​are 0.2mm, 0.5mm, 0.8mm, 1.0mm, 1.5mm, and 2.0mm.

[0036] (2) The distance between the centers of adjacent target samples in the through groove satisfy ,in The minimum process gap between adjacent target samples, where .

[0037] (3) The length of the through groove The maximum outer dimensions of the target sample The quantities n (n≥2), the minimum process gap g between adjacent target samples, and the minimum end gap between the target sample and the end of the through groove. satisfy ,in, .

[0038] For example, , Each can be independently assigned a value such as 0.5mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, or 3.0mm.

[0039] (4) The length of the through groove The total length of the double-sided copper-clad laminate satisfy .

[0040] (5) At least one through slot is provided on the double-sided copper-clad laminate. For multiple through slots, the multiple through slots are arranged parallel to each other on the double-sided copper-clad laminate.

[0041] For example, the through groove is a rectangular through groove.

[0042] Specifically, the surface roughening treatment of the channel wall includes: on the glue removal line, removing the resin melt and debris generated during channel machining from the surface of the channel wall through a chemical etching process, and roughening the surface of the channel wall.

[0043] For example, in step S1, the surface roughening treatment includes at least one of chemical etching, plasma treatment, laser treatment, or mechanical polishing.

[0044] Specifically, step S1 further includes: processing positioning targets on the double-sided copper-clad laminate before opening the through slot; and using the positioning targets as alignment references when opening the through slot. The positioning targets are located at both ends of the through slot or in the peripheral area of ​​the double-sided copper-clad laminate.

[0045] To achieve efficient and high-precision sample preparation for different forms of existing test resin materials (dry film type and liquid slurry), this invention provides the following two specific implementation methods (Implementation Method 1: for semi-cured dry film type resin; Implementation Method 2: for liquid resin slurry). Both share the core process architecture and make adaptive adjustments in the filling and preforming stages, which significantly improves the process adaptability of the method.

[0046] In one specific embodiment of the present invention, in step S2, the resin material to be tested is a dry film type resin in a semi-cured state.

[0047] When the resin material to be tested is a semi-cured dry film resin, the filling step includes: The dry film type resin is cut into an inner resin sheet and an outer resin sheet; Wherein, in any direction parallel to the surface of the core board, the outline dimensions of the inner resin sheet are... The distance between the inner walls of the through groove and the outline dimensions of the outer resin sheet Satisfying Relationship: ; in, This is the one-sided difference between the outline dimension of the inner resin sheet and the distance between the inner wall of the through groove; At least one outer resin sheet is used as the bottom layer group to cover and adhere to the bottom opening of the through groove. An inner resin sheet group consisting of at least one inner resin sheet is stacked on the bottom layer group. Then, at least one outer resin sheet is used as the top layer group to stack on the inner resin sheet group, so that the total thickness of the stacked resin is greater than or equal to the thickness of the core board.

[0048] For example, the The values ​​can be 0.02mm, 0.05mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.8mm, and 1mm.

[0049] Specifically, in any direction parallel to the surface of the core plate, the distance between the inner walls of the through grooves and the outline dimensions of the outer resin sheet Satisfying Relationship: ; in, The amount by which the outer resin sheet's outline extends beyond one side of the inner wall of the channel.

[0050] For example, the The values ​​can be 5mm, 10mm, 15mm, 20mm, 25mm, 30mm, 40mm, and 50mm.

[0051] Specifically, the length of the through slot The total length of the double-sided copper-clad laminate satisfy To ensure that the outer resin sheet can effectively cover and extend beyond both ends of the through groove, while the outer resin sheet does not extend beyond the outline of the core board.

[0052] It should be noted that by controlling the unilateral distance difference between the inner resin sheet and the tank wall, smooth insertion is ensured while avoiding assembly interference caused by excessively small gaps or uneven filling caused by excessively large gaps. By controlling the unilateral excess of the outer resin sheet, material waste and process redundancy are prevented while ensuring the sealing and constraint effects of compression. Combined with the sandwich-layer structure of "outer layer-inner layer-outer layer", quantitative and structured filling of resin material is achieved, providing a uniform, dense, and well-interfaced preform for subsequent vacuum compression, which is beneficial to improving molding quality and process reliability.

[0053] In some embodiments, both the bottom layer group and the top layer group are composed of a single outer resin sheet.

[0054] In some embodiments, all outer resin sheets have the same thickness.

[0055] In some embodiments, all inner resin sheets have the same thickness; The number N of inner resin sheets in the inner resin sheet group is determined according to the following formula: ; in, This indicates a floor function, where T is the thickness of the core board. The thickness of a single inner resin sheet.

[0056] It should be noted that a single-layer outer sheet (i.e., "one sheet on both the top and bottom") structure is adopted, and the thickness of the outer and inner resin sheets is specified to be consistent. The number of inner sheets is calculated by combining the formula. Through thickness uniformity and quantification of filling, the thickness of the laminate is precisely controlled, which improves the consistency and repeatability of the process. At the same time, the material preparation is simplified to parametric calculation, which improves the operational efficiency and reduces material waste, providing a reliable foundation for batch and high-quality sample preparation.

[0057] Specifically, the thickness of a single outer resin sheet The thickness T of the core plate satisfies: For example, The values ​​can be 0.01, 0.02, 0.04, 0.05, 0.06, 0.08, or 0.1.

[0058] Specifically, the thickness of a single inner resin sheet The thickness T of the core plate satisfies: For example, The values ​​can be 0.01, 0.02, 0.04, 0.05, 0.06, 0.08, or 0.1.

[0059] For example, the thickness of the outer resin sheet With respect to the thickness of the inner resin sheet equal.

[0060] It should be noted that limiting the thickness of a single resin sheet to within 1% to 10% of the core plate thickness ensures that the resin sheet has the necessary structural strength and can seal the edge of the through-slot opening during the pressing process. It also allows the resin sheet to deform in coordination with the core plate during the pressing process, avoiding operational difficulties caused by excessive thinness or excessive overflow and pressure distribution imbalance caused by excessive thickness. This ensures the feasibility and reliability of the quantitative filling strategy and improves the overall compatibility and process controllability of the process.

[0061] Specifically, the resin material to be tested is a semi-cured dry film type resin, and the pre-forming process in step S3 is to perform low-temperature vacuum pressing molding on the filled composite structure in a vacuum press, wherein the temperature of the low-temperature vacuum pressing molding process is 100℃~120℃.

[0062] In some embodiments, the filled composite structure (in this embodiment, the filled composite structure includes a core plate with the through groove and a test resin material, i.e., a semi-cured dry film resin, filled in the through groove and with a thickness not less than the thickness of the core plate) is placed in a vacuum laminator, and vacuuming, heating, pressurizing and maintaining for a certain time are performed in a sealed cavity to complete the degassing, initial flow and interlayer bonding of the resin, forming a preform.

[0063] For example, in addition to controlling the temperature of the low-temperature vacuum pressing molding process within the range of 100°C-120°C, at least one of the following process parameters can be further controlled: (1) The vacuum degree during the vacuum compression molding process is not higher than 100 Pa; (2) The applied pressing pressure is between 0.5 MPa and 2 MPa; (3) The holding time at the temperature and pressure is 1 to 10 minutes.

[0064] By synergistically controlling the parameters of the above-mentioned vacuum pressing molding process, air bubbles inside the resin can be effectively eliminated, resin flow and interlayer bonding can be promoted in the preforming stage, and a stable, dense and uniform intermediate can be formed, laying a good foundation for subsequent mirror pressing and curing.

[0065] In another specific embodiment of the present invention, in step S2, the resin material to be tested is a liquid resin slurry.

[0066] When the resin material to be tested is a liquid resin slurry, the filling step includes: A high-temperature resistant temporary bonding film is attached to the bottom opening of the through groove to seal the through groove and form a receiving cavity; The liquid resin slurry is injected into the receiving cavity using a vacuum screen printing machine; this injection method can avoid the generation of air bubbles in the liquid resin slurry and the receiving cavity.

[0067] Specifically, to ensure the stability of the bottom structure of the cavity during subsequent lamination and curing, the high-temperature resistant temporary bonding film has a temperature tolerance higher than the highest temperature of the lamination and curing process in step S4.

[0068] To better ensure the sealing reliability of the bottom of the cavity during the filling and curing process of the liquid resin slurry, the thickness of the high-temperature resistant temporary bonding film... With respect to the thickness of the core plate Satisfying Relationship: To balance sufficient elasticity, compressive strength, and ease of manufacturing.

[0069] Specifically, when the resin material to be tested is a liquid resin slurry, the pre-forming process in step S3 includes: baking the liquid resin slurry injected into the receiving cavity at a low temperature so that the degree of curing of the liquid resin slurry reaches 40% to 60%, forming a semi-cured state; after the pre-forming process, the resin in the core board through groove is in a soft solid state at room temperature.

[0070] For example, the liquid resin slurry is an epoxy magnetic resin slurry, and the low-temperature baking temperature is 120~140℃, and the baking time is 20~40min.

[0071] Specifically, in step S4, the pressing and curing are carried out in the laminator under the following process conditions: (a) Vacuum pressing stage: First, maintain the vacuum at a temperature of 110℃~130℃ and a pressure of 1-3MPa for 30-60 minutes in an environment with a vacuum degree of less than 100-1000Pa; preferably, the pressure is 2-3MPa. (b) Curing stage: Under a vacuum of less than 100-1000 Pa, the temperature is raised to the curing temperature of the resin material to be tested, and maintained at a pressure of 1.0-3.0 MPa for 60-100 min. Preferably, the pressure is 2.0-3.0 MPa.

[0072] Preferably, the pressure during the vacuum pressing stage and the curing stage is the same.

[0073] For example, during the vacuum pressing stage, the temperature is 110℃, 115℃, 120℃, 125℃, and 130℃; the pressure is 1.0MPa, 1.5MPa, 2.0MPa, 2.5MPa, and 3.0MPa; and the holding time is 30min, 40min, 50min, and 60min.

[0074] For example, during the curing stage, the pressure is 1.0 MPa, 1.5 MPa, 2.0 MPa, 2.5 MPa, and 3.0 MPa; and the holding time is 60 min, 70 min, 80 min, 90 min, and 100 min.

[0075] For example, the curing temperature should be set according to the material properties for different resin materials to be tested: For magnetic film materials, the curing temperature is preferably set at 180-190℃; For ABF (epoxy laminate) materials, the curing temperature is preferably set at 190-210℃; For PI (polyimide) materials, depending on the specific model, the curing temperature is preferably set at 240℃~260℃ (e.g., 250℃) or 340℃~360℃ (e.g., 350℃).

[0076] Furthermore, when the resin material to be tested is a semi-cured dry film resin, after the pressing and curing are completed in the laminator, the method further includes removing the resin material that overflows outside the through groove after curing and that exists at the edge of the composite structure.

[0077] Furthermore, when the resin material to be tested is a liquid resin slurry, after the pressing and curing are completed in the laminator, the method further includes: removing the high-temperature resistant temporary bonding film.

[0078] This invention designs personalized filling and post-processing paths for resin materials of different forms, ultimately unifying them towards the common goal of high-precision molding.

[0079] For dry film resins, this invention employs a "micro-interference filling + vacuum laminator low-temperature pressing preforming" strategy. By controlling the resin sheet stacking structure, a filling slightly exceeding the cavity volume is achieved. During the preforming stage, vacuum is used to remove interlayer gas, and pressure is used to promote resin flow and fusion, forming a dense and well-bonded intermediate. After lamination and curing in the laminator, edge overflow is removed, revealing a flat surface constrained by a mirror-finished steel plate. This ensures sufficient resin material filling and internal quality while obtaining a sample preform with high dimensional accuracy and excellent surface morphology.

[0080] For liquid resin slurries, this invention employs a "constant volume injection + low-temperature baking pre-curing" strategy. Quantitative injection is performed using a cavity formed by a temporary bonding film at the bottom, which is open at the top and closed at the bottom. During the pre-forming stage, the resin slurry is gelled through low-temperature baking, transforming it into a soft solid that can maintain its shape at room temperature. After lamination and curing in a laminator, the temporary bonding film is removed, thus providing a clean and complete preform interface for subsequent milling, ensuring the accuracy of the sample's bottom morphology.

[0081] To ensure that the high-temperature resistant temporary bonding film can be completely removed after the resin has cured, and that no film residue remains on the surface of the completely cured resin in the channel after removal, preferably, the high-temperature resistant temporary bonding film is selected from silicone-based films or acrylic-based films.

[0082] This invention provides a large-size resin material property test sample for semiconductor packaging, which is obtained by the manufacturing method of the large-size resin material property test sample for semiconductor packaging.

[0083] Specifically, the large-size resin material property test sample for semiconductor packaging refers to a magnetic ring-type test sample. The magnetic ring-type test sample is a ring-shaped test sample with a certain thickness. The outer diameter of the ring-shaped test sample is not less than 3 mm. For example, the outer diameter of the ring-shaped test sample is 1.25 to 2.5 times the inner diameter. The thickness of the ring-shaped test sample is 0.5 mm to 3.0 mm.

[0084] The technical solution of the present invention will be further described in detail below with reference to specific embodiments and comparative examples.

[0085] Example 1: This embodiment provides a method for manufacturing large-size magnetic ring test samples for semiconductor packaging. It employs the implementation path of this invention for semi-cured dry film resins to prepare magnetic ring samples (target samples) for permeability testing. Specifically, the target sample is a ring-shaped sample with an inner diameter of 7 mm, an outer diameter of 17 mm, and a thickness of 1 mm. The specific steps are as follows: S1. Prepare the core board: A double-sided copper-clad laminate 1 is provided, comprising an insulating substrate 2 in the middle and copper foils covering both sides of the insulating substrate, namely, front copper foil 3 and back copper foil 4. The double-sided copper-clad laminate 1 has the same thickness as the target sample 12. A through-slot 6 for accommodating the target sample array is formed on the double-sided copper-clad laminate. The width of the through-slot is greater than the outer diameter of the target sample, and the length of the through-slot is less than the length of the double-sided copper-clad laminate 1. The wall of the through-slot 6 is roughened. After the surface roughening treatment, a core board 5 with the roughened through-slot is obtained. Specifically, the double-sided copper-clad laminate uses an FR-4 epoxy resin substrate, and the thickness of the double-sided copper-clad laminate is 1.00 mm with a thickness tolerance of ±0.01 mm. The through-slot is rectangular, with a width of 18.0 mm (the outer diameter of the target sample is 17.0 mm) and a length of 200 mm, which can accommodate up to 10 target sample arrays. The through-slot wall is roughened by chemical etching; see [link to documentation]. Figure 1 .

[0086] S2, Filling with the resin material to be tested: The resin material to be tested is a semi-cured dry film resin. The dry film resin is cut into inner resin sheets 8 and outer resin sheets 7. One outer resin sheet 7 is used as the bottom layer, covering and adhering to the bottom opening of the channel. N layers of inner resin sheets 8 are stacked on top of the bottom layer, and then one outer resin sheet 7 is stacked as the top layer, ensuring the total thickness of the stacked resin is greater than the thickness of the core board. Specifically, the dry film resin is a semi-cured epoxy magnetic resin film (ShengYi Technology magnetic film model SIF40). The inner resin sheet is rectangular, with a length of 200mm and a width of 17mm. The outer resin sheet is rectangular, with a length of 240mm and a width of 58mm (excess on one side). =20mm); outer resin sheet thickness =0.12mm, inner resin sheet thickness =0.12mm. According to the formula Calculations show that the number of inner resin sheets is N=7, and the total thickness of the stacked resin sheets is 1.08mm; see [link / reference]. Figure 2 (a); S3. Pre-forming process: The filled composite structure is pre-formed. Specifically, the composite structure is placed in a vacuum laminator for low-temperature vacuum lamination molding. The low-temperature vacuum lamination molding process is carried out at a temperature of 120°C, a vacuum degree of less than 100 Pa, a lamination pressure of 0.9 MPa, and a holding time of 1 minute; see [link to relevant documentation]. Figure 2 (b); S4. Pressing and Curing: The pre-formed composite structure is placed in a laminator, and two mirror-finished steel plates 11, placed vertically opposite each other, are pressed and cured in a vacuum environment to further remove air bubbles from the uncured resin, ensuring that the resin material to be tested is completely cured and that the upper and lower surfaces of the resin material in the through-groove are flush with the surface of the core board. Specifically, the pressing and curing are carried out under the following process conditions: In the vacuum pressing stage, the temperature is maintained at 120°C and the pressure at 2MPa for 30 minutes in an environment with a vacuum degree lower than 100-1000Pa; in the curing stage, the temperature is further increased to 180°C and the pressure at 2.0MPa for 90 minutes in an environment with a vacuum degree lower than 100-1000Pa; see [link to relevant documentation]. Figure 2 (c) Figure 2 (d) Figure 2 (e1) and Figure 2 (e2). Remove excess material from the edges after curing 14.

[0087] S5. Machining: Radial finishing is performed on the resin molding surface after the mirror-finished steel plate is pressed and cured. A magnetic ring-type test sample 12 with predetermined inner and outer diameters is milled from the cured resin structure within the through groove of the core plate after pressing and curing in step S4 using a machining method. Specifically, a magnetic ring sample with an inner diameter of 7.0 mm and an outer diameter of 17.0 mm is milled using a CNC milling machine; see [link to relevant documentation]. Figure 4 .

[0088] Example 2: This embodiment provides a method for manufacturing large-size magnetic ring test samples for semiconductor packaging. It employs the implementation path for liquid resin slurry in this invention to prepare magnetic ring samples (target samples) for permeability testing. The size and shape of the target sample are the same as in Example 1. The specific steps are as follows: S1. Prepare the core board: The steps are the same as in Example 1, resulting in a core plate 5 with roughened grooves on the walls. The core plate thickness is 1.00 mm, and the groove dimensions are the same (18.0 mm wide and 200 mm long). The specific material is an FR-4 epoxy resin substrate; see [link to relevant documentation]. Figure 1 .

[0089] S2, Filling with the resin material to be tested: The resin material to be tested is a liquid resin slurry. A high-temperature resistant temporary bonding film 10 is attached to the bottom opening of the channel to seal the channel and form a receiving cavity 13; the liquid resin slurry 91 is injected into the receiving cavity using a vacuum screen printing machine. Specifically, the high-temperature resistant temporary bonding film is a polyimide film (PI film) coated with an organosilicon pressure-sensitive material, with a thickness of 0.10 mm. The liquid resin slurry is an epoxy magnetic resin slurry (ShengYi Technology product model Mag1005P). See also Figure 3 (a) and Figure 3 (b).

[0090] S3. Pre-forming process: The liquid resin slurry injected into the receiving cavity is subjected to low-temperature baking to achieve a semi-cured state. Specifically, it is baked at 130°C for 30 minutes to achieve a curing degree of 40-60%, forming a soft solid.

[0091] S4. Pressing and Curing: The pre-formed composite structure is placed in a laminator, and two mirror-finished steel plates 11, placed vertically opposite each other, are pressed and cured in a vacuum environment to further remove air bubbles from the uncured resin. Specifically, the process conditions are as follows: Vacuum pressing stage: first, under a vacuum level below 100-1000 Pa, the temperature is maintained at 120°C and the pressure at 3.0 MPa for 30 minutes; Curing stage: under a vacuum level below 100-1000 Pa, the temperature is then increased to 180°C and maintained at 3.0 MPa for 60 minutes. After curing, the high-temperature resistant temporary bonding film is removed, resulting in a core board with cured resin 92 in the channel. See [link to relevant documentation]. Figure 3 (c) ~ (e).

[0092] S5. Machining: Radial finishing is performed on the resin molding surface after the mirror-finished steel plate is pressed and cured. A magnetic ring-type test sample 12 with predetermined inner and outer diameters is milled from the cured resin structure within the through groove of the core plate after pressing and curing in step S4 using a machining method. Specifically, a magnetic ring sample with an inner diameter of 7.0 mm and an outer diameter of 17.0 mm is milled using a CNC milling machine; see [link to relevant documentation]. Figure 4 .

[0093] The magnetic ring samples prepared in Examples 1 and 2 of this invention have smooth surfaces and uniform thickness. The relative deviation between the measured thickness of the magnetic ring sample and the target thickness of 1.0 mm is within 2%. The inner and outer diameters are accurate. Furthermore, after metallographic section microscopy (e.g., according to IPC-TM-650) and microfocus X-ray CT scanning analysis, no pores with a diameter greater than 10 μm were found inside the prepared magnetic ring samples. The volume porosity is less than 0.1%. The samples are dense and uniform inside, without defects such as pores or delamination, which meets the requirements of high-precision magnetic permeability testing for sample size and internal quality.

[0094] Comparative Example 1 This comparative example provides a method for preparing magnetic ring-type test samples. See [link to relevant documentation]. Figure 5 The preparation steps are as follows: (1) Core board preparation: Provide an FR-4 epoxy resin-based double-sided copper-clad laminate (the middle insulating substrate is epoxy resin, and the insulating substrate is covered with copper foil on both sides). Using mechanical drilling, process several independent circular through holes on the copper-clad laminate. Each through hole is designed to have a diameter of 17mm, resulting in a core board with a thickness of 1mm and multiple independent circular through holes; see [link to relevant documentation]. Figure 5 (a1) and (a2); (2) Formation of cavity and filling with resin ( Figure 5 (A represents the process route of liquid resin): A temporary bonding film is attached to one side of the core board (as the bottom) to completely cover the bottom of the through-hole, thereby forming a series of independent cylindrical cavities with closed bottoms and open tops together with the core board. Liquid epoxy magnetic resin slurry (the same slurry described in Example 2 of this invention) is injected into the above cavities, the injection amount being sufficient to fill the cavities; see [link to relevant documentation]. Figure 5 (b); (3) The structure filled with liquid epoxy magnetic resin slurry in step (2) above is then thermo-cured, i.e., baked at 180-190℃ for 30 minutes. Two curing methods are specifically employed: Horizontal Curing: The structure filled with liquid epoxy magnetic resin slurry is placed horizontally in a hot air oven and heated according to the resin curing process under normal pressure. After curing, the upper surface of the resin (free liquid surface) forms an irregular curved surface with a central depression or raised edges due to surface tension and curing shrinkage, and cannot be flush with the core board surface; see [link to relevant documentation]. Figure 5 (c1).

[0095] Vertical Curing: The structure filled with liquid epoxy magnetic resin slurry was vertically suspended in a hot air oven and cured under normal pressure. Due to the large pore size (17mm) and the large amount of resin in the cavity, its own weight exceeded the critical value that the surface tension of the liquid resin could maintain equilibrium, causing significant resin flow and deformation in the vertical direction. This resulted in severe collapse of the resin surface at the top of the cavity or overall shape distortion; see [link to relevant documentation]. Figure 5 (c2).

[0096] After curing, remove the temporary bonding film at the bottom.

[0097] Comparative Example 2 This comparative example is the same as Comparative Example 1, except that... In step (2), the semi-cured epoxy magnetic resin film (the same material as described in Example 1 of this invention) is cut into circular pieces, and the circular resin pieces are directly pressed into the circular through holes of the core board. See [link to relevant documentation]. Figure 5 (d) No temporary bonding film is required for bottom sealing.

[0098] Step (3): The structure after pressing the circular resin sheet into the through hole in step (2) above is thermo-cured, that is, baked at 180℃-190℃ for 30 minutes. Two curing and placement methods are specifically used: Horizontal Curing: The structure filled with the semi-cured epoxy magnetic resin film is placed horizontally in a hot air oven and heated according to the resin curing process under normal pressure. After curing, the resin inserted into the through holes may fall off or deform.

[0099] Vertical Curing: The structure filled with the semi-cured epoxy magnetic resin film was vertically suspended in a hot air oven and cured under normal pressure. Due to the large pore size (17mm) and the large amount of resin in the cavity, its own weight exceeded the critical value that the resin surface tension could maintain, causing significant resin flow and deformation in the vertical direction. This resulted in severe collapse of the resin surface at the top of the cavity or overall shape distortion; see [link to relevant documentation]. Figure 5 (e).

[0100] Observations revealed that, regardless of whether horizontal or vertical curing methods were used, the surface of the cured resin inside the through-holes in Comparative Examples 1 and 2 was severely uneven, with the height difference between the highest and lowest points exceeding 0.4 mm, far exceeding the allowable range of the test sample thickness tolerance (usually ±0.02 mm). Furthermore, the joint between the resin body and the sidewall of the core board also exhibited defects such as gaps or internal pores due to deformation, resulting in a low sample yield for large-sized magnetic ring samples.

[0101] This demonstrates that, compared to Comparative Examples 1 and 2, the embodiments of the present invention significantly improve the surface smoothness, thickness uniformity, and internal density of the test samples, achieving efficient, low-cost, and high-precision preparation of magnetic ring samples for permeability testing. The manufacturing method provided by the present invention significantly improves the yield of large-size resin material property test samples for semiconductor packaging, reduces the cost per test sample, and improves sample preparation efficiency.

[0102] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for manufacturing large-size resin material property testing samples for semiconductor packaging, characterized in that, Includes the following steps: S1. Provide a double-sided copper-clad laminate, wherein the thickness of the double-sided copper-clad laminate is consistent with the thickness of the target sample; A through slot is formed on the double-sided copper-clad laminate to accommodate one or more target sample arrays. The width of the through slot is greater than the outer edge of the target sample, and the length of the through slot is less than the length of the double-sided copper-clad laminate. The surface of the channel wall is roughened. After surface roughening treatment, a core plate with a through groove having roughened groove walls is obtained; S2. Fill the through groove with the resin material to be tested, and make the thickness of the filled resin not less than the thickness of the core board to obtain the filled composite structure. S3. Pre-form the filled composite structure; S4. The pre-formed composite structure is placed in a laminator and pressed and cured in a vacuum environment using a mirror steel plate, so that the resin material to be tested is completely cured and the upper and lower surfaces of the resin material in the through groove are flush with the surface of the core board. S5. Through mechanical processing, a large-size resin material physical property test sample with a specific shape and size for semiconductor packaging is milled out from the cured resin structure in the through groove of the core board.

2. The manufacturing method according to claim 1, characterized in that, In step S2, the resin material to be tested is a dry film type resin in a semi-cured state; The filling step includes: The dry film resin is cut into an inner resin sheet and an outer resin sheet; Wherein, in any direction parallel to the surface of the core board, the outline dimensions of the inner resin sheet are... The distance between the inner walls of the through groove and the outline dimensions of the outer resin sheet Satisfying Relationship: ； in, This is the one-sided difference between the outline dimension of the inner resin sheet and the distance between the inner wall of the through groove; At least one outer resin sheet is used as the bottom layer group to cover and adhere to the bottom opening of the through groove. An inner resin sheet group consisting of at least one inner resin sheet is stacked on the bottom layer group. Then, at least one outer resin sheet is used as the top layer group to stack on the inner resin sheet group, so that the total thickness of the stacked resin is greater than or equal to the thickness of the core board.

3. The manufacturing method according to claim 2, characterized in that: The distance between the inner walls of the through slots in any direction parallel to the surface of the core plate. and the outline dimensions of the outer resin sheet Satisfying Relationship: ； in, The amount by which the outer resin sheet's outline extends beyond one side of the inner wall of the channel.

4. The manufacturing method according to claim 2, characterized in that: All inner resin sheets have the same thickness; The number N of inner resin sheets in the inner resin sheet group is determined according to the following formula: ； in, This indicates a floor function, where T is the thickness of the core board. The thickness of a single inner resin sheet.

5. The manufacturing method according to claim 4, characterized in that: The thickness of the outer resin sheet The thickness T of the core plate satisfies: ; and / or, The thickness of the inner resin sheet The thickness T of the core plate satisfies: .

6. The manufacturing method according to claim 2, characterized in that: The resin material to be tested is a semi-cured dry film type resin. The pre-forming process in step S3 is to perform low-temperature vacuum pressing molding on the filled composite structure in a vacuum press, and the temperature of the low-temperature vacuum pressing molding process is 100℃~120℃.

7. The manufacturing method according to claim 1, characterized in that, In step S2, the resin material to be tested is a liquid resin slurry; The filling step includes: A high-temperature resistant temporary bonding film is attached to the bottom opening of the through groove to seal the through groove and form a receiving cavity; The liquid resin slurry is injected into the receiving cavity using a vacuum screen printing machine.

8. The manufacturing method according to claim 7, characterized in that, The pre-forming process in step S3 includes: baking the liquid resin slurry injected into the receiving cavity at a low temperature so that the degree of curing of the liquid resin slurry reaches 40% to 60%, forming a semi-cured state.

9. The manufacturing method according to claim 1, characterized in that, In step S4, the pressing and curing are carried out in the laminator under the following process conditions: (a) Vacuum pressing stage: First, maintain the vacuum level below 100-1000 Pa for 30-60 min at a temperature of 110-130℃ and a pressure of 1.0-3.0 MPa; (b) Curing stage: Under a vacuum of less than 100-1000 Pa, the temperature is raised to the curing temperature of the resin material to be tested, and maintained at a pressure of 1.0~3.0 MPa for 60-100 min.

10. A large-size resin material property test sample for semiconductor packaging, characterized in that, The large-size resin material physical property test sample is obtained by the manufacturing method according to any one of claims 1 to 9.

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