Biosensor and manufacturing method thereof

Abstract

The invention provides a biosensor and a manufacturing method thereof. The biosensor comprises a bearing substrate, a first insulating layer, a second insulating layer, a first conductive circuit layer, a second conductive circuit layer, a plurality of first conductive through layers, a plurality of second conductive through layers, a plurality of first exposed electrodes and a plurality of second exposed electrodes. A plurality of first conductive through layers pass through the second insulating layer. A plurality of second conductive through layers pass through the second insulating layer. Each first bare electrode is electrically connected to the corresponding first conductive through layer. Each second bare electrode is electrically connected to the corresponding second conductive through layer. Therefore, the first bare electrodes can be electrically connected to the first conductive circuit layer through the corresponding first conductive penetrating layers, and a first preset distance is formed between the first bare electrodes and the first conductive circuit layer; and the second exposed electrodes can be electrically connected to the second conductive circuit layer through the corresponding second conductive penetrating layers and are separated from the second conductive circuit layer by a second preset distance.

Description

Technical Field

[0001] This application relates to a sensor and a method for manufacturing the same, and more particularly to a biosensor and a method for manufacturing the same. Background Technology

[0002] Biosensors can transmit the reactions of biomolecules (such as enzymes, antibodies, cell receptors, or DNA probes) via physicochemical detectors, and then use a signal processor to present the sensing results to the user. However, existing biosensors still have room for improvement. Summary of the Invention

[0003] The technical problem to be solved by this application is to provide a biosensor and a method for manufacturing the same, addressing the shortcomings of existing technologies.

[0004] To improve or solve the above-mentioned problems, one technical approach adopted in this application is to provide a biosensor, comprising: a carrier substrate, a first insulating layer, a second insulating layer, a first conductive circuit layer, a second conductive circuit layer, a plurality of first conductive through-layers, a plurality of second conductive through-layers, a plurality of first exposed electrodes, and a plurality of second exposed electrodes. The first insulating layer is disposed on the carrier substrate. The first conductive circuit layer is disposed on the first insulating layer. The second conductive circuit layer is disposed on the first insulating layer. The second insulating layer is disposed on the first insulating layer and partially covers the first conductive circuit layer and the second conductive circuit layer. The plurality of first conductive through-layers penetrate the second insulating layer to be electrically connected to the first conductive circuit layer. The plurality of second conductive through-layers penetrate the second insulating layer to be electrically connected to the second conductive circuit layer. The plurality of first exposed electrodes are disposed on the second insulating layer, each first exposed electrode being electrically connected to a corresponding first conductive through-layer. The plurality of second exposed electrodes are disposed on the second insulating layer, each second exposed electrode being electrically connected to a corresponding second conductive through-layer. The first conductive line layer and the second conductive line layer are adjacent to each other and separated from each other, and the first conductive line layer and the second conductive line layer cooperate with each other to form a finger-shaped electrode structure; wherein the first conductive line layer includes a first extension and a plurality of first line portions extending from the first extension, the second conductive line layer includes a second extension and a plurality of second line portions extending from the second extension, and the plurality of first line portions of the first conductive line layer and the plurality of second line portions of the second conductive line layer are arranged alternately.

[0005] To improve or solve the above-mentioned problems, another technical approach adopted in this application is to provide a biosensor, which includes: a carrier substrate, a first insulating layer, a second insulating layer, a first conductive circuit layer, a second conductive circuit layer, a plurality of first conductive through-layers, a plurality of second conductive through-layers, a plurality of first exposed electrodes, and a plurality of second exposed electrodes. The first insulating layer is disposed on the carrier substrate. The first conductive circuit layer is disposed on the first insulating layer. The second conductive circuit layer is disposed on the first insulating layer. The second insulating layer is disposed on the first insulating layer and partially covers the first conductive circuit layer and the second conductive circuit layer. The plurality of first conductive through-layers pass through the second insulating layer to be electrically connected to the first conductive circuit layer. The plurality of second conductive through-layers pass through the second insulating layer to be electrically connected to the second conductive circuit layer. The plurality of first exposed electrodes are disposed on the second insulating layer, each first exposed electrode being electrically connected to a corresponding first conductive through-layer. The plurality of second exposed electrodes are disposed on the second insulating layer, each second exposed electrode being electrically connected to a corresponding second conductive through-layer.

[0006] To improve or solve the above-mentioned problems, another technical means adopted in this application is to provide a method for fabricating a biosensor, which includes: forming a first insulating layer on a carrier substrate; forming a first conductive line layer and a second conductive line layer on the first insulating layer; forming a second insulating layer on the first insulating layer to partially cover the first conductive line layer and the second conductive line layer; forming a plurality of first conductive through-layers and a plurality of second conductive through-layers, wherein the plurality of first conductive through-layers pass through the second insulating layer to be electrically connected to the first conductive line layer, and the plurality of second conductive through-layers pass through the second insulating layer to be electrically connected to the second conductive line layer; and forming a plurality of first exposed electrodes and a plurality of second exposed electrodes, wherein the plurality of first exposed electrodes are disposed on the second insulating layer and are respectively electrically connected to the plurality of first conductive through-layers, and the plurality of second exposed electrodes are disposed on the second insulating layer and are respectively electrically connected to the plurality of second conductive through-layers.

[0007] One of the beneficial effects of this application is that the biosensor provided by this application can achieve the following technical solutions: "multiple first conductive penetration layers pass through the second insulating layer to be electrically connected to the first conductive line layer", "multiple second conductive penetration layers pass through the second insulating layer to be electrically connected to the second conductive line layer", "multiple first exposed electrodes are disposed on the second insulating layer, each first exposed electrode is electrically connected to a corresponding first conductive penetration layer", and "multiple second exposed electrodes are disposed on the second insulating layer, each second exposed electrode is electrically connected to a corresponding second conductive penetration layer". This allows the first exposed electrode to be electrically connected to the first conductive line layer through the corresponding first conductive penetration layer and to be a first predetermined distance from the first conductive line layer, and also allows the second exposed electrode to be electrically connected to the second conductive line layer through the corresponding second conductive penetration layer and to be a second predetermined distance from the second conductive line layer.

[0008] One of the beneficial effects of this application is that the method for fabricating a biosensor provided in this application can achieve the following through the technical solutions: "forming multiple first conductive through-layers and multiple second conductive through-layers, wherein the multiple first conductive through-layers pass through a second insulating layer to be electrically connected to a first conductive circuit layer, and the multiple second conductive through-layers pass through a second insulating layer to be electrically connected to a second conductive circuit layer" and "forming multiple first exposed electrodes and multiple second exposed electrodes, wherein the multiple first exposed electrodes are disposed on a second insulating layer and are respectively electrically connected to the multiple first conductive through-layers, and the multiple second exposed electrodes are disposed on a second insulating layer and are respectively electrically connected to the multiple second conductive through-layers." This allows the first exposed electrodes to be electrically connected to the first conductive circuit layer through corresponding first conductive through-layers at a first predetermined distance from the first conductive circuit layer, and allows the second exposed electrodes to be electrically connected to the second conductive circuit layer through corresponding second conductive through-layers at a second predetermined distance from the second conductive circuit layer.

[0009] The other effects and embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a flowchart illustrating a method for fabricating a biosensor according to the first embodiment of this application;

[0012] Figure 2This is a top view schematic diagram of step S102 of the method for fabricating a biosensor according to the first embodiment of this application;

[0013] Figure 3 for Figure 2 Partial cross-sectional schematic diagram of section III-III;

[0014] Figure 4 This is a top view schematic diagram of step S104 of the method for fabricating a biosensor according to the first embodiment of this application;

[0015] Figure 5 for Figure 4 A partial cross-sectional schematic diagram of VV;

[0016] Figure 6 This is a top view schematic diagram of step S106 of the method for fabricating a biosensor according to the first embodiment of this application;

[0017] Figure 7 for Figure 6 Partial cross-sectional schematic diagram of VII-VII;

[0018] Figure 8 This is a top view of step S108 of the biosensor fabrication method according to the first embodiment of this application (or a top view of the biosensor according to the first embodiment of this application).

[0019] Figure 9 for Figure 8 A partial cross-sectional view of IX-IX;

[0020] Figure 10 This is a top view schematic diagram of the biosensor according to the second embodiment of this application. Detailed Implementation

[0021] The following specific embodiments illustrate the implementation of the "biosensor and its fabrication method" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, it should be stated in advance that the accompanying drawings of this application are for simple illustration only and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application. In addition, the term "or" used herein may include any one or more combinations of the associated listed items, depending on the actual situation.

[0022] First Embodiment

[0023] See Figures 1 to 9As shown, the first embodiment of this application provides a method for fabricating a biosensor, which may include at least the following steps: First, in conjunction with... Figure 1 , Figure 2 and Figure 3 As shown, a first insulating layer 2A is formed on a carrier substrate 1 (step S100), then a first conductive line layer 3A and a second conductive line layer 3B are formed on the first insulating layer 2A (step S102); next, in conjunction with Figure 1 , Figure 4 and Figure 5 As shown, a second insulating layer 2B is formed on the first insulating layer 2A to partially cover the first conductive line layer 3A and the second conductive line layer 3B (step S104); then, in conjunction with Figure 1 , Figure 6 and Figure 7 As shown, a plurality of first conductive through-layers 4A and a plurality of second conductive through-layers 4B are formed. The plurality of first conductive through-layers 4A pass through the second insulating layer 2B to be electrically connected to the first conductive line layer 3A, and the plurality of second conductive through-layers 4B pass through the second insulating layer 2B to be electrically connected to the second conductive line layer 3B (step S106). Next, a plurality of first exposed electrodes 5A and a plurality of second exposed electrodes 5B are formed. The plurality of first exposed electrodes 5A are disposed on the second insulating layer 2B and are respectively electrically connected to the plurality of first conductive through-layers 4A, and the plurality of second exposed electrodes 5B are disposed on the second insulating layer 2B and are respectively electrically connected to the plurality of second conductive through-layers 4B (step S108), thereby completing the fabrication of a biosensor S.

[0024] For example, coordination Figures 2 to 9As shown, in step S100, where the first insulating layer 2A is formed on the substrate 1, the first insulating layer 2A can be formed using a semiconductor process (e.g., exposure, development, etching) or a non-semiconductor process. Furthermore, in step S102, where the first conductive line layer 3A and the second conductive line layer 3B are formed on the first insulating layer 2A, the first conductive line layer 3A and the second conductive line layer 3B can be formed using a semiconductor process (e.g., exposure, development, etching) or a non-semiconductor process. Additionally, in step S104, where the second insulating layer 2B is formed on the first insulating layer 2A, the second insulating layer 2B can be formed using a semiconductor process (e.g., exposure, development, etching) or a non-semiconductor process. Moreover, in step S106, where the plurality of first conductive through-layers 4A and the plurality of second conductive through-layers 4B are formed, the plurality of first conductive through-layers 4A and the plurality of second conductive through-layers 4B can be formed using a semiconductor process (e.g., exposure, development, etching) or a non-semiconductor process. Furthermore, in step S108, which forms a plurality of first exposed electrodes 5A and a plurality of second exposed electrodes 5B, the plurality of first exposed electrodes 5A and the plurality of second exposed electrodes 5B can be formed by semiconductor processes (e.g., exposure, development, etching) or non-semiconductor processes. However, the examples given above are merely one possible embodiment and are not intended to limit this application.

[0025] It is worth noting that, for example, after step S108, which forms multiple first exposed electrodes 5A and multiple second exposed electrodes 5B, the biosensor fabrication method may further include: performing a cleaning step (step S110). The cleaning step (or product surface cleaning step) may be chemical cleaning, water cleaning, plasma cleaning, or any type of semiconductor cleaning method to clean the biosensor S fabricated by the biosensor fabrication method provided in this application. Furthermore, after step S108, which forms multiple first exposed electrodes 5A and multiple second exposed electrodes 5B, the biosensor fabrication method may further include: performing a leveling step (step S112). The leveling step (or electrode surface leveling step) may be a physical or chemical surface treatment of the top surface of the first exposed electrode 5A and the top surface of the second exposed electrode 5B, thereby improving the surface flatness of each first exposed electrode 5A and each second exposed electrode 5B. However, the examples given above are merely one possible embodiment and are not intended to limit this application.

[0026] Furthermore, cooperation Figure 8 and Figure 9As shown, the first embodiment of this application further provides a biosensor S, which includes: a carrier substrate 1, a first insulating layer 2A, a second insulating layer 2B, a first conductive line layer 3A, a second conductive line layer 3B, a plurality of first conductive through-layers 4A, a plurality of second conductive through-layers 4B, a plurality of first exposed electrodes 5A, and a plurality of second exposed electrodes 5B. More specifically, the first insulating layer 2A is disposed on the carrier substrate 1, the first conductive line layer 3A is disposed on the first insulating layer 2A, and the second conductive line layer 3B is disposed on the first insulating layer 2A. Furthermore, the second insulating layer 2B is disposed on the first insulating layer 2A and partially covers the first conductive line layer 3A and the second conductive line layer 3B. The plurality of first conductive through-layers 4A pass through the second insulating layer 2B to be electrically connected to the first conductive line layer 3A, and the plurality of second conductive through-layers 4B pass through the second insulating layer 2B to be electrically connected to the second conductive line layer 3B. Furthermore, a plurality of first exposed electrodes 5A are disposed on the second insulating layer 2B, and each first exposed electrode 5A is electrically connected to a corresponding first conductive through-layer 4A. Additionally, a plurality of second exposed electrodes 5B are disposed on the second insulating layer 2B, and each second exposed electrode 5B is electrically connected to a corresponding second conductive through-layer 4B. It is worth noting that, for example, such as... Figure 2 As shown, the first conductive line layer 3A and the second conductive line layer 3B can be adjacent to each other and separated from each other, and the first conductive line layer 3A and the second conductive line layer 3B can cooperate to form a forked electrode structure. Furthermore, the first conductive line layer 3A may include a first extension 31A and a plurality of first line portions 32A extending from the first extension 31A, and the second conductive line layer 3B may include a second extension 31B and a plurality of second line portions 32B extending from the second extension 31B, and the plurality of first line portions 32A of the first conductive line layer 3A and the plurality of second line portions 32B of the second conductive line layer 3B can be arranged alternately. However, the above-described example is only one possible embodiment and is not intended to limit this application.

[0027] For example, coordination Figure 2 and Figure 3As shown, the plurality of first line portions 32A of the first conductive line layer 3A may be parallel to each other or non-parallel to each other, and the plurality of first line portions 32A may extend vertically or obliquely from the first extension portion 31A. Similarly, the plurality of second line portions 32B of the second conductive line layer 3B may be parallel to each other or non-parallel to each other, and the plurality of second line portions 32B may extend vertically or obliquely from the second extension portion 31B. Furthermore, the first extension portion 31A of the first conductive line layer 3A and the second extension portion 31B of the second conductive line layer 3B may be parallel to each other or non-parallel to each other, and the plurality of first line portions 32A of the first conductive line layer 3A and the plurality of second line portions 32B of the second conductive line layer 3B may be parallel to each other or non-parallel to each other. Furthermore, the first conductive line layer 3A and the second conductive line layer 3B can cooperate with each other to form a continuous meandering gap G (or a continuous S-shaped separation space) between the first conductive line layer 3A and the second conductive line layer 3B, and the width (or maximum width) of the continuous meandering gap G can be between 2000nm and 6000nm (e.g., any positive integer between 2000nm and 6000nm). However, the examples given above are only one possible embodiment and are not intended to limit this application.

[0028] For example, coordination Figure 6 and Figure 7 As shown, a first end and a second end of each first conductive through-layer 4A can respectively directly and electrically contact the first conductive line layer 3A and the corresponding first exposed electrode 5A (e.g., ...). Figure 9 As shown), and each second conductive through-layer 4B has a first end and a second end that can directly and electrically contact the second conductive line layer 3B and the corresponding second exposed electrode 5B (as shown). Figure 9 (As shown). It is worth noting that the plurality of first conductive through-layers 4A can be divided into a plurality of first via arrays V1, and the plurality of first conductive through-layers 4A in each first via array V1 can be electrically connected to the corresponding first line portion 32A of the first conductive line layer 3A. Furthermore, the plurality of second conductive through-layers 4B can be divided into a plurality of second via arrays V2, and the plurality of second conductive through-layers 4B in each second via array V2 can be electrically connected to the corresponding second line portion 32B of the second conductive line layer 3B. However, the examples given above are merely one possible embodiment and are not intended to limit this application.

[0029] For example, coordination Figure 8 and Figure 9As shown, each first exposed electrode 5A can be configured to be columnar (e.g., cylindrical, polygonal, or arbitrary columnar), and each second exposed electrode 5B can be configured to be elongated (or short). Furthermore, each first exposed electrode 5A can be electrically connected to one or more corresponding first conductive through-layers 4A (the first embodiment uses one first conductive through-layer 4A as an example), and each second exposed electrode 5B can be electrically connected to one or more corresponding second conductive through-layers 4B (the first embodiment uses multiple second conductive through-layers 4B as an example). Furthermore, the surface of each first exposed electrode 5A may or may not have a biological probe, or may have a biological probe (e.g., antibody, protein, peptide, receptor, aptamer, chemical polymer, microfinger, nucleic acid, or a combination thereof), and the surface of each second exposed electrode 5B may or may not have a biological probe, or may have a biological probe (e.g., antibody, protein, peptide, receptor, aptamer, chemical polymer, microfinger, nucleic acid, or a combination thereof). It is noteworthy that the multiple first exposed electrodes 5A can be divided into multiple first electrode arrays E1. The multiple first exposed electrodes 5A of each first electrode array E1 can be disposed above the corresponding first line portion 32A of the first conductive line layer 3A and electrically connected to the multiple first conductive through layers 4A of the corresponding first via array V1. Furthermore, the plurality of second exposed electrodes 5B can be divided into a plurality of second electrode arrays E2, and the plurality of second exposed electrodes 5B in each second electrode array E2 can be disposed above the corresponding second line portion 32B of the second conductive line layer 3B and electrically connected to the plurality of second conductive through layers 4B of the corresponding second via array V2. However, the examples given above are merely one possible embodiment and are not intended to limit this application.

[0030] For example, coordination Figure 2 and Figure 3As shown, depending on different requirements, the carrier substrate 1 can be configured as a silicon wafer substrate, a gallium nitride (GaN) substrate, a silicon carbide (SiC) substrate, a silicon germanium (SiGe) substrate, a sapphire substrate, a glass substrate, or any type of carrier substrate. Furthermore, depending on different requirements, the first insulating layer 2A can be configured as a first oxide layer, a first nitride layer, a first oxide nitride layer, or any type of first insulating material layer, and the second insulating layer 2B can be configured as a second oxide layer, a second nitride layer, a first oxide nitride layer, or any type of first insulating material layer. It is worth noting that, depending on different requirements, the thickness (or height) of the first insulating layer 2A can be between [specific values ​​to be filled in]. to Between (e.g., between) to (any positive integer between), and the thickness (or height) of the second insulating layer 2B can be between to Between (e.g., between) to (any positive integer between [0, ...

[0031] For example, coordination Figure 2 and Figure 3As shown, depending on different requirements, the first conductive circuit layer 3A can be configured as a first gold circuit layer made of gold (Au), a first silver circuit layer made of silver (Ag), a first copper circuit layer made of copper (Cu), a first aluminum circuit layer made of aluminum (Al), a first nickel circuit layer made of nickel (Ni), a first titanium circuit layer made of titanium (Ti), a first platinum circuit layer made of platinum (Pt), a first palladium circuit layer made of palladium (Pd), a first tantalum circuit layer made of tantalum (Ta), a first tungsten circuit layer made of tungsten (W), a first copper-aluminum alloy (AlCu) circuit layer, a first copper-aluminum-silicon alloy (AlSiCu) circuit layer, a first tantalum nitride (TaN) circuit layer, or a first titanium nitride (TiN) circuit layer. Furthermore, depending on different requirements, the second conductive circuit layer 3B can be configured as a second gold circuit layer made of gold (Au), a second silver circuit layer made of silver (Ag), a second copper circuit layer made of copper (Cu), a second aluminum circuit layer made of aluminum (Al), a second nickel circuit layer made of nickel (Ni), a second titanium circuit layer made of titanium (Ti), a second platinum circuit layer made of platinum (Pt), a second palladium circuit layer made of palladium (Pd), a second tantalum circuit layer made of tantalum (Ta), a second tungsten circuit layer made of tungsten (W), a second copper-aluminum alloy (AlCu) circuit layer, a second copper-aluminum-silicon alloy (AlSiCu) circuit layer, a second tantalum nitride (TaN) circuit layer, or a second titanium nitride (TiN) circuit layer. It is worth noting that, depending on different requirements, the thickness (or height) of the first conductive circuit layer 3A can be between […]. to Between (e.g., between) to (any positive integer between), and the thickness (or height) of the second conductive layer 3B can be between to Between (e.g., between) to (any positive integer between [0, ...

[0032] For example, coordination Figure 6 and Figure 7As shown, depending on different requirements, each first conductive through-layer 4A can be configured as a first gold through-hole made of gold (Au), a first silver through-hole made of silver (Ag), a first copper through-hole made of copper (Cu), a first aluminum through-hole made of aluminum (Al), a first nickel through-hole made of nickel (Ni), a first titanium through-hole made of titanium (Ti), a first platinum through-hole made of platinum (Pt), a first palladium through-hole made of palladium (Pd), a first tantalum through-hole made of tantalum (Ta), a first tungsten through-hole made of tungsten (W), a first copper-aluminum alloy (AlCu) through-hole, a first copper-aluminum-silicon alloy (AlSiCu) through-hole, a first tantalum nitride (TaN) through-hole, or a first titanium nitride (TiN) through-hole. Furthermore, depending on different requirements, each second conductive through-layer 4B can be configured as a second gold through-hole made of gold (Au), a second silver through-hole made of silver (Ag), a second copper through-hole made of copper (Cu), a second aluminum through-hole made of aluminum (Al), a second nickel through-hole made of nickel (Ni), a second titanium through-hole made of titanium (Ti), a second platinum through-hole made of platinum (Pt), a second palladium through-hole made of palladium (Pd), a second tantalum through-hole made of tantalum (Ta), a second tungsten through-hole made of tungsten (W), a second copper-aluminum alloy (AlCu) through-hole, a second copper-aluminum-silicon alloy (AlSiCu) through-hole, a second tantalum nitride (TaN) through-hole, or a second titanium nitride (TiN) through-hole. It is worth noting that, depending on different requirements, the thickness (or height) of each first conductive through-layer 4A can be between […]. to Between (e.g., between) to The width of each first conductive through-layer 4A can be between 50 nm and 200 nm (e.g., any positive integer between 50 nm and 200 nm). Additionally, the thickness (or height) of each second conductive through-layer 4B can be between... to Between (e.g., between) to The width of each second conductive through-layer 4B can be between 50 nm and 200 nm (e.g., any positive integer between 50 nm and 200 nm). However, the examples given above are merely one possible embodiment and are not intended to limit this application.

[0033] For example, coordination Figure 8 and Figure 9As shown, depending on different needs, each first exposed electrode 5A can be configured as a working electrode, and each first exposed electrode 5A can be configured as a first gold electrode made of gold (Au), a first silver electrode made of silver (Ag), a first copper electrode made of copper (Cu), a first aluminum electrode made of aluminum (Al), a first nickel electrode made of nickel (Ni), a first titanium electrode made of titanium (Ti), a first platinum electrode made of platinum (Pt), a first palladium electrode made of palladium (Pd), a first tantalum electrode made of tantalum (Ta), a first tungsten electrode made of tungsten (W), a first copper-aluminum alloy (AlCu) electrode, a first copper-aluminum-silicon alloy (AlSiCu) electrode, a first tantalum nitride (TaN) electrode, or a first titanium nitride (TiN) electrode. Furthermore, depending on different requirements, each second exposed electrode 5B can be configured as an auxiliary electrode (counter electrode), and each second exposed electrode 5B can be configured as a second gold electrode made of gold (Au), a second silver electrode made of silver (Ag), a second copper electrode made of copper (Cu), a second aluminum electrode made of aluminum (Al), a second nickel electrode made of nickel (Ni), a second titanium electrode made of titanium (Ti), a second platinum electrode made of platinum (Pt), a second palladium electrode made of palladium (Pd), a second tantalum electrode made of tantalum (Ta), a second tungsten electrode made of tungsten (W), a second copper-aluminum alloy (AlCu) electrode, a second copper-aluminum-silicon alloy (AlSiCu) electrode, a second tantalum nitride (TaN) electrode, or a second titanium nitride (TiN) electrode. It is worth noting that, depending on different requirements, the thickness (or height) of each first exposed electrode 5A can be between [specific values ​​to be filled in]. to Between (e.g., between) to The width of each first exposed electrode 5A can be between 100 nm and 5000 nm (e.g., any positive integer between 100 nm and 5000 nm), and the distance between two adjacent first exposed electrodes 5A can be between 1000 nm and 10000 nm (e.g., any positive integer between 100 nm and 10000 nm). Additionally, the thickness (or height) of each second exposed electrode 5B can be between... to Between (e.g., between) to The width of each second exposed electrode 5B can be between 3000 nm and 5000 nm (e.g., any positive integer between 3000 nm and 5000 nm). However, the examples given above are merely one possible embodiment and are not intended to limit this application.

[0034] It is worth noting that, for example, in step S102 of forming the first conductive circuit layer 3A and the second conductive circuit layer 3B, the method for fabricating the biosensor further includes: forming a third conductive circuit layer 3C (e.g., Figure 2 As shown), the third conductive circuit layer 3C is disposed on the first insulating layer 2A. Furthermore, in step S106, which involves forming multiple first conductive through-layers 4A and multiple second conductive through-layers 4B, the biosensor fabrication method further includes: forming multiple third conductive through-layers 4C (as shown). Figure 6 As shown), multiple third conductive through-layers 4C penetrate the second insulating layer 2B to be electrically connected to the third conductive circuit layer 3C. Furthermore, in step S108, which involves forming multiple first exposed electrodes 5A and multiple second exposed electrodes 5B, the biosensor fabrication method further includes: forming a third exposed electrode 5C (as shown). Figure 8 As shown), the third exposed electrode 5C is disposed on the second insulating layer 2B and electrically connected to multiple third conductive through layers 4C. That is, in conjunction with... Figure 2 , Figure 6 and Figure 8 As shown, the biosensor S further includes a third conductive line layer 3C, a plurality of third conductive through-layers 4C, and a third exposed electrode 5C. The plurality of third conductive through-layers 4C are electrically connected between the third conductive line layer 3C and the third exposed electrode 5C, and the third exposed electrode 5C can be configured as a reference electrode. It is worth noting that the third conductive line layer 3C can be made of the same material as the first conductive line layer 3A or the second conductive line layer 3B, the third conductive through-layers 4C can be made of the same material as the first conductive through-layer 4A or the second conductive through-layer 4B, and the third exposed electrode 5C can be made of the same material as the first exposed electrode 5A or the second exposed electrode 5B. However, the examples given above are merely one possible embodiment and are not intended to limit this application.

[0035] Second Embodiment

[0036] See Figure 10 As shown, the second embodiment of this application provides a biosensor S. Figure 10 and Figure 8A comparison reveals that the most significant difference between the second embodiment and the first embodiment of this application lies in the following: In the second embodiment, a second exposed electrode 5B (or a series of second exposed electrodes) of each second electrode array E2 is disposed above the corresponding second line portion 32B of the second conductive line layer 3B and electrically connected to multiple second conductive through layers 4B of the corresponding second via array V2. In other words, depending on different requirements, each second electrode array E2 may include multiple second exposed electrodes 5B (as shown in the first embodiment) or only one second exposed electrode 5B (as shown in the second embodiment). However, the examples given above are merely one feasible embodiment and are not intended to limit this application.

[0037] Beneficial effects of the embodiments

[0038] One of the beneficial effects of this application is that the biosensor S provided by this application can achieve the following through technical solutions: "multiple first conductive penetration layers 4A pass through the second insulating layer 2B to be electrically connected to the first conductive line layer 3A", "multiple second conductive penetration layers 4B pass through the second insulating layer 2B to be electrically connected to the second conductive line layer 3B", "multiple first exposed electrodes 5A are disposed on the second insulating layer 2B, each first exposed electrode 5A being electrically connected to a corresponding first conductive penetration layer 4A", and "multiple second exposed electrodes 5B are disposed on the second insulating layer 2B, each second exposed electrode 5B being electrically connected to a corresponding second conductive penetration layer 4B". This allows the first exposed electrode 5A to be electrically connected to the first conductive line layer 3A through the corresponding first conductive penetration layer 4A and to be a first predetermined distance from the first conductive line layer 3A, and allows the second exposed electrode 5B to be electrically connected to the second conductive line layer 3B through the corresponding second conductive penetration layer 4B and to be a second predetermined distance from the second conductive line layer 3B.

[0039] One of the beneficial effects of this application is that the method for fabricating a biosensor provided in this application can achieve the following through the technical solutions: "forming multiple first conductive through-layers 4A and multiple second conductive through-layers 4B, wherein the multiple first conductive through-layers 4A pass through the second insulating layer 2B to be electrically connected to the first conductive line layer 3A, and the multiple second conductive through-layers 4B pass through the second insulating layer 2B to be electrically connected to the second conductive line layer 3B" and "forming multiple first exposed electrodes 5A and multiple second exposed electrodes 5B, wherein the multiple first exposed electrodes 5A are disposed on the second insulating layer 2B and respectively electrically connected to the multiple first conductive through-layers 4A, and the multiple second exposed electrodes 5B are disposed on the second insulating layer 2B and respectively electrically connected to the multiple second conductive through-layers 4B". This allows the first exposed electrodes 5A to be electrically connected to the first conductive line layer 3A through the corresponding first conductive through-layers 4A and to be separated from the first conductive line layer 3A by a first predetermined distance, and allows the second exposed electrodes 5B to be electrically connected to the second conductive line layer 3B through the corresponding second conductive through-layers 4B and to be separated from the second conductive line layer 3B by a second predetermined distance.

[0040] The embodiments and / or implementation methods described above are merely preferred embodiments and / or implementation methods for implementing the technology of this application, and are not intended to limit the implementation methods of the technology of this application in any way. Any person skilled in the art may make some modifications or alterations to other equivalent embodiments without departing from the scope of the technical means disclosed in this application, but these should still be regarded as the technology or embodiments that are substantially the same as those of this application.

Claims

1. A biosensor, characterized in that, The biosensor includes: One substrate; A first insulating layer is disposed on the carrier substrate; A first conductive circuit layer is disposed on the first insulating layer; A second conductive circuit layer is disposed on the first insulating layer; A second insulating layer is disposed on the first insulating layer and partially covers the first conductive circuit layer and the second conductive circuit layer; Multiple first conductive through-layers penetrate the second insulating layer to be electrically connected to the first conductive line layer; Multiple second conductive through-layers penetrate the second insulating layer to be electrically connected to the second conductive line layer; A plurality of first exposed electrodes are disposed on the second insulating layer, each first exposed electrode being electrically connected to a corresponding first conductive through-layer; and A plurality of second exposed electrodes are disposed on the second insulating layer, and each second exposed electrode is electrically connected to a corresponding second conductive through-layer; The first conductive line layer and the second conductive line layer are adjacent to each other and separated from each other, and the first conductive line layer and the second conductive line layer cooperate with each other to form a finger-shaped electrode structure. The first conductive line layer includes a first extension and a plurality of first line portions extending from the first extension, and the second conductive line layer includes a second extension and a plurality of second line portions extending from the second extension, wherein the plurality of first line portions of the first conductive line layer and the plurality of second line portions of the second conductive line layer are arranged alternately.

2. The biosensor according to claim 1, characterized in that, in, The plurality of first line portions of the first conductive line layer are parallel to each other, and the plurality of first line portions extend vertically or obliquely from the first extension portion; In this embodiment, a plurality of second line portions of the second conductive line layer are parallel to each other, and a plurality of second line portions extend vertically or obliquely from the second extension portion; Wherein, the first extension portion of the first conductive line layer and the second extension portion of the second conductive line layer are parallel to each other, and the plurality of first line portions of the first conductive line layer and the plurality of second line portions of the second conductive line layer are parallel to each other. The first conductive line layer and the second conductive line layer cooperate with each other to form a continuous meandering gap between the first conductive line layer and the second conductive line layer. In this process, a first end and a second end of each of the first conductive through-layers are electrically in contact with the first conductive circuit layer and the corresponding first exposed electrode, respectively. In this embodiment, a first end and a second end of each of the second conductive through-layers are electrically in contact with the second conductive circuit layer and the corresponding second exposed electrode, respectively. The plurality of first conductive through layers are divided into a plurality of first via arrays, and the plurality of first conductive through layers in each first via array are electrically connected to the corresponding first line portion of the first conductive line layer. The plurality of first exposed electrodes are divided into a plurality of first electrode arrays. The plurality of first exposed electrodes in each first electrode array are disposed above the corresponding first line portion of the first conductive line layer and are electrically connected to the plurality of first conductive through layers of the corresponding first via array. The plurality of second conductive through layers are divided into a plurality of second via arrays, and the plurality of second conductive through layers in each second via array are electrically connected to the corresponding second line portion of the second conductive line layer; The plurality of second exposed electrodes are divided into a plurality of second electrode arrays. The plurality of second exposed electrodes in each second electrode array are disposed above the corresponding second line portion of the second conductive line layer and are electrically connected to the plurality of second conductive through layers of the corresponding second via array. Each of the first exposed electrodes is configured to be columnar, and each of the second exposed electrodes is configured to be elongated. Each of the first exposed electrodes is electrically connected to one or more of the corresponding first conductive through-layers, and each of the second exposed electrodes is electrically connected to one or more of the corresponding second conductive through-layers. Wherein, the thickness of the first insulating layer is between to The thickness of the second insulating layer is between [a certain value] and [a certain value], and the thickness of the second insulating layer is between [a certain value] and [a certain value]. to between; Wherein, the thickness of the first conductive line layer is between to The thickness of the second conductive layer is between [a certain value] and [a certain value]. to The width of the continuous meandering gap is between 2000 nm and 6000 nm. Wherein, the thickness of each of the first conductive through-layers is between to Between, and the width of each of the first conductive through-layers is between 50 nm and 200 nm; Wherein, the thickness of each of the second conductive through-layers is between to Between, and the width of each of the second conductive through-layers is between 50 nm and 200 nm; Wherein, the thickness of each of the first exposed electrodes is between to Between these, the width of each of the first exposed electrodes is between 100 nm and 5000 nm, and the distance between two adjacent first exposed electrodes is between 1000 nm and 10000 nm. Wherein, the thickness of each of the second exposed electrodes is between to Between 3000 nm and 5000 nm, and the width of each of the second exposed electrodes is between 3000 nm and 5000 nm.

3. The biosensor according to claim 1, characterized in that, in, The carrier substrate is configured as a silicon wafer substrate, a gallium nitride substrate, a silicon carbide substrate, a silicon germanium substrate, a sapphire substrate, or a glass substrate. The first insulating layer is configured as a first oxide layer, a first nitride layer, or a first oxynitride layer; The second insulating layer is configured as a second oxide layer, a second nitride layer, or a first oxynitride layer; The first conductive circuit layer is configured as a first gold circuit layer made of gold, a first silver circuit layer made of silver, a first copper circuit layer made of copper, a first aluminum circuit layer made of aluminum, a first nickel circuit layer made of nickel, a first titanium circuit layer made of titanium, a first platinum circuit layer made of platinum, a first palladium circuit layer made of palladium, a first tantalum circuit layer made of tantalum, a first tungsten circuit layer made of tungsten, a first copper-aluminum alloy circuit layer, a first copper-aluminum-silicon alloy circuit layer, a first tantalum nitride circuit layer, or a first titanium nitride circuit layer. The second conductive circuit layer is configured as a second gold circuit layer made of gold, a second silver circuit layer made of silver, a second copper circuit layer made of copper, a second aluminum circuit layer made of aluminum, a second nickel circuit layer made of nickel, a second titanium circuit layer made of titanium, a second platinum circuit layer made of platinum, a second palladium circuit layer made of palladium, a second tantalum circuit layer made of tantalum, a second tungsten circuit layer made of tungsten, a second copper-aluminum alloy circuit layer, a second copper-aluminum-silicon alloy circuit layer, a second tantalum nitride circuit layer, or a second titanium nitride circuit layer. Each of the first conductive through-layers is configured as a first gold through-hole made of gold, a first silver through-hole made of silver, a first copper through-hole made of copper, a first aluminum through-hole made of aluminum, a first nickel through-hole made of nickel, a first titanium through-hole made of titanium, a first platinum through-hole made of platinum, a first palladium through-hole made of palladium, a first tantalum through-hole made of tantalum, a first tungsten through-hole made of tungsten, a first copper-aluminum alloy through-hole, a first copper-aluminum-silicon alloy through-hole, a first tantalum nitride through-hole, or a first titanium nitride through-hole. Each of the second conductive through layers is configured as a second gold through-hole made of gold, a second silver through-hole made of silver, a second copper through-hole made of copper, a second aluminum through-hole made of aluminum, a second nickel through-hole made of nickel, a second titanium through-hole made of titanium, a second platinum through-hole made of platinum, a second palladium through-hole made of palladium, a second tantalum through-hole made of tantalum, a second tungsten through-hole made of tungsten, a second copper-aluminum alloy through-hole, a second copper-aluminum-silicon alloy through-hole, a second tantalum nitride through-hole, or a second titanium nitride through-hole; Each of the first exposed electrodes is configured as a working electrode, and each of the first exposed electrodes is configured as a first gold electrode made of gold, a first silver electrode made of silver, a first copper electrode made of copper, a first aluminum electrode made of aluminum, a first nickel electrode made of nickel, a first titanium electrode made of titanium, a first platinum electrode made of platinum, a first palladium electrode made of palladium, a first tantalum electrode made of tantalum, a first tungsten electrode made of tungsten, a first copper-aluminum alloy electrode, a first copper-aluminum-silicon alloy electrode, a first tantalum nitride electrode, or a first titanium nitride electrode. Each of the second exposed electrodes is configured as an auxiliary electrode, and each of the second exposed electrodes is configured as a second gold electrode made of gold, a second silver electrode made of silver, a second copper electrode made of copper, a second aluminum electrode made of aluminum, a second nickel electrode made of nickel, a second titanium electrode made of titanium, a second platinum electrode made of platinum, a second palladium electrode made of palladium, a second tantalum electrode made of tantalum, a second tungsten electrode made of tungsten, a second copper-aluminum alloy electrode, a second copper-aluminum-silicon alloy electrode, a second tantalum nitride electrode, or a second titanium nitride electrode. The biosensor further includes a third conductive circuit layer, a plurality of third conductive through-layers, and a third exposed electrode. The plurality of third conductive through-layers are electrically connected between the third conductive circuit layer and the third exposed electrode, and the third exposed electrode is configured as a reference electrode.

4. A biosensor, characterized in that, The biosensor includes: One substrate; A first insulating layer is disposed on the carrier substrate; A first conductive circuit layer is disposed on the first insulating layer; A second conductive circuit layer is disposed on the first insulating layer; A second insulating layer is disposed on the first insulating layer and partially covers the first conductive circuit layer and the second conductive circuit layer; Multiple first conductive through-layers penetrate the second insulating layer to be electrically connected to the first conductive line layer; Multiple second conductive through-layers penetrate the second insulating layer to be electrically connected to the second conductive line layer; A plurality of first exposed electrodes are disposed on the second insulating layer, each first exposed electrode being electrically connected to a corresponding first conductive through-layer; and A plurality of second exposed electrodes are disposed on the second insulating layer, and each second exposed electrode is electrically connected to a corresponding second conductive through-layer.

5. The biosensor according to claim 4, characterized in that, in, The first conductive line layer and the second conductive line layer are adjacent to each other and separated from each other, and the first conductive line layer and the second conductive line layer cooperate with each other to form a finger-shaped electrode structure. The first conductive line layer and the second conductive line layer cooperate with each other to form a continuous meandering gap between the first conductive line layer and the second conductive line layer.

6. The biosensor according to claim 4, characterized in that, in, Each of the first exposed electrodes is configured as a working electrode, and each of the second exposed electrodes is configured as an auxiliary electrode. The biosensor further includes a third conductive circuit layer, a plurality of third conductive through-layers, and a third exposed electrode. The plurality of third conductive through-layers are electrically connected between the third conductive circuit layer and the third exposed electrode, and the third exposed electrode is configured as a reference electrode.

7. A method for fabricating a biosensor, characterized in that, The method for fabricating the biosensor includes: A first insulating layer is formed on a carrier substrate; A first conductive line layer and a second conductive line layer are formed on the first insulating layer; A second insulating layer is formed on the first insulating layer to partially cover the first conductive line layer and the second conductive line layer; A plurality of first conductive through-layers and a plurality of second conductive through-layers are formed, wherein the plurality of first conductive through-layers penetrate the second insulating layer to be electrically connected to the first conductive line layer, and the plurality of second conductive through-layers penetrate the second insulating layer to be electrically connected to the second conductive line layer; and A plurality of first exposed electrodes and a plurality of second exposed electrodes are formed. The plurality of first exposed electrodes are disposed on the second insulating layer and electrically connected to the plurality of first conductive through-layers, respectively. The plurality of second exposed electrodes are disposed on the second insulating layer and electrically connected to the plurality of second conductive through-layers, respectively.

8. The method for fabricating a biosensor according to claim 7, characterized in that, in, After forming a plurality of first bare electrodes and a plurality of second bare electrodes, the method for fabricating the biosensor further includes: performing a cleaning step to clean a biosensor fabricated by the method for fabricating the biosensor. The method for fabricating the biosensor further includes, after the step of forming a plurality of first exposed electrodes and a plurality of second exposed electrodes, performing a leveling step to improve the surface flatness of each first exposed electrode and the surface flatness of each second exposed electrode. In the step of forming the first conductive circuit layer and the second conductive circuit layer, the method for fabricating the biosensor further includes: forming a third conductive circuit layer, wherein the third conductive circuit layer is disposed on the first insulating layer; In the step of forming multiple first conductive through-layers and multiple second conductive through-layers, the method for fabricating the biosensor further includes: forming multiple third conductive through-layers, wherein the multiple third conductive through-layers pass through the second insulating layer to be electrically connected to the third conductive circuit layer; In the step of forming a plurality of first exposed electrodes and a plurality of second exposed electrodes, the method for fabricating the biosensor further includes: forming a third exposed electrode, wherein the third exposed electrode is disposed on the second insulating layer and electrically connected to the plurality of third conductive through layers respectively.

9. The method for fabricating a biosensor according to claim 7, characterized in that, in, The first conductive line layer and the second conductive line layer are adjacent to each other and separated from each other, and the first conductive line layer and the second conductive line layer cooperate with each other to form a finger-shaped electrode structure. The first conductive line layer includes a first extension and a plurality of first line portions extending from the first extension, and the second conductive line layer includes a second extension and a plurality of second line portions extending from the second extension, wherein the plurality of first line portions of the first conductive line layer and the plurality of second line portions of the second conductive line layer are arranged alternately. In this process, a plurality of first line portions of the first conductive line layer are parallel to each other, and a plurality of first line portions extend vertically or obliquely from the first extension portion. In this embodiment, a plurality of second line portions of the second conductive line layer are parallel to each other, and a plurality of second line portions extend vertically or obliquely from the second extension portion; Wherein, the first extension portion of the first conductive line layer and the second extension portion of the second conductive line layer are parallel to each other, and the plurality of first line portions of the first conductive line layer and the plurality of second line portions of the second conductive line layer are parallel to each other. The first conductive line layer and the second conductive line layer cooperate with each other to form a continuous meandering gap between the first conductive line layer and the second conductive line layer. In this process, a first end and a second end of each of the first conductive through-layers are electrically in contact with the first conductive circuit layer and the corresponding first exposed electrode, respectively. In this embodiment, a first end and a second end of each of the second conductive through-layers are electrically in contact with the second conductive circuit layer and the corresponding second exposed electrode, respectively. The plurality of first conductive through layers are divided into a plurality of first via arrays, and the plurality of first conductive through layers in each first via array are electrically connected to the corresponding first line portion of the first conductive line layer. The plurality of first exposed electrodes are divided into a plurality of first electrode arrays. The plurality of first exposed electrodes in each first electrode array are disposed above the corresponding first line portion of the first conductive line layer and are electrically connected to the plurality of first conductive through layers of the corresponding first via array. The plurality of second conductive through layers are divided into a plurality of second via arrays, and the plurality of second conductive through layers in each second via array are electrically connected to the corresponding second line portion of the second conductive line layer; The plurality of second exposed electrodes are divided into a plurality of second electrode arrays. The plurality of second exposed electrodes in each second electrode array are disposed above the corresponding second line portion of the second conductive line layer and are electrically connected to the plurality of second conductive through layers of the corresponding second via array.

10. The method for fabricating a biosensor according to claim 7, characterized in that, in, Each of the first exposed electrodes is configured as a working electrode, and each of the second exposed electrodes is configured as an auxiliary electrode. The biosensor further includes a third conductive circuit layer, a plurality of third conductive through-layers, and a third exposed electrode. The plurality of third conductive through-layers are electrically connected between the third conductive circuit layer and the third exposed electrode, and the third exposed electrode is configured as a reference electrode.

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