Testing device

Abstract

The invention discloses a testing device, and the device comprises a testing machine which is provided with a plurality of groups of testing resources; the resource adjusting plate is mounted on the surface of the testing machine, a plurality of open grooves are formed in the resource adjusting plate, and the open grooves correspond to a plurality of groups of testing resources on the testing machine; and a plurality of switching modules which are respectively installed on the open slots of the resource adjusting plate and are connected with the test resource. By means of the device, flexible calling of the test resources on the test machine is achieved, and the flexibility of the test device and the matching capacity of the test device with different test items are improved.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a testing device. Background Technology

[0002] Chip testing refers to using a test platform to check whether a chip meets design requirements and to classify and define defects according to the design specifications. An ATE (Automatic Test Equipment) machine is an automated device that integrates various signal sources and reference standards for chip testing, forming one or more dedicated test machines. With the assistance of other equipment such as probe stations or sorters, it completes the performance testing of the chip.

[0003] Chip testing and verification primarily rely on ATE (Automatic Test Equipment) testers. ATE testers connect to the chip via dedicated probe cards or LB boards (Load Boards, also known as IC test load boards). Probe cards or LB boards typically have high development costs, and their functionality cannot be modified after production. They are suitable for products with a defined design and mass production. For cases where the design is not yet finalized or further verification is required, multiple probe cards or LB boards with different functions or versions may need to be deployed, significantly increasing the development cycle and costs. EVB boards (Evaluation Boards, or experimental verification boards) can only connect to laboratory instruments, and some functional tests cannot be performed, preventing in-depth verification of chip performance. Summary of the Invention

[0004] The main technical problem addressed by this application is to provide a testing device that allows for the flexible installation of a required number of adapter modules on a testing machine via a resource adjustment board. These adapter modules enable the flexible access to testing resources on the testing machine, thereby improving the testing machine's compatibility with different testing projects and ultimately meeting the testing requirements of different chips.

[0005] To address the aforementioned problems, this application provides a testing apparatus in a first aspect, comprising: a testing machine having multiple sets of testing resources formed thereon; a resource adjustment plate mounted on the testing machine, the resource adjustment plate having multiple slots corresponding to the multiple sets of testing resources on the testing machine; and multiple adapter modules, each mounted on a slot of the resource adjustment plate and connected to the testing resources.

[0006] The adapter module includes a standard adapter module and a high-frequency adapter module.

[0007] The resource adjustment plate has multiple fixing holes around the corresponding slot, and the adapter module is fixed to the resource adjustment plate by fasteners and the fixing holes.

[0008] The testing machine is also equipped with a locking mechanism, which includes two clamping plates arranged opposite each other. The resource adjustment plate is placed between the two clamping plates and fixed to the testing machine by the locking mechanism.

[0009] The testing device also includes an EVB test board for placing the chip under test. The resource adjustment board is further provided with a window area for placing the EVB test board, and the window area is set in the center area of ​​the testing machine.

[0010] The EVB test board is provided with a test socket for mounting the chip under test, as well as capacitors, resistors and dedicated chips for testing the chip under test; the EVB test board is also provided with a test connector protruding from the surface of the EVB test board, the test connector is connected to the adapter module through a dedicated cable, and then connected to the test resources of the test machine.

[0011] The EVB test board is also provided with a direct connection port that is directly connected to the test machine. The direct connection port passes through the EVB test board and is directly connected to the test resources on the test machine at the bottom.

[0012] The resource adjustment plate includes multiple first slots, which are configured to correspond to the core test resources of the test machine.

[0013] The resource adjustment plate further includes multiple second slots, which are located on the side of the first slot along the first direction and away from the window area. The second slots are configured to correspond to the extended test resources of the test machine.

[0014] The multiple adapter modules are mounted on the slots of the resource adjustment plate along the first direction; and the thickness of the test resource protruding from the surface of the test machine is not less than the thickness of the resource adjustment plate.

[0015] The beneficial effects of this application are as follows: the test resources on the test machine are exposed in groups by the resource adjustment board, and the adapter modules are flexibly installed on the resource adjustment board according to the required number and connected to the test resources in the slotted area of ​​the resource adjustment board, so as to transfer the test resources on the test machine to the adapter modules. The number of adapter modules installed on the resource adjustment board can be increased or decreased as needed, so as to flexibly call the test resources on the test machine, increase the flexibility of the test machine and its matching ability with different test items, improve the versatility of the test machine, and the resource adjustment board and adapter modules also have the feature of flexible disassembly. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of an embodiment of the testing apparatus provided in this application; Figure 2 Schematic diagrams of some embodiments of the test machine provided in this application; Figure 3 Schematic diagrams of other embodiments of the test machine provided in this application; Figure 4 This is a schematic diagram of the structure of the first embodiment of the resource adjustment board provided in this application; Figure 5 for Figure 1 Enlarged view of the adapter module in the image; Figure 6 This is a schematic diagram of the cross-sectional structure of the adapter module provided in this application; Figure 7 This is a schematic diagram of the structure of the first embodiment of the EVB test board provided in this application; Figure 8 This is a schematic diagram of the structure of the second embodiment of the EVB test board provided in this application; Figure 9 This is a schematic diagram of the structure of the second embodiment of the resource adjustment board provided in this application; Figure 10 This is a schematic diagram of the structure of the third embodiment of the resource adjustment board provided in this application; Figure 11 This is a schematic diagram of the structure of the fourth embodiment of the resource adjustment board provided in this application; Figure 12 This is a schematic diagram of the structure of a first specific embodiment of the testing device provided in this application; Figure 13 This is a schematic diagram of the structure of a second specific embodiment of the testing device provided in this application; Figure 14 This is a schematic diagram of the structure of a third specific embodiment of the testing device provided in this application; Figure 15 This is a schematic diagram of the fourth specific embodiment of the testing device provided in this application. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “said,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless otherwise clearly indicated above. “Multiple” generally includes at least two, but does not exclude the inclusion of at least one.

[0020] It should be understood that the term "and / or" used herein is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Furthermore, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship. The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0021] It should be understood that the terms "comprising," "including," or any other variations used herein are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0022] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0023] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in every place in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0024] This application provides a testing device; please refer to the details below. Figure 1 , Figure 1 This is a schematic diagram of an embodiment of the testing apparatus provided in this application. Figure 1 As shown, the testing device includes a testing machine 10, a resource adjustment board 20, and an adapter module 30.

[0025] Among them, test machine 10 is an ATE test machine; please refer to [link / reference] for details. Figure 2 and Figure 3 , Figure 2 The diagram shows the structure of some embodiments of the test machine provided in this application. Figure 3 Schematic diagrams of other embodiments of the test machine provided in this application. For example... Figure 2 and Figure 3 As shown, the upper surface of the test machine 10 is provided with multiple sets of test resources 101. These test resources 101 include resources providing various current test voltages of different polarities or current tests at different voltage levels; providing various clock references to verify the current or voltage performance parameters of the chip; providing various power supplies to meet the driving requirements of different modules within the chip; providing various grounding conditions, including digital signal grounding, analog signal grounding, and signal compensation; and other specially designed resources. Each test resource 101 includes multiple POGO PINs, which are probes mounted on the ATE test machine platform. These POGO PINs are used to centrally export various functional test resources within the test machine in a modular manner, facilitating resource acquisition or connection to external devices under test. Multiple sets of test resources 101 protrude from the surface of the test machine 10.

[0026] The resource adjustment plate 20 is mounted on the upper surface of the testing machine 10. Please refer to [link / reference] for details. Figure 4 , Figure 4 This is a schematic diagram of the structure of the first embodiment of the resource adjustment board provided in this application. Figure 4As shown, the resource adjustment plate 20 has multiple slots 21, which are provided for multiple sets of test resources 101 on the testing machine 10. Specifically, the resource adjustment plate 20 has multiple slots 21 at positions corresponding to the multiple sets of test resources 101 to expose the multiple sets of test resources 101. In this embodiment, the multiple slots 21 penetrate through the resource adjustment plate 20. Furthermore, the thickness of the resource adjustment plate 20 does not exceed the thickness of the test resources 101 protruding from the surface of the testing machine 10, so that the test resources 101, after passing through the slots 21, are flush with or protrude from the surface of the resource adjustment plate 20. Preferably, the thickness of the resource adjustment plate 20 is the same as the thickness of the test resources 101 protruding from the surface of the testing machine 10.

[0027] Multiple adapter modules 30 are mounted on slots 21 of the resource adjustment plate 20 and connected to test resources 101 located in slots 21. For further details, please refer to [link / reference needed]. Figure 5 , Figure 5 for Figure 1 An enlarged view of the adapter module in the image. Figure 5 As shown, the adapter module 30 includes a general adapter module 31 and a high-frequency adapter module 32. The left side shows an enlarged view of the general adapter module 31, and the right side shows the high-frequency adapter module 32. Both the general adapter module 31 and the high-frequency adapter module 32 include multiple through-hole pads. These through-hole pads abut against the tips of multiple probes on the test resource 101 to form an electrical connection, thereby bringing out the test resource 101. Please refer to [link to details]. Figure 6 , Figure 6 This is a schematic diagram of the cross-sectional structure of the adapter module provided in this application. The left side shows the cross-sectional structure of the ordinary adapter module 31, and the right side shows the cross-sectional structure of the high-frequency adapter module 32. The high-frequency adapter module 32 is taller than the ordinary adapter module 31. The high-frequency adapter module 32 also includes a shielding layer 321 formed by a copper metal shell and a pad layer 322 disposed at the end of the shielding layer 321 away from the test resource 101. The shielding layer 321 may be a blind via fully filled with metal, and the pad layer 322 is a hollow through-hole to facilitate the insertion and connection of subsequent connectors.

[0028] In some embodiments, the resource adjustment plate 20 has multiple fixing holes around the slot 21. The adapter module 30 is placed horizontally on the slot 21 along a direction perpendicular to the slot 21 and is fixed to the resource adjustment plate 20 by a fixing member 301 cooperating with the fixing holes. In one specific embodiment, the fixing member 301 is a screw structure, and the fixing holes are screw holes. The adapter module 30 is fixed to the resource adjustment plate 20 by the screw cooperating with the screw holes. In other embodiments, the adapter module 30 can also be fixed to the resource adjustment plate 20 by other fixing structures. The fixing holes are arranged on opposite sides of the slot 21 along a first direction, and the adapter module 30 passes through the slot 21 along the first direction and is fixed to the slot 21.

[0029] In some embodiments, a locking mechanism 11 is further provided on the upper surface of the testing machine 10. The locking mechanism 11 includes two opposing clamping plates, respectively disposed on both sides of the testing machine 10, specifically on opposite sides of the test resources 101, so that multiple sets of test resources 101 are disposed between the two locking mechanisms 11. A resource adjustment plate 20 is placed between the two clamping plates, and the resource adjustment plate 20 is fixed to the testing machine 10 by the clamping plates. In one specific embodiment, a plurality of fixing grooves are also provided on the inner side of the locking mechanism 11, and a plurality of protrusions 201 are provided on the outer side of the resource adjustment plate 20 facing the clamping plate. The protrusions 201 extend outward perpendicular to the outer side of the resource adjustment plate 20 and correspond to the fixing grooves on the inner side of the locking mechanism 11, thereby cooperating with the fixing grooves to form a fixation, so as to fix the resource adjustment plate 20 to the testing machine 10. In other embodiments, the resource adjustment plate 20 can also be fixed to the testing machine 10 by screws and nut holes. In other embodiments, the locking mechanism 11 can also be a structure of other shapes.

[0030] Furthermore, the testing apparatus also includes an EVB test board 40 for placing or testing the chip under test. Please refer to further details. Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of the structure of the first embodiment of the EVB test board provided in this application. Figure 8 This is a schematic diagram of the structure of the second embodiment of the EVB test board provided in this application. Figure 7 As shown, the EVB test board 40 is provided with a test socket 41 for mounting the chip under test (DUT), and capacitors 42, resistors 43, and a dedicated chip 44 for testing the DUT. The DUT can be a semi-finished chip, that is, a chip that is not yet fully processed. The capacitors 42, resistors 43, and dedicated chip 44 on the EVB test board 40 form a detection circuit with the DUT, thereby performing functional and performance testing on the DUT. The EVB test board 40 is provided with a test connector 45 protruding from the EVB test board. The test connector 45 can include three different shapes and types of test connectors. The test connector 45 is connected to the adapter module 30 through a dedicated trace. The dedicated trace includes DuPont connector wires and high-frequency coaxial cables, which are not specifically limited here. One end of the dedicated trace is plugged into the test connector, and the other end is plugged into the adapter module 30.

[0031] Please see further. Figure 8The EVB test board 40 is also provided with an interface 46 that is directly connected to the test machine 10. The interface 46 passes through the EVB test board 40 and directly abuts against the test resource 101 on the test machine 10 at the bottom to form an electrical signal connection. The EVB test board 40 also includes an extension 401 that extends toward the test machine 10 where the test resource 101 is located. A direct connection port 46 is provided on the extension 401 so that the direct connection port 46 is directly connected to the test resource 101 on the test machine 10.

[0032] The resource adjustment plate 20 is provided with a window area 22 for placing the EVB test board 40. The window area 22 corresponds to the central area of ​​the test machine 10. The EVB test board 40 can be fixed to the resource adjustment plate 20 with screws or placed directly in the window area 22. The area of ​​the window area 22 can be larger than or equal to the bottom area of ​​the EVB test board 40. The extension portion 401 extends from the window area 22 towards the slot 21 and into the slot 21 area, corresponding to a portion of the test resources 101 in the slot 21 area. The chip under test (DUT) is connected to the components in the EVB test board 40 to form a detection circuit. The EVB test board 40 is then connected to the adapter module 30 via a dedicated wiring, and subsequently connected to the test resources 101 on the test machine 10, thereby performing testing on the DUT.

[0033] The resource adjustment plate 20 includes multiple first slots 211, which are configured to correspond to the core test resources of the test machine 10. Please refer to [link / reference]. Figure 4 Or refer to further Figure 9 , Figure 9 This is a schematic diagram of the structure of the second embodiment of the resource adjustment board provided in this application. Figure 9 As shown, the resource adjustment plate 20 includes a plurality of first slots 211 arranged along a first direction, which are respectively arranged on opposite sides of the window area 22. The number of first slots 211 arranged on opposite sides of the window area 22 is the same, for example, four on one side as shown in the figure. In other embodiments, the number may be different, and this is not limited here. In other words, the resource adjustment plate 20 includes two first slots 211 arranged along the first direction, wherein each first slot 211 further includes a plurality of horizontal plates to divide each first slot 211 into multiple (e.g., four) first slots 211. The adapter module 30 traverses the first slot 211 along the first direction and is fixed to the first slot 211. Figure 4As shown, the resource adjustment plate 20 includes two first slots 211 arranged along the second direction. The first slots 211 are arranged on opposite sides of the window area 22, and the first slots 211 are provided with multiple fixing holes along the two sides of the second direction to facilitate fixing the adapter module 30 on the first slot 211 along the first direction and connecting it to the test resource 101 in the first slot 211 through the first slot 211.

[0034] Furthermore, the resource adjustment plate 20 also includes multiple second slots 212, which are located away from the center area of ​​the first slot 10, specifically on the side of the first slot 211 away from the window area 22. The second slots 212 correspond to the extended test resources of the test machine 10. Please refer to [link to details] for further information. Figure 10 and Figure 11 , Figure 10 This is a schematic diagram of the structure of the third embodiment of the resource adjustment plate provided in this application. The resource adjustment plate 20 includes a first slot 211 and a second slot 212, which are arranged in the same direction. Both the first slot 211 and the second slot 212 are arranged in a second direction, and the second slot 212 is located on the side of the first slot 211 that is far away from the window area 22. Figure 11 This is a structural schematic diagram of the fourth embodiment of the resource adjustment board provided in this application. Figure 11 As shown, the resource adjustment panel 20 includes multiple first slots 211 and multiple second slots 212. Both the second slots 212 and the first slots 211 are arranged along a first direction, and are arranged side-by-side. The second slots 212 are located on the side of the first slots 211 furthest from the window area 22, meaning the multiple second slots 212 are located to the left and / or right of the multiple first slots 211 (extending along the first direction). Figure 10 As shown, the second slot 212 and the first slot 211 are arranged side by side along the first direction. Figure 11 As shown, the second slot 212 and the first slot 211 are also arranged side by side along the first direction. The adapter module 30 is installed on the slot 21 of the resource adjustment plate 20 along the first direction.

[0035] Specifically, Figure 10 and Figure 4 They can share the same testing machine or they can not share the same testing machine. Figure 10 The second slot 212 is an expansion slot, selected when more test resources are needed. Figure 10 The resource adjustment panel in the middle should be selected when fewer test resources are needed. Figure 4 The resource adjustment panel in the middle. Figure 9 and Figure 11 They can share the same testing machine or they can not share the same testing machine. Figure 11 The second slot 212 in the middle is Figure 9 The expanded slot of the first slot 211 in the middle is selected when more test resources are needed. Figure 11 The resource adjustment panel in the middle should be selected when fewer test resources are needed. Figure 9 The resource adjustment panel in the middle.

[0036] The structures of the above four resource adjustment boards can meet the needs of mainstream testing machines on the market.

[0037] Different resource adjustment boards 20 are installed on the same or different test machines 10 according to different test requirements. Then, multiple adapter modules 30 are installed on the resource adjustment boards 20 according to the requirements. The EVB test board 40 is connected to the adapter modules 30 through a dedicated cable, so as to call the test resources 101 on the test machine 10 to perform performance testing on the chip under test installed on the EVB test board 40.

[0038] For further details, please refer to [link / reference]. Figures 12-15 , Figure 12 This is a schematic diagram of the structure of a first specific embodiment of the testing device provided in this application. Figure 13 This is a schematic diagram of the structure of a second specific embodiment of the testing device provided in this application. Figure 14 This is a schematic diagram of the structure of a third specific embodiment of the testing device provided in this application. Figure 15 This is a schematic diagram of the fourth specific embodiment of the testing device provided in this application. Figure 12 As shown, Figure 12 The resource adjustment panel provided in the first embodiment (i.e.) is used in the middle. Figure 4 The resource adjustment board 20 is mounted on the surface of the test machine 10 and exposes multiple sets of test resources on the test machine 10 through slots. Multiple adapter modules 30 are installed on the resource adjustment board 20 according to the test requirements. The test connectors of the EVB test board 40 are then connected to the adapter modules 30 through dedicated wiring, thereby flexibly calling one or more sets of test resources on the test machine 10 to perform various tests on the chip under test. Figure 13 The resource adjustment panel provided in the second embodiment (i.e.) is used in the middle. Figure 9 The resource adjustment board 20 is mounted on the surface of the test machine 10 and exposes multiple sets of test resources (including core test resources) on the test machine 10 through multiple slots (including the first slot). Multiple adapter modules 30 are installed on the resource adjustment board 20 according to the test requirements, and the test connectors of the EVB test board 40 are connected to the adapter modules 30 through dedicated wiring, so as to flexibly call one or more sets of test resources on the test machine 10 to perform various tests on the chip under test. Figure 14 The resource adjustment panel (i.e., the one used in the third embodiment) is adopted. Figure 10 (Resource adjustment panel in the middle). For example, Figure 14As shown, the resource adjustment board 20 is installed on the surface of the test machine 10, and multiple sets of test resources (including core test resources and extended test resources) on the test machine 10 are exposed through slots (including the first slot and the second slot). Multiple adapter modules 30 are installed on the resource adjustment board 20 according to the test requirements, and the test connectors of the EVB test board 40 are connected to the adapter modules 30 through dedicated wiring, so as to flexibly call one or more sets of test resources on the test machine 10 to perform various tests on the chip under test. Figure 15 The resource adjustment panel in the fourth embodiment (i.e.) is used in the middle. Figure 11 (Resource adjustment panel in the middle). For example, Figure 15 As shown, the resource adjustment board 20 is installed on the surface of the test machine 10, and multiple sets of test resources (including core test resources and extended test resources) on the test machine 10 are exposed through slots (including the first slot and the second slot). Multiple adapter modules 30 are installed on the resource adjustment board 20 according to the test requirements, and the test connectors of the EVB test board 40 are connected to the adapter modules 30 through dedicated wiring, so as to flexibly call one or more sets of test resources on the test machine 10 to perform various tests on the chip under test.

[0039] The beneficial effects of this application are as follows: By exposing the test resources on the test machine in groups through the resource adjustment board, the adapter modules are flexibly installed on the resource adjustment board according to the required number and connected to the test resources in the slotted area of ​​the resource adjustment board, thus transferring the test resources on the test machine to the adapter modules. The number of adapter modules installed on the resource adjustment board can be increased or decreased as needed, thereby flexibly calling up the test resources on the test machine, increasing the flexibility of the test machine and its ability to match different test items, improving the versatility of the test machine, and the resource adjustment board and adapter modules also have the feature of flexible disassembly.

[0040] The above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A testing device, characterized in that, The testing apparatus includes: A testing machine, on which multiple sets of testing resources are formed; A resource adjustment plate is installed on the test machine. The resource adjustment plate is provided with multiple slots, which correspond to multiple sets of test resource settings on the test machine. Multiple adapter modules are installed on slots in the resource adjustment plate and connected to the test resources.

2. The testing apparatus according to claim 1, characterized in that, The adapter module includes a standard adapter module and a high-frequency adapter module.

3. The testing apparatus according to claim 1, characterized in that, The resource adjustment plate has multiple fixing holes around the corresponding slot, and the adapter module is fixed to the resource adjustment plate by fixing parts and the fixing holes.

4. The testing apparatus according to claim 1, characterized in that, The testing machine is also equipped with a locking mechanism, which includes two clamping plates arranged opposite each other. The resource adjustment plate is placed between the two clamping plates and fixed to the testing machine by the locking mechanism.

5. The testing apparatus according to claim 1, characterized in that, The testing device also includes an EVB test board for placing the chip under test. The resource adjustment board is further provided with a window area for placing the EVB test board, and the window area is set in the center area of ​​the testing machine.

6. The testing apparatus according to claim 5, characterized in that, The EVB test board is equipped with a test socket for mounting the chip under test, as well as capacitors, resistors, and dedicated chips for testing the chip under test. The EVB test board is also provided with a test connector protruding from the surface of the EVB test board. The test connector is connected to the adapter module through a dedicated cable, and then connected to the test resources of the test machine.

7. The testing apparatus according to claim 6, characterized in that, The EVB test board is also provided with a direct connection port that is directly connected to the test machine. The direct connection port passes through the EVB test board and is directly connected to the test resources on the test machine at the bottom.

8. The testing apparatus according to claim 1, characterized in that, The resource adjustment plate includes multiple first slots, which are configured to correspond to the core test resources of the test machine.

9. The testing apparatus according to claim 8, characterized in that, The resource adjustment plate also includes a plurality of second slots, which are disposed on the side of the first slot along the first direction and away from the window area. The second slots are disposed corresponding to the extended test resources of the test machine.

10. The testing apparatus according to claim 8 or 9, characterized in that, Multiple adapter modules are mounted on the slots of the resource adjustment plate along the first direction; The thickness of the test resource protruding from the surface of the test machine is not less than the thickness of the resource adjustment plate.

Images