Display module and display device

Abstract

The invention relates to the technical field of display, and discloses a display module and a display device. The display module can comprise a display panel, a second chip on film, at least two first chip on films and at least two rigid circuit boards, connecting a first chip on film between each rigid circuit board and the display panel; the second chip on film is connected between at least part of two adjacent rigid circuit boards. According to the display module, signal attenuation of at least part of signals on the connector and the flexible circuit board can be reduced, and the eye pattern quality of a large-size high-resolution display panel can be improved; the cost can be reduced by replacing a connector and a flexible circuit board with the second chip-on-film, and the thickness and the size of the second chip-on-film are small, so that the ultrathin design of the display device is facilitated; the second chip-on-film and the first chip-on-film can be subjected to a binding process at the same time, productivity improvement is facilitated, compared with manual insertion, the binding process is higher in precision, and product yield improvement is facilitated.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically, to a display module and a display device. Background Technology

[0002] Whether it's TFT-LCD (Thin Film Transistor Liquid Crystal Display) or OLED (Organic Light Emitting Diode Display), the display industry requires external circuitry to drive the display, and these external circuits are inseparable from printed circuit boards (PCBs).

[0003] Currently, the flexible printed circuit board (FPC) mounting method involves soldering flip-type connectors onto a PCB board, and then production line workers manually insert the FPCs into the connectors. However, in actual production, workers are prone to errors such as misaligned or reverse insertion during manual operation, leading to abnormal lamp operation and repetitive work. Furthermore, manual operation consumes a significant amount of time, affecting product yield and reducing production capacity. Moreover, signal attenuation is severe after passing through the FPCs and connectors, resulting in poor eye diagram quality.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and to provide a display module and a display device.

[0006] According to one aspect of this disclosure, a display module is provided, comprising:

[0007] Display panel;

[0008] At least two first flip-chip films;

[0009] At least two rigid circuit boards are connected to the first flip-film between each of the rigid circuit boards and the display panel;

[0010] A second flip-chip film is connected between at least two adjacent rigid circuit boards.

[0011] In one exemplary embodiment of this disclosure, the second flip-chip film includes:

[0012] The first part is connected to one of the two adjacent rigid circuit boards;

[0013] The second part is connected to the other of the two adjacent rigid circuit boards;

[0014] A connecting part is connected between the first part and the second part.

[0015] In an exemplary embodiment of this disclosure, the end of the connecting portion near the display panel is provided with a first connection bonding pin, and the end of the display panel near the second flip-chip film is provided with a panel bonding pin, wherein the first connection bonding pin is bonded to the panel bonding pin.

[0016] In one exemplary embodiment of this disclosure, both the first connection bonding pin and the panel bonding pin are dummy bonding pins.

[0017] In one exemplary embodiment of this disclosure, the corner formed by the first part and the connecting part is provided with a chamfer, and the corner formed by the second part and the connecting part is provided with a chamfer.

[0018] In one exemplary embodiment of this disclosure, differential signal traces are provided on the second flip-chip film.

[0019] In one exemplary embodiment of this disclosure, the display panel is provided with connection traces, and the second flip-chip film includes:

[0020] The first part is connected between one of the two adjacent rigid circuit boards and the display panel, and is bound to one end of the connection trace;

[0021] The second part is connected between the other of the two adjacent rigid circuit boards and the display panel, and is bound to the other end of the connection trace.

[0022] In one exemplary embodiment of this disclosure, the first portion and the adjacent first flip-chip film are configured as an integral structure to form a composite flip-chip film, and / or, the second portion and the adjacent first flip-chip film are configured as an integral structure to form a composite flip-chip film.

[0023] In an exemplary embodiment of this disclosure, the end of the integrated flip-chip film connected to the display panel is a first end, and the end of the integrated flip-chip film connected to the rigid circuit board is a second end. The width of the first end along the first direction is smaller than the width of the second end along the first direction. The first direction intersects with the second direction, and the second direction is the connection direction of the display panel, the first flip-chip film, and the rigid circuit board.

[0024] In an exemplary embodiment of this disclosure, a plurality of first bonding pins are provided at the first end, and a plurality of second bonding pins are provided at the second end; a plurality of third bonding pins are provided on the display panel, the third bonding pins being bonded to the first bonding pins, and the pitch and width of the third bonding pins being the same as those of the first bonding pins; a plurality of fourth bonding pins are provided on the rigid circuit board, the fourth bonding pins being bonded to the second bonding pins, and the pitch and width of the fourth bonding pins being the same as those of the second bonding pins; the pitch of the first bonding pins is smaller than the pitch of the second bonding pins, and the width of the first bonding pins is smaller than the width of the second bonding pins.

[0025] In one exemplary embodiment of this disclosure, the connection trace includes a first differential signal trace.

[0026] In one exemplary embodiment of this disclosure, at least two first flip-chip films are provided connecting the same rigid circuit board and the display panel. The first flip-chip film closest to the adjacent rigid circuit board is a composite flip-chip film. One composite flip-chip film and the first portion of the second flip-chip film are configured as an integral structure, and the other composite flip-chip film and the second portion of the second flip-chip film are configured as an integral structure.

[0027] In one exemplary embodiment of this disclosure, the display module further includes:

[0028] A central control board is electrically connected to two adjacent rigid circuit boards, and the second flip-chip film is not connected between the two adjacent rigid circuit boards connected to the central control board; or, the central control board is electrically connected to one of the rigid circuit boards.

[0029] In an exemplary embodiment of this disclosure, the rigid circuit board closer to the central control board is the first rigid circuit board, and the one farther from the central control board is the second rigid circuit board. The first part is connected between the first rigid circuit board and the display panel, and the second part is connected between the second rigid circuit board and the display panel.

[0030] A second differential signal trace is provided on the first part, and a third differential signal trace is provided on the second part. The second differential signal trace and the third differential signal trace are connected to the opposite ends of the first differential signal trace.

[0031] A fourth differential signal trace is provided on the first rigid circuit board, and one end of the fourth differential signal trace is connected to the central control board.

[0032] A fifth differential signal trace is provided on the second rigid circuit board. One end of the fifth differential signal trace is connected to the third differential signal trace, and the other end of the fifth differential signal trace is connected to the first flip-chip film connected to the second rigid circuit board.

[0033] In one exemplary embodiment of this disclosure, the display module further includes:

[0034] At least two connectors are provided on at least two of the rigid circuit boards in a one-to-one correspondence;

[0035] A flexible circuit board is connected between two adjacent connectors.

[0036] In one exemplary embodiment of this disclosure, the flexible circuit board does not extend beyond the rigid circuit board in a second direction, whereby the second direction is the connection direction of the display panel, the first flip-chip film, and the rigid circuit board.

[0037] In one exemplary embodiment of this disclosure, the first flip-chip film and the second flip-chip film are provided with solder resist film.

[0038] According to another aspect of this disclosure, a display device is provided, comprising:

[0039] The display module is any one of the display modules described above.

[0040] The display module disclosed herein achieves data transmission between two adjacent rigid circuit boards through a second flip-chip film, reducing the use of flexible circuit boards and connectors. On the one hand, it can reduce signal attenuation at least some of the signals on connectors and flexible circuit boards, improve the eye diagram quality of large-size high-resolution display panels, and enhance signal connection reliability. On the other hand, replacing connectors and flexible circuit boards with the second flip-chip film can reduce costs. The thickness and volume of the second flip-chip film are smaller, which is beneficial for the ultra-thin design of display devices and meets the design trends of customer products. Furthermore, the second flip-chip film and the first flip-chip film can be bonded to the rigid circuit board simultaneously, eliminating the need for soldering connectors and manually inserting flexible circuit boards, which is beneficial for increasing production capacity. Compared with manual insertion, the bonding process has higher precision and is conducive to improving product yield.

[0041] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0042] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0043] Figure 1 This is a schematic diagram of the area division structure of the display panel in the display module of this disclosure.

[0044] Figure 2 This is a schematic diagram of the structure of a first example embodiment of the module shown in this disclosure.

[0045] Figure 3 This is a partial structural diagram of a second exemplary embodiment of the module shown in this disclosure.

[0046] Figure 4 This is a partial structural diagram of a third exemplary embodiment of the module shown in this disclosure.

[0047] Figure 5 This is a partial structural diagram of a fourth exemplary embodiment of the module shown in this disclosure.

[0048] Figure 6 This is a partial structural schematic diagram of a fifth exemplary embodiment of the module shown in this disclosure.

[0049] Figure 7 This is a partial structural diagram of a sixth exemplary embodiment of the module shown in this disclosure.

[0050] Figure 8 This is a partial structural schematic diagram of the seventh exemplary embodiment of the module shown in this disclosure.

[0051] Figure 9 This is a partial structural diagram of the eighth exemplary embodiment of the module shown in this disclosure.

[0052] Figure 10 This is a schematic diagram of the structure of the ninth example embodiment of the module shown in this disclosure.

[0053] Explanation of reference numerals in the attached figures:

[0054] Panel; Panel-Lead;

[0055] PCBA, rigid circuit board; PCBA1, first rigid circuit board; PCBA2, second rigid circuit board;

[0056] COF1, the first flip-chip film;

[0057] COFZ, composite flip-chip film; COFZ1, first end; COFZ2, middle part; COFZ3, second end;

[0058] COF2, second flip-chip film; COF21, first part; COF22, second part; COF23, connecting part; COF23-Lead, first connecting bonding pin;

[0059] CNT, connector; CNT1, first connector; CNT2, second connector;

[0060] FPC, flexible circuit boards;

[0061] ZX, connecting wiring;

[0062] DS1, first differential signal trace; DS2, second differential signal trace; DS3, third differential signal trace; DS4, fourth differential signal trace;

[0063] TCON, central control board;

[0064] X, the first direction; Y, the second direction. Detailed Implementation

[0065] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0066] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0067] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0068] In this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. "And / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Furthermore, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0069] This disclosure provides an example implementation of a display module, with reference to... Figures 1-10 As shown, the display module may include a display panel, a second flip-chip film COF2, at least two rigid circuit boards (PCBA), and at least two first flip-chip films COF1; the first flip-chip film COF1 is connected between each rigid circuit board (PCBA) and the display panel; the second flip-chip film COF2 is connected between at least two adjacent rigid circuit boards (PCBA).

[0070] The display module disclosed herein achieves data transmission between two adjacent rigid circuit boards (PCBAs) through a second flip-chip film (COF2), reducing the use of flexible circuit boards (FPCs) and connectors (CNTs). On the one hand, this reduces signal attenuation at least partially on the connectors (CNTs) and FPCs, improving the eye diagram quality of large-size, high-resolution display panels and enhancing signal connection reliability. On the other hand, replacing the connectors (CNTs) and FPCs with the second flip-chip film (COF2) reduces costs. The smaller thickness and volume of the second flip-chip film (COF2) facilitates ultra-thin designs for display devices, meeting customer product design trends. Furthermore, the second flip-chip film (COF2) and the first flip-chip film (COF1) can be simultaneously bonded to the rigid circuit boards (PCBAs), eliminating the need for soldering connectors (CNTs) and manually inserting flexible circuit boards (FPCs), which improves production capacity. Compared to manual insertion, the bonding process offers higher precision, leading to higher product yield.

[0071] In some exemplary embodiments of this disclosure, the display panel may be a liquid crystal display (LCD), an OLED (Organic Electroluminescence Display) display panel, a QLED (Quantum Dot Light Emitting Diodes) display panel, a micro-LED (micro-Light Emitting Diode) display panel, a mini-LED (mini-Light Emitting Diode) display panel, and so on.

[0072] Reference Figure 1 As shown, the display panel has a display area and an active area (AA) and a non-display area (NAA). Specifically, the non-display area (NAA) can be surrounded by the display area (AA). The display panel can be set to a rectangle, and the display area (AA) can be set to a rectangle, so that the non-display area (NAA) is set to a rectangular frame.

[0073] For a liquid crystal display panel, the non-display area (NAA) can include a data pad (DP), a data pad opposite (DPO), a gate pad left (GPL), and a gate pad left (GPR). Gate driver on array (GOA) circuits are located on the gate pad left (GPL) and gate pad right (GPR). The gate pad left (GPL) and gate pad right (GPR) are positioned opposite each other in the first direction (X), with the gate pad left (GPL) generally corresponding to the left bezel coverage area and the gate pad right (GPR) generally corresponding to the right bezel coverage area. The data pad side (DP) generally corresponds to the bottom bezel coverage area. The data pad side (DP) and the data pad opposite (DPO) are positioned opposite each other in the second direction (Y), with the data pad opposite (DPO) generally corresponding to the top bezel coverage area.

[0074] The data bonding side DP can include a fanout area and a bonding area BOD. The display area AA and the bonding area BOD are connected on opposite sides of the fanout area in the second direction Y. That is, the fanout area is connected between the display area AA and the bonding area BOD. Specifically, the fanout area is connected to the display area AA, and the bonding area BOD is connected to the side of the fanout area away from the display area AA. Various traces are provided in the fanout area. Multiple bonding pins are provided in the bonding area BOD. Some bonding pins are used to bond the driver integrated circuit IC, and other bonding pins are used to bond the first flip-chip thin film COF1.

[0075] For other display panels, the non-display area (NAA) may include a data pad (DP), a data pad opposite (DPO), and a first area and a second area that are set opposite each other in the first direction X.

[0076] It should be noted that in this disclosure, both the first direction X and the second direction Y are parallel to the display surface of the display panel, and the second direction Y is the connection direction of the display panel, the first flip-chip film COF1 and the rigid circuit board PCBA. The first direction X intersects with the second direction Y, for example, the first direction X is perpendicular to the second direction Y.

[0077] The display panel may include a substrate, with a driving circuit layer group disposed on one side of the substrate. The substrate material may include inorganic materials, such as glass, quartz, or metal. The substrate material may also include organic materials, such as resins like polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate, and polyethylene naphthalate. The substrate may be formed from multiple material layers; for example, it may include multiple substrate layers, the substrate layer material being any of the aforementioned materials. Alternatively, the substrate may be a single layer, and can be any of the aforementioned materials. The driving circuit layer group may include multiple transistors arranged in an array.

[0078] For a liquid crystal display panel, it may also include a first electrode layer, an insulating layer, and a second electrode layer stacked sequentially. For an OLED display panel, it may also include a first electrode layer, a pixel definition layer, a light-emitting layer group, a second electrode layer, an encapsulation layer group, and so on, stacked sequentially.

[0079] Reference Figure 2As shown, at least two rigid circuit boards (PCBAs) can be configured, for example, two, three, or more rigid circuit boards (PCBAs); at least two first flip-chip films (COF1) can also be configured, for example, two, three, or more first flip-chip films (COF1). A first flip-chip film (COF1) is connected between each rigid circuit board (PCBA) and the display panel (Panel). Specifically, one end of the first flip-chip film (COF1) is bonded to the data bonding side (DP) of the display panel (Panel), and the other end of the first flip-chip film (COF1) is bonded to the rigid circuit board (PCBA), so that the first flip-chip film (COF1) is electrically connected between the rigid circuit board (PCBA) and the display panel (Panel), and signals can be transmitted between the rigid circuit board (PCBA) and the display panel (Panel) through the first flip-chip film (COF1).

[0080] The first flip-chip film COF1 can be bent, which allows the rigid circuit board PCBA to be located on the non-display side of the display panel, thereby reducing the width of the non-display area NAA of the display panel and facilitating the implementation of a narrow bezel design.

[0081] Rigid PCBAs provide support, interconnection, and signal transmission for various electronic components. The entire process of manufacturing a bare PCB (Printed Circuit Board) through SMT (Surface Mount Technology) mounting or DIP (Dual Inline-pin Package) insertion is called PCBA (Printed Circuit Board Assembly), or simply assembly.

[0082] Because PCB manufacturers, assembly plants, and display panel module bonding processes cannot handle ultra-long PCBs, related technologies require at least two rigid PCBs (Printed Circuit Board Assemblies) for large-size display panels. A flexible printed circuit board (FPC) connects adjacent rigid PCBs for data transmission. The FPC consists of a substrate, copper foil, and a cover layer. The substrate is typically made of flexible materials such as polyimide (PI) or polyester film, offering flexibility, foldability, and lightweight characteristics. The copper foil, as a conductive layer, forms circuit patterns through etching and other processes. The thickness of the copper foil can be selected based on different application requirements. The cover layer is generally an insulating material used to protect the circuit and provide insulation. The cover layer can be polyimide film, polyester film, or other insulating materials. When mounting electronic components on the FPC, they need to be soldered to the FPC. The commonly used FPC mounting method involves soldering flip-type connectors (CNTs) onto the PCB, and then production line workers manually insert the FPC into the CNTs. However, in actual production, production line workers are prone to making mistakes such as slanted insertion or reverse insertion when performing manual operations, which can lead to abnormal lighting and repetitive work. In addition, manual operation consumes a lot of time, which not only affects the product yield but also reduces production capacity.

[0083] In addition, as display panels develop towards larger sizes and higher refresh rates, the signal transmission distance is also getting longer and longer, and the requirements for transmission rate are also getting higher and higher. The attenuation of the transmitted signal on the connector CNT and the flexible circuit board FPC is also getting greater and greater, resulting in a deterioration in the eye diagram quality of the product, which seriously affects the customer's product certification schedule and product quality.

[0084] Furthermore, with the trend towards thinner products from OEMs, more and more manufacturers are requiring flexible printed circuit boards (FPCs) with reverse insertion designs. This means that before the first flip-chip film (COF1) is bent, the main body of the FPC is positioned close to the display panel relative to the insertion part. Additionally, the FPC must not exceed the edge of the rigid printed circuit board (PCBA). This necessitates a narrower FPC, limiting its routing space and often requiring multi-layer designs. As resolutions and pixel densities increase, the number of traces on the FPC also increases, further straining its routing space. In some cases, FPCs may need to be designed with four or six layers, or the trace width and spacing must be drastically compressed to meet customer requirements that the reverse-inserted FPC must not exceed the edge of the rigid PCBA. This significantly increases product costs and the impedance of the FPC, impacting product performance.

[0085] In this example implementation, refer to Figure 2 As shown, the second flip-chip film COF2 is connected between at least some of two adjacent rigid circuit boards (PCBAs). For example, no second flip-chip film COF2 is provided between two adjacent rigid circuit boards (PCBAs) connected to the central control board (TCON), while the second flip-chip film COF2 is provided between other two adjacent rigid circuit boards (PCBAs). Of course, in another example embodiment of this disclosure, the second flip-chip film COF2 may be connected between all two adjacent rigid circuit boards (PCBAs).

[0086] Specifically, one end of the second flip-chip film COF2 is bonded to a rigid circuit board PCBA, and the other end of the second flip-chip film COF2 is bonded to another rigid circuit board PCBA. Signal transmission between two adjacent rigid circuit boards PCBAs is achieved through the second flip-chip film COF2, reducing the use of flexible circuit boards (FPCs) and connectors (CNTs). On the one hand, this reduces signal attenuation at least partially on the connectors (CNTs) and FPCs, improving the eye diagram quality of large-size, high-resolution display panels and enhancing signal connection reliability. On the other hand, replacing the connectors (CNTs) and FPCs with the second flip-chip film COF2 reduces costs. The smaller thickness and volume of the second flip-chip film COF2 facilitates ultra-thin designs for display devices, meeting customer product design trends. Furthermore, the second flip-chip film COF2 and the first flip-chip film COF1 can be simultaneously bonded to the rigid circuit boards PCBA, eliminating the need for soldering connectors (CNTs) and manually inserting flexible circuit boards (FPCs), thus improving production capacity. Compared to manual insertion, the bonding process offers higher precision and is less prone to errors such as misaligned or reverse insertion, contributing to higher product yield.

[0087] The bonding process uses ACF (Anisotropic Conductive Film) to thermally bond under various conditions (temperature, pressure, time). Specifically, anisotropic conductive film can be coated on a rigid circuit board PCBA. Then, a first flip-chip film COF1 and a second flip-chip film COF2 are aligned and placed on the position of the anisotropic conductive film coated on the rigid circuit board PCBA. The first flip-chip film COF1 and the second flip-chip film COF2 are then pressed onto the rigid circuit board PCBA using bonding equipment, and the pressure is maintained for a certain time under a set temperature condition.

[0088] Chip On Flex (COF) is a chip-on-film packaging technology that fixes a drive integrated circuit (DriveIC) on a flexible printed circuit board. It uses a flexible additional circuit board as a carrier for packaging the chip to combine the chip with the flexible substrate circuit, or specifically refers to the flexible additional circuit board without a packaged chip. Specifically, a COF usually consists of a substrate, metal lines, and a drive chip. The substrate generally uses flexible materials such as polyimide (PI), which has good flexibility, heat resistance, and insulation properties, and can adapt to various complex shapes and bending requirements. The metal lines usually use metal materials with good electrical conductivity such as copper, and form tiny circuit patterns on the substrate through fine manufacturing techniques. The drive chip is the core component of the COF, responsible for controlling functions such as image display and signal processing of the display screen. The drive chip is directly mounted on the film through flip chip technology. Compared with traditional wire bonding technology, it has a higher connection density and a smaller package size, meeting the development trend of thinner and lighter electronic products; moreover, flip chip technology can provide a more stable connection, reduce interference and loss in signal transmission, and improve the reliability of the product; the fine metal lines and advanced manufacturing techniques can achieve high-resolution signal transmission and improve the image display quality of the display screen.

[0089] The first COF1 uses a flexible additional circuit board as a carrier for packaging the chip to combine the chip with the flexible substrate circuit. The second COF2 specifically refers to the flexible additional circuit board without a packaged chip.

[0090] In some exemplary embodiments of the present disclosure, referring to Figure 3 and Figure 4 as shown, the second COF2 may include a first part COF21, a second part COF22, and a connecting part COF23; the first part COF21 is connected to one of two adjacent rigid circuit boards PCBA. Specifically, one end of the first part COF21 is bonded to one of two adjacent rigid circuit boards PCBA; the second part COF22 is connected to the other of two adjacent rigid circuit boards PCBA. Specifically, one end of the second part COF22 is bonded to the other of two adjacent rigid circuit boards PCBA. The connecting part COF23 is connected between the first part COF21 and the second part COF22. Specifically, the connecting part COF23 is connected between one end of the first part COF21 far from the rigid circuit board PCBA and one end of the second part COF22 far from the rigid circuit board PCBA, such that the second COF2 forms a structure roughly like a "冂".

[0091] The corner formed by the connection between the first part COF21 and the connecting part COF23 is chamfered, and the corner formed by the connection between the second part COF22 and the connecting part COF23 is also chamfered. (Refer to...) Figure 3 and Figure 4 As shown, the corner formed by the connection between the first part COF21 and the connecting part COF23 near the second part COF22 is rounded; the edge line of the first part COF21 away from the second part COF22 after the connection with the connecting part COF23 is a straight line. Similarly, the corner formed by the connection between the second part COF22 and the connecting part COF23 near the first part COF21 is also rounded; the edge line of the second part COF22 away from the first part COF21 after the connection with the connecting part COF23 is a straight line. This design increases the connection length between the first part COF21 and the connecting part COF23, while avoiding sharp corners, thereby increasing the connection strength between the first part COF21 and the connecting part COF23 and preventing tearing between them during handling and testing. Similarly, this design increases the connection length between the second part COF22 and the connecting part COF23, while avoiding sharp corners, thereby increasing the connection strength between the second part COF22 and the connecting part COF23 and preventing tearing between them during handling and testing.

[0092] Optionally, refer to Figure 3 As shown, a first connection bonding pin COF23-Lead is provided at the end of the connecting part COF23 near the display panel, and a panel bonding pin Panel-Lead is provided at the end of the display panel near the second flip-chip film COF2. The first connection bonding pin COF23-Lead is bonded to the panel bonding pin Panel-Lead, so that the end of the connecting part COF23 near the display panel is bonded to the display panel, thereby fixing both ends of the second flip-chip film COF2. This allows the second flip-chip film COF2 to be bent together with the first flip-chip film COF1 after the display panel is installed on the display device, making the display device more structurally stable.

[0093] The first connection bonding pin COF23-Lead and the panel bonding pin Panel-Lead can be unconnected. That is, both COF23-Lead and Panel-Lead are dummy bonding pins, not involved in electrical connection, and do not require power. This configuration allows for the addition of the Panel-Lead bonding pin on the substrate to the display panel, without requiring changes to the design of other photomasks. Similarly, on the rigid circuit board PCBA, only the bonding pins required for bonding the second flip-chip film COF2 need to be added to the existing design.

[0094] In terms of manufacturing process, the second flip-chip film COF2 can be directly mechanically bonded to the first flip-chip film COF1 without the need for additional manufacturing processes. There is also no problem of interference with the device during bonding. This eliminates the need for manual insertion of flexible circuit boards (FPCs), which is beneficial for increasing production capacity. Compared with manual insertion, the bonding accuracy is higher, which is beneficial for improving product yield. Compared with connectors (CNTs) and flexible circuit boards (FPCs), using the second flip-chip film COF2 greatly saves costs.

[0095] Of course, in some other exemplary embodiments of this disclosure, reference is made to Figure 2 and Figure 4 As shown, the end of the connecting part COF23 near the display panel may not be bound to the display panel. In this case, the lengths of the first part COF21 and the second part COF22 can be set to be relatively small.

[0096] Optionally, refer to Figure 4 As shown, differential signal traces can be set on the second flip-chip film COF2. For example, only differential signal traces can be set on the second flip-chip film COF2. In this case, the display module can also include a flexible circuit board FPC and at least two connectors CNTs. The at least two connectors CNTs are correspondingly set on at least two rigid circuit boards PCBAs, that is, one connector CNT is set on one rigid circuit board PCBA. Taking the setting of two rigid circuit boards PCBAs and two connectors CNTs as an example, the two connectors CNTs are the first connector CNT1 and the second connector CNT2. The first connector CNT1 is set on one of the two adjacent rigid circuit boards PCBAs; the second connector CNT2 is set on the other of the two adjacent rigid circuit boards PCBAs; the flexible circuit board FPC is connected between the two adjacent connectors CNTs, that is, the flexible circuit board FPC is connected between the first connector CNT1 and the second connector CNT2; other traces are set on the flexible circuit board FPC. Other traces may include GOA (Gate on Array) signal traces, Gamma signal traces, power signal traces, and control signal traces, etc.

[0097] Since the differential signal has the greatest attenuation, this configuration ensures that the differential signal with the greatest attenuation is transmitted through the second flip-chip film COF2, which avoids signal attenuation of the differential signal on the flexible printed circuit board (FPC) and the connector CNT, thereby improving the eye diagram quality. Moreover, this solution does not require changes to the mask design, which is conducive to rapid improvement of product quality.

[0098] In this case, the number of traces on the flexible printed circuit board (FPC) is reduced, which allows the FPC to be made narrower. For example, the FPC does not extend beyond the rigid printed circuit board (PCBA) in the second direction Y, thus meeting customer requirements.

[0099] Of course, in some other exemplary embodiments of this disclosure, in addition to differential signal traces, control signal traces may be provided on the second flip-chip film COF2, while other traces may be provided on the flexible circuit board FPC. Other traces may include GOA (Gate on Array) signal traces, Gamma signal traces, and power signal traces, etc.

[0100] In some exemplary embodiments of this disclosure, reference is made to Figures 5-9 As shown, a connection trace ZX can be provided on the display panel. The second flip-chip film COF2 can include a first part COF21 and a second part COF22. The first part COF21 is connected between one of two adjacent rigid circuit boards (PCBA) and the display panel, and is bound to one end of the connection trace ZX. Specifically, the first part COF21 has a first end and a second end that are arranged opposite to each other. A first binding pin is provided at the first end, and a second binding pin is provided at the second end. The first binding pin is bound to the rigid circuit board (PCBA), and the second binding pin is bound to one end of the connection trace ZX, so that the signal trace on the first part COF21 is electrically connected to the connection trace ZX on the display panel panel, and the signal trace on the first part COF21 is also electrically connected to the trace on a rigid circuit board (PCBA).

[0101] The second part, COF22, is connected between another rigid circuit board (PCBA) and the display panel, and is bound to the other end of the connecting trace ZX. Specifically, the second part, COF22, has a third end and a fourth end that are arranged opposite to each other. A third binding pin is provided at the third end, and a fourth binding pin is provided at the fourth end. The third binding pin is bound to the rigid circuit board (PCBA), and the fourth binding pin is bound to the other end of the connecting trace ZX. This allows the signal trace on the second part, COF22, to be electrically connected to the connecting trace ZX on the display panel, and also allows the signal trace on the second part, COF22, to be electrically connected to the trace on the other rigid circuit board (PCBA), thereby achieving electrical connection between two adjacent rigid circuit boards (PCBA).

[0102] Reference Figure 5 As shown, the first part COF21 and the first flip-chip film COF1 are separately configured, and the second part COF22 and the first flip-chip film COF1 are also separately configured.

[0103] This configuration allows both ends of the first portion COF21 and the second portion COF22 of the second flip-chip film COF2 to be fixedly positioned. This enables the first portion COF21 and the second portion COF22 of the second flip-chip film COF2 to be bent together with the first flip-chip film COF1 after the display panel is installed on the display device, making the display device structurally more stable. Furthermore, it simplifies the structure of the second flip-chip film COF2. In terms of manufacturing process, the second flip-chip film COF2 can also be bonded together with the first flip-chip film COF1.

[0104] Typically, 60, 68, or 80 traces are required on the second flip-chip film COF2. Therefore, the number of connection traces ZX on the display panel panel is also 60, 68, or 80. The connection traces ZX can be formed on the display panel panel by changing the structure of the photomask, and the aforementioned number of connection traces ZX on the display panel panel can be achieved.

[0105] Optionally, refer to Figures 6-8 As shown, the first part COF21 and the adjacent first flip-chip film COF1 can be configured as an integral structure to form a composite flip-chip film COFZ. That is, one first flip-chip film COF1 is set to be larger, and a part of the first flip-chip film COF1 is still used as the first flip-chip film COF1. A driver integrated circuit IC is set in the part used as the first flip-chip film COF1. The other part of the first flip-chip film COF1 is used as the first part COF21 of the second flip-chip film COF2. In this part, no driver integrated circuit IC is needed. Only wiring is required to connect them.

[0106] The second part COF22 and the adjacent first flip-chip film COF1 can be configured as an integral structure to form a composite flip-chip film COFZ. That is, the other first flip-chip film COF1 is set to be larger. A part of the first flip-chip film COF1 is still used as the first flip-chip film COF1. A driver integrated circuit IC is set in the part used as the first flip-chip film COF1. The other part of the first flip-chip film COF1 is used as the second part COF22 of the second flip-chip film COF2. A driver integrated circuit IC is not required in this part. It is only necessary to connect the traces.

[0107] This configuration ensures the uniformity of pre-shrinkage during the bonding process; it makes the structure of the integrated flip-chip film COFZ in this disclosure basically the same as the structure of the first flip-chip film COF1 in related technologies, except that the integrated flip-chip film COFZ in this disclosure is larger and has more bonding pins; it also reduces the alignment of the second flip-chip film COF2, making the bonding process simpler.

[0108] Generally, the second flip-chip film COF2 actually requires 68 or 80 traces. Since the size of the flip-chip film COF raw material is fixed, for low-resolution display panel panels and display panel panels with a large number of integrated flip-chip film COFZs, such as a 720-channel display panel panel with 12 integrated flip-chip film COFZs, the existing integrated flip-chip film COFZ raw material specifications can meet the channel requirements of the integrated design of the first part COF21 and the first flip-chip film COF1, as well as the channel requirements of the integrated design of the second part COF22 and the first flip-chip film COF1. Therefore, it is not necessary to replace the existing first flip-chip film COF1, thus reducing costs. Similarly, connecting traces ZX need to be set on the display panel panel to realize the connection between the first part COF21 and the second part COF22.

[0109] Of course, in some other exemplary embodiments of this disclosure, the first part COF21 and the adjacent first flip-chip film COF1 may be configured as an integral structure, while the second part COF22 and the adjacent first flip-chip film COF1 may be configured as separate structures; or the second part COF22 and the adjacent first flip-chip film COF1 may be configured as an integral structure, while the first part COF21 and the adjacent first flip-chip film COF1 may be configured as separate structures.

[0110] Optionally, refer to Figure 7 and Figure 8As shown, the end of the integrated chip flip-chip (COFZ) film connected to the display panel is the first end COFZ1, and the end of the integrated chip flip-chip (COFZ) film connected to the rigid circuit board (PCBA) is the second end COFZ3. The width of the first end COFZ1 along the first direction X is smaller than the width of the second end COFZ3 along the first direction X. This configuration reduces the size of the raw material of the integrated chip flip-chip (COFZ) film, retaining only the required number of channels at the display panel end.

[0111] Multiple first bonding pins are provided at the first end COFZ1. The pitch and width of the multiple first bonding pins are the same. That is, the pitch of the first bonding pin used as the first flip-chip film COF1 is the same as the pitch of the first bonding pin used as the second flip-chip film COF2, and the width of the first bonding pin used as the first flip-chip film COF1 is the same as the width of the first bonding pin used as the second flip-chip film COF2, so as to ensure the uniformity of pre-shrinkage during bonding.

[0112] Multiple second bonding pins are provided at the second end COFZ3. The pitch and width of the multiple second bonding pins are the same. That is, the pitch of the second bonding pin used as the first flip-chip film COF1 is the same as the pitch of the second bonding pin used as the second flip-chip film COF2, and the width of the second bonding pin used as the first flip-chip film COF1 is the same as the width of the second bonding pin used as the second flip-chip film COF2, so as to ensure the uniformity of pre-shrinkage during bonding.

[0113] Multiple third bonding pins are provided on the display panel, and these third bonding pins are bonded to the first bonding pins. The pitch and width of the multiple third bonding pins are identical; that is, the pitch of the third bonding pin bonded to the first flip-chip film COF1 is the same as the pitch of the third bonding pin bonded to the second flip-chip film COF2, and the width of the third bonding pin bonded to the first flip-chip film COF1 is the same as the width of the third bonding pin bonded to the second flip-chip film COF2. This ensures the uniformity of pre-shrinkage during bonding.

[0114] To ensure the uniformity of the pre-shrinkage during bonding of the bonding pins on the display panel panel and the bonding pins at the first end of the integrated flip-chip film COFZ1, the pitch of the bonding pins on the display panel panel is the same as the pitch of the bonding pins at the first end of the integrated flip-chip film COFZ1, and the width of the bonding pins on the display panel panel is also the same as the width of the bonding pins at the first end of the integrated flip-chip film COFZ1; that is, the pitch of the third bonding pin is the same as the pitch of the first bonding pin, and the width of the third bonding pin is also the same as the width of the first bonding pin.

[0115] Multiple fourth bonding pins are provided on the rigid circuit board PCBA, and these fourth bonding pins are bonded to the second bonding pins. The pitch and width of these multiple fourth bonding pins are identical; that is, the pitch of the fourth bonding pin bonded to the first flip-chip film COF1 is the same as the pitch of the fourth bonding pin bonded to the second flip-chip film COF2, and the width of the fourth bonding pin bonded to the first flip-chip film COF1 is the same as the width of the fourth bonding pin bonded to the second flip-chip film COF2. This ensures the uniformity of pre-shrinkage during bonding.

[0116] Similarly, to ensure the uniformity of the pre-shrinkage of the bonding pins of the second end COFZ3 of the composite flip-chip film COFZ and the bonding pins on the rigid circuit board PCBA during bonding, the pitch of the bonding pins on the rigid circuit board PCBA is the same as the pitch of the bonding pins of the first end COFZ1 of the composite flip-chip film COFZ, and the width of the bonding pins on the rigid circuit board PCBA is also the same as the width of the bonding pins of the first end COFZ1 of the composite flip-chip film COFZ. That is, the pitch of the fourth bonding pin is the same as the pitch of the second bonding pin, and the width of the fourth bonding pin is also the same as the width of the second bonding pin.

[0117] Because the pitch and width of the bonding pins on the rigid circuit board PCBA cannot be made small enough (i.e., the pitch of the fourth bonding pin is greater than the pitch of the third bonding pin, and the width of the fourth bonding pin is greater than the width of the third bonding pin), even if they could be made small enough, it would require high costs and have a low yield. Therefore, the width of the first end COFZ1 along the first direction X is smaller than the width of the second end COFZ3 along the first direction X. This allows the pitch and width of the bonding pins of the first end COFZ1 on the integrated flip-chip film COFZ to be set smaller to match the bonding pins on the display panel, and also allows the pitch and width of the bonding pins of the second end COFZ3 on the integrated flip-chip film COFZ to be set larger to match the bonding pins on the rigid circuit board PCBA. This results in the pitch of the first bonding pin being smaller than the pitch of the second bonding pin, and the width of the first bonding pin being smaller than the width of the second bonding pin.

[0118] Reference Figure 7As shown, the integrated flip-chip film COFZ can be configured as a symmetrical structure, with the axis of symmetry being the central axis of the integrated flip-chip film COFZ extending along the second direction Y, so that the integrated flip-chip film COFZ can be configured as an approximately isosceles trapezoidal structure. Specifically, the integrated flip-chip film COFZ may include a first end COFZ1, a middle part COFZ2, and a second end COFZ3 connected in sequence. The first end COFZ1 and the second end COFZ3 can be configured as rectangles, and the middle part COFZ2 can be configured as an isosceles trapezoid.

[0119] Reference Figure 8 As shown, the integrated flip-chip film COFZ can be configured as an asymmetric structure. For example, the integrated flip-chip film COFZ can be configured as a roughly right-angled trapezoidal structure. Specifically, the integrated flip-chip film COFZ can include a first end COFZ1, a middle part COFZ2, and a second end COFZ3 connected in sequence. The first end COFZ1 and the second end COFZ3 can be configured as rectangles, and the middle part COFZ2 can be configured as a right-angled trapezoid.

[0120] Of course, in some other exemplary embodiments of this disclosure, the integrated flip-chip film COFZ can be configured as a structure that is approximately non-isosceles trapezoidal. Specifically, the integrated flip-chip film COFZ can include a first end COFZ1, a middle part COFZ2, and a second end COFZ3 connected in sequence. The first end COFZ1 and the second end COFZ3 can be configured as rectangles, and the middle part COFZ2 can be configured as a non-isosceles trapezoid.

[0121] Reference Figure 2 and Figure 9 As shown, in some example embodiments of this disclosure, the connection trace ZX disposed on the display panel may include a first differential signal trace DS1.

[0122] The first flip-chip film COF1 connecting the same rigid circuit board PCBA and the display panel is configured to be at least two; for example, the first flip-chip film COF1 connecting the same rigid circuit board PCBA and the display panel can be configured to be three. Of course, in some other example embodiments of this disclosure, the first flip-chip film COF1 connecting the same rigid circuit board PCBA and the display panel can be configured to be four or more.

[0123] The first flip-chip film COF1 closest to the adjacent rigid circuit board PCBA is a composite flip-chip film COFZ. One composite flip-chip film COFZ and the first portion COF21 of the second flip-chip film COF2 are integrated into a single structure; that is, one composite flip-chip film COFZ includes a first flip-chip film COF1 and the first portion COF21, both integrally formed. Another composite flip-chip film COFZ and the second portion COF22 of the second flip-chip film COF2 are integrated into a single structure; that is, another composite flip-chip film COFZ includes another first flip-chip film COF1 and the second portion COF22, both integrally formed.

[0124] The first flip-chip film COF1, which is far away from the adjacent rigid circuit board PCBA, remains the original first flip-chip film COF1 and is not combined with the first part COF21 or the second part COF22 of the second flip-chip film COF2 to form an integral structure.

[0125] Reference Figure 2 As shown, the display module may also include a central control board (TCON). The central control board (TCON) is electrically connected to two adjacent rigid circuit boards (PCBAs). Various display signals can be directly transmitted to the two adjacent rigid circuit boards (PCBAs) through the central control board (TCON). Therefore, a second chip-coated film (COF2) is not connected between the two adjacent rigid circuit boards (PCBAs) connected to the central control board (TCON). For example, four rigid circuit boards (PCBAs) can be configured. The two middle rigid circuit boards (PCBAs) can be connected to the central control board (TCON) via FFC (Flexible Flat Cable), the two left rigid circuit boards (PCBAs) can be connected via the second chip-coated film (COF2), and the two right rigid circuit boards (PCBAs) can be connected via the second chip-coated film (COF2).

[0126] Of course, in some other exemplary embodiments of this disclosure, the central control board TCON is electrically connected to a rigid circuit board PCBA, for example, referring to Figure 10 As shown, three rigid circuit boards (PCBA) can be set. The middle rigid circuit board (PCBA) can be connected to the central control board (TCON) via FFC (Flexible Flat Cable). The two rigid circuit boards (PCBA) on the left can be connected via the second flip-chip film (COF2), and the two rigid circuit boards (PCBA) on the right can be connected via the second flip-chip film (COF2).

[0127] When two rigid circuit boards (PCBAs) can be set, one rigid circuit board (PCBA) can be connected to the central control board (TCON) via FFC (Flexible Flat Cable), and the two rigid circuit boards (PCBAs) can be connected via a second flip-chip film (COF2).

[0128] In addition, the number of rigid circuit boards (PCBAs) can be other quantities, and their specific connection methods will not be described in detail here.

[0129] In this case, refer to Figure 2 and Figure 9 As shown, the one closer to the central control board TCON in two adjacent rigid circuit boards is the first rigid circuit board PCBA1, and the one farther away from the central control board TCON is the second rigid circuit board PCBA2. The first part COF21 is connected between the first rigid circuit board PCBA1 and the display panel, and the second part COF22 is connected between the second rigid circuit board PCBA2 and the display panel.

[0130] A second differential signal trace DS2 is provided on the first part COF21, and a third differential signal trace DS3 is provided on the second part COF22. The second differential signal trace DS2 and the third differential signal trace DS3 are connected to the opposite ends of the first differential signal trace DS1. Specifically, the second differential signal trace DS2 and the third differential signal trace DS3 are bonded to the opposite ends of the first differential signal trace DS1. Therefore, the number of first differential signal traces DS1, the number of second differential signal traces DS2, and the number of third differential signal traces DS3 are the same.

[0131] A fourth differential signal trace DS4 is provided on the first rigid circuit board PCBA1, and one end of the fourth differential signal trace DS4 is connected to the central control board TCON.

[0132] A fifth differential signal trace DS5 is provided on the second rigid circuit board PCBA2. One end of the fifth differential signal trace DS5 is connected to the third differential signal trace DS3. The number of fifth differential signal traces DS5 can be the same as the number of third differential signal traces DS3. The other end of the fifth differential signal trace DS5 is connected to the first flip-chip film COF1 connected to the second rigid circuit board PCBA2. This allows the differential signal to be transmitted sequentially through the fourth differential signal trace DS4, the second differential signal trace DS2, the first differential signal trace DS1, the third differential signal trace DS3, and the fifth differential signal trace DS5 to each of the first flip-chip films COF1, and then through each of the first flip-chip films COF1 to the display panel.

[0133] It should be noted that differential signal traces are routed in pairs, for the purpose of simplifying the diagram. Figure 9 One line in the diagram represents a pair of differential signal traces. The traces of other signals, when connected through the first and second parts, have essentially the same structure as the differential signal traces, and therefore will not be described further here.

[0134] Optionally, the display module may further include a flexible circuit board (FPC) and at least two connectors (CNTs). The at least two connectors (CNTs) are correspondingly disposed on at least two rigid circuit boards (PCBAs), i.e., one connector (CNT) is disposed on each rigid circuit board (PCBA). Taking the case of two rigid circuit boards (PCBAs) and two connectors (CNTs) as an example, the two connectors (CNTs) are a first connector (CNT1) and a second connector (CNT2). The first connector (CNT1) is disposed on one of the two adjacent rigid circuit boards (PCBAs), for example, the first connector (CNT1) is disposed on the first rigid circuit board (PCBA1). The second connector (CNT) is disposed on the other of the two adjacent rigid circuit boards (PCBAs), for example, the second connector (CNT2) is disposed on the second rigid circuit board (PCBA2). The flexible circuit board (FPC) is connected between the two adjacent connectors (CNTs), i.e., the flexible circuit board (FPC) is connected between the first connector (CNT1) and the second connector (CNT2). Other traces are disposed on the flexible circuit board (FPC), which may include GOA (Gate on Array) signal traces, Gamma signal traces, power signal traces, and control signal traces, etc.

[0135] Since the differential signal has the greatest attenuation, this configuration ensures that the differential signal with the greatest attenuation is transmitted through the second flip-chip film COF2, which avoids signal attenuation of the differential signal on the flexible printed circuit board (FPC) and the connector CNT, thereby improving the eye diagram quality. Moreover, this solution does not require changes to the mask design, which is conducive to rapid improvement of product quality.

[0136] In this case, the number of traces on the flexible printed circuit board (FPC) is reduced, which allows the FPC to be made narrower. For example, the FPC does not extend beyond the rigid printed circuit board (PCBA) in the second direction Y, thus meeting customer requirements.

[0137] Of course, in some other exemplary embodiments of this disclosure, in addition to differential signal traces, control signal traces may be provided on the second flip-chip film COF2, while other traces may be provided on the flexible circuit board FPC. Other traces may include GOA (Gate on Array) signal traces, Gamma signal traces, and power signal traces, etc.

[0138] Optionally, a solder resist (SR) film is applied to the first flip-chip film (COF1) and the second flip-chip film (COF2). Common solder resist materials include dry film and liquid film. Dry film solder resist is formed by covering the surface of the second flip-chip film (COF2) with a pre-fabricated dry film layer and fusing it with the surface under high temperature and pressure. Liquid film solder resist is formed by coating the surface of the second flip-chip film (COF2) with a liquid solder resist material and curing it through thermosetting or ultraviolet irradiation. The solder resist film also increases the strength of the second flip-chip film (COF2), preventing tearing during handling and testing.

[0139] Based on the same inventive concept, this disclosure provides a display device that may include the display module described in any of the above-mentioned embodiments. The specific structure of the display module has been described in detail above, and therefore will not be repeated here.

[0140] The specific type of display device is not particularly limited; any type of display device commonly used in the field is acceptable, such as mobile devices like mobile phones, wearable devices like watches, VR devices, etc. Those skilled in the art can make the appropriate selection based on the specific purpose of the display device, which will not be elaborated further here.

[0141] It should be noted that, in addition to the array substrate, the display device also includes other necessary components and parts. Taking the display as an example, these include, for instance, the casing, circuit board, power cord, etc. Those skilled in the art can supplement these components according to the specific usage requirements of the display device, and will not be elaborated here.

[0142] Compared with the prior art, the beneficial effects of the display device provided by the exemplary embodiments of the present invention are the same as the beneficial effects of the array substrate provided by the above exemplary embodiments, and will not be repeated here.

[0143] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A display module, characterized in that, include: Display panel; At least two first flip-chip films; At least two rigid circuit boards are connected to the first flip-film between each of the rigid circuit boards and the display panel; A second flip-chip film is connected between at least two adjacent rigid circuit boards.

2. The display module according to claim 1, characterized in that, The second flip-chip film includes: The first part is connected to one of the two adjacent rigid circuit boards; The second part is connected to the other of the two adjacent rigid circuit boards; A connecting part is connected between the first part and the second part.

3. The display module according to claim 2, characterized in that, The end of the connecting portion near the display panel is provided with a first connection bonding pin, and the end of the display panel near the second flip-chip film is provided with a panel bonding pin. The first connection bonding pin is bonded to the panel bonding pin.

4. The display module according to claim 3, characterized in that, Both the first connection bonding pin and the panel bonding pin are dummy bonding pins.

5. The display module according to claim 2, characterized in that, The corner formed by the first part and the connecting part is chamfered, and the corner formed by the second part and the connecting part is also chamfered.

6. The display module according to claim 2, characterized in that, Differential signal traces are provided on the second flip-chip film.

7. The display module according to claim 1, characterized in that, The display panel is provided with connection traces, and the second flip-chip film includes: The first part is connected between one of the two adjacent rigid circuit boards and the display panel, and is bound to one end of the connection trace; The second part is connected between the other of the two adjacent rigid circuit boards and the display panel, and is bound to the other end of the connection trace.

8. The display module according to claim 7, characterized in that, The first portion and the adjacent first flip-chip film are configured as an integral structure to form a composite flip-chip film, and / or the second portion and the adjacent first flip-chip film are configured as an integral structure to form a composite flip-chip film.

9. The display module according to claim 8, characterized in that, The end of the integrated flip-chip film connected to the display panel is the first end, and the end of the integrated flip-chip film connected to the rigid circuit board is the second end. The width of the first end along the first direction is smaller than the width of the second end along the first direction. The first direction intersects with the second direction, and the second direction is the connection direction of the display panel, the first flip-chip film, and the rigid circuit board.

10. The display module according to claim 9, characterized in that, A plurality of first bonding pins are provided at the first end, and a plurality of second bonding pins are provided at the second end; a plurality of third bonding pins are provided on the display panel, the third bonding pins being bonded to the first bonding pins, and the pitch and width of the third bonding pins being the same as those of the first bonding pins; a plurality of fourth bonding pins are provided on the rigid circuit board, the fourth bonding pins being bonded to the second bonding pins, and the pitch and width of the fourth bonding pins being the same as those of the second bonding pins; the pitch of the first bonding pins is smaller than the pitch of the second bonding pins, and the width of the first bonding pins is smaller than the width of the second bonding pins.

11. The display module according to claim 8, characterized in that, The connection traces include a first differential signal trace.

12. The display module according to claim 11, characterized in that, The first flip-chip film connecting the same rigid circuit board and the display panel is configured as at least two, and the first flip-chip film closest to the adjacent rigid circuit board is a composite flip-chip film. One composite flip-chip film and the first part of the second flip-chip film are configured as an integral structure, and the other composite flip-chip film and the second part of the second flip-chip film are configured as an integral structure.

13. The display module according to claim 12, characterized in that, The display module also includes: A central control board is electrically connected to two adjacent rigid circuit boards, and the second flip-chip film is not connected between the two adjacent rigid circuit boards connected to the central control board; or, the central control board is electrically connected to one of the rigid circuit boards.

14. The display module according to claim 13, characterized in that, Of the two adjacent rigid circuit boards, the one closer to the central control board is the first rigid circuit board, and the one farther from the central control board is the second rigid circuit board. The first part is connected between the first rigid circuit board and the display panel, and the second part is connected between the second rigid circuit board and the display panel. A second differential signal trace is provided on the first part, and a third differential signal trace is provided on the second part. The second differential signal trace and the third differential signal trace are connected to the opposite ends of the first differential signal trace. A fourth differential signal trace is provided on the first rigid circuit board, and one end of the fourth differential signal trace is connected to the central control board. A fifth differential signal trace is provided on the second rigid circuit board. One end of the fifth differential signal trace is connected to the third differential signal trace, and the other end of the fifth differential signal trace is connected to the first flip-chip film connected to the second rigid circuit board.

15. The display module according to claim 6 or 11, characterized in that, The display module also includes: At least two connectors are provided on at least two of the rigid circuit boards in a one-to-one correspondence; A flexible circuit board is connected between two adjacent connectors.

16. The display module according to claim 15, characterized in that, The flexible circuit board does not extend beyond the rigid circuit board in a second direction, which is the connection direction of the display panel, the first flip-chip film, and the rigid circuit board.

17. The display module according to any one of claims 1 to 14, characterized in that, The first flip-chip film and the second flip-chip film are provided with solder resist film.

18. A display device, characterized in that, include: The display module is the display module according to any one of claims 1 to 17.

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