Reinforced AI server

Abstract

The reinforced AI server comprises a main control module (1) and at least one computing power module (2), the main control module (1) comprises a main control shell (11), a main control mainboard (12), a central processing unit (13), a power supply unit (14) and a bus interface (15), and the main control mainboard (12), the central processing unit (13), the power supply unit (14) and the bus interface (15) are located in the main control shell (11); each computing power module (2) comprises a computing power shell (21), a computing power mainboard (22) and a heat dissipation unit (24), wherein the computing power mainboard (22) and the heat dissipation unit (24) are located in the computing power shell (21), and a computing power chip (23) is arranged on the computing power mainboard (22). Plug-in cascade structures are adopted between the main control module (1) and the computing power modules (2) and between the computing power modules (2), and the main control module (1) and the computing power modules (2) all adopt closed shells. According to the AI server provided by the invention, through the modular and reinforced shell design, the IP65 protection level is realized, and the AI server has the shockproof capability; the system can be flexibly assembled according to computing power requirements, and is suitable for special scenes such as fields and aerospace navigation.

Description

Technical Field

[0001] This invention relates generally to the field of computer technology, and specifically to a ruggedized AI server. Background Technology

[0002] With the development of artificial intelligence (AI) technology, its applications are gradually expanding to various fields. In special scenarios such as the field, aerospace, and maritime, special designs are needed for the computing power, structural strength, and heat dissipation system of AI servers. Summary of the Invention

[0003] The purpose of this invention is to provide a robust AI server that can be used in extreme environments.

[0004] The ruggedized AI server according to the present invention includes a main control module and at least one computing power module. The main control module includes a main control housing and a main control motherboard, a central processing unit, memory, a hard disk, a power supply unit, and a bus interface located therein. Each computing power module includes a computing power housing and a computing power motherboard, an input interface, an output interface, and a heat dissipation unit located therein. The computing power motherboard contains a computing power chip. The main control module and the computing power modules, as well as the computing power modules, adopt a plug-in cascade structure. The main control module and each computing power module adopt a closed housing.

[0005] In specific cases, the main control module and each computing module have the same external dimensions, and their shells are made of metal or alloy frames, with non-metallic materials used for reinforcement at the corners.

[0006] Specifically, the back of the main control housing has a recessed main control connector slot, the front of the computing power housing has a convex computing power connector head, and the back of the computing power housing has a recessed computing power connector slot. The computing power connector head and the computing power connector slot are respectively connected to the input interface and output interface of the computing power module.

[0007] In specific cases, the bus interface of the main control module and the input / output interface of the computing power module both adopt one of the following buses: PCI, PCIe, PXI, and PXIe.

[0008] In specific cases, the heat dissipation unit of the computing module adopts a conductive heat dissipation structure.

[0009] In specific cases, the main control module is equipped with an LCD screen.

[0010] In specific cases, both the main control housing and the computing power housing are equipped with mating fasteners for cascading installation and disassembly between modules.

[0011] The AI ​​server according to the present invention achieves IP65 protection level for waterproofing and dustproofing, as well as shock resistance, through cascaded modular design and reinforced shell design; it can be flexibly assembled according to computing power requirements and is suitable for special scenarios such as field, aerospace and maritime applications. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the assembly structure of the rugged AI server of the present invention.

[0013] Figure 2 This is a front view of the main control module in this invention.

[0014] Figure 3 This is a schematic diagram of the internal structure of the main control module in this invention.

[0015] Figure 4 This is a schematic diagram of the back structure of the main control module in this invention.

[0016] Figure 5 This is a front structural diagram of the computing module in this invention.

[0017] Figure 6 This is a schematic diagram of the internal structure of the computing module in this invention.

[0018] Figure 7 This is another internal structural diagram of the computing module in this invention (with the heat dissipation unit removed).

[0019] Figure 8 This is a schematic diagram of the back structure of the computing module in this invention.

[0020] Figure 9 This is a schematic diagram illustrating the assembly process of the rugged AI server of the present invention.

[0021] The labels in the attached diagram represent: 1-Main control module, 2-Computing power module, 11-Main control housing, 12-Main control motherboard, 13-Central processing unit, 14-Power supply unit, 15-Bus interface, 16-Peripheral interface, 17-Power supply interface, 18-LCD display, 19-Main control connector slot, 21-Computing power housing, 22-Computing power motherboard, 23-Computing power chip, 24-Heat dissipation unit, 25-Computing power connector head, 26-Debugging interface, 27-Computing power connector slot. Detailed Implementation

[0022] The present invention will now be described in detail with reference to specific embodiments and accompanying drawings.

[0023] See Figure 1-9 According to a rugged AI server of the present invention, a main control module 1 and one or more computing power modules 2 are included.

[0024] See details Figure 2-4 The main control module 1 includes a main control housing 11 and a main control motherboard 12, a central processing unit 13, a power supply unit 14, and a bus interface 15 located therein. The main control motherboard 12 is also connected to conventional host components such as memory and hard disk (not shown in the figure). The front of the main control housing 11 may be equipped with an LCD screen 18, but in some embodiments, the screen may not be provided. The back of the main control housing 11 is provided with a recessed main control connector slot 19, which connects the power supply unit 14 and the bus interface 15, and is used to connect to the computing module 2, providing communication and power interfaces for the computing module 2. In addition, a power interface 17 and peripheral interfaces 16 (such as USB port, network port, DP, serial port, etc.) are also provided on the side of the main control housing 11.

[0025] See details Figure 5-8 Each computing module 2 includes a computing housing 21 and a computing motherboard 22, input interfaces, output interfaces, and a heat dissipation unit 24 located within it. The computing motherboard 22 contains one or more computing chips 23 (e.g., 1, 2, 4, or 8) and their peripheral circuits. The heat dissipation unit 24 is disposed on the computing chip 23. The heat dissipation unit 24 uses conductive heat dissipation, transferring heat to the metal housing through copper pipes, graphene, thermal grease, etc. The heat is then transferred to the outside through the housing.

[0026] The computing power housing 21 has a protruding computing power connector head 25 on its front side and a concave computing power connector groove 27 on its back side. The computing power connector head 25 and the computing power connector groove 27 are respectively connected to the input interface and output interface of the computing power module 2. The computing power housing 21 may also have a debugging interface 26 on its side.

[0027] See details Figure 9 During the assembly process, the computing power connector head 25 of the first-level computing power module 1 is inserted into the main control connector slot 19 of the main control module 1; the computing power connector head 25 of the second-level computing power module 2 is inserted into the computing power connector slot 27 of the first-level computing power module 2, and so on, to perform the series assembly of the multi-level computing power modules 2.

[0028] In a specific embodiment of the present invention, the bus interface 15 of the main control module 1 and the input / output interface of the computing power module 2 both adopt one of the PCI, PCIe, PXI and PXIe buses.

[0029] In a specific embodiment of the present invention, the main control module 1 and each computing module 2 preferably have the same external dimensions. Their housings are all made of metal or alloy frames, with non-metallic components (such as carbon fiber or reinforcing engineering materials) used for reinforcement at the corners, forming a moisture-proof, dust-proof, and shock-proof enclosed housing. This reduces weight while enhancing impact and corrosion resistance. The connector slots and connector heads use a rainproof tongue-and-groove sealing structure, combined with the alloy frame, to achieve an IP65 protection rating. Additionally, the main control housing 11 and the computing module housing 21 are equipped with mating fasteners (not shown in the figure) for cascading installation and disassembly between modules. The mating fasteners can employ common mechanical structures in the prior art (e.g., snap-fit, locking).

[0030] Those skilled in the art should understand that the specific embodiments shown above are merely preferred embodiments of the present invention. Those skilled in the art can make simple modifications to the above embodiments using conventional means without departing from the spirit of the present invention, but all such modifications should fall within the protection scope of the present invention.

Claims

1. A ruggedized AI server, comprising a main control module (1) and at least one computing power module (2), characterized in that, The main control module (1) includes a main control housing (11) and a main control motherboard (12), a central processing unit (13), memory, hard disk, power supply unit (14), and bus interface (15) located therein; each computing power module (2) includes a computing power housing (21) and a computing power motherboard (22), an input interface, an output interface, and a heat dissipation unit (24) located therein, and the computing power motherboard (22) contains a computing power chip (23); the main control module (1) and the computing power module (2) and each computing power module (2) adopt a plug-in cascade structure, and the main control module (1) and each computing power module (2) adopt a closed housing.

2. The ruggedized AI server according to claim 1, characterized in that, The main control module (1) and each computing module (2) have the same external dimensions. Their shells are made of metal or alloy frames, and the corner parts are reinforced with non-metallic parts.

3. The ruggedized AI server according to claim 1, characterized in that, The back of the main control housing (11) is provided with a concave main control connector slot (19), the front of the computing power housing (21) is provided with a convex computing power connector head (25), and the back of the computing power housing (21) is provided with a concave computing power connector slot (27). The computing power connector head (25) and the computing power connector slot (27) are respectively connected to the input interface and output interface of the computing power module (2).

4. The ruggedized AI server according to claim 1, characterized in that, The bus interface (15) of the main control module (1) and the input / output interface of the computing module (2) both adopt one of the PCI, PCIe, PXI and PXIe buses.

5. The ruggedized AI server according to claim 1, characterized in that, The heat dissipation unit (24) of the computing module (2) adopts a conductive heat dissipation structure.

6. The ruggedized AI server according to claim 1, characterized in that, The main control module (1) is equipped with an LCD screen (18).

7. The ruggedized AI server according to claim 1, characterized in that, Both the main control housing (11) and the computing power housing (21) are equipped with matching fasteners for cascading installation and disassembly between modules.

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