Power consumption determination method and device and electronic equipment

Abstract

The invention discloses a power consumption determination method and device and electronic equipment, and the method comprises the steps: obtaining a thermal resistance model which comprises the thermal resistance parameters of all heat sources on a heat dissipation path of the electronic equipment, and representing the thermal coupling relation between all heat sources; determining the preset leakage power consumption of each heat source under the preset temperature value based on the corresponding relationship between the leakage power consumption and the temperature of each heat source in the target working scene; calculating electric leakage temperature corresponding to each heat source based on preset electric leakage power consumption and a thermal resistance model; in response to continuous adjustment of the preset temperature value, calculating an electric leakage temperature corresponding to the current preset temperature value until a difference value between the electric leakage temperature and the preset temperature value meets a temperature difference condition, and determining that the current electric leakage temperature is a steady-state temperature; based on the working parameters of the heat sources corresponding to the target working scene, the total power consumption of the heat sources in the target working scene at the steady-state temperature is obtained, and the total power consumption comprises electric leakage power consumption and dynamic power consumption when the heat sources work.

Description

Technical Field

[0001] This application relates to the field of data processing technology, and more specifically to a method, apparatus and electronic device for determining power consumption. Background Technology

[0002] With the development of integrated circuits, the proportion of chip leakage power in total power consumption has increased significantly, especially at advanced process nodes, where leakage power has become a key factor affecting chip thermal design and power management. Leakage power exhibits a strong temperature dependence, increasing exponentially with increasing junction temperature, and this increase in power consumption, in turn, leads to a rise in temperature. Leakage power refers to the power consumption generated when the chip is in an inactive state (such as standby or shutdown mode) due to the leakage characteristics of the transistor. Junction temperature refers to the temperature of the PN junction (a basic structure in semiconductor devices, such as the emitter junction and collector junction of a transistor) inside a semiconductor chip.

[0003] In the thermal design phase of electronic devices (such as mobile terminals and servers), engineers need to accurately obtain power consumption data of chips under different operating scenarios, including dynamic power consumption and leakage power consumption, in order to design a reasonable heat dissipation scheme. However, due to the interdependence between leakage power consumption and junction temperature, and the difficulty of accurately determining the steady-state temperature under actual operating conditions using relevant methods, leakage power consumption is also inaccurate, ultimately leading to deviations in the thermal design and affecting the reliability and performance of electronic devices. Summary of the Invention

[0004] In view of the above, this application provides the following technical solution:

[0005] A method for determining power consumption, comprising:

[0006] Obtain a thermal resistance model, which includes the thermal resistance parameters of each heat source on the heat dissipation path of the electronic device, and characterizes the thermal coupling relationship between each heat source.

[0007] Based on the correspondence between the leakage power consumption and temperature of each heat source in the target working scenario, the preset leakage power consumption of each heat source at the preset temperature value is determined.

[0008] Based on the preset leakage power consumption and the thermal resistance model, the leakage temperature corresponding to each heat source is calculated.

[0009] In response to continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value, until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition, the current leakage temperature is determined to be the steady-state temperature.

[0010] Based on the operating parameters of each heat source corresponding to the target working scenario, the total power consumption of each heat source under the target working scenario at the steady-state temperature is obtained. The total power consumption includes the leakage power consumption and the dynamic power consumption of the heat source when it is working.

[0011] Optionally, calculating the leakage temperature corresponding to each heat source based on the preset leakage power consumption and the thermal resistance model includes:

[0012] Based on the operating parameters of each heat source corresponding to the target working scenario, determine the dynamic power consumption of each heat source at the preset temperature value.

[0013] Based on the dynamic power consumption and the preset leakage power consumption, the current total power consumption of each heat source is determined;

[0014] Based on the thermal resistance model and the current total power consumption, the temperature rise parameters of each heat source are determined;

[0015] Based on the temperature rise parameter and the preset temperature value, the leakage temperature of each heat source is determined.

[0016] Optionally, the step of continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value satisfies the temperature difference condition includes:

[0017] In each iteration of adjusting the preset temperature value, the leakage temperature calculated in the previous iteration is used as the preset temperature value for the next iteration.

[0018] The steps of determining the preset leakage power consumption of each heat source at a preset temperature value and calculating the leakage temperature corresponding to each heat source are re-executed.

[0019] The difference between the current leakage temperature and the current preset temperature value is calculated.

[0020] When the difference satisfies the temperature difference condition, the iterative process is terminated.

[0021] Optionally, the step of continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value satisfies the temperature difference condition includes:

[0022] In each iterative process of adjusting the preset temperature value, the difference between the current leakage temperature and the preset temperature value is calculated.

[0023] Based on the difference, determine the adjustment direction and adjustment range of the preset temperature value;

[0024] The preset temperature value is updated based on the adjustment direction and the adjustment range.

[0025] Based on the updated preset temperature value, the steps of determining the preset leakage power consumption of each heat source at the preset temperature value and calculating the leakage temperature corresponding to each heat source are re-executed.

[0026] The difference between the current leakage temperature and the current preset temperature value is calculated.

[0027] When the difference satisfies the temperature difference condition, the iterative process is terminated.

[0028] Optionally, obtaining the total power consumption of each heat source in the target working scenario at the steady-state temperature based on the operating parameters of each heat source corresponding to the target working scenario includes:

[0029] Based on the target working scenario, determine the working mode of each of the heat sources;

[0030] Based on the operating mode of each heat source, determine the operating parameters of each heat source;

[0031] Based on the operating parameters of each heat source, determine the dynamic power consumption of each heat source when it operates at the steady-state temperature;

[0032] Based on the leakage power consumption of each heat source at the steady-state temperature and the dynamic power consumption, the total power consumption of each heat source at the steady-state temperature under the target working scenario is obtained.

[0033] Optionally, it also includes:

[0034] Based on the steady-state temperature and the leakage current power consumption of each heat source at the steady-state temperature, a temperature and leakage current power consumption record table is generated.

[0035] In response to a target query request, a query is performed in the temperature and leakage power consumption record table to obtain the target leakage power consumption corresponding to the target query request; the target query request represents the target steady-state temperature value to be queried.

[0036] Optionally, it also includes:

[0037] Based on the total power consumption of each heat source under the target working scenario at the steady-state temperature, the thermal design power consumption of the electronic device is determined.

[0038] Based on the thermal design power, a heat dissipation scheme for the electronic device is generated.

[0039] Optionally, generating a heat dissipation scheme for the electronic device based on the thermal design power includes:

[0040] Based on the thermal design power and the steady-state temperature, the heat dissipation requirements of each heat source are determined.

[0041] Based on the correlation between the heat sources in the thermal resistance model and the heat dissipation requirements of each heat source, a heat dissipation scheme for the electronic device is determined.

[0042] A power consumption determination device, comprising:

[0043] The first acquisition unit is used to acquire a thermal resistance model, which includes thermal resistance parameters of each heat source on the heat dissipation path of the electronic device, and characterizes the thermal coupling relationship between each heat source.

[0044] The first determining unit is used to determine the preset leakage power consumption of each heat source at a preset temperature value based on the correspondence between the leakage power consumption of each heat source and the temperature under the target working scenario.

[0045] The calculation unit is used to calculate the leakage temperature corresponding to each of the heat sources based on the preset leakage power consumption and the thermal resistance model;

[0046] The second determining unit is used to respond to continuously adjusting the preset temperature value and calculate the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition, and to determine the current leakage temperature as a steady state temperature.

[0047] The second acquisition unit is used to obtain the total power consumption of each heat source under the target working scenario at the steady-state temperature based on the working parameters of each heat source corresponding to the target working scenario. The total power consumption includes the leakage power consumption and the dynamic power consumption of the heat source when it is working.

[0048] An electronic device, comprising:

[0049] Heat source module, the heat source module including at least one heat source;

[0050] The memory is used to store computer programs and thermal resistance models, which include thermal resistance parameters of each heat source on the heat dissipation path of the electronic device, and characterize the thermal coupling relationship between the heat sources.

[0051] A processor for executing the computer program to achieve:

[0052] Obtain a thermal resistance model, which includes the thermal resistance parameters of each heat source along the heat dissipation path of the electronic device;

[0053] Based on the correspondence between the leakage power consumption and temperature of each heat source in the target working scenario, the preset leakage power consumption of each heat source at the preset temperature value is determined.

[0054] Based on the preset leakage power consumption and the thermal resistance model, the leakage temperature corresponding to each heat source is calculated.

[0055] In response to continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value, until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition, the current leakage temperature is determined to be the steady-state temperature.

[0056] Based on the operating parameters of each heat source corresponding to the target working scenario, the total power consumption of each heat source under the target working scenario at the steady-state temperature is obtained. The total power consumption includes the leakage power consumption and the dynamic power consumption of the heat source when it is working. Attached Figure Description

[0057] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0058] Figure 1 A flowchart illustrating a power consumption determination method provided in an embodiment of this application;

[0059] Figure 2 This is a flowchart illustrating an application scenario provided in an embodiment of this application.

[0060] Figure 3 This is a schematic diagram of the structure of a power consumption determination device provided in an embodiment of this application;

[0061] Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0062] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0063] The terms "first" and "second," etc., used in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units may include steps or units not listed, but may include steps or units not listed.

[0064] This application provides a power consumption determination method, apparatus, and electronic device. The power consumption determination method is applicable to the heat dissipation design and power consumption assessment of electronic devices such as smartphones, laptops, desktop computers, and chip processing systems in complex working scenarios (such as gaming and video processing). This method establishes a thermal resistance model including the thermal resistance parameters of each heat source and combines this with the correspondence between leakage power consumption and temperature under the target working scenario. Starting from a preset temperature value, it iteratively calculates the leakage temperature until the difference between the leakage temperature and the preset temperature value satisfies the temperature difference condition, thereby determining the steady-state temperature. Finally, based on this steady-state temperature and corresponding operating parameters, the total power consumption of each heat source, including leakage power consumption and dynamic power consumption, is obtained. This method effectively solves the problem of inaccurate power consumption estimation in traditional heat dissipation design caused by the interdependence between leakage power consumption and junction temperature, improving the rationality of thermal design power consumption data and the reliability of the overall heat dissipation scheme, thereby optimizing heat dissipation costs and structural design while ensuring stable device performance.

[0065] See Figure 1 The diagram illustrates a power consumption determination method provided in an embodiment of this application. The method may include the following steps:

[0066] S101. Obtain the thermal resistance model.

[0067] A thermal resistance model includes the thermal resistance parameters of each heat source along the heat dissipation path of an electronic device, characterizing the thermal coupling relationship between these heat sources. In other words, this thermal resistance model quantifies the impact of one heat source's heat generation on the temperature of other heat sources, thus constructing a holistic thermal network relationship that reflects the mutual heat transfer between heat sources and their shared determination of the final temperature distribution. Here, a heat source refers to a component in the electronic device that generates heat, such as a central processing unit (CPU), graphics processing unit (GPU), neural network processor (NPU), or chip package. The heat dissipation path characterizes the path through which heat is transferred from the heat source to the outside of the electronic device. Components along the heat dissipation path include the device casing, screen, and cover. The thermal resistance parameter value represents a quantitative indicator of the resistance encountered by heat as it is conducted from the point of generation (heat source, such as the CPU chip junction) to the point of dissipation (environment, such as air). Its basic unit is °C / W (or K / W), indicating how many degrees Celsius of temperature rise is caused by each watt of power. The higher the thermal resistance value, the more difficult the heat dissipation.

[0068] The thermal resistance model can be pre-generated based on the heat source structure of the electronic device. Specifically, the hardware structure of the electronic device is analyzed to determine the installation location of each heat source, the chip packaging form, and the board-level layout. The heat dissipation path corresponding to each heat source is identified. For example, the heat dissipation path of the CPU is: CPU to chip package, then to cover plate, and finally transferred to the external environment. Secondly, thermal resistance data between different components and heat sources on each heat dissipation path is collected through whole-machine thermal simulation testing, real-world environment testing, or hardware structure thermal resistance derivation. For example, in the handheld scenario of a smartphone, the thermal resistance parameter between the CPU and cover_AI (a special cover plate for handheld scenarios) is 1.2, and the thermal resistance parameter between the GPU and cover_AI is 1.2, etc., obtained through thermal simulation testing. Finally, the collected thermal resistance data is integrated and verified to form a thermal resistance model (also called a thermal matrix) containing the thermal resistance parameters of each heat source and its corresponding heat dissipation path. After obtaining the thermal resistance model, it can be stored in the storage area of ​​the electronic device and retrieved from the storage area when needed later.

[0069] Table 1 shows the thermal resistance parameters of various heat sources (CPU, GPU, NPU, Chip, and the overall system SYS) in an electronic device (e.g., a smartphone). The unit of thermal resistance is °C / W, representing the temperature rise per watt of heat power along that path. This thermal resistance parameter does not merely reflect the heat dissipation resistance of a single heat source in isolation, but fully considers the heat transfer coupling effect of the heat sources arranged close together within the device, including the mutual influence of conduction, radiation, and convection heat transfer between heat sources. All thermal resistance data are extracted based on the actual hardware structure, component layout, and heat dissipation path design of the electronic device, ensuring that the thermal resistance parameter accurately reflects the collaborative thermal behavior of each heat source in the overall system's heat dissipation.

[0070] Table 1

[0071]

[0072] In Table 1, rows represent the thermal boundaries through which heat is transferred, and columns represent the heat sources that generate heat. The value in each cell represents the thermal resistance generated when heat is transferred from a specific heat source to a specific thermal boundary. Specifically, cover_A (non-handheld) represents the area of ​​the device's back cover or casing not covered by the user's hand. For example, the CPU thermal resistance parameter corresponding to cover_A is 1.6℃ / W, meaning that for every 1 watt of heat generated by the CPU transferred to the non-handheld area of ​​the back cover, the temperature of that area will rise by 1.6℃. The values ​​in other similar cells in Table 1 are represented similarly and will not be detailed here. cover_AI (handheld) represents the area of ​​the device's back cover or casing that may be covered by the user's hand. cover_glass (glass cover) represents the glass cover on the device (such as back panel glass or camera decorative glass). screen and screen_hand (handheld screen) represent the entire display screen and the screen area obscured by the hand, respectively. In the last four rows of Table 1 (with row headings for CPU, GPU, NPU, and Chip), the value of 3.3 ℃ / W in the CPU column corresponding to the CPU row represents the thermal resistance of the CPU itself due to heat generation. The value of 2.5 ℃ / W in the GPU column corresponding to the CPU row represents the thermal coupling coefficient of the GPU's heat generation on the CPU temperature. That is, for every 1 watt of heat generated by the GPU, the CPU temperature rises by 2.5 ℃. Similarly, the values ​​in the CPU column corresponding to the NPU and Chip rows represent the impact of NPU and Chip heat generation on the CPU temperature, respectively.

[0073] In this embodiment, the thermal resistance model is built based on the hardware characteristics of the electronic device itself, replacing the competitor data relied upon in the general processing mode. This ensures that the thermal resistance parameters match the actual heat dissipation capacity of the device, providing accurate basic data for subsequent power consumption and temperature calculations, and reducing calculation deviations from the data source.

[0074] S102. Based on the correspondence between the leakage power consumption of each heat source and the temperature under the target working scenario, determine the preset leakage power consumption of each heat source at the preset temperature value.

[0075] The target operating scenario refers to the actual usage scenario of the electronic device, or the scenario to be tested in the thermal design, such as scenarios for handheld use, non-handheld use, high-load operation (e.g., gaming, video rendering), and standby scenarios. Leakage power consumption refers to the power consumption of the chip in a non-operating state (e.g., standby) or operating state due to the physical characteristics of semiconductor devices (e.g., transistor leakage current). Its value varies with temperature; the higher the temperature, the greater the leakage power consumption. The preset temperature value refers to the initially assumed temperature data used to initiate the initial leakage power consumption calculation.

[0076] For the target operating scenario (such as mobile game operation), temperature gradient tests are conducted on each heat source. Leakage power consumption data for each heat source is collected using professional testing equipment at multiple different temperature points (e.g., 25℃, 30℃, 35℃, 40℃, 45℃, 50℃, etc.). Next, based on the collected temperature and leakage power consumption data, a correlation relationship (such as a correlation curve or data model) between leakage power consumption and temperature for each heat source in the target operating scenario is established through curve fitting and trend analysis. Then, according to actual calculation requirements, an initial preset temperature value (e.g., 50℃) is set. This preset temperature value is substituted into the aforementioned correlation relationship to query or calculate the preset leakage power consumption of each heat source at that temperature.

[0077] Table 2 shows the relationship between leakage power consumption and temperature for various heat sources in an electronic device. In Table 2, the "temp" row represents a preset temperature point (unit: °C), and the rows below it correspond to the leakage power consumption values ​​(unit: W) of different heat sources at that temperature. For example, at 85 °C, the CPU's leakage power consumption is 4.641 W, and the GPU's is 2.322 W. This table clearly illustrates the relationship between leakage power consumption and temperature. By consulting this table (or interpolating its data), the initial leakage power consumption values ​​for each heat source at any preset temperature can be quickly obtained, thus driving the subsequent thermal resistance model calculation and iterative convergence process. Alternatively, the data in this table can be used to obtain the correlation curves between leakage power consumption and temperature for each heat source through curve fitting, thereby characterizing the relationship between leakage power consumption and temperature for each heat source.

[0078] Table 2

[0079]

[0080] In this embodiment, by establishing the correlation between leakage power consumption and temperature for each heat source, the calculation of leakage power consumption is ensured to better match the target working scenario and heat source characteristics, thus resolving deviations caused by calculation. The preset temperature value is the initial value for iterative calculation, providing a calculation basis for determining the subsequent steady-state temperature.

[0081] S103. Based on the preset leakage power consumption and thermal resistance model, calculate the leakage temperature corresponding to each heat source.

[0082] Leakage temperature refers to the actual temperature of the heat source calculated based on a preset leakage power consumption and thermal resistance model. It reflects the actual temperature of the heat source after heat transfer through the heat dissipation path under the current preset leakage power consumption, and is a key parameter for judging whether the temperature is stable. Specifically, the dynamic power consumption of each heat source can be determined by combining the characteristics of the target working scenario, that is, the power consumption generated by the heat source due to running tasks, such as the computational power consumption of the CPU when running a game. The preset leakage power consumption of each heat source is superimposed with the dynamic power consumption to obtain the current total power consumption. Then, the thermal resistance parameters corresponding to each heat source under the target working scenario are extracted from the thermal resistance model. Based on the principle of heat conduction, the temperature rise parameter of each heat source (i.e., the temperature rise during heat transfer) is obtained by calculating the correlation between the total power consumption and the thermal resistance parameter. The preset temperature value is superimposed with the temperature rise parameter to obtain the leakage temperature corresponding to each heat source. Through the combined calculation of total power consumption and thermal resistance model, a precise mapping from power consumption to temperature is achieved, so that the leakage temperature can reflect the actual heating state of the heat source and provide a reliable calculation basis for subsequent iterative adjustments.

[0083] S104. In response to continuously adjusting the preset temperature value, and calculating the leakage temperature corresponding to the current preset temperature value, until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition, the current leakage temperature is determined to be the steady-state temperature.

[0084] In this process, iterative adjustment refers to continuously updating the preset temperature value through multiple loops, gradually bringing the leakage current temperature closer to the preset temperature value. The temperature difference condition refers to a preset threshold for determining whether the temperature is stable; that is, when the absolute value of the difference between the leakage current temperature and the preset temperature value is less than or equal to this threshold, the temperature is considered to have reached a stable state. The steady-state temperature refers to the value after the temperature has stabilized, at which point the leakage power consumption and temperature have an optimal matching relationship, and it is the main basis for calculating the total power consumption.

[0085] The absolute value of the difference between the current leakage temperature and the preset temperature value can be calculated; it can be determined whether the difference meets the temperature difference condition (e.g., the absolute value of the difference ≤ 0.5℃); if it does not meet the condition, the preset temperature value is adjusted (the adjustment method can be to directly use the previous leakage temperature as the next preset temperature value, or to determine the adjustment direction and magnitude based on the difference); then, based on the adjusted preset temperature value, steps S102 (determine the new preset leakage power consumption) and S103 (calculate the new leakage temperature) are executed again. The above cycle is repeated until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition, at which point the leakage temperature is the steady-state temperature.

[0086] By using an iterative convergence algorithm, the deviation between the preset temperature value and the leakage current temperature is dynamically corrected, ensuring that the steady-state temperature can accurately match the actual heating state of the heat source, avoiding deviations caused by fixed temperature calculations, and providing a guarantee for the accurate calculation of total power consumption.

[0087] S105. Based on the operating parameters of each heat source corresponding to the target working scenario, obtain the total power consumption of each heat source under the target working scenario at steady-state temperature.

[0088] The operating parameters of a heat source refer to its operational status parameters under the target working scenario, including operating load, task type, operating frequency, and operating duration. Dynamic power consumption refers to the power consumption generated by the heat source during tasks such as calculation and data processing under the operating parameters, and is positively correlated with the operating parameters. Total power consumption includes leakage current and dynamic power consumption during heat source operation, and is the main basis for the heat dissipation design of electronic devices.

[0089] For example, the operating parameters of each heat source in the target working scenario are collected. For instance, in a gaming scenario, the CPU operates at 80% load and a frequency of 2.8GHz, while the GPU operates at 90% load and a frequency of 1.8GHz. Based on these operating parameters, the dynamic power consumption of each heat source at steady-state temperature is determined through methods such as load-dynamic power consumption mapping table lookup, power consumption fitting formula calculation, or actual machine testing and calibration. Then, the leakage power consumption of each heat source at steady-state temperature is obtained. Finally, the dynamic power consumption of each heat source is superimposed with its corresponding leakage power consumption to obtain the total power consumption of each heat source. Summarizing the total power consumption of all heat sources yields the total power consumption of the electronic device in the target working scenario.

[0090] The total power consumption is calculated based on steady-state temperature and operating parameters, enabling the total power consumption data to accurately reflect the actual heat generation of electronic devices under target operating scenarios. This provides precise data support for heat dissipation architecture design, thermal simulation, and thermal approval, increasing the probability of products passing thermal approval.

[0091] This application provides a power consumption determination method to obtain a thermal resistance model characterizing the thermal resistance parameters of each heat source along the heat dissipation path of an electronic device. Based on the relationship between leakage power consumption and temperature of each heat source in a target scenario, iterative calculations are performed starting from a preset temperature value. First, the leakage power consumption at the preset temperature is determined, and the leakage temperature is calculated by combining the thermal resistance model. Then, the preset temperature value is continuously adjusted and recalculated until the difference between the leakage temperature and the preset temperature value meets the convergence condition, thereby determining the steady-state temperature that matches the actual thermal state. Finally, based on the steady-state temperature and the operating parameters in the target scenario, the total power consumption of each heat source, including accurate leakage power consumption and dynamic power consumption, is obtained. This application solves the problem of cyclic dependence between leakage power consumption and junction temperature through systematic iterative solution, providing accurate and reliable power consumption input data for the heat dissipation design stage, and solving the problem of over- or under-heat dissipation design caused by power consumption estimation deviation, thereby improving the thermal reliability, performance stability, and design economy of electronic devices.

[0092] The implementation of the power consumption determination method according to the embodiments of this application will be described below.

[0093] In this embodiment, the preset leakage power consumption is determined based on the correspondence between leakage power consumption and temperature, which can be achieved through various methods such as table lookup, interpolation, or calculation based on characteristic curves. To improve calculation accuracy, it can be calculated jointly by combining the scene's dynamic power consumption and the thermal resistance model. Correspondingly, in one embodiment, the process of calculating the leakage temperature corresponding to each heat source based on the preset leakage power consumption and the thermal resistance model includes: determining the dynamic power consumption of each heat source at a preset temperature value based on the operating parameters of each heat source corresponding to the target working scene; determining the current total power consumption of each heat source based on the dynamic power consumption and the preset leakage power consumption; determining the temperature rise parameter of each heat source based on the thermal resistance model and the current total power consumption; and determining the leakage temperature of each heat source based on the temperature rise parameter and the preset temperature value.

[0094] Operating parameters are core parameters characterizing the operating state of a heat source. These parameters vary significantly across different target operating scenarios (e.g., low load in standby scenarios versus high load in gaming scenarios). Dynamic power consumption is related to both operating parameters and preset temperature values. Increased temperature leads to changes in device resistance, thus affecting dynamic power consumption; therefore, specific calculations are required at preset temperature values. Specifically, operating parameters for each heat source are collected under the target operating scenario. For example, in server data processing scenarios, CPU operating parameters include operating load (e.g., 90%), task type (data processing), and operating frequency (3.0GHz). In smartphone gaming scenarios, GPU operating parameters include rendering load (e.g., 95%) and screen resolution (1080P). Based on preset temperature values, a mapping relationship (e.g., mapping table or fitting formula) between operating parameters, temperature, and dynamic power consumption is established through experimental testing. The collected operating parameters and preset temperature values ​​are substituted into the mapping relationship to query or calculate the dynamic power consumption of each heat source at that preset temperature value. Then, the current preset leakage power consumption of each heat source is summed with this dynamic power consumption to obtain the total power consumption of each heat source. For electronic devices with multiple heat sources, the current total power consumption of each heat source can be calculated separately, or the total power consumption of the whole device can be obtained by summing them up (for calculating the temperature rise of the whole device).

[0095] The temperature rise parameter refers to the temperature increase of a heat source as it transfers heat through the heat dissipation path under the current total power consumption. It is positively correlated with the current total power consumption and the thermal resistance parameter (the higher the thermal resistance, the slower the heat transfer and the higher the temperature rise), serving as an intermediate parameter connecting total power consumption and temperature. The specific thermal resistance parameter corresponding to the current heat source in the target working scenario is extracted from the thermal resistance model (e.g., the thermal resistance parameter 1.2 for the CPU and cover_AI in a handheld scenario). Based on the basic principles of heat transfer, for example, the relationship between temperature rise, power consumption, and thermal resistance during heat transfer is: Temperature rise = Total power consumption × Thermal resistance. Finally, the current total power consumption and the corresponding thermal resistance parameter are substituted into the above relationship to calculate the temperature rise parameter of the current heat source. The leakage temperature corresponding to each heat source is calculated based on the preset temperature value and this temperature rise parameter. For heat sources with multiple heat dissipation paths, the average temperature rise parameter of each path needs to be calculated and then superimposed. This embodiment clarifies the calculation logic and correlation of each intermediate parameter by refining the calculation steps of the leakage temperature, thus reducing the implementation difficulty of this step. Dynamic power consumption is determined based on operating parameters and preset temperature values, ensuring the accuracy of total power consumption.

[0096] In some embodiments of this application, in response to continuously adjusting a preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value satisfies the temperature difference condition, the process includes: in each iteration of adjusting the preset temperature value, using the leakage temperature calculated in the previous iteration as the preset temperature value for the next iteration; re-executing the steps of determining the preset leakage power consumption of each heat source at the preset temperature value and calculating the leakage temperature corresponding to each heat source; calculating the difference between the current leakage temperature and the current preset temperature value; and exiting the iteration process when the difference satisfies the temperature difference condition.

[0097] Iterative processing refers to the process of repeatedly executing preset temperature value setting, leakage power consumption determination, leakage temperature calculation, and difference judgment. In this implementation, the leakage temperature from the previous iteration can be directly used when adjusting the preset temperature value, which can improve adjustment efficiency. For example, the leakage temperature of each heat source calculated in the previous iteration is recorded (e.g., the CPU leakage temperature is 53.582℃ after the first iteration). This leakage temperature is directly used as the preset temperature value for the next iteration (i.e., the next preset temperature value is set to 53.582℃). For multiple heat sources, the average value of the leakage temperature of each heat source can be used as the preset temperature value of the whole machine, or each heat source can be iterated independently.

[0098] Then, based on the updated preset temperature value (e.g., 56.885℃), the correspondence between leakage power consumption and temperature for each heat source is re-queried to obtain a new preset leakage power consumption (e.g., the leakage power consumption of the CPU at 56.885℃ is 1.583W). Dynamic power consumption, current total power consumption, and temperature rise parameters are then calculated to finally obtain a new leakage temperature (e.g., the new leakage temperature of the CPU is 55.2℃). For each iteration, the absolute value of the difference between the new leakage temperature and the current preset temperature value is calculated. For multiple heat sources, the average value of the difference for each heat source can be calculated as the iteration judgment index for the entire system. The calculated difference is compared with a preset temperature difference condition (e.g., ≤0.5℃). If the difference is less than or equal to this threshold, the iteration is considered converged, and the iteration process is exited; if the difference is greater than this threshold, the preset temperature value is updated, and the next iteration continues. In this implementation, when the condition for exiting the iteration is not met, the previous leakage temperature is used as the next preset temperature value, simplifying the iteration process and improving iteration efficiency.

[0099] To more intuitively demonstrate the iterative convergence determination process, in this embodiment, the calculation results at different preset temperatures (e.g., 65℃ and 50℃) can be obtained and compared with the reference temperature calculated based on the leakage power consumption and temperature curve. As shown in Table 3:

[0100] Table 3

[0101]

[0102] Table 3 illustrates the specific process of determining iterative convergence by comparing the calculation results at different preset temperatures with the reference temperature. The reference temperature column characterizes the reference temperature distribution of each heat source and heat dissipation node calculated based on pre-determined power consumption data under the target operating scenario (this power consumption data is estimated from the leakage power consumption-temperature characteristic curve) and input into the thermal resistance model. This column provides a benchmark for determining iterative convergence. The columns corresponding to 65℃ and 50℃ respectively represent the predicted temperature distribution of each node calculated using the power consumption determination method (i.e., querying leakage power consumption based on the preset temperature, combining it with dynamic power consumption to obtain the total power consumption, and then inputting it into the thermal resistance model) when the preset temperature value (i.e., the assumed chip junction temperature in the iteration) is 65℃ and 50℃. The temperature difference column in Table 3 represents the difference between the predicted temperature and the reference temperature (i.e., the difference between the reference temperature and the calculated temperature). This difference intuitively reflects the rationality of the current preset temperature value. As shown in Table 3, when the preset temperature is 65℃, the difference (ΔT) between the calculated temperature and the reference temperature at each node is large (e.g., -3.336℃ for the Chip node), indicating non-convergence. However, when the preset temperature is adjusted to 50℃, the ΔT at each node decreases significantly (all less than 1℃, e.g., -0.656℃ for the Chip node). If the preset convergence threshold (i.e., the temperature difference condition) is 0.5℃, it can be determined that under an input of 50℃, the calculated temperature is basically consistent with the temperature expected based on the leakage current curve, satisfying the convergence condition. Therefore, 50℃ (or a more accurate neighboring value after further iteration) can be determined as the steady-state temperature. The data in this table intuitively verifies the effectiveness of iteratively adjusting the preset temperature value until the temperature difference condition is met.

[0103] In another embodiment of this application, in response to continuously adjusting a preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value satisfies the temperature difference condition, the process includes: in each iteration of adjusting the preset temperature value, calculating the difference between the current leakage temperature and the preset temperature value; determining the adjustment direction and adjustment range of the preset temperature value based on the difference; updating the preset temperature value according to the adjustment direction and adjustment range; re-executing the steps of determining the preset leakage power consumption of each heat source at the preset temperature value and calculating the leakage temperature corresponding to each heat source based on the updated preset temperature value; calculating the difference between the current leakage temperature and the current preset temperature value; and exiting the iteration process when the difference satisfies the temperature difference condition.

[0104] In this implementation, the calculated temperature difference between the current leakage temperature and the preset temperature value is used not only to determine whether to exit the iterative process, but also to determine the adjustment direction and magnitude for the preset temperature value. For example, the adjustment direction is represented by the sign of the difference (a positive difference indicates that the leakage temperature is higher than the preset temperature value, and a negative difference indicates that it is lower), and the adjustment magnitude is represented by the absolute value of the difference (the larger the absolute value, the larger the adjustment magnitude). The adjustment direction refers to the increase or decrease of the preset temperature value, determined by the sign of the difference. The adjustment magnitude refers to the amount of change in the preset temperature value, determined by factors such as the absolute value of the difference and the thermal performance requirements of the equipment, and can be a fixed magnitude, a gradient magnitude, or an adaptive magnitude.

[0105] For example, the difference between the CPU's current leakage temperature and the preset temperature value is 3.582℃ (positive). The adjustment direction is to increase the preset temperature value. The absolute value of this difference is > 3℃, and the adjustment range is 2℃. The difference for the GPU is 1.609℃ (positive). The adjustment direction is to increase the preset temperature value. The absolute value of this difference is between 1℃ and 3℃, and the adjustment range is 1℃. The average of the adjustment ranges for each heat source is taken, and the overall adjustment range for the system is determined to be 1.5℃. Then, if the adjustment direction is "increase", the new preset temperature value = current preset temperature value + adjustment range; if the adjustment direction is "decrease", the new preset temperature value = current preset temperature value - adjustment range. Based on the updated preset temperature value, the process of calculating the preset leakage power consumption and the corresponding leakage temperature is re-executed to further calculate the difference after this iteration and determine whether the difference meets the temperature difference condition. For example, after multiple iterations, the updated preset temperature value is 47℃, and the new leakage temperature is 47.119℃. The difference is 0.119℃, which is less than the preset temperature difference of 0.5℃, thus meeting the temperature difference condition, and the iteration process is terminated. In this embodiment, by calculating the magnitude and direction of the difference, the adjustment direction and magnitude of the preset temperature value are determined, making the iteration process more targeted and the convergence speed faster.

[0106] In some embodiments of this application, the total power consumption of each heat source under the target working scenario at steady-state temperature is obtained based on the working parameters of each heat source corresponding to the target working scenario. This includes: determining the working mode of each heat source based on the target working scenario; determining the working parameters of each heat source based on the working mode of each heat source; determining the dynamic power consumption of each heat source when operating at steady-state temperature based on the working parameters of each heat source; and obtaining the total power consumption of each heat source under the target working scenario at steady-state temperature based on the leakage power consumption and dynamic power consumption of each heat source at steady-state temperature.

[0107] In this implementation, the operating mode refers to the running state mode of the heat source under the target working scenario, which is determined by the scenario requirements. Different operating modes correspond to different operating parameters. For example, the high-performance operating mode of a CPU corresponds to high load and high frequency, while the energy-saving mode corresponds to low load and low frequency. The operating parameters are specific quantitative indicators of the operating mode. Different operating modes correspond to fixed or range-based operating parameters, which can be determined through the hardware configuration of the device and scenario test data. For example, for the operating mode of each heat source, the typical operating parameter range of that mode can be queried. For example, the operating parameter range of the CPU high-performance mode is 70%-90% load and 2.5GHz-3.0GHz frequency. The actual operating parameters of each heat source under the target working scenario can also be collected through actual machine testing. For example, during game operation, the actual load of the CPU is 80% and the frequency is 2.8GHz, and the actual load of the GPU is 90% and the frequency is 1.8GHz, which can be monitored by professional tools. Finally, the final operating parameters of each heat source are determined based on the measured data. If no measured data is available, the intermediate value of the typical parameter range can be used.

[0108] To improve processing efficiency, a correlation model between operating parameters, steady-state temperature, and dynamic power consumption can be pre-built. This model can be constructed through experimental testing, such as conducting dynamic power consumption tests on different combinations of operating parameters for each heat source at different steady-state temperatures, collecting multiple sets of data, and forming a model through curve fitting. Then, the operating parameters and steady-state temperature of each heat source are substituted into the correlation model to calculate the dynamic power consumption. Finally, the rationality of the dynamic power consumption is verified. If the dynamic power consumption exceeds the typical range of this operating mode, the operating parameters or correlation model need to be re-examined. The dynamic power consumption and leakage power consumption of each heat source are calculated and determined as the total power consumption of that heat source. Furthermore, the total power consumption of all heat sources can be summarized to obtain the total power consumption of the electronic device under the target operating scenario. In this embodiment, combining steady-state temperature to calculate dynamic power consumption and leakage power consumption improves the accuracy of the total power consumption data.

[0109] In some embodiments of this application, the method further includes: generating a temperature and leakage power consumption record table based on the steady-state temperature and the leakage power consumption of each heat source at the steady-state temperature; and querying the temperature and leakage power consumption record table in response to a target query request to obtain the target leakage power consumption corresponding to the target query request, wherein the target query request represents the target steady-state temperature value to be queried.

[0110] The temperature and leakage power consumption record table is a structured data table that records steady-state temperature and corresponding leakage power consumption. For example, it can include key information such as device model, target working scenario, heat source type, steady-state temperature, and leakage power consumption, which is convenient for querying and management. See Table 4 for example.

[0111] Table 4

[0112]

[0113] It should be noted that Table 4 above only shows one form of the record table. The specific types of fields to be recorded and the relevant parameters to be obtained can be determined according to the actual application requirements. For example, the obtained steady-state temperature and leakage power consumption can be filled into this table based on the data obtained from actual processing. In this way, the generated record table can record the steady-state temperature and leakage power consumption in a structured manner, which is convenient for subsequent querying and reuse, avoids repeated iterative calculations in similar scenarios, and improves work efficiency.

[0114] A target query request is a user-initiated request to query leakage power consumption, including query conditions such as device model, target operating scenario, heat source type, and target steady-state temperature. The target leakage power consumption is the leakage power consumption data obtained that matches the target query request. For example, upon receiving a user-initiated target query request, the system parses the query conditions (e.g., device model Model1, target operating scenario: handheld device gaming, heat source type: CPU, target steady-state temperature: 47℃). In the temperature and leakage power consumption record table, it performs exact matching or fuzzy searching based on the query conditions (e.g., if the target steady-state temperature is 46℃, it can query the leakage power consumption at a similar temperature of 47℃ and interpolate appropriately). Finally, the retrieved leakage power consumption data is returned to the user as the basis for subsequent calculations. This reuse of existing data significantly reduces the workload of repetitive calculations and improves the efficiency of power consumption determination.

[0115] In this embodiment, after obtaining the total power consumption of the electronic device at steady-state temperature, the heat dissipation design of the electronic device can be further performed. Correspondingly, in some embodiments, the method further includes: determining the thermal design power consumption of the electronic device based on the total power consumption of each heat source under the target operating scenario at steady-state temperature; and generating a heat dissipation scheme for the electronic device based on the thermal design power consumption.

[0116] Thermal Design Power (TDP) is a key indicator in the thermal design of electronic devices. It refers to the maximum power generated by the device under stable operating conditions and serves as the basis for thermal design schemes. It is typically determined based on the total power consumption at steady-state temperature, with a certain amount of redundancy considered. For example, if the total power consumption of an electronic device is calculated to be 7W and the preset redundancy factor is 1.2, then the TDP is 8.4W. Based on the TDP, a thermal design scheme is then determined. This scheme refers to the design approach developed to meet the thermal design power requirements, including the selection of cooling methods (such as passive cooling or active cooling), the selection of cooling components (such as heat sinks, cooling fans, and thermally conductive materials), and the optimization of heat dissipation paths.

[0117] Based on thermal design power (TDP) and structural constraints of electronic devices (such as size, weight, and cost), appropriate heat dissipation methods are selected. For example, low-power devices (TDP < 5W) can use passive cooling (such as heat sinks + thermal grease), while high-power devices (TDP > 10W) ​​can use active cooling (such as cooling fans + heat pipes). According to the total power consumption of each heat source, heat dissipation components are configured accordingly. For example, the CPU, with its high total power consumption (2.985W), uses a large heat sink, while the GPU (1.341W) uses a medium-sized heat sink. Finally, the heat dissipation path can be optimized to ensure that heat can be quickly transferred from the heat source to the external environment, such as adjusting the installation position of heat dissipation components to reduce thermal resistance. This embodiment achieves a closed loop of power consumption calculation and heat dissipation design by deriving the TDP and generating a heat dissipation scheme, enhancing the engineering application value of the method. The accurate determination of the TDP based on the total power consumption ensures the reliability of the heat dissipation scheme, and the targeted selection of heat dissipation methods and component configuration improves heat dissipation efficiency and reduces heat dissipation costs.

[0118] Furthermore, in the embodiments of this application, the process of generating a heat dissipation scheme for an electronic device based on thermal design power includes: determining the heat dissipation requirements of each heat source based on thermal design power and steady-state temperature; and determining the heat dissipation scheme for the electronic device based on the correlation between each heat source in the thermal resistance model and the heat dissipation requirements of each heat source.

[0119] The heat dissipation requirement refers to the heat dissipation power and efficiency required for each heat source to maintain a steady-state temperature and avoid overheating. It is determined by the total heat dissipation power of each heat source in the thermal design power (TDP) and the difference between the steady-state temperature and the ambient temperature. The partial TDP of each heat source can be extracted from the TDP (i.e., total heat dissipation power of each heat source × redundancy factor). For example, if the CPU's total power consumption is 2.985W and the redundancy factor is 1.2, the TDP = 2.985 × 1.2 ≈ 3.582W. The difference between the steady-state temperature and the target ambient temperature is calculated (e.g., target ambient temperature 25℃, steady-state temperature 47℃, difference 22℃). Based on the partial TDP and the temperature difference, the heat dissipation requirement of each heat source is determined. The larger the partial TDP and the larger the temperature difference, the higher the heat dissipation requirement and the higher the required heat dissipation efficiency. Then, based on the correlation between each heat source in the thermal resistance model and the heat dissipation requirement of each heat source, the heat dissipation scheme for the electronic device is determined. Among them, the correlation of heat sources refers to the thermal coupling relationship between each heat source and the heat dissipation path component in the thermal resistance model, and between each heat source (such as some heat sources sharing the same heat dissipation path, or thermal conduction interference between heat sources).

[0120] This paper analyzes the relationships between heat sources in the thermal resistance model. For example, the CPU and GPU share the same heat dissipation path in the handheld electronic device, and there is heat conduction between the chip and the CPU. Secondly, for heat sources with high heat dissipation requirements, efficient heat dissipation components are configured. For example, both the CPU and chip have high heat dissipation requirements, so a shared large heatsink and thermal paste are used to improve heat dissipation efficiency. For heat sources with medium heat dissipation requirements, suitable heat dissipation components are configured. For example, the GPU is equipped with a small heatsink, sharing the heat dissipation path with the CPU. Finally, the heat dissipation path is optimized to reduce thermal interference between heat sources. For example, a thermal pad is placed between the CPU and the chip to prevent heat conduction and ensure the heat dissipation efficiency of each heat source. This embodiment generates a targeted heat dissipation solution by analyzing the relationships between heat sources and their heat dissipation requirements, avoiding the decrease in heat dissipation efficiency caused by thermal interference. The use of shared heat dissipation paths reduces the complexity and cost of heat dissipation design.

[0121] See Figure 2 This document illustrates a flowchart of an application scenario provided by an embodiment of this application. In this scenario, it is necessary to determine the accurate power consumption data of an electronic device (such as a smartphone) when running a game, in order to design a matching heat dissipation solution for the electronic device. This embodiment targets a high-load handheld gaming scenario for a certain smartphone. The goal is to accurately calculate the device's steady-state temperature and total power consumption, and design a heat dissipation solution that meets both heat dissipation requirements and the constraints of the phone's thin and light structure. This ensures stable frame rates and no overheating or frequency throttling during game operation, while optimizing the temperature experience in the handheld area.

[0122] First, input the hardware parameters of the electronic device (including the overall heat dissipation structure, chip packaging form, and board layout) and game scenario parameters (handheld grip method, CPU / GPU full load operation state). Based on the hardware parameters, extract the thermal resistance parameters of each heat source (CPU / GPU / NPU / Chip) and heat dissipation path components (such as the cover_AI handheld cover) to construct a thermal resistance model (thermal matrix). For example, the thermal resistance between the CPU and cover_AI is 1.2, and the thermal resistance between the chip and cover_AI is 7.9. At the same time, for the game scenario, perform gradient tests at multiple temperature points of 25℃, 30℃, 40℃, and 50℃ for each heat source, collect leakage power consumption data, and fit to obtain the leakage power consumption and temperature correlation curves of each heat source.

[0123] After entering the iterative calculation module, the initial preset temperature for the first iteration is set to 50℃. Based on the correlation curve, the preset leakage power consumption of the CPU at 50℃ is found to be 1.8W, GPU 0.9W, and Chip 1.5W. Combining the working parameters of the game scene (CPU load 80%, GPU load 90%), the dynamic power consumption of the CPU is determined to be 1.185W, GPU 0.441W, and Chip 1.329W. Adding the leakage power consumption and dynamic power consumption, the total power consumption of the CPU is obtained as 2.985W, the total power consumption of the GPU is 1.341W, and the total power consumption of the Chip is 2.829W. Based on the thermal resistance model, the CPU temperature rise was calculated to be approximately 3.582℃ (2.985 × 1.2), and the leakage temperature was approximately 53.582℃ (50 + 3.582). Similarly, the GPU leakage temperature was approximately 51.609℃, and the Chip leakage temperature was approximately 72.349℃. The difference between the calculated leakage temperature and the preset temperature was 3.582℃, which did not meet the convergence condition that the difference should not exceed 0.5℃. Therefore, the previously calculated leakage temperature was used as the new preset temperature, and the above steps were repeated. After three iterations, the temperature finally converged to a steady-state temperature of 47℃.

[0124] Based on the total power consumption at steady-state temperature (total system power consumption 7.156W), with a redundancy factor of 1.2, the calculated thermal design power is approximately 8.587W. Combining the relationship between the CPU and GPU sharing the cover_AI heat dissipation path in the thermal resistance model, and the heat dissipation requirements of each heat source (CPU / Chip has high requirements, GPU has medium requirements), a heat dissipation solution is generated. This includes configuring a shared copper heatsink to cover the CPU and Chip, with the GPU connected to the shared path via a small heatsink. High thermal conductivity thermal grease is filled between the heat source and the heatsink, and a ceramic thermal pad is placed between the CPU and Chip to reduce thermal interference.

[0125] This application also provides a power consumption determination device, see [link to relevant documentation]. Figure 3 The device includes:

[0126] The first acquisition unit 301 is used to acquire a thermal resistance model, which includes thermal resistance parameters of each heat source on the heat dissipation path of the electronic device, and characterizes the thermal coupling relationship between each heat source.

[0127] The first determining unit 302 is used to determine the preset leakage power consumption of each heat source at a preset temperature value based on the correspondence between the leakage power consumption and temperature of each heat source in the target working scenario.

[0128] The calculation unit 303 is used to calculate the leakage temperature corresponding to each of the heat sources based on the preset leakage power consumption and the thermal resistance model;

[0129] The second determining unit 304 is used to respond to continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition, and to determine the current leakage temperature as a steady state temperature.

[0130] The second acquisition unit 305 is used to obtain the total power consumption of each heat source under the target working scenario at the steady-state temperature based on the working parameters of each heat source corresponding to the target working scenario. The total power consumption includes the leakage power consumption and the dynamic power consumption of the heat source when it is working.

[0131] In some possible implementations, the computing unit includes:

[0132] The first determining subunit is used to determine the dynamic power consumption of each heat source at the preset temperature value based on the working parameters of each heat source corresponding to the target working scenario.

[0133] The second determining subunit is used to determine the current total power consumption of each of the heat sources based on the dynamic power consumption and the preset leakage power consumption.

[0134] The third determining subunit is used to determine the temperature rise parameters of each of the heat sources based on the thermal resistance model and the current total power consumption.

[0135] The fourth determining subunit is used to determine the leakage temperature of each of the heat sources based on the temperature rise parameters and the preset temperature value.

[0136] In some possible implementations, the second determining unit includes:

[0137] The fifth determining subunit is used to use the leakage temperature calculated in the previous iteration as the preset temperature value for the next iteration in each iteration process of adjusting the preset temperature value.

[0138] The sixth determining subunit is used to re-execute the steps of determining the preset leakage power consumption of each heat source at a preset temperature value, and calculating the leakage temperature corresponding to each heat source;

[0139] The first calculation subunit is used to calculate the difference between the current leakage temperature and the current preset temperature value;

[0140] The first control subunit is used to exit the iterative process when the difference meets the temperature difference condition.

[0141] In some possible implementations, the second determining unit includes:

[0142] The second calculation subunit is used to calculate the difference between the current leakage temperature and the preset temperature value in each iterative process of adjusting the preset temperature value.

[0143] The seventh determining subunit is used to determine the adjustment direction and adjustment range of the preset temperature value based on the difference;

[0144] An update subunit is used to update the preset temperature value according to the adjustment direction and the adjustment range;

[0145] The third calculation subunit is used to re-execute the steps of determining the preset leakage power consumption of each heat source at the preset temperature value and calculating the leakage temperature corresponding to each heat source based on the updated preset temperature value.

[0146] The fourth calculation subunit is used to calculate the difference between the current leakage temperature and the current preset temperature value;

[0147] The second control subunit is used to exit the iterative process when the difference meets the temperature difference condition.

[0148] In some possible implementations, the second acquisition unit includes:

[0149] The eighth determining subunit is used to determine the working mode of each of the heat sources based on the target working scenario;

[0150] The ninth determining subunit is used to determine the operating parameters of each heat source according to the operating mode of each heat source.

[0151] The tenth determining subunit is used to determine the dynamic power consumption of each heat source when it operates at the steady-state temperature, based on the operating parameters of each heat source.

[0152] The total power consumption acquisition subunit is used to obtain the total power consumption of each heat source under the target working scenario at the steady-state temperature based on the leakage power consumption of each heat source at the steady-state temperature and the dynamic power consumption.

[0153] In some possible implementations, the device further includes:

[0154] The generation unit is used to generate a temperature and leakage power consumption record table based on the steady-state temperature and the leakage power consumption of each heat source at the steady-state temperature.

[0155] The query unit is used to query the temperature and leakage power consumption record table in response to the target query request to obtain the target leakage power consumption corresponding to the target query request; the target query request represents the target steady-state temperature value to be queried.

[0156] In some possible implementations, the device further includes:

[0157] The third determining unit is used to determine the thermal design power consumption of the electronic device based on the total power consumption of each heat source under the target working scenario at the steady-state temperature.

[0158] A heat dissipation scheme generation unit is used to generate a heat dissipation scheme for the electronic device based on the thermal design power.

[0159] In some possible implementations, the heat dissipation solution generation unit includes:

[0160] The heat dissipation requirement determination subunit is used to determine the heat dissipation requirements of each heat source based on the thermal design power and the steady-state temperature.

[0161] The heat dissipation scheme determination subunit is used to determine the heat dissipation scheme of the electronic device based on the correlation between each heat source in the thermal resistance model and the heat dissipation requirements of each heat source.

[0162] It should be noted that the specific implementation of each unit and subunit in this embodiment can be referred to the corresponding content above, and will not be described in detail here.

[0163] In another embodiment of this application, a readable storage medium is provided, on which a computer program is stored, which, when executed by a processor, implements the power consumption determination method as described above.

[0164] In another embodiment of this application, an electronic device is also provided, see [link to relevant documentation]. Figure 4 ,include:

[0165] Heat source module 401, the heat source module includes at least one heat source;

[0166] The memory 402 is used to store computer programs and thermal resistance models, the thermal resistance models including thermal resistance parameters of each heat source on the heat dissipation path of the electronic device, characterizing the thermal coupling relationship between each heat source.

[0167] Processor 403 is configured to execute the computer program to achieve:

[0168] Obtain a thermal resistance model, which includes the thermal resistance parameters of each heat source along the heat dissipation path of the electronic device;

[0169] Based on the correspondence between the leakage power consumption and temperature of each heat source in the target working scenario, the preset leakage power consumption of each heat source at the preset temperature value is determined.

[0170] Based on the preset leakage power consumption and the thermal resistance model, the leakage temperature corresponding to each heat source is calculated.

[0171] In response to continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value, until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition, the current leakage temperature is determined to be the steady-state temperature.

[0172] Based on the operating parameters of each heat source corresponding to the target operating scenario, the total power consumption of each heat source under the target operating scenario at the steady-state temperature is obtained. The total power consumption includes the leakage power consumption and the dynamic power consumption of the heat source during operation. It should be noted that the specific implementation of the processor in this embodiment can be referred to the corresponding content above, and will not be detailed here.

[0173] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0174] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0175] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented directly by hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.

[0176] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for determining power consumption, comprising: Obtain a thermal resistance model, which includes the thermal resistance parameters of each heat source on the heat dissipation path of the electronic device, and characterizes the thermal coupling relationship between each heat source. Based on the correspondence between the leakage power consumption and temperature of each heat source in the target working scenario, the preset leakage power consumption of each heat source at the preset temperature value is determined. Based on the preset leakage power consumption and the thermal resistance model, the leakage temperature corresponding to each heat source is calculated. In response to continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value, until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition, the current leakage temperature is determined to be the steady-state temperature. Based on the operating parameters of each heat source corresponding to the target working scenario, the total power consumption of each heat source under the target working scenario at the steady-state temperature is obtained. The total power consumption includes the leakage power consumption and the dynamic power consumption of the heat source when it is working.

2. The method according to claim 1, wherein calculating the leakage temperature corresponding to each heat source based on the preset leakage power consumption and the thermal resistance model includes: Based on the operating parameters of each heat source corresponding to the target working scenario, determine the dynamic power consumption of each heat source at the preset temperature value. Based on the dynamic power consumption and the preset leakage power consumption, the current total power consumption of each heat source is determined; Based on the thermal resistance model and the current total power consumption, the temperature rise parameters of each heat source are determined; Based on the temperature rise parameter and the preset temperature value, the leakage temperature of each heat source is determined.

3. The method according to claim 1, wherein responding to continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value satisfies the temperature difference condition, comprises: In each iteration of adjusting the preset temperature value, the leakage temperature calculated in the previous iteration is used as the preset temperature value for the next iteration. The steps of determining the preset leakage power consumption of each heat source at a preset temperature value and calculating the leakage temperature corresponding to each heat source are re-executed. The difference between the current leakage temperature and the current preset temperature value is calculated. When the difference satisfies the temperature difference condition, the iterative process is terminated.

4. The method according to claim 1, wherein responding to continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value satisfies the temperature difference condition, comprises: In each iterative process of adjusting the preset temperature value, the difference between the current leakage temperature and the preset temperature value is calculated. Based on the difference, determine the adjustment direction and adjustment range of the preset temperature value; The preset temperature value is updated based on the adjustment direction and the adjustment range. Based on the updated preset temperature value, the steps of determining the preset leakage power consumption of each heat source at the preset temperature value and calculating the leakage temperature corresponding to each heat source are re-executed. The difference between the current leakage temperature and the current preset temperature value is calculated. When the difference satisfies the temperature difference condition, the iterative process is terminated.

5. The method according to claim 1, wherein obtaining the total power consumption of each heat source under the target working scenario at the steady-state temperature based on the operating parameters of each heat source corresponding to the target working scenario includes: Based on the target working scenario, determine the working mode of each of the heat sources; Based on the operating mode of each heat source, determine the operating parameters of each heat source; Based on the operating parameters of each heat source, determine the dynamic power consumption of each heat source when it operates at the steady-state temperature; Based on the leakage power consumption of each heat source at the steady-state temperature and the dynamic power consumption, the total power consumption of each heat source at the steady-state temperature under the target working scenario is obtained.

6. The method according to claim 1, further comprising: Based on the steady-state temperature and the leakage current power consumption of each heat source at the steady-state temperature, a temperature and leakage current power consumption record table is generated. In response to a target query request, a query is performed in the temperature and leakage power consumption record table to obtain the target leakage power consumption corresponding to the target query request; the target query request represents the target steady-state temperature value to be queried.

7. The method according to claim 1, further comprising: Based on the total power consumption of each heat source under the target working scenario at the steady-state temperature, the thermal design power consumption of the electronic device is determined. Based on the thermal design power, a heat dissipation scheme for the electronic device is generated.

8. The method according to claim 7, wherein generating a heat dissipation scheme for the electronic device based on the thermal design power comprises: Based on the thermal design power and the steady-state temperature, the heat dissipation requirements of each heat source are determined. Based on the correlation between the heat sources in the thermal resistance model and the heat dissipation requirements of each heat source, a heat dissipation scheme for the electronic device is determined.

9. A power consumption determination device, comprising: The first acquisition unit is used to acquire a thermal resistance model, which includes thermal resistance parameters of each heat source on the heat dissipation path of the electronic device, and characterizes the thermal coupling relationship between each heat source. The first determining unit is used to determine the preset leakage power consumption of each heat source at a preset temperature value based on the correspondence between the leakage power consumption of each heat source and the temperature under the target working scenario. The calculation unit is used to calculate the leakage temperature corresponding to each of the heat sources based on the preset leakage power consumption and the thermal resistance model; The second determining unit is used to respond to continuously adjusting the preset temperature value and calculate the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition, and to determine the current leakage temperature as a steady state temperature. The second acquisition unit is used to obtain the total power consumption of each heat source under the target working scenario at the steady-state temperature based on the working parameters of each heat source corresponding to the target working scenario. The total power consumption includes the leakage power consumption and the dynamic power consumption of the heat source when it is working.

10. An electronic device, comprising: Heat source module, the heat source module including at least one heat source; The memory is used to store computer programs and thermal resistance models, which include thermal resistance parameters of each heat source on the heat dissipation path of the electronic device, and characterize the thermal coupling relationship between the heat sources. A processor for executing the computer program to achieve: Obtain a thermal resistance model, which includes the thermal resistance parameters of each heat source along the heat dissipation path of the electronic device; Based on the correspondence between the leakage power consumption and temperature of each heat source in the target working scenario, the preset leakage power consumption of each heat source at the preset temperature value is determined. Based on the preset leakage power consumption and the thermal resistance model, the leakage temperature corresponding to each heat source is calculated. In response to continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value, until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition, the current leakage temperature is determined to be the steady-state temperature. Based on the operating parameters of each heat source corresponding to the target working scenario, the total power consumption of each heat source under the target working scenario at the steady-state temperature is obtained. The total power consumption includes the leakage power consumption and the dynamic power consumption of the heat source when it is working.

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