Electric fire heating furnace circuit board and test equipment thereof

Abstract

The embodiment of the invention provides an electric fire heating furnace circuit board and a test device thereof, the electric fire heating furnace circuit board comprises a circuit structure and an electric heating furnace, and the circuit structure is used for controlling the electric heating furnace; the circuit structure comprises a substrate and a direct insertion type MOS tube, the direct insertion type MOS tube is provided with a grid electrode G, a source electrode S and a drain electrode D, and the grid electrode G, the source electrode S and the drain electrode D are led out to the substrate to serve as test contacts; the circuit structure further comprises an MOS transistor monitoring module, and the driving circuit state and the actual on or off state of the in-line MOS transistor are judged according to the gate-source voltage and the drain-source voltage. Relates to the electric heating control field. By arranging the MOS tube monitoring module, the gate-source voltage and the drain-source voltage of the in-line MOS tube are detected, so that the circuit board can obtain key electrical state information of the MOS tube in the working process, and a reliable basis is provided for judging the actual working state of the MOS tube.

Description

Technical Field

[0001] This invention relates to the field of electric heating control, specifically to a circuit board for an electric fire-starting heating furnace and its testing equipment. Background Technology

[0002] Electric arc furnaces, as devices that achieve heating through electric arcs, are widely used in industrial and civilian heating fields due to their rapid heating rate and high thermal efficiency. In electric arc furnaces, circuit boards are typically used to control the furnace's operating status, and the stability and reliability of the power switching devices directly affect the overall safety and lifespan of the machine.

[0003] In existing electric furnace circuit boards, MOSFETs are typically used as power control devices. A drive circuit controls the MOSFET's on / off state to regulate the furnace's power. However, current MOSFET control methods are mostly based solely on the control signal itself, lacking effective means to detect the MOSFET's actual operating state, making it difficult to promptly determine whether the MOSFET is in a normal on / off state.

[0004] In addition, existing circuit boards often cannot perform independent and intuitive testing of the gate, source, and drain of MOSFETs during the product manufacturing inspection stage. This results in some driving abnormalities or device performance abnormalities only being exposed after the product leaves the factory, affecting product consistency and reliability.

[0005] Therefore, how to detect the key electrical parameters of a MOSFET without significantly increasing circuit complexity, and thereby determine the driving circuit state and actual on or off state of the MOSFET, is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] According to embodiments of the present invention, an electric fire-starting furnace circuit board and its testing equipment are provided. This addresses the technical problems existing in the background art described above.

[0007] In a first aspect of the invention, a circuit board for an electric fire-starting heating furnace is provided.

[0008] The circuit board of the electric heating furnace includes a circuit structure and an electric heating furnace, wherein the circuit structure is used to control the electric heating furnace. The circuit structure includes a substrate and a through-hole MOSFET. The through-hole MOSFET is provided with a gate G, a source S, and a drain D. The gate G, the source S, and the drain D are led out to the substrate as test contacts. The circuit structure also includes a MOS transistor monitoring module, which is used to detect the gate-source voltage and drain-source voltage of the through-hole MOS transistor, and determine the driving circuit state and actual on or off state of the through-hole MOS transistor based on the gate-source voltage and drain-source voltage.

[0009] Preferably, it also includes an MCU main controller, and the MOS transistor monitoring module determines whether the drive circuit is normal by detecting the gate-source voltage.

[0010] Preferably, the MOSFET monitoring module determines the actual conduction state of the through-hole MOSFET by detecting the drain-source voltage.

[0011] Preferably, the MOSFET monitoring module detects the drain-source voltage during MOSFET turn-off.

[0012] Preferably, it further includes a power sampling module, the circuit structure including a voltage sampling submodule, the voltage sampling submodule being integrated into the power sampling module, the power sampling module being used to acquire the gate-source voltage and drain-source voltage in real time.

[0013] Preferably, the circuit structure includes a fan control module, a transformer load connection terminal, a transformer module, and a heat sink, wherein the heat sink is disposed on the through-hole MOSFET; The fan control module is used to control the cooling fan inside the electric heating furnace, which forces heat dissipation from the arc generation area and related high-temperature components.

[0014] Preferably, the fan control module supports PWM speed control, and the MCU master controller dynamically adjusts the speed of the cooling fan according to the degree of abnormality of the drain-source voltage, the arc power sampling value, or the furnace temperature signal detected by the MOS tube monitoring module.

[0015] Preferably, the circuit structure further includes an alarm output unit, which is connected to the MCU main controller. When the MOS transistor monitoring module detects an abnormal gate-source voltage or drain-source voltage, the MOS transistor monitoring module is powered by a 12V auxiliary power supply unit and issues a fault message.

[0016] In a second aspect of the invention, a testing device for an electric fire-starting furnace circuit board is provided.

[0017] The testing equipment for the circuit board of the electric fire-starting furnace includes a pressing structure, a housing, a positioning mechanism, and three monitoring terminals; The pressing structure is disposed on the housing, the positioning mechanism is used to position the circuit structure, and the three monitoring terminals are disposed inside the housing and correspond to the gate G, the source S and the drain D respectively. The positioning mechanism includes a plate, a base plate, a support block, a slide rod, and a first spring; The inner side of the plate is provided with a positioning groove and the positioning groove is connected to the base plate. The base plate is used to support the substrate. The positioning groove matches the shape of the substrate. The plate is connected to the slide rod. The slide rod is slidably connected to the support block. The support block is connected to the housing. The first spring is sleeved on the slide rod and the two ends of the first spring are respectively connected to the slide rod and the support block.

[0018] Preferably, the pressing structure includes a sliding sleeve, a limiting rod, a pressure plate, a side plate, a rotating handle, a connecting rod, and a pressure rod; The sliding sleeve is slidably connected to the limiting rod, the sliding sleeve is connected to the pressure plate, the pressure plate is in contact with the heat sink, the pressure plate is connected to the pressure rod, the pressure rod is slidably connected to the side plate, the side plate is connected to the housing, the upper part of the pressure rod is rotatably connected to the connecting rod, the connecting rod is rotatably connected to the rotating handle, and the rotating handle is rotatably connected to the side plate; When the connecting rod is parallel to the axis of the pressure rod, the pressure plate is at its lowest point and the pressure plate cannot drive the rotating handle to move.

[0019] One or more technical solutions provided in this application have at least the following technical effects or advantages: The present invention provides a circuit board for an electric fire-starting heating furnace and its testing equipment. By setting up a MOSFET monitoring module, the circuit board can detect the gate-source voltage and drain-source voltage of the through-hole MOSFET, so that the circuit board can obtain key electrical state information of the MOSFET during operation, thereby providing a reliable basis for judging the actual working state of the MOSFET.

[0020] By detecting the gate-source voltage, it is possible to determine whether the MOSFET drive circuit is in normal working condition, thus avoiding misjudging that the MOSFET is in a controlled state under abnormal drive conditions and improving the accuracy of control.

[0021] It should be understood that the description in the Summary of the Invention is not intended to limit the key or essential features of the embodiments of the present invention, nor is it intended to restrict the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0022] The above and other features, advantages, and aspects of the various embodiments of the present invention will become more apparent from the accompanying drawings and the following detailed description. In the drawings, the same or similar reference numerals denote the same or similar elements, wherein: Figure 1 A schematic diagram of the planar connection structure of the circuit board of the electric fire-starting furnace according to an embodiment of the present invention is shown; Figure 2A three-dimensional connection structure diagram of the circuit board of an electric fire-starting furnace according to an embodiment of the present invention is shown; Figure 3 A schematic diagram of the connection structure of an electric fire-starting furnace circuit board according to an embodiment of the present invention is shown from another perspective. Figure 4 A three-dimensional connection structure diagram of a test device for an electric fire-starting furnace circuit board according to an embodiment of the present invention is shown; Figure 5 An exploded view of a test apparatus for an electric fire-starting furnace circuit board according to an embodiment of the present invention is shown; Figure 6 A schematic diagram of the connection structure of the positioning mechanism of a test device for an electric fire-starting furnace circuit board according to an embodiment of the present invention is shown. Figure 7 A schematic diagram of the connection structure of the linkage mechanism of the test equipment for the electric fire-starting furnace circuit board according to an embodiment of the present invention is shown; Figure 8 A schematic diagram of the connection structure of the monitoring mechanism of a test device for an electric fire-starting furnace circuit board according to an embodiment of the present invention is shown; Figure 9 A partial connection diagram of the monitoring mechanism of a test device for an electric fire-starting furnace circuit board according to an embodiment of the present invention is shown.

[0023] The attached figures are labeled as follows: 1-Housing, 2-Pressure structure, 21-Sliding sleeve, 22-Limiting rod, 23-Pressure plate, 24-Side plate, 25-Handle, 26-Connecting rod, 27-Pressure rod, 3-Circuit structure, 31-Base plate, 310-Heat sink, 32-Module, 33-Transformer load connection terminal, 34-Transformer circuit transformer sampling module, 35-Transformer module, 36-Main control, 37-Power supply unit, 38-Through-hole MOSFET, 39-Power sampling module, 4-Positioning mechanism, 41-Board, 42-Base plate, 43-Support block, 44-Sliding rod, 4 5-First spring, 5-Monitoring mechanism, 51-Annular contact end, 510-Third base plate, 511-Annular inclined surface, 52-Monitoring end, 53-Contact switch, 54-Contact plate, 55-First base plate, 56-Rod body, 57-Second spring, 58-Top plate, 59-Second base plate, 6-Linkage mechanism, 61-Base frame, 62-Mounting frame, 63-Upright pole, 64-Third spring, 65-L-shaped contact rod, 66-Frame body, 67-Protrusion, 68-Connecting rod, 3121-Gate G, 3122-Source S, 3123-Drain D. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0026] like Figures 1 to 3 As shown, the circuit board of the electric furnace includes circuit structure 3 and electric furnace. Circuit structure 3 is used to control the electric furnace to generate electric arc heating in order to achieve stable control of the working state of the furnace.

[0027] Circuit structure 3 includes a substrate 31 and a through-hole MOSFET 38. The through-hole MOSFET 38 is disposed on the substrate 31 and is used for switching control of the power output of the electric heating furnace. The through-hole MOSFET 38 is provided with a gate G3121, a source S3122, and a drain D3123. The gate G3121, the source S3122, and the drain D3123 are respectively led out to the substrate 31 and set as test contacts. These contacts are used to detect the driving circuit status and device performance status of the through-hole MOSFET 38 during the product factory inspection stage, thereby improving product consistency and reliability.

[0028] Circuit structure 3 also includes a MOS transistor monitoring module. The MOS transistor monitoring module is used to detect the gate-source voltage and drain-source voltage of the through-hole MOS transistor 38 in real time during product operation, and to determine the driving circuit status of the through-hole MOS transistor 38 and its actual on or off state based on the detected gate-source voltage and drain-source voltage.

[0029] Circuit structure 3 also includes MCU main control 36. The MOS tube monitoring module detects the gate-source voltage to determine whether the driving circuit is normal. Its detection process includes: collecting the voltage value between the gate G3121 and the source S3122, and comparing the collected voltage value with the preset effective control voltage threshold range; when the gate-source voltage is lower than the lower limit of the voltage threshold or higher than the upper limit of the voltage threshold, it is determined that there is a driving abnormality in the through-hole MOS tube 38, and the MCU main control 36 sends a control signal to interrupt or adjust the driving signal.

[0030] The MOSFET monitoring module also detects the drain-source voltage to determine the actual conduction state of the through-hole MOSFET 38. The detection process is configured as follows: when the through-hole MOSFET 38 is conducting, the drain-source voltage value between the drain D3123 and the source S3122 is collected, and the collected drain-source voltage value is compared with a preset conduction voltage drop threshold. When the drain-source voltage exceeds the preset multiple of the conduction voltage drop threshold, it is determined that the through-hole MOSFET 38 is not fully turned on or there is device performance degradation.

[0031] The MOSFET monitoring module also detects the drain-source voltage during the turn-off period of the through-hole MOSFET 38. The detection process is configured as follows: the drain-source voltage value between the drain D3123 and the source S3122 is collected, and the collected drain-source voltage value is compared with the preset bus voltage threshold. When the drain-source voltage is significantly lower than the bus voltage threshold, it is determined that the through-hole MOSFET 38 has leakage current or is not completely turned off.

[0032] Circuit structure 3 also includes a power sampling module 39, which integrates a voltage sampling submodule. The voltage sampling submodule is used to acquire the gate-source voltage and drain-source voltage in real time, and transmits the acquired voltage signal to the MCU main controller 36 after filtering, so that the MCU main controller 36 can perform threshold comparison, anomaly judgment and fault information recording.

[0033] The circuit structure 3 also includes a fan control module 32, a transformer load connection terminal 33, a transformer module 35, and a heat sink 310. The heat sink 310 is disposed on the through-hole MOSFET 38 and is used to passively dissipate heat from the through-hole MOSFET 38. The fan control module 32 is used to control the cooling fan disposed inside the electric heating furnace. The cooling fan is used to force heat dissipation from the arc generation area and related high-temperature components.

[0034] The MCU main controller 36 executes multi-level protection logic based on the detection results of the MOSFET monitoring module. Specifically, when an abnormal gate-source voltage is detected, the drive signal is stopped or adjusted by controlling the transformer module 35; when an abnormal drain-source voltage is detected, the fan speed of the fan control module 32 is increased to enhance heat dissipation, or the power output of the transformer load connection terminal 33 is interrupted to prevent further damage to the device.

[0035] The fan control module 32 supports PWM speed control. The MCU main controller 36 can dynamically adjust the speed of the cooling fan according to the abnormality of the drain-source voltage detected by the MOS tube monitoring module, the arc power sampling value, or the furnace temperature signal, thereby realizing adaptive heat dissipation control of the arc generation area.

[0036] Circuit structure 3 also includes an alarm output unit, which is connected to the MCU main control 36. When the MOSFET monitoring module detects an abnormal gate-source voltage or drain-source voltage, or the fan control module 32 detects a fan failure, the MOSFET monitoring module generates corresponding fault information under the power supply of the 12V auxiliary power supply unit 37. The 12V auxiliary power supply unit 37 is used to provide working power to the electronic components in circuit structure 3. The generated fault information is recorded in the transformer circuit current transformer sampling module 34 or non-volatile memory for subsequent fault diagnosis and maintenance analysis.

[0037] In actual use, the circuit board of the electric arc heating furnace monitors and protects the driving and working status of the through-hole MOS transistor 38 in real time to achieve stable operation of the electric arc heating process, and takes timely heat dissipation or power-off measures when abnormal conditions occur, thereby improving the safety and service life of the whole machine.

[0038] Meanwhile, this solution sets up a MOSFET monitoring module to collect and analyze the gate-source and drain-source voltages of through-hole MOSFETs in real time. This enables accurate determination of the MOSFET's drive circuit status and its actual on or off state, avoiding the problem of relying solely on control signals and failing to reflect the true operating state of the device. This significantly improves the safety and reliability of circuit operation.

[0039] like Figures 4 to 9 As shown, another embodiment of the present invention also provides a testing device for an electric furnace circuit board, used to detect the electrical status of through-hole MOSFETs in the electric furnace circuit board. The testing device includes a pressure-down structure 2, a housing 1, a positioning mechanism 4, and three monitoring terminals 52.

[0040] The pressure-down structure 2 is mounted on the housing 1, and the positioning mechanism 4 is located inside the housing 1 and is used to position and fix the circuit structure 3. Three monitoring terminals 52 are located inside the housing 1, and each monitoring terminal 52 corresponds to the gate G3121, source S3122, and drain D3123 of the through-hole MOSFET, respectively, to form an electrical connection with the corresponding test contacts during testing. The three monitoring terminals 52 are also electrically connected to the voltage detection unit in the testing equipment. The voltage detection unit is used to measure the voltage of the gate G3121 of the through-hole MOSFET. 121. The voltage signals of the source S3122 and drain D3123 are acquired. Specifically, the gate-source voltage is obtained by detecting the voltage between the gate G3121 and the source S3122, and the drain-source voltage is obtained by detecting the voltage between the drain D3123 and the source S3122. After signal conditioning and processing, the acquired voltage signals are used to determine the driving circuit status of the through-hole MOSFET and its actual on or off state, thereby realizing the testing and evaluation of the electrical status of power devices in the electric furnace circuit board.

[0041] The positioning mechanism 4 includes a plate 41, a base plate 42, a support block 43, a slide rod 44, and a first spring 45.

[0042] A positioning groove is provided on the inner side of the plate 41. The positioning groove is connected to the base plate 42 to form an installation space for accommodating the circuit structure 3. The base plate 42 is used to support and carry the substrate 31. The shape of the positioning groove matches the shape of the substrate 31 to limit the displacement of the substrate 31 in the horizontal direction.

[0043] The plate 41 is fixedly connected to the slide rod 44, and the slide rod 44 is slidably connected to the support block 43. The support block 43 is fixedly connected to the inner wall of the housing 1. The first spring 45 is sleeved on the slide rod 44, and the two ends of the first spring 45 abut against the slide rod 44 and the support block 43 respectively. It is used to drive the plate 41 and the base plate 31 on it to reset after the external force is released, thereby realizing the buffer positioning and automatic return function.

[0044] The pressing structure 2 includes a sliding sleeve 21, a limiting rod 22, a pressure plate 23, a side plate 24, a handle 25, a connecting rod 26, and a pressure rod 27.

[0045] The sliding sleeve 21 is slidably connected to the limiting rod 22 to limit the movement direction of the pressing structure 2. The sliding sleeve 21 is fixedly connected to the pressure plate 23. During the pressing process, the pressure plate 23 is used to fit against the heat sink 310 on the through-hole MOS transistor to apply a stable downward pressure to the MOS transistor during the test, ensuring reliable contact between the monitoring end and the test contact.

[0046] The pressure plate 23 is connected to the pressure rod 27, the pressure rod 27 is slidably connected to the side plate 24, and the side plate 24 is fixedly connected to the housing 1; the upper end of the pressure rod 27 is rotatably connected to the connecting rod 26, the connecting rod 26 is rotatably connected to the handle 25, and the handle 25 is rotatably connected to the side plate 24. By rotating the handle 25, the connecting rod 26 and the pressure rod 27 can be driven to move together, thereby driving the pressure plate 23 to move up and down.

[0047] In this embodiment, when the axial directions of the connecting rod 26 and the pressure rod 27 are basically parallel, the pressure plate 23 is at the lowest position of the downward stroke, forming a self-locking structure. Under the action of external force, the pressure plate 23 cannot drive the rotating handle 25 to rotate in the opposite direction, thereby ensuring that the pressure plate 23 continuously presses against the heat sink 310 during the test and avoiding poor contact during the test.

[0048] In practical use, the circuit board of the electric furnace to be tested is placed in the positioning groove of the positioning mechanism 4. The positioning groove and the substrate 31 work together to achieve rapid positioning. Then, the handle 25 is rotated, causing the pressing structure 2 to drive the pressure plate 23 downwards and into contact with the heat sink 310. Simultaneously, the substrate 31 is slightly displaced under the elastic action of the first spring 45, ensuring reliable contact between the three monitoring terminals 52 and the test contacts of the gate G3121, source S3122, and drain D3123, respectively. This completes the testing of the electrical parameters of the through-hole MOSFET. After the test, the handle 25 is rotated in the opposite direction, resetting the pressing structure 2 and the positioning mechanism 4 under the action of the first spring 45, facilitating the removal of the circuit board for the next test.

[0049] In this embodiment, in order to monitor the accuracy of the positions of the gate G3121, source S3122, and drain D3123 on the circuit board while simultaneously monitoring, a monitoring mechanism 5 is also provided. The monitoring mechanism 5 includes an annular contact end 51, a contact switch 53, a contact plate 54, a first base plate 55, a second base plate 59, a third base plate 510, a rod 56, a second spring 57, and a top plate 58. The first base plate 55, the second base plate 59, and the third base plate 510 are connected in sequence. The monitoring end 52 is insulatedly connected to the second base plate 59. The annular contact end 51 is located outside the monitoring end 52 and is insulatedly connected to the rod 56. The rod 56 is slidably connected to the top plate 58, and the top plate 58 is connected to the second base plate 59. At the same time, the rod 56 passes through the second base plate 59 and is connected to the contact plate 54. The contact plate 54 can contact the contact switch 53, and the contact switch 53 is connected to the first base plate 55. Furthermore, an annular inclined surface 511 is provided on the inner side of the annular contact end 51. When the misaligned gate G3121, source S3122 and drain D3123 come into contact with the annular contact end 51, the annular inclined surface 511 can prevent jamming.

[0050] In actual use, when the misaligned gate G3121, source S3122, and drain D3123 contact the annular contact terminal 51, since the top surface of the annular contact terminal 51 is a certain distance higher than the top surface of the monitoring terminal 52, if the positions of the gate G3121, source S3122, and drain D3123 are accurate, the protruding gate G3121, source S3122, and drain D3123 will not contact the annular contact terminal 51, but will contact the monitoring terminal 52, and the normal detection process will proceed. If the monitoring point shifts due to problems in the processing of the gate G3121, source S3122, and drain D3123, the protruding monitoring point will contact the annular contact terminal 51 and cause the second spring 57 to compress, while simultaneously contacting the contact switch 53 below to send a signal. At this time, a signal indicating that one of the gate G3121, source S3122, and drain D3123 is misaligned will be output, but this will not affect the detection of the circuit board.

[0051] In this embodiment, to ensure the stability and safety of the monitoring end 52 and the annular contact end 51 during movement, a linkage mechanism 6 is provided to achieve synchronous approach between the circuit board and the monitoring end 52. The linkage mechanism 6 includes a frame 66, a base frame 61, a vertical rod 63, a mounting frame 62, a third spring 64, an L-shaped contact rod 65, a protrusion 67, and a connecting rod 68. The first base plate 55 is connected to the base frame 61, and the vertical rod 63 is fixedly connected to the base frame 61. The vertical rod 63 is slidably connected to the mounting frame 62. The mounting frame 62 is fixedly connected to the housing 1. A third spring 64 is sleeved on the vertical rod 63, and both ends of the third spring 64 are connected to the mounting frame 62 and the base frame 61, respectively. During movement, the base frame 61 allows the third spring 64 to undergo elastic deformation. Here, the elastic force of the third spring 64 is greater than that of the second spring 57, meaning the third spring 64 has a greater elastic force than the second spring 57. The elastic force of the three springs 64 will not affect the second spring 57 during compression, thus triggering the contact switch 53 through other structures. An L-shaped contact rod 65 is also provided below the base frame 61, which can contact the base frame 61. The middle part of the L-shaped contact rod 65 is rotatably connected to the frame 66, which is fixed to the housing 1 as a fixed end. The end of the L-shaped contact rod 65 away from the base frame 61 is rotatably connected to the connecting rod 68. The connecting rod 68 is rotatably connected to the protrusion 67, which is connected to the lower part of the slide rod 44. When the slide rod 44 is at the lowest point, the L-shaped contact rod 65 contacts the lower part of the base frame 61, causing other structures above the base frame 61 to move upward. When the slide rod 44 returns to its original position due to the elastic force of the first spring 45, the L-shaped contact rod 65 returns to its original position. Since the third spring 64 loses external support at this time, it drives the base frame 61 and other structures to return to their original position.

[0052] In practical use, when the circuit board needs to be tested, it is transported into the housing 1 by an external transmission structure and gradually approaches the monitoring mechanism 5. As the slide bar 44 moves downward, the protrusion 67 below the slide bar 44 drives the L-shaped contact rod 65 to rotate around the frame 66 via the connecting rod 68. The other end of the L-shaped contact rod 65 presses upward against the base frame 61, causing the base frame 61, along with the first base plate 55, the second base plate 59, the third base plate 510, the monitoring end 52, and the annular contact end 51, to move upward as a whole. This allows the monitoring end 52 to synchronously approach the gate G3121, the source S3122, and the drain D3123 on the circuit board. During this process, the third spring 64 is compressed and stores elastic potential energy for subsequent reset.

[0053] When the positions of the gate G3121, source S3122, and drain D3123 on the circuit board are accurate, their protruding parts will first contact the monitoring terminal 52 to complete the routine electrical performance test, and will not contact the annular contact terminal 51. At this time, the contact plate 54 will not operate, and the contact switch 53 will not output a signal, indicating that the corresponding pin position is normal.

[0054] When any gate G3121, source S3122, or drain D3123 on the circuit board experiences a positional shift during processing or assembly, its protruding part will first contact the annular contact end 51, which is higher than the monitoring end 52. Guided by the annular inclined surface 511, it avoids jamming and pushes the annular contact end 51 and its connected rod 56 downward, causing the second spring 57 to compress. This, in turn, causes the contact plate 54 to contact the contact switch 53, and the contact switch 53 immediately outputs a signal indicating that the corresponding pin has been misaligned. Since the elastic force of the second spring 57 is less than that of the third spring 64, the misalignment detection action will not affect the normal detection stroke of the monitoring end 52, thus achieving "synchronous and non-interfering position detection and electrical performance detection".

[0055] After the test is completed, the slide bar 44 returns to its original position under the elastic force of the first spring 45, the protrusion 67 rises accordingly, the L-shaped contact rod 65 loses its pressing force on the base frame 61, and under the elastic force of the third spring 64, the base frame 61 and the monitoring mechanism 5 are reset as a whole, and all components return to their initial positions, which facilitates the testing of the next circuit board.

[0056] Through the above-described workflow, this implementation method has at least the following beneficial effects: First, it can simultaneously monitor the accuracy of the positions of the gate, source, and drain on the circuit board without adding any testing steps, thus improving testing efficiency; Secondly, by combining the annular contact end with the elastic structure, the misalignment detection is buffered and guided, avoiding hard collisions between the monitoring end and the pin, thus improving the device's service life and detection safety. Third, the linkage mechanism ensures the synchronous approach and reliable reset of the circuit board and the monitoring end, making the detection process stable and repeatable. Fourth, even if pin misalignment is detected, it does not affect the normal electrical performance testing of the circuit board, which facilitates the subsequent classification and processing of defective products, and improves the practicality and intelligence level of the testing device as a whole.

[0057] Furthermore, in traditional structures, the monitoring end is fixed, and the circuit board needs to be pushed to the monitoring end position in one direction. The load borne by the gate, source, and drain at the moment of contact is concentrated and unidirectional, which can easily lead to pin bending, pad damage, or even circuit board deformation.

[0058] In this embodiment, the linkage mechanism 6 makes the monitoring end 52 move towards the circuit board synchronously and in opposite directions, which effectively reduces the relative movement distance between the two, making the contact process gentler and significantly reducing the instantaneous impact force and unilateral squeezing force on the pin, thus improving the safety of the detection process.

[0059] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A circuit board for an electric fire-starting heating furnace, characterized in that, It includes a circuit structure (3) and an electric heating furnace, wherein the circuit structure (3) is used to control the electric heating furnace; The circuit structure (3) includes a substrate (31) and a through-hole MOS transistor (38). The through-hole MOS transistor (38) is provided with a gate G (3121), a source S (3122) and a drain D (3123). The gate G (3121), the source S (3122) and the drain D (3123) are led out to the substrate (31) as test contacts. The circuit structure (3) also includes a MOS transistor monitoring module, which is used to detect the gate-source voltage and drain-source voltage of the through-hole MOS transistor (38), and determine the driving circuit state and actual on or off state of the through-hole MOS transistor (38) based on the gate-source voltage and the drain-source voltage.

2. The circuit board for the electric fire-starting furnace according to claim 1, characterized in that, It also includes an MCU main controller (36), and the MOS tube monitoring module determines whether the drive circuit is normal by detecting the gate-source voltage.

3. The circuit board for the electric fire-starting furnace according to claim 1, characterized in that, The MOS transistor monitoring module determines the actual conduction state of the through-hole MOS transistor (38) by detecting the drain-source voltage.

4. The circuit board for the electric fire-starting furnace according to claim 1, characterized in that, The MOSFET monitoring module detects the drain-source voltage during MOSFET turn-off.

5. The circuit board for the electric fire-starting furnace according to claim 1, characterized in that, It also includes a power sampling module (39), the circuit structure (3) includes a voltage sampling submodule, the voltage sampling submodule is integrated into the power sampling module (39), the power sampling module (39) is used to collect the gate-source voltage and drain-source voltage in real time.

6. The circuit board for the electric fire-starting furnace according to claim 2, characterized in that, The circuit structure (3) includes a fan control module (32), a transformer circuit transformer sampling module (34), a transformer load connection terminal (33), a transformer module (35), and a heat sink (310), wherein the heat sink (310) is disposed on the through-hole MOS transistor (38); The fan control module (32) is used to control the cooling fan inside the electric heating furnace, and the cooling fan dissipates heat from the area where the electric arc occurs.

7. The circuit board for the electric fire-starting furnace according to claim 6, characterized in that, The fan control module (32) supports PWM speed control. The MCU main controller (36) dynamically adjusts the speed of the cooling fan according to the abnormality of the drain-source voltage, the arc power sampling value or the furnace temperature signal detected by the MOS tube monitoring module.

8. The circuit board for the electric fire-starting furnace according to claim 7, characterized in that, The circuit structure (3) also includes an alarm output unit, which is connected to the MCU main controller (36). When the MOS tube monitoring module detects an abnormal gate-source voltage or drain-source voltage, the MOS tube monitoring module is powered by the 12V auxiliary power supply unit (37) and issues a fault message.

9. A testing device for a circuit board of an electric heating furnace, characterized in that, The device is applied to the circuit board of the electric fire-starting furnace according to any one of claims 1 to 8, and includes a pressing structure (2), a housing (1), a positioning mechanism (4) and three monitoring terminals (52). The pressure-down structure (2) is disposed on the housing (1), the positioning mechanism (4) is used to position the circuit structure (3), and the three monitoring terminals (52) are disposed inside the housing (1) and the three monitoring terminals (52) correspond to the gate G (3121), the source S (3122) and the drain D (3123) respectively. The positioning mechanism (4) includes a plate (41), a base plate (42), a support block (43), a slide rod (44), and a first spring (45). The inner side of the plate (41) is provided with a positioning groove and the positioning groove is connected to the base plate (42). The base plate (42) is used to support the substrate (31). The positioning groove matches the shape of the substrate (31). The plate (41) is connected to the slide rod (44). The slide rod (44) is slidably connected to the support block (43). The support block (43) is connected to the housing (1). The first spring (45) is sleeved on the slide rod (44) and the two ends of the first spring (45) are respectively connected to the slide rod (44) and the support block (43).

10. The testing equipment for the circuit board of the electric fire-starting furnace according to claim 9, characterized in that: The pressing structure (2) includes a sliding sleeve (21), a limiting rod (22), a pressure plate (23), a side plate (24), a handle (25), a connecting rod (26), and a pressure rod (27). The sliding sleeve (21) is slidably connected to the limiting rod (22), the sliding sleeve (21) is connected to the pressure plate (23), the pressure plate (23) is in contact with the heat sink (310), the pressure plate (23) is connected to the pressure rod (27), the pressure rod (27) is slidably connected to the side plate (24), the side plate (24) is connected to the housing (1), the upper part of the pressure rod (27) is rotatably connected to the connecting rod (26), the connecting rod (26) is rotatably connected to the rotating handle (25), and the rotating handle (25) is rotatably connected to the side plate (24); When the connecting rod (26) is parallel to the axis of the pressure rod (27), the pressure plate (23) is at its lowest point and the pressure plate (23) cannot drive the rotating handle (25) to move.

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