Heat dissipation system, heat dissipation control method and electronic equipment

Abstract

The invention discloses a heat dissipation system, a heat dissipation control method and electronic equipment, and relates to the field of heat dissipation. The heat dissipation system comprises a first heat dissipation assembly, a second heat dissipation assembly and a control assembly, the first heat dissipation assembly comprises a first flow channel used for containing a first heat dissipation medium and a first pump, and the first pump is arranged in the first flow channel. The second heat dissipation assembly comprises a second flow channel used for containing a second heat dissipation medium, a second pump and an expansion valve. The second pump and the expansion valve are arranged in the second flow channel. The control assembly is electrically connected with the first heat dissipation assembly and the second heat dissipation assembly and used for controlling the operation condition of at least one of the first heat dissipation assembly and the second heat dissipation assembly. The problems that the heat dissipation effect of a current heat dissipation mode is limited, and the heat dissipation mode is single can be solved.

Description

Technical Field

[0001] This application belongs to the technical field of equipment heat dissipation, specifically relating to a heat dissipation system, heat dissipation control method, and electronic equipment. Background Technology

[0002] Some electronic devices in related technologies (such as mobile phones and tablets) mainly use fan cooling and heat sink cooling. Although these methods can achieve a certain cooling effect, they are limited by factors such as stacking space, resulting in limited cooling effect. Furthermore, the cooling mode is singular and cannot better adapt to the various working modes of electronic devices. Summary of the Invention

[0003] The purpose of this application is to provide a heat dissipation system, heat dissipation control method, and electronic device that can at least solve the problems of limited heat dissipation effect and single heat dissipation mode in current heat dissipation methods.

[0004] To solve the above-mentioned technical problems, the embodiments of this application are implemented as follows: This application provides a heat dissipation system, including: a first heat dissipation component, a second heat dissipation component, and a control component; The first heat dissipation assembly includes a first flow channel for containing a first heat dissipation medium and a first pump, wherein the first pump is disposed in the first flow channel; The second heat dissipation assembly includes a second flow channel for containing a second heat dissipation medium, a second pump, and an expansion valve, wherein the second pump and the expansion valve are respectively disposed in the second flow channel; The control component is electrically connected to the first heat dissipation component and the second heat dissipation component respectively, and is used to control the operation of at least one of the first heat dissipation component and the second heat dissipation component.

[0005] This application also provides a heat dissipation control method applied to the above-mentioned heat dissipation system, which is applied to electronic devices; The heat dissipation control method includes: The operation of at least one of the first pump, the second pump, and the cooling fan is controlled according to the charging or discharging mode of the electronic device. And / or, The operation of at least one of the first pump, the second pump, and the cooling fan is controlled based on the temperature of at least one heat-generating area of ​​the electronic device.

[0006] This application also provides an electronic device, including: a device body and the above-mentioned heat dissipation system; The main body of the device is provided with at least one heat-generating area; At least a portion of each of the first and second heat dissipation components of the heat dissipation system is provided corresponding to the at least one heat-generating area.

[0007] This application also provides an electronic device, including: a memory and a processor; The memory is used to store computer programs; The processor is used to execute computer programs; The computer program, when executed by the processor, implements the above-mentioned heat dissipation control method.

[0008] In this embodiment, driven by the first pump, the first heat dissipation medium flows in the first channel; driven by the second pump, the second heat dissipation medium flows in the second channel. Simultaneously, the second heat dissipation medium in the second channel is pressurized by an expansion valve. Furthermore, both the first and second heat dissipation components are controlled by a control component. Thus, under the control of the control component, the operation of at least one of the first and second pumps can be controlled, thereby adjusting the flow rate of the first heat dissipation medium in the first channel and / or the flow rate of the second heat dissipation medium in the second channel. This flow rate adjustment can then regulate the absorbed heat, thereby controlling the heat dissipation efficiency. Therefore, when the heat dissipation system is applied to electronic devices, the heat dissipation mode can be controlled according to different modes of the electronic device, achieving an optimal combination of power consumption and heat dissipation performance. This not only extends the lifespan of the electronic device but also improves the user experience. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of a heat dissipation system (with the cooling fan removed) disclosed in an embodiment of this application; Figure 2 This is a schematic diagram of another form of heat dissipation system (with the cooling fan removed) disclosed in the embodiments of this application; Figure 3 This is a schematic diagram of another form of heat dissipation system (with a cooling fan) disclosed in the embodiments of this application; Figure 4 This is a schematic diagram of the expansion valve disclosed in the embodiments of this application; Figure 5 This is a schematic diagram of the electronic device disclosed in the embodiments of this application; Figure 6 This is a schematic diagram of an electronic device disclosed in this application in a slow discharge mode (or a temperature greater than a first temperature threshold and less than or equal to a second temperature threshold). Figure 7This is a schematic diagram of an electronic device disclosed in this application in a slow charging mode (or a condition where the temperature is greater than a second temperature threshold and less than or equal to a third temperature threshold); Figure 8 This is a schematic diagram of the electronic device disclosed in the embodiments of this application in fast discharge mode or fast charge mode (or when the temperature is greater than the third temperature threshold); Figure 9 This is a schematic block diagram of the first type of heat dissipation system disclosed in the embodiments of this application; Figure 10 This is a schematic block diagram of a second type of heat dissipation system disclosed in an embodiment of this application.

[0010] Explanation of reference numerals in the attached figures: 01-Heat dissipation system; 10-First heat dissipation assembly; 11-First flow channel; 111-First meandering section; 112-First flow channel section; 113-Third flow channel section; 12-First pump; 20 - Second heat dissipation component; 21 - Second flow channel; 211 - Second meandering section; 212 - Second flow channel section; 213 - Fourth flow channel section; 22 - Second pump; 23 - Expansion valve; 231 - First pipe; 232 - Second pipe; 233 - Third pipe; 30 - Control component; 31 - Processor module; 32 - Driver module; 33 - Switching module; 40 - Temperature sensing element; 50 - Housing; 60 - Thermal gel layer; 70 - Cooling fan; 02-Main body of the equipment; 021 - Mainboard heat source area; 022 - Battery heat source area. Detailed Implementation

[0011] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0012] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0013] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0014] refer to Figures 1 to 10 This application discloses a heat dissipation system 01, which can be applied to a heat dissipation body to achieve a heat dissipation effect and ensure that the temperature of the heat dissipation body does not become too high during operation. The heat dissipation body can be an electronic device; however, it can also be other devices besides electronic devices, and this is not specifically limited. This application embodiment will be described in detail with the heat dissipation body being an electronic device. The disclosed heat dissipation system 01 includes a first heat dissipation component 10, a second heat dissipation component 20, and a control component 30.

[0015] The first heat dissipation component 10 can be used to dissipate heat from electronic devices to meet their heat dissipation needs under certain circumstances. For example, Figure 1 As shown, the first heat dissipation assembly 10 includes a first flow channel 11 and a first pump 12. The first flow channel 11 is used to contain a first heat dissipation medium, and the first pump 12 is disposed in the first flow channel 11. Thus, when the first pump 12 is running, it can drive the first heat dissipation medium in the first flow channel 11, so that the first heat dissipation medium can flow along the first flow channel 11. Optionally, the first heat dissipation medium can be a liquid such as water.

[0016] When the heat dissipation system 01 is applied to an electronic device, the first flow channel 11 can be distributed in the heat-generating area of ​​the electronic device, such as the area where the battery is located (i.e., the battery heat source area 022 below), the area where the motherboard is located (i.e., the motherboard heat source area 021 below), etc., so as to absorb the heat emitted by the heat-generating area through the first heat dissipation medium flowing in the first flow channel 11, thereby achieving the cooling effect on the heat-generating area.

[0017] For example, the first pump 12 can be a micro pump, such as a common liquid pump, etc. Of course, it can also be other types of pumps, which are not specifically limited here.

[0018] Optionally, the first flow channel 11 can be an annular flow channel. In this case, under the driving action of the first pump 12, the first heat dissipation medium can circulate in the first flow channel 11, thereby absorbing heat when flowing through the heat-generating area and dissipating heat to the outside in other areas.

[0019] The second heat dissipation component 20 can also be used to dissipate heat from electronic devices to meet their heat dissipation needs in other situations. For example, Figure 1 As shown, the second heat dissipation assembly 20 includes a second flow channel 21, a second pump 22, and an expansion valve 23. The second flow channel 21 is used to contain the second heat dissipation medium. The second pump 22 and the expansion valve 23 are respectively disposed in the second flow channel 21. Thus, when the second pump 22 is running, it can drive the second heat dissipation medium in the second flow channel 21, allowing the second heat dissipation medium to flow along the second flow channel 21. At the same time, when the second heat dissipation medium flows into the expansion valve 23, the expansion valve 23 can also pressurize the second heat dissipation medium, causing it to undergo a phase change. For example, before the second heat dissipation medium enters the expansion valve 23, it can exist in a gaseous form. After being pressurized by the expansion valve 23, it can change from a gaseous state to a liquid state, so that the liquid second heat dissipation medium can flow along the second flow channel 21 to the heat-generating area to absorb heat. After absorbing heat, the second heat dissipation medium can change from a liquid state to a gaseous state again. Optionally, the second heat dissipation medium can be a refrigerant.

[0020] For example, the second pump 22 can be a micro pump, and the pump pressure of the second pump 22 can be greater than the pump pressure of the first pump 12. That is, the second pump 22 can be a high-pressure pump to accommodate the second heat dissipation medium under high pressure. Of course, the second pump 22 can also be a regular liquid pump, and its pump pressure can be the same as that of the first pump 12.

[0021] Based on the above settings, at least one of the first pump 12 and the second pump 22 can be controlled to operate according to actual heat dissipation needs, so as to facilitate the flow of at least one of the first heat dissipation medium and the second heat dissipation medium, thereby realizing at least one of the heat dissipation mode and the cooling mode, which is beneficial to improving the heat dissipation effect and improving the user experience.

[0022] Optionally, the second flow channel 21 can be an annular flow channel. In this case, under the driving action of the second pump 22, the second heat dissipation medium can circulate in the second flow channel 21, thereby absorbing heat when flowing through the heat-generating area and dissipating heat to the outside in other areas.

[0023] The control component 30 is used to control the heat dissipation mode of the heat dissipation system 01, so as to adaptively adjust the heat dissipation mode according to the different heat dissipation requirements of the electronic device. The control component 30 is electrically connected to the first heat dissipation component 10 and the second heat dissipation component 20 respectively, and is used to control the operation of at least one of the first heat dissipation component 10 and the second heat dissipation component 20.

[0024] Specifically, the control component 30 can receive information about the heat dissipation requirements of the electronic device to determine the actual heat dissipation requirements of the electronic device; then, it generates control commands based on the actual heat dissipation requirements and sends them to at least one of the first pump 12 and the second pump 22, so that at least one of the first pump 12 and the second pump 22 operates as required, such as adjusting the speed and power of at least one of the first pump 12 and the second pump 22, thereby adjusting the flow rate of the first heat dissipation medium in the first flow channel 11 and the second heat dissipation medium in the second flow channel 21, so as to switch the heat dissipation mode and match the current heat dissipation mode with the actual heat dissipation requirements of the electronic device.

[0025] Optionally, when the electronic device is running at the first power, the control component 30 can control the first pump 12 and the second pump 22 to start simultaneously and control both to run at maximum power, thereby maximizing the flow rate of the first heat dissipation medium and the second heat dissipation medium, and thus absorbing the most heat, so as to achieve rapid heat dissipation and cooling of the electronic device, and prevent the electronic device from overheating.

[0026] When the electronic device operates at a second power lower than the first power, the control component 30 can control the first pump 12 and the second pump 22 to start simultaneously according to the actual operating conditions of the electronic device, and control both to operate at a higher power. This allows for a larger flow rate of the first and second heat dissipation media, thereby absorbing more heat and achieving faster heat dissipation and cooling of the electronic device to prevent the electronic device from overheating.

[0027] When the electronic device operates at a third power lower than the second power, the control component 30 can control the second pump 22 to start and operate according to the actual operating conditions of the electronic device, so that heat can be absorbed through the second heat dissipation medium to achieve heat dissipation and cooling of the electronic device, thereby preventing the electronic device from overheating.

[0028] When the electronic device operates at a fourth power lower than the third power, the control component 30 can control the first pump 12 to start and operate according to the actual operating conditions of the electronic device, so that heat can be absorbed through the first heat dissipation medium to achieve heat dissipation and cooling of the electronic device, so as to prevent the electronic device from overheating.

[0029] Based on the above configuration, the heat dissipation system 01 of this application embodiment can control the operation of at least one of the first pump 12 and the second pump 22 under the control of the control component 30. This allows for the adjustment of at least one of the flow rates of the first heat dissipation medium in the first flow channel 11 and the second heat dissipation medium in the second flow channel 21. By adjusting the flow rates, the absorbed heat can be regulated, thereby controlling the heat dissipation efficiency. Therefore, when the heat dissipation system 01 is applied to electronic devices, its heat dissipation mode can be controlled according to different modes of the electronic device. This achieves an optimal combination of power consumption and heat dissipation performance, which is beneficial for extending the service life of the electronic device and improving the user experience.

[0030] refer to Figure 9 and Figure 10 In some embodiments, the control component 30 may include a drive module 32, a switching module 33, a processor module 31, etc. In addition, the control component 30 may also include a heat source monitoring module (i.e., the temperature detection element 40 described below).

[0031] like Figure 9 As shown, the main function of the drive module 32 is to generate drive voltages Vout_P1 / Vout_N1 for the first pump 12 and the second pump 22. Additionally, the drive module 32 is connected to the power supply (VCC) to supply power. The drive module 32 is connected to the processor module 31's IIC1 signal via its own IIC1 signal, allowing it to receive control commands from the processor module 31. This enables the drive module 32 to perform initialization settings, adjust the voltage amplitude of the output drive voltages Vout_P1 / Vout_N1, and perform frequency adjustments.

[0032] When the drive module 32 receives the setting parameters of the low-frequency voltage (Vefficient) from the processor module 31 via the IIC1 signal, the drive module 32 can output the peak-to-peak voltage of the drive voltage Vout_P1 / Vout_N1 as the Vefficient output. In this case, the drive module 32 can generate a drive voltage for the first pump 12, thereby realizing the operation control of the first pump 12 to dissipate heat through the flow of the first heat dissipation medium.

[0033] When the drive module 32 receives the setting parameters of the high-frequency voltage (Vpermance) from the processor module 31 via the IIC1 signal, the drive module 32 can output the peak-to-peak voltage of the drive voltage Vout_P1 / Vout_N1 as the Vpermance output. In this case, the drive module 32 can generate a drive voltage for the second pump 22, thereby realizing the operation control of the second pump 22 to dissipate heat or cool through the flow of the second heat dissipation medium.

[0034] Continue to refer to Figure 9 The switching module 33 is connected between the drive module 32 and the first pump 12 and the second pump 22 to facilitate the switching of operation between the first pump 12 and the second pump 22. Of course, in some other embodiments, when the first pump 12 and the second pump 22 both use independent drive modules 32, the switching module 33 may not be used, and they may be driven separately by their respective independent drive modules 32.

[0035] The main function of the switching module 33 is to switch and control the output drive voltages Vout_P1B / Vout_N1B and Vout_P2B / Vout_N2B based on EN1B / EN2B. Specifically, when EN1B is high, the input voltage signals Vout_P1 / Vout_N1 of the switching module 33 are connected to the output signals Vout_P1B / Vout_N1B; when EN2B is high, the input voltage signals Vout_P1 / Vout_N1 of the switching module 33 are connected to the output signals Vout_P2B / Vout_N2B. It should be noted that the input voltage signals Vout_P1 / Vout_N1 of the switching module 33 can be connected to both the output signals Vout_P1B / Vout_N1B and Vout_P2B / Vout_N2B simultaneously, or they can be connected to Vout_P1B / Vout_N1B or Vout_P2B / Vout_N2B individually.

[0036] The main function of processor module 31 is to transmit heat dissipation requirements to drive module 32 via IIC1 signal, set the configuration parameters of switching module 33, and transmit control signals EN1B / EN2B to switching module 33. In addition, processor module 31 can also send PWM signals to cooling fan 70 via PWM lines to control the operation of cooling fan 70, thereby enabling start / stop and speed adjustment of cooling fan 70. It should be noted that the operation of cooling fan 70 is not limited to start or stop; the power supply of cooling fan 70 can also be controlled and adjusted via PWM signals to adaptively adjust heat dissipation performance.

[0037] refer to Figure 5 , Figure 7 and Figure 8In some embodiments, the heat dissipation system 01 may further include a cooling fan 70, which is configured to correspond to a local area of ​​the first flow channel 11 and the second flow channel 21 respectively. In this way, after the cooling fan 70 is started, it can dissipate the heat emitted by the first flow channel 11 and the second flow channel 21 respectively, thereby improving the heat dissipation effect of the first heat dissipation medium in the first flow channel 11 and the heat dissipation effect of the second heat dissipation medium in the second flow channel 21.

[0038] Optionally, the cooling fan 70 can be located in the region of the first flow channel 11 near the output end of the first pump 12. This allows for cooling of the first heat dissipation medium output from the first pump 12, enabling the cooled medium to be transported to the heat-generating area through the first flow channel 11. Alternatively, the cooling fan 70 can be located in the region of the first flow channel 11 near the input end of the first pump 12. This allows the first heat dissipation medium to be cooled before entering the first pump 12, mitigating the problem of the high-temperature first heat dissipation medium transferring heat to the first pump 12 and causing the first pump 12 to overheat.

[0039] Additionally, the cooling fan 70 can be located in the area of ​​the second flow channel 21 near the output end of the second pump 22. This allows for cooling of the second heat dissipation medium output from the second pump 22, enabling the cooled medium to be transported to the heat-generating area through the second flow channel 21. Alternatively, the cooling fan 70 can be located in the area of ​​the second flow channel 21 near the input end of the second pump 22. This allows the second heat dissipation medium to be cooled before entering the second pump 22, mitigating the problem of the hotter medium transferring heat to the second pump 22 and causing it to overheat.

[0040] The cooling fan 70 is electrically connected to the control component 30, so the operation of the cooling fan 70 can be controlled by the control component 30 to adjust the operating speed, operating power, etc. of the cooling fan 70 according to the actual heat dissipation requirements.

[0041] When the electronic device has a high heat dissipation requirement, the first and / or second heat dissipation media absorb more heat. In this case, the control component 30 controls the cooling fan 70 to increase its operating speed and power to blow away more heat from the first and / or second heat dissipation media, thereby improving the heat dissipation effect. Conversely, when the electronic device has a low heat dissipation requirement, the first and / or second heat dissipation media absorb less heat. In this case, the control component 30 controls the cooling fan 70 to decrease its operating speed and power to blow away less heat from the first and / or second heat dissipation media, thereby relatively reducing the heat dissipation effect.

[0042] When the heat dissipation system 01 is applied to electronic devices, the control component 30 can adjust the heat dissipation mode of the heat dissipation system 01 according to the heat dissipation requirements of the electronic devices. Specifically, the control component 30 can control the operation of at least one of the first pump 12, the second pump 22, and the cooling fan 70 according to the heat dissipation requirements of the electronic devices. This includes: The control component 30 is used to control the operation of the first pump 12 when the electronic device is in the first operating mode. In this first operating mode, the heat generated is relatively small. In this case, the control component 30 can control the heat dissipation system 01 to operate in the first heat dissipation mode, that is, to control the operation of the first pump 12 alone. The first pump 12 drives the first heat dissipation medium in the first flow channel 11 to flow through the heat-generating area of ​​the electronic device, thereby absorbing heat through the first heat dissipation medium and cooling the heat-generating area.

[0043] Optionally, the first operating mode of the electronic device can be the normal discharge mode of the electronic device, that is, the electronic device operates in a low-power mode. In this case, the heat generated by the heat-generating area is less, so only the heat dissipation component 10 is needed to cool down the heat-generating area.

[0044] The control component 30 is also used to control the operation of the first pump 12 and the cooling fan 70 respectively when the electronic device is in the second operating mode. In this second operating mode, more heat is generated than in the first operating mode. In this case, the control component 30 can control the cooling system 01 to operate in the second cooling mode. Driven by the first pump 12, the first heat dissipation medium flows through the first flow channel 11 through the heat-generating area to absorb heat. Because the heat generated by the electronic device increases, the heat absorbed by the first heat dissipation medium in the first flow channel 11 from the heat-generating area is greater than in the first operating mode, causing the temperature of the first heat dissipation medium to rise. Therefore, the cooling fan 70 can blow away some of the heat from the first flow channel 11, achieving a cooling effect on the first heat dissipation medium and preventing the temperature of the first heat dissipation medium from becoming too high and affecting the heat dissipation effect on the heat-generating area.

[0045] Optionally, the second operating mode of the electronic device can be the normal charging mode (i.e., slow charging mode). In this case, the heat generated by the heat-generating area is increased compared to the normal discharge mode, so the heat dissipation effect of the heat-generating area can be achieved by combining the first heat dissipation component 10 with the cooling fan 70.

[0046] The control component 30 is used to control the operation of the second pump 22 and the cooling fan 70 when the electronic device is in the third operating mode. In this third operating mode, more heat is generated than in the second operating mode. Therefore, the control component 30 can control the cooling system 01 to operate in the third cooling mode. Driven by the second pump 22, the second heat dissipation medium flows through the second flow channel 21 to the heat-generating area to absorb heat. Since the heat generated by the electronic device is greater than in the second operating mode, the temperature of the second heat dissipation medium rises. Therefore, the cooling fan 70 can blow air through a portion of the second flow channel 21 to remove some of the heat, achieving a cooling effect on the second heat dissipation medium and preventing its excessive temperature from affecting the heat dissipation effect on the heat-generating area.

[0047] Optionally, the third operating mode of the electronic device can be the performance mode of the electronic device, that is, the electronic device operates in a high-power mode. In this case, the heat generated in the heat-generating area increases rapidly, so the second heat dissipation component 20 and the cooling fan 70 are needed to achieve the heat dissipation and cooling effect of the heat-generating area.

[0048] Of course, the electronic device can also operate in a fourth mode. The control component 30 controls the second pump 22 and the cooling fan 70 to operate in this fourth mode. It should be noted that the heat dissipation in this mode is essentially the same as in the third operating mode described above, and will not be elaborated further. Optionally, the fourth operating mode can be a fast charging mode.

[0049] In addition to the above-mentioned heat dissipation modes, the heat dissipation system 01 can also perform other heat dissipation modes. For example, the control component 30 can also control the second pump 22 to operate independently, or control the first pump 12, the second pump 22 and the cooling fan 70 to operate together, etc. The specific mode can be selected according to the actual operating conditions of the electronic equipment.

[0050] In other embodiments, the control component 30 may also control the heat dissipation mode of the heat dissipation system 01 according to the temperature of the electronic device. Here, the temperature can be the temperature of the heat-generating area, or it can be the temperature of other areas; no specific limitation is made here.

[0051] To obtain the temperature of the electronic device, the heat dissipation system 01 may also include a temperature sensing element 40, such as... Figure 9 and Figure 10 As shown. The temperature sensing element 40 is disposed in a part of the electronic device for detecting the temperature of that part of the electronic device. For example, as... Figures 5 to 8As shown, temperature resistors RT1 and RT2 are used. RT1 can be set in the motherboard heat source area 021, and RT2 can be set in the battery heat source area 022. In addition, RT1 and RT2 can be set at the input pins (such as ADC input pins) of the processor module 31 of the electronic device to collect the heat source temperature value.

[0052] Based on the above settings, the control component 30 can also control the operation of at least one of the first pump 12, the second pump 22, and the cooling fan 70 according to the temperature of the electronic device. Specifically, this includes: The control component 30 is used to control the operation of the first pump 12 when the temperature of the electronic device is greater than a first temperature threshold and less than or equal to a second temperature threshold. When the temperature of the electronic device is greater than the first temperature threshold and less than or equal to the second temperature threshold, it indicates that the electronic device generates relatively little heat. In this case, the control component 30 can control the heat dissipation system 01 to enter a first heat dissipation mode, that is, to control the operation of the first pump 12 alone. The first pump 12 drives the first heat dissipation medium in the first flow channel 11 to flow through the heat-generating area of ​​the electronic device, thereby absorbing heat through the first heat dissipation medium and cooling the heat-generating area.

[0053] The control component 30 is used to control the operation of the first pump 12 and the heat dissipation component respectively when the temperature of the electronic device is greater than the second temperature threshold and less than or equal to the point temperature threshold. Based on this, the heat generated by the electronic device increases. In this case, the control component 30 can control the heat dissipation system 01 to enter a second heat dissipation mode. Driven by the first pump 12, the first heat dissipation medium flows through the first flow channel 11 through the heat-generating area to absorb heat. As the heat generated by the electronic device increases, the heat absorbed by the first heat dissipation medium in the first flow channel 11 from the heat-generating area also increases, causing the temperature of the first heat dissipation medium to rise. Thus, the cooling fan 70 can blow away some of the heat from the first flow channel 11 to achieve a cooling effect on the first heat dissipation medium and prevent the temperature of the first heat dissipation medium from becoming too high and affecting the heat dissipation effect on the heat-generating area.

[0054] When the temperature of the electronic device exceeds a third temperature threshold, the control component 30 controls the second pump 22 and the cooling fan 70 to operate separately. This causes the heat generated by the electronic device to increase further. In this case, the control component 30 can control the cooling system 01 to enter a third cooling mode. Driven by the second pump 22, the second heat dissipation medium flows through the second flow channel 21 to the heat-generating area to absorb heat. Since the heat generated by the electronic device also increases, the temperature of the second heat dissipation medium rises. Therefore, the cooling fan 70 can blow air through a portion of the second flow channel 21 to remove some heat, achieving a cooling effect on the second heat dissipation medium and preventing its excessive temperature from affecting the heat dissipation effect on the heat-generating area.

[0055] In addition to the aforementioned heat dissipation modes, the control component 30 can also adaptively adjust the heat dissipation mode of the heat dissipation system 01 according to other temperature ranges of the electronic device. For example, the control component 30 can also control the second pump 22 to operate independently, or control the first pump 12, the second pump 22, and the cooling fan 70 to operate together, depending on the actual operating conditions of the electronic device, to achieve a good heat dissipation effect.

[0056] refer to Figure 2 and Figure 3 In some embodiments, the heat dissipation system 01 may further include a housing 50, and the first heat dissipation component 10 and the second heat dissipation component 20 are both provided inside the housing 50. In this way, the housing 50 can be used to install and protect the first heat dissipation component 10 and the second heat dissipation component 20.

[0057] Among them, such as Figure 3 As shown, the wall of the housing 50 may be provided with a heat dissipation gel layer 60, and the cooling fan 70 is disposed on the heat dissipation gel layer 60. In this way, when the cooling fan 70 is started, the heat transferred to the housing 50 by the first heat dissipation component 10 and the second heat dissipation component 20 can be efficiently transferred to the cooling fan 70 through the heat dissipation gel layer 60, and finally the heat is blown to the outside by the cooling fan 70, thereby achieving the heat dissipation effect of the first heat dissipation component 10 and the second heat dissipation component 20.

[0058] Optionally, the cooling fan 70 may have a metal base, which may be connected to the thermal gel layer 60. The thermal gel layer 60 may be disposed on the outer wall of the housing 50 so as to transfer the heat inside the housing 50 to the outside through the thermal gel layer 60 and the cooling fan 70.

[0059] In some more specific embodiments, the housing 50 may surround the outer side of a portion of the first flow channel 11 and the outer side of a portion of the second flow channel 21, so as to dissipate heat from the first heat dissipation component 10 at the portion of the first flow channel 11 and the second heat dissipation component 20 at the portion of the second flow channel 21.

[0060] refer to Figure 4 In some embodiments, the expansion valve 23 may include a first pipe 231, a second pipe 232, and a third pipe 233 connected in sequence. The first pipe 231 and the third pipe 233 are respectively connected to the second flow channel 21, so that the second heat dissipation medium in the second flow channel 21 can flow into the first pipe 231, the second pipe 232, and the third pipe 233 in sequence, and then flow back into the second flow channel 21. In this way, the second heat dissipation medium in the second flow channel 21 can flow through the expansion valve 23.

[0061] Furthermore, the inner diameters of the first pipe 231 and the third pipe 233 are both larger than the inner diameter of the second pipe 232, forming a pipe that is thicker at both ends and thinner in the middle. Based on this, during the process of the second heat dissipation medium flowing through the second pipe 232, it will be pressurized by the inner wall of the second pipe 232, thereby causing the second heat dissipation medium to undergo a phase change, and then flow back to the second flow channel 21, and flow through the second flow channel 21 to the heat-generating area, so as to absorb the heat of the heat-generating area and thus achieve the heat dissipation effect.

[0062] Based on the aforementioned heat dissipation system 01, this application also discloses an electronic device, which can be a mobile phone, tablet computer, e-reader, etc., and of course, other devices are also possible, without specific limitations here. The disclosed electronic device includes a device body 02 and the aforementioned heat dissipation system 01. Optionally, the electronic device may include a motherboard, a sub-board, a battery, and other structures. It should be noted that the specific structure and working principle of the device body 02 can be referred to the prior art, and will not be described in detail here.

[0063] The device body 02 has at least one heat-generating area, and at least a portion of the first heat-generating component 10 and the second heat-generating component 20 of the heat dissipation system 01 are respectively configured to correspond to the at least one heat-generating area. Based on this configuration, the first heat-generating component 10 and the second heat-generating component 20 can dissipate heat from at least one heat-generating area of ​​the electronic device to prevent the temperature of the heat-generating area from becoming too high and affecting the normal operation of the electronic device.

[0064] In some embodiments, at least one heat-generating area may include a motherboard heat source area 021 and a battery heat source area 022. In addition, at least one heat-generating area may also include a sub-board heat source area, etc., without specific limitations.

[0065] At least a portion of the first flow channel 11 of the first heat dissipation component 10 passes through the motherboard heat source region 021 and the battery heat source region 022 respectively. In this way, the heat dissipated by the motherboard heat source region 021 and the battery heat source region 022 can be absorbed by the first heat dissipation medium flowing in the first flow channel 11, so as to achieve the heat dissipation effect of the motherboard heat source region 021 and the battery heat source region 022.

[0066] At least a portion of the second flow channel 21 of the second heat dissipation component 20 passes through the motherboard heat source region 021 and the battery heat source region 022 respectively. In this way, the heat dissipated by the motherboard heat source region 021 and the battery heat source region 022 can be absorbed by the second heat dissipation medium flowing in the second flow channel 21, so as to achieve the heat dissipation effect of the motherboard heat source region 021 and the battery heat source region 022.

[0067] It should be noted that the heat source area 021 of the motherboard can be cooled by the first heat dissipation component 10 and the second heat dissipation component 20 together, or the heat source area 022 of the battery can be cooled by the first heat dissipation component 10 and the second heat dissipation component 20 together, or the heat source area 021 of the motherboard can be cooled by the first heat dissipation component 10 and the heat source area 022 of the battery can be cooled by the second heat dissipation component 20, or the heat source area 021 of the motherboard can be cooled by the second heat dissipation component 20 and the heat source area 022 of the battery can be cooled by the first heat dissipation component 10.

[0068] In addition, the first pump 12 and the second pump 22 can be located in the area where the sub-plate is located.

[0069] refer to Figures 5 to 8 In some embodiments, the first flow channel 11 may include a first flow channel segment 112 and a third flow channel segment 113. The first flow channel segment 112 is correspondingly disposed to the motherboard heat source area 021, and at least a portion of the third flow channel segment 113 is correspondingly disposed to the motherboard heat source area 021 and the battery heat source area 022, respectively. The inner diameter of the first flow channel segment 112 is larger than the inner diameter of the third flow channel segment 113.

[0070] It should be noted that during the operation of electronic devices, the motherboard heat source area 021 generates a lot of heat, and the increase in heat will affect the normal operation of electronic devices. Therefore, the first flow channel section 112 with a larger inner diameter is set to correspond to the motherboard heat source area 021 so that more first heat dissipation medium can flow through the motherboard heat source area 021, thereby further improving the heat dissipation effect of the motherboard heat source area 021.

[0071] Optionally, the inner diameter of the first flow channel section 112 can be larger than the inner diameter of the third flow channel section 113, so that more flow of the first heat dissipation medium can flow to the motherboard heat source area 021, thereby improving the heat dissipation efficiency of the area.

[0072] In addition, such as Figure 1 As shown, the first flow channel 11 may also include a first meandering section 111, which can be connected to the first flow channel section 112 and the third flow channel section 113. Furthermore, the first meandering section 111 can increase the corresponding area of ​​the motherboard heat source area 021, thereby improving heat dissipation efficiency.

[0073] In some more specific embodiments, the first flow channel 11 can be a rectangular flow channel, and the first heat dissipation medium can circulate in the first flow channel 11; the first flow channel segment 112 can be located at one short side of the rectangular flow channel, and the first pump 12 can be located at the other short side of the rectangular flow channel, and the first heat dissipation medium can flow through the motherboard heat source area 021 through the first flow channel segment 112 to achieve the heat dissipation effect on the motherboard heat source area 021; the third flow channel segment 113 can be located at the two long sides of the rectangular flow channel, and the first heat dissipation medium can flow through the motherboard heat source area 021 and the battery heat source area 022 through the third flow channel segment 113 respectively, so as to achieve the heat dissipation effect on the motherboard heat source area 021 and the battery heat source area 022 respectively.

[0074] refer to Figures 5 to 8 In some embodiments, the second flow channel 21 may include a second flow channel segment 212 and a fourth flow channel segment 213. The second flow channel segment 212 is correspondingly disposed to the motherboard heat source region 021, and at least a portion of the fourth flow channel segment 213 is correspondingly disposed to the motherboard heat source region 021 and the battery heat source region 022, respectively. The inner diameter of the second flow channel segment 212 is larger than the inner diameter of the fourth flow channel segment 213.

[0075] It should be noted that during the operation of electronic devices, the motherboard heat source area 021 generates a lot of heat, and the increase in heat will affect the normal operation of electronic devices. Therefore, the second flow channel section 212 with a larger inner diameter is set to correspond to the motherboard heat source area 021 so that more second heat dissipation medium can flow through the motherboard heat source area 021, thereby further improving the heat dissipation effect of the motherboard heat source area 021.

[0076] In addition, such as Figure 1 As shown, the second flow channel 21 may also include a second meandering section 211, which can be connected to the second flow channel section 212 and the fourth flow channel section 213. Furthermore, the second meandering section 211 can increase the corresponding area of ​​the motherboard heat source area 021, thereby improving heat dissipation efficiency.

[0077] Optionally, the inner diameter of the first flow channel section 112 can be larger than the inner diameter of the third flow channel section 113, so that more flow of the first heat dissipation medium can flow to the motherboard heat source area 021, thereby improving the heat dissipation efficiency of this area. In some more specific embodiments, the second flow channel 21 can be a rectangular flow channel, and the second heat dissipation medium can circulate in the second flow channel 21; the second flow channel section 212 can be located at one short side of the rectangular flow channel, and the second pump 22 can be located at the other short side of the rectangular flow channel, and the second heat dissipation medium can flow through the motherboard heat source area 021 through the second flow channel section 212 to achieve the heat dissipation effect on the motherboard heat source area 021; the fourth flow channel section 213 can be located at the two long sides of the rectangular flow channel, and the second heat dissipation medium can flow through the motherboard heat source area 021 and the battery heat source area 022 through the fourth flow channel section 213 respectively, so as to achieve the heat dissipation effect on the motherboard heat source area 021 and the battery heat source area 022 respectively.

[0078] Based on the aforementioned electronic device, this application also discloses a heat dissipation control method applied to the aforementioned heat dissipation system 01, which can be applied to electronic devices. The heat dissipation system 01 includes a first heat dissipation component 10, a second heat dissipation component 20, and a cooling fan 70. The cooling fan 70 is configured to correspond to a local area of ​​at least one of the first flow channel 11 and the second flow channel 21, and is electrically connected to the control component 30.

[0079] Based on the above settings, the heat dissipation control method in this application embodiment includes: The operation of at least one of the first pump 12, the second pump 22, and the cooling fan 70 is controlled according to the charging or discharging mode of the electronic device. Specifically, this includes: When the electronic device is in slow charging mode, the control component 30 controls the first pump 12 and the cooling fan 70 to operate respectively; when the electronic device is in fast charging mode, the control component 30 controls the second pump 22 and the cooling fan 70 to operate respectively; when the electronic device is in slow discharging mode, the control component 30 controls the first pump 12 to operate; when the electronic device is in fast discharging mode, the control component 30 controls the second pump 22 and the cooling fan 70 to operate respectively.

[0080] In addition to the above modes, the electronic device can also be in other modes. Accordingly, the control component 30 can control the first pump 12, the second pump 22 and the heat dissipation component to achieve different operating modes.

[0081] In this embodiment of the application, the heat dissipation control method may further include: The operation of at least one of the first pump 12, the second pump 22, and the cooling fan 70 is controlled based on the temperature of at least one heat-generating area of ​​the electronic device. Specifically, this includes: In some embodiments, temperature can be detected at least one of the heat source areas 021 on the motherboard and 022 on the battery of the electronic device, and this can be used as a reference to determine the temperature of the electronic device. Alternatively, a temperature detection element 40 can be used to detect the temperature of at least one heat-generating area, wherein the temperature detection element 40 can be a temperature sensor, a temperature resistor, etc.

[0082] When the temperature of the heated area is detected to be greater than the first temperature threshold and less than or equal to the second temperature threshold, the first pump 12 is controlled to run by the control component 30; when the temperature of the heated area is detected to be greater than the second temperature threshold and less than or equal to the third temperature threshold, the first pump 12 and the cooling fan 70 are controlled to run by the control component 30 respectively; when the temperature of the heated area is detected to be greater than the third temperature threshold, the second pump 22 and the cooling fan 70 are controlled to run by the control component 30 respectively.

[0083] In addition to the above methods, the operation of at least one of the first pump 12, the second pump 22, and the cooling fan 70 can be adaptively controlled according to other temperature conditions.

[0084] Example 1: refer to Figure 7 When the electronic device is in normal charging mode (i.e., slow charging mode), the processor module 31 sends the Vefficient voltage setting parameter to the drive module 32 via IIC1. The drive module 32 outputs the set voltage as the peak-to-peak voltage of the drive voltage Vout_P1 / Vout_N1. The processor module 31 sets EN1B to a high level. Under this enable signal, the input voltage signal Vout_P1 / Vout_N1 of the switching module 33 is connected to the output signal Vout_P1B / Vout_N1B, the first pump 12 starts, and the first heat dissipation medium flows. The processor module 31 sends a PWM signal to the cooling fan 70 via the PWM line, causing the cooling fan 70 to start. Based on the above settings, a heat dissipation mode in which the first heat dissipation component 10 and the cooling fan 70 cooperate is realized.

[0085] refer to Figure 8When the electronic device is in fast charging mode, the processor module 31 sends the Vpermance voltage setting parameters to the drive module 32 via IIC1. The drive module 32 outputs the set voltage as the peak-to-peak voltage of the drive voltage Vout_P1 / Vout_N1. The processor module 31 sets EN2B to a high level. Under this enable signal, the input voltage signals Vout_P1 / Vout_N1 and the output signals Vout_P2B / Vout_N2B of the switching module 33 are connected, the second pump 22 starts, and the flow of the second heat dissipation medium is realized. The processor module 31 sends a PWM signal to the cooling fan 70 through the PWM line, causing the cooling fan 70 to start. Based on the above settings, a heat dissipation mode in which the second heat dissipation component 20 and the cooling fan 70 cooperate is realized.

[0086] refer to Figure 6 When the electronic device is in normal discharge mode (i.e., non-performance mode), the processor module 31 sends the Vefficient voltage setting parameter to the drive module 32 via IIC1. The drive module 32 outputs the set voltage as the peak-to-peak voltage of the drive voltage Vout_P1 / Vout_N1. The processor module 31 sets EN1B to a high level. Under this enable signal, the input voltage signal Vout_P1 / Vout_N1 of the switching module 33 is connected to the output signal Vout_P1B / Vout_N1B, the first pump 12 is started, and the flow of the second heat dissipation medium is realized. Based on the above settings, the heat dissipation mode of the first heat dissipation component 10 is realized.

[0087] refer to Figure 8 When the electronic device is in fast discharge mode (i.e., performance mode), the processor module 31 sends the Vpermance voltage setting parameters to the drive module 32 via IIC1. The drive module 32 outputs the set voltage as the peak-to-peak voltage of the drive voltage Vout_P1 / Vout_N1. The processor module 31 sets EN2B to a high level. Under this enable signal, the input voltage signals Vout_P1 / Vout_N1 and the output signals Vout_P2B / Vout_N2B of the switching module 33 are connected, the second pump 22 starts, and the flow of the second heat dissipation medium is realized. The processor module 31 sends a PWM signal to the cooling fan 70 through the PWM line, causing the cooling fan 70 to start. Based on the above settings, a heat dissipation mode in which the second heat dissipation component 20 and the cooling fan 70 cooperate is realized.

[0088] Example 2: refer to Figure 6When the temperature of the temperature resistance (at least one of RT1 and RT2) of the electronic device is greater than the first temperature threshold T1 and less than or equal to the second temperature threshold T2, the processor module 31 sends the Vefficient voltage setting parameter to the drive module 32 via IIC1. The drive module 32 outputs the set voltage as the peak-to-peak voltage of the drive voltage Vout_P1 / Vout_N1. The processor module 31 sets EN1B to a high level. Under this enable signal, the input voltage signal Vout_P1 / Vout_N1 of the switching module 33 is connected to the output signal Vout_P1B / Vout_N1B, the first pump 12 is started, and the first heat dissipation medium flows. Based on the above settings, the heat dissipation mode of the first heat dissipation component 10 is realized.

[0089] refer to Figure 7 When the temperature of the temperature resistance (at least one of RT1 and RT2) of the electronic device is greater than the second temperature threshold T2 and less than or equal to the third temperature threshold T3, the processor module 31 sends the Vefficient voltage setting parameter to the drive module 32 via IIC1. The drive module 32 outputs the set voltage as the peak-to-peak voltage of the drive voltage Vout_P1 / Vout_N1. The processor module 31 sets EN1B to a high level. Under this enable signal, the input voltage signal Vout_P1 / Vout_N1 of the switching module 33 is connected to the output signal Vout_P1B / Vout_N1B, the first pump 12 starts, and the first heat dissipation medium flows. The processor module 31 sends a PWM signal to the cooling fan 70 via the PWM line, causing the cooling fan 70 to start. Based on the above settings, a heat dissipation mode in which the first heat dissipation component 10 and the cooling fan 70 cooperate is realized.

[0090] refer to Figure 8 When the temperature of the temperature resistance (at least one of RT1 and RT2) of the electronic device exceeds the third temperature threshold T3, the processor module 31 sends the Vpermance voltage setting parameters to the drive module 32 via IIC1. The drive module 32 outputs the set voltage as the peak-to-peak voltage of the drive voltage Vout_P1 / Vout_N1. The processor module 31 sets EN2B to a high level. Under this enable signal, the input voltage signals Vout_P1 / Vout_N1 and the output signals Vout_P2B / Vout_N2B of the switching module 33 are connected, the second pump 22 starts, and the flow of the second heat dissipation medium is realized. The processor module 31 sends a PWM signal to the cooling fan 70 through the PWM line, causing the cooling fan 70 to start. Based on the above settings, a heat dissipation mode in which the second heat dissipation component 20 and the cooling fan 70 cooperate is realized.

[0091] This application also discloses a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the steps of the above-described heat dissipation control method.

[0092] This application also discloses a computer program product, which includes computer instructions stored in a computer-readable storage medium and adapted to be read and executed by a processor to enable the processor to perform the steps of the above-described heat dissipation control method.

[0093] This application also discloses an electronic device, including a memory and a processor, wherein the memory is used to store computer programs and the processor is used to execute computer programs; The steps of the above-mentioned heat dissipation control method are implemented by the computer program when it is executed by the processor.

[0094] In summary, the embodiments of this application can switch between different heat dissipation modes according to actual heat dissipation needs, thereby combining the power consumption and heat dissipation performance of electronic devices to improve user experience.

[0095] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A heat dissipation system, characterized in that, include: First heat dissipation component (10), second heat dissipation component (20) and control component (30); The first heat dissipation assembly (10) includes a first flow channel (11) for containing a first heat dissipation medium and a first pump (12), wherein the first pump (12) is disposed in the first flow channel (11). The second heat dissipation component (20) includes a second flow channel (21) for containing a second heat dissipation medium, a second pump (22) and an expansion valve (23), wherein the second pump (22) and the expansion valve (23) are respectively disposed in the second flow channel (21). The control component (30) is electrically connected to the first heat dissipation component (10) and the second heat dissipation component (20) respectively, and is used to control the operation of at least one of the first heat dissipation component (10) and the second heat dissipation component (20).

2. The heat dissipation system according to claim 1, characterized in that, The heat dissipation system (01) further includes a cooling fan (70), which is respectively configured to correspond to a local area of ​​the first flow channel (11) and the second flow channel (21), and the cooling fan (70) is electrically connected to the control component (30).

3. The heat dissipation system according to claim 2, characterized in that, The heat dissipation system (01) is applied to electronic devices; The control component (30) is used to control the operation of at least one of the first pump (12), the second pump (22) and the cooling fan (70) according to the operating mode of the electronic device.

4. The heat dissipation system according to claim 3, characterized in that, The control component (30) is used to control the operation of the first pump (12) when the electronic device is in the first operating mode; And / or, When the electronic device is in the second operating mode, the control component (30) controls the first pump (12) and the cooling fan (70) to operate respectively. And / or, When the electronic device is in the third or fourth operating mode, the control component (30) controls the second pump (22) and the cooling fan (70) to operate respectively.

5. The heat dissipation system according to claim 2, characterized in that, The heat dissipation system (01) is applied to electronic devices; The control component (30) is used to control the operation of at least one of the first pump (12), the second pump (22) and the cooling fan (70) according to the temperature of the electronic device.

6. The heat dissipation system according to claim 5, characterized in that, The control component (30) is used to control the first pump (12) to operate when the temperature of the electronic device is greater than a first temperature threshold and less than or equal to a second temperature threshold. And / or, When the temperature of the electronic device is greater than the second temperature threshold and less than or equal to the third temperature threshold, the control component (30) controls the first pump (12) and the cooling fan (70) to operate respectively. And / or, When the temperature of the electronic device is greater than the third temperature threshold, the control component (30) controls the second pump (22) and the cooling fan (70) to operate respectively.

7. The heat dissipation system according to claim 2, characterized in that, The heat dissipation system (01) further includes a housing (50), wherein at least a portion of the first flow channel (11) and the second flow channel (21) are respectively disposed inside the housing (50); The wall of the housing (50) is provided with a heat dissipation gel layer (60), and the cooling fan (70) is connected to the heat dissipation gel layer (60).

8. The heat dissipation system according to claim 1, characterized in that, The expansion valve (23) includes a first pipe (231), a second pipe (232) and a third pipe (233) connected in sequence, and the first pipe (231) and the third pipe (233) are respectively connected to the second flow channel (21); The inner diameter of the first pipe (231) and the inner diameter of the third pipe (233) are both greater than the inner diameter of the second pipe (232).

9. A heat dissipation control method, characterized in that, The heat dissipation system (01) according to any one of claims 2 to 7 is applied to an electronic device; The heat dissipation control method includes: The operation of at least one of the first pump (12), the second pump (22), and the cooling fan (70) is controlled according to the charging or discharging mode of the electronic device. And / or, The operation of at least one of the first pump (12), the second pump (22), and the cooling fan (70) is controlled according to the temperature of at least one heat-generating area of ​​the electronic device.

10. An electronic device, characterized in that, include: The main body of the device (02) and the heat dissipation system (01) as described in any one of claims 1 to 8; The main body of the device (02) is provided with at least one heat-generating area; At least a portion of the first heat dissipation component (10) and the second heat dissipation component (20) of the heat dissipation system (01) are respectively provided to correspond to the at least one heat-generating area.

11. The electronic device according to claim 10, characterized in that, The at least one heat-generating area includes a motherboard heat source area (021) and a battery heat source area (022). At least a portion of the first flow channel (11) passes through the motherboard heat source region (021) and the battery heat source region (022), respectively. At least a portion of the second flow channel (21) passes through the motherboard heat source region (021) and the battery heat source region (022), respectively.

12. An electronic device, characterized in that, include: Memory and processor; The memory is used to store computer programs; The processor is used to execute computer programs; When the computer program is executed by the processor, it implements the heat dissipation control method of claim 9.

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