Semiconductor packaging component pressure testing module with multiple pressure blocks and semiconductor packaging component testing equipment
The semiconductor packaging component pressure testing module, which uses multiple pressure blocks and a high-pressure fluid system, solves the problem of uneven pressure distribution in advanced packaging that traditional single pressure testing heads cannot meet. It achieves precise pressure control and packaging stability, thereby improving testing accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-06
- Publication Date
- 2026-05-12
AI Technical Summary
Traditional single pressure test heads are insufficient to meet the testing requirements of advanced semiconductor packaging, resulting in uneven pressure distribution. This may lead to excessively high or insufficient pressure in certain areas, affecting packaging stability and the accuracy of test results.
The semiconductor package component pressure testing module employs multiple pressure blocks to simultaneously apply downward pressure to multiple areas of the semiconductor package component through multiple movable pressure blocks and a high-pressure fluid system, ensuring complete electrical contact between each chip and the test probe and preventing warping or deformation.
It achieves precise pressure control in different areas, ensuring packaging stability and testing accuracy, while reducing equipment size and making it suitable for compact designs.
Smart Images
Figure CN122028706A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a semiconductor package component testing device, and more particularly to a semiconductor package component pressure testing module with multiple pressure blocks. Background Technology
[0002] In traditional semiconductor package component testing technology, a single pressure probe is typically used. The main function of the pressure probe is to apply downward pressure to the semiconductor package component to ensure a good electrical connection between the package component and the test probe, thereby maintaining the validity of the test. However, with the rapid development of semiconductor packaging technology, the single pressure probe approach is no longer sufficient to meet the needs of next-generation technologies, especially in the field of 3D packaging applications. These advanced packages can arrange multiple chips (such as CPUs, GPUs, SOCs, logic chips, or high-bandwidth memory) on the upper surface of the package, making the package structure more complex. These chips vary in area, thickness, and required stress conditions, placing higher demands on the accuracy of testing and the equipment.
[0003] Therefore, traditional testing equipment relying on a single pressure probe is no longer fully suitable for this type of advanced semiconductor packaging. Because existing single pressure probes may not be able to make sufficient contact with each chip, nor apply appropriate downward pressure to all chips, this leads to uneven pressure distribution during the pressure test. This can easily result in localized excessive or insufficient pressure, causing poor contact or even warping or deformation of the entire semiconductor package, ultimately affecting the stability of the package and the accuracy of the test results. Summary of the Invention
[0004] In view of this, the present invention provides a semiconductor package component pressure testing module with multiple pressure blocks and a semiconductor package component testing device, which can simultaneously apply downward pressure to multiple areas on the semiconductor package component to ensure complete electrical contact between the chip and the test probe and to prevent chip deformation.
[0005] In one embodiment, a pressure testing module for a semiconductor package component with multiple pressure blocks is disclosed. The module includes a base and multiple movable pressure blocks. The base includes at least one internal chamber and multiple opening slots. The multiple opening slots communicate with the at least one internal chamber. The multiple movable pressure blocks are respectively accommodated in the multiple opening slots of the base. The multiple movable pressure blocks correspond to different regions on the semiconductor package component. In response to at least one high-pressure fluid being filled into the at least one internal chamber, the multiple movable pressure blocks exert downward pressure on the multiple regions. The multiple regions may include local areas on the substrate of the semiconductor package component, chips (dies) located on the substrate, and local areas on the chips.
[0006] In one embodiment of a semiconductor package component pressure testing module having multiple pressure blocks, the base further includes a fixed pressure block, which corresponds to one of the multiple chips on the semiconductor package component.
[0007] In an embodiment of a semiconductor package component pressure testing module with multiple pressure blocks, the at least one internal chamber includes a first chamber and a second chamber, the plurality of opening slots includes a first opening slot and a second opening slot, and the at least one high-pressure fluid includes a first high-pressure fluid and a second high-pressure fluid; the first opening slot communicates with the first chamber, and the second opening slot communicates with the second chamber; in response to the first high-pressure fluid and the second high-pressure fluid being filled into the first chamber and the second chamber respectively, the plurality of movable pressure blocks generate a plurality of downward pressures on the plurality of regions.
[0008] In one embodiment of a semiconductor package component pressure testing module with multiple pressure blocks, the pressure of the first high-pressure fluid is different from that of the second high-pressure fluid.
[0009] In one embodiment of a semiconductor package component pressure testing module with multiple pressure blocks, the first high-pressure fluid and the second high-pressure fluid have different temperatures.
[0010] In one embodiment of a semiconductor package component pressure testing module with multiple pressure blocks, the base includes an upper housing, a lower housing, and a seal. The at least one internal cavity is located in the upper housing, and the plurality of opening slots are located in the lower housing. The lower housing has an annular groove that surrounds the at least one internal cavity, and the seal is accommodated in the annular groove.
[0011] In one embodiment of a semiconductor package component pressure testing module with multiple pressure blocks, the base includes an upper housing, a lower housing, and a diaphragm, the at least one internal chamber is located in the upper housing, the plurality of opening slots are located in the lower housing, and the diaphragm is located between the upper housing and the lower housing.
[0012] In one embodiment of a semiconductor package component pressure testing module having multiple pressure blocks, it further includes at least one bladder housed within the at least one internal cavity; wherein, in response to the at least one bladder within the at least one internal cavity being filled with the at least one high-pressure fluid, the multiple movable pressure blocks respectively generate the downward pressure on the multiple regions.
[0013] In an embodiment of a semiconductor package component pressure testing module having multiple pressure blocks, each of the opening slots includes a radial extension and an axial through portion, and each of the movable pressure blocks includes a radial flange and an axial body; the axial body passes through the axial through portion, and the radial extension is adapted to block the radial flange.
[0014] In one embodiment, a semiconductor package component testing device includes the aforementioned semiconductor package component pressure testing module with multiple pressure blocks, a fluid supply unit, a test socket, and a controller; the fluid supply unit is connected to the at least one internal chamber; the test socket corresponds to the semiconductor package component pressure testing module with multiple pressure blocks and is adapted to accommodate the semiconductor package component; the controller is electrically connected to the fluid supply unit and the test socket; the controller is adapted to control the fluid supply unit to supply high-pressure fluid to the at least one internal chamber of the semiconductor package component pressure testing module with multiple pressure blocks, and is adapted to test the semiconductor package component through the test socket.
[0015] In one embodiment of a semiconductor package component testing device, a displacement generating device is further included, which is electrically connected to the controller; the base of the semiconductor package component pressure testing module with multiple pressure blocks is connected to the displacement generating device; the controller is adapted to control the displacement generating device to make the semiconductor package component pressure testing module with multiple pressure blocks approach or move away from the test base.
[0016] In one embodiment of a semiconductor packaging component testing apparatus, the fluid supply unit includes a valve and a high-pressure fluid source; the high-pressure fluid source is connected to the at least one internal chamber, the valve is disposed between the high-pressure fluid source and the at least one internal chamber, and is electrically connected to the controller; the controller controls the opening and closing of the valve to control whether the high-pressure fluid source supplies the at least one high-pressure fluid to the at least one internal chamber.
[0017] In one embodiment of a semiconductor packaging component testing apparatus, a fluid temperature control unit is further included; the fluid temperature control unit is disposed between the high-pressure fluid source and the at least one internal chamber and is electrically connected to the controller; the controller controls the fluid temperature control unit to adjust the temperature of the at least one high-pressure fluid supplied to the at least one internal chamber.
[0018] In one embodiment of a semiconductor packaging component testing device, a pressure testing module temperature control unit is further included; the pressure testing module temperature control unit is disposed on the base and at least one of the plurality of movable pressure blocks and electrically connected to the controller; wherein the controller controls the pressure testing module temperature control unit to adjust the temperature of the base and at least one of the plurality of movable pressure blocks.
[0019] In one embodiment of a semiconductor package component testing apparatus, a test socket temperature control unit is further included; the test socket temperature control unit is electrically connected to the controller; wherein the controller controls the test socket temperature control unit to adjust the temperature of the test socket.
[0020] In one embodiment, a semiconductor package component pressure testing module with multiple pressure blocks is suitable for testing semiconductor package components; the surface of the semiconductor package component includes multiple regions; the semiconductor package component pressure testing module with multiple pressure blocks includes a base, multiple movable pressure blocks, and at least one elastic member; the base includes at least one internal cavity and multiple opening slots; the opening slots communicate with the at least one internal cavity; the movable pressure blocks are respectively accommodated in the multiple opening slots of the base; the elastic member is accommodated in the at least one internal cavity and corresponds to the multiple opening slots; the movable pressure blocks respectively correspond to the multiple regions on the semiconductor package component; in response to at least one of the movable pressure blocks being pushed against the at least one elastic member by an external force, the at least one elastic member drives at least one of the movable pressure blocks to exert downward pressure on at least one of the multiple regions.
[0021] In an embodiment of a semiconductor package component pressure testing module having multiple pressure blocks, the at least one internal chamber includes a plurality of internal chambers; the at least one elastic member includes a plurality of elastic members; the plurality of elastic members are respectively housed in the plurality of internal chambers and respectively correspond to the plurality of opening slots.
[0022] In one embodiment of a semiconductor package component pressure testing module having multiple pressure blocks, the at least one elastic element is selected from at least one of the group consisting of springs, rubber, and shape memory alloys.
[0023] In one embodiment of a semiconductor package component pressure testing module having multiple pressure blocks, the at least one elastic element includes a bladder filled with a high-pressure fluid.
[0024] In one embodiment of a semiconductor package component pressure testing module having multiple pressure blocks, the material of the capsule is selected from at least one of the group consisting of nylon, polyurethane, polyvinyl chloride, thermoplastic polyurethane, rubber, polyethylene, and silicone.
[0025] As previously stated, the semiconductor package component pressure testing module and semiconductor package component testing equipment proposed in this case, equipped with multiple pressure blocks, can apply appropriate downward pressure to different chips or regions on the semiconductor package component according to actual needs. This downward pressure is provided by a high-pressure fluid system, allowing the downward pressure applied to each region or chip to be the same or different depending on specific circumstances. For example, when testing semiconductor package components employing advanced packaging technologies, predetermined downward pressure values can be provided for various chips or regions. This not only ensures complete electrical contact between the semiconductor package component and the test probes but also prevents warping or deformation of the semiconductor package component due to uneven stress. Furthermore, by controlling the downward pressure through fluid pressure, no other brakes or pressure generators are required, effectively reducing the size of the pressure testing module and making it more suitable for compact designs. Attached Figure Description
[0026] Figure 1A perspective view of a semiconductor packaging component pressure testing module with multiple pressure blocks according to an embodiment is shown;
[0027] Figure 2 A perspective view of a semiconductor packaging component according to an embodiment is shown;
[0028] Figure 3 An exploded perspective view of a semiconductor packaging component pressure testing module with multiple pressure blocks is shown in one embodiment, wherein the upper housing is presented from a tilting angle, the lower housing is presented from a top angle, and the movable pressure blocks are not shown in this view.
[0029] Figure 4 A cross-sectional view of a semiconductor package component pressure testing module with multiple pressure blocks is shown in one embodiment;
[0030] Figure 5 A schematic diagram illustrating a semiconductor packaging component testing apparatus according to an embodiment is shown;
[0031] Figure 6 A cross-sectional view of a semiconductor package component pressure testing module with multiple pressure blocks is shown in one embodiment;
[0032] Figure 7 A cross-sectional view of a semiconductor package component pressure testing module with multiple pressure blocks is shown in one embodiment;
[0033] Figure 8A A cross-sectional view of a semiconductor package component pressure testing module with multiple pressure blocks according to an embodiment is shown; and
[0034] Figure 8B A cross-sectional view of a semiconductor package component pressure testing module with multiple pressure blocks is shown in one embodiment.
[0035] In the attached figures, the following reference numerals are used:
[0036] 2: Semiconductor packaging component pressure testing module with multiple pressure blocks
[0037] 3: Base
[0038] 301: Upper shell
[0039] 302: Lower housing
[0040] 303: Seals
[0041] 304: Annular groove
[0042] 31:Inner chamber
[0043] 311: First Chamber
[0044] 312: Second Chamber
[0045] 32: Opening groove
[0046] 321: First opening groove
[0047] 322: Second opening slot
[0048] 323: Radial extension
[0049] 324: Axial through section
[0050] 33: Fixed pressure block
[0051] 34: Diaphragm
[0052] 4: Active pressing block
[0053] 41: Radial flange
[0054] 42: Axial Body
[0055] 43: Elastic component
[0056] 431: Spring
[0057] 432: Rubber
[0058] 44: Cyst
[0059] 5: Pressure testing module temperature control unit
[0060] 6: Fluid supply unit
[0061] 61: Valve
[0062] 62: High-pressure fluid source
[0063] 63: Fluid temperature control unit
[0064] 7: Test socket
[0065] 71: Test socket temperature control unit
[0066] 8: Semiconductor packaging component testing equipment
[0067] 9: Semiconductor packaging components
[0068] 91: Chip
[0069] 11: Controller
[0070] 12: Displacement generating device Detailed Implementation
[0071] Please refer to Figures 1 to 4 . Figure 1 A perspective view of a semiconductor packaging component pressure testing module 2 with multiple pressure blocks is shown in one embodiment. Figure 2 A perspective view of a semiconductor packaging component 9 according to an embodiment is shown. Figure 3An exploded perspective view of a semiconductor packaging component pressure testing module 2 with multiple pressure blocks is shown in one embodiment, wherein the upper housing 301 (described later) is presented from a tilting angle, the lower housing 302 (described later) is presented from a top-down angle, and the movable pressure block 4 (described later) is not shown in this figure. Figure 4 A cross-sectional view of a semiconductor package component pressure testing module 2 with multiple pressure blocks is shown according to one embodiment. In some embodiments, the semiconductor package component 9 includes a plurality of chips 91. The semiconductor package component pressure testing module 2 with multiple pressure blocks includes a base 3 and a plurality of movable pressure blocks 4. The base 3 includes at least one internal chamber 31 and a plurality of opening slots 32. The plurality of opening slots 32 communicate with the at least one internal chamber 31. The plurality of movable pressure blocks 4 are respectively accommodated in the plurality of opening slots 32 of the base 3. The plurality of movable pressure blocks 4 correspond to the plurality of chips 91 on the semiconductor package component 9.
[0072] In other embodiments, the plurality of movable pressure blocks 4 may also correspond to other regions on the semiconductor package component 9. These regions can be any local area on the semiconductor package assembly, including but not limited to blank areas on the substrate where no transistors are located. Furthermore, in some embodiments, when downward pressure is applied to the chip, it can be applied to the entire chip area or a local area, such as a local area with high thermal design power (TDP) on a large chip. In response to the filling of the at least one internal chamber 31 with high-pressure fluid, the plurality of movable pressure blocks 4 respectively exert downward pressure on the plurality of chips 91 or other regions.
[0073] In some embodiments, the semiconductor packaging component 9 employs advanced packaging technology, and its upper surface is configured with multiple chips 91, including but not limited to CPUs, GPUs, HBMs (high-bandwidth memory), SOCs (system-on-a-chip), and logic dies. In some embodiments, the semiconductor packaging component 9 may also be a heterogeneous integration semiconductor packaging structure or a silicon photonics (SiPh) packaging component.
[0074] In some embodiments, the base 3 further includes a fixing block 33. The fixing block 33 corresponds to one of the plurality of chips 91 on the semiconductor package component 9, typically the chip located centrally on the semiconductor package component 9 and occupying the largest area, such as a CPU or GPU. Alternatively, the fixing block 33 may also correspond to other areas on the semiconductor package component 9, which in some embodiments may be areas occupying a large substrate area. The fixing block 33 is integral with the base 3 and typically protrudes from the lower surface of the base 3. When the entire base 3 (or the entire semiconductor package component pressure testing module 2 with multiple pressing blocks) moves (e.g., via the displacement generating device 12, detailed later), the fixing block 33 moves accordingly, thereby exerting downward pressure on the chip 91 or other areas. In some embodiments, the fixing block 33 may also correspond to multiple chips 91, for example, the fixing block 33 directly presses against multiple chips 91 of equal height.
[0075] At Figure 1 , Figure 3 and Figure 4 In this embodiment, the semiconductor packaging component pressure testing module 2 with multiple pressure blocks has one fixed pressure block 33 and six movable pressure blocks 4, which respectively correspond to Figure 2 The semiconductor package component 9 may contain individual chips 91 or other regions, but this invention is not limited to these. In different embodiments, depending on the form of the semiconductor package component 9, the number of fixed pressure blocks 33 and movable pressure blocks 4 is not limited to one or six, and the relative positional relationship, shape, and size of the fixed pressure blocks 33 and movable pressure blocks 4 can also be adjusted accordingly. In some embodiments, the semiconductor package component 9 may have more than one fixed pressure block 33. In some embodiments, one chip 91 may correspond to multiple movable pressure blocks 4. In some embodiments, one movable pressure block 4 may correspond to multiple chips 91.
[0076] In the embodiment shown in the figure, the at least one internal chamber 31 includes a first chamber 311 and three second chambers 312, and the plurality of opening slots 32 includes a plurality of first opening slots 321 and a plurality of second opening slots 322. In this embodiment, the first opening slots 321 correspond to and communicate with the first chamber 311, and the second opening slots 322 correspond to and communicate with the second chambers 312. In response to the first chamber 311 and the second chamber 312 being filled with a first high-pressure fluid and a second high-pressure fluid, respectively, the plurality of movable pressure blocks 4 generate a plurality of downward pressures on the plurality of chips 91 or other regions. In this embodiment, by filling the first chamber 311 and the second chamber 312 with first high-pressure fluid and second high-pressure fluid at different pressures, the plurality of movable pressure blocks 4 generate downward pressures of different magnitudes on the plurality of chips 91 or other regions. However, the type and number of internal chambers 31 are not limited to this. Furthermore, in different embodiments, the high-pressure fluids filling each internal chamber 31 can provide the same or different pressures.
[0077] In some embodiments, the first high-pressure fluid and the second high-pressure fluid can be gases or liquids; wherein, the gas can be air or liquid nitrogen. Furthermore, when using a liquid as the high-pressure fluid, the risk of short circuits due to leakage should be considered; therefore, non-conductive liquids such as electronic fluorinated fluids, silicone oils, electronic engineering fluids, and deionized water can be used. Moreover, since the downward pressure (F) is equal to the product of the fluid pressure (P) and the force-bearing area (A), in some embodiments, the fluid pressures of the first high-pressure fluid and the second high-pressure fluid can be the same, but because the force-bearing cross-sectional areas of the multiple movable pressure blocks 4 are different, different magnitudes of downward pressure can be generated. On the other hand, different magnitudes of the first high-pressure fluid and the second high-pressure fluid can be correspondingly set according to the different force-bearing cross-sectional areas of the multiple movable pressure blocks 4, thereby ensuring that the multiple movable pressure blocks 4 generate the same magnitude of downward pressure on the multiple chips 91 or other areas.
[0078] In some embodiments, the temperatures of the first high-pressure fluid and the second high-pressure fluid may be different. In this embodiment, the plurality of movable pressure blocks 4 are composed of materials with good thermal conductivity, such as copper alloy or aluminum alloy; therefore, by using high-pressure fluids with different temperatures, the plurality of movable pressure blocks 4 can produce different temperature regulation effects on the plurality of chips 91 or other regions. Further, for chips 91 with a large thermal design power, the corresponding movable pressure block 4 and internal chamber 31 can be circulated with high-pressure fluid at a lower temperature to maintain a consistent operating temperature for all chips 91 or other regions.
[0079] Please refer to Figure 3 and Figure 4 In some embodiments, the base 3 includes an upper housing 301, a lower housing 302, and a seal 303. In this embodiment, a first chamber 311 and a second chamber 312 are located in the upper housing 301, the plurality of opening slots 32 are located in the lower housing 302, the lower housing 302 has an annular groove 304 surrounding all the internal chambers 31, and the seal 303 is accommodated within the annular groove 304. The seal 303 is preferably made of TPU, silicone, or rubber, which can prevent fluid in the internal chambers 31 from escaping to the outside of the base 3, and can also prevent fluid from escaping between different internal chambers 31. In some embodiments, the seal 303 can also be a gasket, omitting the plurality of opening slots 32.
[0080] In some embodiments, each opening slot 32 includes a radial extension 323 and an axial through-hole 324, and each movable pressure block 4 includes a radial flange 41 and an axial body 42, the axial body 42 passing through the axial through-hole 324, and the radial extension 323 being adapted to stop the radial flange 41. The radial flange 41 extends radially outward relative to the main axis of the axial body 42. For example, the radial flange 41 may extend radially relative to one or more axes of the axial body 42 to form a polygonal, circular, or irregular shape. The shape of the radial extension 323 may match the radial flange 41, or it may not match the radial flange 41, as long as it can properly stop the radial flange 41. Furthermore, the surface of the radial extension 323 relative to the surface of the axial body 42 may be planar or non-planar.
[0081] In some embodiments, the axial length of the axial body 42 of each movable pressure block 4 can be designed according to the thickness and configuration of the corresponding chip 91. For example, when the thicknesses of the chips 91 vary greatly, the length of the axial body 42 of each movable pressure block 4 can be adjusted to be different according to the thickness of the corresponding chip 91, thereby ensuring that each movable pressure block 4 can apply full downward pressure to each chip 91. However, this invention is not limited to this. In other embodiments, the axial length of the axial body 42 of each movable pressure block 4 can be consistent, because the movable pressure block 4 itself can absorb differences in the height direction.
[0082] Please refer to the above as well. Figure 5 . Figure 5 A schematic diagram of a semiconductor package component testing apparatus 8 according to one embodiment is shown. In some embodiments, the semiconductor package component testing apparatus 8 includes the aforementioned semiconductor package component pressure testing module 2 with multiple pressure blocks, a fluid supply unit 6, a test socket 7, and a controller 11. The fluid supply unit 6 is connected to the at least one internal chamber 31. The test socket 7 corresponds to the semiconductor package component pressure testing module 2 with multiple pressure blocks and is adapted to accommodate a semiconductor package component 9. The controller 11 is electrically connected to the fluid supply unit 6 and the test socket 7. The controller 11 is adapted to control the fluid supply unit 6 to supply high-pressure fluid to the at least one internal chamber 31 of the semiconductor package component pressure testing module 2 with multiple pressure blocks, and is adapted to test the semiconductor package component 9 through the test socket 7.
[0083] In some embodiments, the semiconductor package component testing equipment 8 further includes a displacement generating device 12. In this embodiment, the displacement generating device 12 is electrically connected to the controller 11, and the base 3 of the semiconductor package component pressure testing module 2 with multiple pressure blocks is connected to the displacement generating device 12. The controller 11 is adapted to control the displacement generating device 12 to move the semiconductor package component pressure testing module 2 with multiple pressure blocks closer to or further away from the test base 7. In some embodiments, the displacement generating device 12 is a linear actuator, such as a lifting device, including but not limited to a pneumatic cylinder, a hydraulic cylinder, a combination of a motor and a transmission mechanism, a robotic arm, or other equivalent devices capable of generating lifting displacement and downward pressure.
[0084] In some embodiments, the controller 11 may be, but is not limited to, a central processing unit (CPU), a microcontroller unit (MCU), a digital signal processor (DSP), a programmable controller (PLC), an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or other similar devices or combinations thereof. In other embodiments, the controller 11 may also implement various operational functions in hardware circuitry, examples including but not limited to: workstations, laptop computers, client terminals, servers, distributed computing systems, handheld devices, or any other computing system or device. In its most basic configuration, the controller 11 may include at least one processor and system memory.
[0085] In some embodiments, the fluid supply unit 6 includes a valve 61 and a high-pressure fluid source 62. In this embodiment, the high-pressure fluid source 62 is connected to the plurality of internal chambers 31, the valve 61 is disposed between the high-pressure fluid source 62 and the plurality of internal chambers 31, and is electrically connected to a controller 11. The controller 11 controls the opening and closing of the valve 61 to control whether the high-pressure fluid source 62 supplies high-pressure fluid to the plurality of internal chambers 31. In some embodiments, the valve 61 may be a general solenoid valve or a proportional valve to directly regulate the flow rate and pressure of the high-pressure fluid supplied to the plurality of internal chambers 31, but this invention is not limited to these.
[0086] In some embodiments, the semiconductor package component testing equipment 8 further includes a fluid temperature control unit 63. In this embodiment, the fluid temperature control unit 63 is disposed between the high-pressure fluid source 62 and the at least one internal chamber 31, and is electrically connected to the controller 11, and the controller 11 controls the fluid temperature control unit 63 to adjust the temperature of the high-pressure fluid supplied to the at least one internal chamber 31.
[0087] In some embodiments, the semiconductor package component testing equipment 8 further includes a pressure testing module temperature control unit 5. In this embodiment, the pressure testing module temperature control unit 5 is disposed in at least one of the base 3 and the movable pressure block 4 and is electrically connected to the controller 11, and the controller 11 controls the pressure testing module temperature control unit 5 to adjust the temperature of the base 3 and at least one of the multiple movable pressure blocks 4.
[0088] In some embodiments, the semiconductor package component testing equipment 8 further includes a test socket temperature control unit 71. In this embodiment, the test socket temperature control unit 71 is electrically connected to the controller 11, and the controller 11 controls the test socket temperature control unit 71 to adjust the temperature of the test socket 7. Thus, by combining the fluid temperature control unit 63, the pressure testing module temperature control unit 5, and the test socket temperature control unit 71, a comprehensive environmental temperature control can be created for the semiconductor package component 9, allowing the semiconductor package component 9 to be completely immersed in a high-temperature or low-temperature testing environment, thereby improving testing efficiency and accuracy.
[0089] In some embodiments, the fluid temperature control unit 63, the pressure testing module temperature control unit 5, and the test socket temperature control unit 71 may each be at least one of a heating unit and a cooling unit. The heating unit may be a heater composed of an electric heating element, a resistive heating source, or other equivalent components with controllable temperature rise. In some embodiments, the heating unit may also be composed of a pipe or chamber through which a high-temperature fluid flows. The cooling unit may be composed of a temperature-controlled fluid channel. In some embodiments, the coolant supply unit may be a cooling distribution unit (CDU) or a chiller. In other embodiments, the cooling unit may also be thermoelectric modules or a vapor-compression refrigeration system (VCRS). In some embodiments, the cooling unit may also be a condenser, for example, a meandering channel through which a refrigerant flows, wherein the refrigerant may be liquid nitrogen, ethylene glycol, halogenated hydrocarbons, ammonia, sulfur dioxide, methane, or other cryogenic fluids.
[0090] In some embodiments, the fluid temperature control unit 63, the pressure testing module temperature control unit 5, and the test socket temperature control unit 71 can produce the same or different temperature control effects for the fixed pressure block 33, the movable pressure block 4, or the test socket 7 according to the thermal design power (TDP) of each chip 91 or the overall semiconductor package component 9.
[0091] In some embodiments, a force sensing unit (not shown) and a temperature sensing unit (not shown) may be configured on both the fixed pressure block 33 and the movable pressure block 4. The force sensing unit and the temperature sensing unit are electrically connected to the controller 11, and the force sensing unit can be controlled to measure the downward pressure applied by the fixed pressure block 33 and the movable pressure block 4 to the plurality of chips 91 or other areas on the semiconductor package component 9, thereby ensuring that sufficient downward pressure is applied to the plurality of chips 91 or other areas. The force sensing unit is, for example, but not limited to, a load cell, a capacitive pressure sensor, a piezoresistive pressure sensor, or any other type of pressure sensor.
[0092] Furthermore, in some embodiments, the fixed pressure block 33 and each movable pressure block 4 are equipped with a temperature sensing unit (not shown), and the temperature sensing unit can be controlled to measure the temperature of each chip 91 on the semiconductor package component 9 respectively. In this way, it can be used in conjunction with the fluid temperature control unit 63 and the pressure measurement module temperature control unit 5 to adjust the temperature of each chip 91, thereby ensuring that each chip 91 can be maintained at a predetermined temperature value.
[0093] In some embodiments, the temperature value detected by the temperature sensing unit is transmitted to the controller 11. When the detected temperature value is abnormal, the controller 11 will control at least one of the fluid temperature control unit 63, the pressure testing module temperature control unit 5, and the test socket temperature control unit 71 to further heat up or cool down the plurality of chips 91 on the semiconductor package component 9. If the abnormal temperature situation continues to occur, the controller 11 will send an alarm message and stop the test program.
[0094] The following describes some different embodiments of the semiconductor package component pressure testing module 2 with multiple pressure blocks. These embodiments can be implemented in conjunction with at least a part of the aforementioned semiconductor package component testing equipment 8.
[0095] Please refer to Figure 6 . Figure 6 A cross-sectional view of a semiconductor package pressure testing module 2 with multiple pressure blocks is shown according to one embodiment. In some embodiments, the base 3 includes an upper housing 301, a lower housing 302, and a diaphragm 34, with an internal chamber 31 located in the upper housing 301, an opening slot 32 located in the lower housing 302, and the diaphragm 34 located between the upper housing 301 and the lower housing 302. This embodiment can be understood as... Figure 4Variations in the embodiments. In this embodiment, the pressure of the first high-pressure fluid and the second high-pressure fluid is transmitted through the diaphragm 34 to the plurality of movable pressure blocks 4, causing the plurality of movable pressure blocks 4 to generate multiple downward pressures on the plurality of chips 91 or other regions. At the same time, the diaphragm 34 can prevent fluid in the internal chamber 31 from escaping to the outside of the base 3, and can also prevent fluid from escaping between different internal chambers 31; in addition, since the concern of fluid leakage is eliminated, the fluid pressure can be increased to increase the downward pressure. In some embodiments, the diaphragm 34 is silicone, rubber, or a stretchable polymer film.
[0096] Please refer to Figure 7 . Figure 7 A cross-sectional view of a semiconductor package pressure testing module 2 with multiple pressure blocks is shown according to one embodiment. In some embodiments, the semiconductor package pressure testing module 2 with multiple pressure blocks further includes at least one bladder 44 housed within an internal chamber 31. In this embodiment, in response to the bladder 44 within the internal chamber 31 being filled with high-pressure fluid, the movable pressure blocks 4 apply downward pressure to the plurality of regions respectively. This embodiment can be understood as... Figure 4 Variations of the embodiments.
[0097] In this embodiment, the pressure of the first high-pressure fluid and the second high-pressure fluid is transmitted through the capsule 44 to the plurality of movable pressure blocks 4, causing the plurality of movable pressure blocks 4 to exert multiple downward pressures on the chip 91 or other areas. Simultaneously, the capsule 44 not only prevents the fluid in the internal chamber 31 from escaping to the outside of the base 3, but also prevents fluid from escaping between different internal chambers 31. Furthermore, since the capsule 44 can form a closed cavity, it can be filled with a higher-pressure fluid, allowing the movable pressure blocks 4 to provide greater downward pressure. In other words, the output force of the movable pressure blocks 4 can be actively adjusted by regulating the pressure of the high-pressure fluid filled into the capsule 44. In some embodiments, the material of the capsule 44 is selected from at least one of the group consisting of nylon, polyurethane, polyvinyl chloride, thermoplastic polyurethane, rubber, polyethylene, and silicone.
[0098] Please refer to Figure 8A and Figure 8B . Figure 8A A cross-sectional view of a semiconductor packaging component pressure testing module 2 with multiple pressure blocks is shown in one embodiment. Figure 8BA cross-sectional view of a semiconductor package pressure testing module 2 with multiple pressure blocks is shown according to one embodiment. In some embodiments, the semiconductor package pressure testing module 2 with multiple pressure blocks includes at least one elastic member 43, which is housed in the at least one internal cavity 31 and corresponds to the plurality of opening slots 32. In some embodiments, in response to at least one of the movable pressure blocks 4 being pushed against the elastic member 43 by an external force, the elastic member 43 drives at least one of the movable pressure blocks 4 to generate downward pressure on at least one of the plurality of regions. In other words, in some embodiments, the semiconductor package pressure testing module 2 with multiple pressure blocks passively generates downward pressure in response to an external force pushing against the movable pressure blocks 4.
[0099] In some embodiments, at least one internal chamber 31 includes a plurality of internal chambers 31, and at least one elastic member 43 includes a plurality of elastic members 43, which are respectively housed in the internal chambers 31 and respectively correspond to the opening slots 32.
[0100] Specifically, in some embodiments, the elastic element 43 may be a spring 431 (e.g., Figure 8B (as shown) or other solid elastic elements (such as Figure 8A As shown), the solid elastic element can be rubber 432, shape memory alloy, or other elastic element that provides elasticity when compressed. In these embodiments, in response to at least one of the movable pressure blocks 4 being pushed against the elastic element 43 by an external force, the elastic element 43 deforms and rebounds, driving the movable pressure block 4 to generate multiple downward pressures on the chip 91 or other areas.
[0101] In other embodiments, the elastic element 43 may include a capsule 44 (e.g., Figure 7 (As shown), and the capsule 44 is filled with high-pressure fluid. In some embodiments, Figure 6 The combination of the diaphragm 34 and the high-pressure fluid shown can also be used as an elastic element 43, and this combination can be applied to one or more internal chambers 31. For example, when the movable pressure block 4 is pushed against the bladder 44 by an external force, the bladder 44 deforms and rebounds, driving the movable pressure block 4 to generate multiple downward pressures on the chip 91 or other areas.
[0102] As described above, the semiconductor package component pressure testing module 2 with multiple pressure blocks and the semiconductor package component testing equipment 8 with the semiconductor package component pressure testing module 2 with multiple pressure blocks proposed in this case can apply downward pressure to individual chips 91 or regions on the semiconductor package component 9 according to actual needs. These multiple downward pressures can be set to be the same or different using high-pressure fluid to apply downward pressure to individual chips 91 or regions. For example, it is applicable to different chips 91 (such as CPU, GPU, SoC, and HBM) or regions on semiconductor package components 9 employing advanced packaging, providing the predetermined downward pressure required for each chip 91 or region; thereby, in addition to ensuring complete electrical contact between the semiconductor package component 9 and the probes of the test socket 7, it also prevents the semiconductor package component 9 from warping or deforming due to uneven force. Furthermore, temperature control can be performed on the semiconductor package component 9, and even independent temperature control can be performed on individual chips 91 on the semiconductor package component 9.
Claims
1. A pressure testing module for a semiconductor packaged component with multiple pressure blocks, suitable for testing a semiconductor packaged component, wherein a surface of the semiconductor packaged component includes multiple regions, characterized in that, This multi-pressure block semiconductor package component pressure testing module includes: A base includes at least one internal chamber and a plurality of opening slots connected to the at least one internal chamber; as well as Multiple movable pressure blocks are respectively accommodated in the multiple opening slots of the base; The plurality of movable pressure blocks correspond to the plurality of regions on the semiconductor package component; in response to the filling of at least one internal cavity with at least one high-pressure fluid, the plurality of movable pressure blocks generate a pressure on the plurality of regions respectively.
2. The semiconductor packaging component pressure testing module with multiple pressure blocks as described in claim 1, characterized in that, The base further includes a retaining block, which corresponds to one of the multiple chips on the semiconductor package component.
3. The semiconductor packaging component pressure testing module with multiple pressure blocks as described in claim 1, characterized in that, The at least one internal chamber includes a first chamber and a second chamber, the plurality of opening slots include a first opening slot and a second opening slot, the at least one high-pressure fluid includes a first high-pressure fluid and a second high-pressure fluid; the first opening slot communicates with the first chamber, and the second opening slot communicates with the second chamber; in response to the first high-pressure fluid and the second high-pressure fluid being filled into the first chamber and the second chamber respectively, the plurality of movable pressure blocks generate a plurality of downward pressures on the plurality of areas.
4. The semiconductor packaging component pressure testing module with multiple pressure blocks as described in claim 3, characterized in that, The pressure of the first high-pressure fluid is different from that of the second high-pressure fluid.
5. The semiconductor packaging component pressure testing module with multiple pressure blocks as described in claim 3, characterized in that, The first high-pressure fluid has a different temperature than the second high-pressure fluid.
6. The semiconductor packaging component pressure testing module with multiple pressure blocks as described in claim 1, characterized in that, The base includes an upper housing, a lower housing, and a sealing element. The at least one internal cavity is located in the upper housing, and the plurality of opening slots are located in the lower housing. The lower housing has an annular groove that surrounds the at least one internal cavity, and the sealing element is accommodated in the annular groove.
7. The semiconductor packaging component pressure testing module with multiple pressure blocks as described in claim 1, characterized in that, The base includes an upper shell, a lower shell, and a diaphragm. The at least one internal chamber is located in the upper shell, and the plurality of opening slots are located in the lower shell. The diaphragm is located between the upper shell and the lower shell.
8. The semiconductor packaging component pressure testing module with multiple pressure blocks as described in claim 1, characterized in that, It further includes at least one bladder housed within the at least one internal cavity; wherein, in response to the at least one bladder within the at least one internal cavity being filled with the at least one high-pressure fluid, the plurality of movable pressure blocks respectively generate the downward pressure on the plurality of regions.
9. The semiconductor packaging component pressure testing module with multiple pressure blocks as described in claim 1, characterized in that, Each of the opening slots includes a radial extension and an axial through portion, and each of the movable pressure blocks includes a radial flange and an axial body; the axial body passes through the axial through portion, and the radial extension is adapted to block the radial flange.
10. A semiconductor packaging component testing device, characterized in that, Include: The semiconductor packaging component pressure testing module with multiple pressure blocks as described in claim 1; A fluid supply unit is connected to the at least one internal chamber; A test socket, corresponding to the pressure testing module of the semiconductor package component with multiple pressure blocks, and adapted to accommodate a semiconductor package component; as well as A controller is electrically connected to the fluid supply unit and the test socket; The controller is adapted to control the fluid supply unit to supply the at least one high-pressure fluid to the at least one internal chamber of the semiconductor package component pressure testing module having multiple pressure blocks, and is adapted to test the semiconductor package component through the test socket.
11. The semiconductor package component testing equipment as described in claim 10, characterized in that, It further includes a displacement generating device electrically connected to the controller; the base of the semiconductor package component pressure testing module with multiple pressure blocks is connected to the displacement generating device; the controller is adapted to control the displacement generating device to make the semiconductor package component pressure testing module with multiple pressure blocks approach or move away from the test base.
12. The semiconductor package component testing equipment as described in claim 10, characterized in that, The fluid supply unit includes a valve and a high-pressure fluid source; the high-pressure fluid source is connected to the at least one internal chamber, the valve is disposed between the high-pressure fluid source and the at least one internal chamber, and is electrically connected to the controller; the controller controls the opening and closing of the valve to control whether the high-pressure fluid source supplies the at least one high-pressure fluid to the at least one internal chamber.
13. The semiconductor package component testing equipment as described in claim 10, characterized in that, It further includes a fluid temperature control unit; the fluid temperature control unit is disposed between the high-pressure fluid source and the at least one internal chamber, and is electrically connected to the controller; the controller controls the fluid temperature control unit to adjust the temperature of the at least one high-pressure fluid supplied to the at least one internal chamber.
14. The semiconductor package component testing equipment as described in claim 10, characterized in that, It further includes a pressure testing module temperature control unit; the pressure testing module temperature control unit is disposed on the base and at least one of the plurality of movable pressure blocks and is electrically connected to the controller; wherein, the controller controls the pressure testing module temperature control unit to adjust the temperature of the base and at least one of the plurality of movable pressure blocks.
15. The semiconductor package component testing equipment as described in claim 10, characterized in that, It also includes a test socket temperature control unit; the test socket temperature control unit is electrically connected to the controller; wherein the controller controls the test socket temperature control unit to adjust the temperature of the test socket.
16. A pressure testing module for a semiconductor packaged component with multiple pressure blocks, suitable for testing a semiconductor packaged component, wherein a surface of the semiconductor packaged component includes multiple regions, characterized in that, This multi-pressure block semiconductor package component pressure testing module includes: A base includes at least one internal chamber and a plurality of opening slots connected to the at least one internal chamber; Multiple movable pressure blocks are respectively accommodated in the multiple opening slots of the base; and At least one elastic member is received in the at least one internal cavity and corresponds to the plurality of opening slots; The plurality of movable pressure blocks correspond to the plurality of regions on the semiconductor package component; in response to at least one of the plurality of movable pressure blocks being pushed against the at least one elastic member by an external force, the at least one elastic member causes at least one of the plurality of movable pressure blocks to generate a pressure on at least one of the plurality of regions.
17. The semiconductor package component pressure testing module with multiple pressure blocks as described in claim 16, characterized in that, The at least one internal chamber includes a plurality of internal chambers; the at least one elastic member includes a plurality of elastic members; the plurality of elastic members are respectively housed in the plurality of internal chambers and respectively correspond to the plurality of opening slots.
18. The semiconductor package component pressure testing module with multiple pressure blocks as described in claim 16, characterized in that, The at least one elastic element is selected from at least one of the group consisting of springs, rubber, and shape memory alloys.
19. The semiconductor package component pressure testing module with multiple pressure blocks as described in claim 16, characterized in that, The at least one elastic element includes a bladder filled with a high-pressure fluid.
20. The semiconductor package component pressure testing module with multiple pressure blocks as described in claim 19, characterized in that, The material of the capsule is selected from at least one of the group consisting of nylon, polyurethane, polyvinyl chloride, thermoplastic polyurethane, rubber, polyethylene and silicone.