Liquid-cooled negative pressure distribution system

Abstract

A data center cooling system for cooling at least one rack system of a data center includes a cooling circuit having a cooling fluid circulating therethrough. The cooling circuit has a closed loop configuration and includes a pump for moving a cooling fluid within the cooling circuit, a cooling distribution unit, and a heat recovery member mounted within the at least one rack system. The data center cooling system is thermally coupled to the at least one rack system such that heat is transferred from the at least one rack system directly to the cooling fluid at the heat recovery member.

Description

[0001] Cross-references to related applications This application claims the benefit of U.S. Provisional Patent Application No. 63 / 518670, filed August 10, 2023, the entire contents of which are incorporated herein by reference. Background Technology

[0002] Exemplary embodiments relate to the field of thermal management, and more specifically to the thermal management of servers within a data center.

[0003] A “data center” refers to the physical location of one or more servers. Data centers and the servers housed within them typically consume a significant amount of electrical power. Existing servers are designed to be cooled at least partially by airflow. Such servers typically include one or more printed circuit boards with multiple operable heat-generating devices mounted on them. The printed circuit boards are usually housed in an enclosure with vents configured to guide outside air into, through, and out of the enclosure from the data center. The air absorbs heat dissipated by the components and mixes with ambient air after being exhausted from the enclosure. Air conditioning is then used to cool the heated air in the data center and recirculate it, repeating the cooling process.

[0004] Higher-performance server components typically dissipate more power. However, the amount of heat that a conventional cooling system can remove from a server is partly limited by the range of air conditioning available from the data center. Generally, the lower air temperatures in a data center allow each server component cooled by airflow to dissipate more power, and thus allow each server to operate at a correspondingly higher performance level. Summary of the Invention

[0005] According to an embodiment, a data center cooling system for cooling at least one rack system of a data center includes a cooling loop having a cooling fluid circulating therethrough. The cooling loop has a closed-loop configuration and includes a pump disposed within the cooling loop, a cooling distribution unit, and a heat recovery component installed within the at least one rack system. The data center cooling system is thermally coupled to the at least one rack system such that heat is transferred directly from the at least one rack system to the cooling fluid at the heat recovery component. The pump is operable to move the cooling fluid within the cooling loop and generate negative pressure at the heat recovery component.

[0006] In addition to one or more of the features described above, or as an alternative, in other embodiments, the heat recovery component is a heat exchanger for heat-generating electronic components mounted to at least one rack system.

[0007] In addition to one or more of the features described above, or as an alternative, in other embodiments, the heat exchanger is directly thermally connected to the surface of the thermally generated electronic component.

[0008] In addition to one or more of the features described above, or as an alternative, in other embodiments, the pump is positioned downstream of the heat recovery unit and upstream of the cooling distribution unit relative to the flow of the cooling fluid.

[0009] In addition to one or more of the features described above, or as an alternative, in other embodiments, the pump is located directly downstream of the outlet of the heat recovery component.

[0010] In addition to one or more of the features described above, or as an alternative, in other embodiments, the pump is a positive pressure pump.

[0011] In addition to one or more of the features described above, or as an alternative, in other embodiments, the pump is positioned downstream of the cooling fluid distribution unit and upstream of the heat recovery component.

[0012] In addition to one or more of the features described above, or as an alternative, in other embodiments, an inlet valve is provided directly upstream of the heat recovery component.

[0013] In addition to one or more of the features described above, or as an alternative, in other embodiments, an outlet valve is included that is disposed directly downstream of the heat recovery component.

[0014] In addition to one or more of the features described above, or as an alternative, in other embodiments, the heat recovery component is vertically positioned below the cooling distribution unit.

[0015] In addition to one or more of the features described above, or as an alternative, in other embodiments, the heat recovery component is positioned vertically above the cooling distribution unit.

[0016] In addition to one or more of the features described above, or as an alternative, in other embodiments, the cooling circuit includes a plurality of fluid circuits arranged in parallel, and each of the plurality of fluid circuits includes a separate cooling distribution unit and a separate heat recovery component.

[0017] In addition to one or more of the features described above, or as an alternative, in other embodiments, multiple fluid circuits are fluidly connected by at least one manifold.

[0018] In addition to one or more of the features described above, or alternatively, in other embodiments, the cooling distribution unit is a heat exchanger fluidly connected to the cooling system. The heat transfer fluid is configured to absorb heat from the cooling fluid at the cooling distribution unit.

[0019] According to an embodiment, a method for cooling at least one rack system of a data center includes circulating cooling fluid via a pump through a cooling loop having a closed-loop configuration, transferring heat from the cooling fluid at a cooling distribution unit, transferring heat to the cooling fluid at a heat recovery component installed within the at least one rack system, and generating a negative pressure at the heat recovery component via a pump. Heat is transferred directly from a heat-generating electronic component of the at least one rack system to the cooling loop at the heat recovery component.

[0020] In addition to one or more of the features described above, or as an alternative, in other embodiments, a pump is operated to generate negative pressure at the heat recovery component, the pump being located directly downstream of the outlet of the heat recovery component.

[0021] In addition to one or more of the features described above, or as an alternative, other embodiments include cooling at least one rack system’s other heat-generating electronic component with another fluid S, and cooling the other fluid S via a cooling fluid at a heat recovery component.

[0022] In addition to one or more of the features described above, or alternatively, in other embodiments, the cooling circuit includes a plurality of fluid circuits arranged in parallel, and each of the plurality of fluid circuits includes a separate heat recovery component. The method further includes simultaneously supplying cooling fluid to the plurality of fluid circuits.

[0023] In addition to one or more of the features described above, or as an alternative, in other embodiments, the position of at least one of the inlet valve and outlet valve associated with the heat recovery component is adjusted in response to the condition at at least one rack system. Attached Figure Description

[0024] The following description should not be considered as limiting in any way. Referring to the accompanying drawings, similar element numbers are similar: Figure 1 This is a schematic diagram of an example of a cooling system according to an embodiment; Figure 2 This is a schematic diagram of a cooling system integrated into a building according to an embodiment; Figure 3 This is a schematic diagram of a cooling system integrally integrated into a building according to another embodiment; Figure 4A This is a schematic diagram of a cooling system integrated into a building according to an embodiment; Figure 4B This is a schematic diagram of a cooling system integrally integrated into a building according to another embodiment; Figure 5 This is a schematic diagram of a cooling system integrated into a building according to an embodiment; and Figure 6This is a schematic diagram of a cooling system integrated into a building according to an embodiment. Detailed Implementation

[0025] This document provides a detailed description of one or more embodiments of the disclosed apparatus and methods by way of example and without limitation, with reference to the figures.

[0026] refer to Figure 1 An example of a cooling system 20 is illustrated. As shown, the cooling system 20 includes a cooling distribution system 30 and multiple loads thermally coupled to the cooling distribution system 30. As used herein, the term "load" is intended to apply to any secondary system or component thermally coupled to the cooling distribution system 30, whether the secondary system or component is configured to transfer heat to or remove heat from the cooling distribution system 30. In the non-limiting embodiment shown, the multiple loads of the cooling distribution system 20 include a first load 32 and a second load 34. However, it should be appreciated that embodiments having any number of loads connected to the cooling distribution system 30 (e.g., such as three loads, four loads, or five loads) are within the scope of this disclosure. Examples of suitable loads include, but are not limited to, data center cooling systems, air conditioning systems (such as air handling units), cooler systems, heat pumps, and sanitation or drinking water systems.

[0027] As shown, the cooling distribution system 30 includes a cooling distribution loop through which the main heat transfer fluid F circulates. Examples of suitable heat transfer fluids F include, but are not limited to, water, propylene glycol, dielectric fluids, and refrigerants. The cooling distribution system 30 may include a pump or other moving device 36 for moving the heat transfer fluid F through the cooling distribution loop. In some embodiments, the cooling distribution loop may include one or more valves (not shown) to allow the heat transfer fluid F to selectively bypass one or more of the loads. Although the cooling distribution loop is shown as having a closed-loop configuration, embodiments in which the cooling distribution loop is not a closed loop are contemplated herein.

[0028] The cooling distribution system 30 is configured to transfer heat between multiple loads. Figure 1 In the simplified cooling distribution system 30 shown in the embodiments, the heat transfer fluid F is configured to absorb heat from the first load 32 and transfer heat to the second load 34. Although the cooling distribution loop is thermally coupled to one or more loads via heat exchangers (such as via a first heat exchanger 38 and a second heat exchanger 40, respectively), it should be appreciated that embodiments in which the cooling distribution loop is thermally coupled to at least one load in another suitable manner are within the scope of this disclosure. The first heat exchanger 38 may also be referred to herein as a cooling distribution unit.

[0029] In the non-limiting embodiment shown, the first load 32 is a data center cooling system including a secondary cooling loop through which a coolant or cooling fluid C is configured to circulate. In some embodiments, the cooling fluid C is a liquid, such as water, propylene glycol, or a dielectric fluid. The data center cooling system 32 is associated with one or more data centers 50, each data center having at least one rack system 52 containing at least one server or a component having heat-generating electronics 54 therein (referred to herein as a "server") (see [link to documentation]). Figure 2 Localized cooling of the heat-generating electronics 5 at one or more servers in rack system 52 can be performed via different server cooling systems having separate fluids S (not described herein). As shown, rack system 52 includes at least one heat recovery member 56 configured to receive a flow of cooling fluid C. In the non-limiting embodiment shown, heat recovery member 56 is a heat exchanger. However, in other embodiments, heat recovery member 56 may be a cold plate or other suitable heat transfer device. Within each heat recovery member 56, heat is transferred from rack system 52 (e.g., from one or more heat-generating electronics 54 of at least one server disposed therein) via fluid S to cooling fluid C. In embodiments where data center 50 includes multiple rack systems 52, as Figure 1 As shown, cooling fluid C is supplied in parallel to heat recovery components 56 associated with each rack system 52. The flow of cooling fluid C exiting from each heat recovery component 56 then rejoins at a location upstream of the cooling distribution unit 38 or at other thermal connections of the cooling distribution system 30. It should be appreciated that in embodiments in which the data center cooling system 32 alternatively or additionally includes multiple data centers 50, cooling fluid C may be supplied in parallel to each data center 50, and may further be supplied in parallel to the heat recovery components 56 of each rack system 52 of the multiple data centers.

[0030] Now for reference Figure 2-6 Various implementations of a cooling system 20 within a building are illustrated. Implementing the cooling system 20, particularly distributing the cooling fluid C and heat transfer fluid F among various loads, can be challenging. Furthermore, external leakage of the cooling fluid C (e.g., within the rack system 52) can potentially cause significant damage to the rack system 52. To minimize the risk of such leakage, in this embodiment, the secondary cooling circuit has negative pressure (relative to atmospheric pressure) or zero pressure at at least one heat recovery member 56.

[0031] Now for reference Figure 2 and Figure 3In the illustrated non-limiting embodiment, the data center cooling system 32 has a secondary cooling loop comprising a tank or accumulator 60 at least partially filled with cooling fluid C. As shown, the tank 60 may be open to the atmosphere or may be sealed and pressurized by the secondary cooling loop. Thus, in some embodiments, such as when the tank 60 is open to the atmosphere, the secondary cooling loop has an open-loop configuration. The outlet 62 of the tank 60 is fluidly connected to an inlet valve 64 via a first conduit 66, and the inlet valve 64 is fluidly connected to an inlet 68 of at least one heat recovery component 56 via a second conduit 70. A third conduit 76 connects the outlet 72 of the heat recovery component 56 to the inlet 74 of a cooling distribution unit 38, and a fourth conduit 78 connects the outlet 80 of the cooling distribution unit 38 to the inlet 82 of the tank 60.

[0032] The first pump 84 is configured to circulate cooling fluid C within at least a portion of the secondary cooling circuit. As shown, the first pump 84 may be located between the outlet 62 and the inlet valve 64 of the tank 60. The second pump 86 may be located downstream of the heat recovery component 56 relative to the flow of cooling fluid C, for example, at a location such as upstream of the cooling distribution unit 38. In an embodiment, the second pump 86 is a positive displacement pump or a positive pressure pump. A controller (not shown) may be operatively coupled to at least one of the first pump 84, the second pump 86, and the inlet valve 64. The operation of one or more of the first pump 84, the second pump 86, and the inlet valve 64 may be controlled in response to a state or condition at the data center.

[0033] In operation, the first pump 84 directs the flow of cooling fluid C through the first conduit 66 to the inlet valve 64. Furthermore, the operation of the second pump 86, located downstream of at least one heat recovery component 56, generates negative or zero pressure within the heat recovery component 56, and in some embodiments, negative or zero pressure is generated within the conduit 70 connected to the inlet valve 64. The position of the inlet valve 64 is adjustable to control the flow of cooling fluid C toward at least one heat recovery component 56. In the non-limiting embodiments shown, only a portion of the cooling circuit experiences negative pressure. The cooling fluid C at the reservoir 60, and in some embodiments, within the first conduit 66 extending between the outlet of the reservoir 60 and the inlet valve 64, does not experience negative pressure.

[0034] In the event of a leak or malfunction, inlet valve 64 can be closed to stop the flow of cooling fluid C to rack system 52 in order to minimize damage to it.

[0035] exist Figure 2 and Figure 3In the non-limiting embodiment shown, the various components of the cooling system 20 are arranged at different levels of the building (relative to the ground floor). For example, at least one rack system 52 of the data center 50 and its associated inlet valve 64 may both be vertically positioned below the thermal interface between the second pump 86 and / or the cooling distribution system 30 and the data center cooling system 32 (such as the cooling distribution unit 38). The inlet valve 64 may be vertically positioned above the inlet 68 of at least one heat recovery component 56, and the tank 60 and the first pump 84 may be vertically positioned below at least one heat recovery component 56. However, it should be understood that regardless of the configuration of the data center cooling system 32, at least one heat recovery component 56 is vertically positioned above the thermal interface between the cooling distribution system 30 and the data center cooling system 32 (Figure 4 and...). Figure 6 Or at the same level as the thermal interface between the cooling distribution system 30 and the data center cooling system 32. Figure 5 Examples of this disclosure are also within the scope of this disclosure.

[0036] In some embodiments, the data center cooling system 32 is fluidly and thermally coupled to multiple data centers 50, such as those located on different floors of a building. In such embodiments, each of the multiple data centers 50 includes at least one rack system 52 containing one or more servers. When used to cool multiple data centers 50, the data center cooling system 32 may include multiple parallel fluid loops, each fluid loop associated with a corresponding data center 50. Reference Figure 3 In a non-limiting embodiment, each fluid loop includes an inlet valve 64, a second pump 86, and its own thermal interface with the cooling distribution system 30 via a cooling distribution unit 38. Although a single cooling distribution system 30 is shown, in some embodiments, the cooling distribution units 38, thermally coupled to multiple parallel loops of the data center cooling system 32, may originate from different cooling distribution systems. The flows of cooling fluid C output from each cooling distribution unit 38 then converge again at a location upstream of the inlet of the tank 60. Although the data center cooling system 32 is described as having multiple data centers 50 arranged in parallel, it should be recognized that the same construction of the data center cooling system 32 can be applied to a data center 50 having multiple rack systems 52 arranged in parallel relative to the flows of cooling fluid C within secondary cooling loops.

[0037] In other embodiments, the building may have a separate fluid-cooled data center cooling system 32 for each data center 50. In such embodiments, such as Figure 4A and Figure 4B As shown, the cooling distribution unit 38 of each data center cooling system 32 can be connected to the same cooling distribution system 30 or to a different cooling distribution system.

[0038] Now continue with the reference. Figure 4A-6 This illustrates another embodiment of the data center cooling system 32. The data center cooling system 32 is related to... Figure 2 and Figure 3 Similar to data center cooling systems; however, with Figure 2 and Figure 3 Unlike the embodiments described herein, the secondary cooling loop of the data center cooling system 32 has a closed-loop configuration. Therefore, the data center cooling system 32 does not need to include the tank 60 as previously described herein. In such embodiments, the outlet 72 of the heat recovery component 56 can be directly coupled to the inlet 74 of the cooling distribution unit 38. As shown, the inlet valve 64 can be arranged upstream of the inlet 74 of the cooling distribution unit 38, for example, directly upstream. In embodiments comprising multiple data centers 50 and / or multiple rack systems 52 arranged in parallel with respect to the flow of cooling fluid C within the secondary cooling loop, the inlet valve 64 can be located upstream of each of the multiple data centers 50 or each of the multiple rack systems 52 within a data center.

[0039] A single pump 88, replacing the first pump 84 and the second pump 86 previously described herein, may be located directly upstream of the inlet 74 of the cooling distribution unit 38 and directly downstream of the outlet 72 of the heat recovery member 56 within the fluid flow. In the non-limiting embodiment shown, the data center 50 is vertically positioned above the cooling distribution unit 38.

[0040] In operation, cold cooling fluid C is circulated through a secondary cooling circuit via pump 88. Cooling fluid C is heated as it passes through heat recovery member 56. From outlet 72 of at least one heat recovery member 56, cooling fluid C is supplied to inlet 74 of cooling distribution unit 38, where heat is transferred to heat transfer fluid F of cooling distribution system 30. From outlet 80 of cooling distribution unit 38, cooling fluid C returns to inlet of heat recovery member 56 via inlet valve 64. Operation of pump 88, located directly downstream of at least one heat recovery member 56 relative to the flow of cooling fluid C, creates a negative pressure or zero pressure within heat recovery member 56, thereby drawing cooling fluid C through heat recovery member 56. One or more inlet valves 64 may be operable to control the flow of cooling fluid C supplied to heat recovery member 56. Thus, in an embodiment, one or more inlet valves 64 and pump 88 are combined to control the application of a negative pressure applied to at least a portion of the cooling circuit extending between inlet valves 64 and heat recovery member 56.

[0041] Now for reference Figure 5 and Figure 6This provides a similar closed-loop configuration for the data center cooling system 32. As shown, the secondary cooling loop may include at least one manifold, such as an inlet manifold 89 fluidly connected to the data center 50 or rack system 52 via a corresponding inlet branch, and an outlet manifold 91 fluidly connected to the outlet of each data center 50 or rack system 52 via a corresponding outlet branch. Furthermore, as... Figure 5 As shown, the data center cooling system 32 may include not only inlet valves 64 associated with each inlet branch (e.g., directly disposed upstream of the inlet 68 of the heat recovery component 56), but also outlet valves 65 associated with each outlet branch (e.g., directly disposed downstream of the outlet 72 of the heat recovery component 56). As previously described, the position of at least one of the inlet valves 64 and outlet valves 65 associated with the heat recovery component 56 may be adjusted (e.g., closed) by a controller in response to detecting a condition (e.g., a fault) at at least one rack system.

[0042] In some embodiments, the data center cooling system 32 may also include vents 90 and / or expansion tanks 92 and corresponding control valves 94. Vents 90 can be used to remove any gases (e.g., air) that have accumulated in the cooling fluid C. Although Figure 5 Vent 90 is shown directly downstream of pump 88, but it should be understood that one or more vents 90 may be located anywhere relative to the secondary cooling circuit. For example, vent 90 may be associated with each inlet branch connected to the corresponding heat recovery component 56, such as between inlet valve 64 and inlet 68. Expansion tank 92 and corresponding control valve 94 may be used to maintain a constant pressure of the cooling fluid C downstream of pump 88. As shown, expansion tank 92 and control valve 94 may be directly upstream of cooling distribution unit 38 ( Figure 5 ), or may be located downstream of the cooling distribution unit 38, such as at a location upstream of one or more inlet valves 64 ( Figure 6 ).exist Figure 6 In the non-limiting embodiment shown, the expansion tank 92 and control valve 94 are directly connected to the manifold; however, any location downstream of the cooling distribution unit 38 and upstream of the heat recovery component 56 is within the scope of this disclosure.

[0043] exist Figure 1-4A and Figure 5-6In each of the non-limiting embodiments of the data center cooling system 32 shown, a cooling fluid C circulating therethrough acts as a heat sink to indirectly cool the heat-generating electronics 54 of one or more rack systems 52 of the data center 50. As described, in such embodiments, the cooling fluid C is arranged to have a thermal transfer relationship with a separate fluid S of at least one rack system 52 at a heat recovery member 56. However, it should be understood that in some embodiments, the cooling fluid C may be operable to directly cool one or more of the heat-generating electronics 54 of at least one rack system 52. Reference Figure 4B Although the cooling fluid C can be thermally connected to the rack system 52 via a heat recovery component, this heat recovery component may not be located in one or more heat-generating components 54 located away from the rack system 52. Figure 4B In a non-limiting embodiment, the heat recovery component 56 may be located within the rack system 52. For example, the heat recovery component 56 may be positioned and thermally coupled to at least one selected heat-generating electronics 54, such as within a server component.

[0044] While any suitable heat recovery component 56 may be adapted for use within the rack system 52, in this embodiment, the heat recovery component 56 is a heat exchanger mounted in an axially overlapping arrangement with one or more heat-generating electronic devices 54. In such embodiments, when cooling fluid C is supplied to the heat recovery component 56 (e.g., to its inlet manifold), heat is transferred from the surface of the heat-generating electronic device 54 to the cooling fluid C, such as via the surface of the inlet manifold thermally coupled to the heat-generating electronic device 54. In some embodiments, as the cooling fluid C moves through the heat recovery component 56, the cooling fluid C may additionally function as a radiator to remove heat from the fluid S contained within the rack system 52. In such embodiments, the fluid S output from the heat recovery component 56 is operable to further cool one or more additional heat-generating electronic devices 54 of the rack system 52.

[0045] like Figure 4BAs illustrated herein, embodiments are envisioned in which the cooling distribution system 30 includes a data center cooling system 32 having a cooling fluid C for directly cooling one or more heat-generating components 54 of the rack system 52, and a fluid-separate data center cooling system 32 having a cooling fluid C indirectly thermally coupled to one or more heat-generating components 54 of at least one rack system 52. However, embodiments in which each data center cooling system 32 of the cooling distribution system 30 has a cooling fluid C directly thermally coupled to at least one heat-generating component 54 of the rack system 52 are also within the scope of this disclosure. Furthermore, in embodiments in which a single data center cooling system 32 has multiple fluid loops arranged in parallel, each fluid loop associated with a corresponding data center 50, the cooling fluid C in at least one of the fluid loops (and in some embodiments, in each of the multiple fluid loops) may be directly thermally coupled to at least one heat-generating component 54 of the rack system 52. Alternatively, or additionally, the cooling fluid C within at least one fluid loop of the data center cooling system 32 may be thermally connected, indirectly or directly, to at least one heat-generating component 54 of the rack system 52 via a heat recovery component 56 located away from the heat-generating component 54. Using liquid cooling fluid to cool the data center is more effective than existing cooling methods that use airflow. Furthermore, by applying negative pressure to a portion of the secondary cooling loop associated with the data center 50 or rack system 52, the potential for leakage within the data center or rack system 52 is limited.

[0046] The term “about” is intended to include the degree of error associated with measurements based on a specific amount of equipment available at the time of application submission.

[0047] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. As used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that the terms “comprising” and / or “including” as used in this specification indicate the presence of the indicated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0048] Although this disclosure has been described with reference to one or more exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and elements may be replaced with equivalents without departing from the scope of this disclosure. Furthermore, many modifications may be made to suit particular situations or materials to the teachings of this disclosure without departing from its essential scope. Therefore, this disclosure is intended to be limited to the specific embodiments disclosed as the best mode for carrying out the concepts of this disclosure, but rather to include all embodiments falling within the scope of the claims.

Claims

1. A data center cooling system for cooling at least one rack system in a data center, the data center cooling system comprising: A cooling circuit having a cooling fluid circulating therethrough, the cooling circuit having a closed-loop configuration and comprising: A pump arranged within the cooling circuit; Cooling distribution unit; and A heat recovery component installed within the at least one rack system; Heat is transferred directly from the at least one rack system to the cooling fluid at the heat recovery component; and The pump is operable to move the cooling fluid within the cooling circuit and to generate negative pressure at the heat recovery component.

2. The data center cooling system according to claim 1, wherein, The heat recovery component is a heat exchanger for the heat-generating electronic components installed in the at least one rack system.

3. The data center cooling system according to claim 2, wherein, The heat exchanger is directly thermally connected to the surface of the thermally generated electronic component.

4. The data center cooling system according to claim 1, wherein, The pump is positioned downstream of the heat recovery component and upstream of the cooling fluid flow relative to the heat recovery component and the cooling distribution unit.

5. The data center cooling system according to claim 4, wherein, The pump is located directly downstream of the outlet of the heat recovery component.

6. The data center cooling system according to claim 1, wherein, The pump is a positive pressure pump.

7. The data center cooling system according to claim 1, wherein, The pump is positioned downstream of the cooling fluid distribution unit and upstream of the heat recovery component relative to the flow of the cooling fluid.

8. The data center cooling system according to any one of the preceding claims further includes an inlet valve disposed directly upstream of the heat recovery component.

9. The data center cooling system of claim 8, further comprising an outlet valve disposed directly downstream of the heat recovery component.

10. The data center cooling system according to any one of the preceding claims, wherein, The heat recovery component is vertically positioned below the cooling distribution unit.

11. The data center cooling system according to any one of claims 1 to 9, wherein, The heat recovery component is vertically positioned above the cooling distribution unit.

12. The data center cooling system according to any one of the preceding claims, wherein, The cooling circuit includes multiple fluid circuits arranged in parallel, each of which includes a separate cooling distribution unit and a separate heat recovery component.

13. The data center cooling system according to claim 12, wherein, The plurality of fluid circuits are fluidly connected by at least one manifold.

14. The data center cooling system according to claim 12, wherein, The cooling distribution unit is a heat exchanger fluidly connected to the cooling system, wherein the heat transfer fluid is configured to absorb heat from the cooling fluid at the cooling distribution unit.

15. A method for cooling at least one rack system in a data center, comprising: Cooling fluid is circulated through a cooling circuit via a pump, the cooling circuit having a closed-loop structure; Heat is transferred from the cooling fluid at the cooling distribution unit; as well as Heat is transferred to the cooling fluid at a heat recovery component installed within the at least one rack system, wherein heat is transferred directly from the heat-generating electronic components of the at least one rack system to the cooling circuit at the heat recovery component; as well as A negative pressure is generated at the heat recovery component via the pump.

16. The method of claim 15, further comprising wherein the pump is positioned directly downstream of the outlet of the heat recovery component.

17. The method of claim 15 or claim 16, further comprising cooling another heat-generating electronic component of the at least one rack system with another fluid S, and cooling the other fluid S via the cooling fluid at the heat recovery component.

18. The method of any one of claims 15 to 17, wherein the cooling circuit comprises a plurality of fluid circuits arranged in parallel, each of the plurality of fluid circuits comprising a separate heat recovery component, the method further comprising simultaneously supplying the cooling fluid to the plurality of fluid circuits.

19. The method according to any one of claims 15 to 18, further comprising adjusting the position of at least one of the inlet valve and outlet valve associated with the heat recovery component in response to conditions at the at least one rack system.

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