Diamond cutting tool and cutting method

By introducing a gradient transition layer and a wear-resistant conductive layer into diamond cutting tools, a three-dimensional conductive network is formed, which solves the problems of conductivity, wear resistance and bonding strength, and realizes the ability to prepare cutting tools and process non-conductive materials with high efficiency and low cost.

CN122033308APending Publication Date: 2026-05-15HUIZHOU XINJINQUAN PRECISION TECH CO LTD
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Patent Information

Application Number
CN202610151086.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-02-03
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

Existing diamond-coated cutting tools are difficult to optimize in a synergistic way in terms of conductivity, wear resistance, bonding strength and manufacturing cost, and are not suitable for processing non-conductive materials.

Method used

The structure employs a gradient transition layer and a wear-resistant conductive layer, including a first sublayer of carbide or nitride compatible with the tool substrate and a second sublayer of gradually doped diamond. This is combined with a continuous diamond phase and conductive nanoparticles to form a three-dimensional conductive network, which is prepared by a single chemical vapor deposition process.

Benefits of technology

It improves the bonding strength between the coating and the substrate, maintains the stability and wear resistance of the conductive function, reduces the preparation cost, and enables the processing of non-conductive materials.

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Abstract

The invention discloses a diamond cutting tool and a cutting method. The diamond cutting tool comprises a tool base body, a gradient transition layer and a wear-resistant conductive layer deposited on the gradient transition layer. The gradient transition layer sequentially comprises a first sub-layer and a second sub-layer from the surface of the cutter base body to the outside, the first sub-layer is carbide or nitride compatible with the cutter base body, and the second sub-layer is gradually-changed doped diamond; the wear-resistant conductive layer comprises a continuous diamond phase and conductive nanoparticles, and the conductive nanoparticles are mutually connected in the diamond phase to form a three-dimensional conductive network extending from the gradient transition layer interface to the surface of the cutter. The electrical conductivity, the wear resistance and the bonding strength of the cutting tool are optimized, and the preparation cost is reduced.
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